Silver alloy wire and conductive wire, bonding wire, semiconductor wire, and structural wire using the same
By controlling the crystal structure and alloying elements of silver alloy wire, the problem of easy grain boundary degradation of silver alloy wire at high temperature was solved, achieving high strength and resistance to grain boundary degradation, making it suitable for industrial wires.
CN122396788APending Publication Date: 2026-07-14TANAKA DENSHI KOGYO KK
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TANAKA DENSHI KOGYO KK
- Filing Date
- 2024-11-25
- Publication Date
- 2026-07-14
Smart Images
Figure CN122396788A_ABST
Abstract
The present invention provides a silver alloy wire having high tensile strength and high grain boundary deterioration resistance, and thus can maintain high strength even at high temperatures as an industrial wire. The silver alloy wire is a silver alloy wire containing 99.8 mass% or more of silver, the ratio of the length of special grain boundaries of grains in a cross section perpendicular to the length direction of the silver alloy wire is 30% or more, and the crystal orientation in the length direction measured in the cross section is <hkl>In the present embodiment, the ratio of crystal orientation <111> with respect to the angle difference in the length direction of the silver alloy wire is 10% or more and 60% or less.< / hkl>
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