Brain wave measuring device and brain wave measuring method

Abstract

A brain wave measuring device has an electrode unit that acquires a brain wave signal by contacting a measuring site of a subject's head, a support member (20) that supports the electrode unit, and a mounting portion (70) (auxiliary member) that assists the support member (20) in being disposed on the head. The support member (20) has a non-stretchable film member and a fitting portion (25) to which the electrode unit is electrically connected and fixed. The film member has a non-stretchable base material and a circuit pattern provided to the base material, and the circuit pattern is connected to the fitting portion (25).

Description

Technical Field

[0001] This invention relates to a brainwave measurement device and a brainwave measurement method. Background Technology

[0002] Various brainwave measurement devices have been developed for measuring brainwaves. As such a technology, for example, a brainwave measurement device is known to include: a support body, a headband made of shape memory material and worn on the user's head; and a vital sign sensor mounted on the support body to acquire the user's biosignals (see, for example, Patent Document 1). According to the technology of Patent Document 1, when measuring biosignals, the support body can easily be restored to a shape adapted to the user's body shape that has been pre-memorized.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 5900167. Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In brainwave measurement, in order to make multiple electrodes in contact with the head (i.e., the scalp), the number of signal lines connected to these electrodes increases, which risks making the overall device more complex.

[0008] The technology disclosed in Patent Document 1 does not take into account the wiring structure, and a new technology is needed.

[0009] The present invention was made in view of this situation, and its object is to provide a technique for simplifying the wiring structure for connecting electrodes to a brainwave measurement device.

[0010] means for solving problems

[0011] According to the present invention, the following technology is provided.

[0012] (1) A brainwave measuring device, comprising: Electrode units are used to acquire brainwave signals by contacting the measurement sites on the subject's head. Supporting member, supporting the electrode unit; and Auxiliary components, which assist the supporting components in being positioned at the head. The support member has a non-stretchable membrane member and an assembly part for electrically connecting and fixing the electrode unit. The membrane component has a non-stretchable substrate and a circuit pattern disposed on the substrate. The circuit pattern is connected to the assembly part.

[0013] (2) The brainwave measuring device according to (1) further comprises an electromagnetic wave shielding component covering the circuit pattern.

[0014] (3) The brainwave measuring device according to (1) or (2), wherein, The membrane component is elongated. The electrode units are arranged in multiples at predetermined intervals along the length of the membrane component.

[0015] (4) The brainwave measuring device according to any one of (1) to (3), wherein, The electrode unit has a base, a plurality of protrusions disposed on the base, and an electrode portion disposed on the protrusions and in contact with the head.

[0016] (5) The brainwave measuring device according to (4), wherein, The protrusion is an elastic member.

[0017] (6) The brainwave measuring device according to any one of (1) to (5), wherein, The auxiliary component is disposed at the end of the support component and installed on the ear or jaw, assisting the support component in being configured according to the shape of the head.

[0018] (7) The brainwave measuring device according to any one of (1) to (6), wherein, The auxiliary component has a spring-like structure.

[0019] (8) The brainwave measuring device 10 according to any one of (1) to (7), wherein, The auxiliary component has a length adjustment component.

[0020] (9) The brainwave measuring device 10 according to any one of (1) to (8), wherein, With the installation position of the electrode unit as the vertex, the support member bends at the vertex and connects the vertices to each other in a straight line.

[0021] (10) A method for measuring brain waves, wherein the brain wave measuring device described in any one of (1) to (9) is worn on the head of a subject to measure brain waves.

[0022] The effects of the invention

[0023] According to the present invention, a technique is provided that simplifies the wiring structure for connecting electrodes to a brainwave measurement device. Attached Figure Description

[0024] Figure 1 This is a schematic diagram illustrating the state in which a brainwave measuring device is worn on the head according to the embodiment.

[0025] Figure 2 This is a diagram showing the support member and mounting part (auxiliary member) of the support electrode unit according to the embodiment.

[0026] Figure 3 It is a diagram showing the circuit pattern of the support member involved in the implementation method.

[0027] Figure 4 This is a cross-sectional view of the electrode unit assembled on the support member according to the embodiment.

[0028] Figure 5 This is a cross-sectional view of an electrode unit assembled on a support member, according to a variation of the embodiment.

[0029] Figure 6 This is a cross-sectional view of the support member involved in the implementation method.

[0030] Figure 7 This is a schematic diagram illustrating the tension display unit involved in the embodiment.

[0031] Figure 8 This is a diagram illustrating and explaining the force acting on the head when wearing an EEG measuring device, as described in the implementation method.

[0032] Figure 9 This is a diagram illustrating the winch principle (equation) used for modeling in the implementation method.

[0033] Figure 10 This is a graph showing the theoretical (calculated) and measured values ​​of the electrode pressing pressure F involved in the embodiments. Detailed Implementation

[0034] Hereinafter, embodiments of the present invention will be described using the accompanying drawings. In this embodiment, a brainwave measurement device having electrode units and worn on the head of a subject to acquire brainwaves, and a brainwave measurement method using the brainwave measurement device will be described.

[0035] <Brief Structure of Brainwave Measurement Device>

[0036] Figure 1 This is a schematic diagram showing the state of a person's head 99 wearing a brainwave measuring device 10, viewed from the front. Figure 2 This diagram shows the support member 20 and the mounting part 70 (auxiliary member) of the supporting electrode unit 30. In this embodiment, an EEG measuring device 10 for measuring EEG at electrode positions Cz, C3, C4, T3, T4 (international 10-20 method) is shown. Figure 3 This is a diagram showing the circuit pattern 22 of the supporting member 20. Figure 4 This is a cross-sectional view of the electrode unit 30 assembled on the support member 20.

[0037] The brainwave measuring device 10 is worn on a person's head 99 and detects brainwaves as potential changes from a biological source, and outputs the detected brainwaves to a brainwave display device (not shown). The brainwave display device acquires the brainwaves detected by the brainwave measuring device 10 and displays them on a monitor, or saves the data, or performs known brainwave analysis processing (measuring processing).

[0038] The brainwave measurement device 10 includes: a plurality of electrode units 30 that contact the measurement site (i.e., the head 99) of the subject and acquire brainwaves as biosignals; a support member 20 having a non-stretchable membrane member (also referred to as a strip-shaped member or a band-shaped member) for mounting and supporting the electrode units 30; and a mounting part 70 for fixing the support member 20 to the head 99. In this embodiment, the mounting part 70 is worn on the subject's ear, thereby functioning as an auxiliary member for fixing the brainwave measurement device 10 to the head 99. The mounting part 70 has a tension display part 60. The tension display part 60 displays the tension acting on the support member 20 in a recognizable manner. The non-stretchability of the membrane member is defined by the condition that the Poisson's ratio is within a specified range, as described later.

[0039] The support member 20 (membrane member) has a circuit pattern 22 and an assembly portion 25. The assembly portion 25 provides an electrical connection and fixation for the electrode unit 30. The circuit pattern 22 is connected to the electrode unit 30 and external brainwave display devices via the assembly portion 25. By adopting this structure, the wiring structure of the brainwave measuring device 10 becomes neat. To achieve this structure, a flexible circuit (also called a flexible substrate) is used as the support member 20.

[0040] The support member 20 is configured to be flexible to a certain extent, at least in the thickness direction. Furthermore, no member (such as a rigid member like a helmet) is provided that is pre-shaped by surrounding the support member 20. The support member 20, etc., is flexible enough to remain flat without requiring external force when not worn on the head 99, and its shape changes primarily with the shape of the head 99 when worn on the head 99 due to gravity. In this embodiment, the support member 20 is bent at the position of the electrode unit 30 (mounting part 25) so that the electrode unit 30 (mounting part 25) serves as a vertex, and the edges connecting the vertices form a polygon (or polygonal line) that serves as the support member 20. Since the two ends of the electrode unit 30 may sometimes float off the head 99 due to the influence of hair, etc., the mounting part 70 is used to assist in following the shape of the head 99.

[0041] The support member 20 has a concave snap 25a made of a good conductor metal as an assembly part 25. The electrode unit 30 is fixed to the support member 20 by fitting the convex snap 35 of the electrode unit 30 into the concave snap 25a. The concave snap 25a has sufficient strength to stably fix the electrode unit 30. This strength is appropriately adjusted according to the force acting on the electrode unit 30. Furthermore, because the concave snap 25a is made of a good conductor metal, when the convex snap 35 of the electrode unit 30 is fitted into the concave snap 25a, the electrode unit 30 is electrically connected to the circuit pattern 22 via the concave snap 25a.

[0042] Furthermore, in the support member 20, the position where the concave snap 25a is provided in the left-right direction coincides with the bend 27 of the support member 20. Due to the presence of the bend 27, the extension direction of the support member 20 between the electrode units 30 can be made straight. Additionally, because of the concave snap 25a, the bend 27 may sometimes be in a state of incomplete bending, but rather a deformation including bending or other deformations with a certain width. Even in this case, as long as the deformation is sufficient to apply the winch principle (winch equation) described later, it is acceptable. This can be appropriately adjusted according to the thickness of the concave snap 25a or the substrate 21. Furthermore, when the support member 20 is sufficiently thin, even without the bend 27, as long as the deformation is sufficient to apply the winch principle (winch equation), the bend 27 can be omitted.

[0043] The mounting section 70 has an ear-wearing section 40, an adjustment section 50, and a tension display section 60, which are connected by non-extending components (here, ropes 45 and 55).

[0044] When the brainwave measuring device 10 is worn on the head 99, the electrode units 30 are positioned approximately at the vertices of the polygon, and the electrode units 30 are arranged in a shape spanned by the support member 20. That is, the support member 20 bends precisely at the portion where the electrode units 30 are mounted (bend 27). The bend 27 corresponds to the position of the vertex of the polygon. The force acting on the head 99 (the pressure F applied to the electrodes on the head) is calculated using the winch principle (winch equation) modeled using this polygon. This will be explained later.

[0045] The following is a detailed explanation of each component.

[0046] <Electrode Unit>

[0047] Electrode unit 30 is detachably installed only at the locations required for brainwave measurement. The installation positions of electrode unit 30 correspond, for example, to the positions T3, C3, C2, C4, and T4 in the International Electrode Configuration Method 10-20. Figure 1 As shown, the configuration is symmetrical when viewed from the front.

[0048] For example, such as Figure 4 As shown, the electrode unit 30 is configured as a so-called button-type electrode. Specifically, the electrode unit 30 has a cylindrical base 31, a protrusion 32 integrally formed with one end of the base 31 (here, the lower surface 36 of the base), a conductive contact portion 33 (electrode), a signal line portion 34, and a convex snap 35 provided at the other end of the base 31 (here, the upper surface 37 of the base). For convenience, the base 31 and the protrusion 32 will be referred to as the electrode body 39 below. The convex snap 35 is detachably mounted on a concave snap 25a provided at a predetermined position on the support member 20.

[0049] The electrode unit 30 can be entirely made of conductive metal, or it can be configured with a rubber-like elastic member as the base and conductive members disposed on the surface. The following example illustrates a configuration with a rubber-like elastic member as the base.

[0050] The detailed structure and materials of the electrode unit 30 are described below. The electrode unit 30 of this embodiment is an electrode (dry electrode) that does not use a so-called brainwave electrode paste to ensure conductivity. However, it is also possible to form a gel at the tip of the dry electrode (the tip of the protrusion 32) and immerse it in a wetting liquid or the like to ensure moisture. Furthermore, it is also possible to use a method where the tip of the dry electrode is moistened with a conductive auxiliary liquid made by mixing a small amount of electrolyte such as salt with a low-viscosity liquid such as lotion, without using paste or grease. That is, the dry electrode of this embodiment is not limited to being completely dry, but refers to not using auxiliary agents such as paste that would leave obvious stains.

[0051] The electrode body 39 is integrally formed from a rubber-like elastic member. The specific material of the elastic member will be explained later. In addition, the electrode body 39 (i.e., the base 31 and the protrusion 32) is not limited to being integrally formed, but may also be formed by assembling separate electrode bodies 39 using adhesives or interlocking structures.

[0052] <Shape of the base and protrusions>

[0053] The base 31 is generally cylindrical. On the circular lower surface 36 of the base 31 (shown as the lower side in the illustration), a plurality of generally conical protrusions 32 protruding downwards are provided. Furthermore, the base 31 can be cylindrical, and its cross-section can be circular, polygonal, or other shapes. Moreover, the shape of the protrusions 32 is not limited to a conical shape; various shapes such as triangular pyramids, isogonal pyramids, or cylinders can be used.

[0054] A conductive contact portion 33 is provided on at least the front end side surface of the protrusion 32. Alternatively, the conductive contact portion 33 may be provided on the entire surface of the protrusion 32. The conductive contact portion 33 is formed in the form of a thin film, and when the conductive contact portion 33 is provided on the protrusion 32, it can be regarded as having a shape that is substantially the same as the shape of the protrusion 32 alone.

[0055] The outer diameter of the base 31 is, for example, 10 mm to 50 mm. The height (thickness) of the base 31 is, for example, 0.1 mm to 30 mm. The height of the protrusion 32 is, for example, 1 mm to 20 mm. The width of the protrusion 32 (outer diameter of the root portion) is, for example, 1 mm to 10 mm.

[0056] <Material of the electrode body (base and protrusions)>

[0057] The material of the electrode body 39 will be described. As described above, the electrode body 39 can be made of a rubber-like elastomer. Specifically, the rubber-like elastomer is rubber or a thermoplastic elastomer (also simply referred to as "elastomer (TPE)"). For example, silicone rubber is a rubber. For example, styrene-based TPE (TPS), olefin-based TPE (TPO), vinyl chloride-based TPE (TPVC), polyurethane-based TPE (TPU), ester-based TPE (TPEE), amide-based TPE (TPAE), etc.

[0058] When the material of the electrode body 39 is silicone rubber, the hardness of the A-type hardness tester on the surface of the electrode body 39, measured at 37°C in accordance with JIS K 6253 (1997), is set as the rubber hardness A. For example, the rubber hardness A is 15 or more and 55 or less.

[0059] Here, the above-mentioned silicone rubber-based curable composition will be described.

[0060] The aforementioned silicone rubber can be composed of a cured product of a silicone rubber-based curable resin composition. The curing process of the silicone rubber-based curable resin composition is performed, for example, by heating at 100–250°C for 1–30 minutes (first curing) followed by post-baking at 100–200°C for 1–4 hours (secondary curing).

[0061] Insulating silicone rubber is silicone rubber without conductive fillers, while conductive silicone rubber is silicone rubber with conductive fillers.

[0062] The silicone rubber-based curable composition according to this embodiment may contain a vinyl-containing organopolysiloxane (A). The vinyl-containing organopolysiloxane (A) is a polymer that is the main component of the silicone rubber-based curable composition of this embodiment.

[0063] Insulating silicone rubber-based curable compositions and conductive silicone rubber-based curable compositions may contain the same type of vinyl-containing linear organopolysiloxanes. The same type of vinyl-containing linear organopolysiloxanes are acceptable as long as they contain at least the same vinyl groups and are linear in shape; the amount of vinyl groups in the molecule, the molecular weight distribution, or the amount added may differ.

[0064] In addition, the insulating silicone rubber-based curable compositions and the conductive silicone rubber-based curable compositions may also contain different vinyl-containing organopolysiloxanes.

[0065] The aforementioned vinyl-containing organopolysiloxane (A) can contain vinyl-containing linear organopolysiloxane (A1) having a linear structure.

[0066] The aforementioned vinyl-containing linear organopolysiloxane (A1) has a linear structure and contains vinyl groups, which become crosslinking points during curing.

[0067] The vinyl content of the vinyl-containing linear organopolysiloxane (A1) is not particularly limited. For example, it is preferable to have two or more vinyl groups within the molecule and to be 15 mol% or less, more preferably 0.01 to 12 mol%. This optimizes the amount of vinyl in the vinyl-containing linear organopolysiloxane (A1), enabling reliable formation of a network with the components described later. Furthermore, in this embodiment, "~" indicates a value including both ends.

[0068] In addition, in this specification, vinyl content refers to the molar percentage of vinyl-containing siloxane units when all units constituting the vinyl-containing linear organopolysiloxane (A1) are set to 100 mol%. Here, it is considered that one vinyl unit is equivalent to one vinyl-containing siloxane unit.

[0069] Furthermore, the degree of polymerization of the vinyl linear organopolysiloxane (A1) is not particularly limited, and is preferably in the range of about 1,000 to 10,000, more preferably about 2,000 to 5,000. Additionally, the degree of polymerization can be determined, for example, as the number-average degree of polymerization (or number-average molecular weight) of polystyrene in GPC (gel permeation chromatography) using chloroform as the developing solvent.

[0070] Furthermore, the specific gravity of the vinyl linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

[0071] As a vinyl-containing linear organopolysiloxane (A1), by using a vinyl-containing linear organopolysiloxane having a degree of polymerization and specific gravity within the range described above, it is possible to improve the heat resistance, flame retardancy, chemical stability, etc. of the obtained silicone rubber.

[0072] As a vinyl-containing linear organopolysiloxane (A1), it is particularly preferred to have the structure represented by the following formula (1).

[0073]

[0074] In equation (1), R 1 It is a hydrocarbon group obtained by substituted or unsubstituted alkyl, alkenyl, aryl, or combinations thereof, having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, and propyl, with methyl being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl, allyl, and butenyl, with vinyl being preferred. Examples of aryl groups having 1 to 10 carbon atoms include phenyl.

[0075] Furthermore, R 2 It is a hydrocarbon group obtained by substituted or unsubstituted alkyl, alkenyl, aryl, or combinations thereof, having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, and propyl, with methyl being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl, allyl, and butenyl. Examples of aryl groups having 1 to 10 carbon atoms include phenyl.

[0076] Furthermore, R 3 It is a substituted or unsubstituted alkyl, aryl, or hydrocarbon group obtained by combination thereof having 1 to 8 carbon atoms. Examples of alkyl groups having 1 to 8 carbon atoms include methyl, ethyl, propyl, etc., with methyl being preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl.

[0077] Moreover, R in equation (1) 1 and R 2 Substituents, such as methyl, vinyl, etc., can be used as R. 3 Substituents, such as methyl groups, can be used.

[0078] In addition, in equation (1), multiple R 1 They are independent of each other; they can be different from each other or the same as each other. Furthermore, regarding R... 2 and R 3 Same here.

[0079] Furthermore, m and n are the number of repeating units containing vinyl linear organopolysiloxane (Al) represented by formula (1), where m is an integer from 0 to 2000 and n is an integer from 1000 to 10000. m is preferably 0 to 1000 and n is preferably 2000 to 5000.

[0080] Furthermore, as a specific structure of vinyl-containing linear organopolysiloxane (A1) represented by formula (1), the structure represented by the following formula (1-1) can be cited as an example.

[0081]

[0082] In equation (1-1), R 1 and R 2 Each is independently methyl or vinyl, with at least one being vinyl.

[0083] Furthermore, the vinyl-containing linear organopolysiloxane (A1) preferably contains: a first vinyl-containing linear organopolysiloxane (A1-1) having two or more vinyl groups within the molecule and a vinyl content of 0.4 mol% or less; and a second vinyl-containing linear organopolysiloxane (A1-2) having a vinyl content of 0.5 to 15 mol%. As a raw material for silicone rubber, namely raw rubber, by combining the first vinyl-containing linear organopolysiloxane (A1-1) with a general vinyl content and the second vinyl-containing linear organopolysiloxane (A1-2) with a high vinyl content, uneven distribution of vinyl groups can be achieved, enabling more effective formation of varying crosslinking densities within the crosslinking network of the silicone rubber. As a result, the tear strength of the silicone rubber can be improved more effectively.

[0084] Specifically, as a vinyl-containing linear organopolysiloxane (A1), it is preferred to use, for example, R having two or more of the above formula (1-1) in the molecule. 1 For vinyl units and / or R 2 A first vinyl-containing linear organopolysiloxane (A1-1) containing 0.4 mol% or less of the vinyl unit; and R containing 0.5 to 15 mol% of the vinyl unit. 1 For vinyl units and / or R 2 The second vinyl-containing linear organopolysiloxane (A1-2) is a vinyl unit.

[0085] Furthermore, the vinyl content of the first vinyl-containing linear organopolysiloxane (A1-1) is preferably 0.01 to 0.2 mol%. Furthermore, the vinyl content of the second vinyl-containing linear organopolysiloxane (A1-2) is preferably 0.8 to 12 mol%.

[0086] Furthermore, when a first vinyl-containing linear organopolysiloxane (A1-1) and a second vinyl-containing linear organopolysiloxane (A1-2) are incorporated in combination, the ratio of (A1-1) to (A1-2) is not particularly limited. For example, the weight ratio of (A1-1) to (A1-2) is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.

[0087] In addition, the first vinyl-containing linear organopolysiloxane (A1-1) and the second vinyl-containing linear organopolysiloxane (A1-2) may be used individually or in combination with more than one.

[0088] Furthermore, the vinyl-containing organopolysiloxane (A) may include a vinyl-containing branched organopolysiloxane (A2) having a branched structure.

[0089] <<Organohydrogen polysiloxane (B)>>

[0090] The silicone rubber-based curable composition of this embodiment may contain a crosslinking agent. The crosslinking agent may contain organohydrogen polysiloxane (B).

[0091] Organohydrogen polysiloxanes (B) are classified as linear organohydrogen polysiloxanes (B1) with a linear structure and branched organohydrogen polysiloxanes (B2) with a branched structure, and can contain either or both of these.

[0092] Insulating silicone rubber-based curable compositions and conductive silicone rubber-based curable compositions may contain the same type of crosslinking agent. The same type of crosslinking agent only needs to have a common structure, such as a linear or branched chain structure; the molecular weight distribution, functional groups, and amount added may differ.

[0093] In addition, the insulating silicone rubber-based curable compositions and the conductive silicone rubber-based curable compositions may also contain crosslinking agents that are different from each other.

[0094] Linear organohydrogen polysiloxane (B1) is a polymer with a linear structure and a structure in which hydrogen and Si are directly bonded (≡Si-H). In addition to undergoing hydrosilylation reaction with vinyl groups containing vinyl organosiloxane (A), it also undergoes hydrosilylation reaction with vinyl groups of components incorporated into silicone rubber-based curable compositions, thereby crosslinking these components.

[0095] The molecular weight of linear organohydrogen polysiloxane (B1) is not particularly limited, but preferably the weight average molecular weight is 20,000 or less, more preferably 1,000 or more and 10,000 or less.

[0096] In addition, the weight-average molecular weight of linear organohydrogen polysiloxanes (B1) can be determined, for example, by conversion to polystyrene in GPC (gel permeation chromatography) with chloroform as the developing solvent.

[0097] Furthermore, linear organohydrogen polysiloxanes (B1) are generally preferably free of vinyl groups. This reliably prevents intramolecular crosslinking reactions within the linear organohydrogen polysiloxane (B1).

[0098] As the linear organohydrogen polysiloxane (B1) as described above, for example, a linear organohydrogen polysiloxane having the structure represented by the following formula (2) may be preferred.

[0099]

[0100] In equation (2), R 4 It is a substituted or unsubstituted alkyl, alkenyl, aryl, or hydrocarbon group or hydride group obtained by combining them, having 1 to 10 carbon atoms. Examples of alkyl groups with 1 to 10 carbon atoms include methyl, ethyl, and propyl, with methyl being preferred. Examples of alkenyl groups with 1 to 10 carbon atoms include vinyl, allyl, and butenyl. Examples of aryl groups with 1 to 10 carbon atoms include phenyl.

[0101] Furthermore, R 5 It is a substituted or unsubstituted alkyl, alkenyl, aryl, or hydrocarbon or hydride group composed of the same or combined groups having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, and propyl, with methyl being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl, allyl, and butenyl. Examples of aryl groups having 1 to 10 carbon atoms include phenyl.

[0102] In addition, in equation (2), multiple R 4 They are independent of each other; they can be different from each other or the same as each other. (Regarding R) 5 The same applies. Among them, multiple R... 4 and R 5 At least two of them are hydride groups.

[0103] Furthermore, R 6 It is a substituted or unsubstituted alkyl, aryl, or hydrocarbon group composed of these, having 1 to 8 carbon atoms. Examples of alkyl groups having 1 to 8 carbon atoms include methyl, ethyl, and propyl, with methyl being preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl. Multiple R 6 They are independent of each other; they can be different from each other, or they can be the same as each other.

[0104] In addition, R in equation (2) 4 R 5 R 6 Substituents, such as methyl and vinyl groups, are preferred from the viewpoint of preventing intramolecular cross-linking reactions.

[0105] Furthermore, m and n are the number of repeating units in the linear organohydrogen polysiloxane (B1) represented by formula (2), where m is an integer from 2 to 150 and n is an integer from 2 to 150. Preferably, m is an integer from 2 to 100 and n is an integer from 2 to 100.

[0106] In addition, linear organohydrogen polysiloxanes (B1) can be used alone or in combination of two or more.

[0107] Branched organohydrogen polysiloxane (B2), due to its branched structure, forms regions with high crosslinking density, significantly contributing to the formation of a dense-sparse crosslinking structure in silicone rubber systems. Furthermore, similar to the linear organohydrogen polysiloxane (B1), it is a polymer with a structure where hydrogen and Si are directly bonded (≡Si-H). Besides undergoing hydrosilylation with the vinyl groups of the vinyl-containing organohydrogen polysiloxane (A), it also undergoes hydrosilylation with the vinyl groups of components incorporated into the silicone rubber curing composition, thus crosslinking these components.

[0108] Furthermore, the specific gravity of the branched organohydrogen polysiloxane (B2) is in the range of 0.9 to 0.95.

[0109] Furthermore, branched organohydrogen polysiloxanes (B2) are generally preferably free of vinyl groups. This reliably prevents intramolecular crosslinking reactions within the branched organohydrogen polysiloxane (B2).

[0110] Furthermore, as a branched organohydrogen polysiloxane (B2), a compound represented by the following average composition formula (c) is preferred.

[0111] Average composition formula (c)

[0112] (H) a (R) 7 ) 3-a SiO 1 / 2 ) m (SiO) 4 / 2 ) n

[0113] (In equation (c), R) 7 It is a monovalent organic group, where a is an integer in the range of 1 to 3, and m is a hydrogen atom. a (R) 7 ) 3-a SiO 1 / 2 The number of units, n is the number of SiO units. 4 / 2 (Number of units)

[0114] In equation (c), R 7It is a monovalent organic group, preferably a substituted or unsubstituted alkyl, aryl, or hydrocarbon group composed of the same or combined thereof, having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, and propyl, with methyl being preferred. Examples of aryl groups having 1 to 10 carbon atoms include phenyl.

[0115] In formula (c), a is the number of hydride groups (directly bonded to hydrogen atoms of Si), which is an integer in the range of 1 to 3, preferably 1.

[0116] Furthermore, in equation (c), m is H a (R) 7 ) 3-a SiO 1 / 2 The number of units, n is the number of SiO units. 4 / 2 The number of units.

[0117] Branched organohydrogen polysiloxanes (B2) have a branched structure. Straight-chain organohydrogen polysiloxanes (B1) and branched organohydrogen polysiloxanes (B2) differ in whether their structures are straight-chain or branched. When the number of Si atoms is set to 1, the ratio of alkyl R atoms bonded to Si (R / Si) is 1.8–2.1 in straight-chain organohydrogen polysiloxanes (B1) and 0.8–1.7 in branched organohydrogen polysiloxanes (B2).

[0118] Furthermore, branched organohydrogen polysiloxanes (B2) have a branched structure, so when heated to 1000°C at a heating rate of 10°C / min under nitrogen conditions, for example, the residue amount is more than 5%. In contrast, linear organohydrogen polysiloxanes (B1) are linear, so the residue amount after heating under the above conditions is almost zero.

[0119] Furthermore, as a specific example of branched organohydrogen polysiloxane (B2), a branched organohydrogen polysiloxane having the structure represented by the following formula (3) can be cited.

[0120]

[0121] In equation (3), R 7 It is a substituted or unsubstituted alkyl group, aryl group, or a hydrocarbon group or hydrogen atom obtained by combining them, having 1 to 8 carbon atoms. Examples of alkyl groups having 1 to 8 carbon atoms include methyl, ethyl, propyl, etc., with methyl being preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl. As R 7 Substituents, such as methyl groups, can be used.

[0122] In addition, in equation (3), multiple R 7 They are independent of each other; they can be different from each other, or they can be the same as each other.

[0123] Furthermore, in equation (3), "-O-Si≡" indicates that Si has a three-dimensional extended branched structure.

[0124] In addition, branched organohydrogen polysiloxanes (B2) can be used alone or in combination of two or more.

[0125] Furthermore, the amount of hydrogen atoms (hydride groups) directly bonded to Si in both the linear organohydrogen polysiloxane (B1) and the branched organohydrogen polysiloxane (B2) is not particularly limited. Specifically, in the silicone rubber-based curable composition, the total content of hydride groups in the linear organohydrogen polysiloxane (B1) and the branched organohydrogen polysiloxane (B2) is preferably 0.5 to 5 moles, more preferably 1 to 3.5 moles, relative to 1 mole of vinyl in the vinyl-containing linear organohydrogen polysiloxane (A1). This allows for the reliable formation of a crosslinking network between the linear organohydrogen polysiloxane (B1) and the branched organohydrogen polysiloxane (B2) and the vinyl-containing linear organohydrogen polysiloxane (A1).

[0126] <<Silica Particles (C)>>

[0127] The silicone rubber-based curable composition according to this embodiment includes a non-conductive filler. The non-conductive filler may include silica particles (C) as needed. This allows for improvements in the hardness and mechanical strength of the elastomer.

[0128] Insulating silicone rubber-based curable compositions and conductive silicone rubber-based curable compositions may contain the same type of non-conductive filler. The same type of non-conductive filler only needs to have at least common constituent materials; however, the particle size, specific surface area, surface treatment agent, or its amount may differ.

[0129] In addition, the insulating silicone rubber-based curable compositions and the conductive silicone rubber-based curable compositions may also contain different silane coupling agents.

[0130] There are no particular limitations on the silica particles (C). For example, silica can be produced by pyrolysis, calcination, or precipitation. These methods can be used individually or in combination of two or more.

[0131] The specific surface area of ​​silica particles (C), for example, based on the BET method, is preferably 50 to 400 m². 2 / g, more preferably 100-400m 2 / g. Furthermore, the average primary particle size of the silica particles (C) is preferably 1 to 100 nm, more preferably about 5 to 20 nm.

[0132] Using silica particles (C) within the range of specific surface area and average particle size can improve the hardness or mechanical strength of the formed silicone rubber, especially the tensile strength.

[0133] <<Silane Coupling Agent (D)>>

[0134] The silicone rubber-based curable composition of this embodiment may contain a silane coupling agent (D).

[0135] The silane coupling agent (D) can have hydrolyzable groups. The hydrolyzable groups are hydrolyzed by water to become hydroxyl groups, which undergo a dehydration condensation reaction with the hydroxyl groups on the surface of silica particles (C), thereby enabling surface modification of silica particles (C).

[0136] Insulating silicone rubber-based curable compositions and conductive silicone rubber-based curable compositions may contain the same type of silane coupling agent. The same type of silane coupling agent only needs to have at least a common functional group; other functional groups in the molecule or the amount added may differ.

[0137] In addition, the insulating silicone rubber-based curable compositions and the conductive silicone rubber-based curable compositions may also contain different silane coupling agents.

[0138] Furthermore, the silane coupling agent (D) can contain silane coupling agents with hydrophobic groups. It is hypothesized that, by imparting these hydrophobic groups to the surface of the silica particles (C), the cohesiveness of the silica particles (C) in the silicone rubber-based curable composition, and even in silicone rubber itself, decreases (less cohesion due to hydrogen bonding based on silanol groups), resulting in improved dispersibility of the silica particles (C) in the silicone rubber-based curable composition. Consequently, the interface between the silica particles (C) and the rubber matrix increases, and the reinforcing effect of the silica particles (C) is enhanced. Moreover, it is hypothesized that the slippage of the silica particles (C) within the matrix is ​​improved during rubber matrix deformation. Furthermore, through the improved dispersibility and slippage of the silica particles (C), the mechanical strength (e.g., tensile strength or tear strength) of the silicone rubber based on silica particles (C) is improved.

[0139] Furthermore, the silane coupling agent (D) can contain a silane coupling agent having vinyl groups. This introduces vinyl groups onto the surface of the silica particles (C). Therefore, during the curing of the silicone rubber-based curable composition, when the vinyl groups of the vinyl-containing organopolysiloxane (A) undergo a hydrosilylation reaction with the hydride groups of the organohydrogen polysiloxane (B) to form a network (crosslinked structure), the vinyl groups of the silica particles (C) also participate in the hydrosilylation reaction with the hydride groups of the organohydrogen polysiloxane (B), thus incorporating the silica particles (C) into the network. This enables the formation of a silicone rubber with low hardness and high modularity.

[0140] As a silane coupling agent (D), it can be used in combination with silane coupling agents having hydrophobic groups and silane coupling agents having vinyl groups.

[0141] As a silane coupling agent (D), for example, the silane coupling agent represented by the following formula (4) can be cited.

[0142] Y n -Si-(X) 4-n ... (4)

[0143] In the above formula (4), n represents an integer from 1 to 3. Y represents any one of the functional groups having a hydrophobic group, a hydrophilic group, or a vinyl group. When n is 1, it is a hydrophobic group. When n is 2 or 3, at least one of them is a hydrophobic group. X represents a hydrolytic group.

[0144] The hydrophobic group is an alkyl group, an aryl group, or a hydrocarbon group obtained by combining them with 1 to 6 carbon atoms, such as methyl, ethyl, propyl, phenyl, etc., with methyl being particularly preferred.

[0145] Furthermore, examples of hydrophilic groups include hydroxyl, sulfonic acid, carboxyl, or carbonyl groups, with hydroxyl being particularly preferred. Additionally, while hydrophilic groups can be included as functional groups, from the viewpoint of imparting hydrophobicity to the silane coupling agent (D), it is preferable that no hydrophilic groups are included.

[0146] Furthermore, examples of hydrolyzable groups include alkoxy groups such as methoxy and ethoxy groups, chloro groups, or silazane groups. Among these, silazane groups are preferred due to their high reactivity with silica particles (C). Additionally, silane coupling agents with silazane groups as hydrolyzable groups possess two of the (Y) groups in formula (4) above due to their structural characteristics. n The structure of -Si-).

[0147] The specific example of the silane coupling agent (D) represented by the above formula (4) is as follows.

[0148] Examples of silane coupling agents having hydrophobic groups as the aforementioned functional groups include alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, and decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, and phenyltrichlorosilane; and hexamethyldisilazane. Preferably, a silane coupling agent containing one or more of the groups selected from hexamethyldisilazane, trimethylchlorosilane, trimethylmethoxysilane, and trimethylethoxysilane, and having a trimethylsilyl group is preferred.

[0149] Regarding silane coupling agents having vinyl groups as the aforementioned functional groups, examples include alkoxysilanes such as methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxysilane; chlorosilanes such as vinyltrichlorosilane and vinylmethyldichlorosilane; and divinyltetramethyldisilazane. Preferably, a silane coupling agent containing one or more of the groups selected from methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, divinyltetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxysilane, and having a vinyl organosilicon alkyl group, is preferred.

[0150] Furthermore, when the silane coupling agent (D) includes both a silane coupling agent having a trimethylsilyl group and a silane coupling agent having a vinyl organosilayl group, hexamethyldisilazane is preferably included as a silane coupling agent having a hydrophobic group, and divinyltetramethyldisilazane is preferably included as a vinyl silane coupling agent.

[0151] When using a silane coupling agent (D1) containing trimethylsilyl groups and a silane coupling agent (D2) containing vinyl organosilanes, the ratio of (D1) to (D2) is not particularly limited. For example, by weight, the ratio of (D1):(D2) is 1:0.001 to 1:0.35, preferably 1:0.01 to 1:0.20, and more preferably 1:0.03 to 1:0.15. By setting this range, the desired physical properties of the silicone rubber can be obtained. Specifically, a balance can be achieved between the dispersion of silica in the rubber and the crosslinking properties of the rubber.

[0152] In this embodiment, the lower limit of the content of silane coupling agent (D) relative to 100 parts by weight of the total amount of vinyl organopolysiloxane (A) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more. Furthermore, the upper limit of the content of silane coupling agent (D) relative to 100 parts by weight of the total amount of vinyl organopolysiloxane (A) is preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 40% by mass or less.

[0153] By setting the content of silane coupling agent (D) to the lower limit or above mentioned above, the adhesion between the columnar portion containing the elastomer and the conductive resin layer can be improved. Furthermore, this helps to improve the mechanical strength of the silicone rubber. Conversely, by setting the content of silane coupling agent (D) to the upper limit or below mentioned above, the silicone rubber can possess appropriate mechanical properties.

[0154] <<Platinum or platinum compounds (E)>>

[0155] The silicone rubber-based curable composition described in this embodiment may contain a catalyst. The catalyst may contain platinum or a platinum compound (E). The platinum or platinum compound (E) is a catalyst component that functions as a catalyst during curing. The amount of platinum or platinum compound (E) added is the catalyst amount.

[0156] Insulating silicone rubber-based curable compositions and conductive silicone rubber-based curable compositions may contain the same type of catalyst. The same type of catalyst only needs to have at least common constituent materials; different components may be included in the catalyst, and their amounts may also vary.

[0157] In addition, the insulating silicone rubber-based curable compositions and the conductive silicone rubber-based curable compositions may contain different catalysts.

[0158] As platinum or a platinum compound (E), known platinum or platinum compounds can be used, such as platinum black, platinum compounds in which platinum is supported on silica or carbon black, chloroplatinic acid or an alcoholic solution of chloroplatinic acid, complex salts of chloroplatinic acid and olefins, complex salts of chloroplatinic acid and vinylsiloxanes, etc.

[0159] In addition, platinum or platinum compounds (E) can be used alone or in combination of two or more.

[0160] In this embodiment, the content of platinum or platinum compound (E) in the silicone rubber-based curable composition refers to the amount of catalyst, which can be appropriately set. Specifically, relative to 100 parts by weight of the total amount of vinyl organopolysiloxane (A), silica particles (C), and silane coupling agent (D), the content of platinum group metals by weight is 0.01 to 1000 ppm, preferably 0.1 to 500 ppm.

[0161] By setting the content of platinum or platinum compound (E) above the aforementioned lower limit, the silicone rubber-based curable composition can cure at an appropriate rate. Furthermore, by setting the content of platinum or platinum compound (E) below the aforementioned upper limit, manufacturing costs can be reduced.

[0162] <<Water (F)>>

[0163] Furthermore, in the silicone rubber curable composition described in this embodiment, in addition to the components (A) to (E) mentioned above, water (F) may also be included.

[0164] Water (F) acts as a dispersion medium to disperse the various components contained in the silicone rubber curing composition and facilitates the reaction between silica particles (C) and silane coupling agent (D). Therefore, in silicone rubber, silica particles (C) and silane coupling agent (D) can be more reliably linked together, thereby achieving overall uniform properties.

[0165] (Other ingredients)

[0166] Furthermore, the silicone rubber-based curable composition of this embodiment may contain other components besides those described in (A) to (F). Examples of such other components include inorganic fillers other than silica particles (C), such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica, as well as additives such as reaction inhibitors, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, and thermal conductivity improvers.

[0167] The conductive solution (conductive silicone rubber composition) involved in this embodiment includes, in addition to the aforementioned silicone rubber-based curable composition that does not contain conductive fillers, the aforementioned conductive fillers and solvents.

[0168] As the solvents mentioned above, various known solvents can be used, such as those containing high-boiling-point solvents. These can be used alone or in combination of two or more.

[0169] Examples of the solvents mentioned above include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane, and tetradecane; aromatic hydrocarbons such as benzene, toluene, ethylbenzene, xylene, trifluoromethylbenzene, and benzotrifluoride; ethers such as diethyl ether, diisopropyl ether, dibutyl ether, cyclopentylmethyl ether, cyclopentylethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3-dioxane, and tetrahydrofuran; haloalkanes such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, and 1,1,2-trichloroethane; carboxylic amides such as N,N-dimethylformamide and N,N-dimethylacetamide; and sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide. These can be used individually or in combination of two or more.

[0170] The aforementioned conductive solution can be adjusted to achieve a viscosity suitable for various coating methods such as spraying or dip coating by adjusting the amount of solid components in the solution.

[0171] Furthermore, when the conductive solution contains the conductive filler and the silica particles (C), the lower limit of the silica particle (C) content in the electrode body 39 relative to 100% by mass of the total silica particles (C) and conductive filler can be set to, for example, 1% by mass or more, preferably 3% by mass or more, and more preferably 5% by mass or more. This improves the mechanical strength of the electrode body 39. On the other hand, the upper limit of the silica particle (C) content in the electrode body 39 relative to 100% by mass of the total silica particles (C) and conductive filler is, for example, 20% by mass or less, preferably 15% by mass or less, and more preferably 10% by mass or less. This achieves a balance between conductivity and mechanical strength or flexibility in the electrode body 39.

[0172] Conductive silicone rubber can be obtained by heating and drying the conductive solution as needed.

[0173] The conductive silicone rubber can be composed without silicone oil. This prevents a decrease in conductivity due to silicone oil seeping onto the surface of the electrode body 39.

[0174] <Materials for conductive contacts>

[0175] The conductive component of the conductive contact 33 is, for example, a paste containing a highly conductive metal (so-called conductive paste). The highly conductive metal includes one or more selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, and alloys thereof. Especially from the viewpoint of availability or conductivity, silver or silver chloride, or copper, are preferred.

[0176] When the conductive contact portion 33 is formed using a slurry containing a highly conductive metal, the top of the protrusion 32, which is formed of a rubber-like elastomer, is immersed (impregnated) in a slurry-like conductive solution containing a highly conductive metal. Thus, the conductive contact portion 33 is formed on the surface of the protrusion 32.

[0177] Alternatively, a conductive contact portion 33, which is a conductive resin layer, can be formed by coating the protrusion 32 with a conductive solution containing conductive filler and solvent. In this case, by using a material (silicone rubber) of the same system as the protrusion 32, the adhesion of the conductive contact portion 33 (conductive resin layer) can be improved.

[0178] Conductive silicone rubber can be obtained by heating and drying the conductive solution as needed.

[0179] The conductive silicone rubber can be composed without silicone oil. This prevents a decrease in conductivity due to silicone oil seeping onto the surface of the conductive contact portion 33.

[0180] This improves the ability to part hair when the brainwave measuring device 10 is worn on the head 99. Furthermore, it ensures sufficient contact area of ​​the conductive contact portion 33 when the brainwave measuring device 10 is worn.

[0181] <Structure of the signal line section>

[0182] In the electrode unit 30, a signal line portion 34 is provided as a signal path connected to the conductive contact portion 33. The signal line portion 34 can employ various wiring structures as long as it is conductive via the base 31 and the protrusion 32. Here, the signal line portion 34 is configured to pass through the conductive contact portion 33 at the front end of the protrusion 32, through the interior of the protrusion 32 and the base 31, and protrude onto the upper surface 37 of the base. The portion of the signal line portion 34 protruding from the upper surface 37 of the base (here, end 34a) is inserted between the convex snap 35 (more specifically, the disc portion 35a described later) and the upper surface 37 of the base, ensuring conductivity with the convex snap 35.

[0183] The area at the lower front end of the signal line portion 34, relative to or near the front end portion of the protrusion 32, where the conductive contact portion 33 is formed, can be any of the following: a protruding structure, a structure on approximately the same plane, or an embedded structure. From the viewpoint of connection stability with the conductive contact portion 33, a protruding structure can be used. Partially or entirely, the protruding portion at the front end of the signal line portion 34 is covered by the conductive contact portion 33. The protruding structure at the front end of the signal line portion 34 can be a structure without folds, with folds, or wrapped around the front end surface of the protrusion 32.

[0184] Other wiring structures for the signal line portion 34 can be structures disposed on the surfaces of the protrusion portion 32 and the base portion 31, or wiring structures that are partly disposed inside and partly disposed on the surface. That is, as long as the signal detected by the conductive contact portion 33 is ultimately transmitted to the convex snap 35.

[0185] <Materials of the signal line section>

[0186] The signal line section 34 can use known signal line sections, such as those made of conductive fibers. As conductive fibers, one or more selected from the group consisting of metal fibers, metal-coated fibers, carbon fibers, conductive polymer fibers, conductive polymer-coated fibers, and conductive paste-coated fibers can be used. These can be used individually or in combination of two or more.

[0187] The aforementioned metal fibers and metal-coated fibers are not limited in their metallic properties as long as they are conductive; examples include copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, stainless steel, aluminum, silver / silver chloride, and their alloys. These can be used individually or in combination of two or more. Among these, silver can be used from the viewpoint of conductivity. Furthermore, the metal material preferably does not contain metals such as chromium that cause environmental impact.

[0188] The fiber materials used for the aforementioned metal-coated fibers, conductive polymer-coated fibers, and conductive paste-coated fibers are not particularly limited and can be any of synthetic fibers, semi-synthetic fibers, or natural fibers. Among these, polyester, nylon, polyurethane, silk, and cotton are preferred. These can be used alone or in combination of two or more.

[0189] Examples of the aforementioned carbon fibers include PAN-based carbon fibers and pitch-based carbon fibers.

[0190] The conductive polymer materials of the aforementioned conductive polymer fibers and conductive polymer-coated fibers can be, for example, mixtures of conductive polymers and adhesive resins such as polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylene oxide, polynaphthalene and their derivatives, or aqueous solutions of conductive polymers such as PEDOT-PSS ((3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid)).

[0191] The resin material contained in the conductive paste coating the fibers described above is not particularly limited, but preferably has elasticity, and for example, can contain one or more selected from the group consisting of silicone rubber, polyurethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, neoprene rubber, and ethylene propylene rubber. These can be used alone or in combination of two or more.

[0192] The conductive filler contained in the conductive paste of the aforementioned conductive paste-coated fiber is not particularly limited, and known conductive materials can be used. It can contain one or more of the following: metal particles, metal fibers, metal-coated fibers, carbon black, acetylene black, graphite, carbon fibers, carbon nanotubes, conductive polymers, conductive polymer-coated fibers, and metal nanowires.

[0193] The metal constituting the conductive filler is not particularly limited, and may include at least one of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, silver / silver chloride, or alloys thereof, or two or more thereof. Silver or copper is preferred from the perspective of high conductivity and easy availability.

[0194] The signal line section 34 can be made of twisted yarn, which is formed by twisting multiple linear conductive fibers together. This can suppress the breakage of the signal line section 34 during deformation.

[0195] In this embodiment, the coating of conductive fibers includes not only covering the outer surface of the fiber material, but also coating each single fiber constituting the twisted yarn when metal, conductive polymer or conductive paste is impregnated in the fiber gaps inside the twisted yarn.

[0196] The tensile elongation at break of the signal line portion 34 is, for example, 1% or more to 50% or less, preferably 1.5% or more to 45%. By setting it within such a range, breakage during deformation can be suppressed, and excessive deformation of the protrusion portion 32 can be suppressed.

[0197] <Supporting Components>

[0198] Main Reference Figure 3 , Figure 6 The supporting component 20 will be described in detail. Figure 3 This is a schematic top view showing the substrate 21 and circuit pattern 22 in the support member 20. The shielding layer 24 is omitted. Figure 6 This is a sectional view of the support member 20, showing the section along... Figure 2 A sectional view cut along the X2-X2 axis.

[0199] The support member 20 has a so-called flexible substrate and is arranged in a strip shape. The support member 20 is configured to have a strip-shaped substrate 21, a circuit pattern 22, a protective layer 23, a shielding layer 24, and a rope guide portion 26.

[0200] <Substrate>

[0201] In the substrate 21, assembly parts 25 are provided at five positions corresponding to the positions of T3, C3, Cz, C4, and T4 in the International Electrode Configuration Method 10-20.

[0202] The substrate 21 is configured to be non-stretchable, flexible in a direction perpendicular to the surface formed by the substrate 21, and possess sufficient strength for mounting the electrode unit 30. That is, it has sufficient strength to prevent breakage when the mounting part 25 is provided and the electrode unit 30 is mounted. The non-stretchability is defined by Poisson's ratio, as described later.

[0203] Furthermore, from the viewpoint of pressing the multiple electrode units 30 onto the head 99 with appropriate pressure, that is, making them linear between the assembly parts 25 and applying a certain tension, it has the property of not stretching.

[0204] The longitudinal width (depth length) of the substrate 21 also depends on the size of the electrode unit 30 being worn, for example, it can be set to 10mm to 50mm.

[0205] The lateral width (length in the left-right direction) of the substrate 21 also depends on the size of the head 99 or the position of the electrodes, and can be set to 200mm to 400mm, for example. Furthermore, for example, assuming it is for adult use, the distance between the electrodes can be set to 65mm to 75mm.

[0206] The thickness of the substrate 21 also depends on the material, and can be set to, for example, 0.01 mm to 1 mm. By setting the thickness of the support member 20 within the above range, it can appropriately follow the shape of the head 99 and maintain a state where the electrode unit 30 is pressed with a certain tension. In addition, the substrate 21 can be bent to a substantially constant degree depending on the shape of the head 99 or the state of the hair. Furthermore, from the viewpoint of pressing the multiple electrode units 30 against the head 99 with appropriate pressure, i.e., applying a certain tension, it has non-stretchable physical properties.

[0207] The substrate 21 can be a resin film substrate, a metal film component, or a glass film. Examples of resin film substrates include polyimide resin films, polyetherimide resin films, polyamideimide resin films, polyamide resin films, polyester resin films, PET (polyethylene terephthalate) resin films, and PS (polystyrene) resin films. Among these, polyimide resin films are particularly preferred from the viewpoint of improving flexibility, modulus of elasticity, and heat resistance. Furthermore, aluminum foil or copper foil can be used as the metal component.

[0208] <Circuit Pattern>

[0209] The circuit pattern 22, for example, has terminals electrically connected to the electrode unit 30 and wiring connecting the electrode unit 30 to external connection terminals (not shown). For example, it can be obtained by etching a flexible copper-clad laminate with copper foil covering the entire upper surface of the substrate 21 into a desired shape. Furthermore, the method for setting the circuit pattern 22 is not limited to the methods described above; for example, a method using conductive pastes such as silver ink or copper ink to print the desired pattern can also be used.

[0210] The circuit pattern 22 has five circuit patterns 22a to 22e (hereinafter referred to as circuit pattern 22 if not distinguished) that extend to the left from five openings 29 respectively. The five circuit patterns 22a to 22e are independent and electrically insulated from each other.

[0211] Each circuit pattern 22 has an annular pattern 28a arranged in a ring shape around the periphery of the opening 29, and a linear pattern 22b extending linearly from the annular pattern 28a in a leftward direction as shown in the figure. A mounting portion 25 formed of a ring-shaped good conductor is mounted on the annular pattern 28a, thereby realizing the connection between the circuit pattern 22 and the mounting portion 25. That is, a portion of the annular pattern 28a functions as a connection terminal with the electrode unit 30. And, the other portion of the linear pattern 22b functions as wiring to the outside.

[0212] To maintain its separation from other linear patterns 22b or annular patterns 28a, a portion of the linear pattern 22b is oriented differently in the tilt direction. Furthermore, since the adjustment portion 50 is stitched between electrode positions C3 and T3 and between electrode positions C4 and T4, the circuit pattern 22 (annular pattern 28a) is formed by avoiding the areas required for stitching. A connector (not shown) for connection to external wiring is provided at the extended end (left end in the illustration) of the linear pattern 28b.

[0213] Furthermore, from the viewpoint of giving the supporting member 20 a specified strength, not only can an actual wiring structure be set as the circuit pattern 22, but also a virtual pattern can be set.

[0214] <Protective Layer>

[0215] like Figure 6 As shown, the protective layer 23 is formed by covering the circuit pattern 22 with an insulating member (excluding the lower surface). For example, it can be a cover film made of an insulating resin film and an adhesive material, or it can be a protective layer formed by forming a coating of a liquid resin composition containing a thermosetting resin by screen printing or the like and then heating and curing it.

[0216] <Shielding layer>

[0217] The shielding layer 24 is an electromagnetic wave shielding component covering the circuit pattern 22. The shielding layer 24 is provided to counteract noise when transmitting brainwave signals over the circuit pattern 22, and has a first shielding layer 24a disposed on the upper surface of the protective layer 23 and a second shielding layer 24b disposed on the lower surface of the substrate 21. The first shielding layer 24a and the second shielding layer 24b can be formed of the same material or different materials.

[0218] The shielding layer 24 (first shielding layer 24a, second shielding layer 24b) is obtained by forming a conductive paste containing a metal filler onto the protective layer 23 using methods such as screen printing. The metal filler can be gold, silver, copper, aluminum, or other metals or alloys, used alone or in combination. There are no particular limitations on the size of the filler; fillers ranging from a few nm to a few μm are used. The metal filler and thermosetting epoxy resin are mixed as components of the paste.

[0219] The thickness of the shielding layer 24 (first shielding layer 24a, second shielding layer 24b) can be set to, for example, 5 μm to 50 μm. By setting the thickness within this range, a stable thickness can be achieved when forming the shielding layer 24, and the desired shielding performance can be achieved.

[0220] Alternatively, as the shielding layer 24, a laminate in which a conductive metal layer is formed on a resin film by means of vapor deposition or the like can be used. In this case, the laminate is attached to the upper surface of the protective layer 23 or the lower surface of the substrate 21 using an adhesive or the like. Alternatively, the shielding layer can be formed by printing, but from the viewpoint of being able to reduce the thickness of the shielding layer and improve its bending resistance, vapor deposition is preferred. Furthermore, the conductive metal layer is connected to the ground (reference potential stabilization portion) of the circuit pattern 22. Both or either the first shielding layer 24a or the second shielding layer 24b can be omitted. In this case, although the noise immunity is reduced, the device can be simplified. Furthermore, regarding the noise immunity, within a certain range, it can also be addressed through signal processing.

[0221] <Physical properties of supporting components, etc.>

[0222] If the physical properties of the supporting member 20 (more specifically the base material 21) are specified (Poisson's ratio, Young's modulus, maximum thickness, Young's modulus × thickness), then for example, they are as follows.

[0223] Poisson's ratio and Young's modulus are determined by tensile testing in accordance with JIS K7127. In the tensile test, a test piece (the test piece of the substrate 21 itself) specified by the above standard is used. Alternatively, a test piece that does not conform to the above JIS standard but has circuit patterns 22 provided on the substrate 21 may also be used.

[0224] (Poisson's ratio)

[0225] Poisson's ratio specifies the non-stretchability of the support member at 20.

[0226] The Poisson's ratio of the support member 20 is 0.15 to 0.4. The lower limit of the Poisson's ratio is preferably 0.2 or more, more preferably 0.25 or more. The upper limit of the Poisson's ratio is preferably 0.38 or less, more preferably 0.35 or less.

[0227] By setting the Poisson's ratio of the support member 20 (i.e., the substrate 21) within the aforementioned range, the support member 20 is less prone to deformation. That is, when the brainwave measurement device 10 is worn on the head 99, with the electrode unit 30 pressed against the head 99, force acts in the direction of extension of the support member 20. In other words, tension is applied. At this time, if the support member 20 is an elastic member such as rubber (a member with a Poisson's ratio of approximately 0.46 to 0.49), the support member 20 may extend improperly, sometimes causing uneven force of the electrode unit 30 pressing against the head 99. As a result, the signal quality of the obtained brainwaves may sometimes be reduced. However, by setting the Poisson's ratio of the support member 20 within the aforementioned range, the force of the electrode unit 30 pressing against the head 99 can be controlled within a certain range, enabling stable brainwave measurement.

[0228] (Young's modulus)

[0229] The Young's modulus (elastic modulus) of the support member 20 is 0.4 GPa to 150 GPa. The lower limit of the Young's modulus is preferably 3 GPa or more, more preferably 5 GPa or more. The upper limit is preferably 140 GPa or less, more preferably 135 GPa or less.

[0230] By setting the Young's modulus of the support member 20 within the above-mentioned range, the strength of the support member 20 can be maintained and its deformation can be prevented.

[0231] (Young's modulus × thickness)

[0232] The product of the Young's modulus (elastic modulus) of the material constituting the membrane component and its thickness is 0.4 to 9.1.

[0233] Even with easily deformable materials (i.e., materials with low Young's modulus), as long as the thickness is above a certain level, they will not deform substantially, and the force exerted by the electrode unit 30 on the head 99 can be controlled within a certain range. Furthermore, in the case of hard materials (i.e., materials with high Young's modulus), if the thickness is not made thin enough, the ability of the brainwave measuring device 10 to follow the shape of the head 99 will be significantly reduced. Therefore, by setting the product of Young's modulus (elastic modulus) and thickness within the aforementioned range, the force exerted by the electrode unit 30 mounted on the support member 20 on the head 99 can be controlled within a certain range, enabling stable brainwave measurement.

[0234] <Connection structure between electrode unit and supporting member>

[0235] For example, such as Figure 4 As shown, the electrode unit 30 and the support member 20 are fixed by snap-fit. Specifically, the concave snap 25a of the support member 20 engages with the convex snap 35 of the electrode unit 30. The concave snap 25a functions as an assembly part 25 for mounting the electrode unit 30 via the snap-fit ​​structure.

[0236] The convex snap button 35 is made of a good conductor of metal, for example, and has a disc-shaped disc portion 35a and a button-shaped convex button portion 35b extending from the center of the upper surface of the disc portion 35a. Good conductors of metal include, for example, stainless steel, copper alloy, aluminum alloy, brass, etc.

[0237] The disc portion 35a is attached to the upper surface 37 of the base portion 31 using a conductive adhesive or the like. At this time, as described above, the end 34a of the signal line portion 34 is sandwiched between the disc portion 35a and the upper surface 37 of the base portion, ensuring communication with the convex snap 35.

[0238] The button portion 35b is installed in a manner that engages with the concave snap fastener 25a provided on the support member 20.

[0239] Similar to the convex snap 35, the concave snap 25a is made of a good conductor metal and outputs the brainwave signal acquired by the electrode unit 30 to the brainwave display device, etc. through the circuit pattern 22.

[0240] refer to Figure 5 As a variation of the fixing structure of electrode unit 30 and support member 20, a structural example of using threaded engagement instead of snap-fit ​​will be described.

[0241] In this modified example, it has an external thread type connection terminal 135 provided on the top of the electrode unit 30 and an electrode mounting part 160 provided as an assembly part 25 instead of a concave snap fastener 25a.

[0242] The external thread type connection terminal 135 is made of a good conductor metal, for example, and has a disc-shaped disc portion 135a and a protrusion 135b extending from the center of the upper surface of the disc portion 135a. The protrusion 135b is formed into a cylindrical shape and has threads formed on its circumferential surface to become an external thread. As a good conductor metal, for example, stainless steel, copper alloy, aluminum alloy, brass, etc. can be used.

[0243] The disk portion 135a is mounted to the upper surface 37 of the base portion 31 using a conductive adhesive or the like. At this time, as described above, the end 34a of the signal line portion 34 is sandwiched between the disk portion 135a and the upper surface 37 of the base portion to ensure conduction with the external thread type connection terminal 135.

[0244] The electrode mounting portion 160 is formed of a good conductor and has a mounting body 161 that is circular when viewed from above, and an internally threaded connection terminal 162 located at the center of the mounting body 161. The internally threaded connection terminal 162 has a threaded opening and is threadedly connected to the externally threaded connection terminal 135 (protrusion 135b) of the electrode unit 30. As a result, it can be fixed more securely than a snap-fit, and the generation of noise caused by the snap-fit ​​portion can be suppressed.

[0245] The outer diameter of the mounting body 161 is set to be approximately the same as the outer diameter of the electrode unit 30. An amplification unit (preamplifier) ​​and other circuitry, formed of a rigid insulating substrate, amplify the brainwaves acquired by the electrode unit 30. The upper surface of the mounting body 161 is covered by a shielding layer 24 or other covering member as needed.

[0246] Alternatively, the external threaded connection terminal 135, which protrudes from the internal threaded connection terminal 162, can be fixed to the mounting body 161 using a nut (not shown). This makes the fixation between the electrode unit 30 and the support member 20 more secure, and further stabilizes the transmission of brainwave signals.

[0247] Installation Department

[0248] like Figure 1 or Figure 2 As shown, the mounting part 70 is a component that is installed on the subject's measurement site (e.g., ear) to ensure proper wearing when the brainwave measuring device 10 is worn on the subject's head 99. In other words, the mounting part 70 is provided at the end of the support member 20 and installed on the subject's ear or jaw, and functions as an auxiliary member that is configured to support the head 99 along with the shape of the head 99.

[0249] The mounting parts 70 are respectively installed at both ends of the support member 20 along its length (in) Figure 1 or Figure 2 The electrode unit 30 (located at both ends in the left-right direction) spans between the support member 20 and a location different from the measurement site on the subject (in this case, the ear). Thus, the electrode unit 30 is pressed onto the head 99 with a prescribed electrode pressing force F.

[0250] Specifically, the mounting part 70 includes an adjustment part 50, a tension display part 60, an ear-wearing part 40, a non-stretchable cord 55 connecting the adjustment part 50 and the tension display part 60, and a cord 45 connecting the tension display part 60 and the ear-wearing part 40.

[0251] <Ear Wearing Part>

[0252] The ear-wearing part 40 is worn on the subject's ear. A cord 45 is attached to the ear-wearing part 40, and it is detachably attached to the second hook 64 of the tension display part 60 via a loop 46 provided at the end of the cord 45. In this embodiment, the ear-wearing part 40 is worn by winding the cord 45 around the ear.

[0253] <Adjustment Department>

[0254] The adjustment unit 50 adjusts the tension acting on the rope 55 by adjusting the distance (length) between the support member 20 and the ear-wearing part 40.

[0255] Adjustment parts 50 are respectively installed at both ends of the support member 20. Each adjustment part 50 includes a plate-shaped member 52 installed on the support member 20, a locking part 51 for fixing the length of the plate-shaped member 52, a rope 55 installed at the end of the plate-shaped member 52 on the side of the tension display part 60, and a ring 56 provided at the end of the rope 55 on the side of the tension display part 60. The first hook 63 of the tension display part 60 is detachably installed on the ring 56.

[0256] The plate-shaped member 52 is a long strip with multiple teeth arranged in a row. An opening with pawls is provided in the locking part 51, through which the plate-shaped member 52 is inserted and locked in the desired position. Furthermore, the locking part 51 is provided with a release part that releases the locked state in conjunction with the pawls. The material of the adjusting part 50 is not particularly limited, and various plastics can be used. From the viewpoints of physical properties, processability, or cost, 66 nylon is preferred.

[0257] <Tension Display Section>

[0258] The tension display unit 60 is detachably disposed between the adjustment unit 50 and the ear-wearing unit 40, and displays whether the tension acting on both ends is within an appropriate range. That is, it can determine whether the tension T1 applied to the end of the support member 20 (membrane substrate) is within an appropriate range during brainwave measurement.

[0259] like Figure 7 As shown, the tension display unit 60 has a cylindrical frame 66, a stretchable elastic body (spring 61) housed inside the frame 66, an indicator 65 indicating the extension state of the spring 61, a scale 67, and an index 68. It displays the tension of the elastic body (spring 61) acting on the support member 20 in a recognizable manner.

[0260] The frame 66 is configured to at least determine the position of the indicator 65. In this embodiment, the frame 66 is a transparent structure that allows the internal state to be identified. One end of the frame 66 (here, the end on the side of the adjustment part 50) has a bottom, and the other end (here, the end on the side of the ear-wearing part 40) is open. A first hook 63 is provided at the upper end of the frame 66, which is detachably mounted to a loop 56 provided at the front end of the cord 55 of the adjustment part 50.

[0261] Spring 61 is, for example, a coil spring. One end of spring 61 (the end on the side of adjustment part 50) is fixed to the bottom end (the end on the side of adjustment part 50) of frame 66. Spring 61 is configured to extend to a certain extent when the brainwave measuring device 10 is worn on the head 99. The degree of extension is set to a level that can be visually grasped in the indicator 65 described later, and a level that does not exert excessive force on the head 99.

[0262] A non-stretchable cord 62 is installed at the other end of the spring 61 (the end on the ear-wearing part 40 side), extending outward from the end on the opening side of the frame 66. A second hook 64 is provided at the front end of the cord 62. The loop 46 at the end of the cord 45 provided in the ear-wearing part 40 is detachably attached via the second hook 64.

[0263] An indicator 65 is provided at the mounting portion of spring 61 and wire 62. The indicator 65 displays the tension of spring 61. A scale 67 and an index 68 are provided on the circumferential surface of the frame 66. The scale 67 has multiple horizontal lines at regular intervals. The index 68 is provided as a value that can be used to determine the tension. The indicator 65, scale 67, and index 68 function as tension appropriate display parts that display whether the tension is within the appropriate range in a recognizable manner. In addition, to easily identify whether it is within the appropriate range, the scale 67 can include markings such as red lines to indicate the appropriate range.

[0264] Alternatively, it can be assumed that the appropriate tension varies depending on the subject's attributes (e.g., age, gender, hair condition). Therefore, various tension display sections 60 with different spring strengths, scale 67, and index ranges 68 can be prepared, and an appropriate tension display section 60 can be selected according to the subject.

[0265] <Pressure F applied to the electrodes on the head>

[0266] refer to Figure 8 and Figure 9 The features of this embodiment will be described. Figure 8 This diagram illustrates the force (pressure F applied to the electrodes on the head) acting on the head 99 when wearing the brainwave measurement device 10. Figure 9 This is a diagram illustrating the winch principle (winch equation) used for modeling.

[0267] like Figure 8 As shown, with the brainwave measuring device 10 worn on the head 99, multiple electrode units 30 are used as vertices to form a polygon (or polygonal line) connecting the electrode units 30 by the support member 20. At this time, assuming that the electrode units 30 are pressed against the head 99 by the tension of the support member 20, the force (electrode pressing force F) that presses the electrode units 30 against the head 99 can be expressed by the following formula 1.

[0268] F=2·T1·cos(θ)……Equation 1

[0269] That is, the difference in θ caused by individual differences in head shape is reflected in the difference in electrode pressure F.

[0270] Furthermore, the minimum curvature of the inscribed circle is determined based on the height and spacing of the electrode units 30. The maximum curvature is also determined based on the required electrode pressure F for the electrode units 30 and the winch principle. Additionally, the electrode pressure F on the head 99 follows the winch equation; therefore, the electrode pressure on the sides of the head is greater than that on the top of the head.

[0271] Here, it is assumed that the support member 20 (film substrate) is approximately wound around the head 99. Since there is friction between the head 99 and the support member 20, it is assumed that the tension of each electrode unit 30 follows the winch equation shown in Equation 2 below.

[0272] T1=T2·e^(μ· Equation 2

[0273] μ: coefficient of friction Central angle Based on Equations 1 and 2 above, the relationship between the tension T1 applied to the end of the support member 20 (membrane substrate) and the load (electrode pressure F) applied to the head 99 by the electrode unit 30 can be grasped.

[0274] Additionally, in the embodiments described later (see reference) Figure 10 The figure shows the load values ​​calculated based on the above theory and the actual measured load values.

[0275] According to this embodiment, in the brainwave measuring device 10, by providing a circuit pattern 22 on the support member 20, wires and the like can be omitted, the electrode unit 30 of the brainwave measuring device 10 can be properly contacted with the scalp, and the wiring structure can be simplified.

[0276] Furthermore, the electrode unit 30 is fixed to the support member 20 made of a membrane substrate, forming a polygon (or polygonal line) with the electrode unit 30 installed only at the necessary locations as vertices. Therefore, the electrode unit 30 can be made to follow the shape of the head well. Moreover, by modeling the wearing state of the brainwave measuring device 10 according to the winch equation, the electrode pressing pressure F based on the electrode unit 30 can be properly controlled.

[0277] Furthermore, by providing the adjustment section 50 and the tension display section 60 in the mounting section 70, the tension acting on the support member 20 can be adjusted to an appropriate range. Moreover, by making the tension display section 60 detachable, an appropriate tension display section 60 can be selected according to the subject's attributes, enabling stable brainwave measurement.

[0278] More specifically, when both the support member 20 and the mounting part 70 are non-stretchable members, changing the length of the adjustment part 50 will directly change the tension. The appropriate range of force required to press the electrode unit 30 onto the scalp is narrow, meaning the appropriate range of the adjustment part 50 is also narrow, making adjustment difficult. More specifically, since the ear or scalp can deform and is elastic, it slightly expands the appropriate range of the adjustment part 50. Even so, adjustment is still difficult; the adjustment range between a state of low and relaxed tension and a state of high and painful tension is narrow, making it difficult to wear the EEG measuring device 10 with sufficient force while ensuring the subject does not experience discomfort. On the other hand, when a tension display part 60 is provided, i.e., when a stretchable member is included, not only the aforementioned deformation / elasticity of the ear or scalp is considered, but also the deformation of more elastic bodies such as springs is superimposed, thereby significantly expanding the appropriate range of the adjustment part 50. Therefore, it is easier to wear the EEG measuring device 10 in the appropriate state.

[0279] The plate-like member 152 is a long strip in the shape of a guide rail with a plurality of protrusions 152a arranged in a row. The locking part 151 is slidably inserted into the guide rail formed by the protrusions 152a. The locking part 151 has a locking mechanism 156 that is held in a non-slidable manner. The non-slidable state is released by a predetermined operation on the locking mechanism 156 (e.g., a lateral pressing operation).

[0280] By sliding the locking part 151 on the plate member 152, the distance, i.e. the tension, between the tension display part 60 (i.e., the ear-wearing part 40) installed on the rope 55 and the support member 20 can be adjusted.

[0281] <Summary of Implementation Methods>

[0282] The features of the implementation method can be simply summarized as follows.

[0283] (1) A brainwave measuring device 10, which has: Electrode unit 30 contacts the measurement site on the subject's head 99 to acquire brainwave signals; Support member 20 supports the electrode unit 30; and Mounting part 70 (auxiliary component), which assists the support component 20 in being disposed at the head 99. The mounting portion 70 (auxiliary component) includes a non-stretchable membrane component and an assembly portion 25 for electrically connecting and fixing the electrode unit 30. The membrane component has a non-stretchable substrate 21 and a circuit pattern 22 disposed on the substrate 21. The circuit pattern 22 is connected to the assembly part 25.

[0284] (2) The brainwave measuring device 10 according to (1) further comprises an electromagnetic wave shielding member (shielding layer 24) covering the circuit pattern 22.

[0285] (3) The brainwave measuring device 10 according to (1) or (2), wherein, The membrane component is elongated. The electrode units 30 are arranged in multiples at predetermined intervals along the length of the membrane component.

[0286] (4) The brainwave measuring device 10 according to any one of (1) to (3), wherein, The electrode unit 30 has a base 31, a plurality of protrusions 32 (convex portions) disposed on the base 31, and a conductive contact portion 33 (electrode portion) disposed on the protrusions 32 (convex portions) and in contact with the head 99.

[0287] (5) The brainwave measuring device 10 according to (4), wherein, The protrusion 32 (convex part) is an elastic member.

[0288] (6) The brainwave measuring device 10 according to any one of (1) to (5), wherein, The mounting part 70 (auxiliary member) is disposed at the end of the support member 20 and mounted on the ear or jaw, assisting the support member 20 in being configured along the shape of the head 99.

[0289] (7) The brainwave measuring device 10 according to any one of (1) to (6), wherein, The mounting part 70 (auxiliary component) has a spring-like component.

[0290] (8) The brainwave measuring device 10 according to any one of (1) to (7), wherein, The mounting part 70 (auxiliary component) has a length adjustment component.

[0291] (9) The brainwave measuring device 10 according to any one of (1) to (8), wherein, With the mounting position (assembly part 25) of the electrode unit 30 as the vertex, the support member 20 bends at the vertex and connects the vertices to each other in a straight line.

[0292] (10) A method for measuring brain waves, wherein the brain wave measuring device 10 of any one of (1) to (9) is worn on the head 99 of a subject to measure brain waves.

[0293] The embodiments of the present invention have been described above, but these are merely examples of the present invention, and various configurations other than those described above are also possible.

[0294] Example

[0295] Hereinafter, this embodiment will be described in detail with reference to the embodiments. However, this embodiment is not limited to the description of these embodiments.

[0296] In the following embodiments corresponding to the first and second embodiments, the "verification of the support member (membrane substrate)" and the "modeling verification based on the winch equation" were confirmed.

[0297] <<Verification of Supporting Components (Membrane Substrate)>>

[0298] A total of 7 samples from Examples 1 to 7 were evaluated to determine their suitability as support components 20.

[0299] The evaluation criteria were assessed in the following three stages.

[0300] Evaluation A… When a certain tension (0.6N) is applied, the electrode position shift is small (less than 5mm).

[0301] Evaluation B… When a certain tension (0.6N) is applied, the electrode position deviation is within the allowable range (less than 10mm).

[0302] Evaluation C… When a certain tension (0.6N) is applied, the electrode position shift is outside the allowable range (greater than 10mm).

[0303] The materials of the samples in Examples 1 to 7 are as follows. Table 1 shows the various physical properties (Poisson's ratio, Young's modulus, maximum thickness, Young's modulus × thickness).

[0304] Example 1…PET (Polyethylene terephthalate) resin

[0305] Example 2…PI (polyimide) resin

[0306] Example 3…Aluminum Foil

[0307] Example 4…copper foil

[0308] Example 5…PS (polystyrene) resin

[0309] Example 6…PE (Polyethylene) Resin

[0310] Example 7…glass film

[0311] In Examples 1-6, the positional shift of the electrodes was small when a certain tension was applied, enabling stable acquisition of brain waves at the target location.

[0312] In Example 7, the aim was to suppress deformation by making the Young's modulus of the support member smaller than that of Examples 1-6, while making its thickness larger than that of other samples. However, the electrode offset was slightly larger when a certain tension was applied.

[0313] [Table 1]

[0314] <<Modeling and Verification Based on Winch Equations>>

[0315] The brainwave measurement device shown in the embodiment was worn on a head model, and the pressure F applied by the electrodes was measured using a pressure sensor disposed on the surface of the head model. The measured pressure was then compared with the calculated value obtained from the model based on the winch equation.

[0316] The specific specifications of the brainwave measuring device 10 are as follows.

[0317] Brainwave measurement locations: T3, C3, C2, C4, and T4.

[0318] Electrode unit: base diameter 10mm

[0319] The base thickness is 5mm

[0320] The height of the protrusion is 5mm.

[0321] The number of protrusions is 7

[0322] The distance between electrodes is 70mm.

[0323] Supporting components (membrane substrate): PI resin Poisson's ratio is 0.3 Young's modulus is 3.4 GPa. The maximum thickness is 0.225mm. In addition, instead of fixing it to the ear via the ear-wearing part, 200g weights were installed at each end to simulate the wearing state of the brainwave measurement device.

[0324] exist Figure 10The graph shows the theoretical (calculated) and measured values ​​of the electrode pressure F at five locations: T3, C3, Cz, C4, and T4. The graph shows that the theoretical and measured values ​​are almost identical, confirming the rationality of the modeling.

[0325] This application claims priority based on Japanese Patent Application No. 2023-213993, filed on December 19, 2023, the entire contents of which are incorporated herein by reference.

[0326] Explanation of reference numerals in the attached figures

[0327] 10-Brainwave Measurement Device 20-Supporting components (membrane substrate, strip components). 22-Circuit pattern, 23-Protective layer, 24-Shielding layer, 25-Assembly Department 25a - Concave snap fastener 30-electrode unit, 31-base, 32-Protrusion (convex part), 33-Conductive contact portion (electrode portion). 34-Signal line section, 35-convex snap button, 40-Ear fitting area, 50-Adjustment section, 60-Tension display section, 61-Spring, 62-line, 63-First hook, 64-Second hook, 65 - Indicator section (tension appropriate display section), 66-Frame, 67 - Scale (Tension Appropriate Display Section) 68-Indicator section (tension appropriate display section), 70-Installation Department 135-External thread type connection terminal, 160 - Electrode mounting section 161-Main body of the installation section, 162 - Internal thread type connection terminal.

Claims

1. A brainwave measuring device, wherein, have: Electrode units are used to acquire brainwave signals by contacting the measurement sites on the subject's head. Supporting components support the electrode unit; as well as Auxiliary components, which assist the supporting components in being positioned at the head. The support member has a non-stretchable membrane member and an assembly part for electrically connecting and fixing the electrode unit. The membrane component has a non-stretchable substrate and a circuit pattern disposed on the substrate. The circuit pattern is connected to the assembly part.

2. The brainwave measuring device according to claim 1, wherein, It also has an electromagnetic wave shielding component that covers the circuit pattern.

3. The brainwave measuring device according to claim 1 or 2, wherein, The membrane component is elongated. The electrode units are arranged in multiples at predetermined intervals along the length of the membrane component.

4. The brainwave measuring device according to any one of claims 1 to 3, wherein, The electrode unit has a base, a plurality of protrusions disposed on the base, and an electrode portion disposed on the protrusions and in contact with the head.

5. The brainwave measuring device according to claim 4, wherein, The protrusion is an elastic member.

6. The brainwave measuring device according to any one of claims 1 to 5, wherein, The auxiliary component is disposed at the end of the support component and installed on the ear or jaw, assisting the support component in being configured according to the shape of the head.

7. The brainwave measuring device according to any one of claims 1 to 6, wherein, The auxiliary component has a spring-like structure.

8. The brainwave measuring device according to any one of claims 1 to 7, wherein, The auxiliary component has a length adjustment component.

9. The brainwave measuring device according to any one of claims 1 to 8, wherein, With the installation position of the electrode unit as the vertex, the support member bends at the vertex and connects the vertices to each other in a straight line.

10. A method for measuring brain waves, wherein, The brainwave measuring device according to any one of claims 1 to 9 is worn on the head of the subject to measure brainwaves.

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