A cooling system and electronic device

Abstract

The application discloses a cooling system and electronic equipment, and is applied to the technical field of electronic equipment cooling, and the cooling system comprises a machine cover, which is used for being buckled on a machine box, and the machine cover is provided with a plurality of jet holes; a heat sink component is used for being attached to a heat generating component inside the machine box, and the heat sink component comprises a heat sink base and a plurality of heat sink fins vertically arranged on the heat sink base, and a flow channel gap is formed between adjacent heat sink fins; and the positions of the jet holes and the flow channel gaps correspond to each other one by one, so that the cooling medium is flushed into the corresponding flow channel gap after being sprayed through the jet hole. The cooling system provided by the application improves the surface heat exchange coefficient of the heat sink component by coupling the jet structure of the heat sink component and the machine cover, thereby realizing the directional heat dissipation requirement of the high-power heat generating component in the electronic equipment, more efficiently improving the heat transfer efficiency, and eliminating the problem of uneven temperature distribution inside the electronic equipment.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, and in particular to a cooling system and electronic device. Background Technology

[0002] Today, data centers have become a crucial foundation for the development of large-scale artificial intelligence models. With the significant increase in data storage and transmission speeds, the demand for heat dissipation has surged, and traditional air-cooling technology is struggling to meet the heat dissipation requirements of high power density. Immersion liquid cooling technology has a much higher heat transfer coefficient than air, which can significantly improve energy efficiency and achieve noiseless operation. However, single-phase immersion liquid cooling is difficult to target high-power heat-generating components, resulting in localized hot spots inside electronic devices. Moreover, the heat transfer efficiency of these hot spots is closely related to the boundary layer of the wall and flow structures such as vortices.

[0003] Among related technologies, directional liquid cooling technology mainly relies on complex cooling structures and precision testing instruments. It has problems such as limited application scenarios and insufficient refinement of flow field design. In addition, it can lead to obstruction of high-temperature liquid discharge, high maintenance costs of the cooling system, and mismatch between jet orifices and heat sink channels, resulting in insufficient internal flow and low heat exchange efficiency of heat sink components.

[0004] Therefore, how to improve the heat exchange efficiency of the cooling system is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a cooling system and electronic device that can effectively improve the surface heat transfer coefficient of heat sink components and achieve directional heat dissipation of heat-generating components within electronic devices.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] A cooling system is applied to a chassis, the interior of which is filled with a cooling medium; it includes: an upper cover for fastening to the chassis, the upper cover having a plurality of jet holes; and a heat sink component for attaching to a heat-generating component inside the chassis, the heat sink component including a heat sink base and a plurality of heat sink fins vertically disposed on the heat sink base, with flow channel gaps formed between adjacent heat sink fins; and the position of each jet hole corresponds one-to-one with the position of the flow channel gap, so that the cooling medium is sprayed through the jet holes and flushed into the corresponding flow channel gap.

[0008] The present invention also provides an electronic device, including a chassis and a cooling system of any one of the above.

[0009] The cooling system provided by this invention has the following advantages: First, by setting the heat sink component in close contact with the heat-generating component, the heat dissipated by the heat-generating component can be transferred to the heat sink component more efficiently. The heat sink component includes a heat sink base and heat sink fins. The heat dissipated by the heat-generating component is first transferred to the heat sink base, and then the heat sink base transfers it to the heat sink fins. Therefore, the heat dissipation of the heat-generating component is transformed into heat dissipation of the heat sink fins. Second, by setting jet holes on the upper cover, the jet outlet position of each jet hole corresponds one-to-one with the flow channel gap between the adjacent heat sink fins below. When the low-temperature cooling medium flows to the area above the upper cover, the cooling medium is pushed... The cooling medium flows into the jet orifice. The driving force for the cooling medium can be achieved by setting a flow collection and stabilization cavity above the upper cover, or by connecting pipes. As the cross-sectional area of ​​the jet orifice is drastically reduced, the flow velocity of the cooling medium increases, transforming into jet fluid that flows directly into the flow channel gaps between the heat sink fins of the heat sink component. After the high-speed fluid enters the flow channel gaps, it can effectively destroy the fluid boundary layer at the bottom of the heat sink fins, thereby increasing the heat transfer coefficient between the heat sink fins and the cooling medium. The heat sink component can be placed on the heat-generating components with higher heat output inside the chassis, while for heat-generating components with lower heat output, cooling can be achieved simply by using the immersion cooling medium inside the chassis.

[0010] The cooling system provided by this invention, through the coupled design of the heat sink component and the jet structure of the upper cover, realizes the control of the fluid flow and mixing process near the heat sink component, thereby improving the surface heat transfer coefficient of the heat sink component, and thus realizing the directional heat dissipation requirements of high-power heat-generating components in electronic devices, improving the efficiency of heat transfer more efficiently, and eliminating the problem of uneven temperature distribution inside electronic devices.

[0011] In one embodiment, the centerline of the elongated jet orifice is aligned with the centerline of the corresponding flow channel gap; or, the lateral offset between the centerline of the elongated jet orifice and the centerline of the corresponding flow channel gap is less than or equal to a target proportion of the flow channel gap width, the target proportion being 8-12%; and / or, the width of the straight section is 80%-95% of the width of the flow channel gap. This configuration, through the positional relationship between the centerline of the elongated jet orifice and the centerline of the corresponding flow channel gap, avoids excessive deviation between the two centerlines, preventing the cooling medium from directly impacting the top of the heat sink fins and causing kinetic energy loss, and ensures sufficient cooling medium enters the flow channel gap of the heat sink fins. Through strict dimensional design, it ensures that the jet cooling medium can be precisely injected into the bottom of the flow channel gap. Combined with the contraction acceleration effect of the jet orifice, it significantly enhances the impact depth of the cooling medium within the heat sink gap, thereby disrupting the fluid boundary layer deep within the heat sink component and improving the surface heat transfer coefficient near high-power heat-generating components.

[0012] In one embodiment, each heat sink fin is provided with a drag-reducing section at its top. The drag-reducing section has a gradually widening structure from one side near the upper cover to the other side, so as to form a guide surface on the left and right sides of the drag-reducing section to guide the flow of cooling medium. With the above arrangement, the drag-reducing section is used to guide the cooling medium ejected from the jet elongated hole to smoothly enter the flow channel gap on both sides of the heat sink fin and to compensate for the mechanical alignment error between the upper cover and the heat sink component.

[0013] In one embodiment, a flow-collecting and stabilizing component is further included. This component contains a flow-collecting and stabilizing cavity, and is located at the top of the upper cover, covering the area where each jet orifice is located. The bottom of the component has several liquid outlets, each corresponding to a jet orifice. Specifically, the liquid outlets and jet orifices are aligned vertically. This configuration allows the flow-collecting and stabilizing component to stabilize local static pressure. When external cooling medium, driven by a pump and possessing high turbulence and uneven velocity, flows into the flow-collecting and stabilizing cavity, the velocity of the cooling medium decreases, and its dynamic pressure is converted into stable static pressure. This mechanism ensures a highly consistent static pressure distribution at the inlet of all the parallel-arranged jet orifices, eliminating the problem of uneven flow distribution among the jet orifices caused by differences in upstream flow positions.

[0014] In one embodiment, a ring-shaped dam component is also included, extending through the upper cover. The bottom of the dam component abuts against the heat sink fins, and the top of the dam component abuts against the bottom of the flow-collecting and stabilizing component. The dam component is a flexible sealing component. This design further addresses the common problem in immersion liquid cooling where the cooling medium bypasses the high-resistance heat sink area and flows directly from the low-resistance peripheral area. By introducing the dam component, located on the upper cover and surrounding the area of ​​the jet orifice array, the dam component forms a ring-shaped, raised structure. Through a forced flow channel design, when the upper cover of the electronic device is closed and locked, the flexible dam component is compressed and tightly fitted to the edge of the heat sink fins or a specially designed sealing step. This fit physically completely blocks the horizontal flow path above the heat sink component, creating a closed vertical flow channel. At this time, all cooling medium driven by the pump into the flow-collecting and stabilizing cavity can only be injected at high speed into the flow channel gap of the heat sink component. This design ensures maximum utilization of the cooling medium, improves efficiency, and saves costs.

[0015] In one embodiment, the cofferdam component includes a first sealing section, a through section, and a second sealing section, which are connected sequentially. The bottom inner circumference of the flow collecting and stabilizing component has a recessed portion. The first sealing section is placed within the recessed portion and is sealed to the flow collecting and stabilizing component. The through section penetrates the upper cover, and the end of the second sealing section opposite to the through section abuts against the heat sink fins. This configuration achieves pre-sealing between the flow collecting chamber and the upper cover by embedding the first sealing section in the recessed portion, preventing coolant leakage upwards. The through section penetrating the upper cover provides accurate positioning and assembly. The second sealing section is compressed when the chassis is closed and locked, tightly abutting against the edge of the heat sink fins or the sealing step, improving the bottom sealing effect.

[0016] The electronic device provided by the present invention is equipped with the above-mentioned cooling system. Since the cooling system has the above-mentioned technical effects, the electronic device equipped with the cooling system should also have the corresponding technical effects. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the heat sink component and the heat-generating component after assembly in the cooling system provided by the present invention.

[0019] Figure 2 This is a schematic diagram of the upper cover structure in the cooling system provided by the present invention.

[0020] Figure 3 This is a schematic diagram of the heat sink component in the cooling system provided by the present invention installed inside the chassis.

[0021] Figure 4 This is a top view of the upper cover of the cooling system provided by the present invention.

[0022] Figure 5 This is a longitudinal sectional view of the jet hole on the upper cover of the cooling system provided by the present invention.

[0023] Figure 6 This is a schematic diagram of the first specific embodiment of the cooling system provided by the present invention.

[0024] Figure 7 This is a schematic diagram of a second specific embodiment of the cooling system provided by the present invention.

[0025] Figure 8This is a schematic diagram of the third specific embodiment of the cooling system provided by the present invention.

[0026] Figure 9 This is a schematic diagram of the fourth specific embodiment of the cooling system provided by the present invention.

[0027] Figure 10 for Figure 8 A top view of the dam and heat sink components in the cooling system shown.

[0028] Figure 11 This is a comparison diagram of the surface heat transfer coefficient distribution of the heat sink component in the cooling system provided by the present invention under conditions of jetting and non-jetting.

[0029] Figure 12 This is a comparison diagram of the temperature distribution of the heat sink component in the cooling system provided by the present invention under conditions of jet flow and no jet flow.

[0030] Reference numerals: 100-Chassis; 200-Heating component; 300-Cooling medium; 400-Base plate; 1-Upper cover; 11-Jet hole; 111-Contraction section; 112-Straight section; 2-Heat sink component; 21-Heat sink base; 22-Heat sink fins; 23-Flow channel gap; 24-Drag reduction section; 25-Bottom gap; 26-Spacer bar; 3-Memory component; 4-Flow collecting and stabilizing component; 41-Flow collecting and stabilizing cavity; 42-Inlet; 5-Damage component; 51-First sealing section; 52-Through section; 53-Second sealing section; 6-Arc transition structure. Detailed Implementation

[0031] The core of this invention is to provide a cooling system and electronic device that can couple heat sink components with jet hole technology, thereby increasing the penetration depth of the jet within the gap of the heat sink components.

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0033] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] Electronic devices contain numerous components, with high-power heat-generating components 200 primarily encapsulated in the CPU (Central Processing Unit) and GPU (Graphics Processing Unit). The uneven temperature distribution within electronic devices employing immersion liquid cooling technology mainly stems from the heat generated by the high-power heat-generating components 200. The heat generated per unit area / volume by components such as storage and power supplies is significantly less than that generated by the high-power heat-generating components 200. In this invention, the directional heat dissipation system for electronic devices focuses primarily on the components encapsulating the high-power heat-generating components 200, simplifying or ignoring the structures of other low-power components. The CPU, which encapsulates the high-power heat-generating components 200, has a limited external surface area, making it difficult to meet the convective heat transfer requirements with the cooling medium 300. Therefore, a heat sink component 2 is placed above the CPU to increase the contact area with the cooling medium 300. Compared to the CPU, the heat generated per unit area / volume by the memory component 3 is negligible, but the presence of the memory component 3 alters the flow field characteristics near the CPU, thus affecting the accuracy of the simulation. The substrate 400 affects the incoming flow boundary layer state, thereby influencing the flow field characteristics near the CPU and potentially affecting CPU heat dissipation. Therefore, the impact of the memory component 3 is considered in the improvements of this invention.

[0036] In this embodiment, it is applied to chassis 100, and the interior of chassis 100 is filled with cooling medium 300; please refer to Figure 1 , Figure 2 and Figure 4 The cooling system includes an upper cover 1 and a heat sink component 2.

[0037] The upper cover 1 is used to fasten onto the casing 100, and the upper cover 1 is provided with several jet holes 11.

[0038] The heat sink component 2 is used to attach to the heat-generating component 200 inside the chassis 100. The heat sink component 2 includes a heat sink base 21 and a plurality of heat sink fins 22 vertically disposed on the heat sink base 21. A flow channel gap 23 is formed between adjacent heat sink fins 22. Furthermore, the position of each jet hole 11 corresponds one-to-one with the position of the flow channel gap 23, so that the cooling medium 300 is sprayed through the jet hole 11 and flushed into the corresponding flow channel gap 23.

[0039] Specifically, the heat sink fins 22 are arranged in parallel, the position of the jet holes 11 corresponds to the directional heat dissipation area inside the chassis 100, and the heat-generating components 200 are set in the directional heat dissipation area of ​​the chassis 100; the chassis 100 can be the chassis 100 of electronic equipment, and the electronic equipment can be servers, switches, etc.

[0040] The cooling system provided by this invention, firstly, through the setting of the heat sink component 2, which is closely fitted to the heat-generating component 200, enables the heat dissipated by the heat-generating component 200 to be transferred to the heat sink component 2 more efficiently. The heat sink component 2 includes a heat sink base 21 and heat sink fins 22. The heat dissipated by the heat-generating component 200 is first transferred to the heat sink base 21, and then the heat sink base 21 transfers it to the heat sink fins 22. Therefore, the heat dissipation of the heat-generating component 200 is converted into heat dissipation of the heat sink fins 22. Then, by setting jet holes 11 on the upper cover 1, the jet outlet position of each jet hole 11 is set one-to-one with the flow channel gap 23 between the adjacent heat sink fins 22 below. When the low-temperature cooling medium 300 flows to the area above the upper cover 1, the cooling medium 300 is pushed into the jet. As for the driving force of the cooling medium 300 inside the hole 11, it can be achieved by setting a flow collection and stabilization cavity 41 above the upper cover 1, or by connecting the pipes. As the cross-sectional area of ​​the jet hole 11 is drastically reduced, the flow velocity of the cooling medium 300 increases and is transformed into jet fluid, which flows directly into the flow channel gap 23 between the heat sink fins 22 of the heat sink component 2. After the high-speed fluid enters the flow channel gap 23, it can effectively destroy the fluid boundary layer at the bottom of the heat sink fins 22, thereby increasing the heat transfer coefficient between the heat sink fins 22 and the cooling medium 300. The heat sink component 2 can be set on the heat-generating component 200 with greater heat generation inside the chassis 100, while for the heat-generating component 200 with smaller heat generation, the cooling effect can be achieved simply by using the immersion cooling medium 300 inside the chassis 100.

[0041] The cooling system provided by this invention, by coupling the heat sink component 2 and the upper cover 1 with a jet structure, controls the flow and mixing of fluid near the heat sink component 2, thereby improving the surface heat transfer coefficient of the heat sink component 2, and thus meeting the directional heat dissipation requirements of the high-power heat-generating component 200 in the electronic device, improving the efficiency of heat transfer more efficiently, and eliminating the problem of uneven temperature distribution inside the electronic device.

[0042] In some embodiments, the jet orifice 11 is an elongated jet orifice, the extension direction of the jet orifice 11 is parallel to the extension direction of the flow channel gap 23, and the arrangement direction of each jet orifice 11 is the same as the arrangement direction of the heat sink fins 22. The shape and size of the elongated jet orifice are more matched with the flow channel gap 23; by setting the elongated jet orifice, the flow characteristics near the local hot spot can be adjusted and optimized, the surface heat transfer coefficient between the cooling medium 300 and the wall near the hot spot can be improved, thereby enhancing the heat exchange between the local solid and liquid, improving the heat dissipation efficiency of the high-heat-generating component 200 in the electronic device, and making the temperature distribution of each component inside the electronic device more uniform.

[0043] In some implementation methods, please refer to Figure 5The longitudinal section of the elongated jet orifice has a shape that first contracts and then straightens. The elongated jet orifice includes: a contraction section 111, located at the jet inlet of the elongated jet orifice, which is streamlined in the vertical direction to guide and accelerate the cooling medium 300; and a straight section 112, connected to the end of the contraction section 111 and extending to the jet outlet of the elongated jet orifice, used to rectify the cooling medium 300 and suppress the lateral velocity component. The contraction section 111 and the straight section 112 can have a smooth transition to ensure that the cooling medium 300 can flow smoothly through the elongated jet orifice. Specifically, the width of the straight section 112 in the elongated jet orifice matches the width of the flow channel gap 23 between the heat sink fins 22. The purpose of this design is to ensure that the cooling medium 300 injected downwards into the electronic device through these elongated jet holes can enter more of the gaps between the heat sink fins 22 and be accelerated to a certain extent, thereby increasing the convective heat transfer coefficient of the heat sink fins 22 and allowing the cooling medium 300 to remove more heat from the heat sink. In other words, the jet holes 11 are not straight holes; their longitudinal sections are first constricted and then straightened, and the hole walls are streamlined relative to the vertical direction. They first play a guiding role at the hole inlet, then accelerate the cooling medium 300, and finally rectify the cooling medium 300 to suppress the lateral velocity component.

[0044] It should be noted that the width direction of the straight section 112 and the width of the flow channel gap 23 referred to in this article refer to the arrangement direction of the heat sink fins 22, which is also the arrangement direction of the jet elongated holes; the vertical direction referred to in this article refers to the direction perpendicular to the substrate 400.

[0045] In some embodiments, the centerline of the elongated jet orifice is aligned with the centerline of the corresponding flow channel gap 23; or, the lateral offset between the centerline of the elongated jet orifice and the centerline of the corresponding flow channel gap 23 is less than or equal to a target proportion of the width of the flow channel gap 23, the target proportion being 8-12%; specifically, the lateral offset Ax is related to the width W of the flow channel gap. gap The following condition must be met: Ax ≤ a × Wgap, where a is between 0.08 and 0.12. This configuration, through the positional relationship between the centerline of the jet's elongated orifice and the corresponding centerline of the flow channel gap 23, avoids excessive deviation between the two centerlines, prevents the cooling medium 300 from directly impacting the top of the heat sink fins 22 and causing kinetic energy loss, and ensures sufficient cooling medium 300 enters the flow channel gap 23 of the heat sink fins 22.

[0046] In some embodiments, the width of the straight section 112, i.e. the outlet width of the jet elongated orifice, is 80%-95% of the width of the flow channel gap 23. Through strict dimensional design, it is ensured that the jet cooling medium 300 can be accurately injected into the bottom of the flow channel gap 23. Combined with the contraction acceleration effect of the jet orifice 11, the impact depth of the cooling medium 300 in the heat sink gap is significantly enhanced, thereby destroying the fluid boundary layer deep in the heat sink component 2 and improving the surface heat transfer coefficient near the high-power heat-generating component 200.

[0047] In one specific embodiment, the structural parameter design rules for the jet hole 11 are as follows.

[0048] The gap width between the heat sink fins 22 is W gap The width of the jet's elongated orifice outlet is W. jet Set W jet =k×W gap The coefficient k ranges from 0.80 to 0.95. This design aims to prevent kinetic energy loss caused by direct fluid impact on the top of the heat sink fin 22, while ensuring sufficient flow into the gaps of the heat sink fin 22. The centerline of the jet's elongated orifice should be aligned with the corresponding centerline of the gap in the heat sink fin 22, and the maximum allowable lateral offset Δx must satisfy Δx ≤ 0.1 × W. gap .

[0049] In some embodiments, the inner wall roughness of the jet elongated orifice is less than or equal to the target roughness, which is 1.6 micrometers. Of course, it can also be set as needed. Specifically, an inner wall roughness of ≤1.6μm can reduce flow resistance and thereby increase the penetration depth of the jet in the flow channel gap 23 of the heat sink component 2.

[0050] In some implementations, please refer to Figure 7 and Figure 8Each heat sink fin 22 has a drag-reducing section 24 at its top. The drag-reducing section 24 has a gradually widening structure from one side near the upper cover 1 to the other side, so as to form a guiding surface on the left and right sides of the drag-reducing section 24 to guide the flow of the cooling medium 300. The above-mentioned drag reduction section 24 is used to guide the cooling medium 300 ejected from the jet elongated orifice smoothly into the flow channel gap 23 on both sides of the heat sink fin 22, and to compensate for the mechanical alignment error between the upper cover 1 and the heat sink component 2. Specifically, the drag reduction section 24, through its top-to-bottom gradually widening structural design, can increase the flow guidance and correction mechanism. When there is a slight deviation between the center line of the upper jet elongated orifice and the center line of the lower flow channel gap 23, the edge of the high-speed jet cooling medium 300 will first contact the guiding surface of the heat sink fin 22. Utilizing the characteristic of fluid flowing along curved or inclined surfaces, the guiding surface can smoothly guide the fluid that might otherwise hit the top surface of the flat heat sink fin 22 and be splashed away into the flow channel gap 23 on both sides of the heat sink fin 22. This design significantly improves the system's tolerance to assembly tolerances and ensures that it can maintain efficient inflow even under long-term vibration.

[0051] In some embodiments, the drag-reducing part 24 is a pointed or arc-shaped structure. The apex angle of the pointed structure is 30°-60°; the radius of the arc-shaped structure is equal to 0.45 to 0.55 times the thickness of the heat sink fin 22, for example, it can be half the thickness of the heat sink fin 22. In order to solve the problem of jet efficiency reduction caused by unavoidable small alignment errors in precision assembly, the top of the heat sink fin 22 is structurally improved to optimize the structural morphology of the heat sink fin 22. Specifically, the top of the heat sink fin 22 can be improved to be pointed or semi-circular streamlined.

[0052] In some embodiments, the heat-generating component 200 is disposed on the substrate 400, and the projected area of ​​the heat sink component 2 in the vertical direction is larger than the projected area of ​​the heat-generating component 200 in the vertical direction but smaller than the projected area of ​​the substrate 400 in the vertical direction; a bottom gap 25 is formed between the periphery of the heat sink component 2 and the substrate 400. This arrangement, on the one hand, increases the effective heat dissipation area of ​​the heat sink component 2, increases the arrangement space of the heat sink fins 22, and improves heat dissipation efficiency; on the other hand, the bottom gap 25 formed between the periphery of the heat sink component 2 and the substrate 400 allows the cooling medium 300 to flow into the gap between the substrate 400 and the heat sink component 2 and flow around the heat-generating component 200, allowing the cooling medium 300 to contact the heat-generating component 200 more directly.

[0053] In some embodiments, the heating element 200 is an encapsulated component, and the heat sink component 2 and the heating element 200 are fixed by adhesive or detachably connected by snap-fit, making disassembly and assembly convenient.

[0054] In some implementations, such as Figure 1 and Figure 3As shown, the chassis 100 is also equipped with several memory components 3. The top of the heat sink component 2 is flush with the top of the memory component 3, which facilitates the assembly of the upper cover 1 and the limiting effect of the upper cover 1 on the memory component 3 and the heat sink component 2. The extension direction of the heat sink fin 22 is the same as the extension direction of the memory module in the memory component 3.

[0055] In some implementation methods, please refer to Figure 6 It also includes a flow collecting and stabilizing component 4, which has a flow collecting and stabilizing cavity 41 inside. The flow collecting and stabilizing component 4 is located on the top of the upper cover 1, and the flow collecting and stabilizing cavity 41 covers the area where each jet hole 11 is located. The bottom of the flow collecting and stabilizing component 4 has several liquid outlets, which correspond to the positions of the jet holes 11. With the above configuration, the flow collecting and stabilizing component 4 can stabilize the local static pressure. When the external cooling medium 300 driven by the pump and having high turbulence and uneven velocity flows into the flow collecting and stabilizing cavity 41, the velocity of the cooling medium 300 fluid will decrease, and its dynamic pressure will be converted into stable static pressure. This mechanism ensures that the static pressure distribution at the inlet of all the jet holes 11 arranged side by side is highly consistent, eliminating the problem of uneven flow distribution of each jet hole 11 caused by the difference in the upstream flow position. The design of the flow collection and stabilization component 4 is to solve the problem of uneven flow rate and pressure fluctuation of the cooling medium 300 before entering the jet hole 11 due to external interference. The present invention designs a flow collection and stabilization cavity 41 above the jet elongated hole inlet of the cover 1 of the electronic device, and its horizontal coverage range encompasses all the corresponding jet elongated holes above the heat sink component 2.

[0056] In some embodiments, the jet orifice 11 is a jet elongated orifice, and the number of liquid outlets is the same as that of the jet orifice 11 and they correspond one-to-one. The width of the liquid outlet is greater than the width of the jet elongated orifice, so that the cooling medium 300 flowing out of the liquid outlet can flow into the jet elongated orifice more effectively.

[0057] In some embodiments, adjacent liquid outlets are separated by a spacer 26, the top of which has an arc-shaped protrusion structure. The cooling medium 300 is guided from the side wall of the liquid outlet to the jet hole 11. Specifically, the arc-shaped protrusion structure of the spacer 26 can better guide the cooling medium 300.

[0058] In some embodiments, the depth of the flow collection and stabilization cavity 41 in the vertical direction is set to 2-5 times the width of the jet elongated orifice, in order to form a buffer volume to convert the dynamic pressure of the cooling medium 300 into static pressure.

[0059] In some embodiments, a memory jet channel is provided at the position of the upper cover 1 corresponding to the memory component 3; the memory jet channel is the same as the aforementioned jet elongated hole structure for cooling the heat sink, and the memory jet channel corresponds to the gap position between the memory module units in the memory component 3; the number of memory jet channels is the same as the number of gaps between the memory module units. Specifically, the memory jet channel can adopt a longitudinal section design that first contracts and then straightens. The contraction section 111 guides and accelerates the coolant flow, while the straight section 112 suppresses the lateral velocity component. The inner wall of the memory jet channel also maintains low roughness to reduce flow resistance. The memory jet channel allows the cooling medium 300 to directly impact the side surface of the memory module, effectively disrupting the fluid boundary layer around the memory module and thus improving the surface heat transfer coefficient of the area where the memory component 3 is located. Of course, the upper cover 1 also has other jet structures, and sheet-like heat-generating components 200 can be used. For non-sheet-like structures, an encapsulation method can be used to add a heat sink component 2. Of course, when the memory jet channel is not needed, a seal can be added to seal the memory jet channel.

[0060] In some implementation methods, please refer to Figure 9 and Figure 10 It also includes a dam component 5, which can be a ring structure. The dam component 5 is installed through the upper cover 1. The bottom of the dam component 5 abuts against the heat sink fins 22, and the top of the dam component 5 abuts against the bottom of the flow collection and stabilization component 4. The dam component 5 is a flexible sealing component. Specifically, in order to ensure that the cooling medium 300 in the flow collection and stabilization cavity 41 of the flow collection and stabilization component 4 can enter the heat sink component 2 as much as possible, the bottom of the dam component 5 abuts against the heat sink fins 22. In actual use, if the top of the heat sink fins 22 is flat, the bottom of the dam component 5 can be directly attached to the top of the heat sink fins 22. If the top of the heat sink fins 22 is not flat, but has an arc-shaped structure or a sharp corner structure, a step can be set on the side of the heat sink fins 22, and the bottom of the dam component 5 abuts against the step. Of course, the bottom of the dam component 5 can also abut against other positions to meet the usage requirements.

[0061] Specifically, the dam component 5 can be made of a flexible material that is resistant to high temperatures and corrosion, such as fluororubber or EPDM rubber with a Shore hardness of 50-70. This design is intended to further address the common problem in immersion liquid cooling where the cooling medium 300 bypasses the high-resistance heat sink area and flows directly from the low-resistance peripheral area. By introducing the dam component 5, located on the upper cover 1 and surrounding the area of ​​the jet orifice 11 array, the dam component 5 forms a ring-shaped, raised structure. Through a forced flow channel design, when the upper cover 1 of the electronic device is closed and locked, the flexible dam component 5 is compressed and tightly fitted to the edge of the heat sink fins 22 or a specially designed sealing step. This fit physically completely blocks the horizontal flow path above the heat sink component 2, creating a closed vertical flow channel. At this time, all the cooling medium 300 driven by the pump into the flow collection and stabilization chamber 41 can only be injected at high speed into the flow channel gap 23 of the heat sink component 2.

[0062] In some embodiments, the liquid inlet 42 of the flow collecting and stabilizing cavity 41 is perpendicular to the jet direction of the jet orifice 11. An arc-shaped transition structure 6 is provided at the connection point between the flow collecting and stabilizing cavity 41 and the upper cover 1 to guide the cooling medium 300 from horizontal flow to a vertically downward jet. To better utilize the rectifying and guiding effect, an arc-shaped transition structure 6 is used at the connection point between the bottom of the flow collecting and stabilizing cavity 41 and the inlet of the jet orifice 11. The arc-shaped transition structure 6 can guide the fluid to smoothly transition from horizontal flow to a vertically downward jet flow, effectively suppressing vortices and lateral velocity components at the inlet, making the ejected jet beam more aligned and stable. Specifically, the arc-shaped transition structure 6 can be provided on the flow collecting and stabilizing component 4, or it can be provided on the weir component 5. The weir component 5 serves both a sealing and guiding function.

[0063] In some embodiments, the cofferdam component 5 includes a first sealing section 51, a through section 52, and a second sealing section 53, which are connected sequentially. The bottom inner circumference of the flow collecting and stabilizing component 4 has a recessed portion. The first sealing section 51 is placed within the recessed portion and is sealed to the flow collecting and stabilizing component 4. The through section 52 penetrates the upper cover 1, and the end of the second sealing section 53 opposite to the through section 52 abuts against the heat sink fins 22. This arrangement achieves a pre-sealing between the flow collecting cavity and the upper cover 1 by embedding the first sealing section 51 into the recessed portion, preventing coolant leakage upwards. The through section 52 penetrating the upper cover 1 provides accurate positioning and assembly. The second sealing section 53 is compressed when the chassis 100 is closed and locked, tightly abutting against the edge of the heat sink fins 22 or the sealing step, improving the bottom sealing effect. Specifically, the through section 52 can be a horizontally placed S-shaped structure. The flow collection and stabilization component 4 can be equipped with a pressure-blocking structure to press down the through section 52. When the cofferdam component 5 is subjected to pressure from both above and below, it can cause the through section 52 to deform, thereby better pressing the first sealing section 51 and the second sealing section 53 to ensure reliability. The cooling medium 300 entering the heat sink component 2 will flow out of the heat sink component 2 through both ends of the extension direction of the flow channel gap 23, mix with the cooling medium 300 in the chassis 100, and participate in the entire circulation process of the cooling medium 300.

[0064] In one specific embodiment, the overall dimensions of the electronic device's chassis 100 can be set as follows: 700mm (length) × 448mm (width) × 43.5mm (height); the high-power heat-generating component 200 is a central processing unit / graphics processor, i.e., the main heat source in this invention, with dimensions set to 70mm (length) × 50mm (width) × 3mm (height); the heat sink component is attached to the high-power heat-generating component 200 and includes two parts: a heat sink base 21 and parallel-arranged heat sink fins 22, used to expand the convection heat transfer area. The dimensions of the heat sink base 21 are 130mm (length) × 81mm (width) × 5mm (height); the dimensions of the 14 heat sink fins 22 are 130mm (length) × 3mm (width) × 22mm (height). The size design aims to balance multiple factors affecting heat dissipation, such as flow resistance, thermal conductivity, and heat transfer area. The memory size is set at 130mm (length) × 5mm (width) × 30mm (height), with 8 memory modules for each CPU / GPU and 4 modules on each side. The circuit board size is set at 215mm (length) × 438mm (width) × 2mm (height), and its size design takes into account the influence of factors such as the incoming flow boundary layer state on the heat dissipation simulation of the CPU / GPU. The upper cover 1 of the electronic device chassis 100 is provided with two sets of parallel arrays of slender jet holes 11, which correspond to the gaps between the two heat sink fins 22, serving as the entry point for the jet into the electronic device. The size of the slender jet holes is 40mm (length) × 1mm (width).

[0065] The technical point of this invention is based on the following thermodynamic formula, q=h ΔT ,in, q For heat flux density, h The surface heat transfer coefficient, ΔT The temperature difference between the wall and the fluid is denoted as . Assuming the heating element 200 operates at a constant power, the heat dissipation density required by the heating element 200 also remains constant. According to this formula, if it is necessary to reduce the temperature difference between the heat sink and the cooling medium 300, it can be achieved by increasing the heat transfer coefficient of the heat sink surface.

[0066] Furthermore, dimensionless parameters are generally used in fluid properties and heat transfer analysis. The Nusselt number can be obtained by dimensionlessizing the surface heat transfer coefficient. According to empirical formulas in fluid mechanics, the formulas for calculating the Nusselt number in turbulent and laminar flow states of the boundary layer are as follows.

[0067] .

[0068] .

[0069] in, For the local Nusselt number of the turbulent scene, For laminar flow scenarios, the local Nusselt number is... , The convective heat transfer coefficient is... Let Reynolds number be 1. This is the Prandtl number. In this invention, under laminar flow conditions, D For the gap between heat sink fins 22; in turbulent scenarios, D The width of the jet orifice 11, H For jet distance, Thermal conductivity, r The distance from the jet hole 11 to the surface of the heat sink component 2 is the distance from the jet hole 11 to the surface of the heat sink component 2. The surface of the heat sink component 2 refers to the surface of the heat sink component 2 at a certain location where the jet impacts it.

[0070] Please refer to Figure 11 When jet technology is not used, the surface heat transfer coefficient of heat sink component 2 is low; after jet technology is used, the surface heat transfer coefficient of most areas of heat sink component 2 increases, especially the surface heat transfer coefficient of the central area of ​​heat sink component 2 increases the most. Figure 11 The unit for the median value is W / (m²·K); please refer to [reference needed]. Figure 12Without jet technology, the temperature of heat sink component 2 is high, with almost the entire component exceeding 70°C (approximately 340K). With jet technology, the temperature of heat sink component 2 decreases, with the entire heat sink temperature falling below 60°C (approximately 330K). The central region of heat sink component 2, in particular, experiences the greatest impact from the jet, resulting in a temperature drop to 50°C (approximately 320K). Figure 11 and Figure 12 The left side of the image shows the results without jet technology, while the right side shows the results with jet technology.

[0071] In addition to the cooling system described above, the present invention also provides an electronic device including the cooling system described above. For the structure of other parts of the electronic device, please refer to the relevant technology, which will not be described in detail here.

[0072] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0073] The cooling system and electronic equipment provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. A cooling system applied to a chassis (100), the chassis (100) being filled with a cooling medium (300); characterized in that, include: The upper cover (1) is used to fasten onto the chassis (100), and the upper cover (1) is provided with a plurality of jet holes (11). A heat sink component (2) is used to attach to a heat-generating component (200) inside the chassis (100). The heat sink component (2) includes a heat sink base (21) and a plurality of heat sink fins (22) vertically disposed on the heat sink base (21). A flow channel gap (23) is formed between adjacent heat sink fins (22). Furthermore, the position of each jet hole (11) corresponds one-to-one with the position of the flow channel gap (23), so that the cooling medium (300) is sprayed through the jet hole (11) and then flushed into the corresponding flow channel gap (23).

2. The cooling system according to claim 1, characterized in that, The jet hole (11) is a jet elongated hole, and the extension direction of the jet hole (11) is parallel to the extension direction of the flow channel gap (23). The arrangement direction of each jet hole (11) is the same as the arrangement direction of the heat sink fin (22).

3. The cooling system according to claim 2, characterized in that, The elongated jet orifice includes: A contraction section (111) is located at the jet inlet of the jet elongated orifice, and the contraction section (111) is streamlined in the vertical direction. A straight section (112) is connected to the end of the contraction section (111) and extends to the jet outlet of the jet elongated orifice.

4. The cooling system according to claim 3, characterized in that, The centerline of the jet elongated orifice is aligned with the centerline of the corresponding flow channel gap (23); or, the lateral offset between the centerline of the jet elongated orifice and the centerline of the corresponding flow channel gap (23) is less than or equal to a target proportion of the width of the flow channel gap (23), the target proportion being 8-12%; And / or, the width of the straight section (112) is 80%-95% of the width of the flow channel gap (23).

5. The cooling system according to claim 3, characterized in that, The roughness of the inner wall of the jet elongated orifice is less than or equal to the target roughness, which is 1.6 micrometers.

6. The cooling system according to claim 2, characterized in that, Each of the heat sink fins (22) has a drag-reducing portion (24) at its top end. The drag-reducing portion (24) has a gradually widening structure from one side near the upper cover (1) to the other side, so as to form a guiding surface for guiding the flow of cooling medium (300) on the left and right sides of the drag-reducing portion (24).

7. The cooling system according to claim 6, characterized in that, The drag-reducing part (24) is a pointed-corner structure or a circular arc structure. The apex angle of the pointed-corner structure is 30°-60°. The radius of the circular arc structure is equal to 0.45 to 0.55 times the thickness of the heat sink fin (22).

8. The cooling system according to claim 1, characterized in that, The heating element (200) is disposed on the substrate (400). The projected area of ​​the heat sink (2) in the vertical direction is greater than the projected area of ​​the heating element (200) in the vertical direction and smaller than the projected area of ​​the substrate (400) in the vertical direction. A bottom gap (25) is formed between the periphery of the heat sink (2) and the substrate (400).

9. The cooling system according to claim 1, characterized in that, The chassis (100) is also provided with several memory components (3). The top of the heat sink component (2) is flush with the top of the memory component (3), and the extension direction of the heat sink fins (22) is the same as the extension direction of the memory module in the memory component (3).

10. The cooling system according to any one of claims 1 to 9, characterized in that, It also includes a flow collection and stabilization component (4), which has a flow collection and stabilization cavity (41) inside. The flow collection and stabilization component (4) is located on the top of the upper cover (1), and the flow collection and stabilization cavity (41) covers the area where each of the jet holes (11) is located. The bottom of the flow collection and stabilization component (4) is provided with several liquid outlets, and the liquid outlets correspond to the positions of the jet holes (11).

11. The cooling system according to claim 10, characterized in that, The jet orifice (11) is a jet elongated orifice, and the number of liquid outlets is the same as that of the jet orifice (11) and they correspond one-to-one. The width of the liquid outlet is greater than the width of the jet elongated orifice. And / or, adjacent liquid outlets are separated by a partition bar (26), the top of which has an arc-shaped protrusion structure, and the cooling medium (300) is guided from the side wall of the liquid outlet to the jet hole (11); And / or, the depth of the flow collection and stabilization cavity (41) in the vertical direction is set to 2-5 times the width of the jet elongated orifice.

12. The cooling system according to claim 10, characterized in that, It also includes a ring-shaped cofferdam component (5), which is disposed through the upper cover (1). The bottom of the cofferdam component (5) abuts against the heat sink fin (22), and the top of the cofferdam component (5) abuts against the bottom of the flow collection and stabilization component (4). The cofferdam component (5) is a flexible sealing component.

13. The cooling system according to claim 12, characterized in that, The liquid inlet (42) of the flow collecting and stabilizing cavity (41) is perpendicular to the jet direction of the jet hole (11). The flow collecting and stabilizing cavity (41) is provided with an arc transition structure (6) at the position where it connects with the upper cover (1) to guide the cooling medium (300) from horizontal flow to vertical downward jet. The arc transition structure (6) is located on the flow collecting and stabilizing component (4) or the cofferdam component (5).

14. The cooling system according to claim 12, characterized in that, The cofferdam component (5) includes a first sealing section (51), a through section (52), and a second sealing section (53), which are connected in sequence. The bottom inner circumference of the flow collection and stabilization component (4) is provided with a recessed portion. The first sealing section (51) is placed in the recessed portion and is sealed to the flow collection and stabilization component (4). The through section (52) penetrates the upper cover (1), and the end of the second sealing section (53) away from the through section (52) abuts against the heat sink fin (22).

15. An electronic device, comprising a chassis (100) and a cooling system, characterized in that, The cooling system is the cooling system according to any one of claims 1 to 14.

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