A gradient-pitch fin heat sink with an array of turbulence columns and method of operation
By combining gradient-pitched fins and staggered turbulence column arrays, the problem of traditional heat sinks being unable to balance flow resistance and heat transfer capacity in highly integrated electronic devices is solved, achieving efficient heat dissipation and temperature uniformity, and making it suitable for high-vibration and high-reliability scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TAICANG DOW ELECTRIC
- Filing Date
- 2026-04-20
- Publication Date
- 2026-07-14
AI Technical Summary
Traditional finned heat sinks with equal spacing are difficult to meet the heat dissipation requirements in highly integrated and high-power electronic devices. They suffer from problems such as the inability to balance flow resistance and heat transfer capacity, limited boundary layer disruption effect due to the simple arrangement of turbulence columns, limited increase in heat transfer area due to the simple fin structure, and the lack of synergistic enhancement of gradient flow channels and array turbulence in the overall structure.
Gradient-spacing fins are combined with an array of staggered turbulence columns to form a variable cross-section flow channel and a staggered turbulence structure. The turbulence columns disrupt the fluid boundary layer, enhancing the turbulent heat transfer effect. The heat transfer area and fluid disturbance are increased through the surface structure design of the fins.
It significantly improves heat dissipation efficiency and temperature uniformity, reduces flow resistance, and enhances the reliability and lifespan of electronic devices, making it suitable for high-vibration and high-reliability scenarios.
Smart Images
Figure CN122395899A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat sink technology, and more specifically to a gradient-pitch fin heat sink with an array of turbulence-disrupting columns. Background Technology
[0002] As electronic devices evolve towards higher integration, higher power, and miniaturization, the heat flux density of devices continues to increase, making traditional evenly spaced finned heat sinks insufficient to meet heat dissipation demands. Evenly spaced fins tend to form a stable flow boundary layer, resulting in a low heat transfer coefficient. Furthermore, they cannot adapt to operating conditions with uneven heat source distribution, easily leading to problems such as localized overheating and poor temperature uniformity.
[0003] While existing technologies employ turbulence structures to improve heat transfer, they generally suffer from the following drawbacks: 1. With a fixed fin spacing, it is impossible to balance flow resistance and heat transfer capacity. 2. The arrangement of the turbulence columns is simple, the disturbance intensity is insufficient, and the boundary layer disruption effect is limited; 3. The fin structure is simple, and the increase in heat exchange area is limited; 4. The overall structure does not form a synergistic enhancement mechanism between gradient flow channels and array turbulence.
[0004] Therefore, developing a gradient-pitch finned radiator with high heat exchange efficiency, low flow resistance, good temperature uniformity, and reliable structural strength has significant engineering application value. Summary of the Invention
[0005] The purpose of this invention is to provide a gradient-pitch finned heat sink with a turbulence column array to solve the above problems. By using gradient-pitched fins in conjunction with staggered turbulence columns, flow disturbance is enhanced and gradient flow channels are optimized, significantly improving heat dissipation efficiency and temperature uniformity.
[0006] Technical Solution: This invention provides a gradient-pitch finned heat sink with a turbulence column array, comprising: a substrate, a fin assembly, and a turbulence column array. The substrate is made of a high thermal conductivity metal material for mounting a heat source and rapidly conducting heat. The fin assembly is vertically fixed to the upper surface of the substrate, with the fins arranged at a gradient pitch along the fluid flow direction. Several spacing grooves are formed on the fin surface, with the groove depth not exceeding one-third of the fin thickness to enhance convection. The fins are arranged in a gradient staggered manner to form a gradual flow channel. The turbulence column array is disposed between adjacent fins and fixed to the substrate. The turbulence columns are staggered between the fins, and the line connecting the centers of two adjacent rows of turbulence columns forms an angle of 45° or 60° with the fluid flow direction, which can continuously disrupt the fluid boundary layer and enhance the turbulent heat transfer effect.
[0007] Furthermore, in the aforementioned gradient-pitch finned heat sink with a turbulence column array, the adjacent spacing of the fins forms a trapezoidal flow channel, and the flow channels are centrally symmetrical, making the fluid distribution more uniform and reducing local resistance peaks.
[0008] Furthermore, in the aforementioned gradient-pitch finned heat sink with a turbulence column array, the fin height is 5–20 mm, the thickness is 0.1–1 mm, the minimum fin spacing is 1–3 mm, and the maximum spacing is 3–8 mm, adapting to different airflow, air pressure, and heat dissipation power requirements.
[0009] Furthermore, in the aforementioned gradient-pitch finned heat sink with an array of turbulence columns, at least one row of turbulence columns is provided between each adjacent fin. The turbulence columns are cylindrical, square prisms, or hexagonal prisms, with a height consistent with the fin height, a diameter or side length of 0.5-2 mm, and a spacing of 2-5 mm between two adjacent turbulence columns.
[0010] Furthermore, in the aforementioned gradient-pitch finned heat sink with a turbulence column array, the substrate, fin group, and turbulence column array adopt an integrated molding structure, and the material is aluminum alloy, copper alloy, or other metal material with high thermal conductivity. The molding process is extrusion molding, laser melting molding, or metal stamping molding.
[0011] Furthermore, in the aforementioned gradient-pitch finned heat sink with a turbulence column array, the fin surface is provided with several protruding structures, which are hemispherical or pyramidal in shape and uniformly distributed on the fin surface.
[0012] Furthermore, in the aforementioned gradient-pitch finned heat sink with a turbulence column array, the fin surface has a wavy or serrated structural design.
[0013] Furthermore, in the aforementioned gradient-pitch finned heat sink with a turbulence column array, the lower surface of the substrate is provided with a thermally conductive coating, which is a graphene coating, a carbon nanotube coating, or a metal-ceramic coating, with a thickness of 0.01-0.1 mm.
[0014] Furthermore, in the aforementioned gradient-pitch finned heat sink with an array of turbulence columns, the surface of the turbulence columns is provided with several annular grooves. The annular grooves are evenly arranged along the height direction of the turbulence columns, with a groove depth of 0.05-0.2mm and a groove width of 0.1-0.3mm, which are used to enhance the fluid turbulence effect and improve the heat exchange efficiency.
[0015] The present invention also provides a method for operating a gradient-pitch finned heat sink with a turbulence-disrupting column array, comprising the following steps: S1: The lower surface of the substrate of the heat sink is tightly attached to the heat-generating electronic component, and a thermally conductive interface material is applied to the contact surface; S2: Start the cooling fluid source to allow the cooling fluid (such as air or coolant) to flow in from one end of the fin assembly and through the flow channels between the fins; S3: Cooling fluid enters the variable cross-section flow channel composed of gradient-pitched fins. In the region with smaller fin spacing, the fluid velocity increases, enhancing the convective heat transfer coefficient; in the region with larger fin spacing, the flow resistance decreases, and the pressure loss decreases. S4: While flowing through the interfin channel, the cooling fluid continuously impacts the staggered array of turbulence columns. The turbulence columns cause the fluid boundary layer to separate, reattach, and eddy shedding, generating strong local disturbances, disrupting the development of the thermal boundary layer, and significantly improving heat transfer efficiency. S5: The fluid continues to flow over the spacer grooves, protrusions or wavy structures set on the fin surface, further increasing the fluid turbulence and expanding the effective heat exchange area; S6: Finned heat dissipation removes heat generated by the heat-generating element, completing the heat dissipation process.
[0016] As can be seen from the above technical solution, the present invention has the following beneficial effects: The gradient-pitch finned heat sink with a turbulence column array described in the present invention, through the synergistic effect of the gradient-pitch fins and the staggered turbulence column array, accelerates the fluid using a variable cross-section flow channel on the one hand, and disrupts the boundary layer using the turbulence columns on the other hand. The combination of the two greatly enhances the fluid disturbance, making the overall heat transfer coefficient higher than that of the traditional equal-pitch finned heat sink; the turbulence columns are arranged at 45° or 60° staggered, continuously disrupting the boundary layer and significantly improving the convective heat transfer coefficient; the gradient pitch can be optimized according to the heat source distribution, effectively eliminating local hot spots, making the temperature distribution on the substrate surface more uniform, and improving the reliability and lifespan of electronic devices; the substrate, fins and turbulence columns can be integrally molded (such as extrusion molding or metal 3D printing), avoiding the contact thermal resistance and reliability problems caused by welding or gluing, resulting in continuous thermal conduction and high reliability, suitable for high vibration and high reliability scenarios. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of a gradient-pitch finned heat sink with a turbulence column array according to the present invention; Figure 2 This is a side view of the heat sink of the present invention; Figure 3 This is a top view schematic diagram of the arrangement of fins and turbulence columns in this invention; Figure 4 This is a schematic diagram of the single fin structure of the present invention.
[0018] Reference numerals: 1. Substrate; 2. Fin assembly; 21. Fin; 22. Spacing groove; 3. Array of turbulence columns; 31. turbulence column; 4. Guide plate. Detailed Implementation
[0019] Example 1 like Figure 1-4 The illustrated gradient-pitch finned heatsink with a baffle array includes: a substrate 1, a fin group 2, and a baffle array 3. The substrate 1 is a rectangular flat plate extruded from 6063 aluminum alloy, which has good thermal conductivity. Its lower surface is used to contact heat-generating components such as the CPU and is coated with a 0.05mm thick graphene thermally conductive coating (not shown in the figure) to reduce contact thermal resistance. The fin group 2 is vertically and integrally fixed to the upper surface of the substrate 1. The fin assembly 2 includes multiple rows of parallel fins 21. The spacing between adjacent fins 21 is arranged in a gradient staggered manner, and the adjacent flow channels are centrally symmetrical, so that the flow channels are arranged in an alternating expansion-contraction pattern. Multiple spacer grooves 22 are uniformly opened on the surface of each fin 21. The depth of the spacer grooves 22 is 0.15 mm (not exceeding one-third of the fin thickness) and the width is 0.5 mm, which are used to increase the heat exchange area and guide the fluid to generate micro-disturbances. The turbulence column array 3 is also fixed on the upper surface of the substrate 1 and is evenly distributed between adjacent fins 21. Two rows of turbulence columns 31 are arranged between each adjacent fin 21.
[0020] In this embodiment, the fin 21 has a height of 15mm and a thickness of 0.5mm.
[0021] In this embodiment, the turbulence column 31 is cylindrical with a diameter of 1 mm and a height the same as that of the fin 21 (15 mm). The distance between two adjacent turbulence columns 31 is 3 mm.
[0022] like Figure 2 , 3 The diagram shows a gradient-pitch finned heat sink with an array of turbulence columns. Two rows of turbulence columns 31 are staggered between adjacent fins 21, and the angle between the center line of two adjacent rows of turbulence columns 31 and the direction of fluid flow is 60°. This staggered arrangement forces the fluid to constantly change direction as it flows through, generating a strong eddy shedding effect.
[0023] In this embodiment, to further enhance the disturbance, the surface of the turbulence column 31 is also provided with multiple annular grooves. The annular grooves are evenly arranged along the height direction of the turbulence column 31, with a groove depth of 0.1 mm and a width of 0.2 mm.
[0024] like Figure 2 The illustration shows a gradient-pitch finned heat sink with a turbulence column array. The base plate 1 has guide plates 4 on both sides. The guide plates 4 are integrally formed with the base plate 1 and are inclined outward in the shape of an outwardly flared horn. The height of the guide plates 4 is the same as the height of the fins 21. They are used to guide the cooling air smoothly into the heat sink and reduce flow separation and pressure loss at the inlet.
[0025] In this embodiment, the substrate, fin group, and turbulence column array adopt an integrated molding structure.
[0026] The working method of this embodiment is as follows: First, the heat sink substrate 1 is attached to the surface of the hot CPU using thermal grease. The fan above the CPU is then turned on, allowing cooling air to enter the heat sink through the guide plate 4. The air enters the inlet area where the fin spacing is larger and the area where the spacing gradually decreases. As the air flows through the channels between the fins 21, it continuously impacts the staggered turbulence columns 31. The annular grooves on the surface of the turbulence columns 31 further induce micro-scale eddies, disrupting the laminar boundary layer of the air. After multiple, high-intensity convective heat transfers, the heat transfer between the fins 21 becomes uniform. During this process, the CPU heat absorbed by the substrate 1 is efficiently transferred to the cooling air, achieving effective heat dissipation for the CPU.
[0027] Example 2 Based on Example 1, in this example, as... Figure 4 The diagram illustrates a gradient-pitch finned radiator with a turbulence-disrupting column array. The surface of the fins 21 is not planar but has a continuous wavy structure (which can also be replaced by a serrated structure). This wavy structure extends along the fluid flow direction, with a peak-to-trough amplitude of 0.3 mm and a period of 2 mm. This structure effectively expands the heat exchange area without increasing the fin thickness and guides the fluid to periodically accelerate and decelerate, enhancing fluid mixing and further improving heat exchange efficiency.
[0028] In this embodiment, the turbulence column 31 is a regular hexagonal prism with a side length of 1mm. Its planar sidewall can generate more flow separation points than that of a cylinder, thus enhancing the turbulence effect. The substrate 1, fin group 2 and turbulence column array 3 are manufactured in one piece using laser melting molding (metal 3D printing) technology. The material is copper alloy, which is suitable for high-end server chip heat dissipation scenarios with extremely high heat dissipation requirements.
[0029] Example 3 In this embodiment, the surface of the fin 21 is provided with a pyramidal protrusion (instead of a hemispherical protrusion). The sharp apex of the pyramid can generate stronger local disturbances. The thermally conductive coating on the lower surface of the substrate 1 is a metal-ceramic coating (such as an AlN-TiN composite coating) with a thickness of 0.02 mm. It has both high thermal conductivity and electrical insulation properties, and is suitable for heat dissipation of power semiconductor modules with strict insulation requirements.
[0030] In this embodiment, the spacing between the fins 21, i.e., the minimum spacing at the fluid inlet and outlet, is 2 mm, and the maximum spacing at the outlet is 6 mm. This design allows the high-velocity cooling fluid to first strongly flush the upstream area, and as the fluid temperature rises (downstream), the flow velocity decreases to reduce flow resistance, thereby balancing the heat transfer capacity and pressure drop loss in the entire flow channel, and achieving good overall heat dissipation performance.
[0031] It should be noted that the above description is merely a technical solution of the invention and not a limitation. Although the invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the invention without departing from the scope of the invention, and all such modifications and substitutions should be covered within the scope of the claims of the invention.
Claims
1. A gradient-pitch finned heat sink with a turbulence-disrupting column array, characterized in that: include The substrate (1) is made of a thermally conductive material and is used to carry the heat source and transfer heat. Fin assembly (2), the fin assembly (2) is vertically fixed on the upper surface of the substrate (1), the fin assembly (2) includes several rows of fixedly arranged fins (21), the surface of the fins (21) is provided with several spacing grooves (22), the depth of the spacing grooves (22) is not more than one-third of the thickness of the fins (21), the spacing between the fins (21) is arranged in a gradient spacing along the fluid direction, and the fins (21) are arranged in a gradient staggered manner; The turbulence column array (3) is uniformly distributed between adjacent fins (21) and fixedly connected to the substrate (1). The turbulence column array (3) is composed of a few turbulence columns (31). A few turbulence columns (31) are provided between each adjacent fin (21), and the turbulence columns (31) are staggered between adjacent fins (21). The center line connecting two adjacent rows of turbulence columns (31) forms an angle of 45° or 60° with the fluid direction.
2. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The spacing between adjacent fins (21) gradually increases or decreases along the direction of fluid flow, forming a trapezoidal flow channel, and the adjacent flow channels are centrally symmetrical.
3. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The height of the fin (21) is 5-20 mm, the thickness is 0.1-1 mm, the minimum distance between adjacent fins (21) is 1-3 mm, and the maximum distance is 3-8 mm.
4. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The turbulence columns (31) are arranged in at least one row between each adjacent fin (21). The turbulence columns (31) are cylindrical, square prism or hexagonal prism, with the same height as the fin (21), and the diameter or side length is 0.5-2mm. The distance between two adjacent turbulence columns (31) is 2-5mm.
5. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The substrate (1), fin group (2), and turbulence column array (3) adopt an integrated molding structure, and the material is aluminum alloy, copper alloy or other metal material with high thermal conductivity. The molding process is extrusion molding, laser melting molding or metal stamping molding.
6. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The surface of the fin (21) is provided with several protrusions, which are hemispherical or pyramidal and are evenly distributed on the surface of the fin (21).
7. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The fin (21) has a wavy or serrated structure design on its surface.
8. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The lower surface of the substrate (1) is provided with a thermally conductive coating, which is a graphene coating, a carbon nanotube coating or a metal ceramic coating, with a thickness of 0.01-0.1 mm.
9. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The surface of the turbulence column (31) is provided with several annular grooves. The annular grooves are evenly arranged along the height direction of the turbulence column (31). The groove depth is 0.05-0.2mm and the groove width is 0.1-0.3mm. They are used to enhance the fluid turbulence effect and improve the heat exchange efficiency.
10. A gradient-pitch finned heat sink with a turbulence-disrupting column array according to claim 1, characterized in that: The substrate (1) is provided with guide plates (4) on both sides. The guide plates (4) are obliquely arranged and have an outward expansion structure. The height of the guide plates (4) is the same as that of the fins (21).