Dispensing, curing and demolding device and process for arrayed electrical elements
By setting up an elastic rectangular enclosure wall and a pneumatically assisted demolding device on the circuit board, the problems of uneven glue shells and demolding damage in the dispensing of electrical components in the circuit board array arrangement are solved, realizing uniform molding of the glue shells and low-stress demolding, thereby improving the reliability and yield of the packaging.
CN122395845APending Publication Date: 2026-07-14BENCHMARK ELECTRONICS SUZHOU
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BENCHMARK ELECTRONICS SUZHOU
- Filing Date
- 2026-04-23
- Publication Date
- 2026-07-14
Smart Images
Figure CN122395845A_ABST
Abstract
The application discloses a point-gluing solidification demolding device for array-arranged electric elements, and relates to the technical field of electric elements, in particular to a point-gluing solidification demolding device for array-arranged electric elements. The point-gluing solidification demolding device comprises a plane cover plate, a plurality of grooves are hollowed out on the plane cover plate, a plurality of point-gluing molds are fixedly clamped in the grooves along the length through a plurality of fixing devices, the central part of each point-gluing mold is provided with a rectangular and vertically-through glue pool groove, the arrangement of the plurality of point-gluing molds is adapted to and one-to-one corresponds to the arrangement of the plurality of electric elements on the circuit board, and when the plane cover plate horizontally aligns and covers the circuit board, each electric element on the circuit board is one-to-one correspondingly arranged in the corresponding glue pool groove, so that the point-gluing quality is obviously improved.
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