Film peeling apparatus, semiconductor sintering mold, and sintering method

Abstract

The application provides a film stripping device, a semiconductor sintering mold and a sintering method, which comprises a driving assembly and a baffle assembly. The driving assembly comprises a sleeve, a first piston and a second piston, and the baffle assembly comprises an outer baffle and an inner baffle. The first piston is connected with the outer baffle, and the second piston is connected with the inner baffle. The inner baffle is provided with a product positioning hole, and the edge of the product positioning hole is provided with an elastic positioning piece. In application, the driving assembly drives the baffle assembly to move, realizes the integrated design of the product precise positioning and the film stripping function, the elastic positioning piece on the inner baffle can accurately and flexibly position the product in the circumferential direction, avoids the product deviation or deformation in the sintering process, and guarantees the product machining precision and the process stability. Meanwhile, without the need of additionally setting a complex auxiliary positioning mechanism, the equipment manufacturing cost and the maintenance cost are greatly reduced, the production efficiency, the product performance and the economy are considered, and the semiconductor product large-scale production demand is adapted.

Description

Technical Field

[0001] This invention relates to the field of semiconductor sintering technology, and in particular to a thin film peeling device, a semiconductor sintering mold, and a sintering method. Background Technology

[0002] Internal electrical interconnects within a chip are a core component of the semiconductor device packaging process. The quality of these interconnects directly determines the chip's electrical performance, thermal performance, and long-term reliability. Currently, this process is typically achieved using wire bonding or strip bonding technologies. Among these, Cu Clip Bonding, as a novel interconnect technology, uses solid copper sheets instead of traditional metal wires compared to traditional wire bonding. This effectively reduces packaging resistance, increases current carrying capacity, and optimizes thermal conductivity, thereby enabling double-sided heat dissipation of the chip. It has been widely used in the packaging of mid-to-high-end semiconductor power devices.

[0003] To further improve the thermal reliability and bonding strength of bonded joints and meet the stringent requirements of next-generation power devices for high temperature resistance and high heat dissipation, more and more companies are introducing nano-silver sintering technology into strip bonding processes. This process utilizes nano-silver paste to form a stable connection under pressure at a relatively low temperature. The resulting bonded joints not only possess excellent thermal and electrical conductivity but also outstanding high-temperature reliability, making them suitable for the performance requirements of wide-bandgap semiconductor power modules such as silicon carbide.

[0004] In wide-bandgap semiconductor power modules such as silicon carbide, the thinness of the chip and the high power density place extremely stringent requirements on the control of thermomechanical stress during the packaging process. To meet this demand, the clips (copper sheets) used in the sintering process typically need to be designed to be thin, generally requiring a thickness of less than 0.5 mm, and in high-density packaging scenarios, even an extreme thickness of less than 0.2 mm is required. The application of this thin clip structure poses higher challenges to the dimensional accuracy of the clip itself, the alignment accuracy during clip placement, and the stability of the packaging equipment movement in the process. Improper control in any of these aspects can easily lead to clip misalignment after sintering, or defects such as voids and cracks at the bonding interface, which in turn seriously affects the bonding reliability of the bonding joint and reduces product yield.

[0005] Currently, there are two main solutions in the industry for controlling the alignment accuracy of clips in the sintering process: The first is to use manual or automatic clip placement with the aid of tooling fixtures for positioning. However, the positioning systems used in this solution are complex and varied, making it difficult to achieve mass production and significantly increasing production equipment costs, which is not conducive to industrial application. The second solution is to abandon the use of thin clips in favor of thicker clips or simpler clip designs to avoid the positioning and deformation problems caused by thin clips. While this solution can simplify the process, automate production, and increase capacity to some extent, the thicker clip structure leads to an increase in the overall size of the power module. It also fails to leverage the advantages of thin clips in heat conduction, heat dissipation, and stress control, resulting in ineffective improvement in the thermal performance of the power module and making it difficult to meet the high-performance requirements of wide-bandgap semiconductor power modules. Summary of the Invention

[0006] One objective of this invention is to address the shortcomings of existing technologies by proposing a film peeling device that integrates precise product positioning and film peeling functions, thus balancing production efficiency, product performance, and production costs.

[0007] A second objective of this invention is to provide a semiconductor sintering mold that, by applying the aforementioned thin film peeling device, achieves precise positioning, damage-free clamping, stable support, and thin film peeling of the product, thus meeting the requirements of high-precision sintering processes and balancing production efficiency, product performance, and production costs.

[0008] A third objective of this invention is to provide a semiconductor sintering method that, by applying the aforementioned semiconductor sintering mold and controlling the timing of the sintering process, achieves integrated connection of product positioning, mold closing sintering, and thin film peeling, thereby ensuring product sintering quality and improving production efficiency.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: According to a first aspect of the present invention, a thin film peeling apparatus is provided for product positioning and thin film peeling in a semiconductor sintering mold. The thin film peeling apparatus includes a drive assembly and a baffle assembly.

[0010] The drive assembly includes a sleeve, a first piston, and a second piston. The first piston and the second piston are respectively movably disposed within the sleeve along the drive direction. The first piston has a first connecting portion extending out of the sleeve, and the second piston has a second connecting portion extending out of the sleeve.

[0011] The baffle assembly includes an outer baffle and an inner baffle. The outer baffle has a hollow frame structure, and the inner baffle corresponds to the inner side of the outer baffle. The abutting surface of the inner baffle is perpendicular to the driving direction. A first connecting portion is connected to the outer baffle, and a first piston is used to drive the outer baffle to move along the driving direction. A second connecting portion is connected to the inner baffle, and a second piston is used to drive the inner baffle to move along the driving direction. The inner baffle has a product positioning hole, and an elastic positioning element is provided on the side of the inner baffle away from the driving assembly and corresponding to the edge of the product positioning hole.

[0012] In the application of the film peeling device, the product and product tray are located on the side of the baffle assembly away from the drive assembly, and the film is located on the side of the baffle assembly closer to the drive assembly. When the semiconductor sintering mold is closed, the inner baffle flexibly positions the product circumferentially through the elastic positioning member, and the outer baffle presses against the product tray. When the semiconductor sintering mold is opened, the outer baffle initially maintains the state of pressing against the product tray, and the second piston first drives the inner baffle to move along the drive direction towards the sleeve, so as to use the inner baffle to peel the film off the product; after the film peeling is completed, the first piston then drives the outer baffle to move along the drive direction towards the sleeve, so as to release the constraint of the outer baffle on the product tray.

[0013] Preferably, the second piston is nested inside the first piston, and the relative sliding resistance between the sleeve and the first piston is greater than the relative sliding resistance between the first piston and the second piston; the second connecting part passes through the first connecting part; a return spring is provided inside the first piston at the end of the second piston away from the second connecting part.

[0014] Preferably, there is a first gap between the end of the first piston away from the first connecting part and the sleeve, and a second gap between the end of the first piston near the first connecting part and the sleeve; the sleeve is provided with a first air passage and a second air passage, the first air passage communicating with the first gap; the second air passage communicating with the second gap; and a through hole is provided on the side wall of the first piston, the through hole communicating with the second gap and the internal space of the first piston.

[0015] Preferably, the first piston has a first inner cavity and a second inner cavity that are interconnected, and a first limiting step is provided between the first inner cavity and the second inner cavity; the reset spring and the second piston are disposed in the first inner cavity, and the second connecting part passes through the second inner cavity; a second limiting step is provided between the second piston and the second connecting part, the first limiting step and the second limiting step are opposite to each other, and a sealing gasket is provided between the first limiting step and the second limiting step.

[0016] Preferably, the inner wall of the outer baffle is provided with a first mating structure, which is mated and connected with the first connecting part; the outer wall of the inner baffle is provided with a second mating structure corresponding to the first mating structure, which is mated and connected with the second connecting part.

[0017] According to a second aspect of the present invention, a semiconductor sintering mold is provided, the semiconductor sintering mold comprising an upper mold, a lower mold, and a thin film peeling device as described above.

[0018] The upper mold and the lower mold are arranged opposite each other in the driving direction. The driving component of the film peeling device is located in the upper mold, and the baffle assembly is located between the upper mold and the lower mold. The upper mold is provided with a sintering pressure head, which corresponds to the product positioning hole on the inner baffle of the baffle assembly. The lower mold is provided with a positioning boss, which corresponds to the product positioning hole.

[0019] According to a third aspect of the present invention, a semiconductor sintering method is provided, using a semiconductor sintering mold as described above, the semiconductor sintering method comprising the following steps: Sintering preparation: Use the drive assembly to move the baffle assembly to the preparatory position, lay the film between the upper mold and the baffle assembly; place the product tray carrying the product on the lower mold, and use the positioning boss on the lower mold to pre-position the product.

[0020] Mold closing: The upper mold drives the drive assembly and baffle assembly to move towards the lower mold along the drive direction. When the elastic positioning element on the inner baffle in the baffle assembly presses against the edge of the product to achieve circumferential flexible positioning of the product, the second piston and the inner baffle stop moving. The upper mold drives the first piston and the outer baffle to continue moving until the outer baffle presses against the product tray. Then, the upper mold continues to move until it closes with the lower mold. After mold closing, the product is sintered under pressure through the film using a sintering head.

[0021] Mold opening: After the pressure sintering is completed, the sintering pressure head is reset and the upper mold returns to open; firstly, the second piston in the drive assembly drives the inner baffle to move along the drive direction towards the upper mold, so as to use the inner baffle to peel the film off the product; after the film is peeled off, the first piston in the drive assembly drives the outer baffle to move along the drive direction towards the upper mold, so as to release the constraint of the outer baffle on the product tray.

[0022] Preferably, in the semiconductor sintering mold, the second piston is nested inside the first piston, and the relative sliding resistance between the sleeve and the first piston is greater than the relative sliding resistance between the first piston and the second piston. A second connecting portion passes through the first connecting portion. A return spring is provided inside the first piston at the end of the second piston away from the second connecting portion. A first gap exists between the end of the first piston away from the first connecting portion and the sleeve, and a second gap exists between the end of the first piston near the first connecting portion and the sleeve. The sleeve has a first air passage and a second air passage, the first air passage communicating with the first gap and the second air passage communicating with the second gap. A through hole is provided on the side wall of the first piston, connecting the second gap and the internal space of the first piston.

[0023] In the sintering preparation step, gas is introduced into the first gas channel. The gas enters the first gap, which pushes the first piston and drives the outer baffle to move away from the upper mold along the driving direction. At the same time, the first piston drives the second piston to move synchronously with the inner baffle, so as to use the driving assembly to move the baffle assembly to the preparatory position.

[0024] Preferably, during the mold closing step, when the second piston and the inner baffle stop moving while the first piston and the outer baffle continue moving, the return spring is compressed.

[0025] Preferably, in the mold opening step, after the upper mold returns to its original position, gas is introduced into the second air passage. After the gas enters the second gap, part of the gas acts on the first piston, and the other part of the gas enters the interior of the first piston through the through hole and acts on the second piston. Since the relative sliding resistance between the sleeve and the first piston is greater than the relative sliding resistance between the first piston and the second piston, the second piston is pushed first to drive the inner baffle to move towards the upper mold along the driving direction, and the inner baffle is used to peel the film off the product. During this process, the return spring continues to be compressed. After the film is peeled off, the first piston is pushed to drive the outer baffle to move towards the upper mold along the driving direction, and the outer baffle is released from the constraint of the product tray. After that, the return spring returns to its initial state, so that the first piston and the second piston return to their initial relative positions.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: In the film peeling device of the present invention, the drive component drives the baffle component to move, realizing the integrated design of precise product positioning and film peeling function. The elastic positioning component on the inner baffle can accurately perform circumferential flexible positioning of the product, avoiding product displacement or deformation during sintering, and ensuring product processing accuracy and process stability. At the same time, there is no need to set up additional complex auxiliary positioning mechanisms, which greatly reduces equipment manufacturing and maintenance costs, and takes into account production efficiency, product performance and economy, adapting to the needs of large-scale production of semiconductor products.

[0027] The semiconductor sintering mold of the present invention utilizes the aforementioned thin film peeling device. Through dual positioning of the positioning boss and the elastic positioning element, it further improves the product positioning accuracy, avoids product misalignment and deformation during sintering, ensures the sintering quality and performance stability of semiconductor products, and improves production continuity and automation level. At the same time, by integrating precise product positioning and thin film peeling functions, it can reduce manufacturing costs, simplify the mold debugging process, adapt to the needs of large-scale sintering of semiconductor products, and enhance the versatility and practicality of the mold.

[0028] In the semiconductor sintering method of the present invention, the structural advantages of the semiconductor sintering mold mentioned above are combined to achieve integrated connection of precise product positioning, mold closing sintering, and thin film peeling, which effectively improves the sintering quality and pass rate of the product; the process is seamless, without the need for additional positioning and peeling processes, which greatly shortens the production cycle, improves production efficiency, and reduces the intensity of manual operation and the probability of human error. It is suitable for the needs of large-scale and high-precision production of semiconductor products, and has both practicality and economy, making it easy to promote and apply in industrial applications. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a film peeling device according to the present invention.

[0030] Figure 2 This is a perspective view of another film peeling device according to the present invention.

[0031] Figure 3 This is a cross-sectional view of another film peeling device according to the present invention.

[0032] Figure 4 This is a cross-sectional view of the drive assembly in another film peeling device of the present invention.

[0033] Figure 5 for Figure 4 Enlarged view of the structure at point A in the middle.

[0034] Figure 6 This is a perspective view of a baffle assembly in another film peeling device according to the present invention.

[0035] Figure 7 This is a schematic diagram of the structure of a semiconductor sintering mold during the sintering preparation step.

[0036] Figure 8 This is a schematic diagram of the structure when the elastic positioning component presses against the product during the mold closing process.

[0037] Figure 9 This is a schematic diagram of the structure when the elastic positioning component presses against the product and the outer baffle presses against the product tray during the mold closing process.

[0038] Figure 10 This is a schematic diagram of the structure when the sintering head applies pressure to the product for sintering after the mold is closed.

[0039] Figure 11 This is a schematic diagram of the structure during the film peeling process in the mold opening step.

[0040] 10-Drive assembly; 11-Sleeve; 111-Large diameter cavity; 112-Small diameter cavity; 113-First gap; 114-Second gap; 115-First air passage; 116-Second air passage; 117-Guide sleeve; 118-End cap; 119-Sleeve sealing ring; 12-First piston; 121-First connecting part; 122-Large diameter rod; 1221-Sealing ring; 1222-Guide ring; 123-Small diameter rod; 1231-Linear bearing; 124-First inner cavity; 125-Second inner cavity; 126-First limiting step; 127-Through hole; 13-Second piston; 131-Second connecting part; 132-Second limiting step; 133-Sealing gasket; 14-Reset spring. 20-Baffle assembly, 21-Outer baffle, 211-First mating structure, 22-Inner baffle, 221-Product positioning hole, 222-Elastic positioning element, 223-Second mating structure. 30-Upper mold, 31-Sintering pressure head. 40-Lower mold, 41-Positioning boss. 50-Film, 60-Product, 70-Product tray. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. It is understood that, without conflict, some technical means of the various embodiments described herein can be substituted for or combined with each other.

[0042] In the description of this invention, the terms "first," "second," etc., are used only to distinguish the described objects and have no sequential or technical meaning. Therefore, objects specified with "first," "second," etc., may explicitly or implicitly include one or more of those objects. Furthermore, the words "one" or "a" do not indicate a quantity limitation, but rather indicate the presence of at least one, while "multiple" indicates at least two.

[0043] In the description of this invention, references to "one embodiment" or "some embodiments" mean that one or more embodiments of the invention include a particular feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "one embodiment," "some embodiments," "other embodiments," "and other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0044] According to a first aspect of the present invention, a film peeling apparatus is provided, which is used for product positioning and film peeling in a semiconductor sintering mold.

[0045] Reference Figure 1 In some embodiments, the film peeling device includes a drive assembly 10 and a baffle assembly 20, wherein the drive assembly 10 can be used to move the baffle assembly 20.

[0046] Specifically, the drive assembly 10 includes a sleeve 11, a first piston 12, and a second piston 13. The first piston 12 and the second piston 13 are movably disposed within the sleeve 11 along the drive direction Z. The first piston 12 has a first connecting portion 121 extending out of the sleeve, and the second piston 13 has a second connecting portion 131 extending out of the sleeve 11. The drive direction Z can correspond to either the axial direction of the first piston 12 or the axial direction of the second piston 13. (Refer to...) Figure 1 If the first piston 12 and the second piston 13 are respectively arranged in the vertical direction, then the driving direction Z corresponds to the vertical direction.

[0047] The baffle assembly 20 includes an outer baffle 21 and an inner baffle 22. The outer baffle 21 has a hollow frame structure, and the inner baffle 22 corresponds to the inner side of the outer baffle 21. The abutment surface of the inner baffle 22 (corresponding to...) Figure 1 The top surface of the inner baffle 22 is perpendicular to the driving direction Z. A first connecting part 121 connects to the outer baffle 21, and a first piston 12 drives the outer baffle 21 to move along the driving direction Z. The outer baffle 21 is used to press against the product tray. A second connecting part 131 connects to the inner baffle 22, and a second piston 13 drives the inner baffle 22 to move along the driving direction Z. The inner baffle 22 has a product positioning hole 221. The side of the inner baffle 22 furthest from the driving assembly 10 (corresponding to...) Figure 1An elastic positioning element 222 is provided on the bottom side of the inner baffle 22 and at the edge corresponding to the product positioning hole 221. The inner baffle 22 is used to flexibly position the product circumferentially by means of the elastic positioning element 222, or to peel the film off the product.

[0048] In the above-mentioned film peeling device application, the product and product tray are located on the side of the baffle assembly 20 away from the drive assembly 10. Figure 1 (corresponding to the lower side of the baffle assembly 20), the film is located on the side of the baffle assembly 20 closer to the drive assembly 10 ( Figure 1 (Corresponding to the upper side of the baffle assembly 20). When the semiconductor sintering mold is closed, the inner baffle 22 uses the elastic positioning element 222 to flexibly position the product circumferentially, preventing product displacement or deformation and ensuring product processing accuracy and process stability; the outer baffle 21 is used to press the product tray to prevent the product tray from interfering with the sintering operation. When the semiconductor sintering mold is opened, the outer baffle 21 first maintains the state of pressing the product tray, and the second piston 13 first drives the inner baffle 22 to move along the driving direction Z towards the sleeve 11, so as to use the inner baffle 22 to peel the film from the product; after the film is peeled off, the first piston 12 then drives the outer baffle 21 to move along the driving direction Z towards the sleeve 11, so as to release the constraint of the outer baffle 21 on the product tray.

[0049] In the film peeling device of the present invention, the drive component 10 drives the baffle component 20 to move, realizing the integrated design of precise product positioning and film peeling function. The elastic positioning element 222 on the inner baffle 22 can accurately perform circumferential flexible positioning of the product, avoiding product displacement or deformation during sintering, and ensuring product processing accuracy and process stability. At the same time, there is no need to set up additional complex auxiliary positioning mechanisms, which greatly reduces equipment manufacturing and maintenance costs, and takes into account production efficiency, product performance and economy, adapting to the needs of large-scale production of semiconductor products.

[0050] It should be noted that the number and arrangement of the aforementioned drive components 10, the number and arrangement of the product positioning holes 221, and the number and arrangement of the elastic positioning elements 222 can be reasonably set according to actual conditions. Preferably, the number of drive components 10 is at least two sets, and they are symmetrically distributed to ensure the stability and reliability of the device operation. For example, in some embodiments, there are two sets of drive components, and the two sets of drive components are symmetrically arranged on both sides of the baffle assembly. (Refer to...) Figure 2 In other embodiments, there are four sets of drive components 10, which are arranged at the four corners of the baffle assembly 20 to ensure operational stability and reliability. The inner baffle 22 has four product positioning holes 221, and each product positioning hole 221 is surrounded by at least one elastic positioning element 222. This allows for the simultaneous precise positioning and sintering of four sets of products, improving production efficiency.

[0051] The aforementioned elastic positioning element 222 can be made of high-temperature resistant metals or other materials, such as a stainless steel spring structure. The number of elastic positioning elements can be reasonably set according to actual needs. (Refer to...) Figure 1 In some embodiments, the elastic positioning member 222 has a V-shaped structure. One side of the elastic positioning member 222 is connected to the bottom side of the inner baffle 22, and the other side is inclined. This inclined side is used to contact the product and flexibly position the product. Multiple elastic positioning members 222 at the edge of the product positioning hole 221 form a receiving space that is narrower at the top and wider at the bottom to meet the positioning requirements of products of different specifications and improve the applicability of the device. However, the present invention is not limited thereto; in other embodiments, the elastic positioning member can also adopt other reasonable structural designs.

[0052] Preferably, the outer baffle 21 and the inner baffle 22 adopt a gap nesting structure. The outer baffle 21 and the inner baffle 22 may not have a physical connection relationship, or they may adopt a flexible connection method. The appropriate setting can be made according to the actual situation.

[0053] In some embodiments, there is no physical connection between the outer baffle 21 and the inner baffle 22, that is, the outer baffle 21 and the inner baffle 22 are independent of each other and can move with their respective pistons. This structure has a simple layout, can fully release the range of motion, has low resistance during operation, and is smooth and without jamming. At the same time, the split structure is easy to disassemble and assemble, and the parts can be replaced individually in the future, which greatly simplifies the inspection and maintenance process and is suitable for low-speed operation and flexible adjustment application scenarios.

[0054] In other embodiments, the outer baffle 21 and the inner baffle 22 can also be flexibly connected using a flexible connector or similar structure, without affecting their respective movement along the driving direction Z. This approach, while retaining the ability to adjust the gap, achieves positional limitation between the two, effectively preventing baffle detachment during operation and maintaining a stable nested state. The flexible connector can deform with the relative movement of the two, such as bending or stretching, without causing hard stress damage, thus combining deformability and overall stability.

[0055] The first piston and the second piston mentioned above can be two pistons that are controlled independently, or they can be nested pistons that are controlled in a linked manner.

[0056] Reference Figures 3 to 5In some preferred embodiments, the second piston 13 is nested inside the first piston 12, and the relative sliding resistance between the sleeve 11 and the first piston 12 is greater than the relative sliding resistance between the first piston 12 and the second piston 13. A second connecting portion 131 passes through the first connecting portion 121. A return spring 14 is provided inside the first piston 12 at the end corresponding to the second piston 13 away from the second connecting portion 131. This nested structure design of the first piston 12 and the second piston 13 facilitates a reduction in device size, improves system integration, and lowers production costs. The return spring 14 supports the second piston 13 and enables differential motion control between the two pistons.

[0057] A first gap 113 exists between the end of the first piston 12 furthest from the first connecting portion 121 and the sleeve 11, and a second gap 114 exists between the end of the first piston 12 closest to the first connecting portion 121 and the sleeve 11. The sleeve 11 has a first air passage 115 and a second air passage 116, with the first air passage 115 communicating with the first gap 113 and the second air passage 116 communicating with the second gap 114. A through hole is provided on the side wall of the first piston, connecting to the internal space of the first piston.

[0058] Furthermore, the side wall of the first piston 12 is provided with a through hole 127, which is used to connect the second gap with the internal space of the first piston 12.

[0059] When air enters the first air passage 115, the gas enters the first gap 113, which pushes the first piston 12 and drives the outer baffle 21 to move away from the sleeve 11 along the driving direction Z. At the same time, the first piston 12 drives the second piston 13 to move synchronously with the inner baffle 22.

[0060] When the semiconductor sintering mold is closed, as the outer baffle 21 and the inner baffle 22 approach the product along the driving direction Z, the elastic positioning element 222 on the inner baffle 22 contacts the product first. The elastic positioning element 222 performs circumferential flexible positioning of the product to avoid product displacement or deformation, and to ensure product processing accuracy and process stability. At this time, the first piston 12 and the inner baffle 22 stop moving; the outer baffle 21 continues to move until it presses the product tray. During this process, the return spring 14 is compressed.

[0061] When the semiconductor sintering mold opens, air enters through the second air passage 116. After the gas enters the second gap 114, part of the gas acts on the first piston 12, and the other part enters the interior of the first piston 12 through the through hole 127 and acts on the second piston 13. Since the relative sliding resistance between the sleeve 11 and the first piston 12 is greater than the relative sliding resistance between the first piston 12 and the second piston 13, the second piston 13 will be pushed first to drive the inner baffle 22 to move towards the sleeve 11 along the driving direction Z, and the inner baffle 22 will peel the film off the product. During this process, the return spring 14 continues to be compressed. The outer baffle 21 will first maintain the state of pressing the product tray. After the film is peeled off, the first piston 12 will be pushed to drive the outer baffle 21 to move towards the sleeve 11 along the driving direction Z, and release the constraint of the outer baffle 21 on the product tray. Then, the return spring 14 returns to the initial state, so that the first piston 12 and the second piston 13 return to their initial relative positions.

[0062] The drive assembly 10 adopts a nested dual-piston pneumatic drive structure, which is compact and can effectively reduce the overall size of the equipment, improve integration, and control manufacturing costs. Relying on the difference in sliding resistance at two points, combined with a return spring, it precisely achieves differential speed linkage of the two pistons, and works with two air passages and connecting holes to complete zoned pneumatic pressure control. During mold closing, the elastic positioning element 222 on the inner baffle 22 completes flexible positioning of the product to prevent product displacement and deformation, while the outer baffle 21 completes the product tray clamping and positioning, ensuring sintering processing accuracy. During mold opening, the difference in relative sliding resistance enables differential speed movement of the two pistons. First, the second piston 13 drives the inner baffle 22 to complete the precise film peeling operation, and then the first piston 12 drives the outer baffle 21 to release the tray. The action sequence is clear and smooth, adapting to the requirements of semiconductor sintering processes, and operating stably and reliably, significantly improving process efficiency and product yield.

[0063] Reference Figures 3 to 5 In other embodiments, the sleeve 11 has an internally connected large-diameter cavity 111 and a small-diameter cavity 112, with the large-diameter cavity 111 located on the side of the small-diameter cavity 112 away from the baffle assembly 20. The first piston 12 includes an interconnected large-diameter rod 122 and a small-diameter rod 123, with the large-diameter rod 122 located within the large-diameter cavity 111 and the small-diameter rod 123 passing through the small-diameter cavity 112. A first connecting portion 121 is located at the end of the small-diameter rod 123 away from the large-diameter rod 122. The sleeve 11 and the first piston 12 adopt a stepped assembly structure, which can limit the first piston 12 and prevent it from disengaging from the sleeve 11. It is understood that along the driving direction Z (the axial direction of the first piston 12), the length of the large-diameter cavity 111 is greater than the length of the large-diameter rod 122, and the length of the small-diameter cavity 112 is less than the length of the small-diameter rod 123, to meet the stroke control requirements of the first piston 12. Furthermore, the first gap 113 is located between the large-diameter cavity 111 and the end of the large-diameter rod 122 furthest from the small-diameter rod 123, and the second gap 114 is located between the small-diameter cavity 112 and the small-diameter rod 123. A through hole 127 is located on the side wall of the small-diameter rod 123, and both ends of the through hole 127 connect the second gap 114 and the internal space of the first piston 12, respectively. (Refer to...) Figure 3 As shown, when air enters through the first air passage 115, the gas enters the first gap 113, and the first piston 12 is pushed downwards and moves downwards relative to the sleeve 11, causing the second piston 13 to move synchronously; see reference. Figure 4 and Figure 5 As shown, when air enters the second air passage 116, the trajectory of the gas after entering the second gap 114 is referenced. Figure 5 As shown by the dashed line, a portion of the gas enters the interior of the first piston 12 through the through hole 127 and acts on the second piston 13, causing the second piston 13 to move upward relative to the first piston 12; another portion acts on the first piston 12, causing the first piston 12 to move upward relative to the sleeve 11.

[0064] Reference Figure 4 and Figure 5 The first piston 12 has a first inner cavity 124 and a second inner cavity 125 that are interconnected. A first limiting step 126 is provided between the first inner cavity 124 and the second inner cavity 125. A return spring 14 and a second piston 13 are disposed in the first inner cavity 124, and a second connecting part 131 passes through the second inner cavity 125. A second limiting step 132 is provided between the second piston 13 and the second connecting part 131. The first limiting step 126 and the second limiting step 132 are opposite each other, and a sealing gasket 133 is provided between the first limiting step 126 and the second limiting step 132. The first piston 12 and the second piston 13 adopt a stepped nested structure, which facilitates the reduction of device size, improves system integration, and reduces production costs. The sealing gasket 133 can be made of rubber or other materials to ensure the assembly sealing performance of the two pistons and to provide a buffering effect when the second piston 13 moves.

[0065] In some preferred embodiments, a sealing ring 1221, a guide ring 1222, and a linear bearing 1231 are provided between the first piston 12 and the sleeve 11. Specifically, the sealing ring 1221 and the guide ring 1222 are both disposed between the large-diameter rod 122 and the cavity wall of the large-diameter cavity 111, and the sealing ring 1221 and the guide ring 1222 are respectively arranged around the circumference of the large-diameter rod 122. The sealing ring 1221 is used to ensure a sealed fit between the large-diameter rod 122 and the large-diameter cavity 111, and the guide ring 1222 is used to realize the smooth linear movement of the first piston 12 along the driving direction Z. The linear bearing 1231 is disposed between the small-diameter rod 123 and the cavity wall of the small-diameter cavity 112, and the linear bearing 1231 can provide precise guidance for the movement of the first piston 12 along the driving direction Z. Among them, the sealing ring 1221, guide ring 1222 and linear bearing 1231 can be relevant products in the prior art, and the number of sealing ring 1221, guide ring 1222 and linear bearing 1231 can be reasonably set according to actual needs.

[0066] Furthermore, a sealing ring and a guide ring can also be provided between the first piston 12 and the second piston 13 to ensure that the second piston 13 achieves sealed and smooth linear movement inside the first piston 12, and the number of sealing rings and guide rings between the first piston 12 and the second piston 13 can be reasonably set according to actual needs.

[0067] In some preferred embodiments, the sleeve 11 and the first piston 12 can each be detachable to facilitate assembly operations of the various components. (Refer to...) Figure 3 As shown, in some embodiments, the sleeve 11 includes a detachably connected guide sleeve 117 and an end cap 118, with a sleeve sealing ring 119 provided between the guide sleeve 117 and the end cap 118. The guide sleeve 117 and the end cap 118 can be connected by threads, screws, or other methods. The end cap 118 forms the aforementioned large-diameter cavity 111, and the guide sleeve 117 forms the aforementioned small-diameter cavity 112. The sleeve sealing ring 119 can be a rubber sealing ring or the like, used to ensure the sealing performance at the connection between the guide sleeve 117 and the end cap 118. Similarly, the large-diameter rod 122 and the small-diameter rod 123 in the first piston 12 can be connected by threads, screws, or other methods, with a sealing structure provided between the large-diameter rod 122 and the small-diameter rod 123 to ensure the sealing performance between them.

[0068] The assembly process of the above-mentioned drive assembly is as follows: First, the return spring 14 and the second piston 13 are sealed and assembled inside the first piston 12, so that the return spring 14 and the second piston 13 are in the first inner cavity 124, and the second connecting part 131 passes through the second inner cavity 125; then, the first piston 12 with the second piston 13 is installed into the guide sleeve 117, and after installing the sealing ring 1221, the guide ring 1222 and the linear bearing 1231, the sleeve sealing ring 119 and the end cap 118 are installed on the guide sleeve 117, so that the large diameter rod 122 of the first piston 12 is in the large diameter cavity 111, and the small diameter rod 123 passes through the small diameter cavity 112.

[0069] In some preferred embodiments, the inner wall of the outer baffle 21 is provided with a first mating structure 211, which is mated and connected with the first connecting portion 121. The outer wall of the inner baffle 22 is provided with a second mating structure 223 corresponding to the first mating structure 211, which is mated and connected with the second connecting portion 131.

[0070] Reference Figure 3 and Figure 6 In some embodiments, the first mating structure 211 and the second mating structure 223 are configured as opposing slot structures, and the first connecting part 121 and the second connecting part 131 are configured as hook structures facing opposite directions. The first mating structure 211 engages with the first connecting part 121 to connect the first piston 12 to the outer baffle 21; the second mating structure 223 engages with the second connecting part 131 to connect the second piston 13 to the inner baffle 22. This design is compact, reasonable, and aesthetically pleasing, and is simple and efficient to assemble, improving assembly efficiency and reducing manufacturing costs.

[0071] However, the present invention is not limited thereto. In other embodiments, the connection structure between the first mating structure 211 and the first connecting part 121, and the connection structure between the second mating structure 223 and the second connecting part 131, may adopt other reasonable structural designs.

[0072] According to a second aspect of the present invention, a semiconductor sintering mold is provided. (Refer to...) Figure 7 In some embodiments, the semiconductor sintering mold includes an upper mold 30, a lower mold 40, and a thin film peeling device as described above.

[0073] The upper mold 30 and lower mold 40 are positioned opposite each other in the driving direction Z. The driving component 10 of the film peeling device is located in the upper mold 30, and the baffle assembly 20 is located between the upper mold 30 and the lower mold 40. The upper mold 30 is provided with a sintering pressure head 31, which corresponds to the product positioning hole 221 on the inner baffle 22 of the baffle assembly 20. The lower mold 40 is provided with a positioning boss 41, which corresponds to the product positioning hole 221.

[0074] In the above semiconductor sintering mold application, the thin film 50 is laid between the upper mold 30 and the baffle assembly 20; the product tray 70 is placed on the lower mold 40, and the positioning boss 41 is used to pre-position the product 60.

[0075] During mold closing, the upper mold 30 drives the drive assembly 10 and the baffle assembly 20 to move along the drive direction Z toward the lower mold 40. When the elastic positioning element 222 on the inner baffle 22 of the baffle assembly 20 presses against the edge of the product 60 to achieve circumferential flexible positioning of the product, the second piston 13 and the inner baffle 22 stop moving. At this time, the corresponding... Figure 8 As shown in the diagram; the upper mold 30 drives the first piston 12 and the outer baffle 21 to continue moving until the outer baffle 21 presses against the product tray 70, at which point... Figure 9 The state shown; subsequently, the upper mold 30 continues to move until it closes with the lower mold 40; after mold closing, the product 60 is sintered under pressure using the sintering head 31 through the thin film 50, at which time the corresponding Figure 10 The state shown.

[0076] When the mold opens, the sintering pressure head 31 resets, and the upper mold 30 returns to its starting position. First, the second piston 13 in the drive assembly 10 drives the inner baffle 22 to move along the drive direction Z towards the upper mold 30, so that the inner baffle 22 can peel the film 50 from the product 60. At this time, the corresponding... Figure 11 As shown in the figure; after the film 50 is peeled off, the first piston 12 in the drive assembly 10 drives the outer baffle 21 to move in the drive direction Z toward the direction close to the upper mold 30, so as to release the constraint of the outer baffle 21 on the product tray 70.

[0077] In other embodiments, the second piston 13 is nested inside the first piston 12, and the relative sliding resistance between the sleeve 11 and the first piston 12 is greater than the relative sliding resistance between the first piston 12 and the second piston 13. A second connecting portion 131 passes through the first connecting portion 121. A return spring 14 is provided inside the first piston 12 at the end of the second piston 13 furthest from the second connecting portion 131. This nested structure design of the first piston 12 and the second piston 13 facilitates a reduction in device size, improves system integration, and lowers production costs. The return spring 14 supports the second piston 13 and enables differential motion control between the two pistons. A first gap 113 exists between the end of the first piston 12 furthest from the first connecting portion 121 and the sleeve 11, and a second gap 114 exists between the end of the first piston 12 near the first connecting portion 121 and the sleeve 11. The sleeve 11 has a first air passage 115 and a second air passage 116, with the first air passage 115 communicating with the first gap 113 and the second air passage 116 communicating with the second gap 114. The side wall of the first piston is provided with a through hole, which connects to the internal space of the first piston. Furthermore, the side wall of the first piston 12 is provided with a through hole 127, which is used to connect the second gap with the internal space of the first piston 12.

[0078] Before the semiconductor sintering mold is closed, gas is introduced into the first gas channel 115. The gas enters the first gap 113, which pushes the first piston 12 and drives the outer baffle 21 to move away from the upper mold 30 (downward) along the driving direction Z. At the same time, the first piston 12 drives the second piston 13 to move synchronously with the inner baffle 22. In this way, the driving assembly 10 can be used to drive the baffle assembly 20 to move away from the upper mold 30 along the driving direction Z.

[0079] When the mold is closed, the return spring 14 is compressed when the second piston 13 and the inner baffle 22 stop moving and the first piston 12 and the outer baffle 21 continue to move.

[0080] During mold opening, after the upper mold 30 returns to its starting position, gas is introduced into the second air passage 116. After entering the second gap 114, part of the gas acts on the first piston 12, while the other part enters the first piston 12 through the through hole 127 and acts on the second piston 13. Because the relative sliding resistance between the sleeve 11 and the first piston 12 is greater than the relative sliding resistance between the first piston 12 and the second piston 13, the second piston 13 is pushed first, causing the inner baffle 22 to move along the driving direction Z towards the upper mold 30. The inner baffle 22 then peels the film off the product 60. During this process, the return spring 14 continues to be compressed. The outer baffle 21 initially remains pressed against the product tray. After the film peeling is complete, the first piston 12 is pushed, causing the outer baffle 21 to move along the driving direction Z towards the upper mold 30, releasing the outer baffle 21 from the product tray 70. Then, the return spring 14 returns to its initial state, thus returning the first piston 12 and the second piston 13 to their initial relative positions.

[0081] The semiconductor sintering mold of the present invention utilizes the aforementioned thin film peeling device. Through dual positioning of the positioning boss and the elastic positioning element, it further improves the product positioning accuracy, avoids product misalignment and deformation during sintering, ensures the sintering quality and performance stability of semiconductor products, and improves production continuity and automation level. At the same time, by integrating precise product positioning and thin film peeling functions, it can reduce manufacturing costs, simplify the mold debugging process, adapt to the needs of large-scale sintering of semiconductor products, and enhance the versatility and practicality of the mold.

[0082] According to a third aspect of the present invention, a semiconductor sintering method is provided. Using a semiconductor sintering mold as described above, the semiconductor sintering method includes the following steps: Sintering preparation: Refer to Figure 7 The drive assembly 10 moves the baffle assembly 20 to a preparatory position, and the film 50 is laid between the upper mold 30 and the baffle assembly 20. The product tray 70 carrying the product 60 is placed on the lower mold 40, and the positioning boss 41 on the lower mold 40 is used to pre-position the product 60, so that the product 60 is higher than the product tray. The preparatory position can be reasonably set according to the actual situation, as long as it can facilitate the film laying, product placement and meet the control requirements of the mold closing and opening steps.

[0083] Mold closing: The upper mold 30 drives the drive assembly 10 and the baffle assembly 20 to move along the drive direction Z toward the lower mold. When the elastic positioning element 222 on the inner baffle 22 of the baffle assembly 20 presses against the edge of the product 60 to achieve circumferential flexible positioning of the product, the second piston 13 and the inner baffle 22 stop moving. At this time, the corresponding... Figure 8 As shown in the diagram; the upper mold 30 drives the first piston 12 and the outer baffle 21 to continue moving until the outer baffle 21 presses against the product tray 70, at which point... Figure 9 The state shown; subsequently, the upper mold 30 continues to move until it closes with the lower mold 40; after mold closing, the product 60 is sintered under pressure using the sintering head 31 through the thin film 50, at which time the corresponding Figure 10 The state shown.

[0084] Mold Opening: After pressure sintering is completed, the sintering head 31 resets, and the upper mold 30 returns to its starting position. First, the second piston 13 in the drive assembly 10 drives the inner baffle 22 to move along the drive direction Z towards the upper mold 30, so that the inner baffle 22 can peel the film 50 from the product 60. At this time, the corresponding... Figure 11 As shown in the figure; after the film 50 is peeled off, the first piston 12 in the drive assembly 10 drives the outer baffle 21 to move in the drive direction Z toward the direction close to the upper mold 30, so as to release the constraint of the outer baffle 21 on the product tray 70.

[0085] In other embodiments, the second piston 13 is nested inside the first piston 12, and the relative sliding resistance between the sleeve 11 and the first piston 12 is greater than the relative sliding resistance between the first piston 12 and the second piston 13. A second connecting portion 131 passes through the first connecting portion 121. A return spring 14 is provided inside the first piston 12 at the end of the second piston 13 furthest from the second connecting portion 131. This nested structure design of the first piston 12 and the second piston 13 facilitates a reduction in device size, improves system integration, and lowers production costs. The return spring 14 supports the second piston 13 and enables differential motion control between the two pistons. A first gap 113 exists between the end of the first piston 12 furthest from the first connecting portion 121 and the sleeve 11, and a second gap 114 exists between the end of the first piston 12 near the first connecting portion 121 and the sleeve 11. The sleeve 11 has a first air passage 115 and a second air passage 116, with the first air passage 115 communicating with the first gap 113 and the second air passage 116 communicating with the second gap 114. The side wall of the first piston is provided with a through hole, which connects to the internal space of the first piston. Furthermore, the side wall of the first piston 12 is provided with a through hole 127, which is used to connect the second gap with the internal space of the first piston 12.

[0086] In the sintering preparation step, gas is introduced into the first gas passage 115. The gas enters the first gap 113, which pushes the first piston 12 and drives the outer baffle 21 to move away from the upper mold 30 (downward) along the driving direction Z. At the same time, the first piston 12 drives the second piston 13 to move synchronously with the inner baffle 22. In this way, the baffle assembly 20 can be moved to the preparatory position by the drive assembly 10.

[0087] During the mold closing process, when the second piston 13 and the inner baffle 22 stop moving, and the first piston 12 and the outer baffle 21 continue to move, the return spring 14 is compressed.

[0088] During the mold opening process, after the upper mold 30 returns to its starting position, gas is introduced into the second air passage 116. After entering the second gap 114, part of the gas acts on the first piston 12, while the other part enters the first piston 12 through the through hole 127 and acts on the second piston 13. Because the relative sliding resistance between the sleeve 11 and the first piston 12 is greater than the relative sliding resistance between the first piston 12 and the second piston 13, the second piston 13 is pushed first, causing the inner baffle 22 to move along the driving direction Z towards the upper mold 30. The inner baffle 22 then peels the film 50 from the product 60. During this process, the return spring 14 continues to be compressed. The outer baffle 21 initially remains pressed against the product tray. After the film peeling is complete, the first piston 12 is pushed, causing the outer baffle 21 to move along the driving direction Z towards the upper mold 30, releasing the outer baffle 21 from the product tray. Then, the return spring 14 returns to its initial state, thus returning the first piston 12 and the second piston 13 to their initial relative positions.

[0089] In the semiconductor sintering method of the present invention, the structural advantages of the semiconductor sintering mold mentioned above are combined to achieve integrated connection of precise product positioning, mold closing sintering, and thin film peeling, which effectively improves the sintering quality and pass rate of the product; the process is seamless, without the need for additional positioning and peeling processes, which greatly shortens the production cycle, improves production efficiency, and reduces the intensity of manual operation and the probability of human error. It is suitable for the needs of large-scale and high-precision production of semiconductor products, and has both practicality and economy, making it easy to promote and apply in industrial applications.

[0090] The present invention has been described in the above-described embodiments; however, these embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the present invention. Conversely, any modifications and refinements made without departing from the spirit and scope of the present invention are within the scope of patent protection of the present invention.

Claims

1. A thin film peeling device, used for product positioning and thin film peeling in semiconductor sintering molds, characterized in that: The film peeling device includes a drive assembly and a baffle assembly; The drive assembly includes a sleeve, a first piston, and a second piston. The first piston and the second piston are respectively movably disposed inside the sleeve along the drive direction. The first piston has a first connecting portion extending out of the sleeve, and the second piston has a second connecting portion extending out of the sleeve. The baffle assembly includes an outer baffle and an inner baffle. The outer baffle has a hollow frame structure, and the inner baffle corresponds to the inner side of the outer baffle. The abutting surface of the inner baffle is perpendicular to the driving direction. The first connecting part is connected to the outer baffle, and the first piston is used to drive the outer baffle to move along the driving direction. The second connecting part is connected to the inner baffle, and the second piston is used to drive the inner baffle to move along the driving direction. The inner baffle is provided with a product positioning hole, and an elastic positioning element is provided on the side of the inner baffle away from the driving assembly and corresponding to the edge of the product positioning hole. In the application of the film peeling device, the product and product tray are located on the side of the baffle assembly away from the drive assembly, and the film is located on the side of the baffle assembly closer to the drive assembly. When the semiconductor sintering mold is closed, the inner baffle flexibly positions the product circumferentially through the elastic positioning member, and the outer baffle presses against the product tray. When the semiconductor sintering mold is opened, the outer baffle first maintains the state of pressing against the product tray, and the second piston first drives the inner baffle to move along the drive direction toward the sleeve, so as to use the inner baffle to peel the film off the product. After the film peeling is completed, the first piston then drives the outer baffle to move along the drive direction toward the sleeve, so as to release the constraint of the outer baffle on the product tray.

2. The film peeling device as described in claim 1, characterized in that: The second piston is nested inside the first piston, and the relative sliding resistance between the sleeve and the first piston is greater than the relative sliding resistance between the first piston and the second piston; the second connecting part passes through the first connecting part; a return spring is provided inside the first piston at the end of the second piston away from the second connecting part.

3. The film peeling device as described in claim 2, characterized in that: The first piston has a first gap between the end away from the first connecting part and the sleeve, and a second gap between the end of the first piston near the first connecting part and the sleeve; the sleeve is provided with a first air passage and a second air passage, the first air passage is connected to the first gap, and the second air passage is connected to the second gap; the side wall of the first piston is provided with a through hole, and the through hole is connected to the second gap and the internal space of the first piston.

4. The film peeling device as described in claim 2, characterized in that: The first piston has a first inner cavity and a second inner cavity that are interconnected. A first limiting step is provided between the first inner cavity and the second inner cavity. The return spring and the second piston are disposed in the first inner cavity, and the second connecting part passes through the second inner cavity. A second limiting step is provided between the second piston and the second connecting part. The first limiting step and the second limiting step are opposite to each other, and a sealing gasket is provided between the first limiting step and the second limiting step.

5. The film peeling device as described in claim 1, characterized in that: The inner wall of the outer baffle is provided with a first mating structure, which is mated and connected with the first connecting part; the outer wall of the inner baffle is provided with a second mating structure corresponding to the first mating structure, which is mated and connected with the second connecting part.

6. A semiconductor sintering mold, characterized in that: The semiconductor sintering mold includes an upper mold, a lower mold, and a thin film peeling device as described in any one of claims 1-5; The upper mold and the lower mold are arranged opposite each other in the driving direction. The driving component of the film peeling device is located in the upper mold, and the baffle assembly is located between the upper mold and the lower mold. The upper mold is provided with a sintering pressure head, which corresponds to the product positioning hole on the inner baffle of the baffle assembly. The lower mold is provided with a positioning boss, which corresponds to the product positioning hole.

7. A semiconductor sintering method, characterized in that: The semiconductor sintering method, using the semiconductor sintering mold as described in claim 6, includes the following steps: Sintering preparation: Use the drive assembly to move the baffle assembly to the preparatory position, lay the film between the upper mold and the baffle assembly; place the product tray carrying the product on the lower mold, and use the positioning boss on the lower mold to pre-position the product; Mold closing: The upper mold drives the drive assembly and baffle assembly to move towards the lower mold along the drive direction. When the elastic positioning element on the inner baffle of the baffle assembly presses against the edge of the product to achieve circumferential flexible positioning of the product, the second piston and the inner baffle stop moving. The upper mold drives the first piston and the outer baffle to continue moving until the outer baffle presses against the product tray. Then, the upper mold continues to move until it closes with the lower mold. After mold closing, the product is sintered under pressure through a thin film using a sintering head. Mold opening: After the pressure sintering is completed, the sintering pressure head is reset and the upper mold returns to open; firstly, the second piston in the drive assembly drives the inner baffle to move along the drive direction towards the upper mold, so as to use the inner baffle to peel the film off the product; after the film is peeled off, the first piston in the drive assembly drives the outer baffle to move along the drive direction towards the upper mold, so as to release the constraint of the outer baffle on the product tray.

8. The semiconductor sintering method as described in claim 7, characterized in that: In the semiconductor sintering mold, the second piston is nested inside the first piston, and the relative sliding resistance between the sleeve and the first piston is greater than the relative sliding resistance between the first piston and the second piston; the second connecting part passes through the first connecting part; a return spring is provided inside the first piston at the end of the second piston away from the second connecting part; there is a first gap between the end of the first piston away from the first connecting part and the sleeve, and a second gap between the end of the first piston near the first connecting part and the sleeve; the sleeve is provided with a first air passage and a second air passage, the first air passage communicating with the first gap and the second air passage communicating with the second gap; the side wall of the first piston is provided with a through hole, which communicates with the second gap and the internal space of the first piston; In the sintering preparation step, gas is introduced into the first gas channel. The gas enters the first gap, which pushes the first piston and drives the outer baffle to move away from the upper mold along the driving direction. At the same time, the first piston drives the second piston to move synchronously with the inner baffle, so as to use the driving assembly to move the baffle assembly to the preparatory position.

9. The semiconductor sintering method as described in claim 8, characterized in that: During the mold closing process, when the second piston and the inner baffle stop moving while the first piston and the outer baffle continue moving, the return spring is compressed.

10. The semiconductor sintering method as described in claim 9, characterized in that: During the mold opening process, after the upper mold returns to its original position, gas is introduced into the second air passage. After the gas enters the second gap, part of the gas acts on the first piston, and the other part enters the interior of the first piston through the through hole and acts on the second piston. Since the relative sliding resistance between the sleeve and the first piston is greater than the relative sliding resistance between the first piston and the second piston, the second piston is pushed first to drive the inner baffle to move towards the upper mold along the driving direction, and the inner baffle is used to peel the film off the product. During this process, the return spring continues to be compressed. After the film is peeled off, the first piston is pushed to drive the outer baffle to move towards the upper mold along the driving direction, and the outer baffle releases the constraint of the product tray. Afterward, the return spring returns to its initial state, so that the first piston and the second piston return to their initial relative positions.

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