Laminating apparatus for laminating an electrochemical layer stack

Abstract

A lamination apparatus for laminating an electrochemical layer stack, having a movable first workpiece carrier for carrying a layer stack made of individual substrates which are layered on top of one another, a lamination press for exerting pressure on the layer stack carried by the first workpiece carrier such that the layer stack is pressed against the first workpiece carrier by means of the lamination press in order to connect the substrates of the layer stack into a laminate, and at least one hold-down device to prevent the layer stack from slipping. The lamination apparatus is configured to release the laminate by removing the hold-down device from the laminate. To support this release, the hold-down device has at least one fluid channel which can be loaded with a pressurized fluid. The invention also describes a corresponding lamination method.

Description

Technical Field

[0001] The present invention relates to a lamination apparatus for laminating electrochemical layer stacks and a method for laminating electrochemical layer stacks. Background Technology

[0002] Specifically, the electrochemical layer stack can be an electrode stack having at least one anode electrode, at least one cathode electrode, and a corresponding separator between each anode electrode and cathode electrode. Such a stack can be, in particular, an electrode stack for lithium-ion battery cells. For example, it can be an electrode stack for battery cells used in vehicle batteries, particularly high-voltage batteries, designed to provide energy for the drive of so-called battery electric vehicles (BEVs) or hybrid electric vehicles (HEVs).

[0003] Other examples of this layered stacking are membrane electrode assemblies (MEAs) or membrane electrode frame assemblies (MEFAs) used in fuel cells, particularly PEM-type fuel cells.

[0004] The individual layers of an electrochemical layer stack can consist, in particular, of individual plate-like, film-like, or strip-like layers, which are stacked on top of each other to create the layer stack and then bonded together by lamination. During lamination, the stacked layers are bonded together into a laminate under pressure and, depending on the type of lamination, optionally by an additional supply of heat. Summary of the Invention

[0005] The purpose of this invention is to further improve the lamination of electrochemical layer stacks, and in particular to reduce the damage to the laminate to be manufactured.

[0006] The objective of this invention is achieved through the teachings of the independent claims. Various embodiments and extensions of this invention are given in the dependent claims.

[0007] The first aspect of the technical solution proposed in this paper relates to a lamination apparatus for laminating electrochemical layer stacks. The lamination apparatus has: (i) A movable first workpiece carrier for carrying a stack of layers made of a single layered substrate; (ii) a laminating press for applying pressure to a stack of layers carried by a first workpiece carrier, and optionally additionally applying heat, such that the stack of layers is pressed against the first workpiece carrier by means of the laminating press in order to join the substrates of the stacked layers into a laminate; and (iii) At least one pressing device, wherein the laminating equipment is configured to press the laminate stack at least partially against the first workpiece carrier from a point in time before or during the production of the laminate by the laminating press to prevent the laminate stack from slipping.

[0008] The laminating apparatus is configured to release the laminate stack or laminate made therefrom by removing a clamping device from the laminate stack or laminate made therefrom. Furthermore, the clamping device has at least one fluid channel to support the release, the fluid channel being usable for applying pressurized fluid.

[0009] As used herein, the term "lamination equipment" refers to an apparatus, particularly an apparatus with one or more processing stations, designed to join two or more substrates, particularly sheet or film substrates, into a laminate by means of lamination. Here, the term "lamination" should be understood as a bonding method in which multiple overlapping layers (substrates) are joined together to form a multilayer composite material (laminate). The bonding of layers may specifically include: pressing the substrates together, introducing heat, establishing material mating connections, and / or welding processes.

[0010] As used herein, the term "electrochemical layer stack" refers to a multilayer stack formed by different, overlapping substrates selected and arranged relative to each other such that, collectively, at least after the fabrication of the laminate, it forms at least one galvanic cell unit or an assembly therein that has an electrochemical function. The galvanic cell unit may in particular be a primary battery, a secondary battery (rechargeable battery), a tertiary battery (fuel cell), or an electrolytic battery. Some examples of electrochemical layer stacks have been given above.

[0011] As used herein, the term "workpiece carrier" specifically refers to a carrier structure, particularly plate-like or frame-like, into which one or more workpieces can be placed, or placed, particularly loaded or mounted, so that they can be transported along manufacturing equipment, particularly a production line, through multiple manufacturing stations for processing. The workpiece carrier may particularly have fixing devices for securing at least one workpiece to the workpiece carrier. Lamination equipment according to the first aspect can be considered such manufacturing equipment. In this document, stacked layers are particularly used as workpieces.

[0012] As used herein, the term "substrate" specifically refers to a layer of homogeneous or heterogeneous material. It can exist, particularly in solid form, at room temperature (25°C), allowing multiple such substrates to be stacked by overlapping each other. The substrate can particularly have a shape that is at least partially plate-like, film-like, or strip-like. Depending on the type of layer stack to be formed and the specific layer, the material can particularly be a cathode material, anode material, membrane material, or fuel cell membrane.

[0013] Using lamination equipment according to the first aspect, particularly by means of a clamping device, slippage of the layer stack can be prevented. Here, the clamping force applied by the clamping device should be sufficient to at least substantially prevent slippage of the layer stack even during the lamination process performed by the lamination press. On the other hand, the clamping force applied by the clamping device should not be so strong as to cause significant deformation of the layer stack or to have been laminated by the clamping device.

[0014] Preferably, the timing is chosen such that slippage of the laminate stack is prevented by pressing it against the first workpiece carrier using a clamping device before the laminate stack is pressed against the first workpiece carrier by the laminating press. Preferably, the clamping device is configured to prevent slippage of the laminate stack throughout the entire processing performed by the laminating press. For this purpose, it is specified that the laminating press is removed from the laminate formed by the laminate stack while the clamping device continues to press the laminate stack, or laminate, against the first workpiece carrier. That is, it is specified that the clamping device is removed from the formed laminate only after the laminating press has finished, specifically by lifting the clamping device.

[0015] The inventors have recognized that removing a clamping device from a stack or laminate made therefrom can sometimes lead to damage to the stack or laminate and / or manufacturing defects and / or disruption of the manufacturing process. For example, it is possible that, although the manufacturing process specifies that the laminate should remain on or within the workpiece carrier, the laminate may at least temporarily adhere to the clamping device when it is lifted. This can interfere with the manufacturing process, particularly with subsequent processing steps. Furthermore, after the temporary adhesion phase, the laminate may detach from the clamping device and may fall uncontrollably onto the workpiece carrier or other parts of the manufacturing equipment, potentially damaging the laminate and / or the manufacturing equipment. To overcome this, the clamping device according to the invention has at least one fluid channel capable of loading pressurized fluid. The fluid flow generated when the fluid flows out of the fluid channel can act on the laminate to support the release of the laminate through the clamping device. In particular, force can be applied to the laminate by fluid flow, thereby preventing the laminate from adhering to the clamping device, or at least reducing the likelihood and / or duration of such adhesion. Therefore, ideally, when the clamping device is removed or lifted from the laminate, the laminate remains in the workpiece carrier, allowing possible subsequent manufacturing steps to be performed without interfering with the manufacturing process and without damaging the laminate and manufacturing equipment.

[0016] The fluid to be used can be a gas or a mixture of gases, especially air. For fluid loading, the fluid passage can be connected to or is connected to a source of compressed air. Preferably, the fluid passage is loaded with pressurized fluid only before and / or during removal of the clamping device from the laminate.

[0017] Various exemplary embodiments of the lamination apparatus will now be described. Unless explicitly excluded or technically impossible, these embodiments can be arbitrarily combined with each other and with the second aspect of the present invention described below.

[0018] In some embodiments, at least one fluid channel extends within or above the clamping device. Extending within the clamping device is particularly preferred because it eliminates the need for additional space for the fluid channel (on the side or side of the clamping device). This needs to be considered in the context of prior art: in the sense of a laminating process that is as uniform as possible, it is advantageous to apply pressure to the laminating press or its pressure head over the largest possible area of ​​the lamination stack. However, at those points where the laminating stack is pressed against the workpiece carrier by means of the clamping device, the laminating press cannot apply pressure to the lamination stack. Therefore, it is advantageous for the clamping device to have as little extension as possible in a plane parallel to the surface of the lamination stack.

[0019] Similarly, at least one fluid channel extends above the clamping device (i.e., next to the clamping device when viewed in a plane parallel to the surface of the laminated stack). This simplifies the manufacture of the laminating equipment if necessary. Existing laminating equipment can also be retrofitted in this way, particularly in a manner potentially simpler than introducing a fluid channel into an existing clamping device.

[0020] In some embodiments, the clamping device has a first surface facing the workpiece carrier or the stack of layers, which contacts the workpiece carrier or the stack of layers when clamping the stack of layers. This first surface is preferably configured to have as little or no impact as possible on the surfaces of the stack of layers to be contacted, and in particular, to be non-reactive, especially chemically neutral.

[0021] In some embodiments, at least one fluid channel has a discharge opening disposed in a first surface region. In the context of this invention, the term "first surface region" should be understood as meaning that the discharge opening is disposed on or in the first surface, or sufficiently close to the first surface, such that fluid flowing out through the discharge opening can support or facilitate the release of the laminate. In a prototype lamination device manufactured by the inventors, satisfactory or good results were obtained when the distance between the discharge opening and the plane containing the first surface was at most 20 mm. Even better results were obtained if the distance was at most 10 mm, 5 mm, or 3 mm.

[0022] In some embodiments, the discharge opening is not in the first surface. In such embodiments, the discharge opening may be arranged on a lateral second surface of the clamping device. For example, if the clamping device is generally cylindrical, the first surface corresponds to the face at the axial end of the cylinder, and the second surface corresponds to the (curved) cylindrical surface.

[0023] Arranging the discharge opening on a lateral second surface of the clamping device offers particular technical advantages compared to arranging it on a first surface. When the discharge opening is located on the lateral second surface of the clamping device, the fluid flowing out through the discharge opening (hereinafter also referred to as "compressed air," but this should not be considered a limitation on the term "fluid") can act over a relatively large area, potentially acting on the entire surface of the laminate not contacted by the clamping device. This generates a relatively uniform pressure across the laminate. Consequently, any deformation of the laminate caused by compressed air can be minimized.

[0024] Another advantage compared to arranging the discharge opening on or within the first surface will be explained below. Precisely coordinating the timing of the start of removing the clamping device from the laminate with the timing of loading compressed air into the fluid channel or the flow of compressed air at the discharge opening, so that both occur precisely simultaneously, relates to increased technical costs. When the discharge opening is arranged on or within the first surface, there is still a risk of damaging the laminate if they are not simultaneous enough, because if compressed air is loaded into the fluid channel while the clamping device is still pressing the laminate against the first workpiece carrier, the compressed air may damage the surface of the laminate, as the surface of the laminate is still essentially airtightly sealing the discharge opening of the clamping device. Conversely, if compressed air is loaded into the fluid channel only after the clamping device has begun to be removed from the surface of the laminate, there is again the risk of the laminate temporarily adhering to the first surface of the clamping device, as described above, and the risk of damage to the laminate or laminating equipment when the laminate is subsequently released from the clamping device by the loading of compressed air.

[0025] By arranging the discharge opening on the second surface, the potential problems described above can be largely avoided, because in this arrangement, the loading of compressed air into the fluid channel can begin while the clamping device is still pressing the laminate against the first workpiece carrier, which generally does not cause damage because the discharge opening is not airtight in this arrangement. Therefore, compressed air can flow out relatively unimpeded through the discharge opening, causing only relatively small pressure on the laminate (while it is still being pressed down by the clamping device). Once the clamping device is lifted from the laminate, this relatively small pressure is sufficient to detach the laminate from the clamping device. In other words, the laminate remains in its previous position within or above the first workpiece carrier, while the clamping device is removed from the laminate surface.

[0026] However, it is also possible to arrange the discharge opening in the first surface of the clamping device, but in this case care should be taken to load compressed air into the fluid channel and begin removing the clamping device from the laminate as precisely as possible at the same time.

[0027] In some embodiments, at least one fluid channel has an orientation in the first surface region that includes a directional component parallel to the first surface. This orientation facilitates the (lateral) outflow of compressed air and thus promotes loading on a relatively large portion of the laminate surface. This, in turn, ensures a pressure distribution as uniform as possible.

[0028] In some embodiments, the orientation of at least one fluid channel is inclined at an angle α relative to the first surface, at least in a region of the first surface, and at an angle β relative to the normal of the first surface or relative to the clamping direction of the clamping device, wherein the angle α is at least 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, or 60°, and / or wherein the angle β is at least 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, or 60°, particularly wherein the angle α is a value of 45° ± 10° or 45° ± 5°, and / or the angle β is a value of 45° ± 10° or 45° ± 5°. In a series of experiments, the orientation of the fluid channel being inclined at approximately 45° relative to the first surface and therefore also relative to the normal of the first surface proved particularly advantageous. Here, the direction of the fluid channel points outward relative to the central axis of the clamping device, representing a direction component parallel to the first surface, and simultaneously oriented towards the workpiece carrier or towards the stacked or laminated body contained therein, representing a direction component perpendicular to the first surface. Through this direction component parallel to the first surface, the pressure is distributed relatively uniformly over the largest possible area of ​​the laminated body, as described above; and through the direction component perpendicular to the first surface, the laminated body is facilitated to detach from the clamping device.

[0029] In some embodiments, at least one fluid channel has a first section and a second section connected thereto; wherein the second section leads into a discharge opening; wherein the orientation of the second section of at least one fluid channel is inclined relative to the first surface and relative to the normal of the first surface or relative to the clamping direction of the clamping device; and wherein the first section of at least one fluid channel extends parallel to or substantially parallel to the normal of the first surface or parallel to the clamping direction of the clamping device. As described above, the second section facilitates the detachment of the laminate from the clamping device and facilitates a pressure distribution that is as uniform as possible over the largest possible area of ​​the laminate. Conversely, the first section is used to supply compressed air to the second section. Here, the first section may extend substantially along the longitudinal direction of the clamping device (i.e., perpendicular to the first surface) from a first end of the first section to a second end of the first section, wherein the second end of the first section may be located at the transition from the first section to the second section, and the first end of the first section may be located at the end of the clamping device oriented away from the first workpiece carrier. At the first end of the first section, the clamping device is connected to or may be connected to a compressed air source.

[0030] In some embodiments, the clamping device has two or more fluid channels, particularly four, six, or eight, each having a first section and a second section connected thereto, wherein each second section leads into a respective discharge opening, which is distributed particularly evenly or substantially evenly along the circumference of the clamping device. The arrangement of multiple fluid channels, in turn, helps to load the compressed air flowing from the discharge openings onto the surface of the laminate as evenly as possible. The distribution of the discharge openings, particularly their even or substantially even distribution along the circumference of the clamping device, further facilitates this. For example, if the clamping device has a generally cylindrical shape, the discharge openings can be distributed around the central longitudinal axis of the cylindrical clamping device at regular angular distances.

[0031] In some embodiments, the clamping device has at least one fluid channel having a single first section and a plurality of second sections connected thereto, particularly two, four, six, or eight second sections, each second section leading into a respective discharge opening, wherein the discharge openings are distributed particularly evenly or substantially evenly along the circumference of the clamping device. This embodiment, in turn, also helps to load the compressed air flowing from the discharge openings onto the surface of the laminate as evenly as possible. Furthermore, this embodiment simplifies the manufacture and operation of the clamping device. In terms of manufacturing the clamping device, setting a single first section is generally simpler and less technically complex than setting multiple first sections. For example, the first section can extend along most of the longitudinal direction of the clamping device as described above, for example, as a central hole in the clamping device. The second sections can then be provided over a relatively short distance, i.e., from the central hole to the outer periphery of the clamping device. Advantageously, the cross-section of the first section can be larger than the cross-section of a single second section. In particular, the cross-section of the first section can be substantially equal to the sum of the cross-sections of all the second sections connected to it. The operation of the clamping device can also be simplified by setting a single first section, since only the first section of the displacement (instead of multiple first sections) needs to be connected to the compressed air source.

[0032] In some embodiments, multiple, particularly all, discharge openings are centered in a plane extending substantially parallel to the first surface. This also facilitates the application of compressed air flowing from the discharge openings to the surface of the laminate as uniformly as possible. Alternatively, however, the discharge openings can be arranged in different planes parallel to the first surface, for example, in two or three parallel planes, wherein preferably, the discharge openings in one plane are evenly distributed circumferentially around the clamping device. Depending on the location and orientation of the second section, the compressed air flowing from the discharge openings arranged on different planes can be directed to different areas of the laminate surface. For example, compressed air flowing from discharge openings arranged near the first surface can be directed to a nearby area around the clamping device, while compressed air flowing from discharge openings arranged away from the first surface can be directed to a more distant area around the clamping device. Such a design also facilitates the application of compressed air flowing from the discharge openings to the surface of the laminate as uniformly as possible.

[0033] In some embodiments, the area of ​​the first surface, or, if the laminating apparatus has multiple clamping devices, the sum of the areas of the first surfaces of the clamping devices, is at most 20%, or at most 15%, or at most 10%, or at most 5%, or at most 3%, and / or at least 1%, or at least 2%, or between about 1% and 3%, or between about 2% and 3%, of the area of ​​the workpiece carrier used to carry the laminate, or the area of ​​the laminate, or the area of ​​the laminating press. As previously explained, minimizing the extension of the clamping devices in a plane parallel to the laminate surface allows for maximizing the extension of the laminating press or its pressure head in a plane parallel to the laminate surface. The advantages of maximizing the extension of the laminating press or its pressure head in a plane parallel to the laminate surface have also been explained.

[0034] In some embodiments, the first surface is provided with an anti-stick coating, particularly a ceramic anti-stick coating and / or an anti-stick coating made of polytetrafluoroethylene (PTFE). This can also reduce the possibility of the laminate adhering to the clamping device.

[0035] A second aspect of the invention relates to a method for laminating an electrochemical layer stack, the method comprising: - Provide a lamination apparatus according to the first aspect or one of the embodiments described herein; - Provide a layer stack on a movable workpiece carrier for carrying the layer stack, the layer stack being made of substrates stacked on top of each other in a layered manner that will be laminated together into a laminate; - The stacked layers are pressed at least partially against the first workpiece carrier using a clamping device to prevent the stacked layers from slipping; - Pressure is applied to the stack of layers carried by the workpiece carrier, so that the stack of layers is pressed against the workpiece carrier by means of a laminating press, so as to connect the substrates of the stack of layers into a laminate; Remove the clamping device from the stack or laminate made therefrom to release the stack or laminate made therefrom; and - Pressurized fluid is loaded into at least one fluid channel to support the release.

[0036] As already described in conjunction with the first aspect, it is advantageous to press the laminated stack against the first workpiece carrier by means of a clamping device, so that the laminated stack is fixed to prevent slippage before being pressed against the first workpiece carrier by the laminating press. Furthermore, the clamping device preferably fixes the laminated stack to prevent slippage throughout the entire processing performed by the laminating press. For this purpose, it is stipulated that the laminating press or its pressure head is removed from the laminated body made of the laminated stack, while the clamping device continues to press the laminated stack or laminated body against the first workpiece carrier. It is also stipulated that the clamping device is removed from the produced laminated body only after the laminating press or its pressure head has been removed from the produced laminated body, particularly by lifting the clamping device.

[0037] Other optional features will be described below, which may relate to the first aspect, the second aspect, or other implementations thereof.

[0038] In some embodiments, the laminating equipment is configured to continuously secure the laminate to the workpiece carrier via clamping devices from the time the laminate is provided onto the first workpiece carrier until it is joined into a laminate at a laminating press. This provides continuous anti-slip fixation of the laminate during its processing until it is formed into a laminate, thereby preventing manufacturing defects.

[0039] In some embodiments, the first workpiece carrier has an enableable and deactivateable clamping device by which the stacked layers can be clamped and secured to the first workpiece carrier. In this way, when the clamping device is enabled, it can be ensured that the entire stacked layers and the individual substrates stacked therein do not slip; conversely, when the clamping device is deactivated, the workpiece carrier can be loaded and unloaded because the stacked layers are not secured by the clamping device.

[0040] Specifically, the laminating equipment can be configured such that, after the layer stack is manufactured and before it is transported through the laminating equipment, the layer stack carried by the first workpiece carrier is continuously secured by clamping by activating clamping devices, at least until either the laminating equipment completes the entire processing of the layer stack to form a laminate; or during the manufacturing of the laminate in the laminating press, the individual substrates of the layer stack are otherwise prevented from slipping by the laminating press and / or by being connected to form a laminate, after which the clamping devices are deactivated to release the laminate. In this way, the layer stack can be continuously secured from slippage during the processing of the layer stack until it is processed into a laminate, thereby preventing manufacturing defects caused by slippage.

[0041] In embodiments with the aforementioned clamping device, for example, the clamping device can be deactivated without interrupting the fixation of the stacked layers when the pressing device is tasked with securing the stacked layers to the first workpiece carrier. The pressing device can be specifically designed to apply a higher clamping force to the stacked layers than the clamping device, in order to ensure that the stacked layers are reliably secured to or within the first workpiece carrier during a pressing process that typically applies significant force to the stacked layers.

[0042] In some embodiments, the laminating apparatus further includes a preheating device for heating the first workpiece carrier when it is loaded with the stacked layers. The laminating apparatus is configured herein to: (i) convey the first workpiece carrier to the preheating device when it is loaded with the stacked layers, so as to heat the first workpiece carrier using the preheating device; and (ii) subsequently convey the heated and loaded first workpiece carrier to a laminating press to laminate the stacked layers.

[0043] This can achieve several beneficial effects: On the one hand, the stack of layers carried by the first workpiece carrier can be indirectly preheated by heating the first workpiece carrier with the help of a preheating device, thereby shortening the subsequent residence time in the laminating press required for lamination, since less additional heat needs to be introduced into the stack to achieve the connection of the layers. This preheating can be carried out in the laminating equipment, especially during the transport of the first workpiece carrier loaded with the stack of layers to the laminating press, so preheating requires little or no additional time.

[0044] On the other hand, during preheating, because the heated first workpiece carrier transfers heat to the layer stack, layers closer to the first workpiece carrier are exposed to a stronger heat input than layers farther away from the first workpiece carrier, resulting in a temperature gradient starting from the first workpiece carrier. Subsequently, during the lamination process in the laminator, a reverse temperature gradient occurs because layers that are in direct contact with the laminator and farther from the first workpiece carrier are heated faster through the lamination process (via the pressure and / or heat input of the laminator) than layers that are closer to the first workpiece carrier and only indirectly contact the laminator through the first workpiece carrier.

[0045] Therefore, if preheating precedes the pressing process in the laminating press according to the laminating equipment, the temperature gradients in two opposite directions during lamination can at least partially compensate for each other. This allows for the rapid achievement of a favorable, particularly near-constant, temperature profile (Temperaturverlauf) for lamination between layers across the entire stack through the synergistic effect of the two heating methods (one during preheating and the other in the laminating press). This overcomes the situation where heating on one side of the stack lags behind the other (viewed along the stack direction), and shortens the lamination process, thus achieving higher productivity. This is crucial for reducing the total run time of the lamination process, especially when the actual lamination process in the laminating press is the dominant factor affecting the total run time (as is often the case). The latter can be, for example, a situation where the lamination process limits the possible cycle time for a cyclic serial processing (serielle Verarbeitung) of the stack (or a group of stacks that can be processed simultaneously).

[0046] In some embodiments, the preheating device has a heating element for releasing heat to the first workpiece carrier. The preheating device is also configured to bring the heating element into thermal contact with the first workpiece carrier to heat the first workpiece carrier while it is in a preheating position before being conveyed to the laminating press. Specifically, the preheating device can be configured to preheat the heating element itself to a desired temperature so that it can immediately release heat to the first workpiece carrier once thermal contact is formed, without any time loss.

[0047] The term "thermal contact" as used herein should be specifically understood to refer to a situation where a first object (e.g., a first workpiece carrier) is in direct (physical) contact with a second object (e.g., a heating or cooling body) or indirect contact via at least one medium (e.g., a third object) between them, such that heat exchange (supplying and / or dissipating heat) can occur between the first and second objects along a heat conduction path. Here, the thermal conductivity for heat exchange along the heat conduction path is advantageously higher than that of air, preferably at least 1 W / (m²). K), especially at least 10W / (m K).

[0048] In some embodiments, the preheating device is configured such that the heating element is movable between a waiting position and a heating position, for example, horizontally movable or having a horizontal component of movement, wherein the heating element does not form thermal contact with the first workpiece carrier in the waiting position. Conversely, when the heating element is in the heating position, it forms thermal contact with the first workpiece carrier located in the preheating position for heating thereon. This movable heating element particularly provides the option that the heating element can only be introduced into the transport path of the first workpiece carrier and form thermal contact with the first workpiece carrier when the first workpiece carrier, loaded with stacked layers, arrives at the preheating position. This allows the transport path to remain unobstructed during the movement of the first workpiece carrier without adversely affecting subsequent or prior heating of the first workpiece carrier by the heating element.

[0049] In some embodiments, the laminating equipment also includes a transport device for transporting a first workpiece carrier along a predetermined transport path originating from a starting position through the laminating equipment. Here, the transport path extends through multiple spaced-apart, stacked, particularly parallel, e.g., horizontal planes, and the transport device has a lifting mechanism for transporting the first workpiece carrier between two or more planes. In this way, an optimized (i.e., compact) structural configuration regarding the required footprint of the laminating equipment can be achieved, as the various processing stations or related processes along the transport path can be arranged overlapping each other above the footprint. Thus, even with a highly space-compact structure for the laminating equipment, intersections of transport paths within the same plane can be easily avoided, and sections of transport paths that overlap or intersect on different planes can still be accommodated.

[0050] In some embodiments, the transport device is configured to move the loaded first workpiece carrier between a stacked plane that can transport the loaded first workpiece carrier to the lifting device and another stacked plane where the preheating position is located, by means of a lifting device. This allows for plane switching within confined spaces. Specifically, the preheating device can be combined with the lifting device such that the preheating position of the first workpiece carrier is arranged along the movement path of the lifting device, thereby enabling heating of the first workpiece carrier loaded with stacks during plane switching, which significantly saves time.

[0051] In some embodiments, the preheating device includes an induction heating device for heating the first workpiece carrier. This is particularly advantageous for reducing operating time due to the low thermal inertia of the induction heating device. Specifically, the induction heating device can be placed within or on the aforementioned heating body. The first workpiece carrier can be specifically configured to include a current path, such as a conductor loop, for generating eddy currents with ohmic losses along which the induction heating device operates, thereby enabling the heating of the first workpiece carrier using the eddy current losses, especially ohmic losses, generated by these eddy currents.

[0052] In some embodiments, the first workpiece carrier has a thermal conductivity of at least 1 W / (m²) with respect to the heat conduction path. K), especially at least 10 W / (m The thermal conductivity of K) is such that the heat conduction path thermally connects at least one portion located within or above the first workpiece carrier (where heat can be supplied to the first workpiece carrier by means of preheating) to at least one support surface on the first workpiece carrier for accommodating the stacked layers. In this way, heat can be quickly introduced into the first workpiece carrier by preheating, and rapid heat dissipation can also be achieved from the heated first workpiece carrier to the stacked layers it supports.

[0053] In some embodiments, the laminating equipment also includes a cooling device for dissipating heat from the laminate after it has been manufactured by the laminating press. Here, the laminating equipment is configured to convey the first workpiece carrier to the cooling device while the laminate is loaded after it has been manufactured, so that the first workpiece carrier is cooled there (and thus indirectly, the resulting laminate is cooled via the first workpiece carrier). By cooling the laminate carried by the first workpiece carrier using the cooling device, the time required for the laminate to be sufficiently cooled to harden and be output after lamination can be shortened.

[0054] In some embodiments, the cooling device has a first cooling body for cooling the first workpiece carrier. The cooling device is also configured such that when the first workpiece carrier, which carries the laminate, is in a cooling position downstream of the laminator along the transport path, the first cooling body forms thermal contact with the first workpiece carrier to cool the first workpiece carrier.

[0055] Specifically, in some embodiments, the cooling device is designed to allow the first cooling body to move between a waiting position and a cooling position, for example, to move horizontally or have a horizontal movement component. This means that the first cooling body does not make thermal contact with the first workpiece carrier in its waiting position, but does so in its cooling position to cool the first workpiece carrier. Similar to the case of the heating body described above, this movable cooling body particularly provides the possibility that the cooling body can be introduced into the transport path of the first workpiece carrier and make thermal contact with it only when the first workpiece carrier, loaded with the laminate, reaches the cooling position. Therefore, the transport path can remain unobstructed during the movement of the first workpiece carrier without affecting the subsequent or prior cooling of the first workpiece carrier by the cooling body.

[0056] In some embodiments, the cooling device further includes a second cooling body, and the laminating equipment is configured such that the laminate, on its side opposite to the first workpiece carrier, forms thermal contact with the second cooling body to cool the laminate. This allows for bilateral cooling of the laminate and thus faster cooling of the laminate. This also helps to shorten operating time.

[0057] In some embodiments, the preheating and cooling positions of the first workpiece carrier are located on the same plane. Furthermore, the position of the first workpiece carrier during the lamination process via the laminator can also be located on this same plane. Thus, while retaining the advantages of a multi-plane layout regarding other sections of the transport path, the very short paths between the preheating, laminator, and cooling positions, eliminating the need for elevators between them, enable particularly rapid transfer of the loaded first workpiece carrier between these positions.

[0058] In some embodiments, the laminating equipment also includes a stacking device configured to place subsequent layers to be preheated and laminated onto the first workpiece carrier, or to create the layer stack by stacking its layers, while the first workpiece carrier is in the stacking position. This stacking position may be located on a plane different from the preheating and cooling positions. Therefore, the stacking device is arranged upstream of the preheating position along the transport path and can serve as the first processing station of the laminating equipment along the transport path. For example, the stacking device can be arranged entirely or partially below or above other processing stations (preheating unit, laminating press, cooling unit, etc.), thereby achieving an optimized (small) footprint for the laminating equipment, especially since, after the completed layer stack is output, the empty workpiece carrier can be transported back to the stacking device on a different plane from the aforementioned processing station for reloading new layer stacks to be processed. The layer stack can be formed on the workpiece carrier by the stacking device and secured immediately after completion by clamping, especially before further processing begins. It is also possible to simultaneously load multiple workpiece carriers in a sequential arrangement.

[0059] In some embodiments, the laminating apparatus also includes a welding device configured to weld the lead contacts of the same polarity electrodes of the laminate together when the first workpiece carrier is in the welding position. This welding position may be located on a plane different from the preheating and cooling positions. The advantages of a multi-planar layout also apply here. The welding device may be located downstream of the cooling position, particularly with respect to the transport path, so that welding is performed in a state where the laminate has cooled and therefore has more stable mechanical properties (compared to its heated state before cooling).

[0060] In some embodiments, the laminating apparatus further includes a movable transport carrier for carrying the first workpiece carrier. Here, the laminating apparatus is also configured to, on the one hand, move the first workpiece carrier segment by segment through the laminating apparatus while being carried by the transport carrier during the processing of the laminated layers, and on the other hand, convey the first workpiece carrier loaded with the laminated layers to a laminating press without a transport carrier to manufacture the laminate. Specifically, the laminating apparatus can also be configured to, before and / or after manufacturing the laminate by the laminating press, move the first workpiece carrier segment by segment through the laminating apparatus while being carried by the transport carrier.

[0061] This structural design with a transport carrier is particularly suitable for scenarios where a first workpiece carrier needs to be transported segment by segment along a transport path using transport equipment, which is designed to transport one or more transport carriers (distinct from the first workpiece carrier). Specifically, it can be a transport device designed for a variety of different applications (especially outside of lamination equipment), such as a belt conveyor. Thus, the first workpiece carrier can be particularly adapted for transporting stacked or laminated products, an adaptation that is not necessary for the transport carrier. Since the transport carrier does not participate in the actual lamination process at the lamination press, it does not need to be designed to withstand the pressures acting on the first workpiece carrier during the lamination process in the lamination press, unlike the first workpiece carrier.

[0062] In some embodiments, there is at least one stretcher along which a first workpiece carrier, carried segment by segment by a transport carrier through the laminating equipment, can move along a transport path located on a different plane from the lamination position of the first workpiece carrier when the laminate is manufactured by the laminating press. The laminating equipment can be configured in particular to move the transport carrier along a transport stretcher extending on another plane and thus bypassing the laminating press to a receiving position during the separation of the first workpiece carrier and the transport carrier. At this receiving position, the first workpiece carrier, loaded with the laminate, reassembles with the transport carrier after lamination of the laminate stack by the laminating press, so that the first workpiece carrier can continue to be transported by the transport carrier. This receiving position, with respect to the transport path of the first workpiece carrier, can be located downstream of a cooling device (if present). The advantages of a multi-planar layout are also advantageous here, as the first workpiece carrier and the transport carrier can move space-savingly, particularly asynchronously, and stacked vertically on different planes during their separation.

[0063] In some embodiments, the laminating equipment is further configured to, after removing the laminate processed by the laminating equipment from the first workpiece carrier, return the transport carrier, along with the now empty first workpiece carrier it carries, to the starting position along a return path. This allows for an efficient, particularly periodic (e.g., cyclical) loop process, where the same first workpiece carrier or transport carrier can be reused to process another layer stack. The return path can specifically be located on a plane that is not used as a transport path for moving the first workpiece carrier and / or the transport carrier to the unloading position, where the laminate processed by the laminating equipment is removed from the first workpiece carrier. This approach leverages the advantages of a multi-plane layout and, particularly when multiple first workpiece carriers and transport carriers are moving simultaneously within the laminating equipment, easily avoids collisions between them. The transport carrier may have a first cooling element.

[0064] In some embodiments, the laminating apparatus has N other workpiece carriers besides the first workpiece carrier, particularly workpiece carriers with the same structure as the first workpiece carrier, each of which is configured to receive its respective layer stack. Here, N is a natural number, and the laminating apparatus is configured to process each of the N+1 workpiece carriers, including its respective layer stack, in the same manner to produce its respective laminate from the layer stack, particularly as described above in connection with the various embodiments of the laminating apparatus for the first workpiece carrier. Therefore, at most N+1 layer stacks can be simultaneously carried by a single workpiece carrier in the laminating apparatus and processed in the same manner, particularly sequentially, in grouped synchronous processing, or a combination of both. This can further improve the throughput and efficiency of the laminating apparatus.

[0065] Specifically, according to some embodiments, the laminating apparatus can be configured to process multiple stacks of layers to be processed on a given workpiece carrier within a parallel processing framework, so as to form a corresponding laminate from each stack of layers. Here, the laminating apparatus can also be specifically configured to maintain a predetermined relative arrangement between the workpiece carriers to be processed in parallel within the parallel processing framework, but the spacing between adjacent workpiece carriers in this arrangement is variable, such that the spacing between each pair of workpiece carriers during the lamination process on the laminating press is greater than the spacing between the workpiece carriers during at least one common transport segment located before or after the laminating press. The relative arrangement can be specifically defined such that the workpiece carriers are arranged parallel to each other with the same orientation.

[0066] The laminating equipment described herein includes a transport device and a lifting device. The transport device moves the first workpiece carrier along a predetermined transport path from the starting position through the laminating equipment. This transport path crosses multiple spaced-apart stacked planes. This structural design can also be used in principle in (other) laminating equipment that does not have the aforementioned preheating for stacking electrochemical layers. This also applies to all other embodiments and any combinations thereof described herein, provided they themselves do not technically require preheating.

[0067] This application also discloses another method for laminating an electrochemical layer stack, the method comprising: (i) providing the layer stack on a movable first workpiece carrier for carrying the layer stack, the layer stack consisting of substrates stacked on top of each other in a layered manner to be joined into a laminate by lamination; and (ii) applying pressure to the layer stack carried by the first workpiece carrier after heating, such that the layer stack is pressed against the first workpiece carrier by means of a lamination press, so as to join the substrates of the layer stack into a laminate. Here, the layer stack is continuously fixed to the workpiece carrier by a clamping device from the time it is provided to the workpiece carrier until it is joined into a laminate at the lamination press.

[0068] In particular, the method may also include heating a first workpiece carrier on which the stacked layers are loaded before the layers are joined into a laminate using a laminating press.

[0069] The latter method can be configured in particular to be performed using the lamination apparatus described herein, especially according to one or a combination of two or more embodiments of the lamination apparatus described herein. The lamination apparatus described herein can be specifically configured to perform the method described herein.

[0070] The features and advantages described in this article regarding the lamination apparatus also apply to the methods disclosed herein. Attached Figure Description

[0071] The advantages, features and applications of the present invention will now be described in detail with reference to the accompanying drawings.

[0072] Figure 1 An exemplary embodiment of the lamination apparatus is illustrated in a schematic cross-sectional view, which also shows the corresponding sequence of method steps for laminating a stack of layers using the lamination apparatus.

[0073] Figure 2 An exemplary embodiment of a workpiece carrier is shown in different views, the workpiece carrier loading a stack of layers to be laminated or a laminate already made therefrom.

[0074] Figure 3 Shown in different views Figure 2 An exemplary embodiment of a fixture for a workpiece carrier.

[0075] Figure 4 A perspective view shows the container Figure 2 An exemplary embodiment of the transport carrier for the workpiece carrier.

[0076] Figure 5An exemplary embodiment of the preheating device is shown in cross-sectional view, wherein a workpiece carrier loaded with stacked layers is located in the preheating position of the preheating device, where the workpiece carrier can be heated by an induction heating device.

[0077] Figure 6A An exemplary implementation of an arrangement of multiple workpiece carriers requiring parallel processing is shown in a top view.

[0078] Figure 6B A top-down view shows the method for joint grasping. Figure 6A An exemplary embodiment of a gripping device for a workpiece carrier.

[0079] Figure 6C yes Figure 6B A perspective view of the gripping device.

[0080] Figure 7A -C indicates a series of poses of the laminator during lamination.

[0081] Figure 8 A longitudinal section of an exemplary clamping device for a laminating apparatus is shown.

[0082] Figure 9 It shows Figure 8 Top view of the central clamping device.

[0083] Figure 10 A flowchart illustrating an exemplary method for laminating an electrochemical layer stack is shown schematically. Detailed Implementation

[0084] In the accompanying drawings, the same reference numerals denote the same, similar, or corresponding elements. The elements shown in the drawings are not necessarily drawn to scale. Rather, the various elements shown in the drawings are reproduced in a manner that will allow those skilled in the art to understand their function and general purpose. Unless otherwise expressly stated, the connections and couplings between the functional units and elements shown in the figures may also be implemented as indirect connections or couplings.

[0085] Figure 1 A laminating apparatus 100 according to an exemplary embodiment is shown in cross-sectional view (in a cross-sectional plane developed by coordinates X and Z). The laminating apparatus 100 has a plurality of processing stations 102 to 110 arranged along the production line.

[0086] The laminating equipment 100 has a transport system and a workpiece carrier 200 (see...). Figure 2 The workpiece can be moved from one processing station to another along the production line using this transport system. Here, the transport system is designed to allow the workpiece carrier to be placed in sections onto another carrier (here referred to as transport carrier 400) and transported along the production line (see [link]). Figure 4 ).

[0087] exist Figure 1 In the XZ plane, the outbound transport path 114 of the workpiece carrier 200 extending between the first processing station 102 and the last processing station 110 is shown, as well as a segmentally overlapping outbound transport path 114 extending between processing stations 102 and 110. However, it is also conceivable that the transport path may include segments having at least one Y-direction component extending orthogonally to the XZ plane. Similarly, a common return transport path 118 is also shown, which returns from processing station 110 to the first processing station 102 and is traversed by the workpiece carrier along with the transport carrier 400 carrying the workpiece carrier during the operation of the laminating equipment 100.

[0088] The transport path 114 extends in one segment within a first (upper) plane 120 extending along the X / Y direction, and in other segments within a second (intermediate) plane 122 located below it, also extending along the X / Y direction. The transport path 116 extends continuously in the intermediate plane 122 to the last processing station. The common return transport path 118 for the workpiece carrier 200 and the transport carrier 400 extends in a third (lower) plane 124 located further below plane 122, which also extends along the X / Y direction. To enable the workpiece carrier 200 to switch planes along the transport path 114 and the two carriers to switch planes downwards to the return transport path 118, the laminating equipment 100 has a lifting device designed for this purpose.

[0089] Optionally, laminating equipment 100 (such as...) Figure 1 (As shown) There may be one or more additional processing stations 112 along the production line after processing station 110. In this case, unlike the aforementioned transport paths, the outbound transport paths 114 and 116 extend to the final processing station 112, and the return transport path originates from this final processing station 112. Such a processing station 112 may be, for example, an output device for laminates that can be manufactured by means of laminating equipment 100, or a laminatstapler for stacking laminates after manufacturing.

[0090] A stacking device is provided at the starting point of the production line as a processing station 102. This stacking device is configured to stack multiple different substrates into an electrochemical layer stack 204 (see [link]). Figure 2 For example, the layer stack 204 may have a repeating sequence of anode / cathode pairs, with a separator introduced between the anode and the cathode.

[0091] This type of layer stack 204 is known in particular as an electrode stack for high-voltage batteries used to power vehicle drives, such as as an electrode stack for lithium-ion battery cells, especially in the form of pouch-Zelle cells. Other examples of electrochemical layer stacks have been mentioned above (e.g., MEAs or MEAFAs for fuel cells).

[0092] When stacking is performed on the stacking device 102, the individual substrates are stacked in a desired order, such as the order suitable for connecting basic units (anode, separator, cathode) in series to form a battery cell: anode-separator-cathode / anode-separator-cathode / etc. Here, the layer stack has already been built on the workpiece carrier 200 for subsequent processing, or it is placed on the workpiece carrier 200 as a whole or in batches as a sub-stack after stacking is completed. For efficiency reasons, it may be advantageous to build the layer stack 204 directly on the workpiece carrier 200.

[0093] The next processing station along the production line is a preheating device 104, which is configured to heat (preheat) the layer stack 204 carried by the workpiece carrier 200 to a desired target temperature before actual lamination (where the layer stack is joined and connected into a laminate). Depending on the type of lamination to be performed (e.g., hot lamination), preheating can be particularly used to heat the adhesive present on one or more substrates or the substrate material itself to near or at a bonding temperature suitable for subsequent lamination.

[0094] The preheating device 104 has a heating element 126 that can be introduced, particularly pivoted or pushed into the transport path 114 or below the first (upper) plane 120, particularly between the first (upper) plane 120 and the intermediate plane 122, such that the heating element is directly adjacent to the workpiece carrier 200 or even forms thermal contact with it to heat the workpiece carrier and thereby introduce heat into the stack 204 to bring it to the target temperature.

[0095] The heating element 126 may be permeated by one or more channels through which a heating fluid can be guided to heat the heating element. Additionally or alternatively, the heating element 126 may have an induction heating device designed to generate an alternating magnetic field within the workpiece carrier 200 or a portion thereof, thereby inducing lossy eddy currents therein to heat the workpiece carrier. This will be referred to below. Figure 5 To explain in more detail.

[0096] The next processing station along the production line is a laminator 106, which is configured to bond the individual substrates of the layer stack 204 into a multilayer laminate by applying pressure (pressing) and optionally supplying additional heat. The laminator 206 will be referred to below. Figure 7A -C provides a more precise explanation.

[0097] During the pressing process, the stacked layers are pressed by a press against the heated workpiece carrier 200 that carries them. As a result, a first temperature gradient is typically generated by the pressing process itself, originating from the stack side facing away from the workpiece carrier 200 and directly in contact with the press; on the other hand, a second temperature gradient exists at the beginning of the pressing process due to preheating, originating from the workpiece carrier 200. These two temperature gradients superimpose during pressing, resulting in a modified, approximately uniform temperature profile overall along the stacking direction of the substrate.

[0098] Therefore, by utilizing preheating at preheating device 104 and lamination at laminating press 106, two time-staggered heating processes are provided to heat the layer stack to the desired bonding temperature. Since the layer stack 204 already has a temperature at least close to the target bonding temperature after preheating at preheating device 104, the lamination process at laminating press 106 requires little or no time to heat the layer stack 204 to the bonding temperature.

[0099] In this way, efficiency gains can be achieved, especially when the laminating equipment is set to cycle-operation, in which multiple stacks of layers, each placed on its respective workpiece carrier 200, are processed simultaneously at different processing stations at the same cycle. For example, a stack of layers can be joined into a laminate at the laminating press 106, while the next stack of layers to be laminated is preheated in the preheating device 104.

[0100] The next processing station along the production line is a cooling device 108, which is configured to cool the laminate formed by the layer stack 204 in the laminator, particularly to reinforce any material fit that may form during the lamination process if necessary. For this purpose, the cooling device has a first cooling body 128, which may be designed to be movable, similar to a heating body 126, so that when the workpiece carrier 200 is in a cooling position on the cooling device 108 for cooling, the first cooling body can be introduced into the transport path 114 to form thermal contact with the workpiece carrier 200. Additionally, the cooling device 108 has a second cooling body 130, which may also be movable and is configured to form direct thermal contact with the laminate, for example, with the side of the laminate opposite to the workpiece carrier 200. Thus, the laminate can be cooled efficiently and rapidly from multiple sides. The first cooling body 128 and / or the second cooling body 130 can be cooled, particularly by a coolant, which can be guided through one or more channels formed in the first and / or second cooling bodies.

[0101] like Figure 1 As shown, transport paths 114 and 116 extend separately from each other in the areas of the preheating device 104, the laminating press 106, and the cooling device 108, but overlap in other parts. This has the advantage that the transport carrier 400 does not need to be designed for the high heat or mechanical loads that occur during the preheating, pressing, and cooling processes. In particular, a transport system that is also suitable for other applications can be used and does not need to be specifically designed for the lamination process. In other embodiments, the use of the transport carrier 400 can be omitted.

[0102] Along the production line, (depending on the type of laminate) optionally, the next processing station is a welding device 108, which is configured to connect the same polarity electrode contacts of the laminate 204 by welding, in the case that the laminate 204 is an electrode stack. Here, the electrode contacts can be designed in a manner known to those skilled in the art as lead tabs 206a (positive) and 206b (negative) extending from the laminate side (see...). Figure 2 ).

[0103] Optionally, certain processing stations can exist in dual form, particularly the preheating device 104, the laminating press 106, and / or the cooling device 108. In this case, the transport path may also include a section having at least one Y-direction component extending orthogonally to the XZ plane, so as to transport the workpiece carrier 200 loaded with the stack 204 to these additional processing stations.

[0104] Figure 2Exemplary embodiments of the workpiece carrier 200 are shown in different figures (a) to (d), wherein the workpiece carrier is first loaded with the laminate stack 204 to be laminated, or loaded with the laminate already made therefrom after lamination, depending on the processing state. Figures (a) and (b) are lateral sectional views along the longitudinal or end sides of the loaded workpiece carrier 200, respectively. Figure (c) is a top view of the laminate stack 204 or the laminate and the workpiece carrier 200 loaded with the laminate stack or the laminate, and Figure (d) is a corresponding perspective view.

[0105] The workpiece carrier 200 has a highly conductive substrate 202, particularly a metal substrate. One of its main surfaces is used to accommodate the stack 204 or a laminate formed by the stack during processing on a support surface, and to carry the stack or laminate along the production line. To prevent the stack 204 or laminate from sliding on the workpiece carrier, a plurality of clamps 208 are arranged laterally on the support surface, each clamp being configured to press the stack 204 or laminate against the workpiece carrier 200 to secure it by clamping action. Reference will be made below. Figure 3 Fixture 208 is described in more detail.

[0106] Additionally, the workpiece carrier 200 also has a plurality of particularly nail-head shaped greifpins 210 on its substrate 202, so as to enable gripping via gripping devices (see [link to relevant documentation]) when loading and / or unloading the workpiece carrier into and / or from the laminating equipment 100, and during transport of the workpiece carrier along the production line, particularly by means of a lift. Figure 6B It can easily and reliably grasp and manipulate workpiece carriers 200.

[0107] Figure 3 Shown in different diagrams (a) to (d) Figure 2 An exemplary embodiment of the fixture 208 for the workpiece carrier 200. Figures (a) and (b) are lateral sectional views along the longitudinal and end sides of the fixture 208, respectively. Figure (c) is a top view of the fixture 208 along the direction of viewing the workpiece carrier 200, and Figure (d) is a corresponding perspective view.

[0108] The clamp 208 has a base 302 for securing the clamp 208 to the workpiece carrier 200 and for (direct or indirect) retaining structures for other components of the clamp 208. A clamping lever 304 is pivotally mounted on the base 302 about a pivot axis 306. The spring 308 can, in particular (as shown), be designed as a torsion spring supported on a bolt-type spring carrier 314, arranged to apply a torque about the pivot axis 306 to the clamping lever 304. The spring carrier 314 can, in particular, be secured to the base by means of a washer 316.

[0109] A cylindrical roller 310, rotatably supported about its axis of symmetry, is arranged at one end of the clamping lever 304. A clamping block 312, rotatably supported about its central axis, is arranged at the other end of the clamping lever 304. This clamping block may have a basic cylindrical shape, but optionally, a flat partial surface is constructed on its circumferential surface to allow for flat placement of the clamping block on the laminate. A spring 308 is arranged such that the torque it applies to the clamping lever 304 compresses the clamping block along the direction of the substrate 202 with at least a directional component, thereby clamping the laminate when it is located between the support surface on the substrate 202 and the clamping block. The roller 310 is used to temporarily open the clamp 308 during the lamination process in the laminator 106 by means of a clamp opener 710 acting on the roller 310, details of which will be referred to below. Figures 7A to 7C Detailed explanation.

[0110] Figure 4 Perspective view showing the use of receiving Figure 2 An exemplary embodiment of the transport carrier 400 of the workpiece carrier 200. The transport carrier 400 has a support plate 402, in which one or more recesses 404 may optionally be constructed (as shown). These recesses may be through holes, simple recesses, or a combination of both. These recesses may be specifically configured to reduce weight and / or accommodate protrusions of the workpiece carrier 200 (if present). Additionally, one or more stops 406 may be provided for orientation and lateral fixation of the workpiece carrier 200 during placement on the transport carrier 400 and subsequent transport.

[0111] Figure 5 A cross-sectional view illustrates an exemplary embodiment of the preheating layout 500, wherein a workpiece carrier 200, loaded with a stack of layers 204, is positioned at a preheating location in the preheating device 104, on a heating element 126. The heating element 126 has an induction heating device 502 supported by a support structure 504, configured to heat the substrate 202 of the workpiece carrier 200 by inducing lossy eddy currents, thereby indirectly heating the stack of layers. The heating element 126 may be specifically configured to accommodate multiple, for example four, six, or eight workpiece carriers 200, each loaded with a corresponding stack of layers 204.

[0112] In addition, a lifting device with a vertically adjustable gripper can be provided, which lifts one or more workpiece carriers 200 from the intermediate plane 122 over the moving plane of the heating body 126 by gripping pins constructed on the workpiece carrier, and places the one or more workpiece carriers 200 on the heating body 126 after the heating body 126 has moved.

[0113] Figure 6A An exemplary embodiment of a layout 600 of a group of multiple (four in this case) workpiece carriers 200a to 200d is shown in top view, wherein a laminating apparatus 100 is configured to simultaneously transport the group of workpiece carriers 200a to 200d along the production line in a parallel processing framework, and simultaneously process the stacked layers 204 or laminates formed by the stacked layers. Specifically, the group of workpiece carriers 200a to 200d can be preheated simultaneously, then processed simultaneously in a laminating press, and then cooled simultaneously in a cooling device 108. Stacking on the stacking device 102 and / or welding in the welding device 110 can also be performed simultaneously for the entire group, as well as processing at any other processing station 112.

[0114] According to the design of the laminating equipment 100, the group of workpiece carriers 200a to 200d can be transported, in particular, separately by their own transport carriers 400, or jointly on a single transport carrier 400, along those overlapping sections of transport paths 114 and 116. Furthermore, at least in the former case, the laminating equipment 100 can be defined or configured such that the movement of the transport carrier 400, and thereby the movement of the group of workpiece carriers 200, can be relative to each other with a variable relative spacing 602. For example, this can be achieved by setting the relative spacing 602 in the laminating press area to be different from, and particularly larger than, the areas of the preheating device 104 and / or the cooling device 108. Thus, for example, the increased space requirements of the laminating tools during the lamination process can be met.

[0115] Figure 6B and Figure 6C This is shown in more detail, in which, Figure 6B An exemplary embodiment of a gripping device 604 for simultaneously gripping one or more workpiece carriers 200 to be processed concurrently is shown. More precisely, Figure 6B A top-down view exemplifies the method for simultaneous grasping. Figure 6A One embodiment of the four parallel-oriented workpiece carriers 200a-d. The gripping device 604 consists of two components 608a or 608b, which are structurally identical except for their mirror-image design, and are oriented along the X-direction respectively. Figure 6C The perspective view in the middle illustrates component 608a more accurately.

[0116] Components 608a and 608b each have one or more grippers 606 for each workpiece carrier to be gripped; in this example, each workpiece carrier corresponds to two grippers 606. Grippers 606 corresponding to the same workpiece carrier 200 form a group and have a fixed spacing 614 relative to each other. This spacing is defined such that the group of grippers 606 can grip the gripping pins 210 of the workpiece carrier 200 arranged on the side of the workpiece carrier 200 facing the gripper, thereby enabling the workpiece carrier 200 to be gripped and moved in a controlled manner, particularly raised and / or lowered. Conversely, as described above, the spacing 602 between adjacent groups is adjustable. This can be achieved, in particular, by mounting each group on a carriage that is translatably mounted along a track 610 in the X direction. To adjust the spacing 602, an actuator (not shown) arranged on the track 610 can be provided for translating each group or its corresponding carriage. To enable all groups or grippers to move together in the X direction, a drive 612, in particular a spindle drive (Spindelantrieb), can be provided.

[0117] In order for the gripper 606 to move from its respective component 608a, b along the Y direction toward (and then away from) its respective gripping pin 210 (see movement arrow 616), so that the gripper 606 can grasp the gripping pin 210, the components 608a, b also additionally have bidirectional actuators for this movement.

[0118] Thus, the gripping device 604 can be used to grip and move the workpiece carriers 200 to be processed simultaneously (or, in the absence of purely serial processing, possibly a single workpiece carrier 200), especially when lifting or lowering via a lifting device. This can be particularly used to lift the workpiece carriers 200 from their respective corresponding transport carriers 400, or conversely, to place them on the transport carriers.

[0119] Figure 7A -C shows a series of poses 700 of the laminator 106 during lamination. Figure 7A Figure (a) shows the initial position of the lamination process. The laminator 106 has an upper tool 702 and a lower tool 704 as lamination tools. Here, the workpiece carrier 200, together with the stack 204 fixed thereon by means of a clamp 208, is supported on the lower tool 704. The upper tool 702 is arranged at least partially movably relative to the lower tool so that the stack 204 together with the workpiece carrier 200 can be pressed down onto the lower tool 704 in the pressing position. Furthermore, the upper tool 702 and / or the lower tool 704 may be heatable, and one or both lamination tools may be elastically supported (not shown), particularly to achieve a limitation on the maximum clamping pressure.

[0120] The upper tool 702 has a pressure head 714 for applying pressure to the stack 204 as the pressure head 714 moves toward the stack 204 as described below. However, in the initial pose shown in Figure (a), the upper tool is neither in contact with the workpiece carrier 200 nor with the stack 204 placed thereon.

[0121] In addition, the upper tool 702 has one or more clamping devices 706, each clamping device being elastically supported by a clamping spring 708 (e.g., a coil spring, leaf spring element, gas spring, or pneumatic cylinder), and each clamp 208 for the workpiece carrier 200 has a clamp opener 710 elastically supported by a clamp opener spring 712 (e.g., a coil spring).

[0122] Figure 7A Figure (b) shows a subsequent pose in which the laminator 106, or more precisely the upper tool 702, has left the initial pose and moved toward the lower tool 704, such that the clamping device 706 is just in contact with the stack 204. However, the clamp opener 710 has not yet come into contact with the workpiece carrier 200.

[0123] Figure 7B Figure (c) shows another subsequent pose in which the upper tool 702 moves further toward the lower tool 704, such that the clamping device 706 now applies pressure to the stack 204, thereby additionally securing it to the workpiece carrier 200. Furthermore, the clamp opener 710 comes into contact with the corresponding clamps 208 of the workpiece carrier 200, more precisely, with their rollers 310. However, the clamps 208 remain closed, thus still contributing to securing the stack 204 to the workpiece carrier 200.

[0124] Figure 7B Figure (d) shows yet another subsequent pose in which the upper tool 702 moves further toward the lower tool 704, causing the clamping device 706 to apply further pressure to the stack 204 and thus secure the workpiece carrier 200. Now, each clamp opener 710 presses against the roller 310 of its respective clamp 208, and here applies a stronger torque to the clamping lever 304 of the clamp 308, which reacts with the spring action of the spring 308, causing the clamping lever to open and release its clamping effect on the stack. Thus, the task of securing the stack 204 to the workpiece carrier 200 has been uninterruptedly transferred from the clamp 308 to the clamping device 706.

[0125] Figure 7CFigure (e) shows another subsequent pose in which the upper tool 702 moves further toward the lower tool 704, such that relative to the position in Figure (d), the clamping lever 304 of the clamp 308 pivots further under the pressure of the clamp opener 710, and completely clears the path of the pressure head 714 toward the stack 204, which is still secured by the clamping device 706.

[0126] Figure 7C Figure (f) in the diagram finally shows another subsequent pose in which the upper tool 702 moves further towards the lower tool 704, such that the indenter 714 is placed on the stack 204 and presses it against the workpiece carrier held by the lower tool 704, so as to fuse the stack 204 into a laminate under pressure and, if necessary, heat input supplied by the heatable laminating tools 702 and / or 704. The clamping device 706 and the clamp opener 710 are now both significantly compressed. Preferably, the dimensions of the surface of the indenter 714 that contacts the stack 204 are designed to completely cover or overlap the surface of the stack 204 it faces.

[0127] Subsequently, the laminator can be opened by raising the upper tool 702, and the workpiece carrier 200, along with the original stack 204 it carries, now transformed into a laminate, is transported out and further processed along the production line. This transport can be achieved, in particular, by means of the gripping device 604 (see...). Figure 6B This is achieved as shown in Figure 6c). Here, the spacing 602 between the workpiece carriers can also be changed, or in particular reduced, before, during, or after reaching the subsequent processing station (cooling device 108).

[0128] The initial loading of the workpiece carrier 200 at the stacking device 102 can be performed in a similar manner with respect to the operation of the clamp 308. This means that the stacking device 102 also has a clamp opener with the same or different construction as the clamp opener 710, so as to first open the clamp 308 by applying pressure on the corresponding roller 310, at least open it enough to allow it to enter the corresponding loading posture, so that the layer stack 204 can be placed on the support surface of the workpiece carrier without being obstructed by the clamp 308. This loading posture can specifically correspond to Figure 7C The pose of clamp 308 is shown in diagram (f).

[0129] Figure 8 An exemplary embodiment of the clamping device 706 of the laminating apparatus 100 is shown in longitudinal sectional view. Figure 9 It shows Figure 8 Top view of the intermediate clamping device 706. Figure 9 The section line "AA" in the text indicates Figure 8The plane in which the longitudinal sectional view is located, that is, the plane in which the central longitudinal axis 725 of the gripping device 706 is located. Figure 9 The top view shown corresponds to the view from... Figure 8 A view of the clamping device 706 in the direction shown on the left side of the clamping device 706.

[0130] The following will also refer to Figure 8 and Figure 9 .

[0131] exist Figure 8 and Figure 9 In one embodiment, the clamping device 706 has a generally cylindrical shape, but it may also have a different shape, such as having a rectangular or octagonal cross-section.

[0132] As already Figure 7A As shown in -C, the axial end of the clamping device 706, i.e. Figure 8 The end shown on the right is configured to press the layer stack 204 or the laminate 204 made therefrom against the workpiece carrier 200 to prevent the layer stack 204 from slipping, particularly before or during the actual lamination process. Figure 8 At the end of the clamping device 706 shown on the right, the clamping device has an end face 722, also referred to herein as the "first surface" 722. The first surface 722 may be provided with an anti-stick coating 722 to inhibit the adhesion of the laminate 204. The first surface 722 may be as smooth as possible or have a certain roughness, particularly less than 10 µm. In the example shown, the first surface 722 extends in a plane perpendicular to the longitudinal axis 725 of the clamping device 706.

[0133] exist Figure 8 In the middle, a slender rod 721 is connected to the left side of the first surface 722. The rod 721 has a hole 731 concentrically arranged with respect to the central longitudinal axis 725 of the clamping device 706, which forms the first section 731 of the fluid passage 720. A clamping spring 708 (see...) Figure 7A -C) can also be arranged in hole 731, but Figure 8 and Figure 9 Not shown in the image. Figure 8 The end of the clamping device 706, shown on the left and opposite the first surface 722 (also referred to herein as the first end of the first segment 731 of the fluid channel 720), is configured to connect to a fluid source, such as a compressed air source (not shown). The rod 721 tapers slightly compared to the first surface 722 to allow for guiding the rod 721 (see [reference needed]). Figure 7A -C), without taking up more space in the plane perpendicular to the longitudinal axis 725, thus leaving as much space as possible for the pressure head 714.

[0134] The first segment 731, or hole 731, is essentially constructed as a blind recess. The second end of the first segment 731, opposite the first end, is located near the first surface 722, but does not reach it. At this second end of the first segment 731, a plurality of second segments 732 of the fluid passage 720 are connected to the first segment 731; in the illustrated example, there are eight such second segments 732. The second segments 732 are inclined outwards to the vicinity of the first surface 722, but do not enter the first surface 722; instead, they exit onto or within a cylindrical surface 723, which is also referred to herein as the second surface 723. Thus, in the illustrated example, eight discharge openings 724 of the second segments 732 of the fluid passage 720 are located in the second surface 723. These discharge openings 724 are distributed at a uniform angular spacing around the circumference of the clamping device 706, and are therefore staggered by 45° in this example. All eight discharge openings 724 are centered in a plane that is small in distance from and parallel to the first surface 722.

[0135] Since the second section 732 of the fluid channel 720 is in fluid connection with the first section 731 at the second end of the first section 731, therefore at the first end of the first section 731 ( Figure 8 Compressed air introduced into the fluid channel 720 at the left side of the middle section can flow through the first section 731, then through the second section 732, and finally out through the discharge opening 724. Since the second section 732 is inclined relative to the first surface 722 and also relative to the longitudinal axis 725 (45° in the illustrated example), the compressed air flowing out of the discharge opening 724 is guided radially outward and thus can act on a relatively large area of ​​the laminate 204. Furthermore, the inclination of the second section 732 (i.e., particularly the axial component oriented through the second section 732) also generates a pressure on the laminate 204, which promotes the detachment of the laminate 204 from the first surface 722 of the clamping device 706 when the clamping device 706 is lifted.

[0136] When manufacturing the second section 732 of the fluid channel 720, for example by drilling an oblique hole from the outside of the clamping device 706, the narrowing of the rod 721 and the inclined orientation of the second section 732 should be taken into account. In particular, it should be ensured that the drilling of the second section 732 is at any potentially critical location (in... Figure 8 (Marked with a small circle) It does not penetrate the second surface. That is, the second section 732 should only connect to the first section 731 and penetrate the second surface 723 at the discharge opening 724, otherwise it should be hermetically sealed.

[0137] While an embodiment in which the individual substrates of a laminate are horizontally oriented and the laminator applies pressure to the laminate from above has been described herein, it should be understood that the laminator can also be used from other orientations, or alternative embodiments of the laminator can be considered where the individual substrates of the laminate are not horizontally oriented, or where the laminator applies pressure to the laminate not from above, but for example from below. Accordingly, directional indications used herein, such as “up,” “horizontal,” “lift,” etc., should be interpreted as also covering these alternative orientations or embodiments.

[0138] Figure 10 A flowchart of an exemplary method for laminating an electrochemical layer stack is schematically shown. After the method begins (40), a lamination apparatus 100 as described above is provided (41). Furthermore, a layer stack 204, consisting of substrates stacked on top of each other and to be laminated into a laminate body 204, is provided (42) on a movable workpiece carrier 200; 200a, ..., 200d of the lamination apparatus 100. The layer stack 204 is then pressed at least partially against (43) the workpiece carrier 200; 200a, ..., 200d by means of a clamping device 706 of the lamination apparatus 100 to prevent the layer stack 204 from slipping. Then, or simultaneously, pressure (44) is applied to the stack 204 carried by the workpiece carriers 200; 200a, ..., 200d, such that the stack 204 is pressed against the workpiece carriers 200; 200a, ..., 200d by means of the laminating press 106 of the laminating apparatus 100, so as to connect the substrates of the stack 204 into a laminate 204. Then, the clamping device 706 is removed (45) from the stack 204 or the laminate 204 made therefrom, so as to release the stack 204 or the laminate 204 made therefrom. Here, pressurized fluid is loaded into at least one fluid channel 720 of the clamping device 706 to support the release. The method (46) can then be terminated.

[0139] While at least one exemplary embodiment has been described above, it should be noted that numerous variations are possible. It should also be noted that the described exemplary embodiments are merely non-limiting examples and should not in any way limit the scope, applicability, or configuration of the apparatus and methods described herein. Rather, the foregoing description will provide those skilled in the art with instruction in implementing at least one exemplary embodiment, wherein it should be understood that various changes may be made to the function and arrangement of the elements described in the exemplary embodiments without departing from the subject matter determined in the appended claims and their legal equivalents.

[0140] List of reference numerals

[0141] 100 lamination equipment

[0142] 102 Stacking device

[0143] 104 Preheating device

[0144] 106 Lamination Press

[0145] 108 Cooling device

[0146] 110 Welding Equipment

[0147] 112 Other possible processing devices for laminates, such as output devices for manufactured laminates or laminate stacking machines.

[0148] 114. Transportation route (outbound) of the workpiece carrier

[0149] 116. Transport route (outbound) of the transport vehicle.

[0150] 118 Common return transport path (return trip) for workpiece carrier and transport carrier.

[0151] 120 Upper plane

[0152] 122 Intermediate Plane

[0153] 124 Lower plane

[0154] 126 Heating element

[0155] 128 First (Lower) Cooling Unit

[0156] 130 Second (Upper) Cooling Unit

[0157] 200, 200a-d Workpiece carrier, loaded with stacked or pre-fabricated laminates.

[0158] 202 Substrate of workpiece carrier

[0159] 204 layers stacked or already fabricated laminate

[0160] 206a Electrical lead-out tab for the positive electrode of a laminate / stacked body

[0161] 206b Electrical lead-out tab for the negative electrode of a laminate / stacked body

[0162] 208 Clamps with elastic clamps

[0163] 210 Capture Pin

[0164] Various views of fixture 208 (300)

[0165] 302 Base

[0166] 304 clamping lever

[0167] 306 The pivot axis of clamping lever 304

[0168] 308 Spring

[0169] 310 roll

[0170] 312 Clamping Block

[0171] 314 Spring Carrier

[0172] 316 washers

[0173] 400 transport vehicles

[0174] 402 bearing plate

[0175] 404 Stainless steel bearing plate: recesses (depressions or through holes)

[0176] 406 Stops for orienting workpiece carriers on transport vehicles

[0177] 500 preheating layout

[0178] 502 Induction heating devices, especially planar induction heating devices

[0179] 504 Carrier structure for induction heating devices

[0180] Layout of 600 multiple workpiece carriers for parallel processing

[0181] 602 Spacing between adjacent workpiece carriers

[0182] A series of positions of the 700 laminator during the lamination process

[0183] 702 Upper Tools

[0184] 704 Lower Tools

[0185] 706 Clamping Device

[0186] 708 Compression Spring

[0187] 710 Clamp Opener

[0188] 712 Clamp Opener Spring

[0189] 714 pressure head

[0190] 720 Fluid Channel

[0191] 721 pole section

[0192] 722 First surface, anti-stick coating

[0193] 723 Second Surface

[0194] 724 Discharge opening

[0195] 725 Center (longitudinal) axis, pressing direction

[0196] 731 Section 1, Kong

[0197] 732 Second section.

Claims

1. A lamination apparatus (100) for laminating an electrochemical layer stack (204), wherein, The laminating device (100) has: A movable first workpiece carrier (200; 200a) is used to carry a stack of layers (204) made of individual substrates stacked on top of each other. A laminating press (106) is used to apply pressure to the stack (204) carried by the first workpiece carrier (200; 200a), such that the stack (204) is pressed against the first workpiece carrier (200; 200a) by means of the laminating press (106) in order to connect the substrates of the stack (204) into a laminate (204). as well as At least one pressing device (706), wherein the laminating equipment (100) is configured to prevent the laminate stack (204) from slipping by means of the pressing device (706) at least partially pressing the laminate stack (204) against the first workpiece carrier (200; 200a) before or during the manufacture of the laminate (204) by means of the laminating device (706). The laminating device (100) is configured to release the layer stack (204) or the laminate (204) made therefrom by removing the clamping device (706) from the layer stack (204) or the laminate (204) made therefrom. The clamping device (706) has at least one fluid channel (720) that can be loaded with pressurized fluid to support the release.

2. The lamination apparatus (100) according to claim 1, wherein, The at least one fluid channel (720) extends in or over the clamping device (706).

3. The lamination apparatus (100) according to claim 1 or 2, wherein, The clamping device (706) has a first surface (722) facing the workpiece carrier (200; 200a) or the stack (204), the first surface contacting the workpiece carrier or the stack when clamping the stack (204).

4. The laminating apparatus (100) according to claim 3, wherein, The at least one fluid channel (720) has a discharge opening (724) arranged in a region of the first surface (722).

5. The laminating apparatus (100) according to claim 4, wherein, The discharge opening (724) is not located in the first surface (722), but rather in that the discharge opening (724) is arranged on the lateral second surface (723) of the clamping device (706).

6. The lamination apparatus (100) according to claim 4 or 5, wherein, The at least one fluid channel (720) has a orientation in a region of the first surface (722) having a directional component parallel to the first surface (722).

7. The lamination apparatus (100) according to any one of claims 4 to 6, wherein, The orientation of the at least one fluid channel (720) is inclined at an angle α relative to the first surface (722) at least in the region of the first surface (722), and inclined at an angle β relative to the normal (725) on the first surface (722) or relative to the pressing direction (725) of the pressing device (706), wherein the angle α is at least 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55° or 60°, and / or wherein the angle β is at least 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55° or 60°, and in particular wherein the value of the angle α is 45°±10° or 45°±5°, and / or the value of the angle β is 45°±10° or 45°±5°.

8. The lamination apparatus (100) according to any one of claims 4 to 7, wherein, The at least one fluid channel (720) has a first section (731) and a second section (732) connected thereto, wherein the second section (732) leads into the discharge opening (724); wherein the second section (732) of the at least one fluid channel (720) is inclined relative to the first surface (722) and relative to the normal (725) of the first surface (722) or relative to the pressing direction (725) of the pressing device (706); and wherein the first section (731) of the at least one fluid channel (720) extends parallel to or substantially parallel to the normal (725) of the first surface (722) or parallel to the pressing direction (725) of the pressing device (706).

9. The laminating apparatus (100) according to claim 8, wherein, The clamping device (706) has two or more fluid channels (720), particularly four, six or eight fluid channels (720), each fluid channel having a first section and a second section (732) connected thereto, wherein each second section (732) leads to a corresponding discharge opening (724); wherein the discharge openings (724) are distributed, in particular, uniformly or substantially uniformly, in the circumferential direction of the clamping device (706).

10. The laminating apparatus (100) according to claim 8, wherein, The clamping device (706) has at least one fluid channel (720) having a unique first section (731) and a plurality of second sections (732) connected thereto, particularly two, four, six or eight second sections (732), wherein each second section (732) leads into a corresponding discharge opening (724); wherein the discharge openings (724) are distributed, in particular, uniformly or substantially uniformly, in the circumferential direction of the clamping device (706).

11. The lamination apparatus (100) according to claim 9 or 10, wherein, Multiple, in particular all, of the discharge openings (724) are centered on a plane that extends substantially parallel to the first surface (722).

12. The lamination apparatus (100) according to any one of the preceding claims, wherein, The area of ​​the first surface (722), or if the laminating apparatus (100) has a plurality of clamping devices (706), is the sum of the areas of the plurality of first surfaces (722) of the plurality of clamping devices (706), which is at most 20%, or at most 15%, or at most 10%, or at most 5%, or at most 3%, and / or at least 1%, or at least 2%, or between about 1% and 3%, or between about 2% and 3%, of the area of ​​the workpiece carrier (200; 200a) provided for carrying the laminate stack (204), or the area of ​​the laminate stack (204), or the area of ​​the laminating press (106).

13. The lamination apparatus (100) according to any one of the preceding claims, wherein, The first surface (722) is provided with an anti-stick coating (722), particularly an anti-stick coating (722) comprising polytetrafluoroethylene and PTFE.

14. A method for laminating an electrochemical layer stack (204), wherein, The method includes: A lamination apparatus (100) according to any one of the preceding claims is provided; The layer stack (204) is provided on a movable workpiece carrier (200; 200a, ..., 200d) for carrying the layer stack (204), the layer stack being made of substrates stacked on top of each other in a layered manner and to be laminated into a laminate (204); The stack of layers (204) is pressed at least partially against the first workpiece carrier (200; 200a) by means of a clamping device (706) to prevent the stack of layers (204) from sliding; Pressure is applied to the stack (204) carried by the workpiece carrier (200; 200a, ..., 200d) such that the stack (204) is pressed against the workpiece carrier (200a, ..., 200d) by a laminating press (106) to connect the substrates of the stack (204) into a laminate (204). Remove the clamping device (706) from the stack (204) or the laminate (204) made therefrom to release the stack (204) or the laminate (204) made therefrom; and At least one fluid channel (720) is loaded with pressurized fluid to support the release.

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