A compact integrated power supply device based on heat source analysis

Abstract

The application discloses a compact integrated power supply device based on heat source analysis and relates to the technical field of power supply equipment.The compact integrated power supply device comprises a power supply box body, a cover plate, an adjusting mechanism and a plurality of mounting mechanisms.The power supply box body is fixedly connected with the cover plate through bolts.The adjusting mechanism is embedded on both sides of the power supply box body.The mounting mechanisms are arranged inside the power supply box body.The heat dissipation fan is arranged on one side of the power supply box body.The compact integrated power supply device has a reasonable and reliable structure, can be flexibly installed in the power supply box body according to the conditions of different equipment, greatly improves the space utilization and equipment adaptability, and realizes efficient layout under compact integrated design.The adjusting mechanism is arranged, so that the size of air permeation of the first perforation is adjusted, the position of the first perforation relative to the second perforation is adjusted by the driving motor when the temperature inside the power supply box body is too high, and the size of air flow inside the power supply box body is adjusted, so that the temperature is rapidly reduced.

Description

Technical Field

[0001] This invention relates to the field of power supply equipment technology, and more specifically, to a compact integrated power supply device based on heat source analysis. Background Technology

[0002] Currently, with the booming development of the new energy industry, the demand for integrated AC / DC power supplies is increasing in various new energy power generation projects (such as wind farms and photovoltaic power stations). Because the construction cycle of new energy power stations is usually short and site resources are scarce, prefabricated substations are often used in a compact layout to improve land utilization and construction efficiency. This requires the integrated power system to be highly integrated and compactly designed to combine DC power, communication power, and UPS power within an extremely compact space, in order to meet the special requirements of new energy power stations for power equipment.

[0003] However, current related technologies have the following problems: On the one hand, when integrating multiple power sources in a compact space, it is difficult to flexibly install them according to the size and shape of different equipment, resulting in low utilization of the internal space of the power supply box, making it impossible to achieve efficient layout, limiting the adaptability of the power supply device to different equipment, and making it difficult to meet the diverse equipment needs of new energy power stations; on the other hand, during the operation of the power supply device, heat is generated inside the power supply box, and existing heat dissipation methods often cannot adjust the heat dissipation effect in a timely and effective manner according to the changes in the internal temperature of the power supply box. When the temperature is too high, it cannot be reduced quickly, affecting the performance and stability of the power supply device.

[0004] No effective solutions have yet been proposed to address the problems in the relevant technologies. Summary of the Invention

[0005] In view of the problems in related technologies, the present invention proposes a compact integrated power supply device based on heat source analysis to overcome the above-mentioned technical problems existing in the existing related technologies.

[0006] Therefore, the specific technical solution adopted by the present invention is as follows:

[0007] A compact integrated power supply device based on heat source analysis includes: a power supply enclosure; a cover plate disposed on the top of the power supply enclosure, and the power supply enclosure and the cover plate are fixedly connected by bolts; an adjustment mechanism embedded on both sides of the power supply enclosure; a plurality of mounting mechanisms disposed inside the power supply enclosure; and a cooling fan disposed on one side of the power supply enclosure.

[0008] Furthermore, to provide an installation position for the adjustment mechanism, the vents allow heat generated inside the power supply box to dissipate. The dustproof plate provides some dust protection to the inside of the power supply box. Mounting holes for the adjustment mechanism are provided on both sides of the power supply box. A groove is formed on one side wall of the power supply box, and several vents are formed on the inner wall of the groove. A dustproof plate is installed on one side of the inner wall of the groove. The power supply box also has a mounting partition with a square cross-section and several threaded mounting holes on its side wall.

[0009] Furthermore, the power supply enclosure contains a battery pack, a rectifier and inverter, a monitoring host and a control motherboard, and several temperature sensors are installed on the outside of the monitoring host.

[0010] Furthermore, to adjust the ventilation size of the first perforation, when the temperature inside the power supply box is too high, the position of the first perforation relative to the second perforation can be adjusted by the drive motor, thereby adjusting the airflow inside the power supply box to achieve rapid temperature reduction. The adjustment mechanism includes a mounting plate installed inside the mounting hole, a drive motor installed on one side of the mounting plate, a protective shell installed on the outside of the drive motor, and the output shaft of the drive motor passing through the side wall of the mounting plate and equipped with gears. An adjustment plate is symmetrically arranged on the other side of the mounting plate, an extension plate is provided at one end of the adjustment plate, and several gear teeth meshing with the gears are opened at the bottom end of the extension plate. Several guide rods connected to the mounting plate are embedded at one end of the extension plate. Several first perforations are symmetrically opened on the side wall of the mounting plate, and the cross-section of the first perforation is V-shaped. Several second perforations are opened on the side wall of the adjustment plate, and the shape of the second perforations is the same as that of the first perforations.

[0011] Furthermore, to enable the installation of different devices and maximize the use of space within the power supply enclosure, the adaptability of the power supply unit to various devices is greatly improved. Simultaneously, the connecting holes and vents connect to the outside of the power supply enclosure, allowing heat generated in the center of the enclosure to interact with the external air, thus improving heat dissipation. The installation mechanism includes a mounting bracket with threaded holes inside the power supply enclosure. The mounting bracket has a cross-shaped cross-section, and both ends are equipped with fixing plates. The fixing plates are connected to the mounting partition via nuts that mate with the threaded holes. A connecting hole penetrating the mounting bracket is located in the center of the side wall of the fixing plate, and several vents are located on the outer side of the mounting bracket. The distance between the nuts and vents is equal to the distance between adjacent sets of threaded holes.

[0012] Furthermore, the internal components of the control motherboard include:

[0013] The data acquisition and processing module is used to acquire temperature data collected by several temperature sensors and to preprocess the temperature data.

[0014] The graph model building module is used to acquire the location data of the battery pack, rectifier inverter, monitoring host and control motherboard, and to build a digital twin graph model in combination with the structural characteristics of the power supply box.

[0015] The signal generation module is used to perform thermodynamic simulation based on preprocessed temperature data using a digital twin model, and generate dynamic coordinated control signals for the regulating mechanism and cooling fan based on the simulation results.

[0016] The collaborative control module is used to coordinate the control of the adjustment mechanism and the cooling fan based on dynamic collaborative control signals in order to achieve heat dissipation inside the power supply enclosure.

[0017] Specifically, acquiring the location data of the battery pack, rectifier inverter, monitoring host, and control motherboard, and constructing a digital twin model based on the structural characteristics of the power supply enclosure includes:

[0018] A three-dimensional rectangular coordinate system is established with the geometric center of the power supply box as the origin, and the position data of the battery pack, rectifier inverter, monitoring host and control motherboard are converted into three-dimensional geometric entities; and the constraints of the digital model are established with the structural characteristic parameters of the power supply box.

[0019] Based on constraints and three-dimensional geometric entities, an initial graph network is constructed.

[0020] The cooling fan and the adjustment mechanism are abstracted as dynamic boundary nodes, and the speed attribute of the cooling fan and the opening attribute of the adjustment mechanism are mapped to the variable impedance attribute of the corresponding edge in the initial graph network to obtain the second-level initial graph network.

[0021] The real-time data stream from the temperature sensor is integrated into a secondary initial graph network, and the thermodynamic state of the secondary initial graph network is activated and initialized to obtain a digital twin graph model.

[0022] Specifically, based on the preprocessed temperature data, thermodynamic simulation is performed using a digital twin model, and dynamic coordinated control signals for the regulating mechanism and cooling fan are generated based on the simulation results, including:

[0023] Based on the preprocessed temperature data, and combined with the operating characteristics of the battery pack, rectifier inverter, monitoring host, and control motherboard, the temperature data of each location inside the power supply box is interpolated and estimated to obtain the full-space temperature field.

[0024] The entire space temperature field is used as the initial state and input into the digital twin model. Based on the variable impedance network under the current opening degree of the adjustment mechanism and the speed of the cooling fan, dynamic thermodynamic simulation is performed to predict the temperature change in the future preset time period and identify temperature risk areas.

[0025] Based on the location of the temperature risk area and the impedance network characteristics in the digital twin model, a target optimization function is established with the goal of reducing the temperature of the risk area to within the safe threshold.

[0026] The objective optimization function is solved using a particle swarm optimization algorithm to obtain the optimal combination of opening degree of the regulating mechanism and the optimal speed of the cooling fan, and then converted into driving signals to form a dynamic cooperative control signal.

[0027] Specifically, based on the preprocessed temperature data and combined with the operating characteristics of the battery pack, rectifier inverter, monitoring host, and control motherboard, the temperature data at various locations inside the power supply enclosure are interpolated and estimated to obtain the overall temperature field, including:

[0028] Based on the operating characteristics of the battery pack, rectifier inverter, monitoring host, and control motherboard, heat source models of the battery pack, rectifier inverter, monitoring host, and control motherboard are constructed respectively.

[0029] The preprocessed temperature data is correlated with the heat source model of the monitoring host to determine the temperature reference area;

[0030] Based on the heat source model of battery pack, rectifier inverter, monitoring host and control motherboard, the spatial distance from any spatial location inside the power supply box to the battery pack, rectifier inverter, monitoring host and control motherboard is calculated, and the heat weight matrix of each spatial location affected by different heat sources is constructed.

[0031] Based on the weighted average interpolation algorithm, the temperature of the temperature reference region is used, combined with the influence weight of each heat source model on the target spatial location in the heat weight matrix, to calculate the temperature value of all grid cells inside the power supply box, and obtain the full space temperature field.

[0032] Specifically, the preprocessed temperature data is correlated with the heat source model of the monitoring host to determine the temperature reference area, including:

[0033] Collect real-time operating parameters of the monitoring host and use the heat source model of the monitoring host to determine the theoretical temperature of the monitoring host surface;

[0034] The temperature data preprocessed by the temperature sensor is compared with the theoretical surface temperature of the monitoring host. If the absolute value of the deviation exceeds the preset threshold, the parameters of the heat source model are adjusted until the deviation between the corrected theoretical temperature and the measured temperature does not exceed the preset threshold, so as to achieve dynamic correlation between the preprocessed temperature data and the heat source model of the monitoring host.

[0035] Using the installation coordinates of the temperature sensor on the outside of the monitoring host as the center, and combining the physical dimensions of the monitoring host, a three-dimensional spatial range is defined as the temperature reference area.

[0036] Specifically, based on the heat source models of the battery pack, rectifier-inverter, monitoring host, and control motherboard, the spatial distances from any location inside the power supply enclosure to the battery pack, rectifier-inverter, monitoring host, and control motherboard are calculated, and a heat weight matrix is ​​constructed for each spatial location affected by different heat sources, including:

[0037] The internal space of the power supply enclosure is divided into several three-dimensional grid units according to a preset precision, and the coordinates of the center point of each grid unit are determined.

[0038] The spatial distances from the center point of each grid cell to the battery pack, rectifier inverter, monitoring host, and control motherboard are calculated using a three-dimensional distance formula.

[0039] The real-time heat intensity is obtained from the heat source models of the battery pack, rectifier inverter, monitoring host, and control motherboard, and normalized. The distance attenuation factor is calculated in combination with the spatial distance.

[0040] Based on the distance attenuation factor, the basic thermal weight is calculated, and a thermal weight matrix is ​​constructed to reflect the influence of the battery pack, rectifier inverter, monitoring host, and control motherboard.

[0041] Specifically, based on the weighted average interpolation algorithm, using the temperature of the temperature reference region and combining the influence weights of each heat source model on the target spatial location in the thermal weight matrix, the temperature values ​​of all grid cells inside the power supply enclosure are calculated, resulting in the full-space temperature field including:

[0042] Extract the spatial coordinate range and temperature values ​​of the temperature reference region, and use them as the known data point set for the weighted average interpolation algorithm;

[0043] For each grid cell to be interpolated within the power supply enclosure, the weight value of its influence by each heat source is queried from the thermal weight matrix, and the distance attenuation weight is calculated based on the relative positional relationship between the cell and each temperature reference region.

[0044] The thermal impact weight and distance attenuation weight are fused to generate a comprehensive interpolation weight for each grid cell relative to each temperature reference region, and the comprehensive interpolation weight is then normalized.

[0045] Based on the normalized comprehensive interpolation weight, the temperature values ​​of the temperature reference region are calculated by weighted average to obtain the final temperature estimate of each grid cell. After traversing all grid cells, the full-space temperature field is output.

[0046] The beneficial effects of this invention are as follows:

[0047] 1. The present invention has a reasonable and reliable structure, and can be flexibly installed in the power supply box according to the different equipment conditions, which greatly improves the space utilization and equipment adaptability, realizes the efficient layout under the compact integrated design, and further improves the applicability of the power supply device.

[0048] 2. By setting an adjustment mechanism, the ventilation size of the first perforation can be adjusted. When the temperature inside the power supply box is too high, the position of the first perforation relative to the second perforation can be adjusted by driving the motor, thereby adjusting the airflow inside the power supply box to achieve rapid temperature reduction.

[0049] 3. By setting up an installation mechanism, different devices can be installed, allowing for maximum space utilization inside the power supply box. This greatly improves the adaptability of the power supply unit to different devices. At the same time, the connecting holes and vents can be connected to the outside of the power supply box, allowing the heat generated in the middle of the power supply box to interact with the outside air through the connecting holes and vents, thus improving the heat dissipation effect.

[0050] 4. This invention establishes a high-fidelity physical mapping of the power supply enclosure and internal components from the spatial coordinate system to the thermodynamic state activation through a digital twin graph model. It also incorporates dynamic boundary nodes and variable impedance properties to accurately reflect the action characteristics of the heat dissipation components. Thermodynamic simulation, combined with the full-space temperature field obtained based on heat source modeling, benchmark region calibration, thermal weight matrix quantization, and weighted average interpolation, can predict temperature risk areas in advance. Then, the optimal cooperative control signal is generated by solving the optimization function through particle swarm genetic algorithm, which not only ensures that the temperature risk area is reduced to the safe threshold, but also achieves efficient coordination between the adjustment mechanism and the cooling fan. Ultimately, it significantly improves the accuracy, initiative, and reliability of the power supply enclosure's heat dissipation, perfectly adapting to the space constraints and stable operation requirements of compact devices. Attached Figure Description

[0051] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0052] Figure 1 This is a schematic diagram of a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention;

[0053] Figure 2 This is an internal schematic diagram of a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention;

[0054] Figure 3 This is a schematic diagram of the power supply enclosure in a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention.

[0055] Figure 4 This is a cross-sectional view of the power supply enclosure in a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention;

[0056] Figure 5 This is a three-dimensional assembly drawing of the regulating mechanism in a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention;

[0057] Figure 6 This is a schematic diagram of the regulating mechanism in a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention;

[0058] Figure 7 This is a schematic diagram of the mounting mechanism in a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention;

[0059] Figure 8 This is a schematic diagram of the structure of a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention, in which different devices are installed inside the power supply box.

[0060] Figure 9 This is a schematic diagram of the control motherboard in a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention.

[0061] In the picture:

[0062] 1. Power supply enclosure; 101. Mounting hole; 102. Groove; 103. Vent hole; 104. Dustproof plate; 105. Mounting partition; 1051. Mounting threaded hole; 106. Battery pack; 107. Rectifier and inverter; 108. Monitoring host; 109. Control main board; 1091. Data acquisition and processing module; 1092. Graphical model construction module; 1093. Signal generation module; 1094. Cooperative control module; 110. Temperature sensor; 111. Display; 112. Power supply Socket; 113. Inspection and maintenance interface; 114. Communication interface; 2. Cover plate; 3. Adjustment mechanism; 301. Mounting plate; 3011. First through hole; 302. Drive motor; 303. Protective shell; 304. Gear; 305. Adjustment plate; 3051. Second through hole; 306. Extension plate; 307. Gear tooth; 308. Guide rod; 4. Mounting mechanism; 401. Mounting bracket; 402. Fixing plate; 403. Nut; 404. Connecting hole; 405. Vent hole; 5. Cooling fan. Detailed Implementation

[0063] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these drawings, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0064] According to an embodiment of the present invention, a compact integrated power supply device based on heat source analysis is provided.

[0065] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, such as... Figures 1-8 As shown, a compact integrated power supply device based on heat source analysis according to an embodiment of the present invention includes: a power supply housing 1; a cover plate 2 disposed at the top of the power supply housing 1, and the power supply housing 1 and the cover plate 2 are fixedly connected by bolts; an adjustment mechanism 3 embedded on both sides of the power supply housing 1; a plurality of mounting mechanisms 4 disposed inside the power supply housing 1; and a cooling fan 5 disposed on one side of the power supply housing 1.

[0066] In addition, such as Figure 8 As shown, a battery pack 106, a rectifier-inverter 107, a monitoring host 108, and a control motherboard 109 are arranged inside the power supply box 1 and above the mounting mechanism 4, and several temperature sensors 110 are arranged on the outside of the monitoring host 108.

[0067] Temperature sensor 110 is typically connected to control motherboard 109 via digital or analog signal output. Monitoring host 108 and control motherboard 109 are usually connected via a communication bus, such as RS485 or CAN bus. Monitoring host 108 is typically connected to monitor 111 via a video interface (such as VGA, HDMI, or DVI).

[0068] In addition, the side of the power supply enclosure 1 furthest from the cooling fan 5 is equipped with a display 111, a power socket 112, a testing and maintenance interface 113 for battery performance testing, a communication interface 114, and other interfaces. The display 111 can intuitively display the operating parameters and status information of each device inside the power supply enclosure 1. The power socket 112 can provide a power interface for external devices, facilitating the connection of some temporary devices or charging of small devices. The testing and maintenance interface 113 is used to connect battery performance testing equipment to perform comprehensive testing and maintenance of the battery pack 106. The above are all existing technologies and will not be elaborated further here.

[0069] With the help of the above-mentioned technical solution of the present invention, the present invention has a reasonable and reliable structure, and can be flexibly installed in the power supply box 1 according to the different equipment conditions, which greatly improves the space utilization and equipment adaptability, realizes the efficient layout under the compact integrated design, and further improves the applicability of the power supply device.

[0070] In one embodiment, for the power supply box 1, both sides of the power supply box 1 are provided with mounting holes 101 that cooperate with the adjustment mechanism 3, one end side wall of the power supply box 1 is provided with a groove 102, and the inner wall of the groove 102 is provided with a plurality of ventilation holes 103, a dustproof plate 104 is provided on one side of the inner wall of the groove 102, and the dustproof plate 104 is provided; the power supply box 1 is provided with a mounting partition 105; and the wall is provided with a plurality of mounting threaded holes 1051.

[0071] In addition, it should be noted that the dustproof plate 104 is installed at an angle downwards, and its side wall can block the vent 103 to a certain extent, effectively reducing the amount of dust entering the power supply box 1.

[0072] In one embodiment, the adjustment mechanism 3 includes a mounting plate 301 disposed inside the mounting hole 101. A drive motor 302 is disposed on one side of the mounting plate 301, and a protective shell 303 is disposed on the outer side of the drive motor 302. The output shaft of the drive motor 302 passes through the side wall of the mounting plate 301 and is provided with a gear 304. An adjustment plate 305 is symmetrically disposed on the other side of the mounting plate 301. An extension plate 306 is disposed at one end of the adjustment plate 305. A plurality of gear teeth 307 meshing with the gear are opened at the bottom end of the extension plate 306, and a plurality of guides connected to the mounting plate 301 are embedded at one end of the extension plate 306. Rod 308; The side wall of mounting plate 301 is symmetrically provided with a plurality of first through holes 3011, and the cross-section of the first through holes 3011 is a V-shaped structure; The side wall of adjusting plate 305 is provided with a plurality of second through holes 3051, and the shape of the second through holes 3051 is the same as that of the first through holes 3011, thereby realizing the adjustment of the air permeability of the first through holes 3011. When the temperature inside the power supply box 1 is too high, the position of the first through holes 3011 relative to the second through holes 3051 can be adjusted by driving motor 302, thereby realizing the adjustment of the air flow inside the power supply box 1 to achieve rapid temperature reduction.

[0073] The working principle of the adjustment mechanism 3 is as follows: After the control panel receives the high temperature signal, it sends a start command to the drive motor 302. The output shaft of the drive motor 302 drives the gear 304 set on the output shaft to rotate. Then, under the action of the meshing of the gear 304 and the gear teeth 307, and under the action of the guide rod 308, the adjustment plate 305 is moved, thereby adjusting the relative position between the first perforation 3011 and the second perforation 3051. This allows for the adjustment of the air permeability between the first perforation 3011 and the second perforation 3051. Increased air permeability enhances the heat dissipation effect, allowing heat to be carried away more quickly, thereby reducing the temperature.

[0074] In one embodiment, the mounting mechanism 4 includes a mounting bracket 401 disposed inside the power supply housing 1. The mounting bracket 401 has a cross-shaped cross-section, and both ends of the mounting bracket 401 are provided with fixing plates 402. The fixing plates 402 are connected to the mounting partition 105 by nuts 403 that mate with the mounting threaded holes 1051. A through hole 404 is provided in the middle of the side wall of the fixing plate 402, penetrating the mounting bracket 401. A plurality of ventilation holes 405 are provided on the outer side of the mounting bracket 401. The nuts 403 and the through holes 404 are connected by nuts 403. The spacing between the vents 405 is equal to the spacing between the two sets of mounting threaded holes 1051, thus enabling the installation of different devices. This allows different devices to make maximum use of the space inside the power supply box 1, greatly improving the adaptability of the power supply device to different devices. At the same time, the connecting hole 404 and the vent 405 can be connected to the outside of the power supply box 1, allowing the heat generated in the middle of the power supply box 1 to interact with the external air through the connecting hole 404 and the vent 405, thus improving the heat dissipation effect.

[0075] The working principle of the mounting mechanism 4 is as follows: The mounting frame 401 has fixing plates 402 at both ends, and the fixing plates 402 are connected by nuts 403 that mate with the mounting threaded holes 1051 on the mounting partition 105. Installers can select appropriate positions for the mounting threaded holes 1051 on the mounting partition 105 according to the size, shape, and installation requirements of the equipment; align the holes on the fixing plates 402 with the selected mounting threaded holes 1051, and then tighten them with nuts 403 to securely install the mounting frame 401 onto the mounting partition 105. Since the distance between the nuts 403 and the vent holes 405 is equal to the distance between two adjacent sets of mounting threaded holes 1051, the mounting frame 401 can be flexibly adjusted in its installation position on the mounting partition 105 according to the actual needs of the equipment.

[0076] When the power supply unit is working, heat is generated inside the power supply housing 1, especially in the middle position. The connecting hole 404 and the vent hole 405 can connect the hot air in the middle of the power supply housing 1 with the outside air to form air convection. The outside cold air can enter the inside of the power supply housing 1 through the connecting hole 404, while the inside hot air can be discharged through the connecting hole 404, thereby accelerating the dissipation of heat and improving the heat dissipation effect.

[0077] In one embodiment, such as Figure 9 As shown, the internal components of the control motherboard 109 include:

[0078] The data acquisition and processing module 1091 is used to acquire temperature data collected by several temperature sensors 110 and to preprocess the temperature data.

[0079] It should be noted that during the data acquisition process, sensor malfunctions, environmental interference, and other factors may cause anomalies in the acquired temperature data, such as values ​​that are significantly higher or lower than the normal range. In such cases, a normal distribution method can be used to identify and remove outliers in the temperature data. Then, linear interpolation can be used to interpolate the removed or missing temperature data to ensure the integrity of the temperature data.

[0080] The graph model construction module 1092 is used to acquire the location data of the battery pack 106, rectifier inverter 107, monitoring host 108 and control motherboard 109, and construct a digital twin graph model in combination with the structural characteristics of the power supply box 1.

[0081] The process of acquiring the location data of the battery pack 106, rectifier-inverter 107, monitoring host 108, and control motherboard 109, and constructing a digital twin model based on the structural characteristics of the power supply enclosure 1, includes:

[0082] A three-dimensional rectangular coordinate system is established with the geometric center of the power supply box 1 as the origin. The position data of the battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109 are converted into three-dimensional geometric entities. The constraints of the digital model are established with the structural characteristic parameters of the power supply box 1.

[0083] It should be noted that during the installation of the battery pack 106, rectifier-inverter 107, monitoring host 108, and control motherboard 109, the positions of these components can be measured using measuring tools such as a laser rangefinder or measuring ruler. Then, using the geometric center of the power supply enclosure 1 as the origin of the three-dimensional Cartesian coordinate system, the directions of the X, Y, and Z axes are determined. Based on the obtained device position data, the three-dimensional geometric entities of each device are constructed in the three-dimensional Cartesian coordinate system. For devices with relatively regular shapes, such as the cuboid-shaped battery pack 106 and rectifier-inverter 107, the corresponding cuboid models can be drawn using 3D modeling software (such as SolidWorks, AutoCAD, etc.) or programming languages ​​(such as the Matplotlib library in Python combined with 3D plotting functions) based on their length, width, height dimensions, and position coordinates.

[0084] For devices with complex shapes, such as the monitoring host 108 and the control motherboard 109, an approximation method can be used for modeling. For example, the monitoring host 108 can be approximated as a cuboid, adjusted according to its actual size and position; the control motherboard 109 can be considered as a flat cuboid, and its position can be determined based on its installation location within the power supply enclosure 1. By constructing three-dimensional geometric entities, the spatial distribution of each device within the power supply enclosure 1 can be visually displayed.

[0085] Furthermore, by analyzing the structural characteristics of the power supply enclosure 1, including its dimensions (length, width, height), material (e.g., metal, plastic), internal layout (e.g., partitions, supports), and the location and size of ventilation openings, constraints are established, including spatial constraints and thermal constraints. Specifically, spatial constraints for equipment installation are established based on the dimensions and internal layout of the power supply enclosure. Thermal constraints are established by considering the material of the power supply enclosure and the ventilation openings.

[0086] Based on constraints and three-dimensional geometric entities, an initial graph network is constructed.

[0087] It should be noted that a graph network is a mathematical structure composed of nodes and edges, used to represent relationships between objects. In this invention, nodes represent the various devices within the power supply enclosure 1 (such as the battery pack 106, rectifier-inverter 107, etc.) and the power supply enclosure itself, while edges represent the connections or interactions between devices or between devices and the power supply enclosure 1. When constructing the initial graph network, the battery pack 106, rectifier-inverter 107, monitoring host 108, control motherboard 109, and power supply enclosure 1 are defined as nodes in the graph network. Each node can contain device attribute information, such as device type, number, and location coordinates. Edges in the graph network are defined based on the physical connections, electrical connections, or thermal conduction relationships between devices or between devices and the enclosure. For example, since there is an electrical connection between the battery pack 106 and the rectifier-inverter 107, an edge can be established between their corresponding nodes. During the construction of the graph network, the previously established constraints are applied. For example, when adding an edge, it is checked whether the two nodes connected by the edge satisfy the spatial constraints; if the distance between the two devices is less than the specified minimum spacing, the edge is not allowed to be established.

[0088] The cooling fan 5 and the adjustment mechanism 3 are abstracted as dynamic boundary nodes, and the speed attribute of the cooling fan 5 and the opening attribute of the adjustment mechanism 3 are mapped to the variable impedance attribute of the corresponding edge in the initial graph network to obtain the second-level initial graph network.

[0089] It should be noted that the cooling fan 5 plays a crucial role in the heat dissipation process of the power supply enclosure 1, and its operating status (such as speed) affects the airflow and heat dissipation effect within the enclosure. The cooling fan 5 can be abstracted as a dynamic boundary node, which can reflect its operating status in real time. The adjustment mechanism 3 is typically used to control certain parameters within the power supply enclosure 1, such as the opening degree of the vents. The adjustment mechanism 3 can be abstracted as another dynamic boundary node, and its opening attribute can reflect the degree to which the adjustment mechanism 3 regulates the environmental parameters within the power supply enclosure 1.

[0090] In the initial graph network, the cooling fan 5 has a relationship of heat exchange or airflow with related devices or areas, which can be represented by edges. The speed attribute of the cooling fan 5 is mapped to the variable impedance attribute of these edges. For example, when the speed of the cooling fan 5 increases, the impedance of the edge decreases, indicating smoother airflow and improved heat exchange efficiency; conversely, when the speed decreases, the impedance of the edge increases, airflow is obstructed, and heat exchange efficiency decreases.

[0091] For the regulating mechanism 3, its opening attribute is mapped to the variable impedance attribute of its associated edge. For example, the larger the opening of the vent regulating mechanism, the smaller the impedance of the corresponding edge, and the greater the airflow; the smaller the opening, the greater the impedance of the edge, and the smaller the airflow. Through this mapping method, the dynamic attributes of the cooling fan 5 and the regulating mechanism 3 are integrated into the initial graph network to obtain a secondary initial graph network, enabling the graph network to more accurately reflect the actual operating conditions inside the power supply enclosure 1.

[0092] The real-time data stream from temperature sensor 110 is integrated into a secondary initial graph network, and the thermodynamic state of the secondary initial graph network is activated and initialized to obtain a digital twin graph model.

[0093] It should be noted that, firstly, the data interface between the temperature sensor 110 and the secondary initial graph network ensures that the real-time data collected by the temperature sensor 110 can be accurately and timely transmitted to the graph network. Data transmission can be achieved through wired communication (such as RS-485, Ethernet, etc.) or wireless communication (such as Wi-Fi, ZigBee, etc.). Then, the temperature data collected by the temperature sensor 110 is mapped to the corresponding nodes or edges in the secondary initial graph network. Based on thermodynamic principles such as heat conduction, convection, and radiation, a thermodynamic model of the secondary initial graph network is established. This model can describe the transfer and distribution of heat within the power supply box, considering the influence of factors such as equipment heating, cooling fan 5 heat dissipation, and adjustment mechanism 3 on temperature. The real-time data stream from the temperature sensor 110 is input into the thermodynamic model to activate and initialize the thermodynamic state of the secondary initial graph network. Based on the real-time temperature data, the thermodynamic parameters of each node and edge, such as temperature and heat flow, are calculated. By continuously updating the data from temperature sensor 110, the thermodynamic state of the graph network is adjusted in real time, enabling it to accurately reflect the actual temperature distribution and heat exchange within the power supply box, thereby obtaining a digital twin graph model.

[0094] The signal generation module 1093 is used to perform thermodynamic simulation based on the preprocessed temperature data using a digital twin model, and generate dynamic coordinated control signals for the regulating mechanism 3 and the cooling fan 5 based on the simulation results.

[0095] Specifically, based on the preprocessed temperature data, a digital twin model is used to perform thermodynamic simulation, and dynamic coordinated control signals for the regulating mechanism 3 and the cooling fan 5 are generated based on the simulation results, including:

[0096] Based on the preprocessed temperature data, and combined with the operating characteristics of the battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109, the temperature data of each location inside the power supply box 1 are interpolated and estimated to obtain the temperature field of the entire space.

[0097] Specifically, based on the preprocessed temperature data and combined with the operating characteristics of the battery pack 106, rectifier-inverter 107, monitoring host 108, and control motherboard 109, the temperature data at various locations inside the power supply enclosure 1 are interpolated and estimated to obtain the overall temperature field, including:

[0098] Based on the operating characteristics of the battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109, heat source models of the battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109 are constructed respectively.

[0099] It should be noted that for devices such as the battery pack 106, rectifier-inverter 107, monitoring host 108, and control motherboard 109, the heat generation is calculated based on their operating principles and relevant physical formulas. For example, for the battery pack, the heat generation can be calculated using Joule's law Q=I based on its charging and discharging current, voltage, and internal resistance. 2 Rt (where Q is heat, I is current, R is resistance, and t is time) is used to calculate the heat generated during charging and discharging. For rectifier-inverter converters, power loss can be calculated based on their input and output power and efficiency, thus yielding the heat generation. Due to the internal heat conduction process of the equipment, the equipment is divided into different regions, and heat conduction equations are established based on factors such as the thermal conductivity and temperature gradient of each region's materials. For example, for a monitoring host, components such as the CPU, memory, and hard drive can be considered as different heat source regions, and heat transfer between these regions is described using heat conduction equations. This results in a heat source model.

[0100] The preprocessed temperature data is associated with the heat source model of the monitoring host 108 to determine the temperature reference area;

[0101] Specifically, the preprocessed temperature data is correlated with the heat source model of the monitoring host 108 to determine the temperature reference area, including:

[0102] Collect real-time operating parameters of the monitoring host 108, and use the heat source model of the monitoring host 108 to determine the theoretical temperature of the surface of the monitoring host 108.

[0103] It should be noted that the hardware and software operating parameters of the monitoring host 108 are collected and input into the heat source model. For example, the current heat output of the CPU is determined based on the CPU utilization and power consumption curves; the heat output of the memory is calculated based on the memory usage and the heat characteristics of the memory modules. Then, the model combines the internal heat conduction equations, convective heat transfer coefficients, and radiative heat transfer formulas to calculate the theoretical temperature at various locations on the surface of the monitoring host 108.

[0104] The temperature data preprocessed by temperature sensor 110 is compared with the theoretical surface temperature of monitoring host 108. If the absolute value of the deviation exceeds the preset threshold, the parameters of the heat source model are adjusted until the deviation between the corrected theoretical temperature and the measured temperature does not exceed the preset threshold, so as to achieve dynamic correlation between the preprocessed temperature data and the heat source model of the monitoring host.

[0105] It should be noted that when the absolute value of the deviation exceeds the preset threshold, it indicates a significant difference between the heat source model and the actual situation, requiring adjustment of the model parameters. The basis for adjustment includes the magnitude and direction of the temperature deviation, the actual operating conditions of the equipment, and past experience. For example, if the measured temperature is higher than the theoretical temperature, it may be necessary to increase the heat source's heating power parameter or adjust the thermal conductivity coefficient; if the measured temperature is lower than the theoretical temperature, it may be necessary to decrease the heating power parameter or adjust heat dissipation-related parameters.

[0106] Using the installation coordinates of the temperature sensor 110 on the outside of the monitoring host 108 as the center, and combined with the physical dimensions of the monitoring host 108, a three-dimensional spatial range is defined as the temperature reference area.

[0107] It should be noted that the physical dimensions of the monitoring host 108 include length, width, and height. When defining the temperature reference area, factors such as the distribution of heat sources inside the equipment, the heat dissipation method, and the measurement range and accuracy of the temperature sensor are considered. Centered on the installation coordinates of the temperature sensor, a three-dimensional spatial range of a cuboid or sphere is defined according to the physical dimensions of the monitoring host 108 as the temperature reference area.

[0108] Based on the heat source model of battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109, the spatial distance from any spatial location inside the power supply box 1 to battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109 is calculated, and a heat weight matrix of each spatial location affected by different heat sources is constructed.

[0109] Specifically, based on the heat source models of battery pack 106, rectifier-inverter 107, monitoring host 108, and control motherboard 109, the spatial distances from any location inside the power supply enclosure 1 to battery pack 106, rectifier-inverter 107, monitoring host 108, and control motherboard 109 are calculated, and a heat weight matrix for each location affected by different heat sources is constructed, including:

[0110] The internal space of the power supply box 1 is divided into several three-dimensional grid units according to a preset precision, and the coordinates of the center point of each grid unit are determined.

[0111] Specifically, the internal space of the power supply enclosure 1 is divided using a uniform method, that is, it is divided at the same intervals along the three dimensions (length, width, and height) of the power supply enclosure.

[0112] The spatial distances from the center point of each grid cell to the battery pack 106, rectifier-inverter 107, monitoring host 108, and control motherboard 109 are calculated using the three-dimensional distance formula.

[0113] Specifically, in three-dimensional space, the distance d between two points can be obtained by extending the Pythagorean theorem to three-dimensional space, and by calculating the square root of the sum of the squares of the differences between the two points on the three coordinate axes.

[0114] The real-time heat intensity is obtained from the heat source models of the battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109, and normalized. The distance attenuation factor is calculated in combination with the spatial distance.

[0115] It should be noted that the distance attenuation factor reflects the degree to which heat decreases with increasing distance. Generally speaking, the farther away from the heat source, the less heat is received, and the smaller the distance attenuation factor. Specifically, an inverse proportional function or other suitable function can be used to calculate the distance attenuation factor.

[0116] Based on the distance attenuation factor, the basic thermal weight is calculated, and a thermal weight matrix is ​​constructed to reflect the influence of the battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109 on the weight.

[0117] It should be noted that the basic thermal weight represents the relative degree to which each grid cell is affected by the heat from various devices. It comprehensively considers the real-time heat intensity of the devices and the distance attenuation factor, reflecting the magnitude of the device's contribution to the grid cell's temperature. The basic thermal weight can be obtained by multiplying the normalized heat intensity by the distance attenuation factor. For example, for a certain grid cell, the normalized heat intensity of battery pack 106 is I. battery The distance decay factor is f battery (d) Then the grid cell is subject to the basic thermal weight W of the battery pack 106. battery =I battery· f battery (d). Similarly, the basic thermal weight W of the grid cell caused by the rectifier-inverter 107, the monitoring host 108, and the control motherboard 109 can be calculated. inverter W monitor W mainboard The thermal weight matrix is ​​an n×4 matrix (assuming the power supply enclosure is divided into n grid cells), where each row corresponds to a grid cell, and each column corresponds to the basic thermal weight of the battery pack 106, rectifier inverter 107, monitoring host 108, and control motherboard 109 for that grid cell.

[0118] Based on the weighted average interpolation algorithm, the temperature of the temperature reference region is used, combined with the influence weight of each heat source model on the target spatial location in the heat weight matrix, to calculate the temperature value of all grid cells inside the power supply box 1, and obtain the full space temperature field.

[0119] Based on the weighted average interpolation algorithm, using the temperature of the temperature reference region and combining the influence weights of each heat source model on the target spatial location in the thermal weight matrix, the temperature values ​​of all grid cells inside the power supply box 1 are calculated, resulting in the full-space temperature field including:

[0120] Extract the spatial coordinate range and temperature values ​​of the temperature reference region, and use them as the known data point set for the weighted average interpolation algorithm;

[0121] For each grid cell to be interpolated within the power supply enclosure 1, the weight value of its influence by each heat source is queried from the thermal weight matrix, and the distance attenuation weight is calculated based on the relative positional relationship between the cell and each temperature reference region.

[0122] It should be noted that the thermal weight matrix reflects the relative degree to which each grid cell inside the power supply enclosure is affected by heat from different heat sources (such as battery packs, rectifiers, inverters, etc.). For each grid cell to be interpolated, the specific weight value of the influence of each heat source on that cell can be found according to its row index in the thermal weight matrix. The distance attenuation weight can also be calculated using an inverse proportional function.

[0123] The thermal impact weight and distance attenuation weight are fused to generate a comprehensive interpolation weight for each grid cell relative to each temperature reference region, and the comprehensive interpolation weight is then normalized.

[0124] Based on the normalized comprehensive interpolation weight, the temperature values ​​of the temperature reference region are calculated by weighted average to obtain the final temperature estimate of each grid cell. After traversing all grid cells, the full-space temperature field is output.

[0125] The entire space temperature field is used as the initial state and input into the digital twin model. Based on the opening degree of the current adjustment mechanism 3 and the variable impedance network under the speed of the cooling fan 5, dynamic thermodynamic simulation is performed to predict the temperature change in the future preset time period and identify temperature risk areas.

[0126] It should be noted that inputting the entire space temperature field as the initial state into the digital twin model means that the model can perform subsequent simulations and analyses based on the current actual temperature distribution. The entire space temperature field data is transmitted to the digital twin model via a data interface. Specifically, the spatial coordinates and corresponding temperature values ​​of each grid cell are organized into a specific data format, such as a CSV file or a specific binary data structure, and then the data is imported into the software environment where the digital twin model runs via a software interface.

[0127] In the digital twin model, the variable impedance network is used to simulate thermodynamic processes such as heat conduction, heat convection, and heat radiation inside the power supply enclosure 1. The opening degree of the regulating mechanism 3 and the rotation speed of the cooling fan 5 affect the characteristics of the thermal impedance network. For example, the regulating mechanism 3 is a device that controls the size of the vents; changes in its opening degree alter the airflow channel area, thus affecting the intensity of heat convection. Different rotation speeds of the cooling fan 5 result in different airflow speeds, which in turn affect the heat dissipation effect and thermal impedance.

[0128] Furthermore, the digital twin model, based on the input full-space temperature field and the current opening degree of the regulating mechanism 3 and the speed of the cooling fan 5, combined with a variable impedance network, simulates the heat transfer and change process inside the power supply enclosure 1. It uses numerical calculation methods (such as the finite element method and the finite difference method) to progressively calculate the temperature changes of each grid cell over a preset time period. Based on the predicted temperature changes and a pre-set temperature safety threshold, it identifies areas where the temperature may exceed the safety threshold, i.e., temperature risk areas. The temperature safety threshold can be determined based on factors such as the equipment's heat resistance and safe operation requirements.

[0129] Based on the location of the temperature risk area and the impedance network characteristics in the digital twin model, a target optimization function is established with the goal of reducing the temperature of the risk area to within the safe threshold.

[0130] It should be noted that the impedance network characteristics in the digital twin model reflect the ease or difficulty of heat transfer within the power supply enclosure 1. Different impedance network characteristics will lead to different effects of the control mechanisms 3 and cooling fan 5 on temperature. The objective of the optimization function is to reduce the temperature in the temperature risk zone to within a safe threshold. For example, if the safe temperature threshold is T... safe The current temperature in the temperature risk area is T. risk Then the objective can be expressed as making T risk ≤T safe The objective optimization function is typically a multivariate function, with variables including the opening degree x of the regulating mechanism 3 and the rotational speed y of the cooling fan 5. The function can be represented as F(x,y), and its objective is to minimize (or maximize, depending on the specific optimization direction) F(x,y) while satisfying the constraint that the temperature in the temperature risk zone drops to within a safe threshold. For example, F(x,y) can be a function that comprehensively measures the temperature reduction effect and control cost: F(x,y) = w1·ΔT + w2·C(x,y), where ΔT is the temperature reduction in the temperature risk zone, C(x,y) is the control cost (such as energy consumption) related to the opening degree of the regulating mechanism 3 and the rotational speed of the cooling fan 5, and w1 and w2 are weighting coefficients used to balance the temperature reduction effect and control cost.

[0131] The objective optimization function is solved using the particle swarm genetic algorithm to obtain the optimal opening combination of the regulating mechanism 3 and the optimal speed of the cooling fan 5, and then converted into driving signals to form dynamic cooperative control signals.

[0132] It should be noted that the Particle Swarm Optimization (PSO) Genetic Algorithm combines the advantages of Particle Swarm Optimization (PSO) and Genetic Algorithms. PSO simulates the collective behavior of flocks of birds or schools of fish, allowing particles to search for the optimal solution in the solution space. Particles update their velocity and position based on their own historical best position and the historical best position of the group. Genetic Algorithms, on the other hand, simulate the evolutionary process of organisms, including selection, crossover, and mutation, to continuously optimize individuals in the population. Combining these two algorithms improves search efficiency and global convergence. When solving the objective function, a particle swarm is first initialized, with each particle representing a combination of the opening degree of the regulating mechanism 3 and the rotational speed of the cooling fan 5. Then, the fitness value of each particle is calculated according to the objective function. The fitness value reflects the effectiveness of the control strategy corresponding to that particle in reducing the temperature in the temperature risk zone to within the safe threshold. Next, the particle swarm is continuously optimized through operations of PSO and Genetic Algorithms (such as particle velocity and position updates, selection, crossover, and mutation) until the optimal solution that meets the objective requirements is found, namely the optimal combination of the opening degree of the regulating mechanism 3 and the optimal rotational speed of the cooling fan 5. After obtaining the optimal opening combination of the regulating mechanism 3 and the optimal speed of the cooling fan 5, they need to be converted into corresponding drive signals. For example, a drive signal for the drive motor 302 and a drive signal for the cooling fan 5 are generated.

[0133] The collaborative control module 1094 is used to coordinate the control of the adjustment mechanism 3 and the cooling fan 5 based on the dynamic collaborative control signal, so as to achieve heat dissipation inside the power supply box 1.

[0134] It should be noted that the regulating mechanism 3 and the cooling fan 5 complement each other during the heat dissipation process. The regulating mechanism 3 mainly adjusts the airflow channel by changing the size of the vents, affecting the intensity and direction of heat convection; while the cooling fan 5 provides power to accelerate airflow and enhance the heat dissipation effect. For example, in the initial heat dissipation stage of the power supply box 1, the regulating mechanism 3 can first appropriately increase its opening to allow natural airflow, while the cooling fan 5 operates at a lower speed to provide some aerodynamic force; as the temperature rises, the regulating mechanism 3 further increases its opening, and the cooling fan 5 also increases its speed accordingly, forming a stronger airflow and rapidly reducing the temperature. In addition, during operation, if the regulating mechanism 3 or the cooling fan 5 malfunctions, the dynamic coordination control signal will make corresponding adjustments. For example, if a certain regulating mechanism 3 is stuck and cannot increase its opening, the control signal will promptly increase the opening of other adjustable mechanisms 3 and increase the speed of the cooling fan 5 to compensate for the insufficient heat dissipation caused by the failure of the regulating mechanism 3. At the same time, the control system will issue a fault alarm signal to remind maintenance personnel to carry out maintenance.

[0135] To facilitate understanding of the above technical solutions of the present invention, the working principle or operation method of the present invention in actual process will be described in detail below.

[0136] In practical applications, firstly, intelligent monitoring devices, measurement and control devices, insulation devices, switch quantity acquisition devices, charging devices, communication power devices, and other devices are pre-installed in the power supply enclosure 1 of this invention. Then, according to the size of these devices, they are compactly installed in the power supply enclosure 1 through the installation mechanism 4, so as to maximize the space utilization in the power supply enclosure 1. Then, during use, the control motherboard 109 collects the temperature of the installed intelligent monitoring devices, measurement and control devices, insulation devices, switch quantity acquisition devices, charging devices, communication power devices, and other devices. When the temperature reaches the preset threshold, the cooling fan 5 is started, and the airflow is adjusted by the adjustment mechanism 3. The cooling fan 5 exchanges heat between the heat inside the power supply enclosure 1 and the cold air outside, thereby achieving rapid cooling of the temperature inside the power supply enclosure 1 and ensuring the normal operation of each device in the power supply enclosure 1.

[0137] In summary, by utilizing the above-mentioned technical solution of the present invention, the present invention has a reasonable and reliable structure, and can be flexibly installed in the power supply box 1 according to different equipment conditions, greatly improving space utilization and equipment adaptability, achieving an efficient layout under a compact integrated design, and further improving the applicability of the power supply device. By setting the adjustment mechanism 3, the ventilation size of the first perforation 3011 can be adjusted. When the temperature inside the power supply box 1 is too high, the position of the first perforation 3011 relative to the second perforation 3051 can be adjusted by the drive motor 302, thereby adjusting the airflow inside the power supply box 1 to achieve rapid temperature reduction. By setting the installation mechanism 4, different devices can be installed, allowing for maximum space utilization within the power supply enclosure 1. This greatly improves the adaptability of the power supply unit to different devices. Simultaneously, the connecting hole 404 and the vent 405 can connect to the outside of the power supply enclosure 1, allowing heat generated in the middle of the enclosure to interact with the external air, thus improving heat dissipation. This invention achieves high fidelity for the power supply enclosure 1 and its internal components by establishing a spatial coordinate system and activating the thermodynamic state using a digital twin model. Physical mapping, incorporating dynamic boundary nodes and variable impedance properties, accurately reflects the action characteristics of heat dissipation components; thermodynamic simulation, combined with the full-space temperature field obtained based on heat source modeling, benchmark region calibration, thermal weight matrix quantization, and weighted average interpolation, can predict temperature risk areas in advance; then, by solving the optimization function through particle swarm genetic algorithm, the optimal cooperative control signal is generated, which not only ensures that the temperature risk area is reduced to the safe threshold, but also achieves efficient coordination between the adjustment mechanism 3 and the cooling fan 5, ultimately significantly improving the accuracy, initiative, and reliability of heat dissipation in the power supply box 1, perfectly adapting to the space constraints and stable operation requirements of compact devices.

[0138] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0139] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A compact integrated power supply device based on heat source analysis, characterized in that, include: Power supply enclosure (1); A cover plate (2) is provided at the top of the power supply box (1), and the power supply box (1) and the cover plate (2) are fixedly connected by bolts; Adjustment mechanism (3) is embedded on both sides of the power supply box (1); Several installation mechanisms (4) are installed inside the power supply box (1); A cooling fan (5) is located on one side of the power supply housing (1); The power supply box (1) has mounting holes (101) on both sides that cooperate with the adjustment mechanism (3). One side wall of the power supply box (1) has a groove (102) and the inner wall of the groove (102) has several ventilation holes (103). A dustproof plate (104) is provided on one side of the inner wall of the groove (102). The power supply box (1) is provided with a mounting partition (105). Inside the power supply box (1) and above the mounting mechanism (4), there is a battery pack (106), a rectifier inverter (107), a monitoring host (108) and a control motherboard (109), and several temperature sensors (110) are provided on the outside of the monitoring host (108). The mounting partition (105) has a square cross-section, and the sidewall of the mounting partition (105) is provided with a plurality of mounting thread holes (1051).

2. The compact integrated power supply device based on heat source analysis according to claim 1, characterized in that, The adjustment mechanism (3) includes a mounting plate (301) disposed inside the mounting hole (101), a drive motor (302) disposed on one side of the mounting plate (301), a protective shell (303) disposed on the outside of the drive motor (302), and the output shaft of the drive motor (302) passing through the side wall of the mounting plate (301) and having a gear (304) disposed thereon. An adjustment plate (305) is symmetrically arranged on the other side of the mounting plate (301). An extension plate (306) is provided at one end of the adjustment plate (305). A plurality of gear teeth (307) that mesh with the gear (304) are provided at the bottom end of the extension plate (306). A plurality of guide rods (308) that are connected to the mounting plate (301) are embedded at one end of the extension plate (306). The mounting plate (301) has a plurality of first through holes (3011) symmetrically opened on its side wall, and the cross-section of the first through hole (3011) is a V-shaped structure. The side wall of the adjustment plate (305) is provided with a plurality of second through holes (3051), and the shape of the second through holes (3051) is the same as the shape of the first through hole (3011).

3. A compact integrated power supply device based on heat source analysis according to claim 2, characterized in that, The mounting mechanism (4) includes a mounting bracket (401) disposed inside the power supply box (1). The mounting bracket (401) has a cross-shaped cross section and a fixing plate (402) is provided at both ends of the mounting bracket (401). The fixing plate (402) is connected to the mounting partition (105) by a nut (403) that mates with the mounting threaded hole (1051). The fixing plate (402) has a connecting hole (404) through the mounting bracket (401) in the middle of its side wall, and the mounting bracket (401) has several ventilation holes (405) on its outer side. The distance between the nut (403) and the vent hole (405) is equal to the distance between the two adjacent sets of mounting threaded holes (1051).

4. A compact integrated power supply device based on heat source analysis according to claim 3, characterized in that, The internal components of the control motherboard (109) include: The data acquisition and processing module (1091) is used to acquire temperature data collected by several temperature sensors (110) and preprocess the temperature data. The graph model construction module (1092) is used to obtain the location data of the battery pack (106), rectifier inverter (107), monitoring host (108) and control motherboard (109), and to construct a digital twin graph model in combination with the structural characteristics of the power supply box (1); The signal generation module (1093) is used to perform thermodynamic simulation based on the preprocessed temperature data using a digital twin model, and to generate dynamic coordinated control signals for the regulating mechanism (3) and the cooling fan (5) based on the simulation results. The collaborative control module (1094) is used to coordinate the control of the adjustment mechanism (3) and the cooling fan (5) based on the dynamic collaborative control signal to achieve heat dissipation inside the power supply box (1).

5. A compact integrated power supply device based on heat source analysis according to claim 4, characterized in that, The process of acquiring the location data of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109), and constructing a digital twin model in conjunction with the structural characteristics of the power supply enclosure (1), includes: A three-dimensional rectangular coordinate system is established with the geometric center of the power supply box (1) as the origin. The position data of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109) are converted into three-dimensional geometric entities. The constraints of the digital model are established with the structural characteristic parameters of the power supply box (1). Based on constraints and three-dimensional geometric entities, an initial graph network is constructed. The cooling fan (5) and the adjustment mechanism (3) are abstracted as dynamic boundary nodes, and the speed attribute of the cooling fan (5) and the opening attribute of the adjustment mechanism (3) are mapped to the variable impedance attribute of the corresponding edge in the initial graph network to obtain the second-level initial graph network. The real-time data stream from the temperature sensor (110) is integrated into the secondary initial graph network, and the thermodynamic state of the secondary initial graph network is activated and initialized to obtain the digital twin graph model.

6. A compact integrated power supply device based on heat source analysis according to claim 5, characterized in that, The process of performing thermodynamic simulations using a digital twin model based on preprocessed temperature data, and generating dynamic coordinated control signals for the regulating mechanism (3) and cooling fan (5) based on the simulation results, includes: Based on the preprocessed temperature data, combined with the operating characteristics of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109), the temperature data of each location inside the power supply box (1) are interpolated and estimated to obtain the full space temperature field. The entire space temperature field is used as the initial state and input into the digital twin model. Based on the opening degree of the current adjustment mechanism (3) and the variable impedance network under the speed of the cooling fan (5), dynamic thermodynamic simulation is performed to predict the temperature change in the future preset time period and identify temperature risk areas. Based on the location of the temperature risk area and the impedance network characteristics in the digital twin model, a target optimization function is established with the goal of reducing the temperature of the risk area to within the safe threshold. The target optimization function is solved by using the particle swarm genetic algorithm to obtain the optimal opening combination of the regulating mechanism (3) and the optimal speed of the cooling fan (5), and then converted into driving signals to form dynamic cooperative control signals.

7. A compact integrated power supply device based on heat source analysis according to claim 6, characterized in that, Based on the preprocessed temperature data, and combined with the operating characteristics of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109), the temperature data of each location inside the power supply box (1) are interpolated and estimated to obtain the full-space temperature field, including: Based on the operating characteristics of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109), heat source models of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109) are constructed respectively. The preprocessed temperature data is associated with the heat source model of the monitoring host (108) to determine the temperature reference area; Based on the heat source model of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109), the spatial distance from any spatial location inside the power supply box (1) to the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109) is calculated, and the heat weight matrix of each spatial location affected by different heat sources is constructed. Based on the weighted average interpolation algorithm, the temperature of the temperature reference area is used, and the influence weight of each heat source model on the target spatial location in the heat weight matrix is ​​combined to calculate the temperature value of all grid cells inside the power supply box (1) to obtain the full space temperature field.

8. A compact integrated power supply device based on heat source analysis according to claim 7, characterized in that, The step of associating the preprocessed temperature data with the heat source model of the monitoring host (108) to determine the temperature reference area includes: Collect real-time operating parameters of the monitoring host (108), and use the heat source model of the monitoring host (108) to determine the theoretical temperature of the surface of the monitoring host (108); The temperature data preprocessed by the temperature sensor (110) is compared with the theoretical surface temperature of the monitoring host (108) to calculate the deviation. If the absolute value of the deviation exceeds the preset threshold, the parameters of the heat source model are adjusted until the deviation between the corrected theoretical temperature and the measured temperature does not exceed the preset threshold, so as to achieve dynamic correlation between the preprocessed temperature data and the heat source model of the monitoring host. Using the installation coordinates of the temperature sensor (110) on the outside of the monitoring host (108) as the center, and combined with the physical dimensions of the monitoring host (108), a three-dimensional spatial range is defined as the temperature reference area.

9. A compact integrated power supply device based on heat source analysis according to claim 7, characterized in that, The heat source model based on the battery pack (106), rectifier-inverter (107), monitoring host (108), and control motherboard (109) calculates the spatial distance from any spatial location inside the power supply box (1) to the battery pack (106), rectifier-inverter (107), monitoring host (108), and control motherboard (109), and constructs a heat weight matrix for each spatial location affected by different heat sources, including: The internal space of the power supply box (1) is divided into several three-dimensional grid units according to a preset precision, and the coordinates of the center point of each grid unit are determined. The spatial distances from the center point of each grid cell to the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109) are calculated using the three-dimensional distance formula. The real-time heat intensity is obtained from the heat source models of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109) and normalized. The distance attenuation factor is calculated in combination with the spatial distance. Based on the distance attenuation factor, the basic thermal weight is calculated, and a thermal weight matrix is ​​constructed to reflect the influence of the battery pack (106), rectifier inverter (107), monitoring host (108), and control motherboard (109).

10. A compact integrated power supply device based on heat source analysis according to claim 7, characterized in that, The weighted average interpolation algorithm uses the temperature of the temperature reference region and combines the influence weights of each heat source model on the target spatial location in the heat weight matrix to calculate the temperature values ​​of all grid cells inside the power supply box (1), resulting in the full-space temperature field including: Extract the spatial coordinate range and temperature values ​​of the temperature reference region, and use them as the known data point set for the weighted average interpolation algorithm; For each grid cell to be interpolated in the power supply box (1), the weight value of its influence by each heat source is queried from the thermal weight matrix, and the distance attenuation weight is calculated based on the relative position relationship between the cell and each temperature reference region. The thermal impact weight and distance attenuation weight are fused to generate a comprehensive interpolation weight for each grid cell relative to each temperature reference region, and the comprehensive interpolation weight is then normalized. Based on the normalized comprehensive interpolation weight, the temperature values ​​of the temperature reference region are calculated by weighted average to obtain the final temperature estimate of each grid cell. After traversing all grid cells, the full-space temperature field is output.

Images