Semiconductor circuit and control panel

Abstract

The application provides a semiconductor circuit and an electric control board, comprising: a hollow substrate, at least one side of the hollow substrate being provided with a circuit board; a cavity being formed in the interior of the hollow substrate and being provided with an interface connected with an external refrigeration system, so that a refrigerant medium is circulated and flows between the cavity and the external refrigeration system, and the circuit board is radiated; the application is connected with the external refrigeration system through the interface and the hollow substrate, active circulation radiating of the refrigerant medium is realized, the problem of poor adhesion with a radiator and radiating failure caused by substrate tolerance or high-temperature warping is completely solved, and the equipment cost and the complexity of installation are effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of intelligent power module technology, and more specifically, to a semiconductor circuit and an electronic control board. Background Technology

[0002] Existing MIPS modular intelligent power systems mostly use metal or ceramic substrates as carriers and achieve heat dissipation by installing heat sinks on the back of the substrate. However, such substrates are prone to warping due to tolerances or high-temperature deformation, resulting in poor adhesion to the heat sink and seriously affecting the heat dissipation effect. In addition, adding heat sinks increases costs. For high-power products, some use water cooling, but this cooling method requires an independent water circulation system, which further increases equipment costs and installation complexity. Summary of the Invention

[0003] In view of this, the present invention aims to provide a semiconductor circuit and an electronic control board to solve the problems in the prior art where the substrate of the modular intelligent power system is prone to warping due to tolerance or high temperature deformation, resulting in poor contact with the heat sink, which seriously affects the heat dissipation effect. In addition, the additional heat sink increases the cost, and water cooling requires an independent water circulation system, which increases the equipment cost and installation complexity.

[0004] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0005] A semiconductor circuit, comprising:

[0006] A hollow substrate, wherein a circuit board is provided on at least one side of the hollow substrate;

[0007] The hollow substrate has a cavity inside and an interface for connecting to an external cooling system, which allows the cooling medium to circulate between the cavity and the external cooling system to dissipate heat from the circuit board.

[0008] In some embodiments, the cavity is configured such that the cross-sectional area of ​​the middle region is larger than the cross-sectional area of ​​the two side regions.

[0009] In some embodiments, the cavity includes a left cavity, a left variable-diameter cavity, a middle cavity, a right variable-diameter cavity, and a right cavity that are connected sequentially from left to right.

[0010] In some embodiments, the interface is provided with a condenser pipe connection port, and the interface is connected to the external refrigeration system through the condenser pipe connection port.

[0011] In some embodiments, one of the interface and the condenser pipe connection port is provided with at least one boss, and the other is provided with at least one stop, and the boss and the stop can be rotated and engaged.

[0012] In some embodiments, the condenser pipe connection port is provided with a plurality of protrusions, the plurality of protrusions are arranged at intervals around the outer wall of the condenser pipe connection port, and the plurality of protrusions are located at one end of the condenser pipe connection port;

[0013] Multiple stops are formed at the interface, and a groove is formed between two adjacent stops. The multiple grooves are arranged at intervals around the inner wall of the interface. The grooves are configured to allow the boss to enter the cavity and abut against the stop.

[0014] In some embodiments, there is a one-to-one correspondence between the plurality of bosses and the plurality of grooves, and the angle between adjacent bosses is A. .

[0015] In some embodiments, a stop step is formed on the condenser tube connection port, the stop step being located on the side away from the boss and used to abut against the interface.

[0016] In some embodiments, the condenser pipe connection port is further provided with a connection end on the side away from the boss, and the connection end is connected to the stop step for connecting to the condenser pipe of the external refrigeration system.

[0017] In some embodiments, a positioning groove is formed at the interface, the positioning groove being used to accommodate the stop step and limit the stop step.

[0018] In some embodiments, the positioning groove is provided with a reset baffle and a reset spring, and the reset spring is located between the reset baffle and the bottom wall of the positioning groove;

[0019] The reset spring pushes the stop step through the reset baffle, pressing the boss and the stop block together.

[0020] Secondly, embodiments of this application also provide an electronic control board, including the aforementioned semiconductor circuit.

[0021] Compared with the prior art, the semiconductor circuit and electronic control board of the present invention have the following advantages:

[0022] 1) By setting a hollow substrate and connecting it to an external refrigeration system through an interface, active circulation and heat dissipation of the cooling medium are realized, which completely solves the problem of poor contact with the heat sink and heat dissipation failure caused by substrate tolerance or high temperature warping, and effectively reduces equipment cost and installation complexity.

[0023] 2) A quick, secure, and detachable mechanical locking mechanism is achieved between the interface and the condenser pipe connection port. This connection method is not only easy to operate, but also effectively resists loosening caused by refrigerant pressure fluctuations or equipment vibration by utilizing the rotating locking structure, greatly enhancing the reliability of the connection.

[0024] 3) After the boss rotates into place, the elastic force generated by the return spring continuously pushes the stop step through the return baffle, so that the boss and the stop block always remain tightly pressed together. This design can effectively absorb the small deformation and gap caused by long-term use, temperature changes or slight vibrations, and ensure that the connection is always in a tight and secure state without loosening. This greatly improves the fatigue resistance and long-term reliability of the connection and prevents refrigerant leakage. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the semiconductor circuit described in an embodiment of the present invention;

[0026] Figure 2 for Figure 1 A structural diagram from a second perspective;

[0027] Figure 3 for Figure 1 Schematic diagram of the connection port of the central condenser tube;

[0028] Figure 4 for Figure 3 A structural diagram from a second perspective;

[0029] Figure 5 for Figure 3 Third-view structural diagram

[0030] Figure 6 for Figure 1 A schematic diagram of the interface structure;

[0031] Figure 7 for Figure 2 A magnified schematic diagram of the structure at point A in the middle.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Hollow substrate; 11. Insulating layer; 12. Copper foil layer; 13. Green oil layer; 14. Chip resistor; 15. Chip capacitor; 16. Component; 17. Bonding wire; 18. Package; 19. Lead; 2. Cavity; 21. Left cavity; 22. Left variable diameter cavity; 23. Middle cavity; 24. Right variable diameter cavity; 25. Right cavity; 3. Condenser tube connection port; 31. Boss; 32. Stop step; 33. Connection end; 4. Interface; 401. Left interface; 402. Right interface; 41. Stop block; 42. Groove; 43. Positioning groove; 44. Reset baffle; 45. Reset spring; 51. Metal heat sink; 52. Semi-finished component. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the described embodiments are only some, not all, of the embodiments of this invention. The specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0035] To cool MIPS modular intelligent power systems, heat sinks are typically placed on the back of the substrate. However, the substrate is prone to deformation due to tolerances or high temperatures, resulting in poor adhesion between the substrate and the heat sink, affecting heat dissipation. Furthermore, adding an extra heat sink increases costs. For high-power products, some use water cooling, but this method requires an independent water circulation system, further increasing equipment costs and installation complexity. Meanwhile, existing MIPS modular intelligent power systems generally integrate only a single MIPS module, and the integration of multiple MIPS modular intelligent power systems has not yet been achieved. With market miniaturization and low-cost competition, higher demands are being placed on the high integration and heat dissipation technologies of MIPS modular intelligent power systems.

[0036] To address the issue that the substrate of modular intelligent power systems is prone to warping due to tolerances or high temperatures, resulting in poor contact with the heat sink and severely impacting heat dissipation, and that adding an additional heat sink increases costs, while water cooling requires an independent water circulation system, further increasing equipment costs and installation complexity, this application provides a semiconductor circuit and control board. By setting a hollow substrate 1 and connecting it to an external cooling system via an interface, active circulation of the cooling medium is achieved, significantly enhancing temperature regulation and solving the contact problems caused by traditional substrate warping. This also effectively reduces equipment costs and installation complexity. Furthermore, this design improves circuit integration, enabling the integration of multiple MIPS modular intelligent power systems, adapting to the trend of miniaturization and high integration, and reducing overall manufacturing costs.

[0037] To better understand this application, the following is combined with... Figures 1 to 7 The technical solution of this application is described in detail.

[0038] On the one hand, embodiments of this application provide a semiconductor circuit, such as Figures 1-7 As shown, it includes:

[0039] Hollow substrate 1, wherein a circuit board is provided on at least one side of the hollow substrate 1;

[0040] The hollow substrate 1 has a cavity 2 inside and an interface 4 for connecting to an external cooling system, which allows the cooling medium to circulate between the cavity 2 and the external cooling system to dissipate heat from the circuit board.

[0041] Specifically, by setting a hollow substrate 1 and connecting it to an external cooling system through interface 4, active circulation heat dissipation of the cooling medium is achieved. Compared with traditional technology, this application does not require an additional heat sink to be installed on the back of the substrate, which completely solves the problem of poor contact with the heat sink and heat dissipation failure caused by substrate tolerance or high temperature warping. It also effectively reduces equipment cost and installation complexity, and is especially suitable for high-integration and high-power application scenarios with stringent heat dissipation requirements.

[0042] Specifically, the hollow substrate 1 in this embodiment is a hollow metal substrate or a hollow ceramic substrate. A cooling medium, also known as a refrigerant, is a working medium in a refrigeration system that achieves heat transfer through a "phase change" (the interconversion of gaseous and liquid states).

[0043] In some embodiments, the cavity 2 is configured such that the cross-sectional area of ​​the middle region is larger than the cross-sectional area of ​​the two side regions.

[0044] Specifically, by designing cavity 2 as a structure that is "wider in the middle and narrower on both sides," the flow rate of the cooling medium slows down and its residence time lengthens as it flows through the middle region, thus enabling it to absorb heat from the circuit board more effectively. Meanwhile, the flow rate increases on both sides, facilitating the rapid removal of heat. This variable cross-section flow channel design not only optimizes the heat exchange efficiency between the cooling medium and the substrate, achieving enhanced heat dissipation in the core heat-generating area, but also utilizes the pressure difference generated by the fluid at the diameter change point to enhance the connection seal at interface 4, preventing cooling medium leakage.

[0045] In some embodiments, the cavity 2 includes a left cavity 21, a left variable-diameter cavity 22, a middle cavity 23, a right variable-diameter cavity 24, and a right cavity 25 that are connected sequentially from left to right.

[0046] Specifically, this stepped, smoothly transitioning variable diameter structure can prevent the refrigerant from generating eddies during flow, which would lead to excessive local resistance. It ensures that the refrigerant flows smoothly and the pressure distribution is uniform within the substrate, thereby making the temperature field on the substrate surface more uniform and improving the consistency and reliability of heat dissipation.

[0047] In some embodiments, the interface 4 is provided with a condenser pipe connection port 3, and the interface 4 is connected to the external refrigeration system through the condenser pipe connection port 3.

[0048] Specifically, by setting an independent condenser pipe connection port 3, a modular connection between the hollow base plate 1 and the external refrigeration system is achieved. This design not only simplifies the installation process and improves assembly efficiency, but also facilitates maintenance and replacement, enhancing the product's versatility. At the same time, the dedicated connection port 3 can also ensure the refrigerant's sealing at the connection point and prevent leakage.

[0049] In some embodiments, the interface 4 includes a left interface 401 and a right interface 402, which are respectively disposed on the left and right sides of the hollow substrate 1.

[0050] Specifically, this configuration allows the cooling medium to flow in from the left port 401 and out from the right port 402 (or vice versa), forming a symmetrical and balanced flow path within the cavity 2. This avoids localized cooling medium stagnation, ensures uniform heat dissipation in all areas of the hollow substrate 1, and improves the overall temperature control effect.

[0051] In some embodiments, one of the interface 4 and the condenser pipe connection port 3 is provided with at least one boss 31, and the other is provided with at least one stop 41, and the boss 31 and the stop 41 can be rotated and engaged.

[0052] Specifically, this design enables a quick, secure, and detachable mechanical lock between interface 4 and condenser pipe connection port 3. This connection method is not only convenient to operate without the need for additional tools, but also effectively resists loosening caused by refrigerant pressure fluctuations or equipment vibrations by utilizing the rotating locking structure, greatly enhancing the reliability of the connection.

[0053] In some embodiments, the condenser pipe connection port 3 is provided with a plurality of protrusions 31, the plurality of protrusions 31 are arranged at intervals around the outer wall of the condenser pipe connection port 3, and the plurality of protrusions 31 are located at one end of the condenser pipe connection port 3;

[0054] Multiple stops 41 are formed at the interface 4, and a groove 42 is formed between two adjacent stops 41. The multiple grooves 42 are arranged at intervals around the inner wall of the interface 4. The grooves 42 are configured to allow the protrusion 31 to enter the cavity 2 and abut against the stop 41.

[0055] Specifically, this design enables simultaneous engagement at multiple points, resulting in more even stress distribution at the connection points, avoiding localized stress concentration, and significantly enhancing the strength and stability of the connection. During installation, the boss 31 first enters through the groove 42, then rotates to abut against the stop block 41. This "insertion-rotation-locking" installation method not only ensures a reliable connection but also provides a clear sense of positioning, preventing misoperation and ensuring the quality and consistency of the installation.

[0056] In some embodiments, the plurality of protrusions 31 correspond one-to-one with the plurality of grooves 42, and the angle between adjacent protrusions 31 is A. .

[0057] Specifically, the angle range between adjacent bosses 31 is limited to 15° to 180°, which can balance the snap-fit ​​strength and the ease of assembly, and adapt to different specifications of interfaces 4 and connection ports 3. This avoids the difficulty of processing bosses 31 due to excessively small angles, and also prevents insufficient locking force due to excessively large angles. It ensures smooth rotation and snap-fit ​​while providing sufficient locking contact area, thereby improving the reliability of the connection.

[0058] In some embodiments, a stop step 32 is formed on the condenser tube connection port 3. The stop step 32 is located on the side away from the boss 31 and is used to abut against the interface 4.

[0059] Specifically, the stop step 32 can provide precise axial positioning for the rotation and snapping process. During the process of the boss 31 being inserted into the groove 42, the stop step 32 abuts against the end face of the interface 4, which can accurately control the depth of the condenser pipe connection port 3 inserted into the hollow substrate 1, preventing excessive insertion from damaging the internal structure or affecting the refrigerant flow. At the same time, it provides a reference position for subsequent rotation actions, ensuring the consistency and sealing of each connection.

[0060] In some embodiments, the condenser pipe connection port 3 is further provided with a connection end 33 on the side away from the boss 31. The connection end 33 is connected to the stop step 32 and is used to connect to the condenser pipe of the external refrigeration system.

[0061] Specifically, the connection end 33 can be standardized according to actual application scenarios, such as condenser tubes of different diameters and materials, making the condenser tube connection port 3 a universal adapter component, enhancing the product's adaptability and flexibility, and further simplifying on-site installation work.

[0062] In some embodiments, a positioning groove 43 is formed at the interface 4, the positioning groove 43 is used to accommodate the stop step 32 and limit the stop step 32.

[0063] Specifically, the cooperation between the positioning groove 43 and the stop step 32 provides dual limiting for the connection. After the stop step 32 is embedded in the positioning groove 43, it not only achieves precise axial limiting, but also provides circumferential constraint, preventing the connection port 3 from accidentally rotating and loosening when subjected to external force or vibration, thus further enhancing the reliability and stability of the connection.

[0064] In some embodiments, the positioning groove 43 is provided with a reset baffle 44 and a reset spring 45, and the reset spring 45 is located between the reset baffle 44 and the bottom wall of the positioning groove 43.

[0065] The reset spring 45 pushes the stop step 32 through the reset baffle 44, so that the boss 31 and the stop block 41 are pressed together.

[0066] Specifically, after the boss 31 rotates into position, the elastic force generated by the return spring 45 continuously pushes the stop step 32 through the return baffle 44, ensuring that the boss 31 and the stop block 41 remain tightly pressed together. This design effectively absorbs minor deformations and gaps caused by long-term use, temperature changes, or slight vibrations, ensuring that the connection is always in a locked state without loosening, greatly improving the fatigue resistance and long-term reliability of the connection, and preventing refrigerant leakage.

[0067] Secondly, embodiments of this application also provide an electronic control board, including the aforementioned semiconductor circuit.

[0068] By incorporating the aforementioned semiconductor circuitry into the control board, the entire board acquires highly efficient and reliable active heat dissipation capabilities. This control board eliminates the need for bulky external heatsinks or complex water-cooling systems, enabling it to stably drive high-power loads. This significantly improves the power density and integration of the control board, while reducing the overall size and manufacturing cost of the device. Furthermore, due to the excellent shock resistance and high-temperature resistance of the semiconductor circuitry itself, the integrated control board's operational stability and lifespan under harsh operating conditions are also greatly enhanced.

[0069] In some embodiments, the semiconductor circuit further includes an insulating layer 11 disposed on the hollow substrate 1, a copper foil layer 12 disposed on the insulating layer 11, a green oil layer 13 disposed on the copper foil layer 12, a chip resistor 14 disposed on the copper foil layer 12, a chip capacitor 15 disposed on the copper foil layer 12, a component 16, a bonding metal wire 17, and a package 18; the component 16 is electrically connected to the copper foil layer 12 through the bonding metal wire 17, and the two ends of the copper foil layer 12 are also provided with a plurality of pins 19.

[0070] In detail, the hollow substrate 1 serves as a carrier, and an insulating layer 11 is disposed on the hollow substrate 1. A copper foil layer 12 is disposed on the insulating layer 11, and the copper foil layer 12 is used for circuit wiring. The insulating layer 11 and the copper foil layer 12 are pressed together to form a pressed semi-finished product. The insulating layer of the pressed semi-finished product is pressed together with the hollow substrate 1 to form a hollow substrate semi-finished product. Then, a circuit wiring layer is formed on the surface of the copper foil layer 12 by etching. A green solder mask layer 13 is disposed on the circuit wiring layer to form a hollow substrate finished product. The green solder mask layer 13 protects the circuit wiring layer.

[0071] In some embodiments, the device further includes a silver-plated metal heat sink 51, on which the component 16 is soldered to form a component semi-finished product 52, and the component semi-finished product 52 is sealed with epoxy resin; a circuit wiring layer is formed by etching the copper foil layer 12, and the circuit wiring layer is electrically connected to the component 16 by bonding metal wires 17.

[0072] Here it should be noted that the insulating layer 11 is to prevent the circuit wiring layer from being energized with the hollow substrate 1, which could cause short circuits or leakage in the internal circuitry.

[0073] The copper foil layer 12 is used to form the desired circuit by etching the copper foil layer 12, thus creating a circuit wiring layer;

[0074] The protective layer, also known as the green oil layer 13, prevents soldering in places where it should not be applied, increases the withstand voltage between circuits, prevents short circuits caused by circuit oxidation or contamination, and protects the circuit.

[0075] The chip resistor 14 is connected at the gate of the IGBT chip in the semiconductor circuit to limit the switching speed of the IGBT by limiting the current.

[0076] The 15mm surface mount capacitor serves as a filter, coupler, and bootstrap in semiconductor circuits.

[0077] Component 16: Chips required to form the internal functional circuits of a semiconductor circuit;

[0078] Component semi-finished product 52: High-voltage power components are mounted on heat sinks to form component semi-finished product 52.

[0079] The metal heat sink 51 is silver-plated on the copper surface, which makes the component 16 fit better with the heat sink and improves the heat dissipation capacity.

[0080] The metal wire 17 (the metal wire is generally made of gold, aluminum, copper, etc.) is used to make electrical connections between components in the circuit.

[0081] The encapsulation body 18 is a powdered molding compound made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, silicon micro powder and other fillers, and various additives. It is extruded into the mold cavity by heat transfer molding and embeds the semiconductor chip therein. At the same time, it is cross-linked and cured to form a device with a certain external structure.

[0082] Pin 19 serves as the input / output pin of the semiconductor circuit and is soldered to the corresponding pin on the control board to achieve electrical connection.

[0083] In some embodiments, when sealing the component semi-finished product 52 with epoxy resin, it is necessary to ensure that the solder joints of the external pins 19 are exposed.

[0084] Thirdly, embodiments of this application also provide a method for manufacturing a semiconductor circuit, comprising the following steps:

[0085] Step 1: Block the interface 4 of the hollow substrate 1 to prevent the cavity 2 inside the hollow substrate 1 from being contaminated and oxidized.

[0086] Step 2: Place the hollow substrate product onto a special carrier (the carrier can be made of materials that can withstand high temperatures above 200°C, such as aluminum, synthetic stone, ceramic, or PPS) using automated equipment or manual methods. Apply solder paste or silver glue to the component mounting positions reserved in the copper foil circuit. Then, mount the semiconductor inverter components onto the component mounting positions using an automated die bonding machine (DA machine).

[0087] Step 3: The high-voltage power device (PFC circuit) is mounted onto the metal heat sink 51 using a soft solder die bonder to form a component semi-finished product 52;

[0088] Step 4: Place pin 19 into the mounting position on the hollow substrate using manual or automated equipment;

[0089] Step 5: Use an automated surface mount technology (SMT) machine to mount resistors, capacitors, and semi-finished components onto the component mounting positions;

[0090] Step 6: The component semi-finished product 52, including the carrier, is passed through a reflow oven to weld all the components to the corresponding mounting positions;

[0091] Step 7: Inspect the soldering quality of components using visual inspection AOI equipment;

[0092] Step 8: Remove residual flux and aluminum shavings on the hollow substrate 1 by cleaning methods such as spraying and ultrasonic cleaning;

[0093] Step 9: Connect the circuit elements and the circuit wiring to form an electrical connection using a bonding wire;

[0094] Step 10: The circuit of the hollow substrate 1 is encapsulated in a specific mold using packaging equipment, and then the product is marked by laser marking.

[0095] Step 11: Conduct electrical parameter tests to obtain the final qualified product;

[0096] In practical use, qualified products are electrically connected to the control board via wave soldering, and then the interface 4 of the hollow substrate 1 is connected to the condenser tube connection port 3 to achieve the final installation of the semiconductor circuit.

[0097] The semiconductor circuits described in this application can be extended to fields such as consumer electronics, energy storage, photovoltaics, and new energy.

[0098] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A semiconductor circuit, characterized in that, include: Hollow substrate (1), at least one side of the hollow substrate (1) is provided with a circuit board; The hollow substrate (1) has a cavity (2) inside and an interface (4) for connecting to an external cooling system, so that the cooling medium can circulate between the cavity (2) and the external cooling system to dissipate heat from the circuit board.

2. The semiconductor circuit according to claim 1, characterized in that, The cavity (2) is configured such that the cross-sectional area of ​​the middle region is greater than the cross-sectional area of ​​the two side regions.

3. The semiconductor circuit according to claim 2, characterized in that, The cavity (2) includes a left cavity (21), a left variable diameter cavity (22), a middle cavity (23), a right variable diameter cavity (24), and a right cavity (25) connected from left to right.

4. The semiconductor circuit according to claim 1, characterized in that, The interface (4) is provided with a condenser pipe connection port (3), and the interface (4) is connected to the external refrigeration system through the condenser pipe connection port (3).

5. The semiconductor circuit according to claim 4, characterized in that, The interface (4) and the condenser pipe connection port (3) are provided with at least one boss (31) on one and at least one stop (41) on the other, and the boss (31) and the stop (41) can be rotated and engaged.

6. The semiconductor circuit according to claim 5, characterized in that, The condenser tube connection port (3) is provided with a plurality of protrusions (31), the plurality of protrusions (31) are arranged at intervals around the outer wall of the condenser tube connection port (3), and the plurality of protrusions (31) are located at one end of the condenser tube connection port (3); Multiple stops (41) are formed at the interface (4), and a groove (42) is formed between two adjacent stops (41). The multiple grooves (42) are arranged at intervals around the inner wall of the interface (4). The grooves (42) are configured to allow the boss (31) to enter the cavity (2) and abut against the stop (41).

7. The semiconductor circuit according to claim 6, characterized in that, Each of the protrusions (31) corresponds one-to-one with a groove (42), and the angle between adjacent protrusions (31) is A. .

8. The semiconductor circuit according to claim 5, characterized in that, A stop step (32) is formed on the condenser tube connection port (3). The stop step (32) is located on the side away from the boss (31) and is used to abut against the interface (4).

9. The semiconductor circuit according to claim 8, characterized in that, The condenser pipe connection port (3) is also provided with a connection end (33) on the side away from the boss (31). The connection end (33) is connected to the stop step (32) and is used to connect to the condenser pipe of the external refrigeration system.

10. The semiconductor circuit according to claim 8, characterized in that, A positioning groove (43) is formed at the interface (4), the positioning groove (43) is used to accommodate the stop step (32) and limit the stop step (32).

11. The semiconductor circuit according to claim 10, characterized in that, The positioning groove (43) is provided with a reset baffle (44) and a reset spring (45), and the reset spring (45) is located between the reset baffle (44) and the bottom wall of the positioning groove (43); The reset spring (45) pushes the stop step (32) through the reset baffle (44), so that the boss (31) and the stop block (41) are pressed together.

12. An electronic control board, characterized in that, Includes the semiconductor circuit described in any one of claims 1-11.

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