A conveying device for processing a semiconductor circuit substrate

Abstract

The application discloses a conveying device for semiconductor circuit substrate processing and belongs to the technical field of conveying devices, which comprises a conveying rack and a transmission roller installed on the conveying rack. The outer side of the transmission roller is provided with a conveying belt. A supporting bottom plate is installed on the conveying belt. The upper end of the supporting bottom plate is connected with a connecting loading plate through a floating connecting piece. A guide wheel is installed on the side of the supporting bottom plate. The guide wheel is pushed to move upward by a load-reducing plate installed on the side of the conveying rack, so that the load-reducing plate bears the load of the conveying piece on the connecting loading plate. The conveying device for semiconductor circuit substrate processing is provided with a floating supporting loading plate on the conveying machine. The supporting loading plate can be used for bearing a single circuit substrate or a stacked material frame. When the stacked material frame is conveyed, the supporting loading plate can be lifted up, so that the pressure of the stacked material frame on the conveying machine is reduced to the maximum.

Description

Technical Field

[0001] This invention relates to the field of conveying device technology, specifically to a conveying device for processing semiconductor circuit boards. Background Technology

[0002] In the fields of electronic manufacturing, such as semiconductor packaging, substrate manufacturing, surface mount technology, and advanced packaging testing, semiconductor circuit boards need to be transported efficiently, accurately, and without damage between different processes during processing. The transport objects mainly include two forms: one is a single semiconductor circuit board, and the other is a stacking frame used to hold multiple boards. Therefore, in order to improve the processing efficiency of circuit boards, corresponding transport devices are usually used.

[0003] For example, a PCB board conveying mechanism and PCB board lead cutting device, as disclosed in announcement number CN216470611U, includes an infeed conveyor line, a flip conveyor line and an outfeed conveyor line arranged independently in sequence along the PCB board conveying direction. The flip conveyor line includes a conveying component and a flipping component. The conveying component can clamp and fix the PCB board and can convey the PCB board conveyed by the infeed conveyor line to the outfeed conveyor line. The flipping component can drive the conveying component to flip so that the back side of the PCB board is facing upward.

[0004] For example, the circuit board production conveying device with announcement number CN218056992U includes a mounting frame and a transmission device. The transmission device is fixedly installed on the inner wall of the mounting frame. The top of the transmission device is provided with equidistantly arranged placement devices. The top of the mounting frame is provided with four antistatic devices. The four antistatic devices are located on the front and back of the transmission device, respectively. Circuit boards are placed through the evenly arranged placement devices, and then the transmission device drives the placement devices to move. The placement devices can protect the circuit boards and have a buffer function to avoid damage to the circuit boards. The antistatic devices can remove static electricity from the circuit boards to prevent static electricity from remaining on the circuit boards for a long time and causing damage.

[0005] The aforementioned existing technologies have the following technical problems: When processing semiconductor circuit boards in the workshop, the actual processing requires not only conveying single semiconductor circuit boards but also conveying stacked frames containing multiple boards. While a single semiconductor circuit board is lightweight, a fully loaded stacked frame is heavy. As a result, under the actual condition of conveying a fully loaded frame, the weight of the frame itself, combined with the weight of the numerous stacked boards inside, directly concentrates the load on the conveyor belt, conveyor rollers, drive chains, and other load-bearing components. At the same time, the entire machine frame and drive transmission mechanism will continuously bear significant vertical pressure and be under high load for a long time. This can easily lead to problems such as belt aging and stretching, roller wear and deformation, and chain loosening and play, significantly shortening the replacement cycle of parts and limiting the overall service life of the equipment.

[0006] Therefore, we propose a conveying device for semiconductor circuit board processing to solve the above problems. Summary of the Invention

[0007] The purpose of this invention is to provide a conveying device for semiconductor circuit board processing, so as to solve the problem mentioned in the background art that the existing conveying devices on the market, when conveying fully loaded stacked frames, cause the conveyor to be under high load and pressure for a long time, which easily leads to accelerated wear and tear on components.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a conveying device for processing semiconductor circuit boards, comprising a conveyor frame and a transmission roller mounted on the conveyor frame, a conveyor belt sleeved on the outer side of the transmission roller, a support base plate mounted on the conveyor belt, and the upper end of the support base plate being connected to a connecting carrier plate via a floating connector, a guide wheel mounted on the side of the support base plate, the guide wheel being pushed upward by a load-reducing plate mounted on the side of the conveyor frame, so that the load-reducing plate bears the load of the transported parts on the connecting carrier plate.

[0009] Preferably, there are multiple supporting base plates evenly distributed on the conveyor belt, and the upper end of each supporting base plate is connected to a connecting carrier plate through a floating connector.

[0010] By adopting the above technical solution, and through the uniform distribution of the supporting base plate and connecting carrier plate, multiple single circuit boards or stacked material frames can be transported.

[0011] Preferably, the guide wheel is capable of rotating on the side of the connecting carrier plate, and the longitudinal section of the load-reducing plate is set as an isosceles trapezoidal structure.

[0012] By adopting the above technical solution, the guide wheel can be squeezed and pushed by the inclined sides of the front and rear sides of the load-bearing plate, so that the guide wheel can drive the connecting plate to move upward synchronously.

[0013] Preferably, the floating connector includes a positioning post fixed to the supporting base plate, and a movable tube is inserted into the positioning post. The movable tube is fixed to the bottom of the connecting carrier plate, and the supporting base plate and the connecting carrier plate are connected to each other by an auxiliary spring.

[0014] By adopting the above technical solution, the stability of the connecting plate can be ensured after it is pushed upward by the movement of the movable tube on the positioning column.

[0015] Preferably, the upper outer wall of the positioning post is circumferentially wrapped with a sealing ring, and the positioning post divides the interior of the movable tube into a first air chamber and a second air chamber. An adsorption hole is provided in the middle area of ​​the connecting carrier plate, and the adsorption hole is interconnected with the first air chamber.

[0016] By adopting the above technical solution, the sealing ring at the upper end of the positioning post can ensure the sealing of the movable tube when it moves on the positioning post. At the same time, after the connecting carrier plate moves up, the volume inside the first air chamber increases, which generates negative pressure at the adsorption hole, thereby adsorbing and limiting the single semiconductor circuit board.

[0017] Preferably, the interior of the positioning post is a hollow structure, and a guide hole is provided on the side of the positioning post, and the guide hole and the second air chamber are interconnected.

[0018] By adopting the above technical solution, when the connecting carrier plate moves up, the second air chamber is compressed, and the airflow inside the second air chamber can enter the interior of the positioning column through the guide hole.

[0019] Preferably, the lower end of the positioning post is connected to the limiting post via an air supply hose, and a piston rod is inserted inside the limiting post. The piston rod is connected to the limiting post via a return spring, and an abutment plate is fixed to one end of the piston rod extending out of the limiting post.

[0020] By adopting the above technical solution, when airflow enters the positioning column, the airflow can enter the interior of the limiting column through the air delivery hose and use the airflow to push the piston rod to move.

[0021] Preferably, a sealing ring is circumferentially fixed at one end of the piston rod located inside the limiting post, and a buffer pad is fixed to the contact surface between the piston rod end fixed to the contact plate and the stacking frame, so that the piston rod can slide in the limiting post.

[0022] By adopting the above technical solution, the buffer pad at the end of the pressure plate can play a buffering role when the stacked material frame is clamped.

[0023] Preferably, an exhaust pipe is installed on the limiting post, which is used to connect the internal cavity of the limiting post with the outside. A solenoid valve controlled by a controller is installed on the exhaust pipe.

[0024] By adopting the above technical solution, the exhaust pipe can be switched on or off according to the actual transportation situation by controlling the opening and closing of the solenoid valve.

[0025] Compared with the prior art, the beneficial effects of the present invention are: the conveying device for semiconductor circuit board processing, by setting a floating support plate on the conveyor, the support plate can be used to support a single circuit board or a stacked frame. When conveying the stacked frame, the support plate can be lifted to minimize the pressure of the stacked frame on the conveyor. 1. By setting multiple support base plates and connecting carrier plates on the conveyor belt, the connecting carrier plates can be used to load single semiconductor circuit boards or stacked material frames in a separated manner, thereby avoiding collisions between adjacent conveyed items due to inertia during transportation or sudden power outages. 2. By setting guide wheels on the side of the connecting plate, when stacked material frames are placed on the connecting plate for transportation, the guide wheels on the side of the connecting plate can be pushed and squeezed by the inclined side of the load-reducing plate, so that the connecting plate can move upward. At this time, the load-reducing plate can be used to provide auxiliary support for the connecting plate during the transportation process, thereby minimizing the pressure of the connecting plate on the conveyor belt and drive rollers when transporting fully loaded stacked material frames. 3. When conveying a single semiconductor circuit board, after the connecting carrier is pushed upward, the volume inside the first air chamber increases. At this time, a negative pressure is formed at the adsorption hole, thereby adsorbing and limiting the semiconductor circuit board. Because the circuit board is fixed by adsorption, it can be used to position circuit boards of different sizes, and at the same time, it prevents damage to the circuit board caused by clamping. When conveying the stacked frame, after the connecting carrier moves upward, the airflow inside the second air chamber is squeezed into the interior of the positioning post, and then transmitted to the interior of the limiting post through the air supply hose. The airflow pushes the pressure plate to clamp and limit the stacked frame, improving the stability of the stacked frame during conveying. Attached Figure Description

[0026] Figure 1 This is a frontal perspective view of the present invention; Figure 2 This is a schematic diagram of the conveyor frame and load-bearing plate structure of the present invention; Figure 3 This is a schematic diagram of the connecting carrier plate and guide wheel structure of the present invention; Figure 4 This is a schematic diagram of the connecting carrier plate and adsorption hole structure of the present invention; Figure 5 for Figure 1 Enlarged structural diagram at point A in the middle; Figure 6 This is a cross-sectional view of the positioning column and movable tube of the present invention; Figure 7This is a schematic diagram of the structure of the movable tube after it has been moved according to the present invention; Figure 8 This is a schematic diagram of the connecting carrier plate and the contact pressure plate structure of the present invention; Figure 9 for Figure 8 Enlarged structural diagram at point B.

[0027] In the diagram: 1. Conveyor frame; 2. Drive roller; 3. Conveyor belt; 4. Support base plate; 5. Connecting carrier plate; 6. Guide wheel; 7. Load-reducing plate; 8. Positioning post; 9. Movable tube; 10. Auxiliary spring; 11. First air chamber; 12. Second air chamber; 13. Adsorption hole; 14. Guide hole; 15. Air delivery hose; 16. Limiting post; 17. Piston rod; 18. Return spring; 19. Contact pressure plate; 20. Exhaust pipe; 21. Solenoid valve. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Example 1: Please refer to Figures 1-9In the processing of semiconductor circuit boards in the workshop, the actual processing requires not only the conveying of single semiconductor circuit boards but also the conveying of stacked frames containing multiple boards. While a single semiconductor circuit board is lightweight, a fully loaded stacked frame is heavy. This results in the weight of the frame itself, combined with the weight of the numerous stacked boards inside, directly concentrating the load on the conveyor belt, conveyor rollers, and drive chain. Simultaneously, the entire machine frame and drive transmission mechanism continuously bear significant vertical pressure, operating under high load for extended periods. This can easily lead to problems such as belt aging and stretching, roller wear and deformation, and chain loosening and play, significantly shortening the replacement cycle of parts and limiting the overall lifespan of the equipment. To address this technical problem, this embodiment discloses the following technical content: a conveying device for processing semiconductor circuit boards, including a conveyor belt... The conveyor frame 1 and the drive roller 2 installed on the conveyor frame 1 are provided. The outer side of the drive roller 2 is fitted with a conveyor belt 3. The support base plate 4 is installed on the conveyor belt 3. The upper end of the support base plate 4 is connected to the connecting carrier plate 5 through a floating connector. The side of the support base plate 4 is equipped with a guide wheel 6. The guide wheel 6 is pushed upward by the load-reducing plate 7 installed on the side of the conveyor frame 1, so that the load-reducing plate 7 bears the load of the transported parts on the connecting carrier plate 5. There are multiple support base plates 4 evenly distributed on the conveyor belt 3. The upper end of each support base plate 4 is connected to the connecting carrier plate 5 through a floating connector. The guide wheel 6 can rotate on the side of the connecting carrier plate 5. The longitudinal section of the load-reducing plate 7 is set as an isosceles trapezoidal structure. The floating connector includes a positioning post 8 fixed on the support base plate 4. A movable tube 9 is inserted into the positioning post 8. The movable tube 9 is fixed to the bottom of the connecting carrier plate 5. The support base plate 4 and the connecting carrier plate 5 are connected to each other through an auxiliary spring 10.

[0030] When it is necessary to transport the semiconductor circuit board substrate, the circuit board is placed on the connecting carrier plate 5. The transmission roller 2 and the conveyor belt 3 are controlled by the servo motor to operate. The conveyor belt 3 drives the support plate 4 and the connecting carrier plate 5 to rotate, so as to realize the automatic transmission of a single circuit board substrate. When it is necessary to transfer stacked frames: The stacked material frames are placed on the connecting carrier plate 5. Since the connecting carrier plate 5 is equipped with guide wheels 6 on its side, when the conveyor belt 3 drives the supporting base plate 4 and the connecting carrier plate 5 to rotate, the guide wheels 6 on the side of the connecting carrier plate 5 are squeezed and pushed by the inclined edge of the load-reducing plate 7, thereby lifting the guide wheels 6 and the connecting carrier plate 5 upward. After the connecting carrier plate 5 moves, the movable tube 9 can move on the positioning column 8, thereby ensuring the stability of the connecting carrier plate 5 after it moves upward. At this time, in the subsequent conveying process, the load of the stacked material frames on the connecting carrier plate 5 is shared by the load-reducing plate 7, thereby reducing the pressure of the stacked material frames on the conveyor belt 3 and the drive roller 2 when multiple fully loaded stacked material frames are conveyed. At the same time, the guide wheels 6 can rotate on the side of the connecting carrier plate 5. Therefore, after the guide wheels 6 are lifted to the straight section at the top of the load-reducing plate 7, the guide wheels 6 and the load-reducing plate 7 are in rolling friction, thereby greatly reducing the contact friction between the guide wheels 6 and the load-reducing plate 7.

[0031] Example 2: The technical content disclosed in this example is a further improvement based on Example 1. To improve the stability of transporting single-wafer semiconductor circuit boards or stacked frames, the following technical content is disclosed in this example: Figures 3-9 As shown, the upper outer wall of the positioning post 8 is circumferentially wrapped with a sealing ring, and the positioning post 8 divides the interior of the movable tube 9 into a first air chamber 11 and a second air chamber 12. An adsorption hole 13 is provided in the middle region of the connecting carrier plate 5, and the adsorption hole 13 is interconnected with the first air chamber 11. The interior of the positioning post 8 is a hollow structure, and a guide hole 14 is provided on the side of the positioning post 8, and the guide hole 14 is interconnected with the second air chamber 12. The lower end of the positioning post 8 is connected to the limiting post 16 via an air supply hose 15, and a piston rod 17 is inserted inside the limiting post 16. The piston rod 17 is connected to the limit post 16 via a return spring 18. A contact plate 19 is fixed to one end of the piston rod 17 extending out of the limit post 16. A sealing ring is fixed circumferentially to one end of the piston rod 17 inside the limit post 16. A buffer pad is fixed to the contact surface between the contact plate 19 fixed to the end of the piston rod 17 and the stacking frame. The piston rod 17 can slide in the limit post 16. An exhaust pipe 20 is installed on the limit post 16. The exhaust pipe 20 is used to connect the internal cavity of the limit post 16 to the outside. A solenoid valve 21 controlled by a controller is installed on the exhaust pipe 20.

[0032] When processing semiconductor circuit boards in the workshop, the solenoid valve 21 is selectively opened and closed by the controller. Thus, the solenoid valve 21 is intelligently controlled according to the actual conveying of single circuit boards and stacked material frames. The specific control method or control logic belongs to the prior art, and will not be described in detail in this embodiment. When it is necessary to transfer data to a single semiconductor circuit board: The controller controls the solenoid valve 21 on the exhaust pipe 20 to open. When the monolithic circuit board is placed in the middle of the connecting carrier plate 5 for transmission, the monolithic circuit board covers the suction hole 13 in the middle area of ​​the connecting carrier plate 5. The guide wheel 6 can be pushed by the inclined side of the load-reducing plate 7. At this time, the guide wheel 6 drives the connecting carrier plate 5 to move upward. After the connecting carrier plate 5 moves, the movable tube 9 can move on the positioning post 8. After the movable tube 9 moves, it moves upward relative to the positioning post 8, and the volume inside the first air chamber 11 increases. At this time, a negative pressure can be generated at the suction hole 13. The negative pressure generated at three points can adsorb the conveyed circuit board. After the volume of the first air chamber 11 increases, the volume of the second air chamber 12 decreases. The airflow enters the interior of the limiting post 16 through the guide hole 14 and the air delivery hose 15. Because the solenoid valve 21 is open, the airflow inside the limiting post 16 is discharged outward through the exhaust pipe 20. The airflow will not push the piston rod 17 and the pressure plate 19 to move. By using negative pressure adsorption, it can not only be used to fix circuit boards of different sizes, but also avoid damage to the circuit board caused by using clamping. When it is necessary to transfer stacked frames: The controller controls the solenoid valve 21 on the exhaust pipe 20 to close. After the stacked material frame is placed on the connecting carrier plate 5 for conveying, the load-reducing plate 7 pushes the guide wheel 6 and the connecting carrier plate 5 upward. Since the bottom of the stacked material frame is not flat, after the connecting carrier plate 5 moves upward, the suction hole 13 cannot play a suction and limiting role on the stacked material frame. At this time, the airflow inside the second air chamber 12 enters the interior of the limiting column 16 through the guide hole 14 and the air delivery hose 15. Since the exhaust pipe 20 has been blocked, the airflow cannot be discharged outward through the exhaust pipe 20. After the airflow inside the limiting column 16 increases, it can push the piston rod 17 and the contact plate 19 to move towards the stacked material frame. At this time, the contact plate 19 can be used to clamp and position the stacked material frame. The stability of the stacked material frame when conveyed in the connecting carrier plate 5 is ensured by clamping. Therefore, by intelligently controlling the on / off state of the solenoid valve 21 with the controller, and by cooperating with the floating mechanism during specific load reduction, two different limiting methods can be selected according to the actual semiconductor circuit board or stacked material frame being transported: one is to limit the lightweight circuit board without damage by adsorption, and the other is to fix the heavier stacked material frame by clamping.

[0033] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0034] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A conveying device for processing semiconductor circuit boards, comprising a conveyor frame (1) and a drive roller (2) mounted on the conveyor frame (1), wherein a conveyor belt (3) is sleeved on the outer side of the drive roller (2), characterized in that: The conveyor belt (3) is equipped with a support base plate (4), and the upper end of the support base plate (4) is connected to the connecting carrier plate (5) through a floating connector. The side of the connecting carrier plate (5) is equipped with a guide wheel (6), and the guide wheel (6) is pushed upward by the load-reducing plate (7) installed on the side of the conveyor frame (1), so that the load-reducing plate (7) bears the load of the transported items on the connecting carrier plate (5). The floating connector includes a positioning post (8) fixed on the support base plate (4), and a movable tube (9) is inserted into the positioning post (8). The movable tube (9) is fixed to the bottom of the connecting carrier plate (5). The support base plate (4) and the connecting carrier plate (5) are connected to each other by an auxiliary spring (10). The upper outer wall of the positioning column (8) is wrapped with a sealing ring, and the positioning column (8) divides the interior of the movable tube (9) into a first air chamber (11) and a second air chamber (12). An adsorption hole (13) is opened in the middle area of ​​the connecting carrier plate (5), and the adsorption hole (13) is connected to the first air chamber (11). The interior of the positioning post (8) is set as a hollow structure, and a guide hole (14) is opened on the side of the positioning post (8), and the guide hole (14) is connected to the second air chamber (12); The lower end of the positioning post (8) is connected to the limiting post (16) via the air supply hose (15), and a piston rod (17) is inserted inside the limiting post (16). The piston rod (17) is connected to the limiting post (16) via the return spring (18), and a contact plate (19) is fixed to one end of the piston rod (17) that extends out of the limiting post (16). The piston rod (17) is circumferentially fixed with a sealing ring at one end inside the limiting post (16), and the contact surface between the piston rod (17) fixed with the contact plate (19) and the stacking frame is fixed with a buffer pad, so that the piston rod (17) can slide in the limiting post (16).

2. The conveying device for semiconductor circuit board processing according to claim 1, characterized in that: The supporting base plate (4) is evenly distributed on the conveyor belt (3), and the upper end of each supporting base plate (4) is connected to the connecting carrier plate (5) by a floating connector.

3. The conveying device for semiconductor circuit board processing according to claim 1, characterized in that: The guide wheel (6) can rotate on the side of the connecting plate (5), and the longitudinal section of the load-reducing plate (7) is set as an isosceles trapezoidal structure.

4. The conveying device for semiconductor circuit board processing according to claim 1, characterized in that: An exhaust pipe (20) is installed on the limiting post (16). The exhaust pipe (20) is used to connect the internal cavity of the limiting post (16) with the outside. A solenoid valve (21) controlled by a controller is installed on the exhaust pipe (20).

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