A multi-layer laminating and matching machine for printed circuit board and a laminating method thereof
By coordinating the conveying and stacking execution mechanisms of the multilayer printed circuit board stacking machine, the problem of incorrect stacking order of multilayer printed circuit boards was solved, achieving an efficient and accurate stacking process, and improving production efficiency and product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN CITY KUNPENG EARL MASCH EQUIP CO LTD
- Filing Date
- 2026-05-08
- Publication Date
- 2026-07-14
AI Technical Summary
In the existing technology, the stacking order of multilayer printed circuit boards is prone to errors, which leads to extended production cycles and low efficiency. Manual stacking operations are also prone to producing scrap.
The printed circuit board multilayer stacking machine includes a frame, a conveying mechanism, a stacking execution mechanism, and a control system. By establishing a unique binding relationship between the layer information of the circuit boards to be stacked and the conveying station, and by utilizing the coordinated cooperation between the stacking execution mechanism and the conveying components, continuous stacking of each layer is achieved, and the stacking order is verified by a detection mechanism.
It reduces the risk of disordered stacking order, improves stacking efficiency, shortens production cycle, and increases the product yield of multilayer printed circuit boards.
Smart Images

Figure CN122395860A_ABST