Systems, methods, and apparatus for utilizing heat

Abstract

Systems, methods, and apparatus are provided for utilizing heat. A heat pump is configured to provide high pressure steam and includes at least one compressor and at least one flash evaporator. A heat exchanger is configured to be disposed proximate to a facility and further includes a first flow path and a second flow path. The first flow path is configured to transfer heat to the second flow path within the heat exchanger. An inlet of the first flow path is configured to be coupled to a source of hot fluid exiting the facility. Further, an inlet of the second flow path is configured to be coupled to a source of water. An outlet of the second flow path is configured to be coupled to an inlet of the heat pump.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 532,240, filed August 11, 2023, entitled “Mechanical Vapor Recompression Steam Generating Heat Pump and Heat Exchanger Integration,” which is hereby incorporated in its entirety for all purposes. Technical Field

[0003] This disclosure generally relates to systems, methods, and apparatus for utilizing heat (e.g., waste heat generated at a facility). Background Technology

[0004] Reducing on-site emissions from the industrial sector is crucial to achieving desired greenhouse gas targets. For example, California's Air Resources Board outlines a set of greenhouse gas reduction targets in AB32 and SB32, but this specific set should not be considered the only targets to be met in the industrial sector. Currently, industrial manufacturing processes generate heat that needs to be dissipated from these processes. For instance, waste heat can be transferred to cooling water loops, increasing the temperature of the cooling water. This hot cooling water can then be sent to cooling towers, where the heat is dissipated into the atmosphere to reduce the temperature of the cooling water.

[0005] To meet greenhouse gas targets and become carbon neutral, industrial electrification needs to be increased.

[0006] The obstacle to achieving the desired energy targets is the lack of effective and economically attractive technologies to electrify the substantial heat demand associated with steam generation in industry. State-of-the-art industrial heat pumps are unable to reach the temperatures required for generating medium- to high-pressure saturated steam in many industrial facilities. On the other hand, state-of-the-art electric boiler technology does achieve the required temperatures and pressures, but they do so with low coefficients of performance (COP) of 1.0 or less. This results in excessive electricity consumption, making these systems uneconomical to operate. Furthermore, high electricity consumption can place undue strain on the power grid.

[0007] It is also expected that the development of alternative technologies to meet the demands of medium- and high-pressure saturated steam can limit the implementation of custom engineering and dedicated one-off field assembly. Custom engineering and dedicated field assembly significantly limit availability and increase costs. Furthermore, custom solutions with dedicated field assembly may potentially require very costly downtime, and therefore industrial customers are reluctant to try new technologies that may be perceived as potentially unsuccessful and / or result in undesirable downtime.

[0008] Furthermore, those skilled in the art will understand that transporting steam over long distances (e.g., steam generated within a flash evaporator) is physically difficult or uneconomical because steam has a low density, requiring large duct or pipe structures to avoid associated pressure drops. For example, particularly for cryogenic and low-pressure steam, large pressure drops may be physically impossible because the initial pressure of the steam is too low. Additionally, when the compression ratio is high, large pressure drops negatively impact the performance of the heat pump, requiring additional energy input.

[0009] Therefore, there is a need for an improved system and method that addresses one or more of the above-mentioned drawbacks in a cost-effective, efficient, reliable, and scalable manner. Summary of the Invention

[0010] In light of the foregoing background, there is a need in the art for systems and methods that utilize heat (e.g., waste heat generated at a facility) to improve overall energy efficiency and reduce associated manufacturing, installation, and operating costs. Therefore, various aspects of this disclosure relate to systems, methods, and apparatus for generating high-pressure steam. For example, in some embodiments, the systems, methods, and apparatus of this disclosure are configured as heat pumps. In some embodiments, the heat pump configuration of the systems, methods, and apparatus of this disclosure is used for open-cycle mechanical vapor recompression and high-pressure steam generation. In some embodiments, the systems, methods, and apparatus of this disclosure are configured to capture a cryogenic medium flow discharged from an industrial process performed at a facility, increase the temperature of the medium flow, and use the medium flow with the increased temperature to generate steam. The steam may have the same temperature, pressure, and quality as steam supplied by existing boilers.

[0011] In some embodiments, the systems, methods, and apparatus of this disclosure are configured to transfer heat into a flow path, whether the heat originates from an exhaust duct, a cooling tower loop, any other liquid or gaseous heat source, or a combination thereof, the flow path circulating (e.g., looping) a medium through a heat exchanger. In some embodiments, the systems, methods, and apparatus of this disclosure are configured to pump heated water through the length of the flow path, such as a pipe associated with the flow path. In some embodiments, the systems, methods, and apparatus of this disclosure are configured to supply heated water to a flash evaporator assembly (e.g., at least one flash evaporator) associated with a heat pump. In some embodiments, the flash evaporator assembly is configured to reduce the pressure of the heated water, thereby producing flash steam and / or cooled water. The cooled water is returned to a heat source for reheating, thus closing the loop, for example, by returning the cooled water to the heat exchanger. In some embodiments, the systems, methods, and apparatus of this disclosure are configured to supply flash steam to a compressor assembly (e.g., at least two compressors). The steam exits the mechanical vapor recompression (MVP) heat pump under high pressure, suitable for various process applications or for various heating applications.

[0012] Therefore, in some embodiments, the systems, methods, and apparatus of this disclosure provide a repeatable, modular architecture that delivers medium- or high-pressure working steam, regardless of the type, quality, and / or size of the facility or the heat source associated with the facility. Furthermore, in some embodiments, the heat source and heat pump can be physically located apart from each other by transferring heat from the facility to a flow path with circulating liquid. In some embodiments, the systems, methods, and apparatus of this disclosure transfer heat to a liquid, which enables the use of smaller piping structures to deliver heat over long distances, such as distances exceeding 0.5 miles (e.g., greater than 800 meters (m)).

[0013] In some embodiments, the circulating flow path allows for a large distance between the heat source associated with the facility and the heat pump or, similarly, the heat exchanger disclosed herein. In some embodiments, placing a relatively large distance between the facility and the heat pump and / or heat exchanger is advantageous because it eliminates the need to demolish buildings, construct or modify new buildings, or locate real estate to house the system at the facility. In some embodiments, the heat pump is modular, thereby allowing the heat pump to utilize heat from a variety of heat sources, such as various types of fluids, various capacities, various temperatures, various physical geometries, or combinations thereof, because the heat pump is located at a relatively distant distance from the heat source.

[0014] In some embodiments, the systems, methods, and apparatus of this disclosure generate high-pressure steam with a density greater than that of low-pressure steam, thereby allowing the high-pressure steam to be transported over long distances. Therefore, in some embodiments, the heat pump is physically separated from the heat source and radiator or exhaust fan (e.g., a cooling tower).

[0015] Turning to a more specific aspect, one aspect of this disclosure relates to providing a system for utilizing heat. The system includes a heat exchanger, a heat pump, a medium inlet, and a fluid pump. The heat exchanger is configured to receive a first medium flow and transfer heat from the first medium flow to a second medium flow. Furthermore, the heat exchanger further includes a first flow path having an inlet configured to be coupled to and receive the first medium flow from the facility. Additionally, the heat exchanger includes a second flow path thermally coupled to the first flow path. The second flow path is configured to guide the second medium flow. The second medium flow is at least partially a liquid carried along the second flow path. The heat pump is coupled to the second flow path of the heat exchanger. The heat pump further includes at least one flash evaporator configured to receive the second medium flow, flash a first portion of the second medium flow to produce a vaporized medium flow, and provide a second portion of the second medium flow (e.g., via cooling water) to the second flow path. The heat pump further includes a compressor unit coupled to the at least one flash evaporator. The compressor unit includes at least two compressors and is configured to increase the pressure of the vaporized medium flow. Additionally, a medium inlet is coupled to a second medium flow and configured to, for example, supplement the second medium flow with makeup water. A fluid pump is coupled to a second flow path of the heat exchanger and configured to control the second medium flow.

[0016] In some embodiments, the second flow path is a closed loop.

[0017] In some embodiments, the fluid pump is further configured to control the flow rate associated with the second flow path.

[0018] In some embodiments, at least one flash evaporator is configured to supply liquid water to a second flow path.

[0019] In some embodiments, the first flow path is configured to bypass the source of the hot fluid leaving the facility.

[0020] In some embodiments, the first flow path is configured to be fluidly coupled in series or in parallel with a source of hot fluid leaving the facility.

[0021] In some embodiments, the heat exchanger is a plate heat exchanger.

[0022] In some embodiments, the heat exchanger is a vapor condenser heat exchanger.

[0023] In some embodiments, the heat exchanger is a tubular heat exchanger, a finned heat exchanger, a frame heat exchanger, a shell heat exchanger, a spiral heat exchanger, a tube heat exchanger, or a combination thereof.

[0024] In some embodiments, the heat exchanger is a co-current heat exchanger, a counter-current heat exchanger, or a cross-current heat exchanger.

[0025] In some embodiments, the heat exchanger is configured to prevent mixing of the first flow path and the second flow path.

[0026] In some embodiments, the heat pump is a mechanical vapor recompression (MVP) heat pump.

[0027] In some embodiments, the system further includes a heat pump outlet configured to be coupled to an existing steam manifold of the facility or a different facility.

[0028] In some embodiments, the source of the hot fluid leaving the facility is waste heat generated at the facility.

[0029] In some embodiments, the heat exchanger is configured to transfer latent heat and sensible heat from a first flow path to a second flow path.

[0030] In some embodiments, the system further includes an outlet of a second flow path configured to couple with an existing heat exchanger associated with the same exhaust heat exchanger.

[0031] In some embodiments, the heat exhauster is a cooling tower.

[0032] In some embodiments, the system further includes a heat pump outlet configured to couple with a water source associated with an inlet of a second flow path.

[0033] In some embodiments, the system further includes a nozzle configured to spray water into a hot fluid exiting the facility and to capture heat from the hot fluid.

[0034] In some embodiments, the water injected into the hot fluid is further configured to purify the hot fluid.

[0035] In some embodiments, the first flow path is configured to be in fluid communication with a first replenishment water flow generated at the facility or a different facility.

[0036] In some embodiments, the water injected into the hot fluid comprises a first replenishment water flow.

[0037] In some embodiments, the second flow path is configured to be in fluid communication with a second makeup water flow generated at the facility or a different facility.

[0038] In some embodiments, the system further includes a filter configured to be fluidly coupled to a first flow path and further configured to remove contaminants from the first flow path upstream of the heat exchanger.

[0039] In some embodiments, the system further includes: a first sensor configured to detect temperature at the inlet of a first flow path; and a controller electrically coupled to the first sensor and a damper assembly configured to fluidly couple to the first flow path and further configured to control the flow rate of the first flow path at the inlet of the first flow path.

[0040] In some embodiments, the system further includes: a second sensor configured to detect the temperature of the first flow path at the inlet of the heat exchanger; and a controller electrically coupled to the second sensor and a fan assembly configured to fluidly couple to the first flow path and further configured to maintain the temperature at the inlet of the heat exchanger.

[0041] In some embodiments, the system further includes: a third sensor configured to detect the temperature at the inlet of the first flow path; and a controller electrically coupled to the third sensor and a first fluid pump configured to be fluidly coupled to the first flow path and further configured to control the flow rate at the inlet of the heat exchanger.

[0042] In some embodiments, the system further includes: a fourth sensor configured to detect the pressure of the heat pump; and a controller electrically coupled to the fourth sensor and a second fluid pump configured to fluidly couple to a second flow path and further configured to maintain the pressure of the heat pump.

[0043] In some embodiments, the pressure is the internal pressure of the heat pump, which is less than the saturation pressure of the heat fluid.

[0044] In some embodiments, the system further includes: a fifth sensor configured to detect pressure at the inlet of the heat pump; a sixth sensor configured to detect temperature at the inlet of the heat pump; and a controller electrically coupled to the fifth sensor, the sixth sensor, and a value configured to fluidly couple to a second flow path and further configured to maintain pressure at the heat pump.

[0045] In some embodiments, the controller is a proportional-integral-derivative (PID) controller.

[0046] In some embodiments, the system further includes a first discharge element configured to remove contaminants contained in a first flow path.

[0047] In some embodiments, the first drain element is configured to be fluidly coupled to a first flow path upstream of the inlet of the heat exchanger.

[0048] In some embodiments, the system further includes a second discharge element configured to remove contaminants contained in a second flow path.

[0049] In some embodiments, the second drain element is further configured to be fluidly coupled to a second flow path downstream of the heat pump outlet.

[0050] In some embodiments, the distance between the facility and the heat exchanger is between 100 meters and 10 kilometers.

[0051] In some embodiments, the distance between the heat exchanger and the heat pump is less than 100 meters.

[0052] In some embodiments, the distance between the facility and the heat exchanger is greater than the distance between the heat exchanger and the heat pump.

[0053] In some embodiments, the heat exchanger is configured to be positioned at a first height greater than the second height associated with the heat pump.

[0054] In some embodiments, the heat exchanger is a direct contact heat exchanger.

[0055] In some embodiments, the system further includes: a seventh sensor configured to detect the liquid depth of the heat pump; and a controller electrically coupled to the seventh sensor and a second fluid pump, the second fluid pump being configured to fluidly couple to a second flow path and further configured to maintain the liquid depth of the heat pump.

[0056] Another aspect of this disclosure relates to providing a system for utilizing heat. The system includes a heat pump configured to provide high-pressure steam. The heat pump includes at least one compressor and at least one flash evaporator. Additionally, the system includes a heat exchanger configured to be disposed close to a facility. The heat exchanger includes a first flow path and a second flow path. The first flow path is configured to transfer heat to the second flow path within the heat exchanger. Furthermore, the inlet of the first flow path is configured to be coupled to a source of hot fluid exiting the facility, and the inlet of the second flow path is configured to be coupled to a second medium, such as a water source. Furthermore, the outlet of the second flow path is configured to be coupled to the inlet of the heat pump.

[0057] In some embodiments, the second flow path is configured to accommodate a flow that is at least partially liquid.

[0058] In some embodiments, the second flow path is a closed loop.

[0059] In some embodiments, the system further includes a fluid pump fluidly coupled to a second flow path and further configured to control the flow rate associated with the second flow path.

[0060] In some embodiments, at least one flash evaporator is configured to flash some or all of the water in the second flow path to provide steam received by the inlet of at least one compressor.

[0061] In some embodiments, at least one flash evaporator is configured to supply liquid water to a second flow path.

[0062] In some embodiments, the first flow path is configured to bypass the source of the hot fluid leaving the facility.

[0063] In some embodiments, the first flow path is configured to be fluidly coupled in series or in parallel with a source of hot fluid leaving the facility.

[0064] In some embodiments, the heat exchanger is a plate heat exchanger.

[0065] In some embodiments, the heat exchanger is a vapor condenser heat exchanger.

[0066] In some embodiments, the heat exchanger is a tubular heat exchanger, a finned heat exchanger, a frame heat exchanger, a shell heat exchanger, a spiral heat exchanger, a tube heat exchanger, or a combination thereof.

[0067] In some embodiments, the heat exchanger is a co-current heat exchanger, a counter-current heat exchanger, or a cross-current heat exchanger.

[0068] In some embodiments, the heat exchanger is configured to prevent mixing of the first flow path and the second flow path.

[0069] In some embodiments, the heat pump is a mechanical vapor recompression (MVP) heat pump.

[0070] In some embodiments, the system further includes a heat pump outlet configured to be coupled to an existing steam manifold of the facility or a different facility.

[0071] In some embodiments, the source of the hot fluid leaving the facility is waste heat generated at the facility.

[0072] In some embodiments, the heat exchanger is configured to transfer latent heat and sensible heat from a first flow path to a second flow path.

[0073] In some embodiments, the system further includes an outlet of a second flow path configured to couple with an existing heat exchanger associated with the same exhaust heat exchanger.

[0074] In some embodiments, the heat exhauster is a cooling tower.

[0075] In some embodiments, the system further includes a heat pump outlet configured to couple with a water source associated with an inlet of a second flow path.

[0076] In some embodiments, the system further includes a nozzle configured to spray water into a hot fluid exiting the facility and to capture heat from the hot fluid.

[0077] In some embodiments, the water injected into the hot fluid is further configured to purify the hot fluid.

[0078] In some embodiments, the first flow path is configured to be in fluid communication with a first replenishment water flow generated at the facility or a different facility.

[0079] In some embodiments, the water injected into the hot fluid comprises a first replenishment water flow.

[0080] In some embodiments, the second flow path is configured to be in fluid communication with a second makeup water flow generated at the facility or a different facility.

[0081] In some embodiments, the system further includes a filter configured to be fluidly coupled to a first flow path and further configured to remove contaminants from the first flow path upstream of the heat exchanger.

[0082] In some embodiments, the system further includes: a first sensor configured to detect temperature at the inlet of a first flow path; and a controller electrically coupled to the first sensor and a damper assembly configured to be fluidly coupled to the first flow path and further configured to control the flow rate of the first flow path at the inlet of the first flow path.

[0083] In some embodiments, the system further includes: a second sensor configured to detect the temperature of the first flow path at the inlet of the heat exchanger; and a controller electrically coupled to the second sensor and a fan assembly configured to be fluidly coupled to the first flow path and further configured to maintain the temperature at the inlet of the heat exchanger.

[0084] In some embodiments, the system further includes: a third sensor configured to detect the temperature at the inlet of the first flow path; and a controller electrically coupled to the third sensor and a first fluid pump configured to be fluidly coupled to the first flow path and further configured to control the flow rate at the inlet of the heat exchanger.

[0085] In some embodiments, the system further includes: a fourth sensor configured to detect the pressure of the heat pump; and a controller electrically coupled to the fourth sensor and a second fluid pump, the second fluid pump being configured to be fluidly coupled to a second flow path and further configured to maintain the pressure of the heat pump.

[0086] In some embodiments, the pressure is the internal pressure of the heat pump, which is less than the saturation pressure of the heat fluid.

[0087] In some embodiments, the system further includes: a fifth sensor configured to detect pressure at the inlet of the heat pump; a sixth sensor configured to detect temperature at the inlet of the heat pump; and a controller electrically coupled to the fifth sensor, the sixth sensor, and a value configured to fluidly couple to a second flow path and further configured to maintain pressure at the heat pump.

[0088] In some embodiments, the controller is a proportional-integral-derivative (PID) controller.

[0089] In some embodiments, the system further includes a first discharge element configured to remove contaminants contained in a first flow path.

[0090] In some embodiments, the first drain element is configured to be fluidly coupled to a first flow path upstream of the inlet of the heat exchanger.

[0091] In some embodiments, the system further includes a second discharge element configured to remove contaminants contained in a second flow path.

[0092] In some embodiments, the second drain element is further configured to be fluidly coupled to a second flow path downstream of the heat pump outlet.

[0093] In some embodiments, the distance between the facility and the heat exchanger is between 100 meters and 10 kilometers.

[0094] In some embodiments, the distance between the heat exchanger and the heat pump is less than 100 meters.

[0095] In some embodiments, the distance between the facility and the heat exchanger is greater than the distance between the heat exchanger and the heat pump.

[0096] In some embodiments, the heat exchanger is configured to be positioned at a first height greater than the second height associated with the heat pump.

[0097] In some embodiments, the heat exchanger is a direct contact heat exchanger.

[0098] Another aspect of this disclosure relates to a system for utilizing waste heat. The system includes a heat exchanger and a heat pump. The heat exchanger is configured to receive a first stream from a facility, transfer heat between the first stream and a second stream in the heat exchanger, and discharge the first stream. The heat pump is coupled to the heat exchanger. Furthermore, the heat pump is configured to receive the second stream from the heat exchanger and is further configured to convert the second stream into a high-pressure steam stream and a fluid stream that is colder than the high-pressure steam stream.

[0099] Another aspect of this disclosure relates to a system for utilizing heat. The system includes a heat pump. The heat pump further includes a flash evaporator assembly coupled to a compressor unit. The heat pump is further configured to receive some or all of the water in a second flow path. Furthermore, the compressor unit is configured to provide high-pressure steam. The system includes a heat exchanger disposed near the facility. The heat exchanger includes a first flow path and a second flow path. The first flow path is configured to transfer heat to the second flow path within the heat exchanger. The second flow path is a loop configured to contain at least a portion of liquid. The inlet of the first flow path is configured to be coupled to a source of hot fluid exiting the facility. Furthermore, the inlet of the second flow path is configured to be coupled to a water source. The outlet of the second flow path is configured to be coupled to the inlet of the heat pump. Additionally, the system includes a fluid pump fluidly coupled to the second flow path. The fluid pump is further configured to control the flow rate associated with the second flow path.

[0100] Another aspect of this disclosure relates to a system for utilizing heat. The system includes a heat exchanger configured to transfer heat from a first flow path to a second flow path within the heat exchanger. Furthermore, the heat exchanger includes the first flow path having an inlet configured to receive waste heat from a facility. Additionally, the heat exchanger includes a second flow path thermally coupled to the first flow path. The second flow path is configured to transfer energy from the first flow path to a liquid flowing along the second flow path. Additionally, the system includes a heat pump coupled to an outlet of the second flow path. The heat pump includes at least one flash evaporator configured to flash the liquid to generate steam and return any remaining liquid to the second flow path. Furthermore, the heat pump includes at least two compressors coupled to the at least one flash evaporator. The at least two compressors are configured to increase the pressure of the steam. Additionally, the system includes a medium inlet coupled to a second medium flow and configured to supplement the second medium flow. Additionally, the system includes a fluid pump coupled to the second flow path and configured to control the flow of liquid and steam.

[0101] The systems, methods, and apparatus disclosed herein have other features and advantages that will be apparent from or set forth in more detail in the accompanying drawings and the following detailed description incorporated herein, which together serve to explain certain principles of the invention. Attached Figure Description

[0102] Figure 1A This is a block diagram of an example high-pressure steam generating heat pump system according to some embodiments, where dashed boxes indicate optional components.

[0103] Figure 1B This is a block diagram of an example high-pressure steam generating heat pump system according to some embodiments, where dashed boxes indicate optional components.

[0104] Figure 2A , Figure 2B , Figure 3 , Figure 4 , Figure 5A , Figure 5B and Figure 5C This is a block diagram of an example high-pressure steam generating heat pump system according to some embodiments, where dashed boxes indicate optional components.

[0105] Figure 6 A graph depicting various parameters associated with various high-pressure steam-generating heat pump systems according to some embodiments.

[0106] Figure 7 A graph depicting the performance of a high-pressure steam-generating heat pump system according to some embodiments compared to various conventional technologies.

[0107] Figure 8 This is a flowchart of an example method for generating high-pressure steam according to some embodiments, wherein dashed boxes indicate optional elements in the flowchart.

[0108] Figure 9 A block diagram is provided to illustrate an example computer system applied to a high-pressure steam generation heat pump system according to some embodiments.

[0109] Figure 10A , Figure 10B , Figure 11 , Figure 12A , Figure 12B , Figure 13A and Figure 13B This is a block diagram of an example system for utilizing heat according to some embodiments.

[0110] Figure 14A A diagram illustrating an embodiment of a system for utilizing heat according to some embodiments.

[0111] Figure 14B Another figure is shown to illustrate an embodiment of a system for utilizing heat according to some embodiments.

[0112] In the figures, reference numerals throughout the diagram refer to the same or equivalent parts of the invention. Detailed Implementation

[0113] Systems, methods, and apparatuses are provided for utilizing heat. In some embodiments, the systems, methods, and apparatuses use a liquid flowing along a flow path of a heat exchanger in the system to transfer heat from a heat source associated with a facility to a heat pump in the system. In some embodiments, the heat pump is configured to vaporize the liquid and increase the pressure of the vapor to a pressure suitable for industrial processes and / or delivery to the facility or different facilities. Advantageously, by way of example, in some embodiments, the systems, methods, and apparatuses provide a heat pump configured to provide high-pressure steam and comprising at least one compressor and at least one flash evaporator. In some embodiments, the systems, methods, and apparatuses provide a heat exchanger configured to be disposed close to the facility and further comprising a first flow path and a second flow path. In some embodiments, the first flow path is configured to transfer heat to the second flow path within the heat exchanger. In some embodiments, the inlet of the first flow path is configured to be coupled to a source of hot fluid exiting the facility. Furthermore, in some embodiments, the inlet of the second flow path is configured to be coupled to a water source. In some embodiments, the outlet of the second flow path is configured to be coupled to the inlet of the heat pump.

[0114] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. Numerous specific details are set forth in the following detailed description in order to provide a thorough understanding of the present disclosure. However, it will be apparent to those skilled in the art that the present disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

[0115] It should be understood that although the terms first, second, etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another. For example, without departing from the scope of this disclosure, a first compressor may be referred to as a second compressor, and similarly, a second compressor may be referred to as a first compressor. Both the first compressor and the second compressor are compressors, but they are not the same compressor.

[0116] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in the description of the invention and the appended claims, the singular forms “a,” “an,” and “described” are intended to also include the plural forms, unless the context clearly indicates otherwise. It will also be understood that the term “and / or,” as used herein, refers to and covers any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0117] The foregoing description includes example systems, methods, techniques, instruction sequences, and computer program products embodying illustrative embodiments. For purposes of explanation, numerous specific details are set forth in order to provide an understanding of various embodiments of the subject matter of the invention. However, it will be apparent to those skilled in the art that embodiments of the subject matter of the invention can be practiced without these specific details. Generally, well-known instruction examples, protocols, structures, and techniques have not been shown in detail.

[0118] For purposes of explanation, the foregoing description has been described with reference to specific embodiments. However, the following illustrative discussion is not intended to be exhaustive or to limit the embodiments to the precise form disclosed. In view of the above teachings, many modifications and variations are possible. The embodiments described were chosen and described in order to best explain the principles and their practical application, thereby enabling others skilled in the art to best utilize the embodiments and various embodiments with various modifications suitable for the particular intended use.

[0119] For clarity, not all the conventional characteristics of the implementations described herein are shown and described. It will be understood that in the development of any such practical implementation, numerous implementation-specific decisions are made to achieve the designer's specific goals, such as compliance with constraints related to use cases and business, and these specific goals will vary from one implementation to another and from one designer to another. Furthermore, it will be understood that such design work can be complex and time-consuming, but remains a routine engineering task for those skilled in the art who benefit from this disclosure.

[0120] As used herein, depending on the context, the term “if” can be interpreted as “when”, “upon”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if determination” or “if [the stated condition or event] is detected” can be interpreted as “when determination”, “in response to determination”, “when [the stated condition or event] is detected”, or “in response to detection”.

[0121] As used herein, the terms "about" or "approximately" may mean within an acceptable margin of error for a particular value as determined by one of ordinary skill in the art, which may depend in part on how the value was measured or determined, such as limitations of the measurement system. For example, according to practice in the art, "about" may mean within one or more standard deviations. "About" may mean a range of ±20%, ±10%, ±5%, or ±1% of a given value. Where a particular value is described in this application and claims, unless otherwise stated, the term "about" means within an acceptable margin of error for the particular value. The term "about" may have the meaning commonly understood by one of ordinary skill in the art. The term "about" may mean ±10%. The term "about" may mean ±5%.

[0122] As used in this article, the term "period" refers to a predefined time period.

[0123] Furthermore, unless otherwise expressly stated, the terms “compressor” and “blower” are used interchangeably in this document.

[0124] Unless otherwise expressly stated, the terms “flash evaporator” and “gas-liquid separator” are used interchangeably in this document.

[0125] Unless otherwise expressly stated, the terms “steam” and “water vapor” are used interchangeably in this document.

[0126] Furthermore, as used herein, the term "flow" means any material that moves directly or indirectly from one location to another, or is en route directly or indirectly from one location to another. In some embodiments, a flow is still a flow, even if it is temporarily still at any time. In some embodiments, it will be understood that if this disclosure refers to a particular flow, it does not necessarily refer to a single pipe or other physical transport.

[0127] Furthermore, when reference numerals are given the designation "i", they refer to a general component, set, or embodiment. For example, a compressor referred to as "compressor i" refers to the i-th compressor among a plurality of compressors (e.g., compressor 204-i among a plurality of compressors 204).

[0128] Figure 1Aand Figure 1B Each represents a block diagram of an example high-pressure steam generating heat pump system according to some embodiments, wherein dashed boxes indicate optional elements. Figures 2A to 5C This is a block diagram of a high-pressure steam-generating heat pump system according to some embodiments, where dashed boxes indicate optional components. Reference Figure 1A and Figure 1B In some embodiments, this disclosure relates to providing a method for generating high-pressure steam (e.g., Figure 1A High-pressure steam 140-1 or 140-2, Figure 1B High-pressure steam 140 Figures 2A to 7 A system (e.g., high-pressure steam 140, etc.) of any of them Figures 1A to 7 (System 104, etc. of any of them).

[0129] In some embodiments, system 104 is coupled to one or more facilities (e.g., Figure 1A The first facility 102-1 Figure 1B (e.g., a second facility 102). For example, in some embodiments, system 104 is associated with and located near first facility 102-1, which allows system 104 to utilize one or more resources from first facility 102-1. Furthermore, in some embodiments, system 104 is associated with and located near first facility 102-1 to allow system 104 to supply high-pressure steam 140 generated at system 104 to first facility 102-1, for example, via an existing steam manifold coupled to first facility 102-1. However, this disclosure is not limited thereto.

[0130] refer to Figures 2A to 5C System 104 includes a compressor unit (e.g., Figures 2A to 5C Compressor unit 202 (e.g., any of the compressor units 202) and flash evaporator unit (e.g., Figures 1A to 5B The system 104 uses the compressor unit and the flash evaporator unit together (such as flash evaporator 212 in any of the components) to generate high-pressure steam 140 for facility 102.

[0131] Those skilled in the art will understand that the temperature rise and mechanical stress limits within the respective compressor are provided by the maximum pressure differential of any stage of the respective compressor. Therefore, in order to provide high-pressure steam 140 that can be utilized by facility 102, compressor unit 202 comprises a series of at least two compressors (e.g., Figures 2A to 5C The first compressor 204-1 of any of them Figures 2A to 5C The second compressor 204-2 of any of them Figures 3 to 5C The third compressor 204-3 of any of them, ... Figure 5C(such as compressor 204-m). For example, in some embodiments, compressor unit 202 includes between two and twenty compressors 204 (e.g., two compressors 204, three compressors 204, ... twenty compressors 204, etc.), between two and seventeen compressors 204, between two and fifteen compressors 204, between two and twelve compressors 204, between two and nine compressors 204, between two and six compressors 204, between two and three compressors 204, between three and twenty compressors 204, between three and seventeen compressors 204, between three and fifteen compressors 204, between three and twelve compressors 204, between three and nine compressors 204, between three and six compressors 204, between five and twenty compressors 204, between five and seventeen compressors 204, between five and fifteen compressors 204, between five and twelve compressors 204, between five and nine compressors 204. 04, compressors between five and six, compressors between seven and twenty, compressors between seven and seventeen, compressors between seven and fifteen, compressors between seven and twelve, compressors between seven and nine, compressors between nine and twenty, compressors between nine and seventeen, compressors between nine and fifteen, compressors between nine and twelve, compressors between eleven and twenty, compressors between eleven and seventeen, compressors between eleven and fifteen, compressors between eleven and twelve, compressors between thirteen and twenty, compressors between thirteen and seventeen, compressors between thirteen and fifteen, compressors between fifteen and twenty, compressors between fifteen and seventeen, or compressors between seventeen and twenty, including end values. In some embodiments, the compressor unit 202 includes at least two compressors 204, at least three compressors 204, at least four compressors 204, at least five compressors 204, at least six compressors 204, at least seven compressors 204, at least eight compressors 204, at least nine compressors 204, at least ten compressors 204, at least eleven compressors 204, at least twelve compressors 204, at least thirteen compressors 204, at least fourteen compressors 204, at least fifteen compressors 204, at least sixteen compressors 204, at least seventeen compressors 204, at least eighteen compressors 204, at least nineteen compressors 204, or at least twenty compressors 204.In some embodiments, the compressor unit 202 includes up to two compressors 204, up to three compressors 204, up to four compressors 204, up to five compressors 204, up to six compressors 204, up to seven compressors 204, up to eight compressors 204, up to nine compressors 204, up to ten compressors 204, up to eleven compressors 204, up to twelve compressors 204, up to thirteen compressors 204, up to fourteen compressors 204, up to fifteen compressors 204, up to sixteen compressors 204, up to seventeen compressors 204, up to eighteen compressors 204, up to nineteen compressors 204, or up to twenty compressors 204.

[0132] In some embodiments, compressor unit 202 includes m compressors 204, where m is an integer, such as an integer greater than two. In some embodiments, m is at least two and less than twenty-one. Furthermore, in some embodiments, based on one or more input parameters of system 104 (e.g., ...), Figure 9The parameter 916) and / or one or more output parameters 916 of system 104 are used to select m for system 104. For example, in some embodiments, m is selected based on the temperature of the high-pressure steam 140 generated by system 104 and the temperature of the hot water received by system 104 from facility 102 or a different facility 102. In some embodiments, m is selected based on the increase (e.g., difference) between the temperature of the high-pressure steam 140 generated by system 104 and the temperature of the hot water received by system 104 from a hot water source 110 associated with facility 102 or a different facility 102. For example, in some embodiments, m is selected to provide temperatures between 60℉ (15.6℃) and 330℉ (165℃), between 60℉ (15.6℃) and 300℉ (149℃), between 60℉ (15.6℃) and 270℉ (135℃), between 60℉ (15.6℃) and 250℉ (121℃), between 60℉ (15.6℃) and 220℉ (65.6℃), between 60℉ (15.6℃) and 205℉ (96.1℃), between 60℉ (15.6℃) and 190℉ (87.8℃), and between 60℉ (15.6℃). Between 175℉ (79.4℃), 60℉ (15.6℃) and 150℉ (65.6℃), 60℉ (15.6℃) and 135℉ (57.2℃), 60℉ (15.6℃) and 120℉ (48.9℃), 60℉ (15.6℃) and 105℉ (40.6℃), 60℉ (15.6℃) and 90℉ (32.2℃), 60℉ (15.6℃) and 75℉ (23.9℃), 80℉ (26.7℃) and 330℉ (165℃), 80℉ (26.7℃) and 30 Between 0℉ (149℃), 80℉ (26.7℃) and 270℉ (135℃), 80℉ (26.7℃) and 250℉ (121℃), 80℉ (26.7℃) and 220℉ (65.6℃), 80℉ (26.7℃) and 205℉ (96.1℃), 80℉ (26.7℃) and 190℉ (87.8℃), 80℉ (26.7℃) and 175℉ (79.4℃), 80℉ (26.7℃) and 150℉ (65.6℃), 80℉ (26.7℃) and 135℉ (5 Between 7.2℃, 80℉ (26.7℃) and 120℉ (48.9℃), 80℉ (26.7℃) and 105℉ (40.6℃), 80℉ (26.7℃) and 90℉ (32.2℃), 100℉ (37.8℃) and 330℉ (165℃), 100℉ (37.8℃) and 300℉ (149℃), 100℉ (37.8℃) and 270℉ (135℃), 100℉ (37.8℃) and 250℉ (121℃), 100℉ (37.8℃) and 220℉ (65℃).Between 6℃, 100℉ (37.8℃) and 205℉ (96.1℃), 100℉ (37.8℃) and 190℉ (87.8℃), 100℉ (37.8℃) and 175℉ (79.4℃), 100℉ (37.8℃) and 150℉ (65.6℃), 100℉ (37.8℃) and 135℉ (57.2℃), 100℉ (37.8℃) and 120℉ (48.9℃), 100℉ (37.8℃) and 105℉ (40.6℃), 120℉ (48.9℃) and 330℉ (165℃), 120℉ (48.9℃) and 300℉ (149℃), 120℉ (48.9℃) Between 270℉ (135℃), 120℉ (48.9℃) and 250℉ (121℃), 120℉ (48.9℃) and 220℉ (65.6℃), 120℉ (48.9℃) and 205℉ (96.1℃), 120℉ (48.9℃) and 190℉ (87.8℃), 120℉ (48.9℃) and 175℉ (79.4℃), 120℉ (48.9℃) and 150℉ (65.6℃), 120℉ (48.9℃) and 135℉ (57.2℃), 140℉ (60.0℃) and 330℉ (165℃), 140℉ (60.0℃) and 300℉ (149℃), 140℉ ( Between 60.0℃ and 270℉ (135℃), between 140℉ (60.0℃) and 250℉ (121℃), between 140℉ (60.0℃) and 220℉ (65.6℃), between 140℉ (60.0℃) and 205℉ (96.1℃), between 140℉ (60.0℃) and 190℉ (87.8℃), between 140℉ (60.0℃) and 175℉ (79.4℃), between 140℉ (60.0℃) and 150℉ (65.6℃), between 175℉ (79.4℃) and 330℉ (165℃), between 175℉ (79.4℃) and 300℉ (149℃), between 175℉ (79.4℃) and 270℉ (135℃). Between 175℉ (79.4℃) and 250℉ (121℃), between 175℉ (79.4℃) and 220℉ (65.6℃), between 175℉ (79.4℃) and 205℉ (96.1℃), between 175℉ (79.4℃) and 190℉ (87.8℃), between 190℉ (87.8℃) and 220℉ (65.6℃), between 190℉ (87.8℃) and 330℉ (165℃), between 190℉ (87.8℃) and 300℉ (149℃), between 190℉ (87.8℃) and 270℉ (135℃), between 190℉ (87.8℃) and 250℉ (121℃), between 190℉ (87.8℃) and 205℉ (96.1℃).The elevations between 1℃, 205℉ (96.1℃) and 330℉ (165℃), 205℉ (96.1℃) and 300℉ (149℃), 205℉ (96.1℃) and 270℉ (135℃), 205℉ (96.1℃) and 250℉ (121℃), 205℉ (96.1℃) and 220℉ (65.6℃), 250℉ (121℃) and 330℉ (165℃), 250℉ (121℃) and 300℉ (149℃), 250℉ (121℃) and 270℉ (135℃), or 270℉ (135℃) and 330℉ (165℃), including end values. In some embodiments, m is selected to provide at least 60℉ (15.6℃), at least 65℉ (18.3℃), at least 70℉ (21.1℃), at least 75℉ (23.9℃), at least 80℉ (26.7℃), at least 85℉ (29.4℃), at least 90℉ (32.2℃), at least 95℉ (35.0℃), at least 100℉ (37.8℃), at least 105℉ (40.6℃), at least 110℉ (43.3℃), at least 115℉ (46.1℃), at least 120℉ (48.9℃), at least 125℉ (51.7℃), at least 130℉ (54.4℃), at least 135℉ (57.2℃), at least 140℉ (60.0℃), at least 145℉ (62.8℃), to The following are increases: at least 150℉ (65.6℃), at least 155℉ (68.3℃), at least 160℉ (71.1℃), at least 165℉ (73.9℃), at least 170℉ (76.7℃), at least 175℉ (79.4℃), at least 180℉ (82.2℃), at least 185℉ (85.0℃), at least 190℉ (87.8℃), at least 195℉ (90.6℃), at least 200℉ (93.3℃), at least 205℉ (96.1℃), at least 210℉ (98.9℃), at least 215℉ (102℃), at least 220℉ (104℃), at least 250℉ (121℃), at least 270℉ (135℃), at least 300℉ (149℃), or at least 330℉ (165℃). In some embodiments, m is selected to provide temperatures up to 60℉ (15.6℃), up to 65℉ (18.3℃), up to 70℉ (21.1℃), up to 75℉ (23.9℃), up to 80℉ (26.7℃), up to 85℉ (29.4℃), up to 90℉ (32.2℃), up to 95℉ (35.0℃), up to 100℉ (37.8℃), up to 105℉ (40.6℃), up to 110℉ (43.3℃), up to 115℉ (46.1℃), up to 120℉ (48.9℃), up to 125℉ (51.7℃), up to 130℉ (54.4℃), and up to 135℉ (57.8℃).2℃), up to 140℉ (60.0℃), up to 145℉ (62.8℃), up to 150℉ (65.6℃), up to 155℉ (68.3℃), up to 160℉ (71.1℃), up to 165℉ (73.9℃), up to 170℉ (76.7℃), up to 175℉ (79.4℃), up to 180℉ (82.2℃), up to 185℉ (85.0℃), up to 1 Upgrades of 90℉ (87.8℃), up to 195℉ (90.6℃), up to 200℉ (93.3℃), up to 205℉ (96.1℃), up to 210℉ (98.9℃), up to 215℉ (102℃), up to 220℉ (104℃), up to 250℉ (121℃), up to 270℉ (135℃), up to 300℉ (149℃), or up to 330℉ (165℃).

[0133] In some embodiments, a series of at least two compressors 204 are configured such that at least two of the compressors 204 are fluidly coupled in series. In some embodiments, the series of at least two compressors 204 are at least partially fluidly coupled in series, which allows a medium flow from a first compressor 204-1 to a second compressor 204-2. For example, in some embodiments, when the series of at least two compressors 204 are at least partially fluidly coupled in series, the series of at least two compressors 204 includes a trace through both the first compressor 204-1 and the second compressor 204-2. In some embodiments, the series of at least two compressors 204 are configured such that each compressor is arranged in a straight line, substantially a straight line, an arc, or substantially an arc. In some embodiments, the series of at least two compressors 204 are configured such that each compressor is arranged in an array, such as an array of two or more rows of parallel or substantially parallel lines. For example, in some embodiments, a series of at least two compressors 204 are configured such that each compressor in the series of at least two compressors 204 is arranged in a herringbone array, wherein a first line associated with a first set of compressors 204 in the series of at least two compressors 204 has a first slope, and a second set of compressors 204 in the series of at least two compressors 204 has a second slope opposite to the first slope. Briefly, reference is made as a non-limiting example. Figure 5C In some embodiments, a series of at least two compressors 204 includes at least four compressors 204 (e.g., Figure 5BThe compressor set 202 includes a first compressor 204-1, a second compressor 204-2, ..., a compressor 204-m. In some such embodiments, at least four compressors 204 in the compressor set 202 are arranged in a herringbone array configuration such that the outlet of the first compressor set 204 in the series of at least four compressors 204 has a first slope, and the outlet of the second compressor set 204 in the series of at least four compressors 204 has a second slope, wherein the second slope is tangent to, substantially tangent to, or orthogonal to, or substantially orthogonal to the first slope. In some embodiments, the second slope is the reciprocal of the first slope. In some embodiments, the first slope has a 45-degree difference from the second slope or approximately a 45-degree difference from the second slope. In some embodiments, the herringbone configuration of the compressor set 202 is configured such that the steam generated by each compressor 204 flows in a first direction. In some such embodiments, the first compressor set 204 in the series of at least four compressors 204 is configured to change the direction of flow in a second direction, and the second compressor set 204 in the series of at least four compressors 204 is configured to change the direction of flow in a third direction, wherein the first direction, the second direction, and the third direction are each different directions. For example, in some embodiments, the herringbone configuration of the compressor unit 202 is configured such that the steam generated by each compressor 204 flows in a first horizontal direction, a first compressor set 204 of a series of at least four compressors 204 is configured to change the direction of flow in a second vertical direction, and a second compressor set 204 of a series of at least four compressors 204 is configured to change the direction of flow in a third vertical direction, wherein the second and third vertical directions are different. In some embodiments, the second vertical direction is related to gravity (e.g., Figure 5C g, which has the ability to enter Figure 5CThe vector direction of the page is opposite, and gravity is applied in the third vertical direction. However, this disclosure is not limited thereto. In some embodiments, the herringbone configuration of the compressor unit 202 is configured such that the steam 140, 206 generated by each compressor 204 flows in a first horizontal direction, a first compressor set 204 of a series of at least four compressors 204 is configured to change the direction of flow in a second horizontal direction, and a second compressor set 204 of a series of at least four compressors 204 is configured to change the direction of flow in a third horizontal direction, wherein the second and third horizontal directions are different. In some embodiments, the herringbone configuration is configured to maintain the flow through the compressor unit 204 at a constant or substantially constant height, such that a uniform or substantially uniform gravity is applied to the compressor unit 202. In some embodiments, the herringbone configuration of the compressor unit 202 is configured to provide an array of compressors arranged around a line (Y), wherein each compressor 204 in the compressor unit 202 is arranged in a unique position around the line according to a first constant amplitude and a first constant frequency. For example, in some embodiments, the herringbone configuration of compressor unit 202 is configured to provide an array of compressors arranged according to the following functions:

[0134] Y = B + (A * sin(k * X)), where Y is the first position of the corresponding compressor 204 in the compressor unit 202, B is the position of the end compressor 204 of the compressor unit 202, A is a constant amplitude, k is a constant frequency, and X is the second position of the corresponding compressor. However, this disclosure is not limited thereto. In some embodiments, each compressor 204 is arranged perpendicular, substantially perpendicular, orthogonal, substantially orthogonal, or a combination thereof to the direction of the preceding and / or following compressor 204.

[0135] In some embodiments, compressor unit 202 includes a first compressor 204-1 and a second compressor 204-2. The first compressor 204-1 includes a first optimal inlet volumetric flow rate. Furthermore, in some such embodiments, the second compressor 204-2 includes a second optimal inlet volumetric flow rate greater than the first optimal inlet volumetric flow rate of the first compressor 204-1. Additionally, in some such embodiments, the first compressor 204-1 is coupled upstream of the second compressor 204-2 in compressor unit 202.

[0136] refer to Figure 2A and Figure 2BIn some embodiments, a first compressor 204-1 is associated with a first size, and a second compressor 204-2 is associated with a second size. In some embodiments, the second size is equal to the first size. Alternatively, in some embodiments, the second size is different from the first size. For example, in some embodiments, the first compressor 204-1 has a first diameter, and the second compressor has a second diameter different from the first diameter. In some embodiments, the first diameter is larger than the second diameter. In some embodiments, the first diameter is the same as the second diameter. For example, in some embodiments, the first diameter is a number k chosen between 0.1 meters and 1.6 meters, and the second diameter is a number l chosen between 0.1 meters and 1.6 meters, where k and l are different numbers. However, this disclosure is not limited thereto. In some embodiments, a third compressor 204-3 has a second diameter and / or a third diameter larger than the second diameter. In some such embodiments, the third compressor is positioned upstream of the first compressor 204-1 and the second compressor 204-2. In some embodiments, a third compressor is disposed downstream of the first compressor 204-1 and upstream of the second compressor 204-2, such that the third compressor is inserted between the first compressor 204-1 and the second compressor 204-2 and fluidly coupled to the first compressor 204-1 and the second compressor 204-2. In some embodiments, the third compressor is fluidly coupled in series to the first compressor 204-1 and the second compressor 204-2. However, this disclosure is not limited thereto.

[0137] In some embodiments, compressor unit 202 includes a third compressor 204-3, which is adjacent to the first compressor 204-1 and the second compressor 204-2 and inserted between the first compressor 204-1 and the second compressor 204-2. Briefly, as a non-limiting example, reference is made to... Figure 4 The compressor unit 202 includes a second compressor 204-2, which is adjacent to... Figure 4 The system 104 includes a first compressor 204-1 and a third compressor 204-3, and is inserted between the first compressor 204-1 and the third compressor 204-3. However, this disclosure is not limited thereto. In some embodiments, the third compressor 204-3 includes a first optimal inlet volumetric flow rate or a second optimal inlet volumetric flow rate.

[0138] In some embodiments, each compressor 204 in compressor unit 202 has a compression ratio of less than 2.5. For example, in some embodiments, the compression ratio of a respective compressor 204 is defined by the ratio of the absolute discharge pressure to the absolute suction pressure of the respective compressor 204. In other words, in some such embodiments, the compression ratio of a respective compressor 204 is the ratio of the pressure at the inlet (e.g., inlet 224) of the respective compressor 204 to the pressure at the outlet of the respective compressor 204. Therefore, a higher compression ratio results in a greater pressure increase when fluid is compressed via the respective compressor 204.

[0139] In some embodiments, a series of at least two compressors 204 includes one or more centrifugal compressors 204, one or more piston compressors 204, one or more rotary compressors 204, one or more screw compressors 204, or combinations thereof.

[0140] Furthermore, in some embodiments, each of the at least two compressors 204 in the compressor unit 202 is a single-stage compressor 204. For example, in some embodiments, each stage of each compressor 204 is associated with a corresponding motor (e.g., Figure 9 The power supply 986) and / or the corresponding variable frequency drive (VFD) controller (e.g., Figure 9 This is associated with a controller 906, which allows the respective compressor 204 to operate individually, distinct from the rest of a series of at least two compressors 204. In some embodiments, the impeller speed (e.g., rotational speed) is controlled by a controller (e.g., controller 906). Figure 9 The impeller speed is controlled by a controller 906, which controls the impeller speed via a VFD associated with the corresponding motor. For example, in some embodiments, the speed is individually controlled (e.g., via...). Figure 9 The controller 906) adjusts the impeller speed of each compressor 204 in the compressor unit 202 to maintain a constant pressure for supplying high-pressure steam 140 to the facility. However, this disclosure is not limited thereto.

[0141] In some embodiments, controller 906 is configured to modify the rotational speed of a respective compressor 204 of a series of at least two compressors 204 in compressor assembly 202. For example, in some embodiments, controller 1906 is configured to modify the rotational speed of each respective compressor 204 in compressor assembly 202 to maintain the pressure at the outlet of compressor assembly 202, for example, to maintain the outlet pressure of high-pressure steam 140 at at least 80 PSI. However, this disclosure is not limited thereto. For example, in some embodiments, controller is configured to increase the rotational speed of first compressor 202-1, decrease the rotational speed of first compressor 202-1, increase the rotational speed of second compressor 202-2, decrease the rotational speed of second compressor 202-2, or a combination thereof (e.g., decreasing the rotational speed of first compressor 202-1 and increasing the rotational speed of second compressor 202-2, etc.). However, this disclosure is not limited thereto.

[0142] In addition, compressor unit 202 includes an inlet for compressor unit 202 (e.g., Figures 2A to 5B (e.g., the first inlet 216-1 of any of them), said inlet allows compressor unit 202 to receive a medium flow, such as low-pressure steam (e.g., from the respective flash evaporator in flash evaporator group 210) generated by a corresponding flash evaporator in flash evaporator group 210. Figures 2A to 5B The first low-pressure steam 206-1 generated by the first flash evaporator 212-1 of either of them, by Figures 2A to 5B The second low-pressure steam 206-2 produced by the second flash evaporator 212-2 of any of them, ... the low-pressure steam n 206-n produced by the flash evaporator n 212-n, etc.

[0143] In addition, compressor unit 202 includes an outlet for compressor unit 202 (e.g., Figures 2A to 5B (e.g., outlet 208 of any of the above). In some embodiments, outlet 208 of compressor unit 202 is configured to provide high-pressure steam to facility 102. For example, in some embodiments, outlet 208 of compressor unit 202 is configured to couple to an existing steam manifold of facility 102, which allows system 104 to provide high-pressure steam 140 without requiring reconfiguration of facility 102, for example by requiring a new steam manifold at facility 102.

[0144] refer to Figures 5A to 5CIn some embodiments, three or more compressors 204 in compressor unit 202 have decreasing sizes along the forward direction from the inlet to the outlet of compressor unit 202. In some embodiments, in compressor unit 202, an upstream compressor is positioned closer to the inlet than a downstream compressor, and the size of the upstream compressor is less than or equal to the size of the downstream compressor. In some embodiments, three or more compressors 204 in compressor unit 202 have the same size along the direction from the inlet to the outlet of compressor unit. In some embodiments, all compressors 204 in compressor unit 202 are equal to or less than a predefined compressor size limit. In some embodiments, during the process of designing system 104, the number of compressors 204 in compressor unit 202 is determined based on steam parameters 116 (e.g., pressure and temperature) measured at the inlet and outlet of compressor unit 202. The size of the compressors 204 in compressor unit 202 increases along the reverse direction from the outlet to the inlet of compressor unit 202. In some cases, a subset 204 of compressors coupled to the inlet (e.g., two compressors) has the same size equal to a predefined compressor size limit. Based on the determination that the compressor subset 204 contains two or more compressors 204, one or more flash evaporators 212 are added to facilitate the corresponding cascade compression process implemented by the compressor unit 202.

[0145] In some embodiments, the outlet of compressor unit 202 is configured to provide high-pressure steam 140 at a pressure between 50 PSI (3.44 Bar) and 315 PSI (21.7 Bar). For example, in some embodiments, compressor unit 202 is configured between 50 PSI (3.44 Bar) and 300 PSI (20.7 Bar), between 50 PSI (3.44 Bar) and 275 PSI (19.0 Bar), between 50 PSI (3.44 Bar) and 250 PSI (17.2 Bar), between 50 PSI (3.44 Bar) and 225 PSI (15.5 Bar), between 50 PSI (3.44 Bar) and 200 PSI (13.8 Bar), between 50 PSI (3.44 Bar) and 175 PSI (12.1 Bar), between 50 PSI (3.44 Bar) and 150 PSI (10.3 Bar), between 50 PSI (3.44 Bar) and 125 PSI (8.62 Bar), and between 50 PSI (3.44 Bar) and 100 PSI (6.89 Bar). Between 110 PSI (7.58 Bar) and 315 PSI (21.7 Bar), between 110 PSI (7.58 Bar) and 300 PSI (20.7 Bar), between 110 PSI (7.58 Bar) and 275 PSI (19.0 Bar), between 110 PSI (7.58 Bar) and 250 PSI (17.2 Bar), between 110 PSI (7.58 Bar) and 225 PSI (15.5 Bar), between 110 PSI (7.58 Bar) and 200 PSI (13.8 Bar), between 110 PSI (7.58 Bar) and 175 PSI (12.1 Bar), between 110 PSI (7.58 Bar) and 150 PSI (10.3 Bar), between 110 PSI (7.58 Bar) and 125 PSI (8.62 Bar). Between 170 PSI (11.7 Bar) and 315 PSI (21.7 Bar), between 170 PSI (11.7 Bar) and 300 PSI (20.7 Bar), between 170 PSI (11.7 Bar) and 275 PSI (19.0 Bar), between 170 PSI (11.7 Bar) and 250 PSI (17.2 Bar), between 170 PSI (11.7 Bar) and 225 PSI (15.5 Bar), and between 170 PSI (11.7 Bar) and 200 PSI (13.0 Bar).High-pressure steam 140, including end values, is supplied to the existing steam main of facility 102 at pressures between 8 Bar, 170 PSI (11.7 Bar) and 175 PSI (12.1 Bar), 230 PSI (15.6 Bar) and 315 PSI (21.7 Bar), 230 PSI (15.6 Bar) and 300 PSI (20.7 Bar), 230 PSI (15.6 Bar) and 275 PSI (19.0 Bar), 230 PSI (15.6 Bar) and 250 PSI (17.2 Bar), 290 PSI (20.0 Bar) and 315 PSI (21.7 Bar), or 290 PSI (20.0 Bar) and 300 PSI (20.7 Bar). In some embodiments, compressor unit 202 is configured to supply high-pressure steam 140 to the existing steam manifold of facility 102 at pressures of at least 50 PSI (3.44 Bar), at least 70 PSI (4.83 Bar), at least 90 PSI (6.21 Bar), at least 110 PSI (7.58 Bar), at least 130 PSI (8.96 Bar), at least 150 PSI (10.3 Bar), at least 170 PSI (11.7 Bar), at least 190 PSI (13.1 Bar), at least 210 PSI (14.5 Bar), at least 230 PSI (15.6 Bar), at least 250 PSI (17.2 Bar), at least 270 PSI (18.6 Bar), at least 290 PSI (20.0 Bar), or at least 310 PSI (21.4 Bar). In some embodiments, the compressor unit 202 is configured to operate at up to 50 PSI (3.44 Bar), up to 70 PSI (4.83 Bar), up to 90 PSI (6.21 Bar), up to 110 PSI (7.58 Bar), up to 130 PSI (8.96 Bar), up to 150 PSI (10.3 Bar), up to 170 PSI (11.7 Bar), up to 190 PSI (13.1 Bar), up to 210 PSI (14.5 Bar), up to 230 PSI (15.6 Bar), up to 250 PSI (17.2 Bar), up to 270 PSI (18.6 Bar), up to 290 PSI (20.0 Bar), or up to 310 PSI (21.0 Bar).The system 104 supplies high-pressure steam 140 to the existing steam main of facility 102 at a pressure of 4 Bar. Therefore, system 104 is capable of supplying high-pressure steam 140 to facility 102 at a pressure sufficient to allow the high-pressure steam 140 to be directly utilized by facility 102. In some embodiments, all pressures in this paragraph are referred to as gauge pressures. In some embodiments, unless otherwise expressly stated, all pressures in this disclosure are gauge pressures.

[0146] System 104 further includes a flash evaporator assembly (e.g., Figures 2A to 5B Flash evaporator group 210, etc., of any of the flash evaporators. Flash evaporator group 210 comprises a series of at least two flash evaporators (e.g., Figures 2A to 5B The first flash evaporator 212-1 of any of them Figures 2A to 5B The second flash evaporator 212-2 of any of them, ... Figure 5B(e.g., flash evaporator 212-n). For example, in some embodiments, the flash evaporator group 210 includes flash evaporators 212 of between two and twenty, between two and seventeen, between two and fifteen, between two and twelve, between two and nine, between two and six, between two and three, between three and twenty, between three and seventeen, between three and fifteen, between three and twelve, between three and nine, between three and six, between five and twenty, between five and seventeen, between five and fifteen, between five and twelve, between five and nine, and between five and six. Flash evaporators 212 with between seven and twenty units, flash evaporators 212 with between seven and seventeen units, flash evaporators 212 with between seven and fifteen units, flash evaporators 212 with between seven and twelve units, flash evaporators 212 with between seven and nine units, flash evaporators 212 with between nine and twenty units, flash evaporators 212 with between nine and seventeen units, flash evaporators 212 with between nine and fifteen units, flash evaporators 212 with between nine and twelve units, flash evaporators 212 with between eleven and twenty units. Flash evaporators 212 with 11 to 17, 11 to 15, 11 to 12, 13 to 20, 13 to 17, 13 to 15, 15 to 20, 15 to 17, or 17 to 20, including end values. In some embodiments, the flash evaporator group 210 includes at least two flash evaporators 212, at least three flash evaporators 212, at least four flash evaporators 212, at least five flash evaporators 212, at least six flash evaporators 212, at least seven flash evaporators 212, at least eight flash evaporators 212, at least nine flash evaporators 212, at least ten flash evaporators 212, at least eleven flash evaporators 212, at least twelve flash evaporators 212, at least thirteen flash evaporators 212, at least fourteen flash evaporators 212, at least fifteen flash evaporators 212, at least sixteen flash evaporators 212, at least seventeen flash evaporators 212, at least eighteen flash evaporators 212, at least nineteen flash evaporators 212, or at least twenty flash evaporators 212.In some embodiments, the flash evaporator group 210 includes up to two flash evaporators 212, up to three flash evaporators 212, up to four flash evaporators 212, up to five flash evaporators 212, up to six flash evaporators 212, up to seven flash evaporators 212, up to eighteen flash evaporators 212, up to nine flash evaporators 212, up to ten flash evaporators 212, up to eleven flash evaporators 212, up to twelve flash evaporators 212, up to thirteen flash evaporators 212, up to fourteen flash evaporators 212, up to fifteen flash evaporators 212, up to sixteen flash evaporators 212, up to seventeen flash evaporators 212, up to eighteen flash evaporators 212, up to nineteen flash evaporators 212, or up to twenty flash evaporators 212. However, this disclosure is not limited thereto. Brief reference is made, for example. Figure 5C In some embodiments, the flash evaporator group 210 includes a flash evaporator 212 as an end flash evaporator 212. In some embodiments, the flash evaporator group 210 consists of a single flash evaporator 212.

[0147] In some embodiments, each compressor 204 in compressor unit 202 and each flash evaporator 212 in flash evaporator unit 210 share a one-to-one relationship. For example, briefly refer to... Figure 2A System 104 describes a one-to-one relationship between each compressor 204 in compressor group 202 and each flash evaporator 212 in flash evaporator group 210, since compressor group 202 has two compressors 204 and flash evaporator group 210 similarly has two flash evaporators 212. In some embodiments, compressor 204 and flash evaporator 212 share a one-to-one relationship when the temperature difference between the first compressor and the second compressor meets a threshold temperature such as 10°C or 20°C. In some embodiments, compressor 204 and flash evaporator 212 share a one-to-one relationship when the temperature difference between the first flash evaporator and the second flash evaporator meets a threshold temperature such as 20°C. Therefore, in some embodiments, compressor group 202 includes p compressors (e.g., first compressor 204-1, second compressor 204-2, ..., compressor p 204-p), and flash evaporator group 210 includes p flash evaporators 212 (e.g., first flash evaporator 212-1, second flash evaporator 212-2, ..., flash evaporator p 212-p), where p is an integer (i) greater than or equal to two and (ii) less than or equal to twenty. In some embodiments, p is an integer (i) greater than two and (ii) less than or equal to twenty. However, this disclosure is not limited thereto. In some embodiments, each compressor 204 in compressor group 202 and each flash evaporator 212 in flash evaporator group 210 share a many-to-one relationship. As another non-limiting example, brief reference is made to... Figure 4System 104 describes a many-to-one relationship between each compressor 204 in compressor unit 202 and each flash evaporator 212 in flash evaporator unit 210, since compressor unit 202 has three compressors 204 and flash evaporator unit 210 has two flash evaporators 212. For example, in some embodiments, when a first size of first compressor 204 is the same as a second size of second compressor 204, then a first flash evaporator 212 is placed between the first compressor 204 and the second compressor 204, which creates a many-to-one relationship. Therefore, in some embodiments, compressor group 202 includes m compressors 204 (e.g., first compressor 204-1, second compressor 204-2, ..., compressor m 204-m), and flash evaporator group 210 includes n flash evaporators 212 (e.g., first flash evaporator 212-1, second flash evaporator 212-2, ..., flash evaporator n 212-n), where m and n are each (i) greater than or equal to two and (ii) less than or equal to twenty, and m is greater than n.

[0148] Similar to a series of at least two compressors 204 in compressor unit 202, a series of at least two flash evaporators 212 in flash evaporator unit 210 are at least partially fluidly coupled in series, allowing media flow from one flash evaporator 212 to another flash evaporator 212 in the series of at least two flash evaporators. For example, in some embodiments, brief reference is made... Figure 2A When a series of at least two flash evaporators 212 are at least partially fluidly coupled in series, the series of at least two flash evaporators 212 includes traces through both the second inlet 224-2 of the second flash evaporator 212-2, the second liquid outlet 228-2 of the second flash evaporator, and the first inlet 224-1 of the first flash evaporator 212-1 in the flash evaporator group 210.

[0149] Therefore, a series of at least two flash evaporators 212 are included at one end of the flash evaporator group 210, specifically as an end flash evaporator 212. For example, briefly refer to... Figure 2A The first flash evaporator 212-1 is a first end flash evaporator 212 at one end of a series of at least two flash evaporators 212, and the second flash evaporator 212-2 is a second end flash evaporator 212 at a second end of a series of at least two flash evaporators 212. As another non-limiting example, brief reference is made. Figure 5A The first flash evaporator 212-1 is a first end flash evaporator 212 at one end of a series of at least two flash evaporators 212, and the flash evaporator 212-n is a second end flash evaporator 212 at the second end of a series of at least two flash evaporators 212. Therefore, by fluidly connecting at least two flash evaporators 212 in series, the flash evaporator group 210 can utilize steam condensate (e.g., Figures 2A to 5B The heat energy of the steam condensate return 214 (or any of the above). However, this disclosure is not limited thereto.

[0150] In some embodiments, each of at least two flash evaporators 212 in a series is configured to maintain (e.g., by means of) Figure 9 The control module 906 maintains a predetermined internal pressure or a predetermined internal pressure range that is less than the saturation pressure of the hot water received by the system 104. For example, in some embodiments, each flash evaporator 212 is configured to be maintained at an internal pressure less than the saturation pressure of the hot water received from the inlet 224 in the respective flash evaporator 212. Furthermore, each of at least two flash evaporators 212 in a series is configured to expand the hot water received by the inlet 224 of the flash evaporator 212 to generate low-pressure steam (e.g., by...). Figures 2A to 5B The first low-pressure steam 206-1 generated by the first flash evaporator 212-1 of either of them, by Figures 2A to 5B The second low-pressure steam 206-2 generated by the second flash evaporator 212-2 in any of the flash evaporators, ... the low-pressure steam n 206-n generated by the flash evaporator n212-n, etc.). For example, in some embodiments, the internal pressure of the corresponding flash evaporator 212 in the flash evaporator group 210 is based on the first temperature of the hot water received by the system 104 or the condensate received by the corresponding flash evaporator 212 (e.g., Figure 4 Steam condensate return 214, Figure 2A The second temperature (such as the steam outlet 228-2, etc.) is determined. As a non-limiting example, in some embodiments, the hot water source 110 provides hot water at a temperature of 120℉, and then the terminal flash evaporator 212-1 in the flash evaporator group 210 is configured to have an internal pressure of about 88 millibars absolute (mBara), which is the saturation pressure of water at 110℉. However, this disclosure is not limited thereto. In some embodiments, the internal pressure of the respective flash evaporator 212 is less than the saturation temperature of the medium received by the flash evaporator, such as liquid received from the liquid outlet 228 of the adjacent flash evaporator 212 or hot water received from the hot water source 110. Therefore, by using each of at least two flash evaporators 212 configured to be maintained at a predetermined internal pressure or a predetermined internal pressure range less than the saturation pressure of the hot water received by the system 104, the system 104 is not only able to connect to various facilities 303 with different hot water source 110 temperatures, but also to substantially adapt to variations in the operating parameters 916 at the respective facilities 102 connected to the system 104.

[0151] In some embodiments, one or more flash evaporators 212 in the flash evaporator group 210 are disposed at the inlet of the flash evaporator group 210 (e.g., Figures 2A to 5BAbove the second inlet 224-2 of any of the flash evaporators 212, such that each flash evaporator 212 in the flash evaporator group 210 is raised or substantially raised above the inlet 224-2 of the flash evaporator group 210, this effectively increases the potential energy of each flash evaporator 212 in the flash evaporator group 210. By placing one or more flash evaporators 212 in the flash evaporator group 210 above the inlet 224-2 of the flash evaporator group 210, the system 104 is configured to utilize the additional potential energy obtained from the pressure difference between the inlet 224-2 of the flash evaporator group 210 and the height of the one or more flash evaporators 212 in the flash evaporator group 210. Furthermore, this configuration allows the system 104 to have minimal power consumption (e.g., when receiving cooled water generated by each of the one or more flash evaporators 212 in the flash evaporator group 210) when receiving cooled water. Figure 9 Operation Figure 2A The power consumed by the power supply 986 required for the reboost pump 220.

[0152] Therefore, in some embodiments, each of the series of at least two flash evaporators 212 includes two or more outlets. For example, in some embodiments, the steam outlet (e.g., Figures 2A to 5B Steam outlet 226-1 of either of the flash evaporators 212-1 Figures 2A to 5B Steam outlet 226-2 of either flash evaporator 212-2 Figure 5A The flash evaporator 212-n, including its steam outlet 226-n, is configured to deliver low-pressure steam 206 generated by the flash evaporator 212 to the compressor 204 in the compressor unit 202. For example, in some embodiments, the first steam outlet 226-1 of the terminal flash evaporator 212-1 is fluidly coupled to the inlet 216-1 of the compressor unit 202.

[0153] Additionally, system 104 includes a series of vapor outlets 226 for the remainder of at least two flash evaporators 212, said vapor outlets being fluidly coupled between compressors 204 in a series of at least two compressors 204 within compressor unit 202. Briefly, as a non-limiting example, reference is made to... Figure 2A and Figure 4 The second steam outlet 226-2 of the second flash evaporator 212-2 is fluidly coupled to the second inlet 216-2 of the second compressor 204-2 in the compressor unit 202. As yet another non-limiting example, brief reference is made... Figure 3 The second steam outlet 226-2 of the second flash evaporator 212-2 is fluidly coupled to the third inlet 216-3 of the third compressor 204-3 in the compressor unit 202.

[0154] In some embodiments, the flash evaporator assembly 210 further includes an inlet for the flash evaporator assembly 210 (e.g., Figure 5AThe first flash evaporator 212-1 has a second inlet 224-2, etc. The inlet 224 of the flash evaporator assembly 210 is configured to receive hot water from facility 102 (e.g., a hot water source 110 from any of Figures 1 to 5). For example, in some embodiments, the inlet 224 of the flash evaporator assembly 210 is configured to receive the same facility 102 from which high-pressure steam 140 is supplied (e.g., from system 104). Figure 1B The first facility 102-1) receives hot water from its hot water source 110, or receives hot water from a different facility 102 (e.g., Figure 1A The hot water received from the hot water source 110 of the second facility 102-2). In some embodiments, the different facilities 102 providing hot water received from the hot water source 110 are not associated with the utilization of the high-pressure steam 140 generated by the system 104. However, this disclosure is not limited thereto. Furthermore, in some such embodiments, the efficiency of the system 104 is improved by utilizing hot water as a medium flowing along the system 104 (e.g., as a refrigerant for the system 104) because water has zero global warming potential (0 GWP), is non-flammable and non-toxic, and poses no regulatory risks compared to other conventional refrigerants such as toxic and / or flammable hydrofluorocarbons (HFCs) and / or hydrofluoroolefins (HFOs).

[0155] In some embodiments, the inlet 224 of the flash evaporator group 210 is the inlet of the terminal flash evaporator 212-1 in the flash evaporator group 210. For example, in some embodiments, the second inlet 224-2 of the terminal flash evaporator 212-1 is configured to receive hot water received from the hot water source 110, which is supplied to the interior of the terminal flash evaporator 212-1.

[0156] In some embodiments, the remainder of a series of at least two flash evaporators 212 each includes a liquid outlet (e.g., a second liquid outlet 228-2 of any of Figures 2 through 5). Each liquid outlet 228 of the remainder of each of the series of at least two flash evaporators 212 is fluidly coupled to an inlet 224 of the other of the series of at least two flash evaporators 212. Briefly, reference is made as a non-limiting example. Figure 2A The second flash evaporator 212-2 belongs to the remainder of a series of at least two flash evaporators 212, because the second flash evaporator 212-2 is not the end flash evaporator 212-1 in the flash evaporator group 210, and the second flash evaporator 212-2 includes a second liquid outlet 228-2 that is fluidly coupled to the inlet 224-1 of the end flash evaporator 212-1 in the series of at least two flash evaporators 212.

[0157] In some embodiments, the terminal flash evaporator 212-1 includes a liquid outlet fluidly coupled to the outlet of system 104 (e.g., the first liquid outlet 228-1 of any of Figures 2 to 5). As a non-limiting example, in some embodiments, the outlet of system 104 is a cooling water source associated with either a first facility 102-1 receiving high-pressure steam 140 generated by system 104 or a second facility 102-2 associated with hot water received by system 104 from hot water source 110 (e.g., Figures 1 to 5). Figure 7 (e.g., cooling water source 120 of any of the facilities). For example, in some embodiments, the outlet of the cooling water source 120 of system 104 is fluidly coupled to the hot water received from facility 102 or a different facility 102 from the hot water source 110. In this way, in some such embodiments, the outlet of the cooling water source 120 of system 104 is configured as a cooling water source for a closed-loop cooling water process associated with the facility providing the hot water source 110. Furthermore, in some embodiments, by connecting system 104 only to the existing steam header and cooling water source 120 of the same facility 102, system 104 does not require significant modifications to operate under the unique operating conditions of the respective facility 102.

[0158] In some embodiments, the liquid outlet 228-1 of the terminal flash evaporator 212-1 is fluidly coupled to a reboost pump (e.g., reboost pump 220 of any of Figures 2 to 5). The reboost pump 220 is coupled to the outlet of the cooling water source 120 of system 104, thereby interposed between the liquid outlets 228 of the terminal flash evaporator 212-1. This allows the reboost pump 220 to deliver the fluid generated by the terminal flash evaporator 212-1 to the outlet of the cooling water source 120 when a pressure gradient exists between the pressure of the fluid generated by the terminal flash evaporator 212-1 and the outlet of the cooling water source 120 of system 104. For example, in some embodiments, the reboost pump 220 is configured to generate a negative pressure gradient to receive cooled water generated by the flash evaporator 212 from the liquid outlet 228 of the flash evaporator 212, for example, to maintain a stable state of the flash evaporator 212. However, this disclosure is not limited thereto. In some embodiments, the booster pump 220 is configured to maintain the pressure at the liquid outlet 228 of the flash evaporator 212 at a predetermined pressure or a predetermined pressure range.

[0159] In some embodiments, system 104 includes one or more valves (e.g., the first valve 218-1 of any of Figures 2 to 5). Figures 2A to 5B The second valve 218-2 of either of them Figure 5A The third valve 218-3, Figure 5A The fourth valve 218-4, ... Figure 5AValves n 218-n, etc.), each of one or more of the valves 218 is configured to control (e.g., block and / or delay) the flow of medium through the valve 218 (e.g., the flow rate of hot water received from hot water source 110, the flow rate of low-pressure steam 206, the flow rate of cooling water, etc.), wherein the flow is ultimately received by or from a corresponding flash evaporator 212. In some embodiments, one or more of the valves 218 are located at the inlet of the corresponding flash evaporator 212 (e.g., Figure 5A First entrance 224-1 Figure 5A The second inlet 224-2, etc., is upstream of or downstream of the outlet of the corresponding flash evaporator 212, such as steam outlet 226 or liquid outlet 228. In some embodiments, each valve 218 is configured to meter the flow rate of the medium received by or from the corresponding flash evaporator 212 (e.g., the flow rate of hot water received from hot water source 110, the flow rate of low-pressure steam 206, the flow rate of cooled water, etc.).

[0160] In some embodiments, system 104 further includes a controller (e.g., Figure 9 (Control module 906, etc.). In some embodiments, controller 906 is configured to maintain a temperature range for flash evaporator group 210, such as maintaining the temperature of high-pressure steam 140 generated by system 104 and / or the temperature of the outlet of system 104, such as the temperature of cooling water source 120 associated with facility 102.

[0161] In some embodiments, the controller 906 is configured to maintain a respective centrifugal compressor 204 in the compressor unit 202 free from blockage or surge. For example, in some embodiments, the controller 906 is configured to determine whether the mass flow rate associated with a respective centrifugal compressor 204 in the compressor unit 202 satisfies a first threshold mass flow rate associated with a blockage condition of flow within the respective centrifugal compressor 204 and / or a second threshold mass flow rate associated with a surge condition of flow within the respective centrifugal compressor 204. However, this disclosure is not limited thereto. As a non-limiting example, each respective compressor 204 has a minimum mass flow rate at which the respective compressor 204 can operate stably, which is the surge condition.

[0162] In some embodiments, system 104 further includes a superheater assembly (e.g., Figure 5A (e.g., a superheater assembly 230). In some embodiments, the superheater assembly 230 includes at least one superheater (e.g., a superheater). Figure 5A(e.g., first superheaters 232-1, 232-2, ..., and 232-q, etc.). For example, in some embodiments, the superheater group 230 includes superheaters 232 with two to twenty units, two to seventeen units, two to fifteen units, two to twelve units, two to nine units, two to six units, two to three units, three to twenty units, and three to seventeen units. 232, Superheaters with between three and fifteen units; Superheaters with between three and twelve units; Superheaters with between three and nine units; Superheaters with between three and six units; Superheaters with between five and twenty units; Superheaters with between five and seventeen units; Superheaters with between five and fifteen units; Superheaters with between five and twelve units; Superheaters with between five and nine units; Superheaters with between five and six units. Superheater 232 with between seven and twenty units; superheater 232 with between seven and seventeen units; superheater 232 with between seven and fifteen units; superheater 232 with between seven and twelve units; superheater 232 with between seven and nine units; superheater 232 with between nine and twenty units; superheater 232 with between nine and seventeen units; superheater 232 with between nine and fifteen units; superheater 232 with between nine and twelve units; superheater 232 with between eleven and twenty units. 2. Superheaters 232 between eleven and seventeen, eleven and fifteen, eleven and twelve, thirteen and twenty, thirteen and seventeen, thirteen and fifteen, fifteen and twenty, or seventeen and twenty, including end values. In some embodiments, the superheater group 230 includes at least two superheaters 232, at least three superheaters 232, at least four superheaters 232, at least five superheaters 232, at least six superheaters 232, at least seven superheaters 232, at least eight superheaters 232, at least nine superheaters 232, at least ten superheaters 232, at least eleven superheaters 232, at least twelve superheaters 232, at least thirteen superheaters 232, at least fourteen superheaters 232, at least fifteen superheaters 232, at least sixteen superheaters 232, at least seventeen superheaters 232, at least eighteen superheaters 232, at least nineteen superheaters 232, or at least twenty superheaters 232.In some embodiments, the superheater group 230 includes up to two superheaters 232, up to three superheaters 232, up to four superheaters 232, up to five superheaters 232, up to six superheaters 232, up to seven superheaters 232, up to eight superheaters 232, up to nine superheaters 232, up to ten superheaters 232, up to eleven superheaters 232, up to twelve superheaters 232, up to thirteen superheaters 232, up to fourteen superheaters 232, up to fifteen superheaters 232, up to sixteen superheaters 232, up to seventeen superheaters 232, up to eighteen superheaters 232, up to nineteen superheaters 232, or up to twenty superheaters 232.

[0163] Each superheater 232 in the superheater assembly 230 includes an outlet configured to inject hot water received from facility 102 or different facilities 102 into compressor assembly 202. For example, in some embodiments, each superheater 232 in the superheater assembly 230 is configured to receive a supply of hot water received from hot water source 110 to a portion of the inlet 224-2 of terminal flash evaporator 212-1, which allows the superheater assembly 230 to utilize the same source of hot water received from hot water source 110. However, this disclosure is not limited thereto. In some embodiments, each superheater 232 in the superheater assembly 230 is configured to remove heat (e.g., superheat) added to low-pressure steam 206 by each compressor 204 in compressor assembly 202 by injecting hot water received from hot water source 110 into low-pressure steam 206 between compressors 204. Therefore, in some such embodiments, the water injected by the desuperheater 232 evaporates, which removes superheat from the low-pressure steam 206 and increases the mass flow of the low-pressure steam 206 through system 104. In some embodiments, the desuperheater group 230 is configured such that each compressor 204 in the compressor group 202 does not require an interstage cooler. Furthermore, in some embodiments, the high efficiency of system 104 is achieved by utilizing the desuperheater group 230 to provide desuperheating of the low-pressure steam 206 as it is compressed by the compressor 204, which allows system 104 to operate at or near the water saturation line without additional heat loss due to the intercooler or entropy loss due to excessive superheating.

[0164] In some embodiments, each compressor 204 in compressor unit 202 and each superheater 232 in superheater unit 230 share a one-to-one relationship. For example, briefly refer to... Figure 5ASystem 104 describes a one-to-one relationship between each compressor 204 in compressor unit 202 and each superheater 232 in superheater unit 230, since compressor unit 202 has four compressors 204 and superheater unit 230 similarly has four superheaters 232. Therefore, in some embodiments, compressor unit 202 comprises m compressors (e.g., Figure 5A The first compressor 204-1, the second compressor 204-2, ..., the compressor m204-m), and the superheater group 230 includes q superheaters 232 (e.g., Figure 5A The first superheater 232-1, the second superheater 232-2, ..., superheater q 232-q), where m and q are the same integers (i) greater than or equal to two and (ii) less than or equal to twenty. In some embodiments, m and q are the same integers (i) greater than two and (ii) less than or equal to twenty. However, this disclosure is not limited thereto. In some embodiments, each compressor 204 in compressor group 202 and each superheater 232 in superheater group 230 share a many-to-one relationship. Thus, in some such embodiments, compressor group 202 comprises m compressors and superheater group 230 comprises q superheaters 232, where m and q are each (i) greater than or equal to two and (ii) less than or equal to twenty, and m is greater than q. However, this disclosure is not limited thereto.

[0165] In some embodiments, system 104 includes a coefficient of performance (COP) greater than 65% of a corresponding Carnot efficiency, where Carnot efficiency represents the highest possible efficiency of a heat pump system operating between a higher temperature source and a lower temperature source. For example, in some embodiments, system 104, operating as a heat pump system 104 between two sources at different heat temperatures (e.g., a higher-temperature hot water source 110 and a lower-temperature cooling water source 120, a lower-temperature hot water source 110 and higher-temperature high-pressure steam, a higher-temperature high-pressure steam and a lower-temperature cooling water source 120, or combinations thereof), has associated efficiency ratings determined based on the coefficient of performance (COP), energy efficiency ratio (EER), etc. In some embodiments, the COP is determined by dividing the value of heat transferred from the lower temperature source by a network input, which is the value of heat transferred to the higher temperature source minus a refrigerant effect value. For example, in some embodiments, the COP of system 104 is determined based on the temperature of the high-pressure steam 140 generated by system 104 and the temperature of the hot water source 110 providing hot water received by the system. In some embodiments, the COP of system 104 is determined based on the ratio of the electrical power consumption of system 104 to the output thermal power of system 104. In some embodiments, the corresponding Carnot efficiency percentage is determined based on the ratio of the Carnot COP to the actual COP of system 104. Additional details and information regarding the COP and / or Carnot efficiency of heat pump systems can be found in Sadegh et al., 2018, “Marks' Standard Handbook for Mechanical Engineers”, McGraw-Hill Education, print, which is hereby incorporated in its entirety for all purposes.

[0166] In some embodiments, the flash evaporator 212 in the flash evaporator assembly 210 includes a drain element (e.g., Figure 1A or Figure 5B(e.g., a blowdown device 170). In some embodiments, the blowdown device 170 is configured to remove contaminants contained in the flash evaporator 212. For example, in some embodiments, the blowdown device 170 is configured to continuously remove contaminants contained in the flash evaporator 212 (e.g., continuous blowdown device 170) or intermittently remove contaminants contained in the flash evaporator 212. For example, in some embodiments, the contaminants comprise one or more fluids and / or one or more solids, which are at least partially removed from the system 104 by discharging the contaminants via the blowdown device 170, allowing downstream components of the system 104 and the flash evaporator 212 to remain unimpeded by the contaminants in terms of heat transfer efficiency. In some embodiments, the contaminants contain no or substantially no steam (e.g., low-pressure steam 206, high-pressure steam 140, etc.). In some embodiments, by purging the contaminants via the blowdown device 170, the flash evaporator 212 is allowed to further receive hot water received from the hot water source 110, and thus generate high-pressure steam 140 via the compressor unit 202, such as makeup hot water received from the hot water source 110. Furthermore, in some embodiments, the drain element 170 is configured to remove contaminants at least partially at a temperature below a first temperature of the hot water, which allows purging to be completed without causing heat loss to system 104. However, this disclosure is not limited thereto. In some embodiments, the drain element 170 is configured to continuously remove contaminants without active control mechanisms (e.g., without receiving one or more instructions from controller 906). For example, in some embodiments, the drain element 170 is in electronic communication with a sensor 982 configured to detect one or more contaminants within the flash evaporator 212, such as a conductivity sensor 982, which provides feedback information to the drain element 170 regarding the state of one or more contaminants.

[0167] In some embodiments, the drain 170 is associated with a second liquid outlet of a corresponding flash evaporator 212 in the flash evaporator assembly 210. In some embodiments, the drain 170 is fluidly configured to selectively remove fluid from the corresponding flash evaporator 212.

[0168] In some embodiments, the controller 906 is in electronic communication with the second liquid outlet of the corresponding flash evaporator 212. In some embodiments, the controller is configured to control the selective removal of fluid.

[0169] In some embodiments, the flash evaporator 212 in the flash evaporator group 210 includes a degasser (e.g., Figure 5B(e.g., degasser 240). In some embodiments, degasser 240 is configured to form an outlet of flash evaporator 212, such as a second liquid outlet of flash evaporator 212. In some embodiments, degasser 240 is configured to selectively remove fluid from a corresponding flash evaporator 412. For example, in some embodiments, based on the determination of a threshold amount of a first medium (e.g., contaminants within the flash evaporator, hot water within the flash evaporator, steam within the flash evaporator, etc.), degasser 240 is configured to modify the opening of the outlet of flash evaporator 212, which allows selective removal of fluid from the corresponding flash evaporator 212. In some such embodiments, the fluid removed from the corresponding flash evaporator 212 comprises one or more gases (e.g., oxygen, carbon dioxide, etc.) contained in flash evaporator 212 and / or one or more liquids contained in flash evaporator 212. However, this disclosure is not limited thereto. In some embodiments, controller 1906 of system 104 is in electronic communication with the second liquid outlet associated with degasser 240. In some such embodiments, controller 1906 is configured to selectively allow fluid communication between the second liquid outlet and the outlet of system 104, which allows fluid removal from flash evaporator 212. In some embodiments, controller 906 is configured to modify the flow rate of fluid passing through superheater 232 based on a determination that the temperature and / or pressure associated with compressor unit 202 meets a threshold pressure and / or temperature. As a non-limiting example, in some embodiments, controller 906 is configured to modify the size of the second outlet, such as the diameter of the orifice or opening of the outlet of superheater 232. For example, in some embodiments, based on a determination that the pressure associated with compressor 204 is less than a threshold pressure and therefore does not meet the threshold pressure, controller is configured to reduce the size of the second outlet (e.g., the diameter of the orifice) to increase the internal pressure of system 104 and / or to modify the mass flow rate of fluid output from superheater 232. However, this disclosure is not limited thereto.

[0170] In some embodiments, system 104 further includes one or more boilers (e.g., Figure 5A Boiler 236. Boiler 236 is arranged to be inserted between and fluidly coupled to the outlets 208 of compressor unit 202. In some embodiments, boiler 236 is configured to remove moisture or condensate from the high-pressure steam 140 generated by compressor unit 202. For example, in some embodiments, boiler 236 is configured to heat the high-pressure steam, for example, to generate superheated steam. In some embodiments, boiler 236 is configured to provide supplemental steam to address peak steam demand from facility 102 that exceeds the steam generation capacity of compressor unit 202. In some embodiments, boiler 236 is configured to serve as a backup source of steam generation for facility 102 in the event of an intentional or unintentional power outage of compressor unit 202. However, this disclosure is not limited thereto.

[0171] In some embodiments, system 104 further includes a steam accumulator (e.g., Figure 5A (Steam accumulator 238). The steam accumulator 238 is arranged to be inserted between and fluidly coupled to the outlets 208 of the compressor unit 202. For example, in some embodiments, the steam accumulator 238 is configured to increase the storage capacity of the system 104, which allows the system 104 to respond to fluctuations (e.g., one or more peaks and / or one or more troughs) in the facility's demand for the high-pressure steam 140 generated by the system 104.

[0172] The systems, methods, and apparatus disclosed herein have other features and advantages that will be apparent from or set forth in more detail in the accompanying drawings and the following detailed description incorporated herein, which together serve to explain certain principles of the invention.

[0173] Figure 6 A graph depicting various parameters associated with various high-pressure steam-generating heat pump systems according to some embodiments. References Figure 6 In some embodiments, the systems, methods, and apparatus of this disclosure provide a plurality of heat pump systems 104. In some embodiments, each of the plurality of heat pump systems 104 is configured to achieve a unique set of parameter requirements. In some embodiments, parameters (e.g., Figure 9 The unique set of parameters 916 required includes the output pressure of the high-pressure steam generated by the corresponding system 104, the output flow rate of the high-pressure steam generated by the corresponding system 104, and the temperature of the hot water source 110 received by the corresponding system 104. In some embodiments, the remainder of parameters 916 remains constant on each heat pump system 104, or is derived directly from the unique set of parameters 916 associated with the corresponding system 104.

[0174] Furthermore, the systems, methods, and apparatus of this disclosure avoid the associated losses of intermediate refrigerant and the transfer of heat to and / or from intermediate refrigerant. Specifically, the systems, methods, and apparatus of this disclosure generate high-pressure steam directly from the hot water source 110 and directly compress it together with the low-pressure steam generated by the flash evaporator assembly 210 using a multi-stage mechanical vapor recompression (MVR) compressor assembly 202 having a series of at least two centrifugal compressors 204. In some embodiments, system 104 includes a superheater assembly 230 comprising a superheater 232 disposed between each compressor 204 in the compressor assembly 202.

[0175] Therefore, in some embodiments, the systems, methods and apparatus of this disclosure achieve high COP (e.g., COP of 4.5, COP of 4.0, etc.) by utilizing the high efficiency associated with utilizing one or more centrifugal compressors 204 in compressor unit 202 and avoiding the overheating losses associated with high compression ratio compressors 204 typically found in conventional high-temperature industrial heat pump technology.

[0176] Figure 7 A graph is provided to illustrate the performance of a high-pressure steam generation heat pump system according to some embodiments compared to various conventional technologies. In some embodiments, the heat pump system 104 of the systems, methods, and apparatus of this disclosure is used to generate high-pressure steam 140, as a comparison with conventional high-temperature industrial heat pump technologies. The heat pump system 104 performs better than conventional high-temperature industrial heat pumps.

[0177] In some embodiments, the main competitive advantage of the systems, methods, and apparatus of this disclosure over conventional high-temperature industrial heat pump technology is the ability to generate steam at higher pressures, to produce high-pressure steam with higher performance coefficients, to use more attractive refrigerants in water form, or combinations thereof.

[0178] In some embodiments, conventional high-temperature industrial heat pump technology using one or more hydrofluorocarbon (HFC) refrigerants and / or one or more hydrofluoroolefin (HFO) refrigerants generates heat at temperatures up to 320 degrees Fahrenheit (160°C). In some embodiments, conventional high-temperature industrial heat pumps cannot directly generate steam and must be used in conjunction with an unburned steam generator, which introduces a nominal temperature drop of 20°F. Therefore, the maximum saturated vapor pressure that a conventional high-temperature industrial heat pump can produce is 3.5 Barg (50 PSIg), which is insufficient to address the medium-pressure applications (e.g., between 3.5 Barg and 20 Barg) commonly found in industrial facilities 102. Furthermore, conventional high-temperature industrial heat pumps have a relatively low coefficient of performance (COP) of less than 3.0, resulting in high power demands and high operating costs.

[0179] Furthermore, one or more HFC refrigerants have high global warming potential (GWP). In contrast, one or more HFO refrigerants have low GWP but are prohibitively expensive. In contrast, the heat pump system 104 of the systems, methods, and apparatus of this disclosure directly generates high-pressure steam 140 at pressures up to 20 barg (290 PSIg). Moreover, when operated under the same conditions, the heat pump system 104 of the systems, methods, and apparatus of this disclosure generates this high-pressure steam 140 with a COP 50% higher than that of conventional high-temperature industrial heat pumps, resulting in a proportional reduction in the power demand and operating costs of the heat pump system 104 of the systems, methods, and apparatus of this disclosure. Furthermore, since the heat pump system 104 of the systems, methods, and apparatus of this disclosure uses water as a refrigerant, the heat pump system 104 offers the benefits of low cost, safety, non-toxicity, zero GWP, or a combination thereof.

[0180] Furthermore, conventional high-temperature industrial heat pumps based on CO2 utilize low-cost and low-GWP refrigerants in the form of CO2. However, due to the high pressure required by the refrigerant, conventional high-temperature industrial CO2 heat pumps are limited to temperatures of 238℉ (114°C) or lower. In this way, those skilled in the art will understand that although 238℉ (114°C) is higher than the atmospheric boiling point of water, conventional high-temperature industrial CO2-based heat pumps cannot generate sufficiently high-pressure steam because they require a low fluid return temperature of 203℉ (95°C) or lower, which directly determines the ability of conventional high-temperature industrial CO2-based heat pumps to drive steam generators.

[0181] Furthermore, conventional high-temperature industrial heat pumps, which are based on ammonia, have high-pressure characteristics, limiting the maximum output temperature of conventional high-temperature industrial ammonia-based heat pumps to 203℉ (95℃), which is not suitable for steam generation.

[0182] refer to Figure 7 In some embodiments, the heat pump system 104 of the systems, methods, and apparatus of this disclosure is used to generate high-pressure steam 140 as a comparison with conventional boiler technologies (e.g., conventional electric boiler technology and / or conventional natural gas boiler technology). The heat pump system 104 performs better than conventional boilers.

[0183] In some embodiments, the main competitive advantage of the systems, methods, and apparatus of this disclosure over conventional electric boiler technology is the higher COP of the systems, methods, and apparatus of this disclosure, which results in lower operating costs. Furthermore, conventional electric boiler technology is identified as having a COP close to 1.0 and requiring approximately 295 kilowatt-hours (kWh) of electricity to produce 1 klb of steam. Assuming an industrial electricity price of $0.12 / kWh, the energy cost required by a conventional electric boiler to produce one klb of steam is $35.40.

[0184] In contrast, even though the COP of the systems, methods, and apparatus of this disclosure depends on the temperature of the hot water source 110 received by system 104, the temperature of the cooling water source 120 associated with system 104, and common operating conditions of obtaining 85℉ hot water from the facility and generating 10 Barg (130 PSIg) high-pressure steam 140, the systems, methods, and apparatus of this disclosure have a COP of 3.0 under these operating conditions. Furthermore, the systems, methods, and apparatus of this disclosure require three times less electricity (97 kWh per klb of high-pressure steam) than conventional electric boilers. Additionally, the systems, methods, and apparatus of this disclosure offer three times lower energy costs than conventional electric boilers, with a cost of $11.80 per klb of high-pressure steam.

[0185] Furthermore, the operating costs of the systems, methods, and apparatus of this disclosure are comparable to or lower than those of conventional natural gas boiler technologies. For example, a novel conventional natural gas boiler technology with an economizer has a COP of 0.85 and requires approximately 11.8 thms of natural gas to produce 1 klb of high-pressure steam. At a natural gas price of $1.30 / thm, the conventional natural gas boiler technology requires an energy cost of $15.34 per klb of steam, which is greater than the $11.80 / klb achieved by the systems, methods, and apparatus of this disclosure.

[0186] Figure 8 This is a flowchart of an example method (e.g., method 800) for generating high-pressure steam according to some embodiments, where dashed boxes denote optional elements in the flowchart. Specifically, method 800 is applied to generate high-pressure steam (e.g., Figure 1A High-pressure steam 140-1 or 140-2, Figure 1 to Figure 7 (such as high-pressure steam 140 in any of them). Unless otherwise expressly stated, various modules in the memory 992 of the computer system 900 perform certain processes of the method 200 described in FIG2. Furthermore, it will be understood that... Figure 8 The process can be encoded in a single module or any combination of modules.

[0187] In some embodiments, method 800 is as shown in Figure 1 to... Figure 7 The method is performed in a heat pump system 104. In some embodiments, the method 800 is performed in a computer system (e.g., Figure 9 The computer system 900 (e.g., computer system 900) is located at or in conjunction with the computer system. The computer system 900 includes one or more processors (e.g., Figure 9 CPU 972) and memory coupled to one or more processors 172 (e.g., CPU 972) and memory coupled to one or more processors 172. Figure 9The memory 992 contains one or more programs configured to be executed by one or more processors 972 (e.g., memory 992). Figure 9 Control module 906 Figure 9 (e.g., client application 918). In other words, in some embodiments, method 800 cannot be performed mentally because the computational complexity solved by method 800 requires the use of computer system 900.

[0188] refer to Figure 8 In box 804, method 800 includes using a heat pump system (e.g., Figures 1A to 7 System 104, etc., of any of them is coupled to one or more facilities (e.g., Figure 1A The first facility 102-1 Figure 1A (e.g., second facility 102-2). In some cases, the heat pump system is connected to one or more facilities. In some embodiments, each facility 102 is associated with an industrial process, such as a chemical process, pulping process, papermaking process, metallurgical process, refining process, wood drying process, packaging process, or a combination thereof. Those skilled in the art will appreciate that other industrial processes exist within the scope of the facilities 102 disclosed herein. Therefore, method 800 allows the heat pump system 104 to be connected to one or more facilities 102 to provide energy for the energy needs of one or more facilities 102.

[0189] In some embodiments, the heat pump system 104 is connected to a hot water source (e.g., Figures 1 and 5). Figure 6 (e.g., hot water source 110 of any of the above). In some embodiments, hot water source 110 is configured to capture waste heat from the first facility 102-1, which allows heat pump system 104 to utilize this waste heat via a heat transfer process. As a non-limiting example, in some embodiments, hot water source 110 includes boiler feedwater (e.g., Figure 1AThe boiler feedwater 160 has a high temperature, where waste heat will be captured by system 104. For example, in some embodiments, the hot water source 110 includes a cooling water flow returning from a cooling process performed at facility 102 and / or a makeup water flow generated at facility 102. In some embodiments, the cooling water flow returning from a cooling process performed at facility 102 and / or the makeup water flow generated at facility 102 are combined before being received by system 104. However, this disclosure is not limited thereto. In some embodiments, additional hot water (e.g., boiler feedwater) is received by system 104, for example, to maintain a constant water volume in system 104. However, this disclosure is not limited thereto. Thus, the hot water source 110 provides a low-level heat source in the form of hot water received by system 104, which has energy in the form of heat that facility 102 will otherwise discharge (e.g., heat discharged to the atmosphere and / or discharged to wastewater via a cooling tower process). Furthermore, in some embodiments, the heat pump system 104 is further integrated with the same facility 102 (e.g., Figure 1A The first facility 102-1) or different facilities 102 (e.g., Figure 1A The heat pump system 104 is connected to the existing steam main of the second facility 102-1, which allows the heat pump system 104 to have a one-to-one relationship with facility 102, or a one-to-many relationship with two or more facilities 102. For example, in some embodiments, the heat pump system 104 is connected between a hot water source 110 configured to capture waste heat from the first facility 102-1 and the existing steam main of the first facility 102-1. This allows the heat pump system 104 to generate high-pressure steam 140, which is then used at the first facility 102-1, and is received from the hot water source 110 that captures waste heat from the first facility 102-1. As another non-limiting example, in some embodiments, the heat pump system 104 is connected between a hot water source 110 configured to capture waste heat from a first facility 102-1 and an existing steam manifold for a second facility 102-2. This allows the heat pump system 104 to generate high-pressure steam 140 that can be used at the second facility 102-2, the high-pressure steam being received from the hot water source 110 capturing waste heat from the first facility 102-1. Therefore, by connecting the heat pump system 104 between the hot water source 110 of facility 102 and an existing steam manifold for the same or different facilities 102, method 800 provides for optimizing the efficiency of the heat pump system 104 without requiring modification or substantial modification of the existing structure of the same or different facilities 102 connected to the heat pump system 104, such as the existing steam manifold. In this way, the heat pump system 104 allows for a standardized connection between the hot water source 110 of facility 102 and the existing steam manifold for the same or different facilities 102.

[0190] Furthermore, in some embodiments, the heat pump system 104 is connected to a steam condensate return stream (e.g., steam condensate return stream 214 of any of Figures 2 through 5). For example, in some embodiments, the heat pump system 104 is connected between steam condensate return streams 214 configured to capture waste condensate from an existing steam manifold of the first facility 102-1, which allows the heat pump system 104 to generate high-pressure steam 140 otherwise discharged by the first facility 102-1 by circulating the steam condensate return streams 214. In some embodiments, the heat pump system 104 is connected between steam condensate return streams 214 configured to capture waste condensate from a second facility 102-2, different from the first facility 102-1. However, this disclosure is not limited thereto.

[0191] In some embodiments, the heat pump system 104 is connected between the hot water source 110 of facility 102 and an existing steam main of the same or different facility 102, and further connected to one or more utilities of facility 102. For example, briefly refer to... Figure 9 In some embodiments, the heat pump system 104 is further connected to the power supply of facility 102 (e.g., Figure 9 The power supply 986), which allows electrical connection between facility 102 and heat pump system 104 for the transmission of power (e.g., Figure 1B Electricity 150 is supplied to the heat pump system 104 for use, for example, to drive one or more motors of the compressor unit of the heat pump system 104 (e.g., compressor unit 202 of any of Figures 2 to 5).

[0192] It should be noted that in various embodiments of this application, “connection” broadly refers to a “direct connection” or “indirect connection” via an additional structure.

[0193] refer to Figure 8In block 806, method 800 includes receiving hot water from hot water source 110 at a heat pump system 104. In some embodiments, heat pump system 104 is configured to receive hot water from hot water source 110 at a first temperature. In some embodiments, the first temperature of the hot water received by heat pump system 104 is between 60 degrees Fahrenheit (℉) (15.6 degrees Celsius (°C)) and 150℉ (65.6°C). In some embodiments, the first temperature of the hot water received by heat pump system 104 is between 60℉ (15.6°C) and 220℉ (104°C). For example, in some embodiments, the heat pump system 104 is configured to receive hot water from the hot water source 110 at a first temperature between 60℉ (15.6℃) and 220℉ (65.6℃), between 60℉ (15.6℃) and 205℉ (96.1℃), between 60℉ (15.6℃) and 190℉ (87.8℃), between 60℉ (15.6℃) and 175℉ (79.4℃), between 60℉ (15.6℃) and 150℉ (65.6℃), and between 60℉ (15.6℃) and 135℉ (57.2℃). Between 60℉ (15.6℃) and 120℉ (48.9℃), between 60℉ (15.6℃) and 105℉ (40.6℃), between 60℉ (15.6℃) and 90℉ (32.2℃), between 60℉ (15.6℃) and 75℉ (23.9℃), between 80℉ (26.7℃) and 220℉ (65.6℃), between 80℉ (26.7℃) and 205℉ (96.1℃), between 80℉ (26.7℃) and 190℉ (87.8℃), between 80℉ (26.7℃) and 175℉ ( Between 79.4℃, between 80℉ (26.7℃) and 150℉ (65.6℃), between 80℉ (26.7℃) and 135℉ (57.2℃), between 80℉ (26.7℃) and 120℉ (48.9℃), between 80℉ (26.7℃) and 105℉ (40.6℃), between 80℉ (26.7℃) and 90℉ (32.2℃), between 100℉ (37.8℃) and 220℉ (65.6℃), between 100℉ (37.8℃) and 205℉ (96.1℃), between 100℉ (37.4℃) and 150℉ (65.6℃), between 80℉ (26.7℃) and 135℉ (57.2℃), between 80℉ (26.7℃) and 120℉ (48.9℃), between 80℉ (26.7℃) and 105℉ (40.6℃), between 80℉ (26.7℃) and 90℉ (32.2℃), between 100℉ (37.8℃) and 220℉ (65.6℃), between 100℉ (37.8℃) and 205℉ (96.1℃), between 100℉ (37.8℃) and 205℉ (96.1℃). Between 190℉ (87.8℃), between 100℉ (37.8℃) and 175℉ (79.4℃), between 100℉ (37.8℃) and 150℉ (65.6℃), between 100℉ (37.8℃) and 135℉ (57.2℃), between 100℉ (37.8℃) and 120℉ (48.9℃), between 100℉ (37.8℃) and 105℉ (40.6℃), between 120℉ (48.9℃) and 220℉ (65.6℃), between 120℉ (48.9℃) and 205℉ (96℃).Between 1℃, between 120℉ (48.9℃) and 190℉ (87.8℃), between 120℉ (48.9℃) and 175℉ (79.4℃), between 120℉ (48.9℃) and 150℉ (65.6℃), between 120℉ (48.9℃) and 135℉ (57.2℃), between 140℉ (60.0℃) and 220℉ (65.6℃), between 140℉ (60.0℃) and 205℉ (96.1℃), between 140℉ (60.0℃) and 190℉ (87.8℃), between 140℉ (60.0℃) and Between 175℉ (79.4℃), between 140℉ (60.0℃) and 150℉ (65.6℃), between 175℉ (79.4℃) and 220℉ (65.6℃), between 175℉ (79.4℃) and 205℉ (96.1℃), between 175℉ (79.4℃) and 190℉ (87.8℃), between 190℉ (87.8℃) and 220℉ (65.6℃), between 190℉ (87.8℃) and 205℉ (96.1℃), or between 205℉ (96.1℃) and 220℉ (65.6℃), inclusive of the extreme values. In some embodiments, the first temperature received by the heat pump system 104 from the hot water source 110 is at least 60℉ (15.6℃), at least 65℉ (18.3℃), at least 70℉ (21.1℃), at least 75℉ (23.9℃), at least 80℉ (26.7℃), at least 85℉ (29.4℃), at least 90℉ (32.2℃), at least 95℉ (35.0℃), at least 100℉ (37.8℃), at least 105℉ (40.6℃), at least 110℉ (43.3℃), at least 115℉ (46.1℃), at least 120℉ (48.9℃), at least 125℉ (51.7℃), at least 130℉ (54.4℃), at least 135℉ ( 57.2℃), at least 140℉ (60.0℃), at least 145℉ (62.8℃), at least 150℉ (65.6℃), at least 155℉ (68.3℃), at least 160℉ (71.1℃), at least 165℉ (73.9℃), at least 170℉ (76.7℃), at least 175℉ (79.4℃), at least 180℉ (82.2℃), at least 185℉ (85.0℃), at least 190℉ (87.8℃), at least 195℉ (90.6℃), at least 200℉ (93.3℃), at least 205℉ (96.1℃), at least 210℉ (98.9℃), at least 215℉ (102℃), or at least 220℉ (104℃). In some embodiments, the first temperature received by the heat pump system 104 from the hot water source 110 is at most 60℉ (15.6℃), at most 65℉ (18.3℃), at most 70℉ (21.1℃), at most 75℉ (23.9℃), or at most 80℉ (26℃).7℃), up to 85℉ (29.4℃), up to 90℉ (32.2℃), up to 95℉ (35.0℃), up to 100℉ (37.8℃), up to 105℉ (40.6℃), up to 110℉ (43.3℃), up to 115℉ (46.1℃), up to 120℉ (48.9℃), up to 125℉ (51.7℃), up to 130℉ (54.4℃), up to 135℉ (57.2℃), up to 140℉ (60.0℃), up to 145℉ (62.8℃), up to 150℉ (65.6℃) ), up to 155℉ (68.3℃), up to 160℉ (71.1℃), up to 165℉ (73.9℃), up to 170℉ (76.7℃), up to 175℉ (79.4℃), up to 180℉ (82.2℃), up to 185℉ (85.0℃), up to 190℉ (87.8℃), up to 195℉ (90.6℃), up to 200℉ (93.3℃), up to 205℉ (96.1℃), up to 210℉ (98.9℃), up to 215℉ (102℃) or up to 220℉ (104℃). For example, in some embodiments, the hot water source 110 is used to receive low-level heat in the form of hot water, which originates from an existing, typically available on-site heat source, such as cooling water return from a cooling tower process, typically at a temperature between 85℉ (29.4°C) and 90℉ (32.2°C). In some embodiments, the low-level heat in the form of hot water originates from a dryer exhaust, which is at a temperature between 140℉ (60.0°C) and 180℉ (82.2°C). In some embodiments, the system 104 includes a heat exchange mechanism inserted between the hot water source 110 and the inlet of the system 104, which allows the heat of the hot water to be transferred via the heat exchange mechanism to the heat pump water circuit of the system 104. For example, in some embodiments, the heat exchange mechanism is configured to generate condensate at facility 102 or system 104 (e.g., ...). Figure 1A (Condensate 180). However, this disclosure is not limited thereto.

[0194] In some embodiments, system 104 further includes a water circuit, such as a closed water circuit. In some embodiments, the water circuit includes an upstream portion and a downstream portion. In some embodiments, the downstream portion is configured to receive hot water from the same facility or a different facility. In some embodiments, the upstream portion is configured to supply cooling water to the same facility or a different facility. Furthermore, in some embodiments, the water circuit is heated by the same facility or a different facility.

[0195] refer to Figure 8 In box 808, method 800 includes passing hot water through heat pump system 104 to generate high-pressure steam (e.g., Figure 8 Method 800 high-pressure steam, Figure 1BHigh-pressure steam 140-1 or 140-2, Figures 1A to 7 High-pressure steam 140, etc. from any of them.

[0196] For example, in some embodiments, the heat pump system 104 includes a compressor unit (e.g., compressor unit 202 of any of Figures 2 to 5) and a flash evaporator unit (e.g., Figures 2A to 5B (such as flash evaporator 212 in either of the above), method 800 commonly utilizes the compressor unit and the flash evaporator unit to generate high-pressure steam 140 for facility 102.

[0197] More specifically, in some embodiments, passing hot water through the heat pump system 104 to generate high-pressure steam 140 involves expanding the hot water at a flash evaporator (e.g., the first flash evaporator 212-1 of any of Figures 2 to 5). By expanding the hot water at the flash evaporator 212, the flash evaporator 212 generates low-pressure steam 206 which is further utilized by the compressor unit 202. Furthermore, in some such embodiments, due to the expansion of the hot water within the flash evaporator 212, the low-pressure steam 206 generated by the flash evaporator has a lower temperature than the hot water received by the heat pump system 104. In other words, in some such embodiments, the second temperature of the first low-pressure steam 206 generated by the first flash evaporator 212-1 is lower than the first temperature of the hot water source 110. Furthermore, in some such embodiments, when generating the low-pressure steam 206, the flash evaporator 212 operates in a passive steady state, which increases the efficiency of the heat pump system 104. However, this disclosure is not limited thereto.

[0198] In some embodiments, method 800 is configured to operate between 0.256 psi (17.7 mbar) and 3.72 psi (257 mbar), between 0.256 psi (17.7 mbar) and 3.2 psi (221 mbar), between 0.256 psi (17.7 mbar) and 2.7 psi (186 mbar), between 0.256 psi (17.7 mbar) and 1.2 psi (82.7 mbar), between 0.256 psi (17.7 mbar) and 0.7 psi (48.3 mbar), between 0.35 psi (24.1 mbar) and 3.72 psi (257 mbar), between 0.35 psi (24.1 mbar) and 3.2 psi (221 mbar), and between 0.35 psi (24.1 mbar) and 3.2 psi (221 mbar). Between 2.7 PSI (186 mBar) and 0.35 PSI (24.1 mBar) and 1.2 PSI (82.7 mBar), between 0.35 PSI (24.1 mBar) and 0.7 PSI (48.3 mBar), between 0.85 PSI (58.6 mBar) and 3.72 PSI (257 mBar), between 0.85 PSI (58.6 mBar) and 3.2 PSI (221 mBar), between 0.85 PSI (58.6 mBar) and 2.7 PSI (186 mBar), between 0.85 PSI (58.6 mBar) and 1.2 PSI (82.7 mBar), between 1.35 PSI (93.1 mBar) and 3.72 PSI (257 mBar), between 0.85 PSI (93.1 mBar) and 3.2 PSI (3.2 mBar). Between PSI (221 mBar), 1.35 PSI (93.1 mBar) and 2.7 PSI (186 mBar), 1.85 PSI (128 mBar) and 3.72 PSI (257 mBar), 1.85 PSI (128 mBar) and 3.2 PSI (221 mBar), 1.85 PSI (128 mBar) and 2.7 PSI (186 mBar), 2.35 PSI (162 mBar) and 3.72 PSI (257 mBar), 2.35 PSI (162 mBar) and 3.2 PSI (221 mBar), 2.35 PSI (162 mBar) and 2.7 PSI (186 mBar), 2.85 PSI (197 mBar) and 3.72 PSI (257 mBar), 2.First low-pressure steam 206-1, including end values, is generated at a first pressure between 85 PSI (197 mBar) and 3.2 PSI (221 mBar) or between 3.35 PSI (231 mBar) and 3.72 PSI (257 mBar). In some embodiments, the first pressure is at least 0.256 PSI (17.7 mBar), at least 0.363 PSI (25 mBar), at least 0.35 PSI (24.1 mBar), at least 0.5 PSI (34.5 mBar), at least 0.7 PSI (48.3 mBar), at least 0.85 PSI (58.6 mBar), at least 1 PSI (68.9 mBar), at least 1.2 PSI (82.7 mBar), at least 1.3 PSI (89.6 mBar), at least 1.35 PSI (93.1 mBar), at least 1.5 PSI (103 mBar), at least 1.65 PSI (114 mBar), at least 1.85 PSI (128 mBar), at least 2 PSI (138 mBar), at least 2.2 PSI (152 mBar), at least 2.35 PSI (162 mBar), at least 2.5 PSI (172 mBar), and at least 2.7 PSI. PSI (186 mBar), at least 2.85 PSI (197 mBar), at least 3 PSI (207 mBar), at least 3.2 PSI (221 mBar), at least 3.35 PSI (231 mBar), at least 3.5 PSI (241 mBar), or at least 3.72 PSI (257 mBar). In some embodiments, the first pressure is at most 0.256 PSI (17.7 mBar), at most 0.363 PSI (25 mBar), at most 0.35 PSI (24.1 mBar), at most 0.5 PSI (34.5 mBar), at most 0.7 PSI (48.3 mBar), at most 0.85 PSI (58.6 mBar), at most 1 PSI (68.9 mBar), at most 1.2 PSI (82.7 mBar), at most 1.3 PSI (89.6 mBar), at most 1.35 PSI (93.1 mBar), at most 1.5 PSI (103 mBar), at most 1.65 PSI (114 mBar), at most 1.85 PSI (128 mBar), at most 2 PSI (138 mBar), at most 2.2 PSI (152 mBar), at most 2.35 PSI (162 mBar), at most 2.2 PSI (152 mBar), at most 2.35 PSI (162 mBar), at most 17.7 mBar, at most 0.363 PSI (25 mBar), at most 0.35 PSI (24.1 mBar), at most 0.5 PSI (34.5 mBar), at most 0.7 PSI (48.3 mBar), at most 0.85 PSI (58.6 mBar), at most 0.85 PSI (68.9 mBar), at most 0.85 PSI (68.9 mBar), at most 0.85 PSI (82.7 mBar), at most 0.85 PSI (93.1 mBar), at most 0.85 PSI (103 mBar), at most 0.85 PSI (114 mBar), at most 0.85 PSI (128 mBar), at most 0.85 PSI ( (mBar), up to 2.5 PSI (172 mBar), up to 2.7 PSI (186 mBar), up to 2.85 PSI (197 mBar), up to 3 PSI (207 mBar), up to 3.2 PSI (221 mBar), up to 3.35 PSI (231 mBar), up to 3.5 PSI (241 mBar), or up to 3.72 PSI (257 mBar).

[0199] In some embodiments, when hot water is passed through the heat pump system 104, the expansion of the hot water at the flash evaporator 212 further generates cooled water (e.g., condensate) from the hot water. In some embodiments, the cooled water generated by the flash evaporator 212 has a lower temperature than the hot water. In other words, in some such embodiments, the third temperature of the cooled water generated by the flash evaporator 212 is lower than the first temperature of the hot water source 110. Furthermore, in some embodiments, the third temperature of the cooled water is lower than the second temperature of the low-pressure steam 206 generated by the flash evaporator 212. Thus, by causing the hot water to expand at the flash evaporator 212, the heat pump system 104 increases a portion of the thermal energy of the hot water received from the hot water source 110 by forming low-pressure steam 206, which is transferred from the cooled water generated by the flash evaporator 212. For example, in some embodiments, the facility 102 is configured to utilize high-pressure steam 140 generated by the system 104, which in turn generates a cooling water source 120 at a third temperature lower than the first temperature of the hot water received from the hot water source 110. However, this disclosure is not limited thereto.

[0200] Furthermore, in some embodiments, the pressure in the flash evaporator 212 is less than the saturation pressure of the hot water. For example, in some embodiments, passing hot water through the heat pump system 104 further includes compressing the low-pressure steam 206 into a first higher-pressure steam having a pressure higher than that of the low-pressure steam. For example, briefly refer to... Figure 2A In some embodiments, the first low-pressure vapor 206 at the first pressure is further compressed by a second compressor 204-2, which produces a first higher-pressure vapor having a pressure higher than that of the first low-pressure vapor, such as second low-pressure vapor 206-2 produced by the second compressor 204-2, which has a higher pressure than the first low-pressure vapor 206-1 produced by the first compressor 204-1. Therefore, in some such embodiments, the first higher-pressure vapor having a pressure higher than that of the first low-pressure vapor comprises low-pressure vapor 206 produced by one or more compressors 204 downstream of the first compressor 204-1 that produces the first low-pressure vapor 206-1. However, this disclosure is not limited thereto. For example, in some embodiments, the first higher-pressure vapor having a pressure higher than that of the first low-pressure vapor comprises high-pressure vapor 140 produced by the heat pump system 104 for use by the facility 102.

[0201] In some embodiments, passing hot water through the heat pump system 104 further includes introducing hot water into a first higher-pressure steam (e.g., a first low-pressure steam 206-1 generated by a first flash evaporator 212-1 of any of Figures 2 to 5, a second low-pressure steam 206-2 generated by a second flash evaporator 212-2 of any of Figures 2 to 5, ..., low-pressure steam n 206-n generated by flash evaporator n 212-n, etc.). In some embodiments, the hot water is introduced into the first higher-pressure steam to superheat the first higher-pressure steam into saturated first higher-pressure steam.

[0202] In some embodiments, passing hot water through the heat pump system 104 further includes repeating the compression and introduction steps as many times as desired to generate high-pressure steam.

[0203] In some embodiments, the number of times required is greater than one. In some embodiments, the number of times required is greater than one but less than twenty-one. In some embodiments, the desired number is between two and twenty, between two and seventeen, between two and fifteen, between two and twelve, between two and nine, between two and six, between two and three, between three and twenty, between three and seventeen, between three and fifteen, between three and twelve, between three and nine, between three and six, between five and twenty, between five and seventeen, between five and fifteen, between five and twelve, between five and nine, between five and six, between seven and twenty, between seven and seventeen, between seven and fifteen, between seven and twelve, between seven and nine, between nine and twenty, between nine and seventeen, between nine and fifteen, between nine and twelve, between eleven and twenty, between eleven and seventeen, between eleven and fifteen, between eleven and twelve, between thirteen and twenty, between thirteen and seventeen, between thirteen and fifteen, between fifteen and twenty, between fifteen and seventeen, or between seventeen and twenty, including end values. In some embodiments, the desired number of times is at least two, at least three, at least four, at least five, at least six, at least seven, at least eight, at least nine, at least ten, at least eleven, at least twelve, at least thirteen, at least fourteen, at least fifteen, at least sixteen, at least seventeen, at least eighteen, at least nineteen, or at least twenty. In some embodiments, the desired number of times is at most two, at most three, at most four, at most five, at most six, at most seven, at most eight, at most nine, at most ten, at most eleven, at most twelve, at most thirteen, at most fourteen, at most fifteen, at most sixteen, at most seventeen, at most eighteen, at most nineteen, or at most twenty.

[0204] refer to Figure 8 In some embodiments, as shown in box 810, method 800 includes supplying high-pressure steam 140 from heat pump system 104 to an existing steam manifold of the same or different facility 102 from which heat pump system 104 receives hot water.

[0205] In some embodiments, high-pressure steam 140 is supplied at speeds between 10 klb / hr and 300 klb / hr, 10 klb / hr and 250 klb / hr, 10 klb / hr and 200 klb / hr, 10 klb / hr and 150 klb / hr, 10 klb / hr and 100 klb / hr, 10 klb / hr and 50 klb / hr, 75 klb / hr and 300 klb / hr, 75 klb / hr and 250 klb / hr, 75 klb / hr and 200 klb / hr, 75 klb / hr and 150 klb / hr, 75 klb / hr and 100 klb / hr, 150 klb / hr and 300 klb / hr, 150 klb / hr and 250 klb / hr, 150 klb / hr and 200 klb / hr, and 225 klb / hr. Mass flow rates between 100 klb / hr and 300 klb / hr or between 225 klb / hr and 250 klb / hr are supplied from heat pump system 104 to the same or different facility 102, including endpoints. In some embodiments, the mass flow rate of high-pressure steam generated by heat pump system 104 is at least 10 klb / hr, at least 25 klb / hr, at least 50 klb / hr, at least 75 klb / hr, at least 100 klb / hr, at least 125 klb / hr, at least 150 klb / hr, at least 175 klb / hr, at least 200 klb / hr, at least 225 klb / hr, at least 250 klb / hr, at least 275 klb / hr, or at least 300 klb / hr. In some embodiments, the mass flow rate of the high-pressure steam generated by the heat pump system 104 is up to 10 klb / hr, up to 25 klb / hr, up to 50 klb / hr, up to 75 klb / hr, up to 100 klb / hr, up to 125 klb / hr, up to 150 klb / hr, up to 175 klb / hr, up to 200 klb / hr, up to 225 klb / hr, up to 250 klb / hr, up to 275 klb / hr, or up to 300 klb / hr.

[0206] In this disclosure, unless otherwise expressly stated, the description of the apparatus and systems will include embodiments of one or more computers. For example, and for the sake of Figure 9For the purposes of this description, computer system 900 is represented as a single device encompassing all the functions of computer system 900. However, this disclosure is not limited thereto. For example, the functions of computer system 900 may be distributed across any number of networked computers and / or reside on each of several networked computers and / or hosted on one or more virtual machines and / or containers at remote locations accessible across a communication network (e.g., communication network 984). Those skilled in the art will appreciate that various different computer topologies are possible for computer system 900 and other devices and systems of this disclosure, and all such topologies are within the scope of this disclosure. Furthermore, the illustrated devices and systems may wirelessly transmit information to each other without relying on a physical communication network 984. Thus, Figure 9 The exemplary topologies shown are merely illustrative of some embodiments in a manner that will be readily understood by those skilled in the art.

[0207] Figure 9 To illustrate, a block diagram of an example computer system 900 applied in a high-pressure steam generation heat pump system according to some embodiments is provided. The computer system 900 is configured to control the heat pump system (e.g., Figures 1 to 1). Figure 7 The generation of high-pressure steam at the heat pump system 104. In some embodiments, the computer system 900 and the facilities (e.g., Figure 3 The first facility 102-1 Figures 1A to 7 The heat pump system of any of them 104, Figure 1A The computer system 900 is associated with two or more facilities 102. In some embodiments, the computer system 900 is associated with at most one facility or at most two or more facilities 102.

[0208] In some embodiments, the communication network 984 may optionally include the Internet, one or more local area networks (LANs), one or more wide area networks (WANs), other types of networks, or combinations of such networks. Examples of the communication network 984 include the World Wide Web (WWW), intranets and / or wireless networks (e.g., cellular telephone networks), wireless local area networks (LANs) and / or metropolitan area networks (MANs), and other devices that communicate wirelessly. Wireless communication may optionally use any of a variety of communication standards, protocols, and technologies, including Global System for Mobile Communications (GSM), Enhanced Data GSM Environment (EDGE), High-Speed ​​Downlink Packet Access (HSDPA), High-Speed ​​Uplink Packet Access (HSUPA), Evolved Data Only (EV-DO), HSPA, HSPA+, Dual-Cell HSPA (DC-HSPDA), Long Term Evolution (LTE), Near Field Communication (NFC), Wideband Code Division Multiple Access (W-CDMA), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Bluetooth, and Wi-Fi (e.g., IEEE 802.11a, IEEE 802.11ac, IEEE 802.11ax, IEEE 802.11b, IEEE 802.11g, and / or IEEE... 802.11n), Voice over Internet Protocol (VoIP), Wi-MAX, email protocols (e.g., Internet Messaging Access Protocol (IMAP) and / or Post Office Protocol (POP)), instant messaging (e.g., Extensible Messaging and Presence Protocol (XMPP), Session Initiation Protocol for Instant Messaging and Presence Extensions (SIMPLE), Instant Messaging and Presence Service (IMPS)) and / or Short Message Service (SMS) or any other suitable communication protocol, including communication protocols that have not been developed as of the date of submission of this document.

[0209] In various embodiments, the computer system 900 includes one or more processing units (CPUs) 972, network or other communication interfaces 974, and memory 992.

[0210] In some embodiments, computer system 900 includes a user interface 976. The user interface 976 typically includes a display 978 for presenting media, such as appropriate instruments (e.g., Figure 9The state of the first instrument 910-1, the second instrument 910-2, ..., instrument Q 912-Q). In some embodiments, the display 978 is integrated within the computer system (e.g., housed in the same chassis as the CPU 972 and memory 992). In some embodiments, the computer system 900 includes one or more input devices 980 that allow an individual to interact with the computer system 900. In some embodiments, the input device 980 includes a keyboard, mouse, and / or other input mechanisms. Alternatively or additionally, in some embodiments, the display 978 includes a touch-sensitive surface (e.g., where the display 978 is a touch-sensitive display, or the computer system 900 includes a touchpad).

[0211] In some embodiments, computer system 900 presents media to a user via display 978. Examples of media presented by display 978 include one or more images, videos, audio (e.g., waveforms of audio samples), or combinations thereof. In a typical embodiment, one or more images, videos, audio, or combinations thereof are presented by display 978 via a client application stored in memory 992. In some embodiments, audio is presented via an external device (e.g., a speaker, a headset, an input / output (I / O) subsystem, etc.) that receives audio information from computer system 900 and presents audio data based on this audio information. In some embodiments, user interface 976 further includes an audio output device, such as a speaker or an audio output for connection to a speaker, headphones, or headset.

[0212] Memory 992 includes high-speed random access memory, such as DRAM, SRAM, DDR RAM, or other random access solid-state memory devices, and optionally also includes non-volatile memory, such as one or more disk storage devices, optical disk storage devices, flash memory devices, or other non-volatile solid-state storage devices. Memory 992 may optionally include one or more storage devices remotely located relative to one or more CPUs 972. Memory 992, or alternatively, one or more non-volatile memory devices within memory 992, comprise non-transitory computer-readable storage media. Access to memory 992 by other components of computer system 900, such as one or more CPUs 972, may optionally be controlled by a controller. In some embodiments, memory 992 may include a large-capacity storage device remotely located relative to one or more CPUs 972. In other words, some data stored in memory 992 may actually be hosted on a device located outside computer system 900 but electronically accessible by computer system 900 via the Internet, intranet, or other forms of network 984 or electronic cable using communication interface 974.

[0213] In some embodiments, the memory 992 of the computer system 900 for generating high-pressure steam stores:

[0214] ● Operating system 902 (e.g., ANDROID, iOS, DARWIN, RTXC, LINUX, UNIX, OS X, WINDOWS, or embedded operating systems such as VxWorks), which contains programs for handling various basic system services;

[0215] ●Optionally, an electronic address 904 associated with computer system 900 identifies computer system 900 (e.g., within communication network 984, within facility network, etc.).

[0216] ● Control module 906 facilitates control of one or more operations performed during the generation of high-pressure steam according to multiple heuristic instructions, wherein control module 906 includes a storage of multiple instruments 910 for generating high-pressure steam (e.g., Figure 9 The instrument module 908 records the first instrument 910-1, the second instrument 910-2, ..., the instrument 910-Q, and also includes a task module 912 storing multiple tasks 914, each task 914 defining an operation for generating high-pressure steam at the heat pump system according to one or more parameters 916 associated with the corresponding task 914; and

[0217] ●Optionally, a client application 918 is used to present information (e.g., a medium) using a display 978 of a computer system 900, such as a method for generating high-pressure steam (e.g., Figure 8 The status of the steps and / or processes of Method 800.

[0218] As noted above, an optional electronic address 904 is associated with computer system 900. The optional electronic address 904 is used to uniquely identify computer system 900 at least from other devices and components of distributed system 900, such as other devices accessing communication network 984 (e.g., facility 102). For example, in some embodiments, electronic address 904 is used to receive a request from a remote device associated with first facility 102-1 to initiate the use of computer system 900 to generate high-pressure steam for use by second facility 102-2. However, this disclosure is not limited thereto. In some embodiments, electronic address 904 is used to receive a request from a remote device associated with first facility 102-1 to initiate the use of computer system 900 to generate high-pressure steam for use by first facility 102-1.

[0219] In some embodiments, the computer system 900 includes a control module 906, hereinafter referred to as a "controller," configured to control one or more operations performed during the generation of high-pressure steam. Specifically, the controller 906 is configured to control one or more operations performed during the generation of high-pressure steam according to a plurality of heuristic instructions. As a non-limiting example, in some embodiments, the plurality of heuristic instructions include one or more proportional, integral, and derivative (PID) loop instructions and / or one or more variable frequency drive (VFD) instructions. For example, in some embodiments, the controller 906 interacts with one or more sensors (e.g., Figure 9 The controller 906 communicates electronically with one or more sensors 982, wherein each of the one or more sensors 982 is configured to determine a state associated with a corresponding instrument 910. In some embodiments, the controller 906 communicates electronically with one or more sensors 982, the one or more sensors comprising: a first sensor set 982 configured to determine a state associated with the system (e.g., Figure 8 Method 800 heat pump system, Figure 1 to Figure 7The system 104 includes one or more temperatures associated with it (e.g., the temperature of hot water received by the system 104, the temperature of low-pressure steam generated by the flash evaporator assembly of the system 104, the temperature of high-pressure steam generated by the compressor assembly of the system 104, the temperature of the steam condensate source received by the system 104, the temperature of the condensate generated by the system 104, temperature losses at some or all of the system 104, etc.); a second set of sensors 982 configured to determine one or more pressures associated with the system 104 (e.g., the internal pressure of the flash evaporator assembly, the pressure ratio of the compressor assembly, pressure losses at some or all of the system 104, etc.); and a third set of sensors 982 configured to determine one or more flow rates associated with the system 104 (e.g., the temperature of hot water received by the system 104, etc.). The system 104 has several sensors, including: a mass flow rate of the low-pressure steam generated by the flash evaporator assembly 210 of system 104; a mass flow rate of the high-pressure steam generated by the compressor assembly 202 of system 104; a fourth sensor set 982 configured to determine one or more speeds associated with system 104 (e.g., the speed of hot water received by system 104, the speed of low-pressure steam generated by the flash evaporator assembly 210 of system 104, the speed of high-pressure steam generated by the compressor assembly 202 of system 104, the speed of steam condensate source received by system 104, etc.); and a fifth sensor set 982 configured to determine one or more electrical states associated with system 104 (e.g., one or more electrical loads, one or more voltage drops on some or all of system 104, one or more arc flashes, one or more groundings, etc.); or combinations thereof. Therefore, by electronically communicating with one or more sensors 982, controller 906 allows computer system 900 to control the flow rate of the high-pressure steam generated by system 104 received by facility 102. However, this disclosure is not limited thereto.

[0220] Instrument 910 performs specific functions or multiple functions in system 104 to generate high-pressure steam, such as generating high-pressure steam products associated with system 104 (e.g., Figure 8 Method 800 high-pressure steam, Figure 1A High-pressure steam 140-1 or 140-2, Figures 2A to 7 High-pressure steam 140 (or any of the high-pressure steam products) or cooling water products (e.g., Figures 1A to 6 The equipment, apparatus, mechanism, or combination thereof (such as cooling water source 120) of any of the instruments 120. For example, in some embodiments, each of the plurality of instruments 910 is configured to perform a specific task 914 or multiple tasks 914 in system 104 to generate high-pressure steam 140. Examples of instruments 910 include, but are not limited to, blowers, boilers (e.g., heat recovery boilers, etc.). Figure 5ABoiler 236, etc.), burner, compressor (e.g., the first compressor 204-1 in compressor unit 202 of FIG. 2, etc.), conduits (e.g., a first conduit for conveying hot water received by hot water source 110 of FIG. 2, a second conduit for conveying low-pressure steam 206 generated by flash evaporator 212, etc.), and superheater (e.g., Figure 5A (e.g., the first superheater 232-1 in the superheater group 230), drum, heat exchanger, fluid pump (e.g., Figure 5A (e.g., reboost pump 220), pipelines, reservoirs, valves (e.g., Figure 3 Valves 218-1, etc.), containers (e.g., flash evaporators), etc. For example, in some embodiments, one or more instruments 910 include a compressor unit 202, which further includes a series of at least two compressors 204 configured to supply high-pressure steam 140 to a facility (e.g., Figure 1A The existing steam main of facility 102-1 (e.g., Figure 8 (Box 810). However, this disclosure is not limited thereto.

[0221] In some embodiments, each task 914 is associated with a function, step, or process performed by the instrument set 910 in generating high-pressure steam 140 (e.g., Figure 8 This is associated with the function, steps, or processes of method 800. As a non-limiting example, in some embodiments, one or more tasks 914 for generating high-pressure steam 940 include receiving hot water (e.g., Figure 8 (Block 806), determine the first temperature of the hot water received from the hot water source 110, determine the saturation pressure of the hot water received from the hot water source 110, and allow the hot water to pass through the system 104 (e.g., Figure 8 (The box 808), causing the hot water to expand at the flash evaporator (e.g., Figure 8 (block 808), generates low-pressure steam (e.g., Figure 8 (block 808), generating cooling water (e.g., Figure 8 (Block 808), maintain the flash evaporator at a first pressure lower than the saturation pressure of the hot water (e.g., Figure 8 (Block 808), compressed low-pressure steam (e.g., Figure 8 (Block 808), de-superheating of low-pressure steam, and supplying high-pressure steam from system 104 to the existing steam main of facility 102 (e.g., Figure 8 (e.g., the box 810).

[0222] Furthermore, each task 914 includes a set of parameters 916 for performing functions by the corresponding instrument 910. In some embodiments, each task 914 is a logical dependency of the functions performed by the corresponding instrument 910, defining the operation. For example, in some embodiments, task 914 is to run a first operation of a first instrument 910-1 with a first set of parameters 916, and a second task 914-2 is to run a second operation of a second instrument 910-2. As a non-limiting example, in some embodiments, parameters 916 include the temperature of the hot water received by system 104 from hot water source 110, the pressure of the hot water received by system 104 from hot water source 110, the mass flow rate of the hot water received by system 104 from hot water source 110, the temperature of low-pressure steam 206 generated by system 104, the pressure of low-pressure steam 206 generated by system 104, the mass flow rate of low-pressure steam 206 generated by system 104, the temperature of high-pressure steam 140 generated by system 104, and the pressure of high-pressure steam 140 generated by system 104. The parameters include the pressure of the high-pressure steam 140 generated by system 104, the mass flow rate of the high-pressure steam 140 generated by system 104, the temperature of the cooling water received from cooling water source 120 by system 104, the pressure of the cooling water received from cooling water source 120 by system 104, the mass flow rate of the cooling water received from cooling water source 120 by system 104, the temperature of the steam condensate return 214 received by system 104, the pressure of the steam condensate return 214 received by system 104, and the mass flow rate of the steam condensate return 214 received by system 104. As a non-limiting example, in some embodiments, computer system 900 configures one or more parameters 916, including configuring flow rate parameters 916 (e.g., mass flow rate), pressure parameters 916, temperature parameters 916, direction parameters 916, etc., associated with the corresponding instrument 910, to optimize the generation of high-pressure steam 140 at system 104. However, this disclosure is not limited thereto.

[0223] Each of the modules and applications identified above corresponds to a function for performing one or more functions described above and methods described in this disclosure (e.g., computer implementation methods and other information processing methods described herein). Figure 8 The method 800, etc., is a set of executable instructions. These modules (e.g., instruction sets) need not be implemented as individual software programs, programs, or modules, and therefore various subsets of these modules may optionally be combined or otherwise rearranged in various embodiments of this disclosure. In some embodiments, memory 992 may optionally store a subset of the modules and data structures identified above. Furthermore, in some embodiments, memory 992 stores additional modules and data structures not described above.

[0224] It should be understood that Figure 9The computer system 900 is only one example of the computer system 900, and the computer system 900 may optionally have more or fewer components than the components shown, may optionally combine two or more components, or may optionally have different configurations or arrangements of components. Figure 9 The various components shown are implemented in hardware, software, firmware, or a combination thereof, and include one or more signal processing and / or application-specific integrated circuits.

[0225] Additional details and information regarding system 104 can be found in International Patent Application No. PCT / US2023 / 030626, filed August 18, 2023, entitled “Systems, Methods, and Apparatuses for Producing High-Pressure Steam,” which is hereby incorporated in its entirety for all purposes.

[0226] In some embodiments, system 104 is configured to utilize heat, such as waste heat generated at facility 102.

[0227] In some embodiments, system 104 includes a heat pump (e.g., Figure 10A , Figure 10B , Figure 11 , Figure 12A , Figure 12B , Figure 13A , Figure 14A and Figure 14B (e.g., any of the heat pumps 1006, etc.). In some embodiments, the heat pump 1006 is configured to increase the pressure of the fluid, for example by increasing the vapor supplied by the heat pump 1006 (e.g., Figure 1A The pressure of high-pressure steam (140-1).

[0228] In some embodiments, the heat pump 1006 includes at least one compressor configured to generate high-pressure steam 140 for facility 102 (e.g., Figure 2A The first compressor 204-1 Figure 2A The second compressor 204-2, Figure 2B The first compressor 204-1 Figure 2B (e.g., the second compressor 204-2, etc.). For example, in some embodiments, the heat pump 1006 includes a compressor assembly comprising at least one compressor 204 (e.g., Figure 2A , Figure 2B , Figure 3 , Figure 4 and Figures 5A to 5C(such as compressor unit 202 of any of the above). In some embodiments, heat pump 1006 includes compressor unit 202 having at least two compressors 204. In some embodiments, heat pump 1006 includes at least three compressors 204. In some embodiments, compressor unit 202 of heat pump 1006 includes two to twenty compressors 204. However, this disclosure is not limited to any particular number of compressors and may generally include more compressors.

[0229] In some embodiments, the heat pump 1006 includes at least one flash evaporator (e.g., Figure 2A First flash evaporator 212-1 Figure 2A Second flash evaporator 212-2, Figure 2B First flash evaporator 212-1 Figure 2B (e.g., the second flash evaporator 212-2, etc.). In some embodiments, each flash evaporator 212 in at least one flash evaporator 212 is configured to reduce the pressure of the liquid received from the second flow path 1010, for example, through one or more orifices of the flash evaporator 212 (e.g., Figure 10A (e.g., orifice 1064), which allows for restriction of the flow of liquid received by heat pump 1006 between at least one flash evaporator 212. In some embodiments, a pressure reduction causes a portion of the liquid flowing through second flow path 1010 to flash into steam at the pressure associated with flash evaporator 212. In some embodiments, the generation of steam within flash evaporator 212 causes a portion of the liquid received by flash evaporator 212 to cool and transfer heat previously absorbed in heat exchanger 1004 from fluid flowing along first flow path 1008. In some embodiments, one or more orifices of flash evaporator 212 have fixed geometry or variable-sized openings, such as a first opening having an orifice mechanically actuated by an actuator that receives one or more instructions from a processor in electronic communication with one or more sensors.

[0230] In some embodiments, heat pump 1006 is a mechanical vapor recompression (MVR) heat pump. The MVR heat pump is configured to return some or all of the residual fluid associated with the heat pump to a second flow path 1010, for example at the inlet of the second flow path 1010 upstream of heat exchanger 1004, thereby reducing the energy consumption of system 104 by circulating some or all of the heat in the residual fluid. However, this disclosure is not limited thereto. In some embodiments, heat pump 1006 includes... Figure 1A Compressor unit 202 and flash evaporator unit 210, Figure 1B Compressor unit 202 and flash evaporator unit 210, Figure 2A Compressor unit 202 and flash evaporator unit 210, Figure 2B Compressor unit 202 and flash evaporator unit 210, Figure 3Compressor unit 202 and flash evaporator unit 210, Figure 4 Compressor unit 202 and flash evaporator unit 210, Figure 5A Compressor unit 202 and flash evaporator unit 210, Figure 5B Compressor unit 202 and flash evaporator unit 210, Figure 5C The compressor unit 202 and the flash evaporator unit 210, or a combination thereof.

[0231] Additionally, system 104 includes a heat exchanger (e.g., Figure 10A , Figure 10B , Figure 11 , Figure 12A , Figure 12B , Figure 13A , Figure 13B , Figure 14A and Figure 14B (such as heat exchangers 1004 in any of them).

[0232] In some embodiments, the heat exchanger 1004 is configured to be located close to the facility 102. For example, in some embodiments, the heat exchanger 1004 is located at a distance from a heat source associated with the facility 102 (e.g., Figure 14A The heat source 1400) is a certain distance away, which allows the facility 102 to be physically separated from the heat exchanger 1004 and to pass through a first flow path (e.g., Figure 10A First flow path 1008 Figure 10B First flow path 1008 Figure 10A , Figure 10B , Figure 11 , Figure 12A , Figure 12B , Figure 13A , Figure 13B , Figure 14A and Figure 14B A first flow path 1008 (e.g., any one of the first flow paths) fluidly couples the heat source 1400 and the heat exchanger. For example, in some embodiments, the heat source 1400 is configured to generate heat, such as waste heat, at facility 102. In some embodiments, the heat generated by the heat source 1400 is transferred via an airflow (e.g., steam) discharged from facility 102, a liquid flow discharged from facility 102, or a combination thereof (e.g., a liquid-vapor mixture flow transferred from facility 102 to heat exchanger 1004). However, this disclosure is not limited thereto. In some embodiments, the heat received from facility 102 comprises hot liquid, such as wastewater or cooling tower water, received by heat exchanger 1004.

[0233] In some embodiments, the distance between facility 102 and heat exchanger 1004 is between 100 meters (m) and 10 kilometers (km). In some embodiments, the distance between facility 102 and heat exchanger 1004 is between 100 m and 10000 m, 100 m and 5050 m, 419 m and 9681 m, 419 m and 4731 m, 739 m and 9361 m, 739 m and 4411 m, 1058 m and 9042 m, 1058 m and 4092 m, 1377 m and 8723 m, 1377 m and 3773 m, 1697 m and 8403 m, 1697 m and 3453 m, 2016 m and 8084 m, 2016 m and 3134 m, 2335 m and 7765 m, 2335 m and 2815 m, 2655 m and 7445 m, 2974 m and 7126 m, 3294 m and 6806 m, 3613 m and 3613 m. The numbers between m and 6487 m, 3932 m and 6168 m, 4252 m and 5848 m, 4571 m and 5529 m, 4890 m and 5210 m, 5050 m and 10000 m, 5369 m and 9681 m, 5689 m and 9361 m, 6008 m and 9042 m, 6327 m and 8723 m, 6647 m and 8403 m, 6966 m and 8084 m, or 7285 m and 7765 m. In some embodiments, the distance between facility 102 and heat exchanger 1004 is at least 100 m, at least 419 m, at least 739 m, at least 1058 m, at least 1377 m, at least 1697 m, at least 2016 m, at least 2335 m, at least 2655 m, at least 2815 m, at least 2974 m, at least 3134 m, at least 3294 m, at least 3453 m, at least 3613 m, at least 3773 m, at least 3932 m, at least 4092 m, at least 4252 m, at least 4411 m, at least 4571 m, at least 4731 m, at least 4890 m, at least 5050 m, at least 5210 m, at least 5369 m, at least 5529 m, at least 5689 m, at least 5848 m, at least 6008 m, at least 6168 m, at least 6327 m, at least 6487 m. m, at least 6647 m, at least 6806 m, at least 6966 m, at least 7126 m, at least 7285 m, at least 7445 m, at least 7765 m, at least 8084 m, at least 8403 m, at least 8723 m, at least 9042 m, at least 9361 m, at least 9681 m, at least 10000 m.In some embodiments, the distance between facility 102 and heat exchanger 1004 is at most 100 m, at most 419 m, at most 739 m, at most 1058 m, at most 1377 m, at most 1697 m, at most 2016 m, at most 2335 m, at most 2655 m, at most 2815 m, at most 2974 m, at most 3134 m, at most 3294 m, at most 3453 m, at most 3613 m, at most 3773 m, at most 3932 m, at most 4092 m, at most 4252 m, at most 4411 m, at most 4571 m, at most 4731 m, at most 4890 m, at most 5050 m, at most 5210 m, at most 5369 m, at most 5529 m, at most 5689 m, at most 5848 m. m, up to 6008 m, up to 6168 m, up to 6327 m, up to 6487 m, up to 6647 m, up to 6806 m, up to 6966 m, up to 7126 m, up to 7285 m, up to 7445 m, up to 7765 m, up to 8084 m, up to 8403 m, up to 8723 m, up to 9042 m, up to 9361 m, up to 9681 m, up to 10000 m.

[0234] By way of example, in some embodiments, the first distance between the edge portion of the heat source 1400 and the inlet of the heat exchanger 1004 is at least 0.5 miles, at least 1 mile, or at least 2 miles.

[0235] Furthermore, in some embodiments, the distance between facility 102 and heat exchanger 1004 is greater than the distance between heat exchanger 1004 and heat pump 1006. For example, in some embodiments, the distance between facility 102 and heat exchanger 1004 is at least twice the distance between heat exchanger 1004 and heat pump 1006, at least three times the distance between heat exchanger 1004 and heat pump 1006, etc.

[0236] In some embodiments, the heat exchanger 1004 is configured to be positioned at a first height greater than the second height associated with the heat pump 1006. However, this disclosure is not limited thereto.

[0237] In some embodiments, heat exchanger 1004 includes two or more flow paths thermally coupled to each other. In some embodiments, heat exchanger 1004 includes a first flow path 1008 configured to receive energy in the form of heat from facility 102, and a second flow path 1010 configured to receive heat transferred from the first flow path 1008 to a second flow path. For example, in some embodiments, the first flow path 1008 includes a gas and / or liquid (e.g., air, water, steam, combinations thereof) flowing at least partially within the interior of heat exchanger 1004. Furthermore, in some embodiments, the gas and / or liquid flowing along the first flow path 1008 includes waste heat received from facility 102. In some embodiments, the gas and / or liquid flowing along the first flow path 1008 is received from a heat source 1400 of hot fluid exiting facility 102, wherein heat source 1400 provides waste heat generated at facility 102. In some embodiments, heat exchanger 1004 is configured to transfer latent heat and sensible heat from a fluid flowing along a first flow path 1008 to a liquid flowing along a second flow path 1010. Therefore, system 104 allows for energy savings by utilizing heat generated at facility 102 and ultimately transferred to heat pump 1006 via the first and second flow paths 1008 and 1010 of heat exchanger 1004, in order to generate steam 140 at heat pump 1006.

[0238] In some embodiments, heat exchanger 1004 is a plate heat exchanger. In some embodiments, heat exchanger 1004 is a vapor condenser heat exchanger. In some embodiments, heat exchanger 1004 is a tubular heat exchanger, finned heat exchanger, frame heat exchanger, shell heat exchanger, spiral heat exchanger, tube heat exchanger, or a combination thereof. By way of example, in some embodiments, the heat exchanger is a finned tube heat exchanger or a shell-and-tube heat exchanger, which allows heat to be indirectly transferred from a fluid flowing along a first flow path 1008 to a liquid flowing along a second flow path 1010 by passing the fluid and liquid through the heat exchanger 1004, wherein heat is transferred through the surface (e.g., the wall) of the heat exchanger 1004. In some embodiments, the indirect heat exchanger 1004 is used to allow a gas to flow along the first flow path 1008, such as a gas that does not condense into a liquid when releasing heat through the heat exchanger 1004. However, this disclosure is not limited thereto. In some embodiments, where the fluid flowing along the first flow path 1008 comprises a hot liquid, the heat exchanger 1004 comprises a plate-and-frame heat exchanger configured to directly transfer heat from the fluid flowing along the first flow path 1008 to the liquid flowing along the second flow path 1010. Furthermore, in some embodiments, the fluid flowing along the first flow path 1008 comprises vapor, and the heat exchanger 1004 is a shell-and-tube heat exchanger, which allows vapor to flow along the shell portion of the heat exchanger (e.g., to minimize pressure drop), and the liquid to flow along the tube portion of the heat exchanger 1004. In some embodiments, the heat exchanger 1004 is a direct-contact heat exchanger. For example, in some embodiments, the heat exchanger 1004 includes nozzles (e.g., Figure 10A The nozzle 1040 is configured to spray liquid onto the surface of the heat exchanger 1004 and / or onto the wetting medium. However, this disclosure is not limited thereto.

[0239] In some embodiments, the heat exchanger 1004 is a co-flow heat exchanger, wherein for at least a portion of the length of the heat exchanger 1004, a fluid flowing along a first flow path 1008 flows in a first direction, and a liquid flowing along a second flow path 1010 flows in the first direction and parallel to or substantially parallel to the first direction. Brief Reference Figure 10AIn some embodiments, the heat exchanger 1004 is a counter-current heat exchanger, wherein for at least a portion of the length of the heat exchanger 1004, fluid flowing along the first flow path 1008 flows in a first direction, and liquid flowing along the second flow path 1010 flows in a second direction opposite to the first direction and parallel or substantially parallel to the first direction and opposite to the first direction. Furthermore, in some embodiments, the heat exchanger 1004 is a cross-flow heat exchanger, wherein for at least a portion of the length of the heat exchanger 1004, fluid flowing along the first flow path 1008 flows in a first direction, and liquid flowing along the second flow path 1010 flows in a third direction perpendicular or substantially perpendicular to the first direction. Therefore, the system 104 can utilize various heat exchangers 1004 to transfer heat from the fluid flowing along the first flow path 1008 to the liquid flowing along the second flow path 1010.

[0240] In some embodiments, the heat exchanger is configured to prevent mixing of the first flow path 1008 and the second flow path 1010. For example, in some embodiments, the heat exchanger 1004 is configured to thermally couple the first flow path 1008 and the second flow path 1010 and prevent fluid flowing along the first flow path (e.g., hot water and / or hot air received from facility 102) from mixing with liquid flowing along the second flow path 1010, which at least allows the second flow path 1010 to maintain a liquid or liquid-vapor mixed flow therein. Further by way of example, in some embodiments, the design of the heat exchanger 1004 is configured at least in part based on the type of fluid received from facility 102. In some embodiments, the fluid received from facility 1002 comprises a gas flow, a vapor flow, a liquid flow, or a combination thereof, wherein the heat exchanger is configured as an indirect contact heat exchanger to prevent mixing between the first flow path 1008 and the second flow path 1010.

[0241] In some embodiments, the first flow path 1008 includes an inlet configured to receive heat from facility 1002 (e.g., Figure 10A , Figure 10B , Figure 11 , Figure 12A , Figure 12B , Figure 13A , Figure 13B , Figure 14A and Figure 14B(e.g., inlet 1012 of any of the above). For example, in some embodiments, inlet 1012 is configured to receive a portion of a gas and / or liquid flow associated with a heat source 1400 of facility 102. In some embodiments, a first flow path 1008 is configured to be fluidly coupled in series or in parallel to a source of hot fluid exiting facility 102 (e.g., heat source 1400 associated with facility 102 and / or exhaust flow associated with heat source 1400). For example, in some embodiments, the opening of inlet 1012 is configured to bypass a gas and / or liquid flow associated with heat source 1400 of facility 102, thereby allowing the first flow path 1008 to receive said flow without requiring modification of existing infrastructure at facility 102. However, this disclosure is not limited thereto. In some embodiments, inlet 1012 is configured to provide a fluid sideflow from heat source 1400 of facility 120. In some embodiments, the inlet 1012 of the first flow path 1008 is configured to couple to a source of hot fluid exiting the facility 102, for example, configured to have a third flow path (e.g., receiving hot air and / or water from a heat source 1400 of the facility 102 flowing along a third flow path) Figure 10A , Figure 10B or Figure 11 (e.g., the third flow path 1002). However, this disclosure is not limited thereto. Thus, the inlet 1012 of the first flow path 1008 allows the system 104 to bypass the heat exchanger 1004, for example, if the heat pump 1006 is offline, etc., then for fail-safe operation. Furthermore, in some embodiments, the inlet 1012 of the first flow path 1008 avoids the need to place the heat exchanger 1004 in existing process lines associated with the facility, which in turn avoids increasing back pressure on the facility, for example, if the heat source 1400 is the existing exhaust system of facility 102, then the impact includes pressure drop and / or fans (e.g., Figure 10A The performance of the suction rate of the fan assembly 1042, etc. Therefore, in some embodiments, the heat exchanger 1004 is placed in a bypass configuration using the first flow path 1008, which reduces the time required for the heat exchanger 1004 to dock with the facility (e.g., minimum downtime for cutting into existing piping associated with the heat source 1400 of facility 102 to connect to the first flow path 1008, etc.).

[0242] In some embodiments, the first flow path 1008 includes an outlet (e.g., 1014) that allows fluid flowing along the first flow path 1008 to transfer heat through the heat exchanger 1004 and be dissipated or returned to the process, such as a fluid source. By way of example, in some embodiments where the fluid includes a hot exhaust stream received from facility 102, the fluid preferably passes through a new exhaust stub downstream of the heat exchanger 1004 (e.g., Figure 14AThe fluid is discharged through an exhaust outlet 1402, etc. In another example, in some embodiments, the fluid is returned to an existing exhaust stub downstream of the inlet 1012 of the first flow path 1008. However, this disclosure is not limited thereto.

[0243] In some embodiments, the heat exchanger 1004 includes a second flow path configured to receive heat from the first flow path 1008 (e.g., Figure 10A , Figure 10B , Figure 11 , Figure 12A , Figure 12B , Figure 13A , Figure 13B , Figure 14A and Figure 14B The second flow path 1010, etc., of any of the following. For example, in some embodiments, the second flow path 1010 includes a gas and / or liquid (e.g., air, water, steam, combinations thereof, etc.) flowing at least partially within the interior of the heat exchanger 1004. As a non-limiting example, in some embodiments, the second flow path 1010 is configured to accommodate a flow that is at least partially liquid. In some embodiments, the second flow path 1010 is configured to transfer energy (e.g., heat) from the first flow path 1008 to the liquid (e.g., water) flowing along the second flow path 1010. For example, in some embodiments, the pressure of the liquid flowing along the second flow path 1010 is configured based on parameters of the heat pump 1006 and / or the second flow path (e.g., the length of the second flow path 1010, the diameter of the second flow path 1010, the fit of the second flow path 1010, etc.). In some embodiments, the second flow path 1010 is maintained at a pressure higher than the saturation point and / or boiling point of the liquid flowing along the second flow path 1010 to ensure that the liquid does not vaporize or evaporate.

[0244] In some embodiments, the second flow path 1010 includes an inlet configured to provide an inlet for liquid to flow along the second flow path 1010 (e.g., Figure 10A In some embodiments, the inlet 1016 of the second flow path 1010 is configured to couple to a water source (e.g., inlet 1016, etc.). Figure 10AWater source 1018). For example, in some embodiments, water source 1018 is configured to provide liquid (e.g., water) flowing along the second flow path 1010 through inlet 1016 of the second flow path 1010. As a non-limiting example, in some embodiments, water source 1018 includes makeup or replenishment water configured to provide liquid for the second flow path 1010 to compensate for fluid removed from the second flow path 1010, for example, the liquid being converted into steam 140 generated by heat pump 1006. For example, in some embodiments, the liquid received by heat pump 1006 from the second flow path 1010 has a first portion, which remains liquid when a second portion flashes to generate steam, resulting in a mass loss, for example, due to the steam stream leaving system 104. In some embodiments, the second flow path 1010 is configured to interact with a second makeup water flow generated at facility 102 or a different facility 102 (e.g., Figure 10A The water source 1018 is in fluid communication. In some embodiments, the makeup water is clean (e.g., containing less than 1.0 volume percentage (v / v%) of contaminants relative to the liquid flowing along the second flow path 1010), such as deaerated water suitable for boiler feedwater. However, this disclosure is not limited thereto.

[0245] In some embodiments, the second flow path 1010 includes a portion configured to couple to provide some or all of the liquid flowing along the second flow path 1010 to the outlet of the heat pump 1006 (e.g., Figure 10A The outlet 1020 of the second flow path 1010 is connected to the inlet of the heat pump 1006 (e.g., outlet 1020). For example, in some embodiments, the outlet 1020 of the second flow path 1010 is connected to the inlet of the heat pump 1006 (e.g., outlet 1020). Figure 10A The inlet 1021, etc., of the second flow path 1010 is in fluid communication. In some embodiments, the outlet 1020 of the second flow path 1010 is in direct fluid communication with the inlet 1021 of the heat pump 1006, which allows the heat pump 1006 to receive liquid flowing along the second flow path 1010 without the risk of further loss and / or contamination.

[0246] In some embodiments, the second flow path is a closed loop. In some such embodiments, system 104 further includes a heat pump outlet configured to couple with a water source associated with the inlet of the second flow path.

[0247] For example, in some embodiments, liquid flowing along the second flow path 1010 is recycled for recirculation (e.g., recirculation) through the second flow path 1010. By way of example, in some embodiments, at least one flash evaporator 212 of the heat pump 1006 is configured to flash liquid flowing along the second flow path and received by the inlet 1021 of the heat pump 1006 to generate steam. Some or all of any remaining liquid is returned to the second flow path 1010, thus forming a closed loop. However, this disclosure is not limited thereto. In some embodiments, at least one flash evaporator 212 of the heat pump 1006 is configured to provide liquid to the second flow path 1010. In some such embodiments, at least one flash evaporator 212 is configured to provide liquid water to the second flow path 1010. In some embodiments, the flash evaporator 212 is configured to provide liquid to the second flow path 1010. For example, in some embodiments, the outlet 1034 of the heat pump allows the second flow path 1010 to receive liquid (e.g., liquid water) from the heat pump 1006.

[0248] In some embodiments, the system further includes a fluid pump (e.g., fluid pump) fluidly coupled to the second flow path 1010. Figure 10AA fluid pump 1022 is provided, which allows control of the liquid flowing along the second flow path 1010. For example, in some embodiments, the fluid pump 1022 is configured to propel the liquid flowing along the second flow path 1010, induce the liquid flowing along the second flow path 1010, circulate the liquid flowing along the second flow path 1010, or a combination thereof. Furthermore, in some embodiments, the fluid pump 1022 is configured to control the flow rate associated with the liquid flowing along the second flow path 1010, such as the mass flow rate and / or the volumetric flow rate of the liquid flowing along the second flow path 1010. In some embodiments, the fluid pump 1022 is configured to control overflow in at least one flash evaporator 212. For example, in some embodiments, the fluid pump 1022 is configured to control the depth or level of liquid contained in each flash evaporator 212. By way of example, in some embodiments, the flow rate of liquid flowing along the second flow path 1010 is reduced using a fluid pump 1022 based on determining that the height in the first end flash evaporator (e.g., the highest temperature flash evaporator 212) satisfies (e.g., exceeds) a first threshold height or ratio, according to the height of the second end flash evaporator 212 (e.g., the lowest temperature flash evaporator 212). By way of another example, in some embodiments, the flow rate of liquid flowing along the second flow path 1010 is increased by the fluid pump 1022 based on determining that the height in the second end flash evaporator 212 satisfies (e.g., exceeds) a first threshold height or ratio, according to the height of the first end flash evaporator 212. Therefore, in some embodiments, the fluid pump 1022 is configured to control the volume of liquid contained in at least one flash evaporator 212 based on a first volume of liquid contained in the first end flash evaporator 212 and a second volume of liquid contained in the second end flash evaporator 212. In some embodiments, the system further includes a fourth sensor 982 configured to detect the pressure of the heat pump 1006, and a controller 906 electrically coupled to the fourth sensor 982 and the fluid pump 1022, such that the internal pressure of the heat pump 1006 meets a threshold pressure, for example, a first threshold pressure less than the saturation pressure of the liquid flowing along the second flow path 1010. However, this disclosure is not limited thereto.

[0249] In some embodiments, the fluid pump 1022 is configured to receive residual liquid exiting at least one flash evaporator 212 of the heat pump 1006 and increase the pressure of the liquid such that the liquid can flow along a second flow path 1010 to the inlet of the heat exchanger 1004 and further to the inlet of the heat pump 1006.

[0250] In some embodiments, fluid pump 1022 comprises a vertical turbine can pump. In some such embodiments, fluid pump 1022 is disposed below ground level (e.g., below horizontal plane) within the interior of a structure (e.g., a container). In some embodiments, the depth of the liquid at fluid pump 1022 increases the pressure of the liquid at or near the impeller of fluid pump 1022. In some embodiments, fluid pump 1022 comprises a centrifugal pump configured to be disposed in a roadbed vault to generate gravity head pressure. In some embodiments, fluid pump 1022 comprises a positive displacement pump that allows control of the multiphase fluid flowing along the second flow path 1010. In some embodiments, fluid pump 1022 is disposed at a height equal to or less than the height of flash evaporator 212 in at least one flash evaporator 212 of the heat pump.

[0251] In some embodiments, at least one flash evaporator 212 is configured to flash some or all of the liquid flowing along the second flow path 1010. For example, in some embodiments, at least one flash evaporator 212 is configured to flash a liquid containing water to provide vapor (e.g., Figure 10A Steam 140-1, Figure 10A (Steam 140-T, etc.). In some such embodiments, this steam is received by the inlet of at least one compressor 204. For example, in some embodiments, one or more flash evaporators 212 in at least one flash evaporator 212 include a steam outlet 226, which is fluidly coupled between compressors 204 in a series of at least two compressors 204 of the compressor unit 202. By way of non-limiting example, brief reference is made. Figure 2A and Figure 4 The second steam outlet 226-2 of the second flash evaporator 212-2 is fluidly coupled to the second inlet 216-2 of the second compressor 204-2 in the compressor unit 202. As yet another non-limiting example, brief reference is made... Figure 3 The second vapor outlet 226-2 of the second flash evaporator 212-2 is fluidly coupled to the third inlet 216-3 of the third compressor 204-3 in the compressor unit 202. However, this disclosure is not limited thereto. In some embodiments, the vapor outlet 226 of the flash evaporator 212 forms the outlet 1034 of the heat pump.

[0252] In some embodiments, the first flow path 1008 is configured to bypass a source of hot fluid exiting facility 102. For example, in some embodiments, the first flow path 1008 is configured to have a negative pressure and / or temperature gradient based on a first temperature associated with a source of hot fluid exiting facility 102 (e.g., heat source 1400) and a second temperature associated with an outlet of the first flow path 1008, which facilitates fluid flow into the first flow path 1008.

[0253] In some embodiments, system 104 further includes an outlet 1060 of heat pump 1006, the outlet being configured to couple to an existing steam header of facility 102 or a different facility 102. In some embodiments, system 104 further includes an outlet of a second flow path 1010, the outlet being configured to connect to a heat exchanger (e.g., Figure 12A Heat exchanger 1200, Figure 12B Heat exchanger 1200, Figure 14B Existing heat exchangers associated with heat exchangers such as the heat exchanger 1200, etc. Figure 12A The existing heat exchanger 1220, Figure 12B The existing heat exchanger 1220, Figure 13A The existing heat exchanger 1220, Figure 13B Coupled with an existing heat exchanger 1220, etc., the heat exhauster is, for example, a first device configured to dissipate heat through evaporation. As a non-limiting example, in some embodiments, the heat exhauster 1200 is a cooling tower, such as an existing cooling tower associated with facility 102 or a different facility.

[0254] In some embodiments, system 104 further includes a nozzle (e.g., Figure 10A Nozzle 1040, Figure 10B (e.g., nozzle 1040), the nozzle being configured to spray liquid flowing along a first flow path 1008. For example, in some embodiments, nozzle 1040 is configured to spray water into the hot fluid exiting facility 102 received by the first flow path 1008, and to capture heat from the hot fluid by interacting with it.

[0255] As a non-limiting example, in some embodiments, the fluid flowing along the first flow path comprises water condensation from the humid exhaust stream received from facility 102. In some such embodiments, the system includes a nozzle 1040 configured as a direct-contact heat exchanger with liquid exiting from the nozzle and received by the first flow path 1008. In some embodiments, the fluid flowing along the first flow path 1008 comprises hot, humid gas, and the liquid ejected from the nozzle comprises cold liquid water, thereby creating a temperature gradient between the fluid and the liquid. Thus, in some such embodiments, the liquid supplied by the nozzle receives heat from the fluid flowing along the first flow path 100, such as sensible heat transfer and latent heat from condensation. In some embodiments, system 104 includes a fluid pump (e.g., Figure 10A Fluid pump 1044, Figure 10BA fluid pump 1044 is configured to deliver fluid flowing along a first flow path, comprising liquid ejected through nozzles 1040 of system 104 for reception from the input of heat exchanger 1004. This hot water (main loop) is then pumped to a liquid-to-liquid indirect contact heat exchanger, such as a plate-and-frame heat exchanger, to transfer heat to a secondary water loop. Furthermore, in some embodiments, the water ejected into the hot fluid is further configured to purify the hot fluid, for example by forming agglomerates of solid particles from the fluid flowing along the first flow path 1008. However, this disclosure is not limited thereto. In some embodiments, the water ejected into the hot fluid comprises a first makeup water flow (e.g., Figure 10A (e.g., makeup water 1046). In some embodiments, the first flow path 1008 is configured to be in fluid communication with a first makeup water flow generated at the facility or a different facility.

[0256] In some embodiments, the system further includes a filter (e.g., Figure 10A (e.g., filter 1030). In some embodiments, filter 1030 is configured to be fluidly coupled to a first flow path 1008, which allows configuration of the quality of the fluid flowing along the first flow path 1008. For example, in some such embodiments, filter 1030 is further configured to remove contaminants from the fluid flowing along the first flow path 1008 upstream of heat exchanger 1004, which at least prevents mechanical and / or chemical wear of heat exchanger 1004 and improves the efficiency of heat exchanger 1004. However, this disclosure is not limited thereto. In some embodiments, filter 1030 is configured to remove contaminants from the fluid flowing along the first flow path 1008 downstream of heat exchanger 1004. In some embodiments, heat from facility 102 contains one or more contaminants, such as one or more metallic materials, one or more cellulose materials, one or more minerals, etc., due to one or more processes performed at facility 102. In some embodiments, the first flow path 1008 includes filter 1030, and the second flow path 1010 includes filter 1032 configured to remove one or more materials from the fluid and / or liquid flowing along the second flow path 1010. In some embodiments, filter 1030 and / or filter 1032 are chemical filters, mechanical filters, etc.

[0257] In some embodiments, system 104 further includes a damper assembly (e.g., Figure 10A Damper assembly 1026 Figure 10B Damper assembly 1026 Figure 11The damper assembly 1026 (e.g., a damper assembly configured to control flow along a first flow path 1008, such as flow along a first flow path 1008 upstream of the inlet of heat exchanger 1004). For example, in some embodiments, the damper assembly controls the size of the inlet 1012 of the first flow path 1008, which allows variable amounts of fluid originating from facility 102 to be drawn into the first flow path 1008. For example, in some embodiments, if the damper assembly 1026 is in a closed position or state, then flow of fluid originating from facility 102 along the first flow path 1008 and along the existing exhaust stub 1402 is prevented or prohibited. In some embodiments, if the damper assembly 1026 is in an open or partially open position or state, then fluid originating from facility 102 is allowed to enter the first flow path 1008. In some embodiments, the damper assembly 1026 is configured to have both an on position (e.g., the opening of the damper assembly 1026 is at its maximum size) and an off position (e.g., the opening of the damper assembly 1026 is at its minimum size). In some embodiments, the position or state of the damper assembly 1026 is controlled in an adjustable manner (e.g., via a controller) to fine-tune the fluid flowing along the first flow path 1008 received by the heat exchanger 1004. Brief reference Figure 10B In some embodiments, the first flow path 1008 includes a downstream damper assembly 1126 configured to control flow along the first flow path 1008, for example, flow downstream of the inlet of the heat exchanger 1004. In some embodiments, the downstream damper assembly 1126 is positioned adjacent to the outlet of the first flow path 1008, which allows control over the exit of fluid flowing through the first flow path 1008. However, this disclosure is not limited thereto.

[0258] In some embodiments, system 104 includes a first sensor configured to detect the temperature at inlet 1012 of the first flow path 1008 (e.g., Figure 9 (e.g., sensor 982). In some embodiments, system 104 includes a controller electrically coupled to the first sensor 982 and damper assembly 1026 (e.g., sensor 982, etc.). Figure 9 Control module 906 Figure 9(CPU 972, etc.). The damper assembly 1026 is configured to be fluidly coupled to the first flow path 1008 and to control the flow rate of fluid flowing along the first flow path 1008 at the inlet 1012 of the first flow path 1008. In some embodiments, the system 104 includes a controller 906 electrically coupled to a first sensor 982 and a downstream damper assembly 1126, wherein the downstream damper assembly 1126 is configured to be fluidly coupled to the first flow path 1008 and further configured to control the flow rate of fluid flowing along the first flow path 1008 at the outlet 1014 of the first flow path 1008.

[0259] Brief reference Figure 13A In some embodiments, system 104 includes one or more bypass valves fluidly coupled to the first flow path 1008 (e.g., Figure 12A or Figure 13A First bypass valve 1302-1, Figure 12A or Figure 13A The second bypass valve 1302-2, Figure 13A (e.g., the third bypass valve 1302-3). For example, in some embodiments, similar to the damper assembly 1026, one or more bypass valves 1302 are configured to control the flow rate of fluid flowing along the first flow path 1008. In some embodiments, one or more bypass valves 1302 are configured to control the direction of fluid flowing along the first flow path 1008, for example by controlling the fluid to flow toward the inlet of the heat exchanger 1004 in a first direction or toward the existing cooling duct in a second direction.

[0260] In some embodiments, system 104 further includes sensor 982 configured to detect the temperature of the first flow path 1008 at the inlet of heat exchanger 1004 (e.g., at the opening of heat exchanger 1004). In some embodiments, controller 906 is electrically coupled to a second sensor 982 and a fan assembly (e.g., Figure 10A Fan assembly 1042, Figure 10B (e.g., fan assembly 1042). In some embodiments, fan assembly 1042 is configured to be fluidly coupled to a first flow path 1008, which allows control of the fluid flowing along the first flow path 1008. In some such embodiments, fan assembly 1042 is further configured to maintain the temperature at the inlet of heat exchanger 1004 by controlling the flow of fluid along the first flow path 100.

[0261] In some embodiments, the fan assembly 1042 is configured to facilitate fluid flow along a first flow path 1008 toward the heat exchanger 1004, induce the fluid, circulate the fluid, or a combination thereof. For example, in some embodiments, if the damper assembly 1026 is open and the fan assembly 1042 is on, then fluid will be drawn through the inlet 1012 of the first flow path 1008 and reach the heat exchanger 1004.

[0262] In some embodiments, the fan assembly 1042 is configured to be operated by a variable speed drive (VSD). In some such embodiments, the VSD is configured to modify the speed of the fan assembly 1042, for example, to accelerate or decelerate the rotational speed of the fan assembly 1042, which in turn adjusts the flow of fluid along the first flow path 1008. In some embodiments, the fan assembly 1042 is configured to ensure that the heat exchanger 1004 receives the maximum amount of heat. In some such embodiments, the temperature of the heat source 1400 and the temperature of the fluid flowing along the first flow path 1008 are determined, for example, by using a sensor 982 and / or a controller. In some embodiments, the fan assembly 1042 is configured to maintain the fluid flowing along the first flow path 1008 based on determining that the temperature of the heat source 1400 and the temperature of the fluid flowing along the first flow path 1008 meet a threshold. By way of example, in some embodiments, the fan assembly 1042 is configured to regulate the flow rate of the fluid flowing along the first flow path 1008 in order to maintain a threshold temperature difference between the temperature of the heat source 1400 and the temperature of the fluid flowing along the first flow path 1008. In some such embodiments, the fan assembly 1042 is configured to maintain a threshold temperature difference between the temperature of the heat source 1400 and the temperature of the fluid flowing along the first flow path 1008, ensuring that the flow exiting the heat source 1400 is delivered to the heat exchanger 1004 with minimal additional flow drawn by the first flow path 1008. By way of example, in some embodiments, if too much additional flow is drawn based on the determination that the first threshold temperature difference is met, the fan assembly 1042 reduces its speed. However, this disclosure is not limited thereto. Therefore, in some embodiments, all fluid flowing along the first flow path 1008 passes through the fan assembly 1042, which allows the fan assembly 1042 to maximize the heat input and temperature received at the heat exchanger 1004.

[0263] In some embodiments, the fan assembly 1042 is configured to maintain the fluid flowing along the first flow path 1008 based on a determination that the output of the heat pump 1006 meets a threshold, where too little steam will be needed or received from the heat pump 1006, thus the fan assembly 1042 reduces its speed. Therefore, in some such embodiments, the fan assembly 1042 reduces the amount of heat input transferred to the liquid flowing along the second flow path 1010. In some embodiments, the fan assembly 1042 is configured to reduce the amount of flash steam generated in the heat pump 1006.

[0264] In some embodiments, system 104 further includes a first fluid pump (e.g., Figure 10A Fluid pump 1024, Figure 10B (e.g., a fluid pump 1024), the first fluid pump is configured to be fluidly coupled to a first flow path 1008, which allows control of the fluid flowing along the first flow path 1008 toward the heat exchanger 1004. In some embodiments, the fluid pump 1024 is coupled with a fan assembly 1042 (e.g., ...). Figure 10A Fluid pump 1028, Figure 10B Fluid pump 1028, Figure 11 The fluid pump 1024 (e.g., fluid pump 1028) is used in combination with other fluids. However, this disclosure is not limited thereto. In some embodiments, the fluid pump 1024 is configured to control the flow rate at the inlet of the heat exchanger 1004, such as the mass flow rate of the fluid flowing along the inlet of the heat exchanger 1004, the volumetric flow rate of the fluid flowing along the inlet of the heat exchanger, etc.

[0265] In some embodiments, the first flow path 1008 bypasses or runs parallel to the fluid flow originating from facility 102, and the fan assembly 1042 and / or the fluid pump 1028 are configured to draw fluid into the first flow path 1008 toward the inlet of the heat exchanger 1004. In some embodiments, the fan assembly 1042 and / or the fluid pump 1028 are configured to generate a pressure differential between the inlet of the first flow path and the inlet of the heat exchanger 1004 and / or between the fluid flow originating from facility 102 and a portion of the first flow path 1008. In some embodiments, the fan assembly 1042 includes one or more blowers. In some embodiments, the fan assembly 1042 includes one or more centrifugal fans, one or more axial fans, one or more propeller fans, or a combination thereof.

[0266] In some embodiments, the fluid flowing along the first flow path 1008 comprises hot gas and / or condensate, and the fluid pump 1024 is configured to circulate the liquid (e.g., water) to a heat exchanger 1004, which absorbs sensible and latent heat from the hot gas, for example, by water ejected from nozzle 1040 of system 104. In some embodiments, the fluid pump 1024 is configured to operate at a constant speed. In some such embodiments, the fluid pump 1024 is further configured to circulate continuously along the first flow path 1008, for example, continuously for a first period (e.g., a 24-hour period, a 72-hour period, a 1,000-hour period, etc.). In some embodiments, the fluid pump is configured to receive instructions from the VFD to maximize the temperature of the fluid flowing along the first flow path 1008 in an attempt to increase the temperature of the liquid flowing along the second flow path 1010 and received by the heat pump 1006, thereby improving the performance and / or efficiency of the heat pump 1006. In some such embodiments, the maximum temperature of the fluid flowing along the first flow path is equal to or substantially equal to the wet-bulb temperature associated with the heat source 1400. In some embodiments, the wet-bulb temperature is determined based on the temperature and humidity of system 104, for example, by using a temperature sensor 982 configured to measure the temperature and / or humidity of heat source 1400. In some embodiments, fluid pumps 1028 and / or 1024 are used to control the fluid flowing along the first flow path 1008 to satisfy different threshold temperatures between the temperature of the fluid flowing along the first flow path 1008 and the wet-bulb temperature of heat source 1400. Thus, system 104 advantageously allows the temperature of the fluid flowing along the first flow path 1008 to be maximized, which in turn maximizes the temperature of the liquid flowing along the second flow path 1010 to improve the performance of heat pump 1006.

[0267] In some embodiments, system 104 further includes a valve configured to control the flow of liquid along the second flow path 1010 (e.g., Figure 10A(e.g., valve 1038). For example, in some embodiments, valve 1038 is configured to be fluidly coupled to a second flow path 1010 and further configured to maintain the pressure of the liquid flowing along the second flow path 1010 and received by the heat pump 1006. In some embodiments, valve 1038 is configured to maintain pressure to ensure that there is no two-phase flow associated with the liquid flowing along the second flow path 1010 (e.g., the liquid does not boil). In some embodiments, valve 1038 is configured to adjust between an open position and a closed position to generate back pressure and increase the hydrostatic pressure of the liquid flowing along the second flow path 1010. Advantageously, in some such embodiments, this increased hydrostatic pressure results in a reduced risk of reaching the boiling saturation pressure of the liquid flowing along the second flow path 1010. In some embodiments, system 104 includes at least one sensor 982, such as a first pressure and / or temperature sensor and a second pressure and / or temperature sensor, configured to determine the temperature and pressure of the liquid flowing along the second flow path 1010 at the outlet of heat exchanger 1004 and at the inlet of valve 1038 or heat pump 1006. By way of example, in some embodiments, controller 906 is configured to determine the saturation pressure of the liquid flowing along the second flow path 1010 based on the temperature of the liquid flowing along the second flow path, and further determine different boiling temperatures based on the saturation pressure and hydrostatic pressure. In some embodiments, controller 906 evaluates whether a threshold, such as a threshold boiling temperature difference (e.g., a positive value, hydrostatic pressure greater than saturation pressure, etc.), is met to prevent boiling of the liquid flowing along the second flow path. However, this disclosure is not limited thereto. In some embodiments, valve 1038 is an orifice.

[0268] In some embodiments, at least one sensor 982 includes a temperature sensor 982 and a pressure sensor 982 disposed at the inlet of valve 1038, the inlet being a location where the pressure of the liquid flowing along the second flow path 1010 is generally expected to be lowest after flowing along a portion of the second flow path 1010. In some embodiments, at least one sensor is disposed at a location in the system where a local low pressure is determined to occur, thereby causing boiling. For example, in some embodiments, if heat exchanger 1004 is significantly elevated above the flash evaporator 212 of heat pump 1006, then the outlet of heat exchanger 1004 is a location where the liquid flowing along the second flow path 1010 in system 104 is at a high temperature (e.g., high saturation pressure) and low hydrostatic pressure. In some embodiments, valve 1038 is configured to maintain a temperature range of the liquid flowing along the second flow path based on threshold temperature and pressure values ​​determined by at least one sensor 982. However, this disclosure is not limited thereto.

[0269] In some embodiments, the first flow path 1008 includes an inlet configured to receive a liquid flow (e.g., a makeup water flow). Figure 10A (Inlet 1046). In some embodiments, inlet 1046 is configured to receive clean water as a liquid, which allows the desired quality of the fluid flowing along the first flow path 1008.

[0270] In some embodiments, the first flow path 1008 includes a first discharge element configured to remove contaminants contained within the first flow path 1008 (e.g., Figure 10A The first drain element 1048 is configured to fluidly couple to a first flow path 1008 upstream of the inlet of the heat exchanger 1004, which prevents material and / or chemical degradation of the heat exchanger 1004, such as the accumulation of contaminants on the internal surfaces of the heat exchanger 1004. However, this disclosure is not limited thereto. In some embodiments, the first drain element 1048 is configured to fluidly couple to a first flow path 1008 downstream of the heat exchanger 1004. In some embodiments, the first drain element 1048 is configured to provide condensate for flow along the first flow path 1008. In some embodiments, the first drain element 1048 is configured to provide a large volume of liquid for flow along the first flow path 1008.

[0271] In some embodiments, the system further includes a second discharge element associated with the second flow path 1010 (e.g., Figure 10A (Second drain element 1050). For example, in some embodiments, the second drain element 1050 is configured to remove contaminants contained by liquid flowing along the second flow path 1010. In some embodiments, the second drain element 1050 is further configured to be fluidly coupled to the second flow path 1010 downstream of the outlet of the heat pump 1006. In some embodiments, the second drain element 1050 is configured to be fluidly coupled to the second flow path 1010 upstream of the heat pump 1006.

[0272] Additional examples and implementation schemes for heat pump system 1006 are described below:

[0273] Subject technology as an explanation of the item

[0274] For convenience, various examples of the aspects of this disclosure are described as numbered entries (1, 2, 3, etc.). These entries are provided as examples and do not limit the technical subject matter.

[0275] Clause 1. A system for utilizing heat, the system comprising: a heat pump configured to provide high-pressure steam and including at least one compressor and at least one flash evaporator; a heat exchanger configured to be disposed near a facility and further comprising: a first flow path and a second flow path, wherein the first flow path is configured to transfer heat to the second flow path within the heat exchanger; an inlet of the first flow path is configured to be coupled to a source of hot fluid exiting the facility; an inlet of the second flow path is configured to be coupled to a water source; and an outlet of the second flow path is configured to be coupled to the inlet of the heat pump.

[0276] Clause 2. The system according to Clause 1, wherein the second flow path is configured to accommodate a flow that is at least partially liquid.

[0277] Clause 3. The system according to Clause 1 or 2, wherein the second flow path is a closed loop.

[0278] Clause 4. The system according to any one of Clauses 1 to 3, wherein the system further comprises a fluid pump fluidly coupled to the second flow path and further configured to control the flow rate associated with the second flow path.

[0279] Clause 5. The system according to any one of Clauses 1 to 4, wherein the at least one flash evaporator is configured to flash some or all of the water in the second flow path to provide steam received by the inlet of the at least one compressor.

[0280] Clause 6. The system according to any one of Clauses 1 to 5, wherein the at least one flash evaporator is configured to provide liquid water to the second flow path.

[0281] Clause 7. The system according to any one of Clauses 1 to 6, wherein the first flow path is configured to bypass the source of the hot fluid exiting the facility.

[0282] Clause 8. The system according to any one of Clauses 1 to 6, wherein the first flow path is configured to be fluidly coupled in series or in parallel with the source of the hot fluid exiting the facility.

[0283] Clause 9. The system according to any one of Clauses 1 to 8, wherein the heat exchanger is a plate heat exchanger.

[0284] Clause 10. The system according to any one of Clauses 1 to 9, wherein the heat exchanger is a vapor condenser heat exchanger.

[0285] Clause 11. The system according to any one of Clauses 1 to 9, wherein the heat exchanger is a tubular heat exchanger, a finned heat exchanger, a frame heat exchanger, a shell heat exchanger, a spiral heat exchanger, a tube heat exchanger, or a combination thereof.

[0286] Clause 12. The system according to any one of Clauses 1 to 11, wherein the heat exchanger is a co-current heat exchanger, a counter-current heat exchanger, or a cross-current heat exchanger.

[0287] Clause 13. The system according to any one of Clauses 1 to 12, wherein the heat exchanger is configured to prevent mixing of the first flow path and the second flow path.

[0288] Clause 14. The system according to any one of Clauses 1 to 13, wherein the heat pump is a mechanical vapor recompression (MVP) heat pump.

[0289] Clause 15. The system according to any one of Clauses 1 to 14, wherein the system further includes an outlet of the heat pump configured to be coupled to an existing steam main of the facility or a different facility.

[0290] Clause 16. The system according to any one of Clauses 1 to 15, wherein the source of the hot fluid leaving the facility is waste heat generated at the facility.

[0291] Clause 17. The system according to any one of Clauses 1 to 16, wherein the heat exchanger is configured to transfer latent heat and sensible heat from the first flow path to the second flow path.

[0292] Clause 18. The system according to any one of Clauses 1 to 17, wherein the system further includes an outlet of the second flow path configured to couple with an existing heat exchanger associated with the same exhaust heat exchanger.

[0293] Clause 19. The system according to Clause 18, wherein the heat exhauster is a cooling tower.

[0294] Clause 20. The system according to any one of Clauses 1 to 19, wherein the system further includes an outlet of the heat pump configured to couple with the water source associated with the inlet of the second flow path.

[0295] Clause 21. The system according to any one of Clauses 1 to 20, wherein the system further comprises a nozzle configured to spray water into the hot fluid exiting the facility and to capture heat from the hot fluid.

[0296] Clause 22. The system according to Clause 21, wherein the water injected into the hot fluid is further configured to purify the hot fluid.

[0297] Clause 23. The system according to any one of Clauses 12 to 22, wherein the first flow path is configured to be in fluid communication with a first makeup water flow generated at the facility or the different facility.

[0298] Clause 24. The system according to Clause 23, wherein the water injected into the hot fluid comprises the first replenishment water flow.

[0299] Clause 25. The system according to any one of Clauses 1 to 24, wherein the second flow path is configured to be in fluid communication with a second makeup water flow generated at the facility or the different facility.

[0300] Clause 26. The system according to any one of Clauses 1 to 25, wherein the system further comprises a filter configured to be fluidly coupled to the first flow path and further configured to remove contaminants from the first flow path upstream of the heat exchanger.

[0301] Clause 27. The system according to any one of Clauses 1 to 26, wherein the system further comprises: a first sensor configured to detect a temperature at the inlet of the first flow path; and a controller electrically coupled to the first sensor and a damper assembly, the damper assembly being configured to be fluidly coupled to the first flow path and further configured to control the flow rate of the first flow path at the inlet of the first flow path.

[0302] Article 28. The system according to any one of Articles 1 to 27, wherein the system further comprises: a second sensor configured to detect a temperature at the inlet of the first flow path in the heat exchanger; and a controller electrically coupled to the second sensor and a fan assembly configured to be fluidly coupled to the first flow path and further configured to maintain the temperature at the inlet of the heat exchanger.

[0303] Article 29. The system according to any one of Articles 1 to 22, wherein the system further comprises: a third sensor configured to detect a temperature at the inlet of the first flow path; and a controller electrically coupled to the third sensor and a first fluid pump configured to be fluidly coupled to the first flow path and further configured to control the flow rate at the inlet of the heat exchanger.

[0304] Article 30. The system according to any one of Articles 1 to 29, wherein the system further comprises: a fourth sensor configured to detect the pressure of the heat pump; and a controller electrically coupled to the fourth sensor and a second fluid pump configured to fluidly couple to the second flow path and further configured to maintain the pressure of the heat pump.

[0305] Clause 31. The system according to Clause 30, wherein the pressure is the internal pressure of the heat pump, and the internal pressure is less than the saturation pressure of the heat fluid.

[0306] Clause 32. The system according to any one of Clauses 1 to 31, wherein the system further comprises: a fifth sensor configured to detect pressure at the inlet of the heat pump; a sixth sensor configured to detect temperature at the inlet of the heat pump; and a controller electrically coupled to the fifth sensor, the sixth sensor, and a value configured to fluidly couple to the second flow path and further configured to maintain the pressure of the heat pump.

[0307] Clause 33. The system according to any one of Clauses 1 to 32, wherein the controller is a proportional-integral-derivative (PID) controller.

[0308] Article 34. The system according to any one of Articles 1 to 33, wherein the system further comprises a first discharge element configured to remove contaminants contained in the first flow path.

[0309] Clause 35. The system according to Clause 34, wherein the first drain element is configured to be fluidly coupled to the first flow path upstream of the inlet of the heat exchanger.

[0310] Article 36. The system according to any one of Articles 1 to 35, wherein the system further comprises a second discharge element configured to remove contaminants contained in the second flow path.

[0311] Clause 37. The system according to Clause 36, wherein the second drain element is further configured to be fluidly coupled to the second flow path downstream of the outlet of the heat pump.

[0312] Article 38. The system according to any one of Articles 1 to 37, wherein the distance between said facility and said heat exchanger is between 100 meters and 10 kilometers.

[0313] Clause 39. The system according to any one of Clauses 1 to 38, wherein the distance between the heat exchanger and the heat pump is less than 100 meters.

[0314] Clause 40. The system according to Clause 39, wherein the distance between the facility and the heat exchanger is greater than the distance between the heat exchanger and the heat pump.

[0315] Clause 41. The system according to any one of Clauses 1 to 40, wherein the heat exchanger is configured to be disposed at a first height greater than the second height associated with the heat pump.

[0316] Clause 42. The system according to any one of Clauses 1 to 8 or 11 to 41, wherein the heat exchanger is a direct contact heat exchanger.

[0317] Clause 43. The system according to any of the preceding clauses, wherein the system further comprises: a seventh sensor configured to detect the liquid depth of the heat pump; and a controller electrically coupled to the seventh sensor and the second fluid pump, the second fluid pump being configured to be fluidly coupled to the second flow path and further configured to maintain the liquid depth of the heat pump.

[0318] Clause 44. A system for utilizing heat, the system comprising: a heat exchanger configured to receive a first stream from a facility, transfer heat between the first stream and a second stream in the heat exchanger, and discharge the first stream; and a heat pump coupled to the heat exchanger, wherein the heat pump is further configured to receive the second stream from the heat exchanger and further configured to convert the second stream into a high-pressure steam stream and a fluid stream that is colder than the high-pressure steam stream.

[0319] Item 45. A system for utilizing heat, the system comprising: a heat pump, wherein the heat pump further comprises: a flash evaporator assembly coupled to a compressor assembly and further configured to receive some or all of the water in a second flow path, and the compressor assembly configured to provide high-pressure steam; a heat exchanger disposed adjacent to a facility and further comprising: a first flow path and a second flow path, wherein the first flow path is configured to transfer heat to the second flow path within the heat exchanger, the second flow path being a loop configured to contain a portion of liquid, an inlet of the first flow path configured to be coupled to a source of hot fluid exiting the facility, an inlet of the second flow path configured to be coupled to a water source, and an outlet of the second flow path configured to be coupled to an inlet of the heat pump; and a fluid pump fluidly coupled to the second flow path and further configured to control a flow rate associated with the second flow path.

[0320] Item 46. A system for utilizing heat, the system comprising: a heat exchanger configured to transfer heat from a first flow path to a second flow path within the heat exchanger, the heat exchanger further comprising: the first flow path having an inlet configured to receive waste heat from a facility, and the second flow path thermally coupled to the first flow path, wherein the second flow path is configured to transfer energy from the first flow path to a liquid flowing along the second flow path; a heat pump coupled to an outlet of the second flow path, the heat pump comprising: at least one flash evaporator configured to flash the liquid to generate steam and return any remaining liquid to the second flow path, and at least two compressors coupled to the at least one flash evaporator configured to increase the pressure of the steam; a medium inlet coupled to a second medium flow and configured to supplement the second medium flow; and a fluid pump coupled to the second flow path and configured to control the flow of the liquid and the steam.

[0321] Item 47. A system for utilizing heat, the system comprising: a heat exchanger configured to receive a first medium flow and transfer heat from the first medium flow to a second medium flow within the heat exchanger, the heat exchanger further comprising: a first flow path having an inlet configured to be coupled to and from a facility to receive the first medium flow, and a second flow path thermally coupled to the first flow path, wherein the second flow path is configured to guide the second medium flow, and the second medium flow is at least partially liquid as it passes through the second flow path; a heat pump coupled to the second flow path of the heat exchanger, the heat pump further comprising: at least one flash evaporator configured to receive the second medium flow, flash a first portion of the second medium flow to generate a vaporized medium flow, and provide a second portion of the second medium flow to the second flow path; and a compressor unit coupled to the at least one flash evaporator, wherein the compressor unit includes at least two compressors and is configured to increase the pressure of the vaporized medium flow; a medium inlet coupled to the second medium flow and configured to replenish the second medium flow; and a fluid pump coupled to the second flow path of the heat exchanger and configured to control the second medium flow.

[0322] Clause 48. The system according to Clause 47, wherein the second flow path is a closed loop.

[0323] Clause 49. The system according to Clause 47 or 48, wherein the fluid pump is further configured to control the flow rate associated with the second flow path.

[0324] Clause 50. The system according to any one of Clauses 47 to 49, wherein the at least one flash evaporator is configured to provide liquid water to the second flow path.

[0325] Clause 51. The system according to any one of Clauses 47 to 50, wherein the first flow path is configured to bypass a source of hot fluid exiting the facility.

[0326] Clause 52. The system according to any one of Clauses 47 to 51, wherein the first flow path is configured to be fluidly coupled in series or in parallel with the source of the hot fluid exiting the facility.

[0327] Clause 53. The system according to any one of Clauses 47 to 52, wherein the heat exchanger is a plate heat exchanger.

[0328] Clause 54. The system according to any one of Clauses 47 to 53, wherein the heat exchanger is a vapor condenser heat exchanger.

[0329] Clause 55. The system according to any one of Clauses 47 to 53, wherein the heat exchanger is a tubular heat exchanger, a finned heat exchanger, a frame heat exchanger, a shell heat exchanger, a spiral heat exchanger, a tube heat exchanger, or a combination thereof.

[0330] Clause 56. The system according to any one of Clauses 47 to 55, wherein the heat exchanger is a co-current heat exchanger, a counter-current heat exchanger, or a cross-current heat exchanger.

[0331] Clause 57. The system according to any one of Clauses 47 to 56, wherein the heat exchanger is configured to prevent mixing of the first flow path and the second flow path.

[0332] Clause 58. The system according to any one of Clauses 47 to 57, wherein the heat pump is a mechanical vapor recompression (MVP) heat pump.

[0333] Clause 59. The system according to any one of Clauses 47 to 58, wherein the system further includes an outlet of the heat pump configured to be coupled to an existing steam main of the facility or a different facility.

[0334] Article 60. The system according to any one of Articles 47 to 59, wherein the source of the hot fluid leaving the facility is waste heat generated at the facility.

[0335] Clause 61. The system according to any one of Clauses 47 to 60, wherein the heat exchanger is configured to transfer latent heat and sensible heat from the first flow path to the second flow path.

[0336] Clause 62. The system according to any one of Clauses 47 to 61, wherein the system further includes an outlet of the second flow path configured to couple with an existing heat exchanger associated with the exhaust heat exchanger.

[0337] Clause 63. The system according to Clause 62, wherein the heat exhauster is a cooling tower.

[0338] Clause 64. The system according to any one of Clauses 47 to 63, wherein the system further includes an outlet of the heat pump configured to be coupled to a water source associated with an inlet of the second flow path.

[0339] Clause 65. The system according to any one of Clauses 47 to 64, wherein the system further comprises a nozzle configured to spray water into the hot fluid exiting the facility and to capture heat from the hot fluid.

[0340] Clause 66. The system according to Clause 65, wherein the water injected into the hot fluid is further configured to purify the hot fluid.

[0341] Article 67. The system according to any one of Articles 47 to 66, wherein the first flow path is configured to be in fluid communication with a first makeup water flow generated at the facility or the different facility.

[0342] Clause 68. The system according to Clause 67, wherein the water injected into the hot fluid comprises the first replenishment water flow.

[0343] Clause 69. The system according to any one of Clauses 47 to 68, wherein the second flow path is configured to be in fluid communication with a second makeup water flow generated at the facility or the different facility.

[0344] Clause 70. The system according to any one of Clauses 47 to 69, wherein the system further comprises a filter configured to be fluidly coupled to the first flow path and further configured to remove contaminants from the first flow path upstream of the heat exchanger.

[0345] Article 71. The system according to any one of Articles 47 to 70, wherein the system further comprises: a first sensor configured to detect a temperature at the inlet of the first flow path; and a controller electrically coupled to the first sensor and a damper assembly, the damper assembly being configured to be fluidly coupled to the first flow path and further configured to control the flow rate of the first flow path at the inlet of the first flow path.

[0346] Article 72. The system according to any one of Articles 47 to 71, wherein the system further comprises: a second sensor configured to detect a temperature at the inlet of the first flow path in the heat exchanger; and a controller electrically coupled to the second sensor and a fan assembly configured to be fluidly coupled to the first flow path and further configured to maintain the temperature at the inlet of the heat exchanger.

[0347] Article 73. The system according to any one of Articles 47 to 72, wherein the system further comprises: a third sensor configured to detect a temperature at the inlet of the first flow path; and a controller electrically coupled to the third sensor and a first fluid pump configured to be fluidly coupled to the first flow path and further configured to control the flow rate at the inlet of the heat exchanger.

[0348] Article 74. The system according to any one of Articles 47 to 73, wherein the system further comprises: a fourth sensor configured to detect the pressure of the heat pump; and a controller electrically coupled to the fourth sensor and a second fluid pump configured to fluidly couple to the second flow path and further configured to maintain the pressure of the heat pump.

[0349] Clause 75. The system according to Clause 75, wherein the pressure is the internal pressure of the heat pump, the internal pressure being less than the saturation pressure of the heat fluid.

[0350] Article 76. The system according to any one of Articles 47 to 75, wherein the system further comprises:

[0351] A fifth sensor is configured to detect the pressure at the inlet of the heat pump;

[0352] A sixth sensor, configured to detect the temperature at the inlet of the heat pump; and

[0353] A controller electrically coupled to the fifth sensor, the sixth sensor, and a value configured to be fluidly coupled to the second flow path and further configured to maintain the pressure of the heat pump.

[0354] Clause 77. The system according to any one of Clauses 47 to 76, wherein the controller is a proportional-integral-derivative (PID) controller.

[0355] Article 78. The system according to any one of Articles 47 to 77, wherein the system further comprises a first discharge element configured to remove contaminants contained in the first flow path.

[0356] Clause 79. The system according to Clause 78, wherein the first drain element is configured to be fluidly coupled to the first flow path upstream of the inlet of the heat exchanger.

[0357] Article 80. The system according to any one of Articles 47 to 79, wherein the system further comprises a second discharge element configured to remove contaminants contained in the second flow path.

[0358] Clause 81. The system according to Clause 80, wherein the second drain element is further configured to be fluidly coupled to the second flow path downstream of the outlet of the heat pump.

[0359] Clause 82. The system according to any one of Clauses 47 to 81, wherein the distance between said facility and said heat exchanger is between 100 meters and 10 kilometers.

[0360] Clause 83. The system according to any one of Clauses 47 to 82, wherein the distance between the heat exchanger and the heat pump is less than 100 meters.

[0361] Clause 84. The system according to Clause 83, wherein the distance between the facility and the heat exchanger is greater than the distance between the heat exchanger and the heat pump.

[0362] Clause 85. The system according to any one of Clauses 47 to 84, wherein the heat exchanger is configured to be positioned at a first height greater than the second height associated with the heat pump.

[0363] Clause 86. The system according to any one of Clauses 47 to 55 or 58 to 85, wherein the heat exchanger is a direct contact heat exchanger.

[0364] Article 87. The system according to any one of Articles 47 to 86, wherein the system further comprises: a seventh sensor configured to detect the liquid depth of the heat pump; and a controller electrically coupled to the seventh sensor and the second fluid pump, the second fluid pump being configured to be fluidly coupled to the second flow path and further configured to maintain the liquid depth of the heat pump.

[0365] Example 1: A heat pump system configured to be modularly connected to the existing steam manifold of a facility.

[0366] In some embodiments, a heat pump system (e.g., Figures 1A to 7 The heat pump system 104 of any of them is configured to have products and / or facilities (e.g., Figure 1A Facilities 102-1 Figure 1AThe modularity of the series of methods (such as facilities 102-2, etc.). More particularly, in some embodiments, the baseline heat pump system 104 is configured to receive hot water at the lowest specified temperature in the series of facilities 102, generate high-pressure steam 140 at the highest specified pressure in the series of facilities 102, and provide high-pressure steam at the maximum flow rate in the series of facilities 102. In some embodiments, for facilities 102 in the series of facilities 102 that have an increased hot water temperature compared to other facilities in the series of facilities, the baseline heat pump system 104 is modified by reducing (e.g., removing) one or more compressors 204 at the downstream (e.g., low-pressure) portion of the compressor unit 202 of facility 102. In some embodiments, for facilities 102 in the series of facilities 102 that have a reduced outlet steam pressure, the baseline heat pump system 104 is modified by reducing (e.g., removing) one or more compressors 204 at the upstream (e.g., high-pressure side) of the compressor unit 202. In some embodiments, for a facility 102 in a series of facilities 102 with a reduced flow rate of high-pressure steam 140, the baseline heat pump system 104 is modified by determining a first temperature of hot water received from facility 102 and an outlet pressure of high-pressure steam received from facility 102 and then selecting an appropriate equipment size to support the desired flow rate of high-pressure steam 140.

[0367] In some embodiments, one or more components of system 104 are mounted on modular skid blocks or containers designed for easy transport and final installation.

[0368] In some embodiments, the baseline heat pump system 104 is configured to address the edge of operating parameters 916, such as minimum hot water source 110 temperature, minimum steam condensate return 214 temperature, maximum high-pressure steam 140 temperature, maximum high-pressure steam 140 pressure, maximum high-pressure steam 140 flow rate, or combinations thereof. In some embodiments, one or more portions of the compressor unit 202 and / or flash evaporator unit 210 are reduced from the baseline heat pump system 104 to accommodate higher heat source temperatures and / or lower steam outlet temperatures and / or pressures. For example, in some embodiments, the baseline heat pump system 104 is configured to address a minimum hot water source 110 temperature of at least 60 degrees Fahrenheit (℉) (15.6 degrees Celsius (°C)) or at least 80 degrees Fahrenheit (26.7°C) received from facility 102.

[0369] In some embodiments, based on the determination that the hot water source 110 is above 80℉ (26.7°C), the baseline heat pump system 104 is modified by increasing the pressure of the flash evaporator assembly 210 and reducing one or more compressors 204 at the front end of the compressor assembly 202.

[0370] In some embodiments, based on the determination that the high-pressure steam 140 received by the facility is less than 290 PSIg (20 Bar), the baseline heat pump system 104 is modified by reducing one or more compressors 204 at the rear end of the compressor unit 202.

[0371] In some embodiments, based on the determination that the high-pressure steam 140 requires a flow rate of less than 50 klb / h, one or more flash evaporators 212 in flash evaporator group 210 and / or one or more compressors 204 in compressor group 202 are replaced with corresponding one or more flash evaporators 212 and / or one or more compressors 204 configured for the lower flow rate.

[0372] Because steam density increases with increasing pressure, the mass flow rate of a compressor 204 of a given size also increases. Therefore, in some embodiments, the systems, methods, and apparatus of this disclosure utilize upper boundaries of operating parameters, such as a 20 barg output pressure for high-pressure steam 140, and determine the minimum flow rate at which compressor unit 202 can produce such pressure with high efficiency and maximum compression ratio (e.g., after desuperheating via superheater unit 230). In some embodiments, at the minimum flow rate, the systems, methods, and apparatus of this disclosure determine the inlet pressure of the hot water received from hot water source 110, which needs to achieve a 20 barg output pressure for the high-pressure flow it produces. In some embodiments, the systems, methods, and apparatus of this disclosure iteratively repeat this process on the remaining compressors 204 in compressor unit 202 until a 35 mBara inlet pressure of the hot water received by system 104 is reached.

[0373] In some embodiments, the baseline heat pump system 104 is modified based on a unique set of parameters required to be associated with the performance of the heat pump system 104 and / or one or more processes performed at the facility. For example, in some embodiments, the unique set of parameters 916 required includes the temperature of the hot water source 110 received by the system 104, the pressure of the high-pressure steam 140 generated by the system 104, and the mass flow rate of the high-pressure steam 140 generated by the system 104. In some embodiments, the systems, methods, and apparatus of this disclosure configure the baseline heat pump system 104 as two or more sub-assemblies. Each sub-assembly includes one or more compressors 204 in a compressor assembly 202 configured to be removed from the front and / or rear portions of the compressor assembly 202. In some embodiments, each sub-assembly includes one or more flash evaporators 212 in a flash evaporator assembly 210. By modifying the baseline heat pump system 104 via the sub-assemblies, the compressor assembly 202 is modified to change the temperature of the hot water source 110 received by the system 104 and the pressure of the high-pressure steam 140 generated by the system 104. In addition, in some embodiments, alternative subassemblies include a smaller, lower-flow compressor 204, which is replaced in the baseline heat pump system 104 to change the mass flow rate of the high-pressure steam 140 generated by the system 104, while optimizing the COP, cost, and size of the system 104.

[0374] Therefore, by providing the heat pump system 104 in a modular configuration, this disclosure allows pre-engineered (e.g., pre-configured) and / or factory-produced packaging systems 104 to be ready to be connected to a pre-existing facility 102.

[0375] Furthermore, in some embodiments, this modular configuration of the heat pump system 104 allows for optimization of the cost and layout footprint of the heat pump system 104 for a given application associated with facility 102, while providing the standardization required to achieve economies of scale in the manufacture of the heat pump system 104. Additionally, in some embodiments, the modular configuration of the heat pump system 104 allows for production-grade quality and reliability assurance by qualifying two or more sub-assemblies in addition to qualifying the incoming components of the heat pump system 104.

[0376] Additionally, in some embodiments, the modular configuration of the heat pump system 104 allows the heat pump system 104 to be manufactured in a factory in one or more skid blocks, allows the heat pump system 104 to be transported from the factory to the facility 102 via standard truck-based transportation, allows for simple and uncomplicated field installation of one or more skid blocks at the defined interface points at the facility 102, allows for a minimized footprint, and allows for easy removal and / or replacement of subassemblies, or combinations thereof.

[0377] For example, in some embodiments, the occupied area (e.g., the surface area beneath system 104) is 2,000 square feet (ft).2 ) and 8,000 ft 2 Between these values, including end values, such as the area occupied by system 104 which is 150 feet long by 50 feet wide.

[0378] Example 2: Computer system, method and non-transitory computer-readable storage medium for configuring a heat pump system.

[0379] In some embodiments, this disclosure provides a computer system, method, and non-transitory computer-readable storage medium for configuring a heat pump system 104.

[0380] In some embodiments, the computer systems, methods, and non-transitory computer-readable storage media of this disclosure allow selection and configuration of one or more subassemblies of the heat pump system 104 to optimally meet a given set of parameter 916 requirements associated with facility 102.

[0381] In some embodiments, the computer systems, methods, and non-transitory computer-readable storage media of this disclosure provide lookup tables. In some embodiments, the lookup tables are used to match one or more ranges of various parameter requirements (e.g., a first temperature of hot water received from facility 102 and / or the outlet pressure of high-pressure steam received by facility 102 from system 104) with specific combinations of two or more sub-assemblies configured to operate in concert.

[0382] In some embodiments, the computer systems, methods, and non-transitory computer-readable storage media of this disclosure evaluate the performance of the heat pump system 104 based on a given set of parameter 916 requirements associated with facility 102. For example, in some embodiments, the computer systems, methods, and non-transitory computer-readable storage media of this disclosure determine a given set of parameter 916 requirements in a lookup table, and then use the lookup table to select two or more sub-assemblies. In some embodiments, the computer systems, methods, and non-transitory computer-readable storage media of this disclosure evaluate the performance of the heat pump system 104, which includes two or more sub-assemblies selected via a lookup table. In some embodiments, the computer systems, methods, and non-transitory computer-readable storage media of this disclosure display a report containing a complete, pre-qualified configuration of the heat pump system and two or more sub-assemblies ready for manufacture, along with performance specifications for that configuration.

[0383] Example 3: Heat pump system.

[0384] refer to Figure 5A In some embodiments, this disclosure provides a system 104 for generating high-pressure steam.

[0385] In some embodiments, system 104 includes compressor unit 202. Compressor unit 202 includes a series of at least two compressors 204. In some embodiments, the series of at least two compressors 204 includes at least four compressors 204. Furthermore, compressor unit 202 includes an inlet 216. Additionally, compressor unit 202 includes an outlet 208 configured to supply high-pressure steam 140 to facility 102. In some embodiments, the series of at least two compressors 204 are arranged to be inserted between the inlet and outlet of compressor unit 202.

[0386] In some embodiments, the system further includes a flash evaporator assembly 210. The flash evaporator assembly 210 includes a series of at least two flash evaporators 212, wherein the series of at least two flash evaporators further includes a terminal flash evaporator 212 at one end of the flash evaporator assembly 210. In some embodiments, the series of at least two flash evaporators 212 includes at least four flash evaporators 212. Furthermore, the vapor outlet 226 of the terminal flash evaporator 212 is fluidly coupled to the inlet 216 of the compressor assembly 202. Additionally, the system 104 includes vapor outlets 226 for the remainder of the series of at least two flash evaporators 212, which are fluidly coupled between the compressors 204 in a series of at least two compressors 204.

[0387] In some embodiments, system 104 is configured to receive hot water received from hot water source 110 at a temperature of 120℉ (48.9°C). In some embodiments, system 104 is configured to receive steam condensate return 214 at a temperature of 200℉ (93.3°C).

[0388] In some embodiments, each of at least two flash evaporators 212 in a series of flash evaporators 210 is configured to be maintained at an internal pressure less than the saturation pressure of the hot water input to the respective flash evaporator 212, and is configured to expand the hot water to generate low-pressure steam. For example, in some embodiments, the terminal flash evaporator 212-1 is configured to be maintained at an internal pressure less than the saturation pressure of the hot water at 120℉ (48.9°C) (e.g., the saturation pressure of water at 120℉ is 116.9 mBar, which results in an internal pressure less than 116.8 mbar(a) for the respective flash evaporator), the second flash evaporator 212-2 is configured to be maintained at an internal pressure less than the saturation pressure of the hot water at 140℉ (60°C), the third flash evaporator 212-3 is configured to be maintained at an internal pressure less than the saturation pressure of the hot water at 160℉ (71.1°C), and the fourth flash evaporator 212-4 is configured to be maintained at an internal pressure less than the saturation pressure of the hot water at 180℉ (82.2°C). Therefore, in some embodiments, the first end flash evaporator (e.g., Figures 2A to 5BThe internal pressure of any of the flash evaporators (e.g., 212-1) is configured to be maintained at a pressure less than the saturation pressure of the hot water received from the hot water source 110 by the system 104. Furthermore, in some embodiments, the second end flash evaporator (e.g., Figures 2A to 5B The internal pressure of any of the flash evaporators 212-2, etc., is configured to be maintained at a pressure less than the saturation pressure of the steam condensate return 214 received by the system 104.

[0389] All references cited in this document are incorporated herein by full reference for all purposes, to the extent that each individual publication, patent or patent application is specifically and individually indicated to be incorporated herein by full reference for all purposes.

[0390] As will be apparent to those skilled in the art, many modifications and variations can be made to the invention without departing from its spirit and scope. The specific embodiments described herein are provided by way of example only. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, thereby enabling others skilled in the art to best utilize the invention and its various embodiments with various modifications suitable for the intended particular use. The invention is limited only by the terms of the appended claims and the full scope of the equivalents granted by these claims.

Claims

1. A system for utilizing heat, the system comprising: A heat exchanger configured to receive a first medium flow and transfer heat from the first medium flow to a second medium flow within the heat exchanger, the heat exchanger further comprising: A first flow path having an inlet configured to couple to and receive the first medium flow from the facility, and A second flow path thermally coupled to the first flow path, wherein the second flow path is configured to guide the second medium flow, and the second medium flow is at least partially liquid as it passes through the second flow path; A heat pump, coupled to the second flow path of the heat exchanger, the heat pump further comprising: At least one flash evaporator is configured to receive the second medium flow, flash a first portion of the second medium flow to produce a vaporized medium flow, and provide a second portion of the second medium flow to the second flow path. A compressor unit coupled to the at least one flash evaporator, wherein the compressor unit comprises at least two compressors and is configured to increase the pressure of the vaporized medium flow; A medium inlet, coupled to the second medium flow and configured to supplement the second medium flow; and A fluid pump coupled to the second flow path of the heat exchanger and configured to control the flow of the second medium.

2. The system according to claim 1, wherein the second flow path is a closed loop.

3. The system of claim 1 or 2, wherein the fluid pump is further configured to control the flow rate associated with the second flow path.

4. The system according to any one of claims 1 to 3, wherein the at least one flash evaporator is configured to provide liquid water to the second flow path.

5. The system according to any one of claims 1 to 4, wherein the first flow path is configured to bypass a source of hot fluid exiting the facility.

6. The system according to any one of claims 1 to 5, wherein the first flow path is configured to be fluidly coupled in series or in parallel with the source of the hot fluid exiting the facility.

7. The system according to any one of claims 1 to 6, wherein the heat exchanger is a plate heat exchanger.

8. The system according to any one of claims 1 to 7, wherein the heat exchanger is a vapor condenser heat exchanger.

9. The system according to any one of claims 1 to 7, wherein the heat exchanger is a tubular heat exchanger, a finned heat exchanger, a frame heat exchanger, a shell heat exchanger, a spiral heat exchanger, a tube heat exchanger, or a combination thereof.

10. The system according to any one of claims 1 to 9, wherein the heat exchanger is a co-current heat exchanger, a counter-current heat exchanger, or a cross-current heat exchanger.

11. The system according to any one of claims 1 to 10, wherein the heat exchanger is configured to prevent mixing of the first flow path and the second flow path.

12. The system according to any one of claims 1 to 11, wherein the heat pump is a mechanical vapor recompression (MVR) heat pump.

13. The system according to any one of claims 1 to 12, wherein the system further comprises an outlet of the heat pump configured to be coupled to an existing steam main of the facility or a different facility.

14. The system according to any one of claims 1 to 13, wherein the source of the hot fluid leaving the facility is waste heat generated at the facility.

15. The system according to any one of claims 1 to 14, wherein the heat exchanger is configured to transfer latent heat and sensible heat from the first flow path to the second flow path.

16. The system according to any one of claims 1 to 15, wherein the system further includes an outlet of the second flow path, the outlet being configured to couple with an existing heat exchanger associated with the same heat exhauster.

17. The system of claim 16, wherein the heat exhauster is a cooling tower.

18. The system according to any one of claims 1 to 17, wherein the system further includes an outlet of the heat pump configured to be coupled to a water source associated with an inlet of the second flow path.

19. The system according to any one of claims 1 to 18, wherein the system further comprises a nozzle configured to spray water into the hot fluid exiting the facility and to capture heat from the hot fluid.

20. The system of claim 19, wherein the water injected into the hot fluid is further configured to purify the hot fluid.

21. The system according to any one of claims 1 to 20, wherein the first flow path is configured to be in fluid communication with a first replenishment water flow generated at the facility or the different facility.

22. The system of claim 21, wherein the water injected into the hot fluid comprises the first replenishment water flow.

23. The system according to any one of claims 1 to 22, wherein the second flow path is configured to be in fluid communication with a second makeup water flow generated at the facility or the different facility.

24. The system according to any one of claims 1 to 23, wherein the system further comprises a filter configured to be fluidly coupled to the first flow path and further configured to remove contaminants from the first flow path upstream of the heat exchanger.

25. The system according to any one of claims 1 to 24, wherein the system further comprises: A first sensor is configured to detect the temperature at the inlet of the first flow path; and A controller electrically coupled to the first sensor and damper assembly, the damper assembly being configured to be fluidly coupled to the first flow path and further configured to control the flow rate of the first flow path at the inlet of the first flow path.

26. The system according to any one of claims 1 to 25, wherein the system further comprises: A second sensor is configured to detect the temperature of the first flow path at the inlet of the heat exchanger; and A controller electrically coupled to the second sensor and fan assembly, the fan assembly being configured to be fluidly coupled to the first flow path and further configured to maintain the temperature at the inlet of the heat exchanger.

27. The system according to any one of claims 1 to 26, wherein the system further comprises: A third sensor is configured to detect the temperature at the inlet of the first flow path; and A controller electrically coupled to the third sensor and a first fluid pump, the first fluid pump being configured to be fluidly coupled to the first flow path and further configured to control the flow rate at the inlet of the heat exchanger.

28. The system according to any one of claims 1 to 27, wherein the system further comprises: A fourth sensor is configured to detect the pressure of the heat pump; and A controller electrically coupled to the fourth sensor and a second fluid pump, the second fluid pump being configured to be fluidly coupled to the second flow path and further configured to maintain the pressure of the heat pump.

29. The system of claim 28, wherein the pressure is the internal pressure of the heat pump, and the internal pressure is less than the saturation pressure of the heat fluid.

30. The system according to any one of claims 1 to 29, wherein the system further comprises: A fifth sensor is configured to detect the pressure at the inlet of the heat pump; A sixth sensor is configured to detect the temperature at the inlet of the heat pump; and A controller electrically coupled to the fifth sensor, the sixth sensor, and a valve configured to fluidly couple to the second flow path and further configured to maintain the pressure of the heat pump.

31. The system according to any one of claims 1 to 30, wherein the controller is a proportional-integral-derivative (PID) controller.

32. The system according to any one of claims 1 to 31, wherein the system further comprises a first discharge element configured to remove contaminants contained in the first flow path.

33. The system of claim 32, wherein the first drain element is configured to be fluidly coupled to the first flow path upstream of the inlet of the heat exchanger.

34. The system according to any one of claims 1 to 33, wherein the system further comprises a second discharge element configured to remove contaminants contained in the second flow path.

35. The system of claim 34, wherein the second drain element is further configured to be fluidly coupled to the second flow path downstream of the outlet of the heat pump.

36. The system according to any one of claims 1 to 35, wherein the distance between the facility and the heat exchanger is between 100 meters and 10 kilometers.

37. The system according to any one of claims 1 to 36, wherein the distance between the heat exchanger and the heat pump is less than 100 meters.

38. The system of claim 37, wherein the distance between the facility and the heat exchanger is greater than the distance between the heat exchanger and the heat pump.

39. The system according to any one of claims 1 to 38, wherein the heat exchanger is configured to be located at a first height greater than the second height associated with the heat pump.

40. The system according to any one of claims 1 to 6 or 9 to 39, wherein the heat exchanger is a direct contact heat exchanger.

41. The system according to any preceding claim, wherein the system further comprises: A seventh sensor is configured to detect the liquid depth of the heat pump; and A controller electrically coupled to the seventh sensor and the second fluid pump, the second fluid pump being configured to be fluidly coupled to the second flow path and further configured to maintain the liquid depth of the heat pump.

42. A system for utilizing heat, the system comprising A heat exchanger configured to receive a first stream from a facility, transfer heat between the first stream and a second stream in the heat exchanger, and discharge the first stream; and A heat pump coupled to the heat exchanger, wherein the heat pump is further configured to receive the second flow from the heat exchanger and is further configured to convert the second flow into a high-pressure steam flow and a fluid flow that is colder than the high-pressure steam flow.

43. A system for utilizing heat, the system comprising: A heat pump, wherein the heat pump further comprises: A flash evaporator assembly, coupled to a compressor unit and further configured to receive some or all of the water in a second flow path, and The compressor unit is configured to provide high-pressure steam; A heat exchanger, which is located close to the facility and further includes: The first flow path and the second flow path, wherein The first flow path is configured to transfer heat to the second flow path within the heat exchanger. The second flow path is a loop configured to contain a portion of the liquid. The inlet of the first flow path is configured to couple to a source of hot fluid exiting the facility. The inlet of the second flow path is configured to couple to a water source, and The outlet of the second flow path is configured to couple to the inlet of the heat pump; and A fluid pump that is fluidly coupled to the second flow path and further configured to control the flow rate associated with the second flow path.

44. A system for utilizing heat, the system comprising: A heat exchanger configured to transfer heat from a first flow path to a second flow path within the heat exchanger, the heat exchanger further comprising: The first flow path has an inlet configured to receive waste heat from the facility, and The second flow path is thermally coupled to the first flow path, wherein the second flow path is configured to transfer energy from the first flow path to the liquid flowing along the second flow path; A heat pump coupled to the outlet of the second flow path, the heat pump comprising: At least one flash evaporator configured to flash the liquid to generate steam and return any remaining liquid to the second flow path, and At least two compressors coupled to the at least one flash evaporator are configured to increase the pressure of the steam. A medium inlet, coupled to the second medium flow and configured to supplement the second medium flow; and A fluid pump coupled to the second flow path and configured to control the flow of the liquid and the vapor.

45. A system for utilizing heat, the system comprising: A heat pump configured to provide high-pressure steam and comprising at least one compressor and at least one flash evaporator; A heat exchanger configured to be located close to the facility and further comprising: First flow path and second flow path, where The first flow path is configured to transfer heat to the second flow path within the heat exchanger; The inlet of the first flow path is configured to couple to a source of hot fluid exiting the facility; The inlet of the second flow path is configured to couple to a water source; and The outlet of the second flow path is configured to couple to the inlet of the heat pump.

46. ​​The system of claim 45, wherein the second flow path is configured to accommodate a flow that is at least partially liquid.

47. The system according to claim 45 or 46, wherein the second flow path is a closed loop.

48. The system of any one of claims 45 to 47, wherein the system further comprises a fluid pump fluidly coupled to the second flow path and further configured to control the flow rate associated with the second flow path.

49. The system according to any one of claims 45 to 48, wherein the at least one flash evaporator is configured to flash some or all of the water in the second flow path to provide steam received by the inlet of the at least one compressor.

50. The system according to any one of claims 45 to 49, wherein the at least one flash evaporator is configured to provide liquid water to the second flow path.

51. The system according to any one of claims 45 to 50, wherein the first flow path is configured to bypass the source of the hot fluid exiting the facility.

52. The system according to any one of claims 45 to 51, wherein the first flow path is configured to be fluidly coupled in series or in parallel with the source of hot fluid exiting the facility.

53. The system according to any one of claims 45 to 52, wherein the heat exchanger is a plate heat exchanger.

54. The system according to any one of claims 45 to 53, wherein the heat exchanger is a vapor condenser heat exchanger.

55. The system according to any one of claims 45 to 54, wherein the heat exchanger is a tubular heat exchanger, a finned heat exchanger, a frame heat exchanger, a shell heat exchanger, a spiral heat exchanger, a tube heat exchanger, or a combination thereof.

56. The system according to any one of claims 45 to 55, wherein the heat exchanger is a co-current heat exchanger, a counter-current heat exchanger, or a cross-current heat exchanger.

57. The system according to any one of claims 45 to 56, wherein the heat exchanger is configured to prevent mixing of the first flow path and the second flow path.

58. The system according to any one of claims 45 to 57, wherein the heat pump is a mechanical vapor recompression (MVP) heat pump.

59. The system according to any one of claims 45 to 58, wherein the system further includes an outlet of the heat pump configured to be coupled to an existing steam main of the facility or a different facility.

60. The system according to any one of claims 45 to 59, wherein the source of the hot fluid leaving the facility is waste heat generated at the facility.

61. The system according to any one of claims 45 to 60, wherein the heat exchanger is configured to transfer latent heat and sensible heat from the first flow path to the second flow path.

62. The system according to any one of claims 45 to 61, wherein the system further includes an outlet of the second flow path, the outlet being configured to couple with an existing heat exchanger associated with the exhaust heat exchanger.

63. The system of claim 62, wherein the heat exhauster is a cooling tower.

64. The system according to any one of claims 45 to 63, wherein the system further includes an outlet of the heat pump configured to couple with the water source associated with the inlet of the second flow path.

65. The system according to any one of claims 45 to 64, wherein the system further comprises a nozzle configured to spray water into the hot fluid exiting the facility and to capture heat from the hot fluid.

66. The system of claim 65, wherein the water injected into the hot fluid is further configured to purify the hot fluid.

67. The system according to any one of claims 45 to 66, wherein the first flow path is configured to be in fluid communication with a first makeup water flow generated at the facility or the different facility.

68. The system of claim 67, wherein the water injected into the hot fluid comprises the first replenishment water flow.

69. The system according to any one of claims 45 to 68, wherein the second flow path is configured to be in fluid communication with a second makeup water flow generated at the facility or the different facility.

70. The system of any one of claims 45 to 69, wherein the system further comprises a filter configured to be fluidly coupled to the first flow path and further configured to remove contaminants from the first flow path upstream of the heat exchanger.

71. The system according to any one of claims 45 to 70, wherein the system further comprises: A first sensor is configured to detect the temperature at the inlet of the first flow path; and A controller electrically coupled to the first sensor and damper assembly, the damper assembly being configured to be fluidly coupled to the first flow path and further configured to control the flow rate of the first flow path at the inlet of the first flow path.

72. The system according to any one of claims 45 to 71, wherein the system further comprises: A second sensor is configured to detect the temperature of the first flow path at the inlet of the heat exchanger; and A controller electrically coupled to the second sensor and fan assembly, the fan assembly being configured to be fluidly coupled to the first flow path and further configured to maintain the temperature at the inlet of the heat exchanger.

73. The system according to any one of claims 45 to 72, wherein the system further comprises: A third sensor is configured to detect the temperature at the inlet of the first flow path; and A controller electrically coupled to the third sensor and a first fluid pump, the first fluid pump being configured to be fluidly coupled to the first flow path and further configured to control the flow rate at the inlet of the heat exchanger.

74. The system according to any one of claims 45 to 73, wherein the system further comprises: A fourth sensor is configured to detect the pressure of the heat pump; and A controller electrically coupled to the fourth sensor and a second fluid pump, the second fluid pump being configured to be fluidly coupled to the second flow path and further configured to maintain the pressure of the heat pump.

75. The system of claim 74, wherein the pressure is the internal pressure of the heat pump, and the internal pressure is less than the saturation pressure of the heat fluid.

76. The system according to any one of claims 45 to 75, wherein the system further comprises: A fifth sensor is configured to detect the pressure at the inlet of the heat pump; A sixth sensor is configured to detect the temperature at the inlet of the heat pump; and A controller electrically coupled to the fifth sensor, the sixth sensor, and a value configured to be fluidly coupled to the second flow path and further configured to maintain the pressure of the heat pump.

77. The system according to any one of claims 45 to 76, wherein the controller is a proportional-integral-derivative (PID) controller.

78. The system according to any one of claims 45 to 77, wherein the system further comprises a first discharge element configured to remove contaminants contained in the first flow path.

79. The system of claim 78, wherein the first drain element is configured to be fluidly coupled to the first flow path upstream of the inlet of the heat exchanger.

80. The system according to any one of claims 45 to 79, wherein the system further comprises a second drain configured to remove contaminants contained in the second flow path.

81. The system of claim 80, wherein the second drain element is further configured to be fluidly coupled to the second flow path downstream of the outlet of the heat pump.

82. The system according to any one of claims 45 to 81, wherein the distance between the facility and the heat exchanger is between 100 meters and 10 kilometers.

83. The system according to any one of claims 45 to 82, wherein the distance between the heat exchanger and the heat pump is less than 100 meters.

84. The system of claim 83, wherein the distance between the facility and the heat exchanger is greater than the distance between the heat exchanger and the heat pump.

85. The system according to any one of claims 45 to 84, wherein the heat exchanger is configured to be located at a first height greater than the second height associated with the heat pump.

86. The system according to any one of claims 45 to 53 or 56 to 85, wherein the heat exchanger is a direct contact heat exchanger.

87. The system according to any one of claims 45 to 86, wherein the system further comprises: A seventh sensor is configured to detect the liquid depth of the heat pump; and A controller electrically coupled to the seventh sensor and the second fluid pump, the second fluid pump being configured to be fluidly coupled to the second flow path and further configured to maintain the liquid depth of the heat pump.

Images