A production process for electronic components

Abstract

A manufacturing process for an electronic component assembly includes the following steps: S1, setting an insulating layer on a single substrate, and batch forming several independent circuit lines on the insulating layer to form a first semi-finished product; S2, soldering and fixing each electronic component to the circuit lines of the first semi-finished product using SMT (Surface Mount Technology) to form a second semi-finished product; S3, dividing the second semi-finished product to form several independent third semi-finished products, each having a substrate, circuit structure, and electronic components; S4, injection molding a base for each third semi-finished product to obtain the finished assembly. This allows for mass production of the assembly. Furthermore, the substrate serves as a support and reinforcing structure, facilitating easy feeding into an SMT placement machine for electronic component placement, thus improving production efficiency. The single injection molding of the base reduces the number of injection molding cycles, saving production costs.

Description

[0001] This application is a divisional application of application number 202510107935.8, filed on January 13, 2025, entitled "An assembly of an electronic component and its manufacturing process". Technical Field

[0002] This invention relates to the technical field of electronic components, and in particular to an electronic component assembly and its manufacturing process. Background Technology

[0003] The closed-loop voice coil motor base in the camera module of mobile terminal devices typically requires the installation of electronic components such as Hall elements, coils, and driver chips to achieve the corresponding closed-loop function. However, due to the continuous miniaturization of mobile terminal devices, the size of the corresponding voice coil motor base is also smaller. Current manufacturing processes for bases containing various electronic components are complex and inefficient.

[0004] Existing related technologies, such as the manufacturing process of a base with electronic components disclosed in Chinese Patent CN 109287074 A, involve molding metal circuits and completing the integral molding of the entire base through two injection molding processes and one SMT process, thus avoiding the need for additional assembly processes between electronic components and plastic parts. However, this process has the drawback of requiring multiple injection molding operations.

[0005] Furthermore, in this solution, since the metal circuit needs to be pre-molded and encapsulated, recesses need to be formed at the solder joints of the metal circuit after molding to facilitate subsequent soldering with electronic components. However, the presence of these recesses causes uneven solder filling during solder paste printing, affecting subsequent SMT processes and easily leading to cold solder joints or missing solder joints. Therefore, a soldering process needs to be added or modified to solve the above problems. However, this would prevent the use of SMT processes alone, resulting in low efficiency and high cost. In addition, soldering may cause solder spraying or splattering to other areas, leading to short circuits and other problems. Summary of the Invention

[0006] The purpose of this invention is to provide a manufacturing process for electronic components, which has the advantages of ensuring product yield, improving production efficiency, and reducing production costs.

[0007] To achieve the above objectives, the solution of the present invention is: A manufacturing process for an electronic component assembly includes the following steps: S1. An insulating layer is set on a whole substrate, and several independent circuit lines are formed in batches on the insulating layer to form the first semi-finished product; S2. Solder and fix each electronic component to the circuit lines of the first semi-finished product using SMT process to form the second semi-finished product; S3. Divide the second semi-finished product into several independent third semi-finished products with substrates, circuit structures and electronic components; S4. Inject molding bases into each of the third semi-finished products to obtain finished components.

[0008] Furthermore, in step S1, the insulating layer is fixed to the entire substrate by printing or pasting; the insulating layer is first fixed to the substrate and then the circuit lines are printed, or the circuit lines are printed first and then fixed to the substrate. In step S2, the first semi-finished product is fed into a screen printing machine to print solder paste onto each circuit line of the first semi-finished product, and then sent to a pick and place machine to place each electronic component. Finally, it is fixed by reflow soldering to obtain the second semi-finished product.

[0009] Furthermore, in step S1, after forming the circuit lines, a coil is also formed on the circuit lines to form a first semi-finished product with coils and circuit lines.

[0010] Furthermore, the electronic components in step S2 do not include coils; in step S4, after the third semi-finished product is injection molded into a base, the coil is then soldered onto the third semi-finished product to obtain the finished component.

[0011] Furthermore, in step S4, firstly, a long strip of material with several spaced reinforcing plates is provided, and each of the third semi-finished products obtained in step S3 is fixed to the reinforcing plates of the material strip to obtain an intermediate product with the third semi-finished products. Then, the intermediate product is sent to an injection molding machine to injection mold each of the third semi-finished products into a base. Finally, the injection-molded third semi-finished products, reinforcing plates, and bases are disconnected from the material strip to obtain the finished product of the component.

[0012] After adopting the above technical solution, the process of the present invention can mass-produce the component, and the substrate is set as a support and reinforcement structure, which can be easily fed into the SMT placement machine for electronic component placement, thereby improving production efficiency. The one-time injection molding base can reduce the number of injection moldings and save production costs.

[0013] The component is manufactured using a single injection molding process, reducing the number of injection cycles, lowering production costs, and increasing production efficiency. It integrates the substrate, circuit structure, and electronic components into a single unit, significantly reducing component thickness and size. Unlike existing technologies, it eliminates the need for multiple injection molding cycles or multi-layer stacking, meeting the demands of product miniaturization. Furthermore, the electronic components can be easily bonded to the circuitry on the substrate surface using SMT (Surface Mount Technology) processes, eliminating the possibility of recesses that could affect soldering and ensuring excellent soldering results and high product yield. These electronic components can be Hall effect sensors, coils, and / or driver chips. This component can also serve as a base for a closed-loop voice coil motor in a camera module, enabling closed-loop detection functionality. Attached Figure Description

[0014] Figure 1 This is a perspective view of the components of Embodiment 1 of the present invention; Figure 2 This is an exploded view of the components of Embodiment 1 of the present invention; Figure 3 This is a partial structural schematic diagram (I) of the component of Embodiment 1 of the present invention; Figure 4 This is a partial structural schematic diagram (II) of the component of Embodiment 1 of the present invention; Figure 5 This is a cross-sectional view of the component of Embodiment 1 of the present invention; Figure 6 for Figure 5 Enlarged view of point A; Figure 7 This is a flowchart of the production process of Embodiment 1 of the present invention; Figure 8 This is a flowchart of the production process of Embodiment 2 of the present invention; Figure 9 This is a flowchart illustrating step S4 of Embodiment 2 of the present invention.

[0015] Labeling Explanation: Component 10, Base 1, Substrate 2, Via 21, Conductive Post 22, Substrate Body 23, Pin Insert 24, Circuit Structure 3, Insulating Layer 31, Via 311, Conductive Material 312, Circuit Line 32, Circuit Structure Body 33, Insulating Layer Pin Part 34, Circuit Pin 35, Electronic Component 4, Coil 41, Driver Chip 42, Strip 6, Reinforcing Plate 61, Intermediate Product 7. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0017] Example 1 like Figures 1 to 6 As shown, the component 10 of an electronic component in this embodiment includes a base 1, a substrate 2, a circuit structure 3, and electronic components 4.

[0018] The circuit structure 3 includes an insulating layer 31 and circuit lines 32 formed on the insulating layer 31, and the circuit structure 3 is fixedly connected to the substrate 2. The insulating layer 31 is spaced between the substrate 2 and the circuit lines 32. The electronic component 4 is conductively connected to the circuit lines 32 and fixed to the substrate 2. The base 1, substrate 2, circuit structure 3, and electronic components 4 are integrally injection molded.

[0019] Therefore, the component 10 in this embodiment is manufactured using a single injection molding process, resulting in fewer injection cycles, lower production costs, and higher production efficiency. Furthermore, it integrates the substrate 2, circuit structure 3, and electronic components 4 into a single unit, significantly reducing the thickness and volume of the component 10 and meeting the requirements for product miniaturization. Simultaneously, the electronic components 4 can be easily bonded to the circuit lines 32 on the surface of the substrate 2 using a surface mount technology (SMT) process, resulting in good welding performance and high product yield. The electronic components 4 can be Hall effect elements, coils 41, and / or driver chips 42, and the component 10 can be used as a base for a closed-loop voice coil motor in a camera module, enabling closed-loop detection functionality.

[0020] Furthermore, the aforementioned component 10 can be manufactured using the following production process.

[0021] like Figure 7 The manufacturing process of an electronic component assembly according to this embodiment includes the following steps: S1. An insulating layer 31 is provided on a whole substrate 2, and several independent circuit lines 32 are formed in batches on the insulating layer 31 to form a first semi-finished product.

[0022] Specifically, the insulating layer 31 can be formed on the entire substrate 2 by printing or other means. The insulating layer 31 can be made of materials such as polyimide or polyester. Then, the circuit line 32 can be formed on the insulating layer 31 of the substrate 2 by printing or other means. The circuit line 32 can be made of liquid metal, conductive silver paste or copper foil.

[0023] Of course, the insulating layer 31 can also be formed by attaching an insulating film to the surface of a whole substrate 2. The insulating film can be a polyester film or a polyimide film, etc., and then the circuit lines 32 are printed. Alternatively, the circuit lines 32 can be printed on the insulating film first, and then the insulating film can be attached and fixed to the substrate 2.

[0024] S2. The electronic components 4 are soldered and fixed to the circuit lines 32 of the first semi-finished product using SMT process to form the second semi-finished product.

[0025] Specifically, since each circuit structure 3 on the first semi-finished product is fixed on a whole substrate 2, the second semi-finished product can be obtained by using the substrate 2 as a support and adopting SMT process. The first semi-finished product can be sent to the screen printing machine to print solder paste onto the pads of each circuit line 32 of the first semi-finished product, and then sent to the pick and place machine to place each electronic component. Finally, it is fixed by reflow soldering. In this way, each electronic component 4 is quickly soldered to the corresponding pad position of the circuit line 32 in batches to realize the corresponding circuit function, thereby obtaining the second semi-finished product.

[0026] S3. Divide the second semi-finished product into several independent third semi-finished products with substrate 2, circuit structure 3 and electronic components 4; dividing a whole substrate 2 into independent third semi-finished products facilitates mass production and meets the needs of product miniaturization.

[0027] S4. Injection mold the base 1 of each of the third semi-finished products to obtain the finished product of the component 10. This finished product can then be assembled with other structures of the camera module to form a complete camera module with closed-loop function.

[0028] In summary, the process of the present invention can be used to mass-produce the component 10, and the substrate 2 is set as a support and reinforcement structure for the circuit structure. It is convenient to use SMT process to mount and fix electronic components 4 during production, which can improve production efficiency. Moreover, one-time injection molding can reduce the number of injection moldings and save production costs.

[0029] In this embodiment, the substrate 2 can be a metal substrate 2, which has good support performance and is convenient for entering the SMT equipment for mounting and fixing during the production process. The substrate 2 included in the final product can reinforce the base 1, improve the support performance of the base 1, and increase the product's service life.

[0030] In this embodiment, as Figure 2 The Hall element and / or driving chip 42 can be soldered to the lower side of the circuit line 32 away from the substrate 2; while the coil 41 can be fixed to the side of the substrate 2 away from the circuit structure 3, see reference. Figure 6 The diagram is for illustrative purposes only. The substrate 2 may have vias 21, and the insulating layer 31 may have vias 311. The coil 41 is electrically connected to the circuit line 32 through the vias 21 and vias 311. In this way, different electronic components 4 can be arranged in appropriate positions as needed.

[0031] Specifically, the guide hole 311 can be filled with conductive material 312, and a conductive post 22 can be disposed inside the through hole 21. The conductive post 22 can be spaced apart from the hole wall of the through hole 21 to form insulation. The conductive material 312 and the conductive post 22 are connected as a whole, so as to realize the conductive connection between the coil 41 and the circuit line 32 by means of the conductive post 22 and the conductive material 312. Of course, the coil 41 can also be connected to the circuit line 32 by other conventional means in the art, and is not limited thereto.

[0032] In another embodiment (not shown), there can be two circuit structures 3, respectively disposed on the upper and lower sides of the substrate 2, and electronic components 4 can be connected to each circuit structure 3. The substrate 2 can also have vias 21, and the insulating layers 31 of both circuit structures 3 can each have vias 311, with the two circuit structures 3 electrically connected through the vias 311 and the conductive posts 22 within the vias 21. This can satisfy the design requirements of multiple circuit lines 32.

[0033] For example Figure 3 and Figure 4 The substrate 2 may include a substrate body 23 and pin insertion plates 24 bent from both sides of the substrate body 23; the circuit structure 3 has a circuit structure body 33 and an insulating layer pin portion 34 and a circuit pin 35 bent and attached to the pin insertion plate 24; the base 1 encloses the substrate body 23 and the circuit structure body 33, while the pin insertion plate 24, the insulating layer pin portion 34 and the circuit pin 35 extend out of the lower side of the base 1.

[0034] By setting the pin insertion plate 24, the injection-molded base 1 can easily have an extended pin structure, which facilitates assembly and cooperation with other accessories of the camera module.

[0035] In this embodiment, SMT process is used to mount and fix electronic component 4. Of course, laser welding can also be used.

[0036] Example 2 The structure of this embodiment is basically the same as that of the above embodiments, the main difference being in the production process.

[0037] like Figure 8 and Figure 9 As shown, the manufacturing process of an electronic component assembly according to this embodiment includes the following steps: S1. An insulating layer is provided on a whole substrate 2, and several independent circuit lines 32 are formed in batches on the insulating layer. At the same time, one or more corresponding coils 41 are formed after each circuit line 32 is formed, so as to form a first semi-finished product with coils 41 and circuit lines.

[0038] Specifically, the coil can be formed on the insulating layer using an ion implantation semi-additive coating method and electrically connected to the circuit line 32.

[0039] S2. The electronic components 4 are soldered and fixed to the circuit lines 32 of the first semi-finished product using SMT process to form the second semi-finished product.

[0040] Specifically, the electronic component 4 in this step may include Hall effect sensors and a driver chip, while the coil 41 may be formed in step S1, which can make production more convenient and improve production efficiency.

[0041] S3. Divide the second semi-finished product into several independent third semi-finished products 5, each having a substrate 2, circuit structure 3, and electronic components 4. Dividing a single substrate 2 into individual third semi-finished products 5 facilitates mass production and meets the requirements for product miniaturization.

[0042] S4. First, a strip 6 with several spaced reinforcing plates 61 can be provided. The third semi-finished products 5 obtained in step S3 are fixed one by one onto the reinforcing plates 61 of the strip 6 to obtain an intermediate product 7 with the third semi-finished products. Then, the intermediate product 7 is sent into an injection molding machine to injection mold the base of each third semi-finished product. Finally, the injection-molded third semi-finished products, reinforcing plates and bases are disconnected from the strip to obtain the finished product of the component.

[0043] In this embodiment, compared to Embodiment 1, the third semi-finished product 5 is further combined with the strip 6 to form the intermediate product 7. This allows each of the third semi-finished products 5 to enter the injection molding machine more conveniently and quickly with the assistance of the long strip 6. Simultaneously, the intermediate product 7 can be individually wound up and then sent to downstream manufacturers for injection molding, reducing production costs. Furthermore, the reinforcing plate can be included within the injection-molded base, resulting in better product structural strength.

[0044] In step S4, the strip 6 is formed by stamping or etching the metal strip. The strip 6 also forms two connecting strips 62. Each reinforcing plate 61 is connected between the two connecting strips 62 by several connecting pieces 63 on both sides. Subsequently, each connecting piece 63 can be easily broken from the connecting strip 62 to separate the third semi-finished product 5, the reinforcing plate 61 and the base from the strip 6 after injection molding.

[0045] The above description is merely a preferred embodiment of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, equivalent changes and modifications without departing from the principle of the present invention should still fall within the scope of protection of the present invention.

[0046] In the description of the embodiments of this application, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in when in use, or the orientation or positional relationship that is commonly understood by those skilled in the art. It is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0047] Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" and "several" mean two or more, unless otherwise explicitly specified.

Claims

1. A manufacturing process for an electronic component assembly, characterized in that: Includes the following steps: S1. An insulating layer is set on a whole substrate, and several independent circuit lines are formed on the insulating layer in batches to form the first semi-finished product; S2. Solder and fix each electronic component to the circuit lines of the first semi-finished product using SMT process to form the second semi-finished product; S3. Divide the second semi-finished product into several independent third semi-finished products with substrates, circuit structures and electronic components; S4. Inject molding bases into each of the third semi-finished products to obtain finished components.

2. The manufacturing process of an electronic component assembly according to claim 1, characterized in that: In step S1, the insulating layer is fixed to the entire substrate by printing or pasting; the insulating layer is first fixed to the substrate and then the circuit lines are printed, or the circuit lines are first printed and then fixed to the substrate. In step S2, the first semi-finished product is fed into a screen printing machine to print solder paste onto the pads of each circuit line of the first semi-finished product, and then sent to a pick-and-place machine to place each electronic component. Finally, it is fixed by reflow soldering to obtain the second semi-finished product.

3. The manufacturing process of an electronic component assembly according to claim 1, characterized in that: In step S1, after forming the circuit lines, a coil is also formed on the circuit lines to form a first semi-finished product with coils and circuit lines.

4. The manufacturing process of an electronic component assembly according to claim 1, characterized in that: The electronic components in step S2 do not include coils; in step S4, after the third semi-finished product is injection molded into a base, the coil is then soldered onto the third semi-finished product to obtain the finished component.

5. The manufacturing process of an electronic component assembly according to claim 1, characterized in that: In step S4, firstly, a long strip of material with several spaced reinforcing plates is provided, and each of the third semi-finished products obtained in step S3 is fixed to the reinforcing plates of the material strip to obtain an intermediate product with the third semi-finished products. Then, the intermediate product is sent to an injection molding machine to injection mold the base of each third semi-finished product. Finally, the injection-molded third semi-finished products, reinforcing plates and bases are disconnected from the material strip to obtain the finished product of the component.

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