A method for manufacturing a stepped groove and a PCB
By combining the graphic transfer component and the insulating adhesive layer, the manufacturing process of the stepped groove is simplified, solving the problems of complex and difficult processes in the existing technology, achieving higher product yield and finer circuit production, and making it suitable for high-end products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN SHENGYI ELECTRONICS
- Filing Date
- 2026-05-26
- Publication Date
- 2026-07-14
AI Technical Summary
The manufacturing process of stepped grooves in the existing technology is complex and difficult, especially due to the long process flow, high precision requirements and easy damage to the groove bottom pattern caused by making the groove bottom pattern first.
The pattern transfer component includes a carrier board, a conductive layer, and conductive bumps. The pattern area is automatically protected by selective filling of the insulating adhesive layer. The concave part of the conductive bump is filled and the exposed bump is protected by a lamination process. The bottom circuit pattern is then revealed by etching and adhesive removal steps.
It simplifies the process flow, reduces the process difficulty, improves product yield, is suitable for high-density fine lines, has good process compatibility, and is easy to promote and apply on existing production lines.
Smart Images
Figure CN122395861A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of PCBs, and more particularly to a method for manufacturing a stepped groove and a PCB thereof. Background Technology
[0002] There are many different manufacturing processes for printed circuit boards, but for stepped grooves with non-metallic sidewalls, the conventional manufacturing method is to first create the groove bottom pattern on the core board and daughter board located at the bottom of the groove, and then create the stepped groove.
[0003] The manufacturing method has the following drawbacks: Since the bottom pattern of the groove is made first, it needs to be protected before the stepped groove is made. This makes the whole process long and complicated, with many quality problems. It also requires high precision in each process, making it difficult to manufacture and restricting the widespread application of stepped groove pattern boards.
[0004] Therefore, improvements to existing technologies are necessary.
[0005] The above information is provided as background information only to aid in understanding this application and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this application. Summary of the Invention
[0006] This application provides a method for manufacturing a stepped groove and a PCB to solve the problems of complex and difficult manufacturing processes in the prior art.
[0007] To achieve the above objectives, this application provides the following technical solution:
[0008] In a first aspect, embodiments of this application provide a method for manufacturing a stepped groove, comprising:
[0009] A graphics transfer assembly is provided, the graphics transfer assembly including a carrier plate, a conductive layer formed on the surface of the carrier plate, and conductive bumps protruding from the surface of the conductive layer;
[0010] The three-dimensional contour of the conductive bump corresponds to the stepped groove cavity to be formed; the surface of the conductive bump is made of a graphic structure formed by alternating convex and concave parts, wherein the convex parts correspond to the non-circuit graphic area of the bottom of the stepped groove to be formed, and the concave parts correspond to the circuit graphic area of the bottom of the stepped groove to be formed.
[0011] An insulating adhesive layer is provided for opening a window, and the graphic transfer component, the insulating adhesive layer, and other core boards are sequentially stacked, such that the protrusions of the graphic structure are accommodated in the opening and the recesses are filled with the insulating adhesive layer.
[0012] First, remove the carrier board, then remove the conductive bumps and the bottom copper of the groove covered by the bumps, so as to expose the insulating adhesive layer filling the recess; then remove the exposed insulating adhesive layer filling the recess so as to expose the bottom copper of the groove covered by it, thereby obtaining the stepped groove with a circuit pattern at the bottom.
[0013] Optionally, the method for preparing the graphics transfer component includes:
[0014] A conductive layer, a PP frame, and a carrier plate are provided, wherein the length and width dimensions of the carrier plate are not less than the length and width dimensions of the other core plates;
[0015] The conductive layer, the PP frame, and the carrier plate are stacked sequentially so that the periphery of the copper foil is bonded to the periphery of the carrier plate through the PP frame.
[0016] Electroplating is performed on the region of the conductive layer corresponding to the stepped groove cavity to form the conductive bump;
[0017] The patterned structure is fabricated on the surface of the conductive bump.
[0018] Optionally, fabricating the patterned structure on the surface of the conductive bump includes:
[0019] On the surface of the conductive bump, the corresponding area of the recess is etched to form the patterned structure; or,
[0020] On the surface of the conductive bump, electroplating is performed on the corresponding area of the bump to form the patterned structure.
[0021] Optionally, the method for removing the carrier plate includes:
[0022] For the laminated plate obtained by sequentially stacking the graphic transfer component, the insulating adhesive layer, and other core boards, the edge area of the laminated plate is mechanically milled off, the edge area being the area covered by the PP frame, so as to separate the carrier board from the copper foil;
[0023] Remove the carrier plate.
[0024] Optionally, the conductive layer may also be a copper foil.
[0025] Secondly, embodiments of this application provide a method for manufacturing a stepped groove, comprising:
[0026] A graphics transfer assembly is provided, the graphics transfer assembly including a carrier plate, a conductive layer formed on the surface of the carrier plate, and conductive bumps protruding from the surface of the conductive layer;
[0027] The three-dimensional contour of the conductive bump corresponds to the stepped groove cavity to be formed; the surface of the conductive bump is made of a graphic structure formed by alternating convex and concave parts, wherein the convex parts correspond to the circuit graphic area of the bottom of the stepped groove to be formed, and the concave parts correspond to the non-circuit graphic area of the bottom of the stepped groove to be formed.
[0028] An insulating adhesive layer is provided for opening a window, and the graphic transfer component, the insulating adhesive layer, and other core boards are sequentially stacked, such that the protrusions of the graphic structure are accommodated in the opening and the recesses are filled with the insulating adhesive layer.
[0029] First, remove the carrier plate, then remove the conductive bumps, so that the insulating adhesive layer filling the recess and the bottom copper of the groove corresponding to the bump are exposed;
[0030] Then, after electroplating the exposed bottom copper of the tank, the exposed insulating adhesive layer filling the recess is removed to obtain the stepped tank with a circuit pattern on the bottom.
[0031] Optionally, the method for preparing the graphics transfer component includes:
[0032] A conductive layer, a PP frame, and a carrier plate are provided, wherein the length and width dimensions of the carrier plate are not less than the length and width dimensions of the other core plates;
[0033] The conductive layer, the PP frame, and the carrier plate are stacked sequentially so that the periphery of the copper foil is bonded to the periphery of the carrier plate through the PP frame.
[0034] Electroplating is performed on the region of the conductive layer corresponding to the stepped groove cavity to form the conductive bump;
[0035] The patterned structure is fabricated on the surface of the conductive bump.
[0036] Optionally, fabricating the patterned structure on the surface of the conductive bump includes:
[0037] On the surface of the conductive bump, the corresponding area of the recess is etched to form the patterned structure; or,
[0038] On the surface of the conductive bump, electroplating is performed on the corresponding area of the bump to form the patterned structure.
[0039] Optionally, the method for removing the carrier plate includes:
[0040] For the laminated plate obtained by sequentially stacking the graphic transfer component, the insulating adhesive layer, and other core boards, the edge area of the laminated plate is mechanically milled off, the edge area being the area covered by the PP frame, so as to separate the carrier board from the copper foil;
[0041] Remove the carrier plate.
[0042] Thirdly, embodiments of this application provide a PCB having a stepped groove, characterized in that the stepped groove is manufactured using any of the above-described methods for manufacturing stepped grooves.
[0043] Compared with the traditional method of "first creating the bottom pattern of the groove, and then creating the stepped groove", this application has the following advantages:
[0044] The process is simplified: traditional methods require an additional protection step after the bottom pattern is made, while this embodiment uses the selective filling of the insulating adhesive layer during the pressing process to achieve automatic protection of the pattern area, without the need to add a separate protection step.
[0045] The process difficulty has been reduced: the coating, curing and removal of the protective layer in traditional methods all require precise control and are prone to damaging the pattern; in this embodiment, the protective layer and the insulating adhesive layer are made of the same material and can be removed uniformly by chemical dissolution or laser ablation, which reduces the requirements for process precision.
[0046] Improved product yield: Traditional protection methods are prone to producing bubbles, wrinkles, or incomplete protection; in this embodiment, the insulating adhesive layer flows when heated, exhibiting good filling properties and uniformity, resulting in more reliable protection and reducing the risk of pattern damage.
[0047] Suitable for high-density, fine-grained circuits: In traditional methods, the groove bottom pattern is easily damaged during subsequent processing; in this embodiment, the groove bottom pattern is doubly protected by conductive bumps and insulating adhesive layer throughout the entire pressing process, and is not affected by the pressing process, enabling finer line widths and spacings, suitable for high-end product manufacturing.
[0048] It has good process compatibility: The processes and materials used in this embodiment are all mature technologies and common materials in the PCB field, which do not require the introduction of special equipment and are easy to promote and apply on existing production lines.
[0049] This application has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and following detailed description, which together serve to explain the particular principles of this application. Attached Figure Description
[0050] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0051] Figure 1 This is a flowchart of the manufacturing method of the stepped groove provided in Embodiment 1 of this application;
[0052] Figure 2 This is a schematic diagram of the manufacturing process of the stepped groove provided in Embodiment 1 of this application;
[0053] Figure 3 This is a flowchart of the manufacturing method of the stepped groove provided in Embodiment 2 of this application;
[0054] Figure 4 This is a schematic diagram of the manufacturing process of the stepped groove provided in Embodiment 2 of this application.
[0055] Figure label:
[0056] 1. Carrier board, 2. Conductive layer, 3. Conductive bumps, 3. Patterned structure, 3. Insulating adhesive layer, 4. Other core boards, 5. Base copper, 5. PP frame, 6. Dry film. Detailed Implementation
[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0058] Example 1
[0059] Please refer to Figure 1 and Figure 2 This application provides a method for manufacturing a stepped groove, including:
[0060] S11. A pattern transfer component is provided, comprising a carrier plate, a conductive layer formed on the surface of the carrier plate, and conductive bumps protruding from the surface of the conductive layer. The three-dimensional contour of the conductive bumps corresponds to the stepped groove cavity to be formed; the surface of the conductive bumps is fabricated with a patterned structure formed by alternating protrusions and concave portions, the protrusions corresponding to the non-circuit pattern area of the bottom of the stepped groove to be formed, and the concave portions corresponding to the circuit pattern area of the bottom of the stepped groove to be formed.
[0061] It should be noted that the carrier board refers to the support plate used to temporarily support the conductive layer and conductive bumps, and it will be removed after lamination. There are no restrictions on the specific material of the carrier board; it can be a metal plate or a copper-clad laminate.
[0062] A conductive layer is a conductive metal layer formed on the surface of a substrate, typically made of copper foil. The conductive layer serves two purposes: firstly, it acts as a seed layer for electroplating conductive bumps; secondly, after the conductive bumps are removed, it can be used to create the surface pattern of the motherboard.
[0063] A patterned structure refers to an alternating bump and recessed structure formed on the surface of a conductive bump, consisting of alternating bumps and recesses. The bumps correspond to the non-circuit pattern areas (areas where copper is not needed) at the bottom of the stepped groove to be formed, while the recesses correspond to the circuit pattern areas (areas where copper is needed) at the bottom of the stepped groove to be formed. This correspondence determines the final shape of the subsequent groove bottom circuit pattern.
[0064] S12. Provide an insulating adhesive layer for opening windows, and sequentially stack the graphic transfer component, the insulating adhesive layer, and other core boards so that the protrusions of the graphic structure are accommodated within the opening windows and the recesses are filled with the insulating adhesive layer.
[0065] In this step, the windowed insulating adhesive layer refers to a prepreg or other insulating adhesive material that has undergone windowing treatment. The position and size of the window correspond to the raised area of the conductive bump. During lamination, the bump is accommodated within the window of the insulating adhesive layer, thus remaining exposed to contact the conductive layer on other core board surfaces, while the recess is filled by the insulating adhesive layer.
[0066] Other core boards refer to multiple core boards that need to be pressed together, excluding the pattern transfer assembly. They are bonded together with the pattern transfer assembly through an insulating adhesive layer to form the mother board.
[0067] The copper layer on the surface of other core boards corresponding to the stepped groove region can be referred to as the groove bottom copper. After the pattern transfer assembly, insulating adhesive layer, and other core boards are sequentially stacked, this groove bottom copper is covered by the protrusions of the conductive bumps of the pattern transfer assembly or by the insulating adhesive layer filling the recesses.
[0068] S13. First remove the carrier board, then remove the conductive bumps and the bottom copper of the groove covered by the bumps, so as to expose the insulating adhesive layer filling the recess; then remove the exposed insulating adhesive layer filling the recess so as to expose the bottom copper of the groove covered by it, and obtain a stepped groove with a circuit pattern at the bottom of the groove.
[0069] In summary, the core of the method for manufacturing the stepped groove provided in this application is as follows: the "negative image" of the groove bottom circuit pattern is pre-fabricated on the sacrificial conductive bump using a pattern transfer component; then, the concave part of the conductive bump is filled and protected by an insulating adhesive layer using a lamination process, while the protrusion remains exposed; then, the carrier board is removed in sequence, and the entire conductive bump and the bottom copper of the groove bottom covered by the protrusion are etched away, exposing the insulating adhesive layer filling the concave part; finally, the insulating adhesive layer is removed, exposing the bottom copper of the groove bottom covered by it, thus obtaining the groove bottom circuit pattern.
[0070] In short, the essence of the embodiments of this application is a process concept of "reverse construction and forward removal": first, a structure opposite to the final pattern is constructed on a temporary carrier, and after pressing and transfer, the structure is "washed away" through etching and resist removal steps, finally exposing the required circuit pattern.
[0071] Compared with the traditional method of "first creating the bottom pattern of the groove, and then creating the stepped groove", this embodiment has the following technical advantages:
[0072] First, the process is simplified. Traditional methods require protecting the completed groove bottom pattern after its fabrication, such as by covering it with a temporary protective film or applying a peelable adhesive, during the subsequent fabrication of the stepped groove. These protective steps themselves require additional procedures. This embodiment, however, pre-fabricates a concave-convex structure opposite to the target pattern on the pattern transfer component. The selective filling of the insulating adhesive layer during the lamination process achieves automatic protection of the pattern area, eliminating the need for a separate protection step and making the process much simpler.
[0073] Secondly, it reduces the complexity of the process. In traditional methods, the protective layer for the bottom pattern of the groove needs to be removed after the stepped groove is fabricated. The coating, curing, and removal of the protective layer all require precise control; slight carelessness can damage the bottom pattern or leave residue. In this embodiment, the protection of the recess (i.e., the circuit pattern area) is achieved through the natural filling of the insulating adhesive layer during lamination. The protective layer and the insulating adhesive layer are made of the same material and can be uniformly removed in subsequent steps by chemical dissolution or laser ablation, eliminating the need for additional protective layer coating and peeling processes, thus requiring lower process precision.
[0074] Third, it improves product yield. Traditional methods often result in air bubbles, wrinkles, or incomplete protection when protecting the bottom pattern, leading to contamination or damage in subsequent processes. In this embodiment, the protrusions are housed within the openings and remain exposed, while the recesses are filled and protected by an insulating adhesive layer. This insulating adhesive layer flows under heat during the pressing process, exhibiting excellent filling properties and uniformity, ensuring complete coverage of the recesses. This provides more reliable protection, reducing the risk of pattern damage and improving product yield.
[0075] Fourth, it is suitable for high-density, fine-grained circuits. In traditional methods, the trench bottom pattern is fabricated first, followed by the stepped trench processing. During subsequent processing, the trench bottom pattern may suffer linewidth loss or pattern deformation due to mechanical forces or chemical erosion, limiting the processing capability of fine-grained circuits. In this embodiment, the trench bottom pattern is not pre-fabricated but is "revealed" through etching and adhesive removal steps after the main structure of the stepped trench is completed. The trench bottom pattern is doubly protected by conductive bumps and an insulating adhesive layer throughout the lamination process, and is unaffected by the lamination process. Therefore, it can achieve finer linewidths and spacings, making it suitable for the fabrication of high-end products such as high-density interconnect boards.
[0076] Fifth, it has good process compatibility. The process flow used in this embodiment includes electroplating, etching, lamination, laser ablation, etc., all of which are mature processes in the field of printed circuit board manufacturing. The materials used (copper foil, prepreg, etching solution, etc.) are all common materials in the industry, and there is no need to introduce special equipment or expensive materials, which makes it easy to promote and apply on existing production lines.
[0077] In one alternative implementation, such as Figure 2 As shown, the method for preparing the graphics transfer component includes:
[0078] Provides a conductive layer, PP frame and carrier board, the length and width dimensions of the carrier board are not less than the length and width dimensions of other core boards;
[0079] The conductive layer, PP frame, and carrier plate are stacked in sequence so that the periphery of the conductive layer is bonded to the periphery of the carrier plate through the PP frame.
[0080] Electroplating is performed on the region of the conductive layer corresponding to the stepped groove cavity to form conductive bumps;
[0081] Create a patterned structure on the surface of the conductive bump.
[0082] In this embodiment, the periphery of the conductive layer is bonded to the surface of the carrier plate using a PP frame, so that the central area of the conductive layer remains separated from the carrier plate, thereby forming a graphic transfer component with a free central functional area and a fixed periphery.
[0083] This structure offers several advantages: First, it facilitates the subsequent separation of the carrier plate and the conductive layer. Since the conductive layer is only bonded around the periphery, removing the carrier plate only requires breaking the periphery, eliminating the need to overcome the overall adhesive force. This makes the separation process easier and less likely to damage the conductive layer. Second, it simplifies the manufacturing process. The conductive layer does not need to be pressed onto the entire surface; only periphery bonding is required for fixation, resulting in higher manufacturing efficiency and lower costs. Third, it avoids contamination of the central functional area by the adhesive material. The PP frame is located only around the periphery and does not come into contact with the central area used to create the conductive bumps, ensuring a clean electroplated surface and improving the bonding quality between the conductive bumps and the conductive layer.
[0084] Based on the above-mentioned patterned structure, the method for removing the carrier board includes: mechanically milling off the edge area of the laminated board, which is the area covered by the PP frame, to separate the carrier board from the copper foil, for the laminated board obtained by sequentially stacking the pattern transfer assembly, the insulating adhesive layer and other core boards, so as to separate the carrier board from the copper foil; and removing the carrier board.
[0085] This mechanical milling method not only has high separation efficiency, but also allows for quick and precise removal of the edge bonding area, making it suitable for mass production. Furthermore, it has minimal impact on the internal structure, as the milling area is limited to the edge where the PP frame is located, without damaging the conductive bumps, patterned structures, or other core boards that have already been pressed and fixed in the central area.
[0086] Furthermore, a method for fabricating a patterned structure on the surface of a conductive bump includes:
[0087] A subtraction method is used to etch corresponding areas of the recesses on the surface of the conductive bumps to form a patterned structure; or...
[0088] By employing a layering method, electroplating is performed on the surface of the conductive bumps in the corresponding areas of the bumps to form a patterned structure.
[0089] This embodiment provides two optional process paths for the patterned structure: subtraction method (etching the area corresponding to the recess) and addition method (electroplated the area corresponding to the protrusion). In practical applications, the most suitable manufacturing method can be selected based on existing equipment conditions, production capacity requirements, and pattern accuracy requirements.
[0090] Example 2
[0091] Please see Figure 3 and Figure 4 Embodiment 2 of this application provides another method for manufacturing a stepped groove, including:
[0092] S21. Provide a graphics transfer component, the graphics transfer component including a carrier plate, a conductive layer formed on the surface of the carrier plate, and conductive bumps protruding from the surface of the conductive layer.
[0093] The three-dimensional contour of the conductive bump corresponds to the stepped groove cavity to be formed; the surface of the conductive bump is made with a graphic structure formed by alternating convex and concave parts, the convex parts correspond to the circuit graphic area of the bottom of the stepped groove to be formed, and the concave parts correspond to the non-circuit graphic area of the bottom of the stepped groove to be formed.
[0094] S22. Provide an insulating adhesive layer for opening windows, and sequentially stack the graphic transfer component, the insulating adhesive layer, and other core boards so that the protrusions of the graphic structure are accommodated within the opening windows and the recesses are filled with the insulating adhesive layer.
[0095] S23. First remove the carrier board, then remove the conductive bumps to expose the insulating adhesive layer filling the recess and the bottom copper of the corresponding groove.
[0096] S24. Then, the exposed bottom copper of the tank is electroplated, and then the exposed insulating adhesive layer filling the recess is removed to obtain a stepped tank with a circuit pattern on the bottom.
[0097] It is understood that the core of Embodiment 2 of this application is: the "positive image" of the bottom circuit pattern of the trench is pre-made on the sacrificial conductive bump by the pattern transfer component, and after pressing, the carrier board and the conductive bump are removed in sequence to expose the bottom copper of the trench corresponding to the bump. Then, the exposed bottom copper is electroplated to thicken it, and finally the insulating adhesive layer filled in the recess is removed to obtain the bottom circuit pattern of the trench.
[0098] Compared to Example 1, the core difference lies in the different correspondence between the patterned structure and the bottom circuit pattern, and the resulting difference in subsequent process paths. In Example 1, the protrusions correspond to non-circuit pattern areas, and the concave areas correspond to circuit pattern areas. That is, the patterned structure and the target pattern have a "negative image" relationship, and the bottom circuit pattern originates from the bottom copper covered by the concave areas, requiring no electroplating for thickening. In Example 2, the protrusions correspond to circuit pattern areas, and the concave areas correspond to non-circuit pattern areas. That is, the patterned structure and the target pattern have a "positive image" relationship, and the bottom circuit pattern originates from the bottom copper covered by the protrusions. Electroplating is required after the protrusions are exposed to obtain the desired circuit thickness.
[0099] Compared with the prior art, Embodiment 2 of this application also has the advantages of simplifying the process flow, reducing the process difficulty, improving the product yield, and having good process compatibility.
[0100] It should be noted that in this second embodiment, the preparation method of the graphic transfer component and the removal method of the carrier plate can be the same as in the first embodiment, and will not be repeated here.
[0101] Example 3
[0102] Embodiment 3 of this application provides a PCB having a stepped groove, which is manufactured using the stepped groove manufacturing method described in any of the above embodiments.
[0103] Based on Embodiments 1 and 2, features not explained in this embodiment can be explained using the methods in Embodiments 1 or 2, and will have corresponding technical effects, which will not be repeated here.
[0104] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.
Claims
1. A method for manufacturing a stepped groove, characterized in that, include: A graphics transfer assembly is provided, the graphics transfer assembly including a carrier plate, a conductive layer formed on the surface of the carrier plate, and conductive bumps protruding from the surface of the conductive layer; The three-dimensional contour of the conductive bump corresponds to the stepped groove cavity to be formed; the surface of the conductive bump is made of a graphic structure formed by alternating convex and concave parts, wherein the convex parts correspond to the non-circuit graphic area of the bottom of the stepped groove to be formed, and the concave parts correspond to the circuit graphic area of the bottom of the stepped groove to be formed. An insulating adhesive layer is provided for opening a window, and the graphic transfer component, the insulating adhesive layer, and other core boards are sequentially stacked, such that the protrusions of the graphic structure are accommodated in the opening and the recesses are filled with the insulating adhesive layer. First, remove the carrier board, then remove the conductive bumps and the bottom copper of the groove covered by the bumps, so as to expose the insulating adhesive layer filling the recess; then remove the exposed insulating adhesive layer filling the recess so as to expose the bottom copper of the groove covered by it, thereby obtaining the stepped groove with a circuit pattern at the bottom.
2. The method for manufacturing the stepped groove according to claim 1, characterized in that, The method for preparing the graphics transfer component includes: A conductive layer, a PP frame, and a carrier plate are provided, wherein the length and width dimensions of the carrier plate are not less than the length and width dimensions of the other core plates; The conductive layer, the PP frame, and the carrier plate are stacked sequentially so that the periphery of the copper foil is bonded to the periphery of the carrier plate through the PP frame. Electroplating is performed on the region of the conductive layer corresponding to the stepped groove cavity to form the conductive bump; The patterned structure is fabricated on the surface of the conductive bump.
3. The method for manufacturing the stepped groove according to claim 2, characterized in that, The process of creating the patterned structure on the surface of the conductive bump includes: On the surface of the conductive bump, the corresponding area of the recess is etched to form the patterned structure; or, On the surface of the conductive bump, electroplating is performed on the corresponding area of the bump to form the patterned structure.
4. The method for manufacturing a stepped groove according to claim 2, characterized in that, The method for removing the carrier plate includes: For the laminated plate obtained by sequentially stacking the graphic transfer component, the insulating adhesive layer, and other core boards, the edge area of the laminated plate is mechanically milled off, the edge area being the area covered by the PP frame, so as to separate the carrier board from the copper foil; Remove the carrier plate.
5. The method for manufacturing a stepped groove according to claim 2, characterized in that, Also includes: The conductive layer is copper foil.
6. A method for manufacturing a stepped groove, characterized in that, include: A graphics transfer assembly is provided, the graphics transfer assembly including a carrier plate, a conductive layer formed on the surface of the carrier plate, and conductive bumps protruding from the surface of the conductive layer; The three-dimensional contour of the conductive bump corresponds to the stepped groove cavity to be formed; the surface of the conductive bump is made of a graphic structure formed by alternating convex and concave parts, wherein the convex parts correspond to the circuit graphic area of the bottom of the stepped groove to be formed, and the concave parts correspond to the non-circuit graphic area of the bottom of the stepped groove to be formed. An insulating adhesive layer is provided for opening a window, and the graphic transfer component, the insulating adhesive layer, and other core boards are sequentially stacked, such that the protrusions of the graphic structure are accommodated in the opening and the recesses are filled with the insulating adhesive layer. First, remove the carrier plate, then remove the conductive bumps, so that the insulating adhesive layer filling the recess and the bottom copper of the groove corresponding to the bump are exposed; Then, after electroplating the exposed bottom copper of the tank, the exposed insulating adhesive layer filling the recess is removed to obtain the stepped tank with a circuit pattern on the bottom.
7. The method for manufacturing a stepped groove according to claim 6, characterized in that, The method for preparing the graphics transfer component includes: A conductive layer, a PP frame, and a carrier plate are provided, wherein the length and width dimensions of the carrier plate are not less than the length and width dimensions of the other core plates; The conductive layer, the PP frame, and the carrier plate are stacked sequentially so that the periphery of the copper foil is bonded to the periphery of the carrier plate through the PP frame. Electroplating is performed on the region of the conductive layer corresponding to the stepped groove cavity to form the conductive bump; The patterned structure is fabricated on the surface of the conductive bump.
8. The method for manufacturing a stepped groove according to claim 7, characterized in that, The process of creating the patterned structure on the surface of the conductive bump includes: On the surface of the conductive bump, the corresponding area of the recess is etched to form the patterned structure; or, On the surface of the conductive bump, electroplating is performed on the corresponding area of the bump to form the patterned structure.
9. The method for manufacturing a stepped groove according to claim 6, characterized in that, The method for removing the carrier plate includes: For the laminated plate obtained by sequentially stacking the graphic transfer component, the insulating adhesive layer, and other core boards, the edge area of the laminated plate is mechanically milled off, the edge area being the area covered by the PP frame, so as to separate the carrier board from the copper foil; Remove the carrier plate.
10. A PCB having stepped grooves, characterized in that, The stepped groove is manufactured using the method described in any one of claims 1 to 9.