Rail transit signal machine integrated circuit board and preparation method thereof

Abstract

The application discloses a rail transit signal machine integrated circuit board and a preparation method thereof, and relates to the technical field of rail transit signal machine integrated circuit boards.The rail transit signal machine integrated circuit board comprises a board body, a chip for auxiliary control arranged on the board body, a shielding protection assembly arranged on the outer side of the chip and used for shielding interference in the chip control process, and a grounding assembly arranged between the shielding protection assembly and the board body.During the fixing process of the shielding protection assembly on the rail transit signal machine integrated circuit board, the mutual cooperation of the extrusion assembly and the limiting assembly is not required to be welded, high-temperature burnout of the board body circuit and peripheral devices of the chip is avoided, the installation is simple, the problems of complicated welding and high-temperature damage are solved, and in addition, through the elastic extrusion effect in the whole installation process, the conductive plate and the L-shaped grounding pad are tightly attached, and the problem of poor grounding caused by uneven screw force is solved.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit boards for rail transit signal controllers, specifically to an integrated circuit board for rail transit signal controllers and its manufacturing method. Background Technology

[0002] As a type of integrated circuit, the integrated circuit board of rail transit signal controllers is manufactured using integrated circuit manufacturing technologies such as integrated circuit process, surface mount packaging process, and board-level circuit integration. It is a key piece of hardware for realizing signal driving, logic interlocking, data sampling, and real-time monitoring of operating status. Its operational stability directly determines the overall safety of train dispatching and train operation.

[0003] The complex operating conditions at rail transit sites, including the high-intensity electromagnetic radiation and pulse interference generated by surrounding equipment such as pantograph-catenary arcing and traction converters, can easily cause electromagnetic interference to various main control chips, logic operation chips, and integrated components manufactured through wafer dicing, chip bonding, and molding on circuit boards. This can lead to malfunctions such as misjudgments in the internal logic of integrated circuits, abnormal board-level bus communication, and clock timing disorders, posing significant safety hazards. Therefore, the industry commonly uses metal shielding covers to encapsulate and protect the integrated chips on integrated circuit boards. Utilizing the Faraday cage electromagnetic shielding principle, chip-level electromagnetic isolation is achieved. Simultaneously, a high thermal conductivity thin-walled metal structure is used to achieve efficient heat dissipation for integrated devices, ensuring the stable operation of internal circuits and transistor units, and mitigating various operational failures caused by electromagnetic interference at the hardware level.

[0004] During the installation of the shielding cover on the integrated circuit board of the rail transit signal controller, it is mainly fixed by welding and screwing. During the welding process, the high temperature welding poses a risk of burning the circuit board and surrounding components of the chip, and the welding process is also quite cumbersome. During the screwing process, the threaded locking is prone to uneven force, causing local compression and denting of the shielding cover and warping of the four corners, which affects the grounding conductivity during the shielding use. To address this, we propose an integrated circuit board for rail transit signal controllers and its preparation method. Summary of the Invention

[0005] The purpose of this invention is to provide an integrated circuit board for rail transit signal controllers and its manufacturing method, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a rail transit signal integrated circuit board, comprising a board body, wherein a chip for auxiliary control is disposed on the board body, and further comprising: The shielding and protection components are located on the outside of the chip and are used for interference shielding during chip control. A grounding component is installed between the shielding and protective components and the plate to provide grounding conductivity during the interference shielding process. And, a pressing component disposed on the plate for pressing and pushing the shielding and protective component around its periphery, wherein the plate is provided with a limiting component for pressing and limiting the shielding and protective component during the pressing and pushing process; The shielding and protection assembly includes a shielding cover, which consists of a top plate and side plates fixed around one side of the top plate. A rubber plate for auxiliary flexible connection is fixed between two adjacent sets of side plates, and the top plate, four sets of side plates and four sets of rubber plates are arranged in a cover shape.

[0007] Preferably, the top plate and side plate are thin-walled components, and the top plate and side plate are made of aluminum alloy.

[0008] Preferably, the grounding assembly includes a conductive plate fixed to the side of the side plate away from the plate body, the conductive plate being disposed facing the inside of the shielding cover, and the periphery of the chip being provided with a U-shaped grounding pad for contacting each group of conductive plates.

[0009] Preferably, the extrusion components are evenly distributed at the four corners above the U-shaped grounding pad, and a first mounting component for auxiliary installation is provided between the extrusion components and the plate. The extrusion components include a V-shaped plate, and the V-shaped plate has two sets of first inclined surfaces for mutual abutment and transmission of adjacent side plates. After mutual abutment and extrusion, each set of side plates is bent toward the inside of the shield.

[0010] Preferably, multiple sets of limiting components are evenly distributed around the periphery of the chip, and each set of limiting components is used to abut and limit the conductive plates after bending. The plate body is provided with a connecting component and a second mounting component for assisting in connecting and fixing the limiting components. The limiting component includes a strip plate disposed above the plate body. A limiting plate is disposed between the strip plate and the plate body. A telescopic component for assisting in telescopic connection is disposed between the strip plate and the limiting plate. A second inclined surface is provided on one side of the limiting plate for abutting and transmitting with the end of the conductive plate during bending.

[0011] Preferably, the telescopic assembly includes multiple sets of sleeves fixed to the strip plate, with a sliding rod slidably connected to each sleeve. One end of the sliding rod is fixed to a limiting plate, and a spring is sleeved on the outside of each sleeve. The two ends of the spring are respectively abutted against the strip plate and the limiting plate.

[0012] Preferably, the connecting component includes a herringbone frame sleeved on the outside of the chip, and multiple sets of fixing rods for auxiliary connection and fixation are fixed between the herringbone frame and the strip plate.

[0013] Preferably, the second mounting component includes threaded holes at the four corners of the loop frame and on the plate, and the corresponding threaded holes on the plate and the loop frame are connected by T-bolts.

[0014] Preferably, the second mounting component includes multiple sets of sockets formed on a V-shaped plate, and the plate body is fixed with pins for insertion and fixing into the sockets.

[0015] A method for fabricating an integrated circuit board for rail transit signal controllers includes the following steps: S1: Install the components on the integrated circuit board of the rail transit signal machine onto the board body in sequence. After the components are installed on the board body, in order to assist the shielding and protection components in shielding and protecting the chip, install and connect the limiting components and the squeezing components around the chip in advance. S2: During the installation of the limit component, the loop frame is placed on the plate. During placement, the threaded holes on the loop frame are connected to the threaded holes on the plate. After placement, the T-bolts are threaded to the threaded holes. The loop frame is fixed on the plate by the thread action. During the fixing of the loop frame, the four strip plates are positioned above the loop-shaped grounding pad by the connection of the fixing rods, thus completing the installation and fixing of the limit component. S3: After the limit components are installed and fixed, install each set of extrusion components. During the installation process, push the V-shaped plate toward the plate body. During the pushing process, fix the pushed V-shaped plate by the insertion of each set of pins into each set of holes, and complete the installation of each set of extrusion components. S4: After the limiting component and the extrusion component are installed, the shielding and protection component is installed on the chip of the board. During the installation process, the entire shielding cover is pushed toward the chip on the board until the conductive plate at the bottom of each group of side plates abuts against the U-shaped grounding pad. During the pushing process, the end of each group of side plates away from the top plate abuts against the first inclined surface on the V-shaped plate. Since the two adjacent groups of side plates are flexibly connected by a rubber plate, during the process of the lower end of the side plate abutting against the first inclined surface, the lower end of each group of side plates is subjected to force and moves toward the inside of the shielding cover. S5: During the contraction movement of the lower ends of each set of side plates towards the inside of the shielding cover under the force, the conductive plate moves synchronously. During this movement, one side of the conductive plate abuts against the second inclined surface of the limiting plate. During this abutment, the limiting plate is subjected to force and moves, compressing and deforming the spring to generate elastic force. As the limiting plate moves under force, the sliding guide action of multiple sets of sleeves and slide rods causes the limited plate, after being subjected to force, to contract towards the strip plate until the conductive plate is below the limiting plate. At this point, the elastic force of the spring on the contracted limiting plate causes the limiting plate to... The positioning plate is moved away from the strip plate and resets. During the reset process, the limiting plate pushes the conductive plate below to abut against the U-shaped grounding pad. Through the abutment, the entire shielding and protection component is installed and limited. This installation method does not require welding, avoiding high temperature damage to the board circuit and chip peripheral components. It is also simple to install, solving the problems of cumbersome welding and high temperature damage. In addition, during the entire installation process, the elastic compression of the limiting plate and conductive plate by the spring ensures that the conductive plate and the U-shaped grounding pad are tightly attached, solving the problem of poor grounding caused by uneven screw force. S6: After the shielding and protection components are installed, the shielding cover formed by the top plate, side plates and rubber plate forms a closed metal cavity, which reflects and attenuates high-frequency electromagnetic radiation from the outside, and isolates the strong interference from the pantograph-catenary arc and traction converter. In addition, during the installation process, each set of conductive plates abuts against the loop-shaped grounding pad, so that the aluminum alloy shielding cover is connected to the plate ground potential as a whole, forming a complete Faraday cage that is not suspended or floating, thus ensuring the electromagnetic shielding effect.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention forms a closed metal cavity by installing a shielding and protection component on the outside of the chip, in conjunction with the grounding component on the shielding and protection component. This cavity reflects and attenuates high-frequency electromagnetic radiation from the outside, isolates the strong interference from the pantograph-catenary arc and traction converter, and ensures the stable use of the integrated circuit board of the rail transit signal machine. 2. During the installation and fixing process of the shielding and protection component on the integrated circuit board of the rail transit signal controller of the present invention, the cooperation between the extrusion component and the limiting component eliminates the need for welding, avoids high temperature damage to the board circuit and chip peripheral components, and simplifies the installation, solving the problems of cumbersome welding and high temperature damage. In addition, during the entire installation process, the elastic extrusion action ensures that the conductive plate and the loop-shaped grounding pad are tightly attached, solving the problem of poor grounding caused by uneven screw force. 3. The present invention achieves this by tightly bonding the conductive plate with the grounding pad, thereby connecting the entire shielding cover to the ground potential of the plate and forming a complete Faraday cage. This prevents the shielding cover from floating, ensures the continuity of electromagnetic shielding, eliminates problems such as poor grounding connection and poor contact, and further improves the stability of shielding protection. 4. The shielding and protection assembly of the present invention adopts a thin-walled aluminum alloy design, which not only meets the electromagnetic shielding requirements, but also has a good thermal conductivity, which can quickly dissipate the heat generated by the chip during operation, avoid chip aging and performance degradation caused by heat accumulation inside the cover, and take into account both shielding and heat dissipation requirements. 5. Through the structural design of the extrusion component, the limiting component, and the grounding component, combined with flexible connecting parts, the present invention can quickly complete the installation and fixation, and is suitable for the complex working conditions of rail transit, avoiding loosening or displacement of components during the installation process and ensuring installation accuracy; 6. This invention uses thin-walled aluminum alloy material combined with a flexible connection structure, which can adapt to complex working conditions such as high and low temperatures and vibration. It avoids the bulkiness and inconvenience of thick-walled parts, and ensures tight grounding through elastic compression, reducing electromagnetic leakage. At the same time, the aluminum alloy material is corrosion resistant and anti-aging, extending the overall service life of the integrated circuit board. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall external structure of the present invention; Figure 2 This is a schematic diagram showing the positional relationship between the shielding and protection component of the present invention and the chip before installation; Figure 3 This is a schematic diagram of the shielding and protection component structure of the present invention; Figure 4 This is a schematic diagram showing the positional relationship between the extrusion component and the limiting component of the present invention; Figure 5 This is a schematic diagram of the extrusion assembly and the first mounting assembly of the present invention; Figure 6 This is a schematic diagram showing the positional relationship between the limiting component, the connecting component, and the second mounting component of the present invention; Figure 7 This is a schematic diagram of the limiting component and the telescopic component of the present invention; Figure 8 This is a schematic diagram of the shielding and protection component of the present invention before installation; Figure 9 This is a schematic diagram showing the side plate bending state under stress during the installation of the shielding and protection component of the present invention; Figure 10 This is a schematic diagram showing the shielding and protection component of the present invention with its side plate bent and restricted during installation.

[0018] In the diagram: 101-Board body; 102-Chip; 201-Top plate; 202-Side plate; 203-Rubber plate; 301-Conductive plate; 302-U-shaped grounding pad; 401-V-shaped plate; 402-First inclined surface; 501-Socket; 502-Pin; 601-Strip plate; 602-Limiting plate; 603-Second inclined surface; 701-Sleeve; 702-Slide rod; 703-Spring; 801-U-shaped frame; 802-Fixing rod; 901-Threaded hole; 902-T-bolt. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Example 1

[0021] Please see Figures 1-10 The diagram shows a rail transit signal integrated circuit board, including a board body 101, on which a chip 102 for auxiliary control is disposed; It should be noted that other auxiliary components are also provided on the plate 101. In this application, the composition, control principle and installation principle of the components on the plate 101 are known technologies and will not be described in detail here. Also includes: A shielding and protection component is disposed on the outside of chip 102 and is used for anti-interference shielding during the control process of chip 102; A grounding component is disposed between the shielding and protective component and the plate 101, and is used for grounding conductivity during the anti-interference shielding process; In addition, a pressing component is provided on the plate 101 for pressing and pushing the shielding and protective component around its periphery, and a limiting component is provided on the plate 101 for pressing and limiting the shielding and protective component during the pressing and pushing process; The shielding and protection assembly includes a shielding cover, which consists of a top plate 201 and side plates 202 fixed around one side of the top plate 201. A rubber plate 203 for auxiliary flexible connection is fixed between two adjacent sets of side plates 202, and the top plate 201, the four sets of side plates 202 and the four sets of rubber plates 203 are arranged in a cover shape. It should be noted here that when the integrated circuit board of the rail transit signal controller is in use, a shielding protection component is installed on the outside of the chip 102, and together with the grounding component on the shielding protection component, a closed metal cavity is formed to reflect and attenuate external high-frequency electromagnetic radiation, isolate the strong interference of the rail transit pantograph-catenary arc and traction converter, and ensure the stable use of the integrated circuit board of the rail transit signal controller. During the installation and fixing process of the shielding and protection components on the integrated circuit board of the rail transit signal controller, the cooperation between the extrusion component and the limiting component eliminates the need for welding, thus avoiding high temperature damage to the board circuit and surrounding components of chip 102. The installation is also simple, solving the problems of cumbersome welding and high temperature damage. In addition, during the entire installation process, the elastic extrusion action ensures that the conductive plate 301 and the loop-shaped grounding pad 302 are tightly attached, solving the problem of poor grounding caused by uneven screw force.

[0022] Preferably, the top plate 201 and the side plate 202 are thin-walled parts, and the top plate 201 and the side plate 202 are made of aluminum alloy; It should be noted here that the use of thin-walled aluminum alloy components ensures effective heat conduction during the shielding process. In addition, the side plate 202 of the thin-walled component can be bent under stress when subjected to opposing forces on one side.

[0023] Preferably, the grounding assembly includes a conductive plate 301 fixed to the side of the side plate 202 away from the plate body 101, the conductive plate 301 is disposed facing the inside of the shield, and the periphery of the chip 102 is provided with a loop-shaped grounding pad 302 for contacting each group of conductive plates 301. It should be noted here that after the shielding and protection components are installed, the shielding cover formed by the top plate 201, side plate 202 and rubber plate 203 forms a closed metal cavity, which reflects and attenuates high-frequency electromagnetic radiation from the outside, and isolates the strong interference from the pantograph-catenary arc and traction converter. In addition, during the installation process, each set of conductive plates 301 abuts against the loop-shaped grounding pad 302, so that the aluminum alloy shielding cover is connected to the ground potential of the plate 101 as a whole, forming a complete Faraday cage, which is not suspended or floating, thus ensuring the electromagnetic shielding effect. Furthermore, in this application, the shielding protection and grounding conductivity of the shielding cover are known technologies, and their working principles and control methods will not be elaborated upon here.

[0024] Preferably, the extrusion components are evenly distributed at the four corners above the loop-shaped grounding pad 302, and a first mounting component for auxiliary installation is provided between the extrusion components and the plate 101. The extrusion components include a V-shaped plate 401, and the V-shaped plate 401 has two sets of first inclined surfaces 402 respectively for abutting and driving adjacent side plates 202. After abutting and extruding, each set of side plates 202 is bent toward the inside of the shield. It should be noted here that: the entire shielding cover is pushed toward the chip 102 on the board 101 until the conductive plate 301 at the bottom of each group of side plates 202 abuts against the U-shaped grounding pad 302. During the pushing process, the end of each group of side plates 202 away from the top plate 201 abuts against the first inclined surface 402 on the V-shaped plate 401. Since the two adjacent groups of side plates 202 are flexibly connected by the rubber plate 203, during the process of the lower end of the side plate 202 abutting against the first inclined surface 402, the lower end of each group of side plates 202 is subjected to force and moves toward the inside of the shielding cover.

[0025] Preferably, multiple sets of limiting components are evenly distributed around the chip 102, and each set of limiting components is used to abut against and limit the conductive plate 301 after bending. The plate body 101 is provided with a connecting component and a second mounting component for assisting in connecting and fixing the limiting components. The limiting component includes a strip plate 601 disposed above the plate body 101, a limiting plate 602 disposed between the strip plate 601 and the plate body 101, and a telescopic component for assisting in telescopic connection is disposed between the strip plate 601 and the limiting plate 602. A second inclined surface 603 is provided on one side of the limiting plate 602 for abutting against and transmitting with the end of the conductive plate 301 during bending. It should be noted here that: during the process of the lower end of each set of side plates 202 contracting towards the inside of the shielding cover under force, the conductive plate 301 moves synchronously. During the movement of the conductive plate 301, one side of the conductive plate 301 abuts against the second inclined surface 603 on the limiting plate 602. During the abutment process, the limiting plate 602 is subjected to force and moves, compressing and deforming the spring 703 to generate elastic force. During the force-driven movement of the limiting plate 602, multiple sets of sleeves 701 and slide rods 70 The sliding guide action of 2 causes the limit plate 602, after being subjected to force, to retract toward the strip plate 601 until the conductive plate 301 is below the limit plate 602. At this time, the elastic force of the spring 703 on the retracted limit plate 602 causes the limit plate 602 to move away from the strip plate 601 and reset. During the reset process, the limit plate 602 pushes the conductive plate 301 below to abut against the U-shaped grounding pad 302. Through the abutment action, the entire shielding and protection assembly is installed and limited after being pushed.

[0026] Preferably, the telescopic assembly includes multiple sets of sleeves 701 fixed on the strip plate 601, a slide rod 702 slidably connected to the sleeve 701, one end of the slide rod 702 being fixed to the limiting plate 602, and a spring 703 being sleeved on the outside of the sleeve 701, with both ends of the spring 703 abutting against the strip plate 601 and the limiting plate 602 respectively. It should be noted that: the multiple sets of sleeves 701 and slide rods 702 facilitate the extension and retraction guidance of the limiting plate 602 after being subjected to force; the spring 703 facilitates the elastic push of the limiting plate 602 after being subjected to force; in addition, during the entire installation process of the shielding and protection assembly, the elastic squeezing action of the spring 703 on the limiting plate 602 and the conductive plate 301 ensures that the conductive plate 301 is tightly attached to the U-shaped grounding pad 302, solving the problem of poor grounding caused by uneven screw force.

[0027] Preferably, the connecting component includes a loop frame 801 sleeved on the outside of the chip 102, and multiple sets of fixing rods 802 for auxiliary connection and fixing are fixed between the loop frame 801 and the strip plate 601; the second mounting component includes threaded holes 901 opened at the four corners of the loop frame 801 and on the plate 101, and the corresponding threaded holes 901 on the plate 101 and the loop frame 801 are threadedly connected by T-bolts 902. It should be noted that during the installation of the limit assembly, the loop frame 801 is placed on the plate 101. During placement, the threaded holes 901 on the loop frame 801 are connected to the threaded holes 901 on the plate 101. After placement, the T-bolts 902 are threaded to the threaded holes 901. The loop frame 801 is fixed on the plate 101 by the threaded action. During the fixing of the loop frame 801, the four strip plates 601 are positioned above the loop-shaped grounding pad 302 by the connection of the fixing rods 802, thus completing the installation and fixing of the limit assembly.

[0028] Preferably, the second mounting component includes multiple sets of sockets 501 formed on the V-shaped plate 401, and a pin 502 is fixed on the plate body 101 for being inserted and fixed to the sockets 501. It should be noted here that: when installing each set of extrusion components, the V-shaped plate 401 is pushed toward the plate body 101. During the pushing process, the V-shaped plate 401 is fixed by the insertion of each set of pins 502 into each set of holes 501, thus completing the installation of each set of extrusion components.

[0029] This solution describes a method for fabricating an integrated circuit board for rail transit signal controllers, comprising the following steps: S1: Install the components on the integrated circuit board of the rail transit signal machine onto the board 101 in sequence. After the components are installed on the board 101, in order to assist the shielding and protection components in shielding and protecting the chip 102, install and connect the limiting components and the squeezing components around the chip 102 in advance. S2: During the installation of the limit component, the loop frame 801 is placed on the plate 101. During the placement process, the threaded holes 901 on the loop frame 801 are connected to the threaded holes 901 on the plate 101. After placement, the T-bolts 902 are threaded to the threaded holes 901. The loop frame 801 placed on the plate 101 is fixed by the thread action. During the fixing of the loop frame 801, the four strip plates 601 are positioned above the loop-shaped grounding pad 302 by the connection of the fixing rods 802, thus completing the installation and fixing of the limit component. S3: After the limiting components are installed and fixed, install each set of extrusion components. During the installation process, push the V-shaped plate 401 toward the plate body 101. During the pushing process, the V-shaped plate 401 is fixed by the insertion of each set of pins 502 into each set of holes 501, thus completing the installation of each set of extrusion components (see the installation of the limiting components and extrusion components). Figure 1 , Figure 2 and Figure 4 (state) S4: After the limiting component and the extrusion component are installed, the shielding protection component is installed on the chip 102 of the plate 101. During the installation process, the entire shielding cover is pushed toward the chip 102 on the plate 101 until the conductive plate 301 at the bottom of each group of side plates 202 abuts against the U-shaped grounding pad 302. During the pushing process, the end of each group of side plates 202 away from the top plate 201 abuts against the first inclined surface 402 on the V-shaped plate 401. Since the two adjacent groups of side plates 202 are flexibly connected by the rubber plate 203, during the process of the lower end of the side plate 202 abutting against the first inclined surface 402, the lower end of each group of side plates 202 is subjected to force and moves toward the inside of the shielding cover (see Figure 9 (state) S5: During the process of the lower end of each set of side plates 202 contracting towards the inside of the shielding cover under force, the conductive plate 301 moves synchronously. During the movement of the conductive plate 301, one side of the conductive plate 301 abuts against the second inclined surface 603 on the limiting plate 602. During the abutment process, the limiting plate 602 is subjected to force and moves, compressing and deforming the spring 703 to generate elastic force. During the force-driven movement of the limiting plate 602, through the sliding guidance of multiple sets of sleeves 701 and slide rods 702, the limiting plate 602 after being subjected to force contracts towards the strip plate 601 until the conductive plate 301 is below the limiting plate 602. At this time, the spring 703 controls the contracted limiting plate 602. The elastic force of spring 703 causes the limiting plate 602 to move away from the strip plate 601 and reset. During the reset process, the limiting plate 602 pushes the conductive plate 301 below to abut against the loop-shaped grounding pad 302. Through the abutment, the entire shielding and protection assembly is installed and limited after being pushed. This installation method does not require welding, avoiding high temperature damage to the board circuit and the surrounding components of the chip 102. It is also simple to install, solving the problems of cumbersome welding and high temperature damage. In addition, during the entire installation process, the elastic squeezing action of spring 703 on the limiting plate 602 and the conductive plate 301 ensures that the conductive plate 301 and the loop-shaped grounding pad 302 are tightly attached, solving the problem of poor grounding caused by uneven screw force. S6: After the shielding and protection components are installed, the shielding cover formed by the top plate 201, side plate 202 and rubber plate 203 forms a closed metal cavity, which reflects and attenuates external high-frequency electromagnetic radiation and isolates the strong interference of the rail transit pantograph-catenary arc and traction converter. In addition, during the installation process, each set of conductive plates 301 abuts against the loop-shaped grounding pad 302, so that the aluminum alloy shielding cover is connected to the ground potential of the plate 101 as a whole, forming a complete Faraday cage that is not suspended or floating, thus ensuring the electromagnetic shielding effect.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit board for rail transit signal controllers, comprising: Board (101), on which a chip (102) for auxiliary control is provided; Its characteristic is that it further includes: A shielding and protection component is disposed on the outside of the chip (102) for interference shielding during the control process of the chip (102); A grounding component is disposed between the shielding and protective component and the plate (101) for grounding conduction during the anti-interference shielding process; And, a pressing component disposed on the plate (101) for pressing and pushing the shielding and protective component around its periphery, wherein the plate (101) is provided with a limiting component for pressing and limiting the shielding and protective component during the pressing and pushing process; The shielding and protection assembly includes a shielding cover, which consists of a top plate (201) and side plates (202) fixed around one side of the top plate (201). A rubber plate (203) for auxiliary flexible connection is fixed between two adjacent sets of side plates (202), and the top plate (201), the four sets of side plates (202) and the four sets of rubber plates (203) are arranged in a cover shape.

2. The integrated circuit board for rail transit signal controllers according to claim 1, characterized in that: The top plate (201) and side plate (202) are thin-walled components, and the top plate (201) and side plate (202) are made of aluminum alloy.

3. The integrated circuit board for rail transit signal controllers according to claim 2, characterized in that: The grounding assembly includes a conductive plate (301) fixed to the side of the side plate (202) away from the plate body (101). The conductive plate (301) is disposed facing the inside of the shield. The chip (102) is provided with a U-shaped grounding pad (302) on its periphery for contacting each group of conductive plates (301).

4. The integrated circuit board for rail transit signal controllers according to claim 3, characterized in that: The extrusion components are evenly distributed at the four corners above the U-shaped grounding pad (302), and a first mounting component for auxiliary installation is provided between the extrusion components and the plate (101). The extrusion components include a V-shaped plate (401). The V-shaped plate (401) has two sets of first inclined surfaces (402) for mutual abutment and transmission of adjacent side plates (202), and each set of side plates (202) is bent toward the inside of the shield after mutual abutment and extrusion.

5. The integrated circuit board for rail transit signal controllers according to claim 4, characterized in that: The limiting components are evenly distributed in multiple sets around the chip (102), and each set of the limiting components is used to abut against and limit the conductive plate (301) after bending movement. The plate body (101) is provided with a connecting component and a second mounting component for assisting in connecting and fixing the limiting components. The limiting component includes a strip plate (601) disposed above the plate body (101). A limiting plate (602) is disposed between the strip plate (601) and the plate body (101). A telescopic component for assisting in telescopic connection is disposed between the strip plate (601) and the limiting plate (602). A second inclined surface (603) is opened on one side of the limiting plate (602) for abutting and driving the end of the conductive plate (301) after bending movement.

6. The integrated circuit board for rail transit signal controllers according to claim 5, characterized in that: The telescopic assembly includes multiple sets of sleeves (701) fixed on the strip plate (601). A slide rod (702) is slidably connected to the sleeve (701). One end of the slide rod (702) is fixed to the limiting plate (602). A spring (703) is sleeved on the outside of the sleeve (701). The two ends of the spring (703) are respectively abutted against the strip plate (601) and the limiting plate (602).

7. The integrated circuit board for rail transit signal controllers according to claim 5, characterized in that: The connecting component includes a loop frame (801) sleeved on the outside of the chip (102), and multiple sets of fixing rods (802) for auxiliary connection and fixing are fixed between the loop frame (801) and the strip plate (601).

8. The integrated circuit board for rail transit signal controllers according to claim 7, characterized in that: The second mounting component includes threaded holes (901) at the four corners of the loop frame (801) and on the plate (101), and the corresponding threaded holes (901) on the plate (101) and the loop frame (801) are threadedly connected by T-bolts (902).

9. The integrated circuit board for rail transit signal controllers according to claim 4, characterized in that: The second mounting assembly includes multiple sets of sockets (501) formed on a V-shaped plate (401), and a pin (502) is fixed on the plate body (101) for insertion and fixing into the sockets (501).

10. A method for manufacturing an integrated circuit board for a rail transit signal as described in any one of claims 1 to 9, characterized in that, Includes the following steps: S1: Install each component on the integrated circuit board of the rail transit signal machine onto the board body (101) in sequence. After the components are installed on the board body (101), in order to assist the shielding and protection components in shielding and protecting the chip (102), the limiting components and the squeezing components are pre-installed and connected on the periphery of the chip (102). S2: During the installation of the limit component, the loop frame (801) is placed on the plate (101). During the placement process, the threaded holes (901) on the loop frame (801) are connected to the threaded holes (901) on the plate (101). After placement, the T bolts (902) are threaded to the threaded holes (901) that are connected to each group. Through the thread action, the loop frame (801) placed on the plate (101) is fixed. During the fixing of the loop frame (801), through the connection of the fixing rods (802), the four strip plates (601) are positioned above the loop grounding pad (302), thus completing the installation and fixing of the limit component. S3: After the limit component is installed and fixed, each group of extrusion components is installed. During the installation process, the V-shaped plate (401) is pushed toward the plate body (101). During the pushing process, the V-shaped plate (401) is fixed after being pushed by the insertion of each group of pins (502) into each group of holes (501), thus completing the installation of each group of extrusion components. S4: After the limit assembly and the extrusion assembly are installed, the shielding and protection assembly is installed on the chip (102) of the plate (101). During the installation process, the entire shielding cover is pushed toward the chip (102) on the plate (101) until the conductive plate (301) at the bottom of each group of side plates (202) abuts against the loop-shaped grounding pad (302). During the pushing process, the end of each group of side plates (202) away from the top plate (201) abuts against the first inclined surface (402) on the V-shaped plate (401). Since the two adjacent groups of side plates (202) are flexibly connected by a rubber plate (203), during the process of the lower end of the side plate (202) abutting against the first inclined surface (402), the lower end of each group of side plates (202) is subjected to force and moves toward the inside of the shielding cover. S5: During the process of the lower end of each set of side plates 2 (02) being forcefully contracted towards the inside of the shield, the conductive plate (301) is driven to move synchronously. During the movement of the conductive plate (301), one side of the conductive plate (301) abuts against the second inclined surface (603) on the limiting plate (602). During the abutment process, the limiting plate (602) is forcefully moved and the spring (703) is compressed and deformed to generate elastic force. During the forceful movement of the limiting plate (602), through the sliding guidance of multiple sets of sleeves (701) and slide rods (702), the limiting plate (602) after being forcefully moved towards the strip plate (601) until the conductive plate (301) is below the limiting plate (602). At this time, the spring (703) controls the contracted limiting plate. The elastic force of the position plate (602) causes the limiting plate (602) to move away from the strip plate (601) and reset. During the reset process, the limiting plate (602) pushes the conductive plate (301) below to abut against the loop-shaped grounding pad (302). Through the abutting action, the entire shielding and protection assembly is installed and limited. This installation method does not require welding, avoids high temperature burning of the board circuit and the peripheral devices of the chip (102), and is easy to install, solving the problems of cumbersome welding and high temperature damage. In addition, during the entire installation process, the elastic squeezing action of the spring (703) on the limiting plate (602) and the conductive plate (301) ensures that the conductive plate (301) and the loop-shaped grounding pad (302) are tightly attached, solving the problem of poor grounding caused by uneven screw force. S6: After the shielding and protection components are installed, the shielding cover formed by the top plate (201), side plate (202) and rubber plate (203) forms a closed metal cavity, which reflects and attenuates the high-frequency electromagnetic radiation from the outside, and isolates the strong interference of the rail transit pantograph-catenary arc and traction converter. In addition, during the installation process, each set of conductive plates (301) abuts against the loop-shaped grounding pad (302), so that the aluminum alloy shielding cover is connected to the ground potential of the plate (101) as a whole, forming a complete Faraday cage, which is not suspended or floating, and ensures the electromagnetic shielding effect.

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