A u-shaped manifold micro-channel cold plate structure and a manufacturing method thereof
By using a U-shaped manifold microchannel cold plate structure, the heat dissipation problem of high-performance computing chips and high-power-density IGBT modules is solved, achieving low voltage drop, efficient heat exchange and temperature uniformity, making it suitable for efficient thermal management in high heat flux scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI JIAOTONG UNIV
- Filing Date
- 2026-04-14
- Publication Date
- 2026-07-14
AI Technical Summary
Traditional air cooling and conventional liquid cooling technologies are insufficient to meet the heat dissipation requirements of high-performance computing chips and high-power-density IGBT modules, resulting in problems such as high flow pressure drop, high pumping power consumption, and poor chip surface temperature uniformity.
By adopting a U-shaped manifold microchannel cold plate structure, a multi-stage fluid distribution and collection manifold system is constructed within the cold plate substrate. Short-range, parallel microchannel units are designed, and combined with precision etching, micro-milling, or metal additive manufacturing technologies, high-reliability, low-cost mass production is achieved.
It significantly reduces system flow resistance and pressure drop, enhances local convective heat transfer intensity, enables the cooling medium to flow uniformly through each microchannel, improves temperature distribution uniformity, reduces pumping power consumption, and enhances heat removal capability.
Smart Images
Figure CN122395896A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of heat dissipation for high-power electronic devices, and relates to a U-shaped manifold microchannel cold plate structure and its manufacturing method. Background Technology
[0002] This invention relates to the field of thermal management technology for electronic devices, and more particularly to a high-performance integrated cold plate based on a manifold microchannel structure and its manufacturing method. With the rapid increase in heat flux density of electronic components such as high-performance computing chips and high-power-density IGBT modules, traditional air cooling and conventional liquid cooling technologies are no longer sufficient to meet their heat dissipation requirements. Specifically, while conventional long straight microchannel cold plates have a large heat exchange area, they suffer from core defects such as extremely high flow pressure drop, huge pumping power consumption, and poor uniformity of chip surface temperature along the flow direction. This severely restricts their energy efficiency and application reliability in high heat flux scenarios. To overcome these technical bottlenecks, this invention provides an innovative manifold microchannel design scheme. The core of this scheme lies in constructing a multi-stage fluid distribution and collection manifold system within the cold plate substrate, parallelly introducing the cooling medium into a series of short-range, parallel microchannel units, and then rapidly discharging it through a collection manifold. This structural design fundamentally shortens the forced convection path of the cooling medium within a single microchannel, thereby significantly reducing the overall flow resistance and pressure drop of the system. More importantly, this design, by optimizing the manifold cross-section and layout, ensures that the cooling medium flows uniformly and synchronously through each microchannel heat exchange unit. This not only significantly enhances the local convective heat transfer intensity and efficiently breaks down the thermal boundary layer, but also results in an extremely uniform temperature distribution across the entire heat exchange surface, effectively eliminating the problems of local hot spots and large axial temperature differences present in traditional designs. To achieve high reliability and low-cost mass production of this complex three-dimensional internal flow channel structure, this invention further incorporates advanced metal forming and joining processes. Specifically, precision etching, micro-milling, or metal additive manufacturing techniques can be used to form the flow channel substrate, which is then metallurgically bonded to the cover plate using vacuum diffusion welding or high-temperature brazing processes, forming a fully sealed, high-strength integral structure. This ensures the long-term sealing reliability of the cold plate under high pressure and high vibration conditions, completely eliminating the risk of leakage. Furthermore, the cold plate of this invention can be flexibly adapted to various cooling media such as deionized water and engineering fluorinated liquids, and can form a closed-loop liquid cooling system with remote radiators, pumps, and pipelines to achieve direct and precise cooling of single or multiple high heat flux chips. In summary, the U-shaped manifold microchannel cold plate provided by this invention, through its unique fluid distribution architecture and integrated manufacturing process, achieves heat removal capabilities and excellent temperature uniformity that surpass traditional solutions with extremely low pumping power consumption. It provides a highly competitive key technology solution for efficient thermal management of next-generation data center servers, electric vehicle drive systems, high-power lasers and other equipment. Summary of the Invention
[0003] To address the current technological shortcomings, this invention proposes a U-shaped manifold microchannel cold plate structure and its manufacturing method, in order to solve the problems mentioned in the background.
[0004] To achieve the above objectives, the present invention provides the following technical solution: a U-shaped manifold microchannel cold plate structure, comprising a main channel layer; The main channel layer is internally machined with a liquid inlet groove and a manifold cavity for the input and output of coolant; The manifold layer is located at the bottom of the main channel layer. The manifold layer has U-shaped manifold structure inlets for splitting the input coolant into multiple jets. The irregularly shaped microchannel is located at the bottom of the manifold layer, allowing multiple jets of coolant to enter the irregularly shaped microchannel in a vertical impact manner, thereby breaking the thermal boundary layer and enhancing heat transfer.
[0005] Furthermore, a liquid inlet is provided at the top of the main channel layer; an inlet is provided on one side wall of the liquid inlet, several diversion holes are provided on the bottom wall of the liquid inlet, and an outlet is provided on the side of the main channel layer near the liquid inlet.
[0006] Furthermore, the manifold includes an upper opening inside the channel layer and a lower opening inside the channel layer; the bottom inner side of the main channel layer has an upper opening inside the channel layer, and the bottom outer side of the main channel layer near the upper opening inside the channel layer also has a lower opening inside the channel layer.
[0007] Furthermore, the manifold layer includes an inner manifold opening and a top manifold plate; the top of the manifold layer is provided with a top manifold plate, and the bottom of the manifold layer is provided with an inner manifold opening. The manifold layer is used to be installed in the main channel layer. The top manifold plate is in contact with the upper inner opening of the channel layer, and the manifold layer is in contact with the lower inner opening of the channel layer.
[0008] Furthermore, a U-shaped manifold structure inlet is provided in the middle of the top plate of the manifold, and manifold layer outlets are provided on both sides of the manifold structure inlet on the top plate of the manifold.
[0009] Furthermore, the irregular microchannel includes a channel top plate and a chip element; the top of the irregular microchannel is provided with a channel top plate for installation inside the manifold opening, and the channel top plate is provided with a chip element.
[0010] Furthermore, the top of the liquid inlet tank has a top opening, and a cover plate is installed inside the top opening for sealing connection.
[0011] Furthermore, the manifold structure inlet itself is a long and narrow interface shape, and the manifold structure inlets are arranged at equal intervals along the U-shaped main channel of the manifold layer.
[0012] A U-shaped manifold microchannel cold plate structure and its manufacturing method are described. The method is applied to a U-shaped manifold microchannel cold plate structure and includes: Step S1: Using a block of metal as the base material, CNC precision milling technology is used to process the cover plate, main channel layer and manifold layer respectively; among them, the top opening, the upper opening inside the channel layer, the lower opening inside the channel layer and the liquid inlet groove are processed on the main channel layer. Step S2: Use a tooth-shaving machine to process the manifold structure inlet, manifold outlet and manifold inner opening in the manifold layer; at the same time, use a tooth-shaving machine to process the irregular microchannel and process the channel top plate on the irregular microchannel. Step S3: The finished cover plate, main channel layer, manifold layer and irregular microchannel are integrally sealed and connected by vacuum pressure atomic diffusion welding or brazing process; When using vacuum pressure atomic diffusion welding, the cover plate needs to be installed on the liquid inlet tank, the manifold layer needs to be installed at the bottom of the main channel layer, so that the top plate of the manifold contacts the upper opening inside the channel layer, and the manifold layer contacts the lower opening inside the channel layer. The irregular microchannel is installed at the bottom of the manifold layer, with the top plate of the channel contacting the opening inside the manifold. After installation, the cover plate, main channel layer, manifold layer and irregular microchannel are placed in the matching mold and pressure of 25-35MPa is applied. The temperature is kept at 550-750℃ for 2-5 hours, and argon-hydrogen mixed gas is introduced throughout the process to prevent oxidation. When using brazing, the oxide layer on the contact surfaces of the cover plate, main channel layer, manifold layer, and irregular microchannel must first be removed. After applying solder, the cover plate is installed on the inlet tank, and the manifold layer is installed at the bottom of the main channel layer, so that the top plate of the manifold contacts the upper opening inside the channel layer, and the manifold layer contacts the lower opening inside the channel layer. The irregular microchannel is installed at the bottom of the manifold layer, with the top plate of the channel contacting the opening inside the manifold. After aligning the cover plate, main channel layer, manifold layer, and irregular microchannel, they are pressed together and welded at 220-350℃ for 25-50 seconds.
[0013] Compared with existing technologies, the present invention has the following advantages: (1) Compared with the existing pure microchannel structure cold plate, the U-shaped manifold microchannel structure cold plate proposed in this invention has better heat dissipation performance under the same heat power and flow rate conditions, with a lower maximum heat source temperature and a more uniform heat source temperature distribution; the introduction of the manifold structure also reduces pressure drop loss and pumping power consumption. It greatly improves the limit of the current high-power cold plate heat dissipation technology in the industry. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the U-shaped manifold microchannel cold plate structure of the present invention.
[0015] Figure 2 This is an exploded structural diagram of the U-shaped manifold microchannel cold plate structure of the present invention.
[0016] Figure 3 This is a schematic diagram of the mainstream channel layer structure of the present invention.
[0017] Figure 4 This is a schematic diagram of the manifold layer structure of the present invention.
[0018] Figure 5 This is a schematic diagram of the irregular microchannel structure of the present invention. Reference numerals: 1. Cover plate; 2. Main channel layer; 3. Manifold layer; 4. Irregular microchannel; 5. Inlet; 6. Diversion hole; 7. Manifold structure inlet; 8. Manifold layer outlet; 9. Outlet; 101. Top opening; 102. Upper opening inside the channel layer; 103. Lower opening inside the channel layer; 104. Liquid inlet tank; 301. Manifold inner opening; 302. Manifold top plate; 41. Channel top plate; 42. Chip element. Detailed Implementation Example 1
[0019] like Figures 1-2 As shown, the present invention provides a technical solution: a U-shaped manifold microchannel cold plate structure, comprising: The main channel layer 2 is internally machined with a liquid inlet groove 104 and a manifold cavity for the input and output of coolant; Manifold layer 3 is located at the bottom of the main channel layer 2. The manifold layer 3 is provided with U-shaped manifold structure inlets 7, which are used to split the input coolant into multiple jets. The irregularly shaped microchannel 4 is disposed at the bottom of the manifold layer 3, allowing multiple jets of coolant to enter the irregularly shaped microchannel 4 in a vertical impact manner, thereby breaking the thermal boundary layer and enhancing heat transfer.
[0020] The main channel layer 2 is provided with an inlet trough 104 at the top; an inlet 5 is provided on one side wall of the inlet trough 104, and several diversion holes 6 are provided on the bottom wall of the inlet trough 104. An outlet 9 is provided on the side of the main channel layer 2 near the inlet trough 104.
[0021] like Figures 3-4 As shown, the confluence cavity includes an upper opening 102 and a lower opening 103 inside the channel layer; the upper opening 102 is provided on the inner side of the bottom of the main channel layer 2, and the lower opening 103 is also provided on the outer side of the bottom of the main channel layer 2 near the upper opening 102.
[0022] The manifold layer 3 includes a manifold inner opening 301 and a manifold top plate 302. The top of the manifold layer 3 is provided with a manifold top plate 302, and the bottom of the manifold layer 3 is provided with a manifold inner opening 301. The manifold layer 3 is used to be installed in the main channel layer 2. The manifold top plate 302 is in contact with the upper opening 102 of the channel layer, and the manifold layer 3 is in contact with the lower opening 103 of the channel layer.
[0023] The top plate 302 of the manifold has a U-shaped manifold structure inlet 7 in the middle part, and the top plate 302 of the manifold has manifold layer outlets 8 on both sides of the manifold structure inlet 7.
[0024] like Figure 5 As shown, the irregular microchannel 4 includes a channel top plate 41 and a chip element 42; the top of the irregular microchannel 4 is provided with a channel top plate 41 for installation in the manifold opening 301, and the channel top plate 41 is provided with a chip element 42.
[0025] The liquid inlet tank 104 has a top opening 101 at the top, and a cover plate 1 is provided inside the top opening 101 for sealing connection.
[0026] Among them, the manifold structure inlet 7 has a narrow and elongated interface shape, and the manifold structure inlet 7 is arranged at equal intervals along the U-shaped main channel of the manifold layer 3.
[0027] The working process of the U-shaped manifold microchannel structure cold plate is as follows: the cooling medium flows in from the inlet 5 and enters the liquid inlet tank 104 sealed by the cover plate 1; the cooling medium is ejected at high speed through the diversion circular hole 6 in the liquid inlet tank 104 to form a directional jet, which is injected into the manifold structure inlet 7 of the manifold layer 3; after being diverted and distributed by the manifold structure inlet 7, multiple jets act on the surface of the chip element 42 corresponding to the irregular microchannel 4 in a vertical impact manner. The jet directly destroys the thermal boundary layer of the inner wall of the microchannel, greatly enhancing the convective heat transfer efficiency, so that the medium can quickly absorb the heat of high-power devices in the short-distance flow of the irregular microchannel 4; at the same time, the uniformly distributed jet makes the surface temperature distribution of the heat source more even, avoiding the generation of local hot spots; After heat exchange, the cooling medium flows through the irregular microchannel 4 to the two manifold outlets 8 under the continuous drive of the pump. After converging at the manifold outlets 8, it enters the main channel layer 2 and finally flows out of the cold plate from the outlet 9 of the main channel layer 2. Throughout the process, the jet design also reduces eddy current losses when the fluid turns, reduces flow pressure drop, and significantly improves the heat dissipation efficiency ratio of the cold plate.
[0028] A U-shaped manifold microchannel cold plate structure and its manufacturing method are described. The method is applied to a U-shaped manifold microchannel cold plate structure and includes: Step S1: Using block metal as the base material, CNC precision milling technology is used to process the cover plate 1, the main channel layer 2 and the manifold layer 3 respectively; among them, the top opening 101, the upper opening inside the channel layer 102, the lower opening inside the channel layer 103 and the liquid inlet groove 104 are processed on the main channel layer 2. Step S2: Then, use a tooth-shaving machine to process the manifold layer 3 to form the manifold structure inlet 7, the manifold layer outlet 8, and the manifold inner opening 301; the manifold structure inlet 7 has a depth of 0.5-1.5mm and a spacing of 0.2-0.5mm; at the same time, use a tooth-shaving machine to process the irregular microchannel 4, and process the channel top plate 41 on the irregular microchannel 4.
[0029] The manifold inlet 7 is typically 1-5mm, the manifold spacing is typically 1.5-3mm, and the number of manifolds is typically 6-12.
[0030] Step S3: The processed cover plate 1, main channel layer 2, manifold layer 3 and irregular microchannel 4 are integrated and sealed together by vacuum pressure atomic diffusion welding or brazing process to ensure the sealing between each layer and the tight contact between the manifold structure and the microchannel. Step S31: When using vacuum pressure atomic diffusion welding, the cover plate 1 needs to be installed on the liquid inlet tank 104, the manifold layer 3 needs to be installed at the bottom of the main channel layer 2, so that the top plate 302 of the manifold is in contact with the upper opening 102 inside the channel layer, and the manifold layer 3 is in contact with the lower opening 103 inside the channel layer. The irregular microchannel 4 is installed at the bottom of the manifold layer 3, and the top plate 41 of the channel is in contact with the opening 301 inside the manifold. The installed cover plate 1, main channel layer 2, manifold layer 3 and irregular microchannel 4 are placed in the matching mold and a pressure of 25-35MPa is applied. The temperature is kept at 550-750℃ for 2-5 hours, and argon-hydrogen mixed gas is introduced throughout the process to prevent oxidation. Step S32: When brazing is used, the oxide layer of the contact surfaces of the cover plate 1, the main channel layer 2, the manifold layer 3 and the irregular microchannel 4 must be removed first. After applying solder, the cover plate 1 is installed on the liquid inlet tank 104, the manifold layer 3 is installed at the bottom of the main channel layer 2, so that the manifold top plate 302 contacts the upper opening 102 inside the channel layer, and the manifold layer 3 contacts the lower opening 103 inside the channel layer. The irregular microchannel 4 is installed at the bottom of the manifold layer 3, and the channel top plate 41 contacts the manifold opening 301 inside the manifold. After aligning the cover plate 1, the main channel layer 2, the manifold layer 3 and the irregular microchannel 4, they are pressed together and the welding is completed by holding at 220-350℃ for 25-50 seconds.
[0031] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A U-shaped manifold microchannel cold plate structure, characterized in that, Including the mainstream channel layer; The main channel layer is internally machined with a liquid inlet groove and a manifold cavity for the input and output of coolant; The manifold layer is located at the bottom of the main channel layer. The manifold layer has U-shaped manifold structure inlets for splitting the input coolant into multiple jets. The irregularly shaped microchannel is located at the bottom of the manifold layer, allowing multiple jets of coolant to enter the irregularly shaped microchannel in a vertical impact manner, thereby breaking the thermal boundary layer and enhancing heat transfer.
2. The U-shaped manifold microchannel cold plate structure according to claim 1, characterized in that: The top of the main channel layer is provided with an inlet tank; an inlet is provided on one side wall of the inlet tank, and several diversion holes are provided on the bottom wall of the inlet tank. An outlet is provided on the side of the main channel layer near the inlet tank.
3. The U-shaped manifold microchannel cold plate structure according to claim 2, characterized in that: The duct cavity includes an upper opening inside the channel layer and a lower opening inside the channel layer; the bottom inner side of the main channel layer has an upper opening inside the channel layer, and the bottom outer side of the main channel layer near the upper opening inside the channel layer also has a lower opening inside the channel layer.
4. The U-shaped manifold microchannel cold plate structure according to claim 3, characterized in that: The manifold layer includes a manifold inner opening and a manifold top plate; the top of the manifold layer is provided with a manifold top plate, and the bottom of the manifold layer is provided with a manifold inner opening. The manifold layer is used to be installed in the main channel layer. The manifold top plate is in contact with the upper opening of the channel layer, and the manifold layer is in contact with the lower opening of the channel layer.
5. The U-shaped manifold microchannel cold plate structure according to claim 4, characterized in that: A U-shaped manifold structure inlet is provided in the middle of the top plate of the manifold, and manifold layer outlets are provided on both sides of the manifold structure inlet on the top plate of the manifold.
6. The U-shaped manifold microchannel cold plate structure according to claim 5, characterized in that: The irregular microchannel includes a channel top plate and a chip element; the top of the irregular microchannel is provided with a channel top plate for installation in the opening inside the manifold, and the chip element is provided on the channel top plate.
7. The U-shaped manifold microchannel cold plate structure according to claim 6, characterized in that: The top of the liquid inlet tank has a top opening, and a cover plate is installed inside the top opening for sealing connection.
8. The U-shaped manifold microchannel cold plate structure according to claim 7, characterized in that: The manifold structure inlet itself is a long and narrow interface shape, and the manifold structure inlets are arranged at equal intervals along the U-shaped main channel of the manifold layer.
9. A U-shaped manifold microchannel cold plate structure and its manufacturing method, applied to the U-shaped manifold microchannel cold plate structure described in any one of claims 1-8, characterized in that, include: Step S1: Using a block of metal as the base material, CNC precision milling technology is used to process the cover plate, main channel layer and manifold layer respectively; among them, the top opening, the upper opening inside the channel layer, the lower opening inside the channel layer and the liquid inlet groove are processed on the main channel layer. Step S2: Use a tooth-shaving machine to process the manifold structure inlet, manifold outlet and manifold inner opening in the manifold layer; at the same time, use a tooth-shaving machine to process the irregular microchannel and process the channel top plate on the irregular microchannel. Step S3: The finished cover plate, main channel layer, manifold layer and irregular microchannel are integrally sealed and connected by vacuum pressure atomic diffusion welding or brazing process; When using vacuum pressure atomic diffusion welding, the cover plate needs to be installed on the liquid inlet tank, the manifold layer needs to be installed at the bottom of the main channel layer, so that the top plate of the manifold contacts the upper opening inside the channel layer, and the manifold layer contacts the lower opening inside the channel layer. The irregular microchannel is installed at the bottom of the manifold layer, with the top plate of the channel contacting the opening inside the manifold. After installation, the cover plate, main channel layer, manifold layer and irregular microchannel are placed in the matching mold and pressure of 25-35MPa is applied. The temperature is kept at 550-750℃ for 2-5 hours, and argon-hydrogen mixed gas is introduced throughout the process to prevent oxidation. When using brazing, the oxide layer on the contact surfaces of the cover plate, main channel layer, manifold layer, and irregular microchannel must first be removed. After applying solder, the cover plate is installed on the inlet tank, and the manifold layer is installed at the bottom of the main channel layer, so that the top plate of the manifold contacts the upper opening inside the channel layer, and the manifold layer contacts the lower opening inside the channel layer. The irregular microchannel is installed at the bottom of the manifold layer, with the top plate of the channel contacting the opening inside the manifold. After aligning the cover plate, main channel layer, manifold layer, and irregular microchannel, they are pressed together and welded at 220-350℃ for 25-50 seconds.