Bonding head and bonding apparatus

Abstract

This application discloses a bonding head and bonding equipment, belonging to the field of semiconductor equipment. The bonding head includes a driving unit, a guiding unit, and a decoupling unit. The guiding unit includes a first guiding mechanism and a second guiding mechanism mounted on the same substrate. The decoupling unit is disposed between the first guiding mechanism and the second guiding mechanism, including a first decoupling mechanism and a second decoupling mechanism connected along a first direction. The first decoupling mechanism is capable of angular deflection, and the second decoupling mechanism is capable of horizontal movement. Based on a dual guiding mechanism, this application further provides a decoupling unit between the first guiding mechanism and the second guiding mechanism. This unit can adapt to horizontal deviations and / or tilt deviations introduced between the first guiding mechanism and the second guiding mechanism due to processing or assembly, ensuring smooth transmission of driving force from the driving unit, eliminating the risk of jamming during the bonding head's transmission process, ensuring the motion accuracy and control accuracy of the bonding head, and improving bonding accuracy and process yield.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, and more particularly to a bonding head and bonding device. Background Technology

[0002] As the core execution unit of the bonding process, the accuracy of the bonding head's motion trajectory and the stability of the bonding force control directly determine the bonding accuracy and quality. However, the guiding mechanisms of existing bonding heads are relatively simple and often fail to provide high-precision guiding constraints. This not only limits the motion accuracy of the bonding head but also directly affects the alignment accuracy of the bonding and the yield of subsequent processes. Furthermore, the overall internal structure of existing bonding heads is relatively complex, making them prone to transmission jamming along the force transmission path. This jamming can lead to decreased force control accuracy, posing a risk of damaging the chip or the underlying substrate; it can also cause mechanical deadlock within the bonding head, affecting the reliability of the device. Therefore, a new type of bonding head is urgently needed, designed to ensure high-precision motion guidance while guaranteeing the smoothness and stability of the driving force transmission. Summary of the Invention

[0003] This application provides a bonding head and bonding device. The bonding head employs a dual-guide mechanism with vertically spaced guides to suppress swaying or tilting of the adsorption unit, which serves as the bonding end actuator, thereby improving the control accuracy of the adsorption unit and ensuring bonding accuracy. Furthermore, based on the aforementioned dual-guide mechanism, this application also includes a decoupling unit between the first and second guide mechanisms. This unit can adaptively handle horizontal and / or tilting deviations introduced by processing or assembly errors between the first and second guide mechanisms, ensuring smooth transmission of driving force from the drive unit, eliminating the risk of jamming during the bonding head's transmission process, and improving bonding accuracy and yield.

[0004] To achieve the above objectives, according to a first aspect of this application, a bonding head is provided, comprising: The drive unit is used to provide driving force; The guiding unit includes a first guiding mechanism and a second guiding mechanism mounted on the same substrate, and functional units are mounted on the first guiding mechanism and the second guiding mechanism. A decoupling unit is disposed between the first guide mechanism and the second guide mechanism. The decoupling unit includes a first decoupling mechanism and a second decoupling mechanism connected sequentially along a first direction. The first decoupling mechanism is closer to the drive unit than the second decoupling mechanism. The first decoupling mechanism is capable of angular deflection, while the second decoupling mechanism is capable of horizontal movement.

[0005] According to a second aspect of this application, a bonding apparatus is also provided, the bonding apparatus comprising: The bonding head described in the above technical solution.

[0006] In the bonding head and bonding device of this application embodiment, the above technical solution has at least the following beneficial effects: The bonding head of this application adopts a double guide mechanism with vertical spacing. The first guide mechanism located at the top is used to ensure the motion accuracy of the upper functional unit, and the second guide mechanism located at the bottom is used to ensure the motion accuracy of the lower functional unit and the end adsorption unit. By independently setting the second guide mechanism, the adsorption unit, which serves as the end actuator of the bonding, can be suppressed from swaying or tilting, thereby improving the control accuracy of the adsorption unit and thus improving the bonding accuracy. At the same time, based on the double guide mechanism, this application also sets a decoupling unit between the first guide mechanism and the second guide mechanism, which can adapt to the horizontal deviation and / or tilt deviation introduced by the processing or assembly errors between the first guide mechanism and the second guide mechanism, ensuring the smooth transmission of the driving force from the drive unit and eliminating the risk of jamming of the bonding head during the transmission process. In this way, the risk of jamming of the bonding head during the transmission process can be eliminated, ensuring the motion accuracy and control accuracy of the bonding head, and improving the bonding accuracy and process yield.

[0007] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0010] Figure 1 This is a schematic diagram of the overall structure of the bonding head provided in the embodiments of this disclosure; Figure 2 This is one of the structural schematic diagrams of the decoupling unit in the bonding head provided in the embodiments of this disclosure; Figure 3 This is the second schematic diagram of the decoupling unit in the bonding head provided in the embodiments of this disclosure; Figure 4 This is a schematic diagram of the structure of the first decoupling mechanism in the bonding head provided in the embodiments of this disclosure; Figure 5 This is a schematic diagram illustrating the function of the decoupling unit in the bonding head provided in this embodiment of the present disclosure; Figure 6This is a schematic diagram of the force control unit in the bonding head provided in the embodiments of this disclosure; Figure 7 This is a schematic diagram of the pre-tightening unit in the bonding head provided in the embodiments of this disclosure; Figure 8 This is a schematic diagram of the deformation detection unit in the bonding head provided in the embodiments of this disclosure; Figure 9 This is a schematic diagram of the structure of the elastic unit in the bonding head provided in the embodiments of this disclosure.

[0011] Explanation of reference numerals in the attached figures: 1- Bonding head; 2-Drive unit; 21-Motor; 3-Guiding unit; 31-First guiding mechanism; 32-Second guiding mechanism; 4-Functional unit; 41-First functional mechanism; 42-Second functional mechanism; 5-Decoupling unit; 51-First decoupling mechanism; 511-First connecting block; 512-Second connecting block; 513-Third connecting block; 514-First connecting rod; 515-First retaining ring; 516-First bearing; 517-Second retaining ring; 518-Second bearing; 519-Second connecting rod; 52-Second decoupling mechanism; 521-First motion table; 522-Second motion table; 53-First adapter; 54-Second adapter; 55-First support seat; 6-Force control unit; 61-Force sensor; 62-Flexible mechanism; 621-First flexible mechanism; 622-Second flexible mechanism; 63-Second support; 64-Third support; 65-Fourth support; 7-Deformation detection unit; 71-Deformation detection sensor; 711-Probe; 72-Third adapter; 721-Detection surface; 8 - Adsorption unit; 81 - Suction cup; 9-Elastic element; 91-First connector; 92-Second connector; 93-Elastic element; 10-Preload unit; 11-Screw; 12-Nut; Z - First direction; X - Second direction; Y - Third direction. Detailed Implementation

[0012] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0013] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship according to the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0014] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0015] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0016] This application provides a bonding head and a bonding device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0017] like Figure 1 As shown, the bonding head 1 of this application includes a driving unit 2, a guiding unit 3, and a decoupling unit 5. The driving unit 2 provides driving force. The guiding unit 3 includes a first guiding mechanism 31 and a second guiding mechanism 32 mounted on the same substrate, and functional units 4 are mounted on the first guiding mechanism 31 and the second guiding mechanism 32. The decoupling unit 5 is disposed between the first guiding mechanism 31 and the second guiding mechanism 32. The decoupling unit 5 includes a first decoupling mechanism 51 and a second decoupling mechanism 52 connected sequentially along a first direction Z (in this application, the first direction Z is the vertical direction). The first decoupling mechanism 51 is closer to the driving unit 2 than the second decoupling mechanism 52. The first decoupling mechanism 51 is configured to be able to deflect at an angle, and the second decoupling mechanism 52 is configured to be able to move horizontally.

[0018] In this technical solution, the driving unit 2 serves as a power source, providing driving force to drive the adsorption unit 8 to move and perform bonding actions. The adsorption unit 8 includes a suction cup 81, which is used to adsorb or release the substrate to be bonded.

[0019] The guiding unit 3 includes a first guiding mechanism 31 and a second guiding mechanism 32 spaced apart along a first direction Z. The first guiding mechanism 31 and the second guiding mechanism 32 are coaxially fixedly mounted on the same substrate (not shown in the figure), that is, the vertical center lines of the first guiding mechanism 31 and the second guiding mechanism 32 coincide with each other; and the first guiding mechanism 31 is located above the second guiding mechanism 32. Both the first guiding mechanism 31 and the second guiding mechanism 32 are provided with functional units 4 to guide the movement of the functional units 4, thereby ensuring the movement accuracy of the bonding head 1 as a whole, especially the adsorption unit 8 at the end, which serves as the bonding action execution mechanism.

[0020] A decoupling unit 5 is disposed between the first guide mechanism 31 and the second guide mechanism 32 to decouple the first guide mechanism 31 (and the functional unit 4 mounted thereon) and the second guide mechanism 32 (and the functional unit 4 mounted thereon) to prevent jamming during the force transmission process. Specifically, the decoupling unit 5 includes a first decoupling mechanism 51 and a second decoupling mechanism 52 connected to each other, with the first decoupling mechanism 51 located above the second decoupling mechanism 52. The first decoupling mechanism 51 is configured to be capable of angular deflection, and the second decoupling mechanism 52 is configured to be capable of horizontal movement. Through the coordinated action of the first and second decoupling mechanisms 51 and 52, the transmission process of the driving force of the bonding head 1 is adapted to the transmission process, and the direction of force transmission is adaptively changed to prevent jamming during the transmission process.

[0021] In existing technologies, a single guiding mechanism is used to ensure the motion accuracy of the bonding head. However, since the bonding head itself has a relatively long length along the first direction Z, relying solely on a single guiding structure often only constrains the local motion trajectory (local guidance), making it difficult to guarantee the overall motion stability and accuracy of the bonding head, especially the end of the bonding head, i.e., the adsorption unit. This easily introduces motion errors (and the motion errors of this end, i.e., the adsorption unit, are difficult to detect and compensate for), affecting the final bonding accuracy and process yield.

[0022] Compared to existing technologies, this application employs a dual-guide mechanism with vertical spacing. Specifically, the upper first guide mechanism 31 supports and ensures the movement accuracy of the upper functional unit 4, while the lower second guide mechanism 32 supports and ensures the movement accuracy of the lower functional unit 4 and the end adsorption unit 8. By independently setting the second guide mechanism 32 on top of the first guide mechanism 31, it is possible to suppress the swaying or tilting of the adsorption unit 8, which serves as the bonding end actuator, thereby improving the control accuracy of the adsorption unit 8 and thus improving the bonding accuracy. However, although the design center lines of the first guide mechanism 31 and the second guide mechanism 32 are theoretically coaxial, in actual processing and assembly, horizontal deviation and / or tilting deviation inevitably exist between them, making it difficult to guarantee that the first guide mechanism 31 and the second guide mechanism 32 are absolutely coaxial. Since both the first guide mechanism 31 and the second guide mechanism 32 are fixed to the same substrate, resulting in their relatively fixed positions, it is easy for the bonding head 1 to experience internal interference or even jamming during transmission. Therefore, based on the dual-guide mechanism, this application further provides a decoupling unit 5 between the first guide mechanism 31 and the second guide mechanism 32. This unit can adaptively handle horizontal and / or tilt deviations introduced by machining or assembly errors between the first guide mechanism 31 and the second guide mechanism 32, ensuring smooth transmission of driving force from the drive unit 2. This eliminates the risk of jamming in the bonding head 1 during transmission, ensuring the motion and control accuracy of the bonding head 1, and improving bonding accuracy and process yield.

[0023] It is understood that in this embodiment, the driving unit 2 may be a motor 21 or other power source capable of providing driving force. The substrate to be bonded includes various semiconductor or electronic components such as chips and wafers that require bonding operations.

[0024] In some embodiments, such as Figure 2 and Figure 3 As shown, the first decoupling mechanism 51 is configured to drive the second decoupling mechanism 52 connected thereto to move horizontally in sync when an angular deflection occurs. The second decoupling mechanism 52 is configured to be able to move horizontally independently of the first decoupling mechanism 51. In this application, the aforementioned "horizontal movement" includes movement along a second direction X and movement along a third direction Y.

[0025] In this technical solution, the first decoupling mechanism 51 and the second decoupling mechanism 52 are directly connected, with the first decoupling mechanism 51 positioned above the second decoupling mechanism 52. The second decoupling mechanism 52 can move cooperatively with the first decoupling mechanism 51 or independently relative to it. Specifically, when the first decoupling mechanism 51 deflects at an angle, the second decoupling mechanism 52 undergoes a horizontal displacement. Their cooperative movement eliminates transmission jamming caused by tilting errors between the first guide mechanism 31 and the second guide mechanism 32 (and between the functional units 4 mounted on the first guide mechanism 31 and the second guide mechanism 32). When the first decoupling mechanism 51 does not deflect at an angle, the second decoupling mechanism 52 can move horizontally independently to eliminate horizontal errors between the first guide mechanism 31 and the second guide mechanism 32 (and between the functional units 4 mounted on the first guide mechanism 31 and the second guide mechanism 32). It is understandable that during the coordinated movement of the first decoupling mechanism 51 and the second decoupling mechanism 52, in addition to eliminating transmission jamming caused by tilting errors, transmission jamming caused by horizontal errors can also be eliminated simultaneously. For example... Figure 5 As shown in the left figure, the first guide mechanism 31 and the second guide mechanism 32 are coaxial at this time, and the first decoupling mechanism 51 and the second decoupling mechanism 52 remain stationary. Figure 5 As shown in the intermediate diagram, when there is only a horizontal deviation between the first guide mechanism 31 and the second guide mechanism 32 (for example, a deviation along the second direction X), the first decoupling mechanism 51 does not undergo angular deflection, and the second decoupling mechanism 52 moves independently along the second direction X. Figure 5 As shown in the right figure, when there is a tilt error between the first guide mechanism 31 and the second guide mechanism 32 (for example, there is a rotational deviation (Ry rotation) between them around an axis parallel to the third direction Y), the first decoupling mechanism 51 will deflect at an angle, and the second decoupling mechanism 52 will also move along the second direction X.

[0026] In some embodiments, when the first decoupling mechanism 51 rotates about an axis parallel to the second direction X (i.e., when the first decoupling mechanism 51 rotates Rx), it drives the second decoupling mechanism 52 to move synchronously along the third direction Y. When the first decoupling mechanism 51 rotates about an axis parallel to the third direction Y (i.e., when the first decoupling mechanism 51 rotates Ry), it drives the second decoupling mechanism 52 to move synchronously along the second direction X.

[0027] In some embodiments, such as Figure 4As shown, the first decoupling mechanism 51 includes a first connecting block 511, a second connecting block 512, and a third connecting block 513. The first connecting block 511 and the second connecting block 512 are hinged together by a first connecting rod 514, and the second connecting block 512 and the third connecting block 513 are hinged together by a second connecting rod 519. The axial ends of the first connecting rod 514 and the second connecting rod 519 respectively pass through the inner ring of the bearing, the outer ring of the bearing is fixed inside the second connecting block 512, and a retaining ring is also provided at the end of the outer ring of the bearing. The first connecting rod 514 and the second connecting rod 519 are arranged in a cross shape. The second connecting block 512 can rotate about the axis of the first connecting rod 514 and the axis of the second connecting rod 519 respectively.

[0028] In this technical solution, the first decoupling mechanism 51 includes a first connecting rod 514 extending along a second direction X and a second connecting rod 519 extending along a third direction Y. The first connecting rod 514 and the second connecting rod 519 are arranged in a cross-shaped interval and are respectively installed at different positions inside the second connecting block 512. The second connecting block 512, as a movable component, is configured to rotate about the axis of the first connecting rod 514 (i.e., achieve Rx rotation) and about the axis of the second connecting rod 519 (i.e., achieve Ry rotation). A bearing receiving groove is provided inside the second connecting block 512, in which a first bearing 516 and a second bearing 518 are installed. The first connecting rod 514 passes sequentially through the first connecting block 511, the inner ring of the first bearing 516, and the inner ring of the second bearing 518. Through the cooperation of the first connecting block 511, the second connecting block 512, the first connecting rod 514, and the bearings, the second connecting block 512 achieves Rx rotation relative to the first connecting rod 514. In addition, a first retaining ring 515 is provided at the end of the outer ring of the first bearing 516, and a second retaining ring 517 is provided at the end of the outer ring of the second bearing 518. The first retaining ring 515 and the second retaining ring 517 are used to axially press and fix the bearings to ensure that the bearings are kept in a preset accurate position and to prevent axial movement during operation, thereby ensuring the stability and accuracy of the movement of the second connecting block 512.

[0029] Furthermore, it should be noted that since the cooperation relationship between the second connecting block 512 and the third connecting block 513 is the same as the cooperation principle between the second connecting block 512 and the first connecting block 511, the cooperation details between the second connecting block 512 and the third connecting block 513 will not be elaborated here.

[0030] In some embodiments, the second decoupling mechanism 52 includes a first motion stage 521 and a second motion stage 522 arranged sequentially along a first direction Z. The first motion stage 521 is configured to move linearly along a second direction X, and the second motion stage 522 is configured to move linearly along a third direction Y.

[0031] In this technical solution, the second decoupling mechanism 52 is arranged in layers, with the first motion stage 521 positioned above the second motion stage 522. The first motion stage 521 is configured to move along the second direction X, and the second motion stage 522 is configured to move along the third direction Y. Thus, planar motion along both the second direction X and the third direction Y can be achieved through the second decoupling mechanism 52. It is understood that in practical applications, the driving directions of each motion stage can be interchanged according to actual needs, i.e., the first motion stage performs the motion along the third direction Y, and the second motion stage performs the motion along the second direction X.

[0032] In some embodiments, such as Figure 6 As shown, the bonding head 1 of this application also includes a force control unit 6. The force control unit 6 includes a force sensor 61 and a flexible mechanism 62. The flexible mechanism 62 includes a first flexible mechanism 621 and a second flexible mechanism 622. The first flexible mechanism 621 has a through hole through which the force sensor 61 passes. The force sensor 61 passes through the through hole, and the portion of it extending out of the first flexible mechanism 621 along its axis is supported by a third support 64.

[0033] In this technical solution, the force sensor 61 is used to detect the magnitude of the applied bonding force in real time. One end of the first flexible mechanism 621 is disposed on the second support 63, and the other end is supported by the third support 64. One end of the second flexible mechanism 622 is also disposed on the second support 63, and the other end is disposed on the fourth support 65. The first flexible mechanism 621 is located inside the second flexible mechanism 622, and both have deformable characteristics. The geometric centers of the first flexible mechanism 621 and the second flexible mechanism 622 together constitute the center of the force sensor 61 and the force center of the adsorption unit 8. Specifically, a through hole is opened in the center of the first flexible mechanism 621, the force sensor 61 is installed in the through hole, and the portion of the force sensor 61 extending axially out of the first flexible mechanism 621 is supported by the third support 64. Thus, through the cooperation of the first flexible mechanism 621 and the third support seat 64, the force sensor 61 is covered and supported, which can enhance the overall rigidity of the force sensor 61 and prevent it from swaying or tilting during movement. This avoids affecting the detection accuracy of the bonding force due to posture deviation, or causing the adsorption unit 8 to sway or tilt unexpectedly.

[0034] In some embodiments, both the first flexible mechanism 621 and the second flexible mechanism 622 are axisymmetric structures. The first flexible mechanism 621 is configured to rotate about an axis parallel to a second direction X, and the second flexible mechanism 622 is configured to rotate about an axis parallel to a third direction Y.

[0035] In this technical solution, both the first flexible mechanism 621 and the second flexible mechanism 622 adopt an axisymmetric structure. This symmetrical structure ensures that the stress distribution is uniform when both are subjected to force, avoiding slight rotation or tilting of the adsorption unit due to parasitic torsional torque, thereby ensuring the overall stability of the bonding head 1. Simultaneously, both the first flexible mechanism 621 and the second flexible mechanism 622 are deformable structures. The first flexible mechanism 621 is configured to undergo Rx deformation, and the second flexible mechanism 622 is configured to undergo Ry deformation. Therefore, when the driving force transmitted by the driving unit 2 has a lateral component, the first flexible mechanism 621 and the second flexible mechanism 622 can decompose the lateral force through their own flexible deformation, preventing the force sensor 61 and the adsorption unit 8 at the end from deflecting or tilting due to the lateral force.

[0036] It is understandable that in practical applications, the allocation of motion degrees of freedom between the first flexible mechanism 621 and the second flexible mechanism 622 is not fixed and can be interchanged according to actual needs. That is, the first flexible mechanism 621 performs Ry deformation and the second flexible mechanism 622 performs Rx deformation.

[0037] In some embodiments, such as Figure 7 As shown, the bonding head 1 also includes a preload unit 10, which includes a screw 11 and a nut 12 sleeved on the screw 11. One end of the screw 11 is connected to the second support 63, and the other end is threaded to the first flexible mechanism 621 and in contact with the force sensor 61 to apply a preload force to the force sensor 61.

[0038] In this technical solution, a pre-tightening unit 10 is also provided for the force sensor 61. Specifically, one end of the screw 11 abuts against the force sensor 61. By tightening the nut 12 fitted on the screw 11, the pre-tightening force applied by the screw 11 to the force sensor 61 can be adjusted and increased. Based on this, the pre-tightening structure can shift the initial operating point of the force sensor 61 to its optimal range, thereby avoiding the non-optimal range region where the sensor has high nonlinearity, thus improving the detection accuracy of the force sensor 61 and preventing damage to the chip or the underlying substrate due to excessive bonding force. At the same time, the two side walls of the second flexible mechanism 622 are hollow, forming an operating window through which the pre-tightening tool passes, so that the pre-tightening of the force sensor 61 can be achieved through the operating window.

[0039] In some embodiments, such as Figure 8As shown, the bonding head 1 also includes a deformation detection unit 7, which includes a deformation detection sensor 71 and a third adapter 72. The third adapter 72 is fixedly connected to the second flexible mechanism 622. The deformation detection sensor 71 detects the displacement of the third adapter 72 relative to a preset reference in a non-contact manner. Specifically, the deformation detection sensor 71 includes a probe 711. The third adapter 72 includes a detection surface 721. The probe 711 detects the displacement of the detection surface 721 relative to the preset reference.

[0040] In this technical solution, the third adapter 72 of the deformation detection unit 7 is fixedly installed on the second flexible mechanism 622, and the probe 711 of the deformation detection sensor 71 detects the displacement of the detection surface 721 relative to a preset reference in real time in a non-contact manner. On the one hand, this displacement can characterize the actual displacement of the force sensor 61. By establishing a mapping relationship between the displacement and the magnitude of the force, the bonding force can be indirectly obtained using the displacement, in addition to the direct reading from the force sensor 61, thus forming a dual verification mechanism, which is beneficial for achieving high-precision force control. On the other hand, in application scenarios where the bonding head has a heating function, the bonding head 1 will undergo thermal expansion when heated. The deformation detection unit 7 can accurately capture the displacement change caused by thermal expansion. By establishing the correspondence between the thermal expansion and the displacement change at different temperatures, key reference data can be provided for the yield analysis and compensation of subsequent bonding processes, which can be used to adjust process parameters.

[0041] It is understandable that the deformation detection sensor 71 is fixedly supported by the bracket, and its specific installation position only needs to ensure that the probe 711 can effectively detect the detection surface 721. In practical applications, it can be adaptively arranged according to specific working conditions and the internal spatial structure of the device.

[0042] In some embodiments, such as Figure 9 As shown, the bonding head 1 also includes an elastic unit 9. The elastic unit 9 includes a first connector 91, an elastic element 93, and a second connector 92 connected in sequence. The first connector 91 is fixedly connected to the first connecting block 511, and the second connector 92 is fixedly connected to the first support seat 55.

[0043] In this technical solution, the elastic unit 9 is connected between the first decoupling mechanism 51 and the first support seat 55. By applying a tensioning force to the first decoupling mechanism 51 and the second decoupling mechanism 52 through the elastic element 93 in the elastic unit 9, the mechanical backlash caused by gravity can be eliminated, reducing the idle stroke during the pressing process of the bonding head 1, thereby improving bonding efficiency and yield. It is understood that the elastic element 93 can be an elastic element with telescopic characteristics, such as a tension spring, and can be adaptively selected according to specific working conditions and design requirements in practical applications.

[0044] In some embodiments, the first guide mechanism 31 and the second guide mechanism 32 in the guide unit 3 can be either the same type of guide rail or different types of guide rails. Preferably, the first guide mechanism 31 and the second guide mechanism 32 are selected from either linear guide rails or crossed roller guide rails.

[0045] In some embodiments, such as Figure 1 As shown, functional unit 4 includes a first functional mechanism 41 and a second functional mechanism 42. The first functional mechanism 41 is disposed on the first guide mechanism 31 and is movable along the first guide mechanism 31. The second functional mechanism 42 is disposed on the second guide mechanism 32 and is movable along the second guide mechanism 32.

[0046] In this technical solution, a first functional mechanism 41 and a second functional mechanism 42 are respectively provided on the first guiding mechanism 31 and the second guiding mechanism 32. Exemplarily, the first functional mechanism 41 may include a transmission mechanism for transmitting the driving force from the driving unit 2 to the lower second functional mechanism 42 and the end adsorption unit 8 via the decoupling unit 5. The second functional mechanism 42 may include a heating and cooling mechanism, etc., for realizing the heating and cooling functions of the bonding head 1 to meet the temperature requirements of the bonding process. It should be understood that the second functional mechanism 42 is not limited to the above embodiment; it can also integrate other functional modules to precisely control the movement trajectory and spatial position of the bonding head.

[0047] In addition, such as Figure 1 As shown, the first decoupling mechanism 51 is connected to the first functional mechanism 41 via the first adapter 53, and the second decoupling mechanism 52 is connected to the second functional mechanism 42 via the second adapter 54. Thus, the driving force from the drive unit 2 is transmitted sequentially through the first functional mechanism 41, the decoupling unit 5, and the second functional mechanism 42, and finally to the adsorption unit 8, which serves as the end effector.

[0048] In some embodiments of this application, a bonding apparatus is also provided, which includes a bonding head as described in any of the above technical solutions. Since the bonding head in this bonding apparatus has the same technical features as the aforementioned bonding head, both can solve the same technical problem and achieve the same technical effect.

[0049] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0050] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.

Claims

1. A bonding head, characterized in that, include: The drive unit is used to provide driving force; The guiding unit includes a first guiding mechanism and a second guiding mechanism mounted on the same substrate, and functional units are mounted on the first guiding mechanism and the second guiding mechanism. A decoupling unit is disposed between the first guide mechanism and the second guide mechanism. The decoupling unit includes a first decoupling mechanism and a second decoupling mechanism connected sequentially along a first direction. The first decoupling mechanism is closer to the drive unit than the second decoupling mechanism. The first decoupling mechanism is capable of angular deflection, and the second decoupling mechanism is capable of horizontal movement. The first decoupling mechanism is configured to drive the second decoupling mechanism connected to it to move horizontally in sync when an angular deflection occurs; The second decoupling mechanism is configured to move horizontally independently relative to the first decoupling mechanism; The first decoupling mechanism is configured as follows: When the first decoupling mechanism rotates about an axis parallel to the second direction, it drives the second decoupling mechanism to move synchronously along the third direction. When the first decoupling mechanism rotates about an axis parallel to the third direction, the second decoupling mechanism moves synchronously along the second direction; The first direction is a vertical direction; the second direction and the third direction are both horizontal directions and perpendicular to each other.

2. The bonding head according to claim 1, characterized in that, The first decoupling mechanism includes a first connecting block, a second connecting block, and a third connecting block; The first connecting block and the second connecting block are hinged together by a first connecting rod, and the second connecting block and the third connecting block are hinged together by a second connecting rod; The axial ends of the first connecting rod and the second connecting rod pass through the inner ring of the bearing, the outer ring of the bearing is fixed in the second connecting block, and a retaining ring is provided at the end of the outer ring of the bearing.

3. The bonding head according to claim 2, characterized in that, In the first decoupling mechanism The first link and the second link are arranged in a cross shape; The second connecting block is capable of rotating about the axis of the first connecting rod and the axis of the second connecting rod, respectively.

4. The bonding head according to claim 1, characterized in that, The second decoupling mechanism includes a first motion table and a second motion table arranged sequentially along a first direction; The first motion table is configured to move linearly along the second direction; The second motion table is configured to move linearly along a third direction.

5. The bonding head according to claim 1, characterized in that, It also includes a force control unit; The force control unit includes a force sensor and a flexible mechanism; The flexible mechanism includes a first flexible mechanism and a second flexible mechanism, wherein the first flexible mechanism is provided with a through hole for the force sensor to pass through; The force sensor is inserted through the through hole, and the portion of it extending along the axis out of the first flexible mechanism is supported by the third support.

6. The bonding head according to claim 5, characterized in that, Both the first flexible mechanism and the second flexible mechanism are axisymmetric structures; The first flexible mechanism is configured to rotate about an axis parallel to the second direction; The second flexible mechanism is configured to rotate about an axis parallel to a third direction.

7. The bonding head according to any one of claims 5 or 6, characterized in that, It also includes a pre-tightening unit, which includes a screw and a nut sleeved on the screw; One end of the screw is connected to the second support, and the other end is threaded to the first flexible mechanism and in contact with the force sensor to apply a preload to the force sensor.

8. The bonding head according to any one of claims 5 or 6, characterized in that, It also includes a deformation detection unit, which includes a deformation detection sensor and a third adapter; The third adapter is fixedly connected to the second flexible mechanism; The deformation detection sensor detects the displacement of the third adapter relative to a preset reference in a non-contact manner.

9. The bonding head according to claim 8, characterized in that, The deformation detection sensor includes a probe; The third adapter includes a detection surface; The probe detects the displacement of the detection surface relative to a preset reference.

10. The bonding head according to any one of claims 2 or 3, characterized in that, It also includes elastic units; The elastic unit includes a first connector, an elastic element, and a second connector connected in sequence. The first connector is fixedly connected to the first connecting block, and the second connector is fixedly connected to the first support.

11. The bonding head according to claim 1, characterized in that, The first guide mechanism and the second guide mechanism are linear guides or crossed roller guides.

12. The bonding head according to claim 1, characterized in that, The functional unit includes a first functional mechanism and a second functional mechanism; The first functional mechanism is connected to the first guide mechanism and is able to move along the first guide mechanism; The second functional mechanism is connected to the second guide mechanism and can move along the second guide mechanism.

13. A bonding apparatus, characterized in that, include: The bonding head as described in any one of claims 1 to 12 above.

Images