Packaging process of IIC explosion-proof electromagnetic valve based on gradient modulus potting
CN122395897APending Publication Date: 2026-07-14HUBEI CHUANGSINUO ELECTRICAL TECH CORP +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUBEI CHUANGSINUO ELECTRICAL TECH CORP
- Filing Date
- 2026-04-14
- Publication Date
- 2026-07-14
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Figure CN122395897A_ABST
Abstract
The application relates to the technical field of electromagnetic valves, in particular to a vehicle-grade IIC explosion-proof electromagnetic valve packaging process based on gradient modulus pouring, which comprises the following: a valve body framework, a pre-embedded shielding component, a gradient pouring layer, a middle-layer flexible buffer layer, a top-layer hard protective layer and a gas-permeable fire-blocking component; the valve body framework is formed by high-strength engineering plastic injection molding; the inside of the valve body framework is separated into an independent lower coil cavity and an upper driving cavity through an intermediate partition plate; the pre-embedded shielding component comprises a metal mesh which is pre-embedded in the inside of the wall thickness of the valve body framework; the application solves the problems of thermal stress, explosion-proof safety and vehicle-grade connection reliability, reduces the weight of the electromagnetic valve to less than 1 / 3 of that of a traditional explosion-proof structure under the premise of meeting the IIC-grade hydrogen environment explosion-proof requirement, effectively solves the cracking problem of SiC devices under high-low temperature impact, and can be widely applied to hydrogen pipeline control in different scenes such as passenger cars and high-power commercial vehicles.
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