Automatic immersion cleaning equipment for PCB manufacturing

Abstract

This invention relates to the field of semiconductor immersion cleaning for circuit boards, specifically an automated immersion cleaning device for PCB manufacturing. It includes a cleaning tank, a clamping mechanism, a spraying mechanism, and a recovery assembly. The cleaning tank has an opening on its side. The clamping mechanism is rotatably mounted inside the cleaning tank via a rotating shaft. The spraying mechanism includes an outlet tank mounted inside the cleaning tank via a fixed frame and having a row of through holes one and a row of through holes two on its lateral sides, a spraying element one and a spraying element two respectively connected to the through holes one and two, a rotating shaft two rotatably mounted on the outlet tank and driven by the rotating shaft one, a connecting rod mounted on the rotating shaft two, and a baffle plate at the outer end of the connecting rod. This invention clamps multiple circuit boards using a clamping method, first spraying the circuit board surface, then cleaning the surface by creating water bubbles, and finally cleaning the surface by immersion cleaning. This multi-stage cleaning process provides better results and higher efficiency, without damaging the circuit boards, ensuring cleaning quality.

Description

Technical Field

[0001] This invention relates to the field of semiconductor immersion cleaning for circuit boards, and in particular to an automated immersion cleaning device for PCB board manufacturing. Background Technology

[0002] After semiconductor devices are assembled onto a PCB circuit board, they need to be immersed in cleaning equipment. This is because the flux used in the semiconductor device soldering process decomposes at high temperatures, leaving behind corrosive, hygroscopic, and conductive residues. These residues can undergo electrochemical migration in a humid environment, creating tiny conductive paths between circuits, leading to leakage or even short circuits. Furthermore, tiny solder balls and dross may be generated during the soldering process; if these remain on the board surface, they can also cause short circuits.

[0003] However, existing immersion cleaning equipment simply puts the circuit boards into the cleaning solution, cleaning one circuit board at a time. This results in low cleaning efficiency, and if too many circuit boards are put in, friction damage may occur between them, affecting the quality of the circuit boards. Summary of the Invention

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing an automated immersion cleaning device for PCB board manufacturing. The device clamps multiple circuit boards using a clamping method, first sprays the surface of the circuit boards to clean them, then cleans them by creating water bubbles, and finally cleans them by immersion. This multi-stage cleaning method provides better and more efficient cleaning of the circuit boards and semiconductor devices on them, without damaging the circuit boards and ensuring cleaning quality.

[0005] The present invention provides an automated immersion cleaning device for PCB board manufacturing, comprising a cleaning tank, a clamping mechanism, a spraying mechanism, and a recovery component. The cleaning tank has an opening on its side, and a door hinged to the cleaning tank blocks the opening. The clamping mechanism is rotatably mounted inside the cleaning tank via a rotating shaft. The spraying mechanism includes a liquid outlet tank mounted inside the cleaning tank via a fixed frame and having a row of through holes 1 and a row of through holes 2 on its lateral sides, a spray element 1 and a spray element 2 respectively connected to the through holes 1 and 2, a rotating shaft 2 rotatably mounted on the liquid outlet tank and drivenly connected to the rotating shaft 1, a connecting rod mounted on the rotating shaft 2, and a baffle mounted on the outer end of the connecting rod. The liquid outlet tank receives pressurized cleaning liquid. The rotating shaft 2 rotates at a speed less than the rotating shaft 1. The baffle rotates and fits against the inner circumferential surface of the liquid outlet tank, intermittently blocking the through holes 1 and 2. The spray element 1 and the spray element 2 are respectively mounted on both sides of the liquid outlet tank and each has a spray nozzle at its bottom. The recovery component filters the cleaning liquid after cleaning the PCB board, recovers the filtered cleaning liquid, and collects the filtered contaminants.

[0006] Preferably, the baffle is an arc-shaped plate that covers the inner circumference of the liquid outlet tank within a 180-degree range.

[0007] Preferably, a pusher is provided at the outer end of the rotating shaft, and the outer side of the pusher is distributed in an elliptical arc shape. Two sets of elastic cleaning components are provided opposite to each other on the side of the liquid outlet tank. The elastic cleaning components include cleaning brushes. When the pusher pushes the elastic cleaning components, the cleaning brushes move to scrub the liquid spray nozzle.

[0008] Preferably, the clamping mechanism includes a rotating frame mounted on a rotating shaft, two connecting frames mounted on the rotating frame in pairs, a support platform with an outer protruding ring portion on the connecting frame, an insertion platform with an outer protruding ring portion two slidably mounted on the connecting frame, a pull plate mounted at the outer end of the insertion platform, and a spring disposed between the connecting frame and the outer protruding ring portion two.

[0009] Preferably, the support has a groove, the end of the insertion platform is inserted into the groove, a magnet is provided in the groove, and a magnet is provided at the end of the insertion platform that is magnetically attracted to the magnet.

[0010] Preferably, the clamping mechanism includes a clamping plate one mounted on a rotating shaft one, multiple sets of positioning components one arrayed on the clamping plate one, a clamping plate two distributed opposite to the clamping plate one, multiple sets of positioning components two arrayed on the clamping plate two, and two sets of spring-loaded components symmetrically distributed and pressing the positioning components two onto the positioning components one. The spring-loaded components include a handle and a bracket mounted on the side of the clamping plate two, a lifting rod slidably mounted on the bracket, a plug portion and a stop portion respectively mounted at both ends of the lifting rod, a spring two connecting the bracket and the stop portion, and a push plate mounted on the lifting rod. The outer side of the clamping plate one is provided with a sliding groove for the plug portion to slide, and the bottom end of the groove has a locking hole for the plug portion to be inserted. The end of the lifting rod near the plug portion is provided with a protruding retaining ring portion.

[0011] Preferably, the recycling assembly includes a recycling bin, a guide pipe connected to the bottom of the cleaning bin, a connecting pipe vertically arranged at the outer end of the guide pipe, and a filter element and a waste bin respectively connected to the top and bottom of the connecting pipe. The filter element is located inside the recycling bin, a control valve is provided at the bottom of the connecting pipe, and a discharge valve is provided at the bottom of the waste bin.

[0012] Preferably, a water pump is installed on the recycling bin, a liquid extraction pipe is connected between the water pump input end and the lower part of the recycling bin, and a return pipe is connected between the water pump output end and the liquid outlet tank.

[0013] Preferably, a three-way pipe is connected to the return pipe, and a control valve two is installed on the return pipe above the three-way pipe. The three-way pipe is connected to a diversion pipe, and a diversion valve is installed on the diversion pipe. A spray hood is connected to the outer end of the diversion pipe. The spray hood surrounds the outer periphery of the filter element, and the inner periphery of the spray hood has spray holes.

[0014] Preferably, the upper side of the recycling box has a convex flow guide box, the bottom surface of the inner side of the flow guide box is inclined downward, the connecting pipe passes through the bottom surface of the inner side of the flow guide box, and the filter element is located inside the flow guide box.

[0015] Compared with existing technologies, this invention has the following beneficial technical effects: This invention clamps multiple circuit boards using a clamping method. A spraying component sprays cleaning fluid onto the circuit boards held by the clamping mechanism, creating an eccentric thrust to clean the circuit board surface through a spraying method. As the cleaning fluid accumulates in the cleaning tank, when the force generated by the eccentric spray is insufficient to overcome the resistance of the accumulated cleaning fluid to the clamping mechanism, the sprayed cleaning fluid creates bubbles at the clamping mechanism, which are then used to clean the circuit board surface. When the cleaning fluid completely submerges the clamping mechanism and the circuit board, the circuit board surface is cleaned through immersion. This provides better and more efficient multi-stage cleaning of the circuit boards and the semiconductor devices on them, without damaging the circuit boards, effectively ensuring cleaning quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention; Figure 2 A schematic diagram illustrating the principle of switching the activation state of two injection components via an eccentric blowing clamping mechanism; Figure 3 for Figure 2 Enlarged view of the structure at point A in the middle; Figure 4 This is a structural cross-sectional view of another clamping mechanism; Figure 5 for Figure 4 Enlarged view of the structure at point B; Figure 6 This is a partial structural cross-sectional view of an embodiment of the present invention; Figure 7 This is a partial structural cross-sectional view of a filter cartridge filtering out contaminants.

[0017] Attached reference numerals: 1. Cleaning tank; 101. Guide tube; 2. Tank door; 3. Rotating shaft one; 4. Rotating frame; 5. Connecting frame; 6. Support platform; 7. Insertion platform; 8. Pull plate; 9. Spring one; 10. Magnet one; 11. Magnet two; 12. Clamping plate one; 121. Slide groove; 122. Locking hole; 13. Glue platform one; 14. Clamping plate two; 15. Glue platform two; 16. Handle; 17. Lifting rod; 171. Plug part; 172. Baffle part; 18. Push plate; 19. Bracket; 20. Spring two; 21. Belt; 22. Driven gear; 23. Rotating shaft two; 24. Discharge tank ; 241. Through hole one; 242. Through hole two; 25. Fixing frame; 26. Connecting rod; 27. Baffle; 281. Spray component one; 282. Spray component two; 29. ​​Push frame; 30. Fixing plate; 31. Slide frame; 32. Slide rod; 33. Spring three; 34. Cleaning brush; 35. Recycling bin; 36. Water pump; 37. Liquid extraction pipe; 38. Liquid return pipe; 380. T-connector; 381. Control valve two; 39. Connecting pipe; 391. Control valve one; 40. Waste bin; 401. Discharge valve; 41. Filter element; 42. Diverter pipe; 421. Diverter valve; 43. Spray cover. Detailed Implementation

[0018] Example 1: As Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 7 As shown in the figure, this embodiment proposes an automated immersion washing equipment for PCB board manufacturing, including a washing tank 1, a clamping mechanism, a spraying mechanism, and a recycling component.

[0019] The cleaning tank 1 has an opening on the side, and the cleaning tank 1 is hinged to a door 2 that blocks the opening. After the door 2 is opened, the circuit board is clamped and fixed by a clamping mechanism.

[0020] like Figure 2 and Figure 3As shown, the clamping mechanism is rotatably mounted inside the cleaning tank 1 via a rotating shaft 3. The clamping mechanism includes a rotating frame 4 mounted on the rotating shaft 3, two pairs of connecting frames 5 mounted on the rotating frame 4, a support platform 6 with an outwardly protruding ring portion 1 mounted on the connecting frame 5, an insertion platform 7 slidably mounted on the connecting frame 5 and having an outwardly protruding ring portion 2, a pull plate 8 located at the outer end of the insertion platform 7, and a spring 9 located between the connecting frame 5 and the outwardly protruding ring portion 2. The support platform 6 has a groove, and the end of the insertion platform 7 is inserted into the groove. This clamping mechanism can clamp larger circuit boards, is suitable for thicker circuit boards, has high structural strength, and is suitable for spray washing. The top of the support platform 6 can be inserted into the mounting hole at the corner of the circuit board, the outwardly protruding ring portion 1 supports the circuit board, and then the spring 9 pushes down the outwardly protruding ring portion 2, causing the bottom end of the insertion platform 7 to insert into the groove, preventing the circuit board from falling off. Additionally, a magnet 10 is provided in the groove, and a magnet 11, which is magnetically attracted to the magnet 10, is provided at the end of the insertion platform 7. After the insertion plate 7 is inserted into the groove, the two magnets attract each other, making it less likely for the insertion plate 7 to come out of the groove, thus preventing the circuit board from falling out during the cleaning process.

[0021] like Figure 2 and Figure 6 As shown, the spraying mechanism includes an outlet tank 24 mounted inside the cleaning tank 1 via a fixed frame 25, having a row of through holes 241 on one side and a row of through holes 242 on the other side; a spray element 281 and a spray element 282 connected to the through holes 241 and 242 respectively; a rotating shaft 23 rotatably mounted on the outlet tank 24 and driven by a rotating shaft 3; a connecting rod 26 mounted on the rotating shaft 23; and a baffle 27 mounted on the outer end of the connecting rod 26. The outlet tank 24 receives pressurized cleaning fluid. The baffle 27 rotatably fits against the inner circumferential surface of the outlet tank 24, intermittently blocking the through holes 241 and 242. The baffle 27 is an arc-shaped plate that covers the inner circumferential surface of the outlet tank 24 within a 180-degree range. The spray elements 281 and 282 are respectively mounted on both sides of the outlet tank 24, each with a spray nozzle at its bottom.

[0022] Cleaning fluid is delivered to the corresponding spray nozzle through the through hole not blocked by the baffle 27. The cleaning fluid is then sprayed onto the circuit board below through the spray nozzle. An eccentric force is applied to rotate the clamping mechanism, which in turn drives the rotating shaft 23 to rotate through the rotating shaft 3. This, in turn, drives the connecting rod 26 and the baffle 27 to rotate. When the baffle 27 disengages from one through hole, it begins to block the other through hole. The cleaning fluid is then sprayed downwards through the spray nozzle on the side where the through hole is not blocked, creating an eccentric force in the opposite direction. This causes the clamping mechanism and the circuit board to rotate in opposite directions, ensuring that all areas of the circuit board are cleaned by the cleaning fluid. Rotating shaft 23 is located above rotating shaft 3. The rotational speed of rotating shaft 23 is less than that of rotating shaft 3. For the transmission connection between rotating shaft 3 and rotating shaft 23, pulley 1 is installed on rotating shaft 3, and pulley 2 is rotatably mounted on the cleaning tank 1 via a connecting shaft. A belt 21 is fitted onto pulley 1 and pulley 2. A drive gear is coaxially mounted on the connecting shaft, and a driven gear 22, which meshes with the drive gear, is installed on rotating shaft 23. The driven gear 22 is larger than the drive gear, serving a speed reduction function. The clamping mechanism and circuit board rotate multiple times in one direction and are sprayed and cleaned multiple times by one spray component. Then, another spray component is switched, and the clamping mechanism and circuit board rotate multiple times in the other direction, continuing to be sprayed and cleaned multiple times, effectively cleaning all areas of the circuit board surface.

[0023] like Figure 1 and Figure 7As shown, the recovery assembly filters the cleaning fluid after cleaning the PCB board, recovers the filtered cleaning fluid, and collects the filtered contaminants. The recovery assembly includes a recovery tank 35, a guide pipe 101 connected to the bottom of the cleaning tank 1, a connecting pipe 39 vertically arranged outside the guide pipe 101, and filter elements 41 and a waste tank 40 connected to the top and bottom of the connecting pipe 39, respectively. The lower part of the guide pipe 101 gradually slopes downward away from the cleaning tank 1. The filter element 41 is located inside the recovery tank 35. A control valve 391 is installed at the bottom of the connecting pipe 39, and a discharge valve 401 is installed at the bottom of the waste tank 40. A water pump 36 is installed on the recovery tank 35. A suction pipe 37 connects the input end of the water pump 36 to the bottom of the recovery tank 35, and a return pipe 38 connects the output end of the water pump 36 to the outlet tank 24. Pump 36 draws cleaning fluid from recovery tank 35 through suction pipe 37 and pressurizes and delivers it to outlet tank 24 through return pipe 38. When the spray nozzle sprays cleaning fluid downwards, control valve 391 closes. The speed at which the cleaning fluid enters recovery tank 35 from filter element 41 is less than the speed at which the spray nozzle sprays the cleaning fluid downwards; that is, the discharge speed of the cleaning fluid is less than the filling speed. The cleaning fluid gradually accumulates in cleaning tank 1, thus achieving the cleaning process of first spray cleaning, then bubble cleaning, and finally immersion cleaning. After the three processes are completed, the spray nozzle stops spraying cleaning fluid, and the cleaning fluid, due to its own gravity, passes through filter element 41 into recovery tank 35, where the filtered-off dirt is removed. When no more cleaning fluid enters recovery tank 35, control valve 391 is opened, and a small amount of cleaning fluid containing dirt flows downwards through connecting pipe 39 to dirt tank 40 for collection and centralized treatment.

[0024] Additionally, a three-way pipe 380 is connected to the return pipe 38, and a control valve 381 located above the three-way pipe 380 is installed on the return pipe 38. The three-way pipe 380 is connected to a diversion pipe 42, and a diversion valve 421 is installed on the diversion pipe 42. A spray shroud 43 is connected to the outer end of the diversion pipe 42, and the spray shroud 43 surrounds the outer periphery of the filter element 41. The inner circumferential surface of the spray shroud 43 has spray holes. When the cleaning fluid is sprayed downward through the spraying element, the control valve 381 opens, the diversion valve 421 closes, and the cleaning fluid flows through the return pipe 38 to the outlet tank 24. After the circuit board is cleaned and the contaminants enter the waste tank 40, control valve 381 is closed and diversion valve 421 is opened. The cleaning fluid is pumped to the diversion pipe 42 by water pump 36. The cleaning fluid is sprayed from the spray nozzles of spray hood 43 onto the filter element 41, backwashing the filter element 41 from the outside in. This facilitates the removal of contaminants from the filter element 41, which then enter the waste tank 40 through connecting pipe 39. The upper side of the recovery tank 35 has a protruding guide box section. The bottom surface of the guide box section slopes downwards, and connecting pipe 39 penetrates the bottom surface of the guide box section. The filter element 41 is located inside the guide box section. The filtered cleaning fluid discharged from the filter element 41 flows along the sloped bottom surface of the guide box section into the main structure of the recovery tank 35 for recycling. Cleaning fluid sprayed from spray hood 43 that does not enter the filter element 41 also flows back into the recovery tank 35 along the slope for recycling.

[0025] This embodiment uses a clamping method to hold multiple circuit boards. A spraying component sprays cleaning fluid onto the circuit boards held by the clamping mechanism, creating an eccentric thrust to clean the circuit boards; that is, the circuit board surface is first cleaned by spraying. As the cleaning fluid accumulates in the cleaning tank 1, the resistance generated by the cleaning fluid to the rotation of the clamping mechanism gradually increases. When the force generated by the eccentric spraying of the cleaning fluid is insufficient to overcome the resistance of the accumulated cleaning fluid to the clamping mechanism, the sprayed cleaning fluid will create bubbles at the clamping mechanism. These bubbles are used to clean the circuit boards; that is, the circuit board surface is cleaned again by creating bubbles. When the cleaning fluid completely submerges the clamping mechanism and the circuit boards, the circuit boards are immersed in the cleaning fluid accumulated in the cleaning tank 1; that is, the circuit board surface is finally cleaned by immersion. This multi-stage cleaning of the circuit boards and the semiconductor devices on them is more effective and efficient, without damaging the circuit boards, effectively ensuring cleaning quality.

[0026] Example 2: This example proposes an automated immersion washing device for PCB board manufacturing. The difference between this example and Example 1 is as follows: Figure 6As shown, a pusher frame 29 is provided at the outer end of the rotating shaft 23. The outer side of the pusher frame 29 is elliptical. Two sets of elastic cleaning components are arranged opposite each other on the side of the liquid outlet tank 24. The elastic cleaning components include a cleaning brush 34, a slide 31 for mounting the cleaning brush 34, a slide rod 32 mounted on the slide 31, a fixing plate 30 mounted on the liquid outlet tank 24 for sliding mounting of the slide rod 32, and a spring 33 connecting the fixing plate 30 and the slide 31. When the pusher frame 29 pushes the elastic cleaning components, it specifically pushes the slide 31. The slide rod 32 slides horizontally on the fixing plate 30, and the slide 31 drives the cleaning brush 34 to move horizontally. The cleaning brush 34 moves to clean the spray nozzle at the bottom of the spray component. The pusher frame 29 and the baffle 27 face the same direction. When the baffle 27 blocks a through hole to prevent the corresponding spray component from spraying cleaning fluid, the pusher frame 29 can trigger the corresponding cleaning brush 34 to clean the spray nozzle at the bottom of the spray component. For the other spray component that is in normal spraying state, the corresponding elastic cleaning component on the other side will not move under the corresponding spray component and will not affect the spraying of cleaning fluid.

[0027] In this embodiment, the push frame 29 is linked with the rotating shaft 23 to clean the spraying parts in the unsprayed state using the elastic cleaning component, preventing the spraying parts from becoming clogged and achieving a self-cleaning function.

[0028] Example 3: This example proposes an automated immersion washing device for PCB board manufacturing. The difference between this example and Example 1 is as follows: Figure 4 and Figure 5 As shown, the difference lies in the clamping mechanism. In this embodiment, the clamping mechanism includes a clamping plate 12 mounted on a rotating shaft 3, multiple sets of positioning components 1 arrayed on the clamping plate 12, a clamping plate 2 14 distributed opposite to the clamping plate 12, multiple sets of positioning components 2 arrayed on the clamping plate 2 14, and two sets of spring-loaded components symmetrically distributed and pressing the positioning components 2 onto the positioning components 1. Multiple openings are arrayed on both the clamping plate 12 and the clamping plate 2 14. The clamping plate 12 and the clamping plate 2 14 can be designed as mesh plates with evenly distributed perforations to facilitate the flow of cleaning fluid. The positioning component 1 includes four rectangular adhesive platforms 13, and the positioning component 2 includes four rectangular adhesive platforms 15. The adhesive platforms 13 and 15 have the same structure, both having right-angled limiting grooves. The four corners of a PCB circuit board can be limited to the four corresponding right-angled limiting grooves. When the positioning components 1 and 2 are pressed together by the spring-loaded components, the PCB circuit board will not detach from the inside. The multiple positioning components 1 and 2 can be used to limit the positioning of multiple PCB circuit boards, thereby ultimately enabling the immersion cleaning of multiple PCB circuit boards with high cleaning efficiency.

[0029] The spring-loaded assembly includes a handle 16 and a bracket 19 disposed on the side of the clamping plate 14, a lifting rod 17 slidably disposed on the bracket 19, a plug portion 171 and a stop portion 172 respectively disposed at both ends of the lifting rod 17, a spring 20 connecting the bracket 19 and the stop portion 172, and a push plate 18 disposed on the lifting rod 17. The outer side of the clamping plate 12 is provided with a sliding groove 121 for the plug portion 171 to slide. The bottom end of the sliding groove 121 has a locking hole 122 for the plug portion 171 to be inserted. The end of the lifting rod 17 near the plug portion 171 is provided with a protruding retaining ring portion. Multiple circuit boards to be cleaned are placed in the multiple positioning components on the clamping plate 14 beforehand. Then, the user holds the handle 16 and pushes the push plate 18 upward. The push plate 18 moves the lifting rod 17 upward, compressing the spring 20. The user pushes the plug part 171 inward along the slide groove 121. When the plug part 171 moves to the locking hole 122, the spring 20 pushes down the stop plate 172, the lifting rod 17 moves downward, and the plug part 171 inserts into the locking hole 122. The positioning component 2 moves below the positioning component 1. The positioning component 1 and the positioning component 2 correspond to define the position of the inner circuit board, preventing the circuit board from falling off.

[0030] This embodiment can array multiple circuit boards of relatively small size. When the cleaning fluid is sprayed downwards by the sprayer, it is also sprayed eccentrically towards clamping plate 12 or clamping plate 14. The cleaning fluid flows inwards to rinse the circuit boards and achieve cleaning. As the cleaning fluid accumulates in the cleaning tank 1, when the accumulated cleaning fluid generates significant resistance to the rotation of the clamping mechanism, the force generated by the eccentric spraying of the cleaning fluid is insufficient to overcome the resistance of the accumulated cleaning fluid to the clamping mechanism. The sprayed cleaning fluid will create bubbles at the clamping mechanism, and the cleaning fluid bubbles are used to clean the circuit boards. When the cleaning fluid completely submerges the clamping mechanism, the circuit boards are immersed in the cleaning fluid, thereby comprehensively improving the number of circuit boards and the immersion cleaning efficiency. During operation, the plug part 171 of the lifting rod 17 needs to be inserted into the card hole 122 first, and then the push plate 18 needs to be released. Under the elastic force of the spring 20, the positioning component 2 can be aligned and attached to the positioning component 1, preventing the circuit board from falling off from the inside and avoiding damage to the circuit board.

[0031] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. An automated immersion washing device for PCB board manufacturing, characterized in that, include: The cleaning box (1) has an opening on the side and a hinged door (2) that blocks the opening. The clamping mechanism is rotatably mounted inside the cleaning tank (1) via a rotating shaft (3); The spraying mechanism includes a liquid outlet tank (24) mounted in the cleaning tank (1) via a fixed frame (25) and having a row of through holes 1 (241) and a row of through holes 2 (242) on its lateral sides respectively; a spray element 1 (281) and a spray element 2 (282) respectively connected to the through holes 1 (241) and the through holes 2 (242); a rotating shaft 2 (23) rotatably mounted on the liquid outlet tank (24) and drivenly connected to the rotating shaft 1 (3); and a connecting rod mounted on the rotating shaft 2 (23). 26) and a baffle (27) set at the outer end of the connecting rod (26), the liquid outlet tank (24) receives the pressurized cleaning liquid, the rotation speed of the second shaft (23) is less than the rotation speed of the first shaft (3), the baffle (27) rotates and fits against the inner circumferential surface of the liquid outlet tank (24), the baffle (27) intermittently blocks the first through hole (241) and the second through hole (242), the first spray element (281) and the second spray element (282) are respectively set on both sides of the liquid outlet tank (24) and both have a spray nozzle at the bottom; The components are recycled by filtering the cleaning solution after cleaning the PCB board, recycling the filtered cleaning solution, and collecting the filtered contaminants.

2. The automated immersion washing equipment for PCB board manufacturing according to claim 1, characterized in that, The baffle (27) is an arc-shaped plate that blocks the inner circumference of the liquid outlet tank (24) within a 180-degree range.

3. The automated immersion washing equipment for PCB board manufacturing according to claim 1, characterized in that, A pusher (29) is provided at the outer end of the rotating shaft (23). The outer side of the pusher (29) is elliptical. Two sets of elastic cleaning components are provided on the side of the liquid outlet (24). The elastic cleaning components include a cleaning brush (34). When the pusher (29) pushes the elastic cleaning components, the cleaning brush (34) moves to wipe the liquid outlet.

4. The automated immersion washing equipment for PCB board manufacturing according to claim 1, characterized in that, The clamping mechanism includes a rotating frame (4) mounted on a rotating shaft (3), two connecting frames (5) mounted on the rotating frame (4) in pairs, a support (6) mounted on the connecting frame (5) with an outer protruding ring (1), a insertion platform (7) slidably mounted on the connecting frame (5) and having an outer protruding ring (2), a pull plate (8) mounted on the outer end of the insertion platform (7), and a spring (9) mounted between the connecting frame (5) and the outer protruding ring (2).

5. The automated immersion washing equipment for PCB board manufacturing according to claim 4, characterized in that, The support (6) has a groove, the end of the insertion platform (7) is inserted into the groove, a magnet (10) is provided in the groove, and a magnet (11) is provided at the end of the insertion platform (7) that is magnetically attracted to the magnet (10).

6. The automated immersion washing equipment for PCB board manufacturing according to claim 1, characterized in that, The clamping mechanism includes a clamping plate 1 (12) set on the rotating shaft 1 (3), multiple sets of positioning components 1 arrayed on the clamping plate 1 (12), a clamping plate 2 (14) distributed opposite to the clamping plate 1 (12), multiple sets of positioning components 2 arrayed on the clamping plate 2 (14), and two sets of spring-loaded components symmetrically distributed and pressing the positioning components 2 onto the positioning components 1.

7. The automated immersion washing equipment for PCB board manufacturing according to claim 1, characterized in that, The recycling assembly includes a recycling bin (35), a guide pipe (101) connected to the bottom of the cleaning bin (1), a connecting pipe (39) vertically arranged at the outer end of the guide pipe (101), and a filter element (41) and a waste bin (40) respectively connected to the top and bottom of the connecting pipe (39). The filter element (41) is located inside the recycling bin (35). A control valve (391) is provided at the bottom of the connecting pipe (39), and a discharge valve (401) is provided at the bottom of the waste bin (40).

8. The automated immersion washing equipment for PCB board manufacturing according to claim 7, characterized in that, A water pump (36) is installed on the recycling bin (35). A liquid extraction pipe (37) is connected between the input end of the water pump (36) and the lower part of the recycling bin (35). A return pipe (38) is connected between the output end of the water pump (36) and the liquid outlet (24).

9. An automated immersion washing device for PCB board manufacturing according to claim 7, characterized in that, A three-way pipe (380) is connected to the return pipe (38). A control valve (381) is installed on the return pipe (38) above the three-way pipe (380). A diversion pipe (42) is connected to the three-way pipe (380). A diversion valve (421) is installed on the diversion pipe (42). A spray hood (43) is connected to the outer end of the diversion pipe (42). The spray hood (43) surrounds the outer periphery of the filter element (41). The inner periphery of the spray hood (43) has spray holes.

10. An automated immersion washing device for PCB board manufacturing according to claim 9, characterized in that, The upper side of the recycling box (35) has a convex flow guide box. The bottom surface of the inner side of the flow guide box is inclined downward. The connecting pipe (39) passes through the bottom surface of the inner side of the flow guide box. The filter element (41) is located inside the flow guide box.

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