Semiconductor circuit, electric control board and air conditioner

Abstract

The application provides a semiconductor circuit, an electric control board and an air conditioner, which comprise at least two circuit boards, and a hollow base plate is arranged between the two opposite circuit boards; a cavity is formed in the hollow base plate, and a medium inlet and a medium outlet which are communicated with the cavity are arranged on the hollow base plate, the medium inlet is connected with a cooling medium supply device, the cooling medium enters the cavity through the medium inlet and is discharged outward through the medium outlet, and the cooling medium is used for heat dissipation of the circuit boards; the hollow base plate is arranged, the cavity is formed in the hollow base plate, the medium inlet and the medium outlet are matched, the cooling medium can flow through the inside of the base plate, the heat dissipation of the upper and lower circuit boards is simultaneously realized, the heat dissipation efficiency and the structural reliability are obviously improved, the circuit integration is greatly improved, the development trend of miniaturization and high integration is adapted, and the overall manufacturing cost can be reduced.

Description

Technical Field

[0001] This invention relates to the field of intelligent power module technology, and more specifically, to a semiconductor circuit, an electronic control board, and an air conditioner. Background Technology

[0002] Semiconductor circuits, namely Modular Intelligent Power Systems (MIPS), integrate power switching devices, drive circuits, and fault detection circuits, and are widely used in consumer electronics, energy storage, photovoltaics, and new energy fields. However, existing MIPS systems have several technical shortcomings: First, they can only integrate a single MIPS module, making it difficult to meet the market's demand for high integration. Second, they use metal or ceramic substrates as the base material, and are generally single-sided substrates, with circuitry arranged on one side and a heat sink installed on the other for heat dissipation. This limits the integration space and makes them unsuitable for the trend of miniaturization. Third, an additional heat sink needs to be installed on the back of the substrate to meet heat dissipation requirements, which not only increases manufacturing costs but also makes the substrate prone to warping due to tolerances or high temperatures, resulting in poor adhesion to the heat sink and affecting heat dissipation performance, making it difficult to cope with the high heat dissipation pressure brought about by high integration. Summary of the Invention

[0003] In view of this, the present invention aims to provide a semiconductor circuit, an electronic control board, and an air conditioner to solve the problems in the prior art where the substrate of the modular intelligent power system is prone to warping due to tolerance or high temperature deformation, resulting in poor adhesion to the heat sink and affecting the heat dissipation effect. In addition, the additional heat sink increases the cost. Furthermore, the substrate only has circuits arranged on one side and the other side is used to install the heat sink for heat dissipation, resulting in limited integration space and inability to adapt to the trend of miniaturization.

[0004] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0005] A semiconductor circuit includes: at least two circuit boards, with a hollow substrate disposed between two opposing circuit boards;

[0006] The hollow substrate has a cavity inside, and is provided with a medium inlet and a medium outlet communicating with the cavity. The medium inlet is connected to a cooling medium supply device. The cooling medium enters the cavity through the medium inlet and is discharged outward through the medium outlet to dissipate heat from the circuit board.

[0007] In some embodiments, the medium inlet is located near the lower part of the cavity, and the medium outlet is located near the upper part of the cavity. When the cooling medium overflows into the medium outlet within the cavity, it is discharged outward from the medium outlet.

[0008] In some embodiments, the medium inlet and the medium outlet are arranged diagonally within the cavity, so that the cooling medium flows diagonally within the cavity.

[0009] In some embodiments, the cavity is configured such that the cross-sectional area of ​​the middle region is larger than the cross-sectional area of ​​the two side regions.

[0010] In some embodiments, the medium inlet is located on the first sidewall of the cavity, and the medium outlet is located on the second sidewall of the cavity, with the first sidewall and the second sidewall being disposed opposite to each other.

[0011] In some embodiments, the medium inlet and the medium outlet are located on the same side wall of the cavity.

[0012] In some embodiments, the first sidewall of the cavity protrudes outward to form a first protrusion, and the medium inlet is located at the lower part of the first protrusion; the second sidewall of the cavity protrudes outward to form a second protrusion, and the medium outlet is located at the upper part of the second protrusion.

[0013] In some embodiments, the hollow substrate and the circuit boards on both sides are covered with an encapsulation.

[0014] In some embodiments, the package further includes pins that extend perpendicularly to the direction of the medium inlet, and the solder joints of the pins are exposed outside the package.

[0015] In some embodiments, the pin has a plurality of first pins and a plurality of second pins;

[0016] The pins include reinforcing ribs, which are used to connect and fix a plurality of first pins and a plurality of second pins together.

[0017] The pin has a positioning hole, which is located on the side away from the hollow substrate and is used for positioning during production.

[0018] Secondly, embodiments of this application also provide an electronic control board, including the aforementioned semiconductor circuit.

[0019] Thirdly, embodiments of this application also provide an air conditioner, including the aforementioned electronic control board.

[0020] Compared with existing technologies, the semiconductor circuit, electronic control board, and air conditioner described in this invention have the following advantages:

[0021] By setting a hollow substrate and forming a cavity inside it, along with a medium inlet and a medium outlet, the cooling medium can flow through the interior of the substrate, achieving simultaneous heat dissipation for the upper and lower circuit boards. This significantly improves heat dissipation efficiency and structural reliability, while also greatly increasing circuit integration, adapting to the development trend of miniaturization and high integration, and reducing overall manufacturing costs. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the semiconductor circuit before packaging, as described in an embodiment of the present invention.

[0023] Figure 2 for Figure 1 A structural diagram from a second perspective;

[0024] Figure 3 for Figure 1 A structural diagram from a third-person perspective;

[0025] Figure 4 for Figure 1 A structural diagram from a fourth-person perspective;

[0026] Figure 5 This is a schematic diagram of the structure of the semiconductor circuit before it is packaged and formed according to an embodiment of the present invention;

[0027] Figure 6 for Figure 5 A structural diagram from a second perspective;

[0028] Figure 7 for Figure 5 A structural diagram from a third-person perspective;

[0029] Figure 8 for Figure 5 A structural diagram from a fourth-person perspective;

[0030] Figure 9 This is a schematic diagram of the finished semiconductor circuit after molding, as described in an embodiment of the present invention.

[0031] Figure 10 for Figure 9 A structural diagram from a second perspective;

[0032] Figure 11 This is a schematic diagram of the installation of the semiconductor circuit described in an embodiment of the present invention;

[0033] Figure 12 for Figure 11 A structural diagram from a second perspective;

[0034] Figure 13 for Figure 11 A structural diagram from a third-person perspective.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Hollow substrate; 101. Dielectric inlet; 102. Dielectric outlet; 11. Insulating layer; 12. Copper foil layer; 13. Green oil layer; 14. Chip resistor; 15. Chip capacitor; 16. Component; 17. Bonding wire; 18. Package; 19. Lead; 191. First lead; 192. Second lead; 193. Reinforcing rib; 194. Positioning hole; 2. Cavity; 41. Metal heat sink; 42. Semi-finished component; 51. Mounting hole; 52. Electronic control board; 53. Bracket. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the described embodiments are only some, not all, of the embodiments of this invention. The specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0038] To cool MIPS modular intelligent power systems, heat sinks are typically placed on the back of the substrate. However, the substrate is prone to deformation due to tolerances or high temperatures, resulting in poor adhesion between the substrate and the heat sink, affecting heat dissipation. Furthermore, adding an extra heat sink increases costs. Additionally, current MIPS modular intelligent power systems generally integrate only a single MIPS module, failing to integrate multiple MIPS modular intelligent power systems, thus failing to meet market demands for high integration. Finally, the industry standard is a single-sided substrate design, with circuitry arranged on one side and the heat sink mounted on the other, limiting integration space and hindering the trend towards miniaturization.

[0039] To address the issues of substrate warping in modular intelligent power systems due to tolerances or high temperatures, resulting in poor contact with the heat sink and severely impacting heat dissipation, and the increased cost of adding a heat sink, as well as the limited integration space of single-sided substrate designs that cannot adapt to the trend of miniaturization, this application provides a semiconductor circuit, an electronic control board, and an air conditioner. By connecting the internal cavity of the hollow substrate to an external cooling medium supply device, the cooling medium circulates between the cavity and the cooling medium supply device, significantly enhancing the temperature regulation effect and solving the contact problems caused by tolerances or high-temperature warping of traditional substrates. At the same time, by setting circuit boards on two opposite sides of the substrate, the circuit integration can be greatly improved, enabling the integration of multiple MIPS modular intelligent power systems, adapting to the trend of miniaturization and high integration, and reducing the overall manufacturing cost.

[0040] To better understand this application, the following is combined with... Figures 1 to 13 The technical solution of this application is described in detail.

[0041] On the one hand, embodiments of this application provide a semiconductor circuit, such as Figures 1-13 As shown, it includes:

[0042] At least two circuit boards, with a hollow substrate 1 provided between two opposing circuit boards;

[0043] The hollow substrate 1 has a cavity 2 inside, and is provided with a medium inlet 101 and a medium outlet 102 communicating with the cavity 2. The medium inlet 101 is connected to a cooling medium supply device. The cooling medium enters the cavity 2 through the medium inlet 101 and is discharged outward through the medium outlet 102 to dissipate heat from the circuit board.

[0044] Specifically, this application utilizes a hollow substrate 1 with a cavity 2 formed within it, along with a medium inlet 101 and a medium outlet 102, to allow the cooling medium to flow through the substrate, achieving simultaneous heat dissipation for both the upper and lower circuit boards. Compared to traditional single-sided substrates that require additional heat sinks, this application eliminates the need for external heat sinks, avoiding contact problems caused by substrate tolerances or high-temperature warping, significantly improving heat dissipation efficiency and structural reliability. Simultaneously, this double-sided circuit board design greatly enhances circuit integration, aligning with the trend towards miniaturization and high integration, and also reduces overall manufacturing costs.

[0045] Specifically, in this embodiment, the hollow substrate 1 is a hollow metal substrate or a hollow ceramic substrate, and the circuit board structures on the upper and lower sides of the hollow substrate 1 are identical. The cooling medium is water discharged from an air conditioner, or other heat dissipation media with heat dissipation functions, such as refrigerant or cooling oil.

[0046] In some embodiments, the medium inlet 101 is disposed near the lower part of the cavity 2, and the medium outlet 102 is disposed near the upper part of the cavity 2. When the cooling medium overflows into the cavity 2 to the medium outlet 102, it is discharged outward from the medium outlet 102.

[0047] Specifically, this design allows the cooling medium to completely fill the cavity 2 before being discharged, thus eliminating heat dissipation dead zones within the cavity 2 and extending the heat exchange time between the cooling medium and the hollow substrate 1. This further enhances the heat dissipation effect, ensures uniform heating of the upper and lower circuit boards, avoids local overheating that could cause circuit failures, and improves the operational stability of the semiconductor circuit.

[0048] In some embodiments, the medium inlet 101 and the medium outlet 102 are arranged diagonally within the cavity 2 so that the cooling medium flows in the diagonal direction within the cavity 2.

[0049] Specifically, the diagonal arrangement of the medium inlet 101 and the medium outlet 102 greatly extends the flow path of the cooling medium in the cavity 2, maximizes the heat exchange area between the cooling medium and the hollow substrate 1, and fully covers the heat-generating area of ​​the circuit board. This design enhances the heat exchange efficiency between the cooling medium and the hollow substrate 1, and also ensures that there are no heat dissipation blind spots in the cavity 2, avoids local hot spots, and improves the heat dissipation uniformity of the semiconductor circuit.

[0050] In some embodiments, the cavity 2 is configured such that the cross-sectional area of ​​the middle region is larger than the cross-sectional area of ​​the two side regions.

[0051] Specifically, this structure increases the residence time and contact area of ​​the cooling medium in the central high-heat region, which can specifically improve the heat dissipation capacity of the core high-power components on the circuit board, matching the heat dissipation capacity with the heat distribution of the circuit board and further improving heat dissipation efficiency. At the same time, this structure also helps guide the flow direction of the medium and enhances flow stability.

[0052] In some embodiments, the medium inlet 101 is disposed on the first side wall of the cavity 2, and the medium outlet 102 is disposed on the second side wall of the cavity 2, with the first side wall and the second side wall being disposed opposite to each other.

[0053] Specifically, the medium inlet 101 and the medium outlet 102 are located on opposite side walls, allowing the cooling medium to traverse the entire cavity 2 and form a stable unidirectional flow path. This layout helps the cooling medium to be evenly distributed within the cavity 2, avoids flow dead zones, ensures consistent heat dissipation across all areas of the upper and lower circuit boards, and improves the overall reliability of heat dissipation.

[0054] In some embodiments, the medium inlet 101 and the medium outlet 102 are located on the same side wall of the cavity 2.

[0055] Specifically, setting the medium inlet 101 and the medium outlet 102 on the same side wall can reduce the space occupied by the hollow substrate 1 interface, which is conducive to the miniaturization of semiconductor circuits. The unified interface layout also facilitates the docking of the cooling medium supply device, which is suitable for scenarios with limited installation space. At the same time, it can also simplify the product assembly process, facilitate production and subsequent maintenance, and reduce product costs.

[0056] In some embodiments, the first sidewall of the cavity 2 protrudes outward to form a first protrusion, and the medium inlet 101 is located at the lower part of the first protrusion; the second sidewall of the cavity 2 protrudes outward to form a second protrusion, and the medium outlet 102 is located at the upper part of the second protrusion.

[0057] Specifically, the first and second protrusions provide installation space for the medium inlet 101 and the medium outlet 102, without occupying the internal heat dissipation volume of the cavity 2, thus ensuring an effective heat dissipation area. The protruding structure also improves the sealing of the interface connection, preventing cooling medium leakage. Combined with the vertical layout of the inlet and outlet, this structure allows the cooling medium to flow more smoothly during entry and exit, reducing turbulence and improving heat dissipation stability. This further ensures that the cavity 2 is filled with cooling medium, enhancing the double-sided heat dissipation effect. Understandably, in this embodiment, the cavity 2 is rhomboid in shape.

[0058] In some embodiments, the hollow substrate 1 and the circuit boards on both sides are covered by an encapsulation body 18.

[0059] Specifically, the package 18 completely encapsulates the hollow substrate 1 and the circuit boards on both sides, forming an integrated modular structure. This packaging method not only provides reliable mechanical protection and electrical insulation for the internal circuits and devices, but also enhances the overall structure's vibration resistance and moisture resistance, improves the product's environmental adaptability and service life, and facilitates subsequent installation and integration.

[0060] In some embodiments, the package further includes pin 19, which extends perpendicularly to the extension direction of the medium inlet 101, and the solder joint of the pin 19 is exposed outside the package 18.

[0061] Specifically, the extension direction of pin 19 is perpendicular to the medium inlet 101, which can avoid interference between pin 19 and the cooling medium interface and optimize space utilization; the solder joint of pin 19 is exposed, which facilitates welding and assembly with the control board 52, improves assembly efficiency, and also facilitates inspection and rework in automated production.

[0062] In some embodiments, the pin 19 has a plurality of first pins 191 and a plurality of second pins 192;

[0063] The pin 19 includes a reinforcing rib 193, which is used to connect and fix a plurality of first pins 191 and a plurality of second pins 192 together.

[0064] A positioning hole 194 is formed on the pin 19, and the positioning hole 194 is located on the side away from the hollow substrate 1 for positioning during production.

[0065] Specifically, by connecting multiple pins together with reinforcing ribs 193, the overall mechanical strength of the pin array is significantly improved, preventing deformation during manufacturing, transportation, and soldering. Positioning holes 194 provide precise positioning for production processes, improving processing accuracy and production efficiency. This facilitates precise positioning by automated equipment during production, enhancing the accuracy and efficiency of mounting and packaging processes, reducing production difficulty and costs, and making it suitable for mass production.

[0066] Secondly, embodiments of this application also provide an electronic control board, including the aforementioned semiconductor circuit.

[0067] Specifically, the control board 52 integrates the aforementioned semiconductor circuits and can rely on efficient double-sided water cooling to ensure stable operation of the highly integrated circuits on the control board 52. This eliminates the need for additional heat sinks, simplifying the structure of the control board 52 and reducing overall costs. Simultaneously, the high integration characteristics of the semiconductor circuits allow for a reduction in the overall size of the control board 52, aligning with the miniaturization trend of terminal devices.

[0068] Thirdly, embodiments of this application also provide an air conditioner, including the aforementioned electronic control board.

[0069] Specifically, the air conditioner equipped with the aforementioned electronic control board 52 can directly utilize the air conditioner's drainage as a cooling medium, thereby achieving resource reuse and reducing air conditioner energy consumption. At the same time, the high heat dissipation and high integration characteristics of semiconductor circuits can also improve the stability of the air conditioner's electronic control system and reduce equipment failures. In addition, the miniaturized design of the electronic control board 52 is also conducive to optimizing the internal space layout of the air conditioner and helping to upgrade the miniaturization of the air conditioner.

[0070] In some embodiments, the semiconductor circuit further includes an insulating layer 11 disposed on the hollow substrate 1, a copper foil layer 12 disposed on the insulating layer 11, a green oil layer 13 disposed on the copper foil layer 12, a chip resistor 14 disposed on the copper foil layer 12, a chip capacitor 15 disposed on the copper foil layer 12, a component 16, a bonding metal wire 17, and a package 18; the component 16 is electrically connected to the copper foil layer 12 through the bonding metal wire 17, and the two ends of the copper foil layer 12 are also provided with a plurality of pins 19.

[0071] In detail, the hollow substrate 1 serves as a carrier, and an insulating layer 11 is disposed on the hollow substrate 1. A copper foil layer 12 is disposed on the insulating layer 11, and the copper foil layer 12 is used for circuit wiring. The insulating layer 11 and the copper foil layer 12 are pressed together to form a pressed semi-finished product. The insulating layer of the pressed semi-finished product is pressed together with the hollow substrate 1 to form a hollow substrate semi-finished product. Then, a circuit wiring layer is formed on the surface of the copper foil layer 12 by etching. A green solder mask layer 13 is disposed on the circuit wiring layer to form a hollow substrate finished product. The green solder mask layer 13 protects the circuit wiring layer.

[0072] In some embodiments, the device further includes a silver-plated metal heat sink 41, on which the component 16 is soldered to form a component semi-finished product 42, and the component semi-finished product 42 is sealed with epoxy resin; a circuit wiring layer is formed by etching the copper foil layer 12, and the circuit wiring layer is electrically connected to the component 16 by bonding metal wires 17.

[0073] Here it should be noted that the insulating layer 11 is to prevent the circuit wiring layer from being energized with the hollow substrate 1, which could cause short circuits or leakage in the internal circuitry.

[0074] The copper foil layer 12 is used to form the desired circuit by etching the copper foil layer 12, thus creating a circuit wiring layer;

[0075] The protective layer, also known as the green oil layer 13, prevents soldering in places where it should not be applied, increases the withstand voltage between circuits, prevents short circuits caused by circuit oxidation or contamination, and protects the circuit.

[0076] The chip resistor 14 is connected at the gate of the IGBT chip in the semiconductor circuit to limit the switching speed of the IGBT by limiting the current.

[0077] The 15mm surface mount capacitor serves as a filter, coupler, and bootstrap in semiconductor circuits.

[0078] Component 16: Chips required to form the internal functional circuits of a semiconductor circuit;

[0079] Component semi-finished product 42: High-voltage power components are mounted onto heat sinks to form component semi-finished product 42.

[0080] The metal heat sink 41 is silver-plated on the copper surface, which makes the component 16 fit better with the heat sink and improves the heat dissipation capacity.

[0081] The metal wire 17 (the metal wire is generally made of gold, aluminum, copper, etc.) is used to make electrical connections between components in the circuit.

[0082] The encapsulation body 18 is a powdered molding compound made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, silicon micro powder and other fillers, and various additives. It is extruded into the mold cavity by heat transfer molding and embeds the semiconductor chip therein. At the same time, it is cross-linked and cured to form a device with a certain external structure.

[0083] Pin 19, as the input / output pin of the semiconductor circuit, is soldered to the corresponding pin position of the control board 52 to achieve electrical connection. Pin 19 is composed of reinforcing ribs 193 and positioning holes 194, which facilitates positioning during the production process and improves production efficiency.

[0084] Mounting hole 51 is used to mount and fix the semiconductor circuit onto the electronic control board 52;

[0085] Electrical control board 52 is the control center for all terminal electrical appliances;

[0086] The bracket 53 is used to support the semiconductor circuit and prevent condensation on the control board 52 from soaking in it for a long time, which would affect the reliability of the product.

[0087] The semiconductor circuit in this application integrates multiple motor drive circuits, achieving high integration and miniaturization.

[0088] Fourthly, embodiments of this application also provide a method for manufacturing a semiconductor circuit, comprising the following steps:

[0089] Step 1: Place the hollow substrate 1 finished product on a special carrier (the carrier can be made of materials that can withstand high temperatures above 200°C, such as aluminum, synthetic stone, ceramic, PPS, etc.) using automated equipment or manual operation. Apply solder paste or silver glue to the component mounting positions reserved in the copper foil circuit layer. Then, mount the semiconductor inverter components to the component mounting positions using an automatic die bonding machine (DA machine).

[0090] Step 2: The high-voltage power device (PFC circuit) is mounted onto the metal heat sink 41 using a soft solder die bonder to form a component semi-finished product 42;

[0091] Step 3: Place pin 19 into the mounting position on hollow substrate 1 manually or using automated equipment;

[0092] Step 4: Use an automated surface mount technology (SMT) machine to mount resistors, capacitors, and semi-finished components onto the component mounting positions;

[0093] Step 5: The semi-finished components 42, including the carrier, are passed through a reflow oven to weld all the components to their corresponding mounting positions.

[0094] Step 6: Inspect the soldering quality of components using visual inspection AOI equipment;

[0095] Step 7: Remove residual flux and aluminum shavings from the hollow substrate 1 by spraying and ultrasonic cleaning.

[0096] Step 8: Connect the circuit elements and the circuit wiring to form an electrical connection using a bonding wire;

[0097] Step 9: The circuit of the hollow substrate 1 is encapsulated in a specific mold using packaging equipment, and then the product is marked by laser marking.

[0098] Step 10: Use a lead frame cutting and forming device to cut off the connecting ribs of the lead frame and form the leads;

[0099] Step 11: Conduct electrical and appearance parameter tests to obtain the final qualified product.

[0100] In practical use, qualified products are electrically connected to the control board 52 via wave soldering, and then the semiconductor circuit is installed on the control board 52 with screws. Then, the medium inlet 101 of the hollow substrate is connected to the air conditioner drain outlet, and the medium outlet 102 of the hollow substrate 1 directly discharges water to the outside of the air conditioner, thereby achieving heat dissipation of the hollow substrate 1.

[0101] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A semiconductor circuit, characterized in that, include: At least two circuit boards, with a hollow substrate (1) between two opposite circuit boards. The hollow substrate (1) has a cavity (2) inside, and is provided with a medium inlet (101) and a medium outlet (102) communicating with the cavity (2). The medium inlet (101) is connected to a cooling medium supply device. The cooling medium enters the cavity (2) through the medium inlet (101) and is discharged outward through the medium outlet (102) to dissipate heat from the circuit board.

2. The semiconductor circuit according to claim 1, characterized in that, The medium inlet (101) is located near the lower part of the cavity (2), and the medium outlet (102) is located near the upper part of the cavity (2). When the cooling medium overflows into the cavity (2) to the medium outlet (102), it is discharged outward from the medium outlet (102).

3. The semiconductor circuit according to claim 1, characterized in that, The medium inlet (101) and the medium outlet (102) are arranged diagonally within the cavity (2) so that the cooling medium flows in the diagonal direction within the cavity (2).

4. The semiconductor circuit according to claim 1, characterized in that, The cavity (2) is configured such that the cross-sectional area of ​​the middle region is greater than the cross-sectional area of ​​the two side regions.

5. The semiconductor circuit according to claim 2, characterized in that, The medium inlet (101) is located on the first side wall of the cavity (2), and the medium outlet (102) is located on the second side wall of the cavity (2). The first side wall and the second side wall are arranged opposite to each other.

6. The semiconductor circuit according to claim 2, characterized in that, The medium inlet (101) and the medium outlet (102) are located on the same side wall of the cavity (2).

7. The semiconductor circuit according to claim 5, characterized in that, The first sidewall of the cavity (2) protrudes outward to form a first protrusion, and the medium inlet (101) is located at the lower part of the first protrusion; the second sidewall of the cavity (2) protrudes outward to form a second protrusion, and the medium outlet (102) is located at the upper part of the second protrusion.

8. The semiconductor circuit according to claim 1, characterized in that, The hollow substrate (1) and the circuit boards on both sides are covered with an encapsulation body (18).

9. The semiconductor circuit according to claim 8, characterized in that, It also includes pins (19) that extend in a direction perpendicular to the direction of extension of the medium inlet (101), and the solder joints of the pins (19) are exposed outside the package (18).

10. The semiconductor circuit according to claim 9, characterized in that, The pin (19) has a plurality of first pins (191) and a plurality of second pins (192). The pin (19) includes a reinforcing rib (193) for connecting and fixing a plurality of first pins (191) and a plurality of second pins (192) together; A positioning hole (194) is formed on the pin (19), the positioning hole (194) is located on the side away from the hollow substrate (1), and is used for positioning during production.

11. An electronic control board, characterized in that, Includes the semiconductor circuit described in any one of claims 1-10.

12. An air conditioner, characterized in that, Includes the electronic control board as described in claim 11.

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