PCB positioning buffer mechanism and vehicle-mounted domain control terminal

Abstract

The application provides a PCB positioning buffer mechanism and a vehicle-mounted domain control terminal, and relates to the technical field of vehicle-mounted equipment positioning. The mechanism comprises a mounting base, a PCB and a positioning sleeve. The mounting base is provided with at least one positioning column, the PCB is provided with a mounting hole corresponding to the position of the positioning column, and the positioning sleeve is mounted in the mounting hole. The positioning sleeve is provided with a positioning hole, the inner wall of the positioning hole is provided with a plurality of convex ribs extending along the axial direction of the positioning hole and protruding radially from the inner wall of the positioning hole. The inner diameter of the positioning hole is greater than the outer diameter of the positioning column, and the gap between the positioning hole and the positioning column ranges from 0.005mm to 0.03mm, so that the convex ribs and the outer surface of the positioning column remain in a non-contact state under static working conditions. The protruding height of the convex ribs in the radial direction is h, which satisfies 0.005mm ≤ h ≤ a / 2, so that the convex ribs and the outer surface of the positioning column form elastic contact under vibration working conditions.

Description

Technical Field

[0001] This invention relates to the field of vehicle-mounted equipment positioning technology, and in particular to a PCB positioning buffer mechanism and a vehicle-mounted domain control terminal. Background Technology

[0002] In the field of automotive electronic equipment, the connection and positioning method between the printed circuit board (PCB) and the device housing directly determines the mating reliability of the high-speed signal connector between the boards and the fatigue life of the solder joints under vibration.

[0003] In existing technologies, rigid positioning schemes use metal positioning pins that fit tightly with positioning holes. Although they can achieve a static positioning accuracy of ±0.05mm, vibration energy is directly transmitted to the weld joint, resulting in weld joint cracking failure time generally less than 150 hours.

[0004] While the elastic buffer solution can improve vibration resistance by adding a rubber pad or foam between the PCB and the housing, the positioning accuracy after assembly is extremely poor and cannot meet the precision mating requirements of ±0.1mm for automotive high-speed connectors.

[0005] The separate assembly solution has independent rigid positioning pins and rubber damping washers, but it has problems such as more parts, complicated assembly, and large cumulative tolerances.

[0006] Therefore, the existing technology has long suffered from the technical contradiction of being unable to achieve both high positioning accuracy and high vibration buffering performance. Thus, there is an urgent need to provide a PCB positioning buffer mechanism and an on-board domain control terminal to solve the problems existing in the current technology to a certain extent. Summary of the Invention

[0007] The purpose of this invention is to provide a PCB positioning buffer mechanism and an on-board domain control terminal, so as to solve, to a certain extent, the problem that it is difficult to achieve both high-precision positioning and high buffering performance in PCB positioning structures.

[0008] This invention provides a PCB positioning buffer mechanism, comprising a mounting base, a PCB board, and a positioning sleeve. The mounting base has at least one positioning post, and the PCB board has mounting holes corresponding to the positions of the positioning posts. The positioning sleeve is installed within the mounting holes. The positioning sleeve has a positioning hole, and the inner wall of the positioning hole has multiple ribs extending axially along the positioning hole and protruding radially beyond the inner wall of the positioning hole. The inner diameter of the positioning hole is larger than the outer diameter of the positioning post, and the gap between the positioning hole and the positioning post is 'a', satisfying 0.005mm ≤ a ≤ 0.03mm, so that under static conditions, the ribs remain in non-contact with the outer surface of the positioning post. The radial protrusion height of the ribs is 'h', satisfying 0.005mm ≤ h ≤ a / 2, so that under vibration conditions, the ribs form elastic contact with the outer surface of the positioning post.

[0009] The positioning posts are multiple, and the PCB board has multiple mounting holes, at least one of which is a circular hole, and the remaining mounting holes are oblong holes or waist-shaped holes.

[0010] Specifically, the positioning sleeve includes a first limiting flange, a limiting body, and a second limiting flange. The outer diameters of the first limiting flange and the second limiting flange are both larger than the outer diameter of the limiting body, so as to form a positioning groove on the outside of the limiting body. The PCB board is embedded in the positioning groove, so that the first limiting flange and the second limiting flange respectively abut against the surfaces of opposite sides of the PCB board to form axial limiting.

[0011] Specifically, the limiting body is interference-fitted with the mounting hole, and the interference amount is 0.02mm-0.05mm.

[0012] Specifically, an axial buffer protrusion is formed on the upper surface of the first limiting flange and / or the lower surface of the second limiting flange.

[0013] Furthermore, the axial buffer protrusion is annular and is arranged circumferentially along the upper surface of the first limiting flange and / or the lower surface of the second limiting flange.

[0014] The number of the raised ribs is 3-6 and they are evenly distributed along the circumference. The axial length of the raised ribs is the same as the axial length of the positioning sleeve.

[0015] Specifically, the cross-sectional shape of the rib is semi-circular, triangular, or trapezoidal.

[0016] Furthermore, the gap between the positioning hole and the positioning post is in the range of 0.008mm-0.025mm, and the positioning sleeve is made of high and low temperature resistant rubber.

[0017] Compared with existing technologies, the PCB positioning buffer mechanism provided by this invention has the following advantages: The PCB positioning buffer mechanism provided by this invention includes a mounting base, a PCB board, and a positioning sleeve. The mounting base has at least one positioning post, and the PCB board has mounting holes corresponding to the positions of the positioning posts. The positioning sleeve is installed in the mounting holes. The positioning sleeve has a positioning hole, and the inner wall of the positioning hole has multiple ribs extending axially along the positioning hole and protruding radially beyond the inner wall of the positioning hole. The inner diameter of the positioning hole is larger than the outer diameter of the positioning post, and the gap between the positioning hole and the positioning post is 'a', satisfying 0.005mm ≤ a ≤ 0.03mm, so that the ribs and the outer surface of the positioning post remain in a non-contact state under static conditions. The radial protrusion height of the ribs is 'h', satisfying 0.005mm ≤ h ≤ a / 2, so that the ribs and the outer surface of the positioning post form elastic contact under vibration conditions.

[0018] Therefore, this analysis shows that the mounting base in this application provides a supporting foundation for the entire mechanism, and is typically part of the bottom shell or housing of the electronic device. At least one positioning post is provided on the base. The positioning post is a rigid cylinder used to provide a radial positioning reference.

[0019] Mounting holes are provided on the PCB board at the positions corresponding to the positioning posts, and the positioning sleeve is fixedly installed in the mounting holes. The positioning sleeve is made of elastic material and has a positioning hole inside. Multiple radially protruding ribs are provided on the inner wall of the positioning hole along the axial direction. In this application, the inner diameter of the positioning hole is larger than the outer diameter of the positioning post, thereby forming a gap between the two. The gap range is a, and satisfies 0.005mm≤a≤0.03mm.

[0020] The lower limit of 0.005mm is used to avoid assembly jamming caused by machining tolerances, surface roughness, or dust particles, while the upper limit of 0.03mm ensures that the static positioning accuracy can be controlled within ±0.05mm, thereby meeting the mating requirements of automotive high-speed connectors.

[0021] Meanwhile, the protrusion height of the rib in the radial direction is h, which satisfies 0.005mm≤h≤a / 2. Thus, through the rib, under static or low vibration conditions, there is still a gap of at least a / 2 between the top of the rib and the outer surface of the positioning post. Therefore, the rib and the positioning post remain in a non-contact state and will not generate any elastic pressure or friction. The PCB board achieves automatic centering and obtains high-precision positioning by relying on the tiny radial gap.

[0022] When the vehicle is moving and generates high-frequency random vibrations, the PCB board undergoes radial displacement relative to the mounting base. When the displacement exceeds ah, the top of the rib begins to contact the outer surface of the positioning post and is compressed, generating elastic restoring force, which converts the vibration energy into internal dissipation of the rib.

[0023] Meanwhile, as the compression increases, the radial stiffness rises nonlinearly, effectively limiting the ultimate displacement and protecting the solder joints and connectors from impact.

[0024] It is understandable that, since the positioning sleeve in this application has both positioning and buffering functions, multiple functions can be achieved with just one structural component, reducing the number of parts, avoiding accumulated tolerances, and resolving the technical contradiction in the prior art that high-precision positioning and high vibration-resistant buffering cannot be achieved simultaneously. This results in a static accuracy of ±0.05mm and zero cracking of weld points after 1000 hours of vibration testing under dynamic conditions.

[0025] In addition, the present invention also provides an in-vehicle domain control terminal, including a top cover, a front panel, a heat sink, a battery box, and the aforementioned PCB positioning buffer mechanism; the base, the top cover, and the front panel enclose a shielding cavity, the heat sink is installed on the outside of the top cover and is in contact with the heat-generating device on the PCB board, and the battery box is detachably installed on the outside of the base.

[0026] In the vehicle-mounted domain control terminal provided in this application, the mounting base is the bottom shell of the domain control terminal. The bottom shell is integrally stamped from SECC cold-rolled steel sheet, which has high strength and electromagnetic shielding performance.

[0027] Furthermore, it also includes a top cover, a front panel, a heat sink, and a battery box. The bottom shell, top cover, and front panel together form a fully enclosed shielded cavity to house the PCB board and other electronic components, and the splicing surfaces are coated with conductive shielding paint to meet automotive-grade electromagnetic compatibility (EMC) requirements.

[0028] The heat sink is mounted on the outside of the top cover and is tightly bonded to heat-generating components on the PCB board, such as the main control chip and power management chip, via thermally conductive pads, forming a closed heat dissipation path. Heat is conducted from the heat-generating components to the top cover via the thermally conductive pads, and then dissipated into the surrounding air by the heat sink on the outside of the top cover.

[0029] Since the positioning buffer mechanism provided by this invention can control the static positioning accuracy of the PCB board within ±0.05mm, the relative positional deviation between the heat sink and the heat-generating device is extremely small. Good adhesion can be achieved without using excessively thick thermal conductive pads, thereby reducing the heat dissipation contact thermal resistance by more than 30%.

[0030] The battery compartment is independent of the main unit and is detachably mounted on the outside of the base. Specifically, it can be bolted to the side or bottom of the bottom shell. When it is time to replace the battery, there is no need to remove the top cover, front panel, or PCB board. Simply loosen the fastening bolts of the battery compartment to quickly remove the battery. The replacement time is less than 1 minute.

[0031] It is understandable that the vehicle-mounted domain control terminal provided in this application integrates multiple advantages such as high-precision positioning, high vibration resistance, full electromagnetic shielding, efficient heat dissipation and convenient maintenance, and is particularly suitable for demanding vehicle-mounted application scenarios such as intelligent driving domain, cockpit domain, and T-BOX. Attached Figure Description

[0032] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the PCB positioning buffer mechanism provided in an embodiment of the present invention; Figure 2 A partially enlarged view of the PCB positioning buffer mechanism provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the positioning sleeve in the PCB positioning buffer mechanism provided in an embodiment of the present invention; Figure 4 This is an exploded view of the vehicle-mounted domain control terminal provided in an embodiment of the present invention.

[0034] In the diagram: 1-PCB board; 2-positioning sleeve; 201-positioning hole; 202-protruding rib; 203-first limiting flange; 204-limiting body; 205-second limiting flange; 206-positioning groove; 3-base; 301-positioning post; 3011-locking hole; 4-locking component; 5-top cover; 6-front panel; 7-heat sink; 8-battery box; 801-battery; 9-interference fit; 10-thermal conductive pad; 11-heat-generating device; 'a' represents the range of the gap between the positioning hole and the positioning post. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] In the description of the embodiments of this application, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0038] In the description of the embodiments of this application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0039] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0040] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also the different orientations of the device during use or operation.

[0041] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0042] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0043] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have various constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis that they can be implemented by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0044] like Figure 1 Combination Figure 2 As shown, the present invention provides a PCB positioning buffer mechanism, including a mounting base 3, a PCB board 1, and a positioning sleeve 2; the mounting base 3 is provided with at least one positioning post 301, and the PCB board 1 has a mounting hole corresponding to the position of the positioning post 301, and the positioning sleeve 2 is installed in the mounting hole; the positioning sleeve 2 has a positioning hole 201, and the inner wall of the positioning hole 201 has a plurality of ribs 202 extending axially along the positioning hole 201 and protruding radially from the inner wall of the positioning hole 201; the inner diameter of the positioning hole 201 is larger than the outer diameter of the positioning post 301, and the gap between the positioning hole 201 and the positioning post 301 is a, satisfying 0.005mm ≤ a ≤ 0.03mm, so that the ribs 202 and the outer surface of the positioning post 301 remain in a non-contact state under static conditions; the protrusion height of the ribs 202 in the radial direction is h, satisfying 0.005mm ≤ h ≤ a / 2, so that the ribs 202 and the outer surface of the positioning post 301 form elastic contact under vibration conditions.

[0045] Compared with existing technologies, the PCB positioning buffer mechanism provided by this invention has the following advantages: The PCB positioning buffer mechanism provided by this invention has a mounting base 3 that provides a supporting foundation for the entire mechanism and is typically part of the bottom shell or housing of the electronic device. At least one positioning post 301 is provided on the base 3. The positioning post 301 is a rigid cylinder used to provide a radial positioning reference.

[0046] A mounting hole is provided on the PCB board 1 at the position corresponding to the positioning post 301, and the positioning sleeve 2 is fixedly installed in the mounting hole. The positioning sleeve 2 is made of elastic material and has a positioning hole 201 inside. Multiple radially protruding ribs 202 are provided on the inner wall of the positioning hole 201 along the axial direction. In this application, the inner diameter of the positioning hole 201 is larger than the outer diameter of the positioning post 301, thereby forming a gap between the two. The gap range is a, and satisfies 0.005mm≤a≤0.03mm.

[0047] The lower limit of 0.005mm is used to avoid assembly jamming caused by machining tolerances, surface roughness, or dust particles, while the upper limit of 0.03mm ensures that the static positioning accuracy can be controlled within ±0.05mm, thereby meeting the mating requirements of automotive high-speed connectors.

[0048] Meanwhile, the protrusion height of the rib 202 in the radial direction is h, which satisfies 0.005mm≤h≤a / 2. Thus, through the rib 202, under static or low vibration conditions, there is still a gap of at least a / 2 between the top of the rib 202 and the outer surface of the positioning post 301. Therefore, the rib 202 and the positioning post 301 remain in a non-contact state and will not generate any elastic pressure or friction. The PCB board 1 achieves automatic centering and obtains high-precision positioning by relying on the tiny radial gap.

[0049] When the vehicle is moving and generates high-frequency random vibrations, the PCB board 1 undergoes radial displacement relative to the mounting base 3. When the displacement exceeds ah, the top of the rib 202 begins to contact the outer surface of the positioning post 301 and is compressed, generating elastic restoring force, which converts the vibration energy into internal dissipation of the rib 202.

[0050] Meanwhile, as the compression increases, the radial stiffness rises nonlinearly, effectively limiting the ultimate displacement and protecting the solder joints and connectors from impact.

[0051] It is understandable that, since the positioning sleeve 2 in this application has both positioning and buffering functions, multiple functions can be achieved with just one structural component, reducing the number of parts, avoiding accumulated tolerances, and solving the technical contradiction of not being able to balance high-precision positioning and high vibration-resistant buffering in the prior art. This achieves the technical effect of static accuracy up to ±0.05mm and zero cracking of weld points after 1000 hours of vibration testing under dynamic conditions.

[0052] It should be added here that, such as Figure 1 Combination Figure 2As shown, the positioning post 301 and the positioning sleeve 2 in this application form a stepped structure at their docking position. That is, the diameter of the overall positioning post 301 is larger than the diameter of the connection position with the positioning sleeve 2, thus realizing the stepped structure. This stepped structure can support the positioning sleeve 2, keeping it at its upper limit in the axial direction and ensuring the positioning stability of the overall structure. At the same time, the positioning post 301 in this application has a locking hole 3011 extending axially and at least longer than the length of the docking position with the positioning sleeve 2. After the positioning sleeve 2 and the positioning post 301 are assembled, the positioning sleeve 2 and the positioning post 301 can be stably connected by screwing the locking member 4 into the locking hole 3011. The locking member 4 in this application can be a bolt, and the locking hole 3011 is a screw hole.

[0053] Optionally, there are multiple positioning posts 301 in this application, and multiple mounting holes are formed on the PCB board 1, and at least one of the multiple mounting holes is a circular hole, while the remaining mounting holes are oblong holes or waist-shaped holes.

[0054] When mounting a larger PCB board 1 or improving connection stability, multiple positioning posts 301 are typically required. However, due to machining tolerances, the actual center distance between the multiple positioning posts 301 cannot be exactly equal to the theoretical center distance between the multiple mounting holes on the PCB board 1.

[0055] If all mounting holes are set to circular holes, it may lead to over-constraint, preventing the second and subsequent positioning pins 301 from being inserted smoothly, or causing internal stress on the PCB board 1 after forced insertion, resulting in board deformation or stress on the connector. Therefore, this application sets at least one of the multiple mounting holes to a circular hole, and sets the remaining mounting holes to oblong holes or waist-shaped holes.

[0056] The circular hole, together with the corresponding positioning post 301 and positioning sleeve 2, forms a precise positioning reference, determining the position of the PCB board 1 in the horizontal plane. The oblong or waist-shaped hole provides additional accommodating space in its length direction, allowing the corresponding positioning post 301 to undergo relative displacement in this direction. This absorbs the manufacturing tolerance of the center distance between multiple positioning posts 301, ensuring positioning accuracy while avoiding over-constraint or assembly failure caused by tolerance.

[0057] Optionally, such as Figures 1-3 As shown, the positioning sleeve 2 in this application includes a first limiting flange 203, a limiting body 204, and a second limiting flange 205. The outer diameters of the first limiting flange 203 and the second limiting flange 205 are both larger than the outer diameter of the limiting body 204, so as to form a positioning groove 206 on the outside of the limiting body 204. The PCB board 1 is embedded in the positioning groove 206, so that the first limiting flange 203 and the second limiting flange 205 respectively abut against the surfaces of opposite sides of the PCB board 1 to form axial limiting.

[0058] In this application, the outer diameters of the first limiting flange 203 and the second limiting flange 205 are both larger than the outer diameter of the limiting body 204, thereby forming a surrounding positioning groove 206 on the outside of the limiting body 204. During assembly, the PCB board 1 is embedded in the positioning groove 206, so that the first limiting flange 203 and the second limiting flange 205 abut against the opposite side surfaces of the PCB board 1, thereby achieving axial positioning of the PCB board 1, that is, preventing the positioning sleeve 2 from moving or falling out relative to the PCB board 1 in the axial direction.

[0059] Meanwhile, since the two limiting flanges are located on both sides of the PCB board 1, the positioning sleeve 2 can maintain a stable axial position after installation and will not move up or down due to vibration.

[0060] Optionally, such as Figure 2 As shown, the limiting body 204 in this application is interference-fitted with the mounting hole, and the interference amount 9 is 0.02mm-0.05mm.

[0061] An interference fit means that the outer diameter of the limiting body 204 is slightly larger than the diameter of the mounting hole on the PCB board 1. During assembly, a certain pressure needs to be applied to press the positioning sleeve 2 into the mounting hole.

[0062] Preferably, the lower limit of the interference fit 9 in this application is 0.02mm, which can ensure that the positioning sleeve 2 is firmly embedded in the PCB board 1 and will not loosen due to vibration or temperature changes, while the upper limit of 0.05mm avoids excessive interference fit 9, which may cause installation difficulties or excessive stress on the PCB board 1.

[0063] Through interference fit, a reliable radial fixation is formed between the positioning sleeve 2 and the PCB board 1. The two will not easily rotate relative to each other or slide axially, so that the positioning sleeve 2 can move together with the PCB board 1 when vibrating, thereby accurately transmitting the displacement to the contact section between the rib 202 and the positioning post 301, improving the connection reliability.

[0064] Optionally, the upper surface of the first limiting flange 203 and / or the lower surface of the second limiting flange 205 in this application are formed with axial buffer protrusions.

[0065] In the vehicle vibration environment, in addition to radial vibration, there is also acceleration impact in the direction perpendicular to the plane of PCB board 1. When PCB board 1 is subjected to axial vibration, it will be transmitted to positioning sleeve 2, and positioning sleeve 2 will directly transmit it to positioning post 301. Without buffering, PCB board 1 will be subjected to the impact of axial vibration.

[0066] This application provides an axial buffer protrusion on the surface of the limiting flange, allowing the axial buffer protrusion to contact the positioning post 301 under static conditions. When axial vibration occurs, the axial buffer protrusion is compressed, generating an elastic restoring force to absorb the axial vibration energy. Accordingly, the axial buffer protrusion in this application can be provided on the upper surface of the first limiting flange 203, i.e., the side facing the top cover 5, or on the lower surface of the second limiting flange 205, i.e., the side facing the base 3, or simultaneously on both surfaces, making the positioning sleeve 2 omnidirectional and facilitating installation.

[0067] Preferably, the axial buffer protrusion in this application is annular and is arranged circumferentially along the upper surface of the first limiting flange 203 and / or the lower surface of the second limiting flange 205.

[0068] The ring structure can provide uniform axial buffer stiffness in the entire circumference direction. It can achieve a consistent buffering effect regardless of the axial tilt or offset at any angle. Moreover, compared with multiple discrete protrusions, the ring protrusion is easier to manufacture by molding and is less likely to cause stress concentration.

[0069] The annular axial buffer protrusion in this application can be integrally injection molded with the limiting flange without the need for additional parts.

[0070] Optionally, the number of ribs 202 in this application is 3-6 and they are evenly distributed along the circumference. The axial length of the ribs 202 is the same as the axial length of the positioning sleeve 2.

[0071] If there are fewer than 3 ribs 202, it may not be able to provide isotropic buffer stiffness, that is, the buffer performance is inconsistent under vibration in different directions. If there are more than 6 ribs, the ribs 202 will be too dense, which will increase the processing difficulty on the one hand, and may make the radial stiffness of the positioning sleeve 2 too large on the other hand, thus weakening the buffer effect.

[0072] Accordingly, the ribs 202 in this application are preferably four in number and are evenly distributed along the circumferential direction at 90°, so that two ribs 202 can participate in contact in any radial direction, thus ensuring the isotropic nature of the buffering performance.

[0073] The axial length of the rib 202 is the same as the axial length of the positioning sleeve 2, which means that the rib 202 extends from the inner wall of one end of the positioning sleeve 2 to the inner wall of the other end, forming a continuous convex structure. This allows the rib 202 to maintain the maximum contact length with the positioning post 301 regardless of the depth of the positioning post 301 inserted into the positioning hole 201, or when the PCB board 1 has slight axial movement. This provides a stable and predictable elastic restoring force.

[0074] Meanwhile, the elongated rib 202 also facilitates the use of axial core pulling in the mold, reducing manufacturing complexity.

[0075] Preferably, the cross-sectional shape of the rib 202 in this application is semi-circular, triangular or trapezoidal.

[0076] More preferably, the gap between the positioning hole 201 and the positioning post 301 in this application is in the range of 0.008mm-0.025mm, and the positioning sleeve 2 is made of high and low temperature resistant rubber.

[0077] The preferred range of radial clearance in this application is 0.008 mm to 0.025 mm, and more preferably 0.01 mm to 0.02 mm. This range is a more optimal range derived after comprehensively considering conventional machining accuracy, surface roughness, thermal expansion and contraction caused by temperature changes, and ease of assembly. Meanwhile, the positioning sleeve 2 is made of high and low temperature resistant rubber, specifically silicone rubber, fluororubber, EPDM rubber, thermoplastic elastomers, etc. This material needs to meet the following performance indicators: Shore hardness of 55 HA to 65 HA, preferably 60 HA; operating temperature range of -40℃ to 125℃, with hardness variation not exceeding ±5 HA within this temperature range; and compression set ≤15%, preferably ≤10%. These parameters ensure that the positioning sleeve 2 has stable mechanical properties over a wide temperature range, and that the gap and the effectiveness of the rib 202 will not change due to low-temperature hardening or high-temperature softening. At the same time, the low compression set ensures that the height of the rib 202 and the radial gap will not deteriorate due to material creep throughout the entire life cycle, thus solving the stringent requirements of automotive environments for the durability and environmental adaptability of rubber parts.

[0078] In addition, such as Figure 4 As shown, the present invention also provides an in-vehicle domain control terminal, including a top cover 5, a front panel 6, a heat sink 7, a battery box 8, and the aforementioned PCB positioning buffer mechanism; the base 3, the top cover 5, and the front panel 6 enclose a shielding cavity, the heat sink 7 is installed on the outside of the top cover 5 and is attached to the heat-generating device 11 on the PCB board 1, and the battery box 8 is detachably installed on the outside of the base 3.

[0079] In the vehicle-mounted domain control terminal provided in this application, the mounting base 3 is the bottom shell of the domain control terminal. The bottom shell is integrally stamped from SECC cold-rolled steel sheet, which has high strength and electromagnetic shielding performance.

[0080] Furthermore, it also includes a top cover 5, a front panel 6, a heat sink 7, and a battery box 8. The bottom shell, top cover 5, and front panel 6 together form a fully enclosed shielded cavity to house the PCB board 1 and other electronic components, and the splicing surfaces are coated with conductive shielding paint to meet automotive-grade electromagnetic compatibility (EMC) requirements.

[0081] The heat sink 7 is installed on the outside of the top cover 5 and is in close contact with the heat-generating devices 11 on the PCB board 1, such as the main control chip and power management chip, through the thermally conductive pad 10, forming a closed heat dissipation path. Heat is conducted from the heat-generating device 11 to the top cover 5 through the thermally conductive pad 10, and then dissipated into the surrounding air by the heat sink 7 on the outside of the top cover 5.

[0082] Since the positioning buffer mechanism provided by the present invention can control the static positioning accuracy of the PCB board 1 within ±0.05mm, the relative positional deviation between the heat sink 7 and the heat-generating device 11 is extremely small. Good fit can be achieved without using an excessively thick thermal conductive pad 10, thereby reducing the heat dissipation contact thermal resistance by more than 30%.

[0083] The battery box 8 is independent of the main unit and is detachably installed on the outside of the base 3. Specifically, it can be locked to the side or bottom of the bottom shell with bolts. When it is necessary to replace the battery 801, there is no need to remove the top cover 5, the front panel 6 or the PCB board 1. Simply loosen the fastening bolts of the battery box 8 to quickly remove the battery 801. The replacement time is less than 1 minute.

[0084] It is understandable that the vehicle-mounted domain control terminal provided in this application integrates multiple advantages such as high-precision positioning, high vibration resistance, full electromagnetic shielding, efficient heat dissipation and convenient maintenance, and is particularly suitable for demanding vehicle-mounted application scenarios such as intelligent driving domain, cockpit domain, and T-BOX.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A PCB positioning buffer mechanism, characterized in that, Includes mounting base, PCB board, and positioning sleeve; At least one positioning post is provided on the mounting base, and a mounting hole is formed on the PCB board corresponding to the position of the positioning post. The positioning sleeve is installed in the mounting hole. The positioning sleeve has a positioning hole, and the inner wall of the positioning hole has a plurality of ribs that extend axially along the positioning hole and protrude radially from the inner wall of the positioning hole. The inner diameter of the positioning hole is larger than the outer diameter of the positioning post, and the gap between the positioning hole and the positioning post is in the range of a, satisfying 0.005mm≤ a≤ 0.03mm, so that the rib and the outer surface of the positioning post remain in a non-contact state under static working conditions. The protrusion height of the rib in the radial direction is h, which satisfies 0.005mm ≤ h ≤ a / 2, so that the rib forms elastic contact with the outer surface of the positioning post under vibration conditions.

2. The PCB positioning buffer mechanism according to claim 1, characterized in that, There are multiple positioning posts, and multiple mounting holes are formed on the PCB board accordingly. At least one of the multiple mounting holes is a circular hole, and the remaining mounting holes are oblong holes or waist-shaped holes.

3. The PCB positioning buffer mechanism according to claim 1, characterized in that, The positioning sleeve includes a first limiting flange, a limiting body, and a second limiting flange. The outer diameters of the first limiting flange and the second limiting flange are both larger than the outer diameter of the limiting body, so as to form a positioning groove on the outside of the limiting body. The PCB board is embedded in the positioning groove, so that the first limiting flange and the second limiting flange respectively abut against the surfaces of the opposite sides of the PCB board to form axial limiting.

4. The PCB positioning buffer mechanism according to claim 3, characterized in that, The limiting body is interference-fitted with the mounting hole, and the interference amount is 0.02mm-0.05mm.

5. The PCB positioning buffer mechanism according to claim 3, characterized in that, An axial buffer protrusion is formed on the upper surface of the first limiting flange and / or the lower surface of the second limiting flange.

6. The PCB positioning buffer mechanism according to claim 5, characterized in that, The axial buffer protrusion is annular and is arranged circumferentially along the upper surface of the first limiting flange and / or the lower surface of the second limiting flange.

7. The PCB positioning buffer mechanism according to claim 1, characterized in that, The number of raised ribs is 3-6 and they are evenly distributed along the circumference. The axial length of the raised ribs is the same as the axial length of the positioning sleeve.

8. The PCB positioning buffer mechanism according to claim 1, characterized in that, The cross-sectional shape of the rib is semi-circular, triangular, or trapezoidal.

9. The PCB positioning buffer mechanism according to claim 1, characterized in that, The gap between the positioning hole and the positioning post is in the range of 0.008mm-0.025mm, and the positioning sleeve is made of high and low temperature resistant rubber.

10. A vehicle-mounted domain control terminal, characterized in that, It includes a top cover, a front panel, a heat sink, a battery compartment, and a PCB positioning buffer mechanism as described in any one of claims 1-9; The base, the top cover, and the front panel together form a shielding cavity. The heat sink is installed on the outside of the top cover and is attached to the heat-generating device on the PCB board. The battery box is detachably installed on the outside of the base.

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