Field bus diagnostic module shell structure resistant to high temperature and high humidity environment

Abstract

The application provides a field bus diagnostic module shell structure resistant to high-temperature and high-humidity environments, which comprises a shell, a plurality of heat dissipation fins are integrally formed on the outer surface of the bottom plate of the shell, and a gradient heat dissipation assembly is arranged on the inner surface of the bottom plate of the shell. The shell structure can be stably operated for a long time under the conditions of-40 DEG C to +85 DEG C and high humidity and high corrosion, the core temperature of the module is reduced by more than 15 DEG C, the MTBF is increased by more than 50%, and the shell structure is suitable for severe industrial sites such as thermal power plants and chemical plants.

Description

Technical Field

[0001] This invention belongs to the field of protection technology for industrial automation fieldbus devices, and in particular relates to a housing structure for a fieldbus diagnostic module suitable for high-temperature, high-humidity, and highly corrosive industrial environments. Background Technology

[0002] Fieldbus technology, as a core communication technology in the field of industrial automation, has been widely used in distributed control systems of process industries such as thermal power plants, chemical plants, and metallurgical production lines. Fieldbus diagnostic modules, as key devices ensuring the reliable operation of the bus system, need to monitor the physical layer status, communication quality, and fault diagnosis information of the bus in real time. The stability of their operation directly affects the safety and continuity of the entire production process.

[0003] However, existing fieldbus diagnostic module housings typically employ ordinary plastic injection molding or standard aluminum profile assembly, posing significant challenges in harsh industrial environments such as power plant boiler rooms and chemical plant reactor areas. On one hand, these environments exhibit ambient temperatures reaching 85°C and relative humidity exceeding 95%, often accompanied by corrosive gases and dust. Existing housings often employ simple flat-plate cooling or forced air cooling, resulting in low heat dissipation efficiency. This forces internal electronic components to operate for extended periods outside their rated temperature range (typically -40°C to +85°C for industrial applications), accelerating component aging and significantly shortening the mean time between failures (MTBF). On the other hand, existing housings often use single-layer rubber ring seals. Under drastic temperature cycling (such as due to diurnal temperature variations or equipment start-ups and shutdowns), the housing material (typically aluminum alloy, with a linear expansion coefficient of approximately 23 × 10⁻⁶) becomes susceptible to damage. -6 / ℃) and rubber sealing ring (linear expansion coefficient approximately 200×10) -6 The significant difference in expansion and contraction at / ℃ leads to excessive changes in the compression ratio of the sealing ring, resulting in permanent deformation after long-term use, sealing failure, and the inability to maintain the IP67 protection level. Moisture and corrosive gases can then enter, causing short circuits or corrosion failure. Summary of the Invention

[0004] The purpose of this invention is to provide a fieldbus diagnostic module housing structure that is resistant to high temperature and high humidity environments. This invention solves the technical problems of poor heat dissipation, sealing failure, and structural corrosion in existing fieldbus diagnostic module housing structures under extreme industrial environments, and achieves the technical effects of significantly reducing the core temperature of the module, maintaining long-term sealing reliability, and enabling rapid installation and maintenance.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: The present invention provides a fieldbus diagnostic module housing structure resistant to high temperature and high humidity environments, including a housing, wherein a heat dissipation fin assembly is integrally formed on the outer surface of the bottom plate of the housing, and a gradient heat dissipation component is provided on the inner surface of the bottom plate of the housing.

[0006] Preferably, the heat dissipation fin group is provided with multiple heat dissipation fins, which are arranged side by side; The heat dissipation fins on the housing, located in the central region of the core heat-generating device, are arranged in a high-density pattern; while the heat dissipation fins located in the edge region next to the core heat-generating device are arranged in a low-density pattern.

[0007] Preferably, the gradient heat dissipation component includes a metal substrate and a thermally conductive gradient layer, wherein: The metal substrate is integrally formed and arranged on the inner surface of the bottom of the housing, and the heat conduction gradient layer is arranged between the metal substrate and the core heating device.

[0008] Preferably, the heat conduction gradient layer comprises a first heat-conducting layer, a second heat-conducting layer, and a third heat-conducting layer, wherein: The first thermal conductive layer is disposed on one side of the core heat-generating device, the third thermal conductive layer is disposed on one side of the metal substrate, and the second thermal conductive layer is disposed between the first thermal conductive layer and the third thermal conductive layer. The thermal conductivity increases sequentially from the first thermally conductive layer to the third thermally conductive layer.

[0009] Preferably, the mating surface of the housing is provided with a double-layer sealing groove, which contains a main sealing groove and a secondary sealing groove, with the secondary sealing groove located outside the main sealing groove; a main sealing ring and a secondary sealing ring are respectively installed in the main sealing groove and the secondary sealing groove; a chamber is provided between the main sealing groove and the secondary sealing groove, and the chamber is filled with a desiccant.

[0010] Preferably, an elastic compensation element is embedded between the bottom of the main sealing groove and the main sealing ring, and the elastic compensation element is in a compressed state when installed.

[0011] Preferably, the elastic compensation element is a wave spring.

[0012] Preferably, the housing is provided with a modular installation interface, and the housing is installed in the field junction box through the modular installation interface.

[0013] Preferably, the modular installation interface includes a DIN rail clip assembly, which is connected to a DIN rail installed on the inner wall of the field junction box.

[0014] Preferably, the modular installation interface includes a wall-mounted mounting bracket, which is disposed on the back of the housing for mounting the housing onto the inner wall of the field junction box.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention provides a high-temperature and high-humidity resistant fieldbus diagnostic module housing structure. Through the integrated heat dissipation fins on the outer surface of the housing base plate and the gradient heat dissipation components on the inner surface of the base plate, thermal resistance is eliminated, enabling efficient directional heat conduction and dissipation from the core heat-generating components. This reduces the core temperature, improves component lifespan and module operational stability, and is suitable for use in high-temperature industrial environments. Under ambient temperature of 85℃ and natural convection conditions, the junction temperature of the module's core heat-generating components can be reduced by more than 15℃ compared to traditionally designed modules. Actual measurement data shows that, under full load operation, the core chip junction temperature of the diagnostic module using this invention remains stable at 72℃, while the junction temperature of the control group using a traditional flat-panel heat dissipation housing reaches 89℃, representing a temperature drop of 17℃. This effectively extends the component lifespan, and the expected mean time between failures (MTBF) is increased by more than 50%, from approximately 50,000 hours to over 75,000 hours.

[0016] Furthermore, due to the adoption of a double-layer sealing structure combined with elastic compensation sealing technology, especially the real-time compensation mechanism of the wave spring for temperature deformation, a durable and reliable seal is achieved under severe temperature cycling conditions. After 1000 temperature cycle tests from -40℃ to +85℃, the protection level of the casing of this invention still maintains the IP67 standard, while the control group with a traditional single-layer sealing structure leaked after 200 cycles. Field tests conducted for 12 months under actual operating conditions in a thermal power plant with humidity >95% and the presence of corrosive gases showed that no condensation or corrosion occurred inside the casing of this invention, and the sealing reliability is significantly superior to existing technologies.

[0017] Furthermore, thanks to the adoption of a modular installation interface made of stainless steel, supporting both DIN rail and wall-mounted installation methods, on-site installation and maintenance time is significantly reduced. Traditional diagnostic module installation typically requires 4-6 screws for fixing, with an installation time of approximately 10-15 minutes; the modular installation interface of this invention supports snap-on quick installation, reducing DIN rail installation time to 2-3 minutes and wall-mounted installation time to less than 5 minutes, improving installation efficiency by more than 50%, and allowing for tool-free disassembly, greatly facilitating on-site maintenance and fault replacement.

[0018] In summary, this invention, through the innovative integration of materials engineering, thermal management engineering, and mechanical structure, provides a solid physical foundation for the reliable operation of fieldbus diagnostic modules in harsh industrial environments such as thermal power plants and chemical plants, and has significant engineering application value and market promotion prospects. Attached Figure Description

[0019] Figure 1This is a schematic diagram of the outer shell structure according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the heat dissipation structure according to an embodiment of the present invention; Figure 3 This is a partially enlarged cross-sectional view of the double-layer sealing and elastic compensation structure according to an embodiment of the present invention; Figure 4 This is a partially enlarged cross-sectional view of the gradient heat dissipation layer structure according to an embodiment of the present invention; Figure 5 This is a top view of the heat dissipation fin array layout according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the modular installation interface structure according to an embodiment of the present invention; The components include: 1. Housing; 2. Heat dissipation fins; 3. Internal cavity; 4. Gradient heat dissipation assembly; 5. Silicone rubber sealing ring; 6. Elastic compensation element; 7. Modular mounting interface; 8. Metal substrate; 9. Heat conduction gradient layer; 91. First heat conduction layer; 92. Second heat conduction layer; 93. Third heat conduction layer; 10. Main sealing ring; 11. Secondary sealing ring; 12. Intermediate cavity; 13. Wave spring; 14. DIN rail clip assembly; 141. Stainless steel elastic clip arm; 142. Locking mechanism; 15. Wall-mounted bracket; 16. Core heating element. Detailed Implementation

[0020] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0021] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0022] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0023] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0024] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0026] Example 1 This embodiment provides a fieldbus diagnostic module housing structure that is resistant to high temperature and high humidity environments. The housing structure adopts a modular design concept and, through the systematic integration of material selection, structural innovation and thermal management engineering, constructs a protection system that is adaptable to a wide temperature range of -40℃ to +85℃ and high humidity and high corrosion environments.

[0027] The housing has an integrally formed heat dissipation fin assembly on the outer surface of its bottom plate and a gradient heat dissipation component on the inner surface of its bottom plate.

[0028] In this embodiment, the shell 1 is integrally formed by die-casting aluminum alloy material (preferably ADC12 or A380 series alloy) through high pressure die-casting process. The die-casting process ensures the one-time forming accuracy and internal density of the complex structure, and avoids the structural weaknesses caused by welding or splicing.

[0029] After the shell 1 is formed, it is anodized, preferably by sulfuric acid anodizing or hard anodizing, to form an aluminum oxide protective film layer with a thickness of 15-50μm on the surface. This film layer has the characteristics of strong adhesion to the base metal, high hardness, good insulation and chemical corrosion resistance, and is particularly suitable for sulfur-containing flue gas environment in thermal power plants or acid and alkali vapor environment in chemical plants.

[0030] After anodizing, the surface is further sealed using a fluorinated sealing agent or dichromate to seal the micropores of the oxide film, thereby further improving corrosion resistance and anti-fouling ability.

[0031] In this embodiment, the heat dissipation structure includes heat dissipation fins 2 and a gradient heat dissipation assembly disposed within the cavity. Unlike the additional heat sinks in the prior art, the heat dissipation fins 2 and the housing body in this embodiment are integrally formed by die casting, eliminating contact thermal resistance and achieving seamless heat conduction from the heat source to the heat dissipation surface. The gradient heat dissipation assembly, through optimized design of the internal heat conduction path, directionally and efficiently conducts the heat from core heat-generating components (such as fieldbus communication chips, power conversion modules, microprocessors, etc.) to the external heat dissipation fins.

[0032] Specifically, the gradient heat dissipation component includes a metal substrate with high thermal conductivity and a thermally conductive gradient layer, wherein: The metal substrate is integrally formed with the bottom plate of the housing or is tightly bonded with a high thermal conductivity adhesive. The preferred material is 6061-T6 aluminum alloy, which has a thermal conductivity of up to 167 W / (m·K).

[0033] The thermal conductivity gradient layer is disposed between the metal substrate and the core heating device. It is made of a composite material with a gradient distribution of thermal conductivity, and the thermal conductivity of the thermal conductivity gradient layer increases in the direction away from the core heating device, forming a thermal conduction path with "decreasing thermal resistance".

[0034] This gradient design allows heat to spread rapidly from the heat source to a large area of ​​the metal substrate, avoiding the formation of localized hot spots. The heat dissipation fin array is integrally formed with the outer surface of the housing, and its fin height and density are non-uniformly arranged according to the heat flux density distribution. A high-density, high-fin design is used in the area corresponding to the core heat-generating device (fin density can reach 3-4 fins per centimeter, height 15-25mm), while a low-density design is used in the edge area (fin density 1-2 fins per centimeter, height 8-12mm), thereby maximizing the natural convection heat dissipation efficiency within a limited space.

[0035] The sealing assembly uses an aging-resistant silicone rubber sealing ring and an innovative double-layer sealing structure to ensure a protection level of IP67 (completely prevents dust ingress and can be immersed in water for a short time).

[0036] The housing has a double-layer sealing groove at the joint surface, which contains a main sealing groove and a secondary sealing groove, with the secondary sealing groove located outside the main sealing groove.

[0037] The double-layer sealing structure includes a main sealing ring and a secondary sealing ring. The main sealing ring is made of high and low temperature resistant silicone rubber material (such as methyl vinyl silicone rubber) with a Shore hardness of 50-70 degrees. It is set in the main sealing groove on the shell mating surface and undertakes the main sealing function. The secondary sealing ring is made of fluorosilicone rubber material with a Shore hardness of 30-50 degrees. It has better oil and solvent resistance and is set in the secondary sealing groove outside the main sealing ring to form redundant protection.

[0038] A cavity is formed between the main sealing ring and the secondary sealing ring. The cavity is filled with a desiccant (such as a molecular sieve) or protective grease to absorb any trace amounts of moisture that may penetrate, forming a "multi-barrier" sealing system.

[0039] Example 2 Based on Embodiment 1, this embodiment provides a high-temperature resistant fieldbus diagnostic module housing structure, wherein an elastic compensation element is provided in the sealing groove to compensate for the expansion and contraction of the housing and sealing ring caused by drastic temperature changes.

[0040] The elastic compensation element includes a wave spring, embedded between the bottom of the sealing groove and the silicone rubber sealing ring. The wave spring is made of stainless steel (such as SUS304 or SUS316) or beryllium bronze, with a spring stiffness of 5-20 N / mm, a free height of 2-5 mm, and a pre-compression of 0.5-1.5 mm under standard installation conditions. By precisely calculating the difference in linear expansion coefficients between the outer shell material (aluminum alloy) and the sealing material (silicone rubber), the dimensional difference caused by temperature changes within a temperature range of -40℃ to +85℃ can be compensated by the elastic deformation of the wave spring, maintaining the sealing ring compression rate within the optimal range of 15%-25%, thus avoiding permanent deformation due to over-compression or seal failure due to under-compression. This "elastic compensation sealing technology" overcomes the limitations of traditional sealing designs in terms of temperature adaptability, ensuring long-term sealing reliability under extreme temperature cycling conditions.

[0041] Example 3 Based on Embodiment 1, this embodiment provides a high-temperature resistant fieldbus diagnostic module housing structure. The housing 1 is provided with a modular installation interface, which is used to install the module in a field junction box.

[0042] The modular installation interface is made of stainless steel (such as 304 or 316 stainless steel) and is designed to support DIN rail mounting and quick wall-mounting. It includes a DIN rail clip assembly and a wall-mounting bracket, wherein: The DIN rail clip assembly is configured to engage with a DIN rail mounted on the inner wall of the field junction box.

[0043] The wall-mounted mounting bracket is located on the back of the housing and is used to mount the housing onto the inner wall of the field junction box. The use of stainless steel ensures the long-term structural integrity and connection reliability of the mounting interface in high-humidity and high-corrosion environments, preventing module loosening or detachment due to corrosion at the mounting points.

[0044] Those skilled in the art will understand that the material selection, size parameters and structural form in the above technical solutions can be adjusted according to specific application scenarios. For example, in high salt spray environments (such as coastal power plants), the thickness of the anodic oxide film can be increased to more than 50 μm, and a special sealing process can be adopted; in higher temperature environments (such as steel plants), the silicone rubber sealing ring can be replaced with fluororubber to further improve the temperature resistance.

[0045] Example 4 like Figures 1 to 5 As shown, this embodiment provides a fieldbus diagnostic module housing structure resistant to high temperature and humidity environments, suitable for extreme industrial environments such as boiler rooms in thermal power plants. The housing structure includes a housing 1, a heat dissipation structure, a sealing assembly, and a modular mounting interface 7.

[0046] The housing 1 is integrally formed from ADC12 die-cast aluminum alloy using a high-pressure die-casting process. The die-casting pressure is 80-120MPa, and the mold temperature is controlled at 220-280℃ to ensure that the casting is dense and free of pores. The housing 1 has a rectangular structure with external dimensions of 120mm × 80mm × 45mm (length × width × height) and a wall thickness of 3-5mm. Reinforcing ribs are provided at the corners to improve structural rigidity. Inside the housing 1, there is a cavity 3 for accommodating the fieldbus diagnostic circuit board. The bottom of the cavity 3 has mounting posts for fixing the circuit board, and the mounting posts have pre-drilled M3 threaded holes.

[0047] After the shell 1 is formed, it undergoes comprehensive surface pretreatment, including degreasing, alkaline etching, and acid pickling to remove ash, followed by sulfuric acid anodizing. The anodizing process parameters are set as follows: sulfuric acid concentration 180-200 g / L, oxidation temperature 18-22℃, current density 1.0-1.5 A / dm², and oxidation time 40-60 minutes, forming an anodized film with a thickness of 25-35 μm. After oxidation, the shell 1 undergoes hot water sealing (temperature 95-100℃, time 20-30 minutes) or nickel-containing sealing treatment to seal the micropores of the oxide film, further improving corrosion resistance and insulation performance. Testing shows that the treated shell surface hardness reaches HV350, insulation withstand voltage >2000V, and shows no corrosion after more than 1000 hours of 5% NaCl salt spray testing.

[0048] The heat dissipation structure includes heat dissipation fins 2 integrated with the housing 1 and a gradient heat dissipation assembly 4 disposed within the cavity 3. The heat dissipation fins 2 and the base plate of the housing 1 are integrally formed by die casting, eliminating contact thermal resistance. Figure 5 As shown, the heat dissipation fins 2 adopt a non-uniform layout design. In the central region of the housing 1 (corresponding to the location of the core heat-generating device 16), the fin density is 3.5 fins per centimeter, the fin height is 20mm, the fin thickness is 2mm, and the spacing is 2.8mm. In the two edge regions, the fin density decreases to 1.5 fins per centimeter, the fin height is 10mm, and the spacing is 6mm. This non-uniform layout is based on the optimization of heat flux density distribution, ensuring that the heat dissipation capacity of the core heat source area is maximized, while taking into account the heat dissipation requirements and structural strength of the edge areas.

[0049] like Figure 4 As shown, the gradient heat dissipation component 4 includes a high thermal conductivity metal substrate 8 and a thermal conductivity gradient layer 9. The metal substrate 8 and the bottom plate of the housing 1 are an integral structure, and the material is ADC12 aluminum alloy. A thermal conductivity gradient layer 9 is disposed between the metal substrate 8 and the core heat-generating device 16, and adopts a three-layer gradient structure: the first thermal conductive layer 91 is disposed adjacent to the core heat-generating device 16, and uses flexible thermal conductive silicone grease (such as Shin-Etsu X-23-7762) with a thermal conductivity of 2.0 W / (m·K) and a thickness of 0.5 mm. Its main function is to fill the microscopic gaps between the device and the heat sink and reduce the contact thermal resistance; the second thermal conductive layer 92 is disposed between the first thermal conductive layer 91 and the third thermal conductive layer 93, and uses aluminum-based silicon carbide composite material with a thermal conductivity of 80 W / (m·K) and a thickness of 2 mm. This material has the characteristics of high rigidity and low thermal expansion coefficient, which can distribute heat and relieve thermal stress; the third thermal conductive layer 93 is in contact with the metal substrate 8, and uses T2 copper foil with a thermal conductivity of 235 W / (m·K) and a thickness of 0.3 mm. It is tightly bonded to the metal substrate 8 by thermally conductive adhesive. This gradient design, with thermal conductivity increasing from 2.0 W / (m·K) to 235 W / (m·K), creates a heat conduction path with decreasing thermal resistance, ensuring that heat is rapidly diffused from the core heat-generating device 16 to the larger area of ​​the metal substrate 8, and then dissipated into the environment through the heat dissipation fins 2.

[0050] The optimization of thermal conductivity can be verified through thermal resistance network analysis. The total thermal resistance R_total of the system can be expressed as:

[0051] In the formula, The junction-to-case thermal resistance of the device is given in °C / W. The contact thermal resistance (°C / W) is the thermal resistance from the housing to the heat sink. Thermal resistance from the heat sink to the environment (°C / W).

[0052] This application utilizes gradient heat dissipation component 4 to... Reduced to below 0.15℃ / W, through integrated heat dissipation fins 2 Reduced to 3.5℃ / W (under natural convection conditions), compared to traditional structures Approximately 0.5℃ / W and Approximately 5.0℃ / W, resulting in a reduction of about 35% in total thermal resistance. According to the temperature rise formula:

[0053] In the formula, Let P be the temperature rise (°C) and P be the power consumption (W). When the module power consumption is 5W, the total temperature rise of this invention is 18.25°C, while that of the traditional structure is 27.5°C, which is an actual reduction of about 9.25°C in temperature rise. This is consistent with the measured temperature drop trend of 15-17°C (considering the influence of actual device thermal resistance and radiative heat dissipation).

[0054] The sealing assembly includes an aging-resistant silicone rubber sealing ring 5 and a double-layer sealing structure. For example... Figure 3 As shown, the housing 1 consists of a top cover and a base, with a double-layer sealing groove at the joint surface. The main sealing ring 10 is made of methyl vinyl silicone rubber (MVQ) with a Shore hardness of 60, tensile strength >7MPa, and tear strength >20kN / m. It is located in the main sealing groove, has a wire diameter of 2.5mm, and a compression ratio designed to be 20%. The secondary sealing ring 11 is made of fluorosilicone rubber (FVMQ) with a Shore hardness of 40, exhibiting excellent oil and solvent resistance. It is located in the secondary sealing groove outside the main sealing ring 10, has a wire diameter of 2.0mm, and a compression ratio of 15%. A 3mm wide intermediate chamber 12 is formed between the main sealing ring 10 and the secondary sealing ring 11. The chamber is filled with 3A molecular sieve desiccant to absorb any trace amounts of moisture that may penetrate.

[0055] The core innovation of this invention lies in the elastic compensation sealing technology. For example... Figure 3 As shown, a wave spring is embedded between the bottom of the main sealing groove and the main sealing ring 10 as an elastic compensation element 6. The wave spring is made of SUS316 stainless steel strip, stamped with an outer diameter of 4mm matching the width of the sealing groove, an inner diameter of 3mm, a material thickness of 0.2mm, a wave crest height of 1mm, a total of 3 waves, a spring stiffness of 12 N / mm, and a free height of 3mm. In the installed state, the pre-compression of the wave spring is 1.0mm, providing a preload of approximately 12N.

[0056] The working principle of elastic compensation is based on calculations to compensate for differences in the linear expansion coefficients of materials. The linear expansion coefficient of aluminum alloy shell 1... Approximately 23 × 10 -6 / ℃, coefficient of linear expansion of silicone rubber seals Approximately 200×10 -6 / ℃. During temperature changes At that time, the change in the width of the housing sealing groove and the change in the cross-sectional diameter of the sealing ring They are respectively:

[0057]

[0058] In the formula, This is the initial width of the sealing groove (mm). This is the initial wire diameter (mm) of the sealing ring.

[0059] by Temperature variation range (Calculation from -40℃ to +85℃):

[0060]

[0061] Without a compensation mechanism, the compression of the sealing ring will change by 0.051 mm, a relative change rate of approximately 10%, which will lead to permanent deformation over long-term cycles. The wave spring has an elastic deformation range of 0.5-2.0 mm and a stiffness of 12 N / mm. Within the 0.051 mm dimensional difference caused by temperature changes, the spring force changes by only 0.61 N, a change rate of 5% relative to the preload of 12 N. This is sufficient to maintain the sealing ring compression rate within a stable range of 15%-25%, ensuring long-term sealing reliability.

[0062] The modular installation interface is made of 304 stainless steel and has two sets, installed on both sides of the back of the housing 1 to ensure installation stability. It includes a DIN rail clip assembly 14 and a wall-mounted bracket 15, wherein: The DIN rail latch assembly 14 includes a stainless steel resilient latch arm 141 and a locking mechanism 142. The resilient latch arm 141 is precision stamped, with a thickness of 1.5 mm, and undergoes aging treatment to obtain suitable elasticity. Its natural spacing is 32 mm, and it can elastically open to 37 mm to engage a standard 35 mm DIN rail. The DIN rail is a prefabricated installation component, typically fixed to the inner wall of a control cabinet or junction box.

[0063] The locking mechanism 142 is installed on the elastic locking arm 141 and includes a rotating latch. When the module is pushed into the guide rail, the latch can be rotated 90 degrees to lock it, preventing accidental dislodgement. After unlocking, the module can slide along the guide rail to adjust its position or be quickly removed by lifting it upwards.

[0064] The wall-mounted bracket 15 is an L-shaped stainless steel plate, 2mm thick, connected to the back of the housing 1 with M4 stainless steel screws. The bracket has oblong mounting holes, 6mm × 12mm in size, allowing for ±3mm horizontal adjustment to accommodate machining errors in the mounting holes on site. During installation, first fix the bracket to the wall using expansion bolts, then hang the housing 1 onto the bracket, and finally tighten the fixing screws to complete the installation.

[0065] In practical applications in thermal power plant boiler rooms, the outer casing of this invention is installed in a field junction box outside the boiler control room. The ambient temperature fluctuates between 60-85℃ year-round, humidity is >95%, and sulfur-containing flue gas is present. The diagnostic module is quickly installed on a DIN rail using a DIN rail clip assembly 14, connecting to a Profibus-DP or DeviceNet fieldbus to monitor the physical layer signal quality in real time. After 18 months of continuous operation and monitoring, the internal temperature of the module was consistently controlled below 75℃, far below the component's rated upper limit of 85℃. There was no condensation or corrosion inside the casing, and the sealing performance remained excellent, verifying the reliability and practicality of this invention in extreme industrial environments.

[0066] Those skilled in the art will understand that the specific parameters and material selections in the above embodiments can be adjusted according to actual application needs, but all should fall within the protection scope of this invention. For example, in the high-radiative-heat environment of a steel plant, a high-emissivity coating (such as black anodizing or ceramic coating) can be sprayed onto the surface of the heat dissipation fins; in a more severe chemical corrosion environment, die-cast zinc alloy can be used instead of aluminum alloy, along with special surface coating treatment. All these modifications should be considered equivalent substitutions of this invention.

[0067] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A high-temperature resistant fieldbus diagnostic module housing structure, characterized in that, include: The housing has an integrally formed heat dissipation fin assembly on the outer surface of its bottom plate and a gradient heat dissipation component on the inner surface of its bottom plate.

2. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 1, characterized in that, The heat dissipation fin group is provided with multiple heat dissipation fins, which are arranged side by side. The heat dissipation fins on the housing, located in the central region of the core heat-generating device, are arranged in a high-density pattern; while the heat dissipation fins located in the edge region next to the core heat-generating device are arranged in a low-density pattern.

3. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 1, characterized in that, The gradient heat dissipation component includes a metal substrate and a heat conduction gradient layer, wherein: The metal substrate is integrally formed and arranged on the inner surface of the bottom of the housing, and the heat conduction gradient layer is arranged between the metal substrate and the core heating device.

4. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 3, characterized in that, The heat conduction gradient layer includes a first heat conduction layer, a second heat conduction layer, and a third heat conduction layer, wherein: The first thermal conductive layer is disposed on one side of the core heat-generating device, the third thermal conductive layer is disposed on one side of the metal substrate, and the second thermal conductive layer is disposed between the first thermal conductive layer and the third thermal conductive layer. The thermal conductivity increases sequentially from the first thermally conductive layer to the third thermally conductive layer.

5. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 1, characterized in that, The housing has a double-layer sealing groove at the joint surface, which contains a main sealing groove and a secondary sealing groove, with the secondary sealing groove located outside the main sealing groove. A main sealing ring and a secondary sealing ring are installed in the main sealing groove and the secondary sealing groove, respectively. A chamber is provided between the main sealing groove and the secondary sealing groove, and the chamber is filled with a desiccant.

6. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 5, characterized in that, An elastic compensation element is embedded between the bottom of the main sealing groove and the main sealing ring. In the installed state, the elastic compensation element is in a compressed state.

7. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 6, characterized in that, The elastic compensation element is a wave spring.

8. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 1, characterized in that, The housing is provided with a modular installation interface, and the housing is installed in the field junction box through the modular installation interface.

9. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 7, characterized in that, The modular installation interface includes a DIN rail clip assembly, which is connected to a DIN rail installed on the inner wall of the field junction box.

10. The high-temperature resistant fieldbus diagnostic module housing structure according to claim 7, characterized in that, The modular installation interface includes a wall-mounted mounting bracket, which is located on the back of the housing and is used to install the housing onto the inner wall of the field junction box.

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