Flexible circuit board adjusting method and device, computer device, and storage medium

Abstract

The application relates to a flexible circuit board adjusting method and device, computer equipment and a storage medium. An execution mechanism is arranged at a position corresponding to a solder ball array of the flexible circuit board. The method comprises the following steps: obtaining a resistance change amount of a current period of the flexible circuit board; comparing the resistance change amount with a first preset resistance change threshold value and a second preset resistance change threshold value to determine a comparison result; the first preset resistance change threshold value is smaller than the second preset resistance change threshold value; if the comparison result is that the resistance change amount is greater than or equal to the second preset resistance change threshold value, a deformation voltage is determined according to a preset voltage determination rule; and the deformation voltage is input into the execution mechanism to make the execution mechanism generate a compensation stress on the flexible circuit board. The method can adjust the flexible circuit board, thereby avoiding the problem that the flexible circuit board cannot work normally due to multiple bending.

Description

Technical Field

[0001] This application relates to the field of flexible circuit board technology, and in particular to a flexible circuit board adjustment method, apparatus, computer equipment, and storage medium. Background Technology

[0002] In the field of flexible circuit boards, these boards are subjected to tens of thousands or even hundreds of thousands of cyclic bending loads during use. Under these conditions, the flexible circuit board undergoes multiple bends, leading to a modulus mismatch between the BGA solder balls and the substrate. Furthermore, the severe strain caused by these repeated bends can result in fatigue cracks at the interface between the BGA solder balls and the substrate, increasing the contact resistance and even causing open circuit failure, rendering the flexible circuit board unusable.

[0003] Therefore, there is an urgent need for a method that can adjust flexible circuit boards to avoid the problem of them malfunctioning due to repeated bending. Summary of the Invention

[0004] Therefore, it is necessary to provide a flexible circuit board adjustment method, apparatus, computer equipment, and storage medium that can adjust the flexible circuit board to avoid the problem of the flexible circuit board failing to work properly due to repeated bending.

[0005] In a first aspect, this application provides a method for adjusting a flexible circuit board, wherein an actuator is disposed at a position corresponding to the solder ball array of the flexible circuit board; the method includes: obtaining the resistance change of the flexible circuit board in the current cycle; comparing a first preset resistance change threshold, a second preset resistance change threshold, and the resistance change to determine a comparison result; wherein the first preset resistance change threshold is less than the second preset resistance change threshold; if the comparison result is that the resistance change is greater than or equal to the second preset resistance change threshold, then determining a deformation voltage according to a preset voltage determination rule; and inputting the deformation voltage into the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

[0006] In one embodiment, the method further includes: if the comparison result is that the resistance change is less than a first preset resistance change threshold, then the resistance change is saved to a database.

[0007] In one embodiment, the method further includes: if the comparison result is that the resistance change is greater than or equal to a first preset resistance change threshold and the resistance change is less than a second preset resistance change threshold, then a micro-amplitude pulse voltage is determined according to the external force matching the resistance change; the micro-amplitude pulse voltage is input to the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

[0008] In one embodiment, obtaining the resistance change of the flexible circuit board in the current period includes: sampling the flexible circuit board according to a preset sampling frequency to determine a plurality of first sampling resistors in the current period; determining a reference resistor based on the plurality of first sampling resistors; and determining the resistance change in the current period based on the plurality of first sampling resistors and the reference resistor.

[0009] In one embodiment, the method further includes: obtaining the number of cycles of the flexible circuit board; determining the evolution slope of the flexible circuit board based on the multiple first sampling resistors of the current cycle and the number of cycles; if the evolution slope is greater than a preset slope threshold, determining the deformation voltage according to a preset voltage determination rule; and inputting the deformation voltage into the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

[0010] In one embodiment, the method further includes: determining a first resistance fluctuation rate based on a plurality of first sampling resistors; sampling the stress-compensated flexible circuit board according to a preset sampling frequency to determine a plurality of second sampling resistors for the next cycle; determining a second resistance fluctuation rate based on the plurality of second sampling resistors; adjusting the deformation voltage or micro-pulse voltage if the second resistance fluctuation rate is greater than or equal to the first resistance fluctuation rate; and inputting the adjusted deformation voltage or micro-pulse voltage into the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

[0011] In one embodiment, determining the first resistance fluctuation rate based on the plurality of first sampling resistors includes: determining a maximum first sampling resistor, a minimum first sampling resistor, and an average first sampling resistor based on the plurality of first sampling resistors; and determining the first resistance fluctuation rate based on the maximum first sampling resistor, the minimum first sampling resistor, and the average first sampling resistor.

[0012] Secondly, this application also provides a flexible circuit board adjustment device. The device includes:

[0013] The module includes an acquisition module for acquiring the resistance change of the flexible circuit board in the current cycle; a comparison module for comparing the resistance change with a first preset resistance change threshold, a second preset resistance change threshold, and the resistance change, and determining a comparison result; wherein the first preset resistance change threshold is less than the second preset resistance change threshold; a determination module for determining a deformation voltage according to a preset voltage determination rule if the comparison result is that the resistance change is greater than or equal to the second preset resistance change threshold; and a compensation module for inputting the deformation voltage into the actuator to cause the actuator to generate compensation stress on the flexible circuit board.

[0014] Thirdly, this application also provides a computer device, the computer device including a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement any of the methods in the first aspect above.

[0015] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements any of the methods in the first aspect described above.

[0016] The aforementioned flexible circuit board adjustment method, apparatus, computer equipment, and storage medium acquire the resistance change of the flexible circuit board during the current cycle. Then, they compare the resistance change with a first preset resistance change threshold, a second preset resistance change threshold, and the resistance change amount to determine a comparison result. If the first preset resistance change threshold is less than the second preset resistance change threshold, and the comparison result shows that the resistance change amount is greater than or equal to the second preset resistance change threshold, a deformation voltage is determined according to a preset voltage determination rule. Finally, the deformation voltage is input to the actuator to generate compensating stress on the flexible circuit board, thereby adjusting the flexible circuit board and preventing it from malfunctioning due to repeated bending. Attached Figure Description

[0017] Figure 1 This is a diagram illustrating the application environment of a flexible circuit board adjustment method in one embodiment.

[0018] Figure 2 This is a flowchart illustrating a flexible circuit board adjustment method in one embodiment;

[0019] Figure 3 This is a schematic diagram illustrating the process of adjusting the deformation voltage or micro-pulse voltage based on the resistance fluctuation rate in one embodiment.

[0020] Figure 4 This is a system architecture diagram of a flexible circuit board adjustment method in another embodiment;

[0021] Figure 5 This is a schematic diagram of the core principle of a flexible circuit board adjustment method in one embodiment;

[0022] Figure 6 This is a schematic diagram of the core mechanical mechanism of a flexible circuit board adjustment method in one embodiment.

[0023] Figure 7 This is a flowchart illustrating the PI-AMAL algorithm in one embodiment;

[0024] Figure 8 This is a structural block diagram of a flexible circuit board adjustment device in one embodiment;

[0025] Figure 9 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0027] With the rapid development of foldable screen phones, wearable devices, and flexible robotics, flexible circuit boards (BGAs) must withstand tens or even hundreds of thousands of cyclic bending loads during their service life. Under this dynamic loading environment, the BGA solder grid array (BGA) interface becomes a weak link in the overall system's reliability. Due to the modulus mismatch between the BGA solder balls and the flexible circuit board, the severe strain caused by bending can easily induce fatigue cracks at the interface, leading to increased contact resistance or even open-circuit failure.

[0028] In related technologies, the aforementioned problems are generally addressed through passive monitoring and structural optimization. Regarding monitoring, simple resistance threshold alarms or strain gauge measurements are typically used. While these methods can detect open circuit failures in flexible circuit boards, they cannot provide any remedial measures during the failure process. As for structural optimization, although underfill adhesive or flexible solder can be used for remediation, this is a static defense and cannot cope with the complex and ever-changing dynamic load environment during service.

[0029] More importantly, there is currently a lack of a closed-loop system capable of real-time sensing and proactive intervention in the evolution of microscopic cracks. While advanced equipment such as scanning electron microscopes (SEMs) can be used to observe cracks in flexible circuit boards in a laboratory setting, such equipment cannot be integrated into electronic terminals. Therefore, how to achieve the sensing, identification, and suppression of microscopic damage to flexible circuit boards without relying on large, advanced equipment is a common scientific problem and technological bottleneck that urgently needs to be solved in the field of flexible electronic packaging.

[0030] The flexible circuit board adjustment method provided in this application embodiment can be applied to, for example... Figure 1In the application environment shown, terminal 102 communicates with server 104 via a network. A data storage system can store the data that server 104 needs to process. The data storage system can be integrated onto server 104 or placed on a cloud or other network server. Terminal 102 is used to execute the flexible circuit board adjustment method. Terminal 102 can be, but is not limited to, various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. IoT devices can include smart speakers, smart TVs, smart air conditioners, smart vehicle devices, etc. Portable wearable devices can include smartwatches, smart bracelets, head-mounted devices, etc. Server 104 can be implemented using a standalone server or a server cluster consisting of multiple servers.

[0031] To address the aforementioned problems, in one embodiment of this application, such as Figure 2 As shown, a method for adjusting a flexible circuit board is provided, wherein an actuator is provided at the corresponding position of the solder ball array of the flexible circuit board.

[0032] In this embodiment, the actuator is an execution module made of piezoelectric thin film PZT or piezoelectric fiber reinforced composite material MFC. Its arrangement position is orthogonal or aligned with the stress concentration area of ​​the BGA solder ball array in space, and it can output the corresponding stress according to the input voltage.

[0033] The above-mentioned flexible circuit board adjustment method includes the following steps:

[0034] Step 201: Obtain the resistance change of the flexible circuit board in the current cycle.

[0035] The resistance change is the difference between the last contact resistance of the flexible circuit board in the current cycle and the reference resistance. The contact resistance is the resistance of the interface where the flexible circuit board intersects with the solder ball array. In this embodiment, the reference resistance is the average value of the contact resistances of the flexible circuit board in the current cycle.

[0036] It should be noted that, in this embodiment, one cycle is the process of applying a bending load to the flexible circuit board and then unloading the bending load. Applying a bending load to the flexible circuit board and then unloading the bending load will cause the flexible circuit board to bend and then unfold.

[0037] It should be noted that in this embodiment, the flexible circuit board is sampled at a preset sampling frequency to obtain the contact resistance of each contact resistance in the current cycle of the flexible circuit board. Then, the average value of each contact resistance is calculated as the reference resistance. Then, the difference between the last contact resistance in the current cycle and the reference resistance is calculated to obtain the resistance change of the flexible circuit board in the current cycle.

[0038] The preset sampling frequency is a pre-set frequency for sampling the contact resistance of the flexible circuit board.

[0039] In other embodiments of this application, the reference resistor is the contact resistance at the interface where the flexible circuit board intersects with the solder ball array when the flexible circuit board is first powered on and not subjected to bending load, and is a preset value. The flexible circuit board is sampled at a preset sampling frequency to obtain the contact resistances of each contact in the current cycle. Then, the difference between the last contact resistance of the current cycle and the reference resistor is calculated to obtain the resistance change of the flexible circuit board in the current cycle.

[0040] It should be noted that when the flexible circuit board and the solder ball array are pressed together, the current needs to flow from one side to the other. The interface between the flexible circuit board and the solder ball array has microscopic roughness, oxide film, and contaminants. Therefore, actual conductive contact only occurs on a few scattered microscopic contact spots at the interface between the flexible circuit board and the solder ball array. The current must contract as it passes through these spots, thus generating additional resistance, which is the contact resistance.

[0041] Step 202: Compare the first preset resistance change threshold, the second preset resistance change threshold, and the resistance change amount to determine the comparison result.

[0042] The first preset resistance change threshold and the second preset resistance change threshold are preset thresholds for the amount of resistance change, and the first preset resistance change threshold is less than the second preset resistance change threshold.

[0043] In this embodiment, the magnitudes of the first preset resistance change threshold, the second preset resistance change threshold, and the amount of resistance change are compared, and the magnitudes are used as the comparison result.

[0044] The comparison results are the relationship between the first preset resistance change threshold, the second preset resistance change threshold, and the magnitude of the resistance change.

[0045] Step 203: If the comparison result is that the change in resistance is greater than or equal to the second preset resistance change threshold, then determine the deformation voltage according to the preset voltage determination rule.

[0046] The preset voltage determination rule is a pre-defined rule for determining the deformation voltage. The deformation voltage is an accurate voltage value, and the actuator can generate compensating stress on the flexible circuit board based on the deformation voltage.

[0047] In this embodiment, if the comparison result shows that the change in resistance is greater than or equal to the second preset resistance change threshold, the deformation voltage is determined according to the preset voltage determination rule, the voltage change, and the physical parameter mechanical mechanism correction term. The physical parameter mechanical mechanism correction term is a preset parameter that addresses the viscoelasticity and damage accumulation unique to flexible packaging interfaces, and is a constant.

[0048] The process of determining the deformation voltage is as follows:

[0049] ;

[0050] in, For deformation voltage, For the change in resistance, This is a correction term for the physical parameter mechanical mechanism. For proportional control items, This is the differential control term.

[0051] Step 204: Input deformation voltage into the actuator to generate compensating stress on the flexible circuit board.

[0052] The compensation stress is the stress generated in the actuator under the action of the deformation voltage after the deformation voltage is input, and it is used to compensate and adjust the flexible circuit board.

[0053] In this embodiment, a deformation voltage is input to the actuator, which then generates a compensating stress based on the deformation voltage, thereby offsetting the internal stress of the flexible circuit board caused by the bending load, and thus compensating and adjusting the flexible circuit board.

[0054] In the aforementioned flexible circuit board adjustment method, the resistance change of the flexible circuit board in the current cycle is obtained. Then, a comparison is made with a first preset resistance change threshold, a second preset resistance change threshold, and the resistance change to determine the comparison result. If the first preset resistance change threshold is less than the second preset resistance change threshold, and the comparison result is that the resistance change is greater than or equal to the second preset resistance change threshold, then a deformation voltage is determined according to a preset voltage determination rule. Finally, the deformation voltage is input to the actuator to generate compensating stress on the flexible circuit board, thereby adjusting the flexible circuit board and avoiding the problem of the flexible circuit board failing to function properly due to repeated bending.

[0055] Furthermore, in this embodiment, by inputting deformation voltage into the actuator, the actuator generates compensating stress on the flexible circuit board, thereby compensating and adjusting the flexible circuit board. This addresses the problem in related technologies where open-circuit failures of flexible circuit boards can be detected, but no remedial measures can be provided during the failure process. By setting the actuator at the corresponding position of the solder ball array on the flexible circuit board, the compensating adjustment of the flexible circuit board is achieved. This solves the problem that although high-precision equipment such as scanning electron microscopes (SEMs) can be used to observe cracks in flexible circuit boards in a laboratory environment, such equipment cannot be integrated into electronic terminals.

[0056] In other embodiments of this application, the method further includes: if the comparison result is that the resistance change is less than a first preset resistance change threshold, then the resistance change is saved to a database.

[0057] In this embodiment, if the comparison result shows that the resistance change is less than the first preset resistance change threshold, the flexible circuit board is in a safe state, and the resistance change is saved to the database.

[0058] It should be noted that in this embodiment, if the comparison result shows that the resistance change is less than the first preset resistance change threshold, the resistance change is saved to the database, which can provide a data basis for subsequent analysis of the characteristics of the flexible circuit board.

[0059] In other embodiments of this application, the method further includes:

[0060] Step 1: If the comparison result is that the change in resistance is greater than or equal to the first preset resistance change threshold and the change in resistance is less than the second preset resistance change threshold, then determine the micro-pulse voltage according to the external force that matches the change in resistance.

[0061] External force refers to the bending load applied to the flexible circuit board from the outside.

[0062] In this embodiment, if the comparison result is that the resistance change is greater than or equal to the first preset resistance change threshold and less than the second preset resistance change threshold, the micro-amplitude pulse voltage will be determined based on the external force that is in phase with the resistance change.

[0063] It should be noted that in this embodiment, a mapping relationship between external force and micro-pulse voltage is pre-established, so the corresponding micro-pulse voltage can be determined based on the external force.

[0064] The external force and the change in resistance are in phase. The micro-pulse voltage is an accurate voltage value, and the actuator can generate compensating stress on the flexible circuit board according to the micro-pulse voltage.

[0065] Step 2: Input a micro-pulse voltage into the actuator to generate compensating stress on the flexible circuit board.

[0066] In this embodiment, a micro-pulse voltage is input to the actuator, and the actuator generates compensating stress according to the micro-pulse voltage, thereby offsetting the internal stress of the flexible circuit board caused by the bending load, so as to compensate and adjust the flexible circuit board.

[0067] In this embodiment, when the comparison result shows that the resistance change is greater than or equal to the first preset resistance change threshold and less than the second preset resistance change threshold, a micro-pulse voltage is determined based on the external force matching the resistance change. Then, the micro-pulse voltage is input to the actuator to generate compensating stress on the flexible circuit board, thereby adjusting the flexible circuit board to avoid the problem of the flexible circuit board failing to work properly due to repeated bending.

[0068] In other embodiments of this application, obtaining the resistance change of the flexible circuit board during the current cycle includes:

[0069] Step 1: Sample the flexible circuit board according to the preset sampling frequency to determine multiple first sampling resistors for the current period.

[0070] The preset sampling frequency is a pre-set frequency for sampling the contact resistance of the flexible circuit board.

[0071] In this embodiment, the contact resistance of the flexible circuit board is sampled at a preset sampling frequency during the current cycle, thereby obtaining multiple first sampling resistances for the current cycle.

[0072] It should be noted that, in this embodiment, the contact resistance of the flexible circuit board is sampled using a constant current source four-wire measurement method.

[0073] The first sampling resistor is the contact resistance of the flexible circuit board in the current cycle.

[0074] Step 2: Determine the reference resistor based on the multiple first sampling resistors.

[0075] In this embodiment, the average value of each first sampling resistor is calculated and used as the reference resistor.

[0076] In this embodiment, the reference resistor is the average value of each of the first sampling resistors.

[0077] Step 3: Determine the resistance change for the current period based on the multiple first sampling resistors and the reference resistor for the current period.

[0078] In this embodiment, the difference between the last first sampling resistor of the current cycle and the reference resistor is calculated, and the result of the difference is used as the resistance change amount of the current cycle.

[0079] In this embodiment, the resistance variable for the current cycle is the difference between the last first sampling resistor and the reference resistor for the current cycle.

[0080] It should be noted that in this embodiment, the flexible circuit board is sampled according to a preset sampling frequency to determine multiple first sampling resistors for the current period. Then, a reference resistor is determined based on the multiple first sampling resistors. Finally, the resistance change for the current period is determined based on the multiple first sampling resistors and the reference resistor.

[0081] In other embodiments of this application, the method further includes:

[0082] Step 1: Obtain the number of cycles for the flexible circuit board.

[0083] The cycle number is the sequence number of the current cycle. It can be understood that in each cycle, the flexible circuit board will undergo the process of applying bending load and then unloading bending load. Therefore, a cycle can be regarded as a cycle of applying bending load and then unloading bending load, so the cycle number is the sequence number of the current cycle.

[0084] The number of cycles can be determined by calibrating the damage to the flexible circuit board using relevant technologies, or it can be obtained directly from a database that pre-stores the number of cycles for the flexible circuit board.

[0085] It should be noted that the number of cycles for the flexible circuit board in the database is determined by a counter built into the flexible circuit board. The counter records the number of cycles for the flexible circuit board in real time and transmits it to the database.

[0086] Step 2: Determine the evolution slope of the flexible circuit board based on the multiple first sampling resistors and the number of cycles in the current period.

[0087] In this embodiment, the evolution slope of the first sampling resistor with respect to the number of cycles is calculated based on the multiple first sampling resistors and the number of cycles in the current cycle.

[0088] The evolution slope is the rate of change of the multiple first sampling resistors in the current cycle with respect to the number of cycles, which can be expressed as:

[0089] ;

[0090] Where R is the first sampling resistor in the current cycle, and N is the number of cycles.

[0091] Step 3: If the evolution slope is greater than the preset slope threshold, the deformation voltage is determined according to the preset voltage determination rule.

[0092] The preset voltage determination rule is a pre-set rule for determining the deformation voltage. The deformation voltage is an accurate voltage value, and the actuator can generate compensating stress on the flexible circuit board based on the deformation voltage. The preset slope threshold is a pre-set threshold for the evolution slope.

[0093] In this embodiment, when the evolution slope is greater than a preset slope threshold, the deformation voltage is determined based on preset voltage determination rules, voltage change amount, and physical parameter mechanical mechanism correction terms. The physical parameter mechanical mechanism correction terms are preset parameters that address the viscoelasticity and damage accumulation unique to flexible packaging interfaces, and are constants.

[0094] It should be noted that if the evolution slope is less than or equal to a preset slope threshold, the evolution slope will be saved to the database.

[0095] The process of determining the deformation voltage is as follows:

[0096] ;

[0097] in, For deformation voltage, For the change in resistance, This is a correction term for the physical parameter mechanical mechanism. For proportional control items, This is the differential control term.

[0098] Step 4: Input the deformation voltage into the actuator so that the actuator generates compensating stress on the flexible circuit board.

[0099] The compensation stress is the stress generated in the actuator under the action of the deformation voltage after the deformation voltage is input, and it is used to compensate and adjust the flexible circuit board.

[0100] In this embodiment, the deformation voltage is input to the actuator, and the actuator generates compensation stress according to the deformation voltage to compensate and adjust the flexible circuit board.

[0101] In other embodiments of this application, such as Figure 3 As shown, the method further includes:

[0102] Step 301: Determine the first resistance fluctuation rate based on multiple first sampling resistors.

[0103] In this embodiment, determining the first resistance fluctuation rate based on a plurality of first sampling resistors includes:

[0104] Step 1: Determine the maximum first sampling resistance, the minimum first sampling resistance, and the average first sampling resistance based on multiple first sampling resistors.

[0105] The maximum first sampling resistor is the maximum value among multiple first sampling resistors, the minimum first sampling resistor is the minimum value among multiple first sampling resistors, and the average first sampling resistor is the average value among multiple first sampling resistors.

[0106] In this embodiment, multiple first sampling resistors are traversed to find the maximum value, which is taken as the maximum first sampling resistor; the minimum value is taken as the minimum first sampling resistor; and the average value of the multiple first sampling resistors is calculated and taken as the average first sampling resistor.

[0107] Step 2: Determine the first resistance fluctuation rate based on the maximum first sampling resistance, the minimum first sampling resistance, and the average first sampling resistance.

[0108] In this embodiment, the difference between the maximum and minimum first sampling resistance is calculated, and this difference is divided by the average first sampling resistance. The final result is used as the first resistance fluctuation rate.

[0109] The first resistance fluctuation rate is a parameter characterizing the change of each first sampling resistor in the current period.

[0110] Step 302: Based on the preset sampling frequency, sample the stress-compensated flexible circuit board to determine multiple second sampling resistors for the next cycle.

[0111] It should be noted that in this embodiment, the next cycle is the cycle after the current cycle, and the flexible circuit board in the next cycle is the flexible circuit board after being stress-compensated in the previous cycle.

[0112] In this embodiment, in the next cycle of the current cycle, the contact resistance of the flexible circuit board is sampled at a preset sampling frequency to obtain multiple second sampling resistances for the current cycle.

[0113] The second sampling resistor is the contact resistance of the flexible circuit board in the next cycle of the current cycle.

[0114] Step 303: Determine the second resistance fluctuation rate based on multiple second sampling resistors.

[0115] In this embodiment, the second resistance fluctuation rate is determined as follows:

[0116] Step 1: Determine the maximum second sampling resistor, the minimum second sampling resistor, and the average second sampling resistor based on the multiple second sampling resistors.

[0117] The maximum second sampling resistor is the maximum value among multiple second sampling resistors, the minimum second sampling resistor is the minimum value among multiple second sampling resistors, and the average second sampling resistor is the average value among multiple second sampling resistors.

[0118] In this embodiment, multiple second sampling resistors are traversed to find the maximum value, which is taken as the maximum second sampling resistor; the minimum value is taken as the minimum second sampling resistor; and the average value of the multiple second sampling resistors is calculated and taken as the average second sampling resistor.

[0119] Step 2: Determine the second resistance fluctuation rate based on the maximum second sampling resistance, the minimum second sampling resistance, and the average second sampling resistance.

[0120] In this embodiment, the difference between the maximum and minimum second sampling resistance is calculated, and this difference is divided by the average second sampling resistance. The final result is used as the second resistance fluctuation rate.

[0121] The second resistance fluctuation rate is a parameter characterizing the changes in each second sampling resistor during the current period.

[0122] Step 304: If the fluctuation rate of the second resistor is greater than or equal to the fluctuation rate of the first resistor, then adjust the deformation voltage or micro-pulse voltage.

[0123] In this embodiment, when the second resistance fluctuation rate is greater than or equal to the first resistance fluctuation rate, the deformation voltage or micro-pulse voltage is automatically adjusted according to a preset adjustment algorithm.

[0124] The preset adjustment algorithm is a pre-defined algorithm that can automatically adjust the pulse phase of deformation voltage or micro-amplitude pulse voltage.

[0125] Step 305: Input the adjusted deformation voltage or micro-pulse voltage into the actuator so that the actuator generates compensating stress on the flexible circuit board.

[0126] In this embodiment, the adjusted deformation voltage or micro-pulse voltage is input to the actuator, and then the actuator generates compensation stress according to the adjusted deformation voltage or micro-pulse voltage to compensate and adjust the flexible circuit board.

[0127] It should be noted that in this embodiment, a first resistance fluctuation rate is determined based on multiple first sampling resistors. Then, the stress-compensated flexible circuit board is sampled according to a preset sampling frequency to determine multiple second sampling resistors for the next cycle. A second resistance fluctuation rate is then determined based on the multiple second sampling resistors. If the second resistance fluctuation rate is greater than or equal to the first resistance fluctuation rate, the deformation voltage or micro-pulse voltage is adjusted. Finally, the adjusted deformation voltage or micro-pulse voltage is input to the actuator to generate compensating stress on the flexible circuit board, thereby adjusting the flexible circuit board to avoid the problem of the flexible circuit board failing to work properly due to multiple bending.

[0128] In other embodiments of this application, a flexible electronic system and method with self-sensing interface failure and dynamic stress field reshaping capabilities are provided. The system uses a high-precision sensing module integrated on a flexible printed circuit board (FPCB) to collect the contact resistance at the interface between the FPCB and the ball-pad array (BGA). A processor with a built-in physical information mapping algorithm, based on a modified Barber electromechanical analogy, inverts the increment of electrical contact resistance in real time into the interface crack opening displacement (CTOD) and contact stiffness degradation state. When the system determines that the damage to the FPCB has reached a dangerous threshold, the processor drives a piezoelectric mechanism embedded in the FPCB substrate to generate a compensating stress field opposite to the direction of the external bending load. This application achieves a technological leap from passive reliability monitoring to proactive long-life maintenance through a closed-loop logic of sensing-mapping-decision-intervention. This solution is applicable to scenarios with frequent bending stress, such as the hinge area of ​​foldable screen phones, smart wearable devices, and robot joint drive boards, and can significantly suppress interface crack propagation and improve the service reliability of flexible packaging.

[0129] In this embodiment, the flexible electronic system with interface failure self-sensing and stress field dynamic reshaping functions includes:

[0130] Sensing module: Used to sample the contact resistance signal at the package interface where the flexible circuit board intersects with the solder ball array BGA in real time. The contact resistance signal is the multiple first sampling resistors in the current cycle.

[0131] Processing module: Includes a physical information observer for mapping the contact resistance signal into interface micro-damage parameters.

[0132] Execution module: An active strain compensation element integrated inside or on the surface of the substrate of a flexible circuit board, used to generate a compensation stress field. The execution module is the execution mechanism; the compensation stress field is the compensation stress generated by the execution mechanism based on the deformation voltage.

[0133] Control module: Calculates compensation load based on the interface micro-damage parameters and drives the execution module to perform stress reshaping.

[0134] The processing module includes a modified Barber electromechanical analogy constitutive model, which establishes a mapping relationship between contact stiffness K and contact conductance G, where contact conductance G is the reciprocal of contact resistance. The mapping relationship between contact stiffness K and contact conductance G is as follows: ,in This is a correction factor based on the interface material properties. Furthermore, the processing module is also used to calculate the load-deflection under a single cyclic loading. The area of ​​the hysteresis loop is used to extract the inelastic dissipation energy at the interface. This is used as the physical criterion for determining the instability and propagation of interface damage.

[0135] The execution module is a piezoelectric thin film PZT or a piezoelectric fiber reinforced composite material MFC, and its arrangement is orthogonal or aligned with the stress concentration area of ​​the BGA solder ball array in space.

[0136] Other embodiments of this application also provide an active interface maintenance method, including the following steps:

[0137] Step S1: Real-time sampling of the contact resistance and external bending characteristic signals at the package interface where the flexible circuit board intersects with the solder ball array BGA.

[0138] Step S2: Calculate the interface microcrack length a and crack tip opening displacement CTOD in reverse using a physical information observer.

[0139] Step S3: Determine the damage state, when the rate of change of resistance... When the preset threshold is exceeded, the compensation stress is calculated. .

[0140] Step S4: Output pulse drive voltage to control the execution module to generate reverse compressive stress at the peak phase of bending load, thereby suppressing crack opening.

[0141] It should be noted that the core logic of this application lies in using high-precision force-electricity-morphology constitutive mapping obtained from in-situ laboratory calibration to provide a dimensionality-reduced physical observer for the terminal device. The system no longer attempts to directly observe the crack image of the flexible circuit board, but instead monitors subtle perturbations in the electrical signal, combines this with a built-in physical model to deduce the microscopic damage state of the flexible circuit board, and drives active components to generate a reverse force to counteract the destructive force.

[0142] The core points and implementation methods are threefold. First, a physical information state observer based on Barber theory. This application abandons traditional empirical models and introduces a modified Barber force-electric analogy theory. We found that fluctuations in contact resistance signals are essentially manifestations of interface contact stiffness degradation. By embedding the KG mapping equation in the processor, the system can analyze the degree of interface crack opening from micro-ohm level resistance changes in real time. This process realizes a cross-scale mapping from purely electrical signals to micro-mechanical parameters. Second, a failure prediction mechanism based on energy dissipation. The system not only monitors resistance values ​​but also synchronously correlates the signals from macroscopic load sensors and displacement sensors during the calibration phase. By calculating the area of ​​the hysteresis loop, the inelastic dissipation energy during the interface damage process is quantified. This energy-dimensional judgment logic is more predictive than setting a single resistance threshold, enabling it to detect the inflection point at the interface between the flexible circuit board and the solder ball array, where steady-state propagation transitions to unstable fracture. Third, the active intervention technology for dynamic stress field reshaping. This invention embeds a piezoelectric actuator within the flexible circuit board. When the observer anticipates rapid crack propagation, the control module calculates the required stress amplitude and, at the moment the bending load reaches its peak (i.e., the interface is under the most intense tension), drives the piezoelectric element to generate a local compressive stress in the opposite direction. This stress cancellation mechanism effectively reduces the stress intensity factor at the crack tip, thereby achieving physical crack suppression.

[0143] Step 1: Multi-field synchronous calibration. In a laboratory environment, an in-situ synchronous characterization system is established. The three databases were linked together, and the constitutive equation parameters were extracted.

[0144] Step 2: Algorithm Dimensionality Reduction and Integration. The complex mechanical model is simplified into a lightweight lookup table and iterative algorithm suitable for embedded MCU operation, and then integrated into the control circuit of the flexible circuit board.

[0145] Step 3: Real-time monitoring of service status. The system acquires contact resistance signals at frequencies on the order of kilohertz and uses a second-derivative algorithm to identify resistance residence characteristics.

[0146] Step 4: Closed-loop active intervention. The excitation phase and power of the piezoelectric actuator are automatically adjusted based on the resistance fluctuation rate to achieve dynamic maintenance.

[0147] In this embodiment, the overall system architecture is as follows: Figure 4 As shown. The execution module is integrated into a local reinforcement component on the bottom or back of the flexible circuit board. This reinforcement component uses high-modulus polyimide as the substrate and encapsulates a piezoelectric film or fiber with a thickness of 30µm to 80µm for local reinforcement. When the processing module determines that the resistance fluctuation at the interface between the flexible circuit board and the solder ball array exceeds a preset precision, for example, a resistance increment corresponding to 10 microstrain, the drive circuit applies a reverse excitation voltage to the piezoelectric film within the reinforcement component. Since the reinforcement component and the flexible circuit board are bonded together by a high-shear-strength adhesive layer, the in-plane strain generated by the piezoelectric film is converted into a local compensating bending moment on the flexible circuit board, thereby reducing the stress intensity factor at the interface between the flexible circuit board and the solder ball array. The system includes modules for electrical parameter sensing, physical information mapping, adaptive multi-level decision-making, and active dynamic stress reshaping to achieve active maintenance and closed-loop control of the solder interface in flexible electronic systems.

[0148] In other embodiments of this application, non-destructive real-time observation of the encapsulation interface is achieved through a force-electric mapping model driven by physical information. Its core principle is as follows: Figure 5 As shown, specifically:

[0149] In terms of the physical configuration of the micro-interface, during the service of the flexible packaging system, the interface between the flexible circuit board and the solder ball array manifests as a series of discrete contact spots at the microscale. For example... Figure 5 As shown in the magnified view on the left, these contact spots collectively constitute the mechanical support path and charge transport path of the interface, which are represented by contact stiffness K and contact conductivity G, respectively. When the flexible circuit board bends and causes interface damage, such as microcrack initiation, the effective number of contact spots and contact area at the interface between the flexible circuit board and the solder ball array will evolve.

[0150] Based on the mapping constitutive model of Barber analogy theory, this embodiment uses the modified Barber force-electric analogy constitutive equation as the core of the algorithm. For example... Figure 5 As shown in the central mapping operator, the system establishes and utilizes the mathematical isomorphism between the potential distribution in the electrostatic field and the linear elastic displacement field according to the Laplace equation. The interface conductivity G and the interface contact stiffness K satisfy a linear proportional relationship:

[0151] ;

[0152] Where R is the contact resistance acquired in real time by the system through a four-wire sampling circuit, and α is the mapping factor. This mapping factor α is a characteristic constant determined by the conductivity of the solder ball material, Young's modulus, and the fractal dimension of the interface.

[0153] Regarding the dynamic evolution of damage observation, when external bending loads cause microcracks in the flexible circuit board to enlarge, the interface force-electric mapping logic executes the following steps. The data sensing layer involves the sensing module capturing minute fluctuations in contact resistance at a high sampling frequency. The physical mapping layer is where the algorithm converts the change in resistance into the attenuation of the effective contact conductance at the interface in real time, such as... Figure 5 As shown in the equivalent circuit diagram on the right, interface failure is equivalent to the separation of the parallel resistor array. Through the mapping equation, the system synchronously translates the resistance signal into the loss of interface mechanical stiffness K. At the geometric quantization layer, the processing module further calculates the equivalent length a of the microcrack and the crack tip opening displacement CTOD using the rate of change of the interface mechanical stiffness K, thereby achieving virtual observation of the interface damage morphology without the need for optical or radiographic detection.

[0154] This force-electric mapping mechanism provides quantitative physical criteria for the subsequent PI-AMAL algorithm. For example... Figure 5 As shown, the interface health index obtained through mapping, namely the ratio of the current stiffness K to the initial stiffness, directly determines the timing of the execution module's activation. In this way, the system can distinguish between electrical signal disturbances caused by noise and actual physical damage, thereby ensuring the accuracy of proactive maintenance intervention.

[0155] In other embodiments of this application, protection of the flexible electronic packaging interface is achieved through an active maintenance mechanism, the core mechanical mechanism of which is as follows: Figure 6 As shown. Initial stress state analysis when the flexible circuit board is subjected to external bending load. During operation, the interface between the flexible circuit board at the bottom of the chip and the BGA solder balls will be subjected to significant tensile stress. Without remodeling intervention, due to the mismatch between the substrate of the flexible printed circuit board (FPCB) and the modulus of the BGA solder balls, stress will be highly concentrated at the tip of the initial microcrack. At this time, the stress intensity factor K at the crack tip will be... I The rapid increase and exceeding of the fracture toughness of the soldering material led to a continuous increase in the crack tip opening displacement (CTOD). The interface between the flexible circuit board and the BGA solder ball exhibited an irreversible fatigue propagation trend, ultimately resulting in the breakage of the electrical path.

[0156] In this embodiment, the dynamic reshaping triggering and mapping logic is as follows: during the initial sensing and mapping stage, the processing module monitors in real time the interface electrical parameters acquired by the sensing pins of the sensing circuit module. Based on the aforementioned interface electromechanical analogy mapping model G=α×K, the processing module converts the resistance change ΔR into a degenerate parameter of the interface mechanical stiffness K, and further inversely calculates the actual crack tip opening displacement CTOD. A When this parameter exceeds a preset threshold, the system determines that the interface has entered a dangerous damage zone and then initiates the dynamic stress field reshaping process.

[0157] Regarding the inverse piezoelectric response and transmission path of the execution module, in the sensing, control, and reshaping execution stages, the processing module, i.e., the control core module, applies a high-voltage excitation signal to the actuator integrated within a local reinforcement on the back of the flexible circuit board based on the compensation requirements calculated by the PI-AMAL algorithm. Due to the inverse piezoelectric effect, the actuator undergoes in-plane deformation under the drive of the electric field, such as contraction or expansion along the length of the flexible circuit board. Because stress has the characteristic of coupled transmission, and because the local reinforcement is tightly bonded to the back of the flexible circuit board through a high-shear-strength adhesive layer, the deformation of the actuator is constrained by the substrate of the flexible circuit board, thereby generating a local compensation torque.

[0158] Active reshaping of the local stress field: During the maintenance and retention phase, the compensating torque induces compensating stress at the interface between the flexible circuit board and the BGA solder balls, opposite to the direction of external bending. Stress neutralization and shielding: According to the principle of stress superposition, the total stress at the interface is reshaped into... By precisely adjusting the amplitude and phase of the excitation voltage, the stress compensation can be achieved. For tensile stress This creates a physical shielding effect. The crack is forced to close; under the compensating stress, the microcracks that were originally open are compressed, and the opening displacement of the crack tip is reduced to a certain extent. This physical crack closure not only directly inhibits further crack propagation, but also restores some of the mechanical support stiffness at the interface between the flexible circuit board and the BGA solder balls.

[0159] In terms of the maintenance effect analysis from an energy perspective, through the dynamic reshaping of the stress field, the system significantly reduces the inelastic dissipation energy at the interface between the flexible circuit board and the BGA solder balls within a single bending cycle. The reshaped interface stress field distribution is more uniform, effectively avoiding extreme stress concentration at the edges of individual solder balls, thereby increasing the interface fatigue life by several to tens of times. This dynamic intervention scheme based on local reinforcement achieves precise physical protection of the core packaging area without changing the overall flexibility of the flexible circuit board.

[0160] In other embodiments of this application, the underlying scientific basis is the Barber analogy theory in contact mechanics. At the interface between a flexible circuit board and BGA solder balls, the number of conductive paths is strictly positively correlated with the stiffness of the physical contact points. When fatigue cracks initiate, the effective contact area at the interface between the flexible circuit board and the BGA solder balls decreases, leading to a reduction in mechanical stiffness. As the resistance decreases, the resistance R increases.

[0161] In this embodiment, we introduce an interface roughness correction factor. Equivalent elastic modulus An evolution equation applicable to large deformations of flexible plates was established:

[0162] ;

[0163] Where K is the interface mechanical stiffness. This is the interface roughness correction factor. G is the equivalent elastic modulus and G is the contact conductivity. This allows the control module to visualize microscopic physical degradation through extremely simple electrical sampling.

[0164] It should be noted that in terms of hardware implementation, the sensing circuit design employs a constant current source four-wire measurement method, with monitoring lines bypassed from key signal pins of the BGA solder balls, and high-speed acquisition via a 16-bit ADC. For actuator integration, a 30-80µm thick piezoelectric ceramic film is embedded between the PI polyimide substrate layers of the flexible circuit board using a hot-pressing process. For processor selection, an ARM Cortex-M4 core with a floating-point unit (FPU) is chosen to ensure that the computational latency of the PI-AMAL algorithm is less than 2ms.

[0165] A detailed description of the PI-AMAL algorithm is as follows: Figure 7 As shown, the algorithm runs in the real-time kernel of the embedded controller and achieves millisecond-level active suppression of BGA interface damage through four stages: perception, mapping, decision-making, and intervention.

[0166] After the system initializes and loads the parameters of the Barber theoretical physics constitutive model, it constructs the signal acquisition and feature space. The algorithm then uses a sampling frequency... Synchronous sampling acquires real-time sensing data, including the interface resistance signal R. In signal preprocessing, multi-stage filtering is used, and recursive least squares or median filtering is employed to remove electromagnetic environmental noise, extracting the pure contact resistance baseline value. This relates to the change in resistance ΔR. In time-frequency domain feature extraction, the slope of the resistance evolution with the number of cycles N will be calculated. and resistance fluctuation rate within a single period .in, For resistance fluctuation rate, This represents the maximum value of the contact resistance sampled in a single cycle. This represents the minimum contact resistance sampled in a single cycle. This is the average value of the contact resistance sampled in a single cycle.

[0167] The core of the algorithm lies in constructing a physical state observer. This involves using a pre-calibrated Barber force-electric mapping model from the laboratory to convert electrical parameters into mechanical damage indicators in real time, based on the force-electric analogy. The percentage degradation of interfacial contact stiffness is inversely calculated by using the change in resistance, thus performing stiffness inversion. Internally, the algorithm runs a simplified fracture mechanics constitutive equation, mapping it to the effective length *a* of the microcrack and the crack tip opening displacement (CTOD), for quantitative damage calculation.

[0168] ;

[0169] in, This refers to the displacement of the crack tip opening. For the change in resistance, This is the bending angle compensation factor for flexible circuit boards.

[0170] In constructing multi-level threshold decision logic, the algorithm changes the threshold by setting a first preset resistance. The second preset resistance changes the threshold. The system state is divided into three levels based on the degree of damage to the flexible circuit board, and a preset slope threshold is also set. In this embodiment, different intervention strategies will be implemented for different stages.

[0171] First, when the flexible circuit board is in the safe zone, the change in resistance... When this happens, it enters a safe mode, only recording relevant data and not activating the piezoelectric actuator, maintaining low-power standby.

[0172] Then, when the flexible circuit board is in the warning zone, the change in resistance... Greater than or equal to And the change in resistance Less than At that time, crack initiation was detected. The piezoelectric actuator was activated to apply a micro-amplitude pulse load in phase with the bending frequency, attempting to optimize the contact interface between the flexible circuit board and the BGA solder balls through mechanical micro-vibration.

[0173] Finally, when the flexible circuit board is in the intervention area, the change in resistance... or evolution slope Greater than the preset slope threshold When the crack in the flexible circuit board is determined to have entered an unstable propagation phase, intervention mode is activated, and the dynamic stress reshaping procedure is immediately initiated.

[0174] In terms of stress field reshaping and dynamic compensation parameter calculation, the algorithm calculates and outputs the compensation voltage in real time based on the current bending phase. The compensating load must reach its peak value at the instant the crack in the flexible printed circuit board (FPCB) opens to achieve phase alignment. Using the Active Disturbance Rejection Control (ADRC) algorithm, a reverse compressive stress is generated by driving the piezoelectric actuator. To achieve amplitude control and minimize inelastic energy dissipation. This causes the load-deflection hysteresis loop within each cycle to tend to close, physically suppressing the driving force at the crack tip, which is the physical objective.

[0175] It should be noted that the algorithm can construct a closed-loop self-calibration, and the algorithm periodically compares the resistance fluctuation rate before and after the intervention. If after intervention If the phase shift decreases, it indicates that the compensation phase is effective; if it is ineffective, it enters the warning mode and automatically adjusts the pulse phase shift according to the preset adjustment algorithm to adapt to complex deformations under different usage scenarios and attempts to optimize the interface.

[0176] Then, a closed-loop effectiveness assessment will be conducted to examine the inelastic dissipation energy after the intervention. If the value decreases, the compensation parameters are self-calibrated, the phase shift and amplitude are adjusted, and then the cycle begins. If the value decreases, the cycle begins directly.

[0177] It should be noted that the flexible circuit board adjustment method provided in this application can be used in foldable screen mobile phone applications. When a user unfolds the foldable screen mobile phone, the sensing module detects a momentary pulse-like increase in resistance. The algorithm identifies this as being caused by the opening of an interface crack. The control module immediately drives the actuator below the hinge area to generate an inward thrust, forcibly closing the crack surface, instantly restoring the resistance to a stable level, and preventing the permanent expansion of the crack during this cycle.

[0178] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0179] Based on the same inventive concept, this application also provides a flexible circuit board adjustment device for implementing the flexible circuit board adjustment method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the flexible circuit board adjustment device provided below can be found in the limitations of the flexible circuit board adjustment method described above, and will not be repeated here.

[0180] In one embodiment of this application, such as Figure 8 As shown, a flexible circuit board adjustment device is provided, comprising:

[0181] The acquisition module 100 is used to acquire the resistance change of the flexible circuit board in the current cycle.

[0182] The comparison module 200 is used to compare the first preset resistance change threshold, the second preset resistance change threshold, and the resistance change amount to determine the comparison result; the first preset resistance change threshold is less than the second preset resistance change threshold.

[0183] The determination module 300 is used to determine the deformation voltage according to the preset voltage determination rule if the comparison result is that the resistance change is greater than or equal to the second preset resistance change threshold.

[0184] The compensation module 400 is used to input the deformation voltage into the actuator so that the actuator generates compensation stress on the flexible circuit board.

[0185] In one embodiment of this application, the determining module 300 is further configured to save the resistance change to the database if the comparison result is that the resistance change is less than a first preset resistance change threshold.

[0186] In one embodiment of this application, the determining module 300 is further configured to determine a micro-pulse voltage based on an external force matching the resistance change if the comparison result is that the resistance change is greater than or equal to a first preset resistance change threshold and the resistance change is less than a second preset resistance change threshold; and input the micro-pulse voltage into the actuator so that the actuator generates compensating stress on the flexible circuit board.

[0187] In one embodiment of this application, the acquisition module 100 is further configured to sample the flexible circuit board according to a preset sampling frequency to determine a plurality of first sampling resistors for the current period; determine a reference resistor based on the plurality of first sampling resistors; and determine the resistance change amount for the current period based on the plurality of first sampling resistors and the reference resistor.

[0188] In one embodiment of this application, the determining module 300 is further configured to obtain the number of cycles of the flexible circuit board; determine the evolution slope of the flexible circuit board based on the multiple first sampling resistors of the current cycle and the number of cycles; if the evolution slope is greater than a preset slope threshold, determine the deformation voltage according to a preset voltage determination rule; and input the deformation voltage into the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

[0189] In one embodiment of this application, the determining module 300 is further configured to: determine a first resistance fluctuation rate based on a plurality of first sampling resistors; sample the stress-compensated flexible circuit board according to a preset sampling frequency to determine a plurality of second sampling resistors for the next cycle; determine a second resistance fluctuation rate based on the plurality of second sampling resistors; if the second resistance fluctuation rate is greater than or equal to the first resistance fluctuation rate, adjust the deformation voltage or micro-pulse voltage; and input the adjusted deformation voltage or micro-pulse voltage into the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

[0190] In one embodiment of this application, the determining module 300 is further configured to determine a maximum first sampling resistance, a minimum first sampling resistance, and an average first sampling resistance based on a plurality of first sampling resistances; and to determine a first resistance fluctuation rate based on the maximum first sampling resistance, the minimum first sampling resistance, and the average first sampling resistance.

[0191] Each module in the aforementioned flexible circuit board adjustment device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each module.

[0192] In one embodiment of this application, a computer device is provided, which may be a server, and its internal structure diagram may be as follows. Figure 9 As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database stores all relevant data for executing the flexible circuit board adjustment method. The network interface communicates with external terminals via a network connection. When the computer program is executed by the processor, it implements a flexible circuit board adjustment method.

[0193] Those skilled in the art will understand that Figure 9 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0194] In one embodiment of this application, a computer device is provided, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps of the flexible circuit board adjustment method in the above embodiment.

[0195] In one embodiment of this application, a computer-readable storage medium is provided, on which a computer program is stored, the computer program being executed by a processor to implement the steps of the flexible circuit board adjustment method in the above-described method embodiments.

[0196] In one embodiment of this application, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps of the flexible circuit board adjustment method in the above-described method embodiments.

[0197] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0198] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0199] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0200] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for adjusting a flexible circuit board, characterized in that, An actuator is provided at the corresponding position of the solder ball array on the flexible circuit board; the method includes: Obtain the resistance change of the flexible circuit board during the current cycle; The first preset resistance change threshold, the second preset resistance change threshold, and the resistance change amount are compared to determine the comparison result; the first preset resistance change threshold is less than the second preset resistance change threshold. If the comparison result is that the change in resistance is greater than or equal to the second preset resistance change threshold, then the deformation voltage is determined according to the preset voltage determination rule. The deformation voltage is input to the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

2. The flexible circuit board adjustment method according to claim 1, characterized in that, The method further includes: If the comparison result shows that the change in resistance is less than the first preset threshold for change in resistance, then the change in resistance is saved to the database.

3. The flexible circuit board adjustment method according to claim 1, characterized in that, The method further includes: If the comparison result is that the resistance change is greater than or equal to the first preset resistance change threshold and less than the second preset resistance change threshold, then the micro-amplitude pulse voltage is determined according to the external force matching the resistance change. The micro-amplitude pulse voltage is input to the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

4. The flexible circuit board adjustment method according to claim 1, characterized in that, The acquisition of the resistance change of the flexible circuit board in the current cycle includes: The flexible circuit board is sampled according to a preset sampling frequency to determine multiple first sampling resistors for the current period; A reference resistor is determined based on a plurality of the first sampling resistors; The resistance change for the current period is determined based on the multiple first sampling resistors and the reference resistor for the current period.

5. The flexible circuit board adjustment method according to claim 4, characterized in that, The method further includes: Obtain the number of cycles for the flexible circuit board; The evolution slope of the flexible circuit board is determined based on the multiple first sampling resistors in the current cycle and the number of cycles. If the evolution slope is greater than a preset slope threshold, the deformation voltage is determined according to the preset voltage determination rule; The deformation voltage is input to the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

6. The flexible circuit board adjustment method according to claim 4, characterized in that, The method further includes: The first resistance fluctuation rate is determined based on multiple first sampling resistors; According to the preset sampling frequency, the stress-compensated flexible circuit board is sampled to determine multiple second sampling resistors for the next cycle; The second resistance fluctuation rate is determined based on multiple second sampling resistors; If the second resistance fluctuation rate is greater than or equal to the first resistance fluctuation rate, then the deformation voltage or micro-pulse voltage is adjusted. The adjusted deformation voltage or micro-pulse voltage is input to the actuator to cause the actuator to generate compensating stress on the flexible circuit board.

7. The flexible circuit board adjustment method according to claim 6, characterized in that, Determining the first resistance fluctuation rate based on a plurality of first sampling resistors includes: Based on the plurality of first sampling resistors, determine the maximum first sampling resistor, the minimum first sampling resistor, and the average first sampling resistor; The first resistance fluctuation rate is determined based on the maximum first sampling resistance, the minimum first sampling resistance, and the average first sampling resistance.

8. A flexible circuit board adjustment device, characterized in that, An actuator is provided at the corresponding position of the solder ball array on the flexible circuit board; the device includes: The acquisition module is used to acquire the resistance change of the flexible circuit board in the current cycle. The comparison module is used to compare the first preset resistance change threshold, the second preset resistance change threshold, and the amount of resistance change to determine the comparison result; the first preset resistance change threshold is less than the second preset resistance change threshold. The determination module is used to determine the deformation voltage according to the preset voltage determination rules if the comparison result is that the resistance change is greater than or equal to the second preset resistance change threshold. The compensation module is used to input the deformation voltage into the actuator so that the actuator generates compensation stress on the flexible circuit board.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

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