A hot peel type degreasing cleaning device for high density interconnection printed wiring board
By combining negative pressure suction and rotating water flow shearing with positive pressure pushing, the problem of difficult removal of residual adhesive in blind holes of high-density interconnect printed circuit boards is solved, achieving efficient adhesive removal and meeting the needs of high-precision and high-yield production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 福建省金普达电子科技有限公司
- Filing Date
- 2026-04-30
- Publication Date
- 2026-07-14
AI Technical Summary
Existing thermal stripping adhesive removal devices, when cleaning blind vias on high-density interconnect printed circuit boards, suffer from poor adhesive removal efficiency due to the contact between low-temperature, weakly alkaline water and high-temperature molten adhesive. The adhesive quickly cools and solidifies, forming a hard adhesive layer that blocks the opening of the blind via, making it impossible to effectively remove residual adhesive from the via.
The heated and melted adhesive is extracted using negative pressure, and the adhesive is sheared and broken into fine fragments in a short time using rotating water flow. Hard particles are used to physically grind the pore walls, and combined with positive pressure pushing and centrifugal discharge, continuous circulation cleaning is achieved.
It effectively avoids adhesive cooling blockage, expands the cleaning coverage, improves cleaning efficiency, ensures that residual adhesive in blind holes is fully removed, and meets the requirements of high-precision and high-yield production.
Smart Images
Figure CN122395840A_ABST