Inspection device

Abstract

The inspection device includes a measurement unit that acquires shape data of an object, and a processing unit that generates three-dimensional information of an inspection site of an inspection object in a mounting board based on the shape data acquired by the measurement unit taking the mounting board as the object, with reference to board data in which information indicating the inspection site is set. The processing unit sets information of a specific region in which noise is assumed to be superimposed on the shape data in the mounting board to the board data, and performs masking processing that excludes specific data in the shape data corresponding to the specific region, or performs correction processing that corrects the specific data, in the case of generating the three-dimensional information of the inspection site.

Description

Technical Field

[0001] This invention relates to an inspection apparatus for inspecting mounting substrates on which components are mounted. Background Technology

[0002] Patent Document 1 discloses a three-dimensional measuring device for inspecting the mounting status of components in a mounting substrate. The three-dimensional measuring device acquires three-dimensional data of the object using a phase-shifting method and an optical cut-off method, respectively, and generates three-dimensional information of the object based on the three-dimensional data.

[0003] The mounting substrate contains through-holes for connecting leads to components, screen-printed areas, and clamping sections that act as holding parts when the substrate is held. These areas, including through-holes, screen-printed areas, and clamping sections, are regions where noise can easily overlap in the 3D data. When generating 3D information of the inspection area on the mounting substrate based on the noisy 3D data, it may result in the inability to generate accurate 3D information about the inspection area. In such cases, it may be impossible to inspect the inspection area on the mounting substrate with high precision.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2020-065850 Summary of the Invention

[0007] The purpose of this invention is to provide an inspection device capable of inspecting inspection areas in a mounting substrate with high precision.

[0008] One aspect of the present invention relates to an inspection apparatus that is installed on a production line for producing mounting substrates on which components are mounted, and for inspecting the mounting substrates. The inspection apparatus includes: a measuring unit that acquires shape data of an object; and a processing unit that, with reference to substrate data containing information indicating inspection portions of the object to be inspected on the mounting substrate, generates three-dimensional information of the inspection portions based on the shape data acquired by the measuring unit with the mounting substrate as the object. The processing unit sets information about specific regions in the shape data that are assumed to have noise overlap in the mounting substrate into the substrate data. When generating the three-dimensional information of the inspection portions, the processing unit performs either a masking process to exclude specific data corresponding to the specific regions in the shape data, or a correction process to correct the specific data.

[0009] The objects, features, and advantages of the present invention will become clearer from the following detailed description and accompanying drawings. Attached Figure Description

[0010] Figure 1 This is a diagram showing the structure of a production line using an inspection apparatus according to an embodiment of the present invention.

[0011] Figure 2 This is a block diagram showing the structure of the inspection device.

[0012] Figure 3 This is a cross-sectional view showing the measuring unit of the inspection device, and a diagram showing the structure of the first measuring unit that acquires two-dimensional data.

[0013] Figure 4 This is a diagram showing the structure of the second measuring unit that acquires three-dimensional data in the measuring unit.

[0014] Figure 5 This is a diagram illustrating the processing capabilities of the processing unit within the inspection device.

[0015] Figure 6 This is a flowchart illustrating the process of substrate data generation processing performed by the processing unit.

[0016] Figure 7 This is a flowchart illustrating the process of setting up a specific region based on three-dimensional data, performed by the processing unit.

[0017] Figure 8 This is a flowchart illustrating the process of a specific region setting process performed by the processing unit based on two-dimensional and three-dimensional data.

[0018] Figure 9 This is a flowchart illustrating the process of generating a learned model executed by the processing unit.

[0019] Figure 10 This is a flowchart illustrating the process of a specific area setting process performed by the processing unit based on design data.

[0020] Figure 11 This is a flowchart illustrating the process of inspection and processing performed by the processing unit.

[0021] Figure 12 This is a flowchart illustrating the process of setting up a new specific region performed by the processing unit. Detailed Implementation

[0022] Hereinafter, the inspection apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0023] [Structure of the production line using inspection equipment]

[0024] Figure 1This diagram illustrates the structure of a production line 1 using the inspection apparatus 2M of this embodiment. Production line 1 is a production line that produces mounting substrates P2 on printed circuit boards P1 with components B mounted on them. It includes a substrate transport path TR and multiple work units. The substrate transport path TR is a transport path for transporting substrates. Multiple work units are arranged on the substrate transport path TR to perform prescribed operations on the substrates. The multiple work units include a printer 11, a printing inspection machine 12, a mounting machine 13, a substrate inspection machine 14, a reflow oven 15, and a visual inspection machine 16, arranged in series from upstream to downstream along the substrate transport direction of the substrate transport path TR.

[0025] Printing machine 11 applies solder to the pads of printed circuit board P1. Printing inspection machine 12 photographs the solder-coated printed circuit board P1 to check if the position, amount, and height of the solder are appropriate. Mounting machine 13, equipped with a component mounting head, produces mounting substrate P2 by mounting the required component B onto the printed circuit board P1. Reflow oven 15 heats the mounting substrate P2 to melt the solder, fixing component B onto the substrate.

[0026] The substrate inspection machine 14 photographs the mounting substrate P2 produced by the mounting machine 13 to inspect the mounting status of component B in the mounting substrate P2, including positional misalignment, lead wire misalignment, component floating, and soldering defects. The appearance inspection machine 16 photographs the mounting substrate P2 after heat treatment in the reflow oven 15, and similarly inspects the mounting status of component B on the mounting substrate P2.

[0027] The inspection device 2M in this embodiment is applied to the substrate inspection machine 14 and the appearance inspection machine 16. In this case, in order to inspect the mounting state of the component B on the mounting substrate P2, the inspection device 2M obtains the shape data of the mounting substrate P2 and generates three-dimensional information of the mounting substrate P2 based on the shape data.

[0028] On the printed circuit board P1 and mounting board P2, which are transported along the substrate transport path TR of production line 1, a reference mark M is affixed, and there are through-hole portions A1 for insertion of lead terminals, etc., connected to component B, screen-printed portions A21, and clamping portions A22 that serve as holding portions when holding the substrate. The through-hole portion A1 in the substrates P1 and P2 can be considered as a specific area A where noise overlap is assumed in the shape data obtained by the inspection device 2M. The screen-printed portion A21 and the clamping portion A22 are included in the noise overlap portion A2, which is assumed to have noise overlap, excluding the through-hole portion A1. That is, on the printed circuit board P1 and mounting board P2, as a specific area A where noise overlap is assumed in the shape data obtained by the inspection device 2M, there are through-hole portions A1 and noise overlap portions A2 including the screen-printed portion A21 and the clamping portion A22.

[0029] [Structure of the inspection device]

[0030] Figure 2 This is a block diagram showing the structure of the inspection apparatus 2M. The inspection apparatus 2M is used to inspect the mounting substrate P2 produced on production line 1. The mounting substrate P2 is carried onto the inspection table of the inspection apparatus 2M in a state of being placed on conveyor 202, and is then removed after inspection. The inspection apparatus 2M includes a measuring unit 2 and a processing unit 5. The measuring unit 2 is a unit that acquires shape data D1 of the object. The measuring unit 2 can move in the XYZ directions via a moving mechanism 201. The processing unit 5 performs processing to analyze the shape data D1 acquired by the measuring unit 2, and performs processing to control the operation of the measuring unit 2.

[0031] <About the Measurement Unit>

[0032] The measuring unit 2 is configured to acquire two-dimensional data D2 and three-dimensional data D3 of an object as shape data D1. When the mounting substrate P2 is taken as the object, the measuring unit 2 acquires the two-dimensional data D2 and three-dimensional data D3 of the mounting substrate P2 as shape data D1. The measuring unit 2 includes a first measuring unit 3 that acquires the two-dimensional data D2 of the object and a second measuring unit 4 that acquires the three-dimensional data D3 of the object using a phase-shifting method.

[0033] Figure 3 This is a cross-sectional view of the measurement unit 2. The measurement unit 2 has a first camera 21. The first camera 21 is shared by the first measurement unit 3 and the second measurement unit 4. The first camera 21 includes a camera body 22 and a lens barrel 23. The camera body 22 includes an image sensor 24 for performing an image capture operation. The image sensor 24 is a sensor with pixels arranged in a matrix, which are composed of photoelectric conversion elements. For example, a CMOS sensor can be used as the image sensor 24. The lens barrel 23 includes a plurality of optical lenses that image the light image of the object onto the light-receiving surface of the image sensor 24. A semi-transparent mirror 25 forming the measurement light path of the first measurement unit 3 is arranged in the light path within the lens barrel 23.

[0034] The first measuring unit 3 includes a coaxial illumination unit 31 and a multi-directional illumination unit 32 as an illumination system, and a camera body 22 as an imaging system. The coaxial illumination unit 31 illuminates a coaxial illumination light L11 onto the mounting substrate P2, which is the object. The coaxial illumination unit 31 includes an LED light-emitting unit mounted on the side peripheral surface of the lens barrel 23. The coaxial illumination light L11 emitted from the coaxial illumination unit 31 is reflected by the semi-transparent mirror 25 and illuminates the mounting substrate P2 along the imaging optical axis of the first camera 21. The reflected light RL from the mounting substrate P2 passes through the lens barrel 23 and enters the camera body 22, where it is received by the imaging sensor 24.

[0035] The multi-directional illumination unit 32 includes an upper illumination unit 34, a middle illumination unit 35, and a lower illumination unit 36, all composed of LED light-emitting units. The upper illumination unit 34 is mounted at the lower end of the first camera 21 and illuminates the mounting substrate P2 with upper illumination light L12 at an illumination angle close to the vertical direction. The upper illumination light L12 is, for example, white light, or a combination of white light and infrared light. The reflected light RL of the upper illumination light L12 along the imaging optical axis is also received by the imaging sensor 24.

[0036] The intermediate illumination unit 35 illuminates the mounting substrate P2 with the intermediate illumination light L13 at an illumination angle tilted relative to the vertical direction compared to the upper illumination light L12. The intermediate illumination light L13 is, for example, white light. A dome reflector 331 with a hemispherical reflective surface is mounted at the lower end of the first camera 21. The intermediate illumination unit 35 is arranged upwards, and the intermediate illumination light L13 is reflected by the dome reflector 331 and illuminates the mounting substrate P2.

[0037] The lower illumination unit 36 ​​illuminates the mounting substrate P2 with the lower illumination light L14 at an illumination angle more inclined relative to the vertical direction than the middle illumination light L13. The lower illumination light L14 is, for example, white light. A holding disk 332 with a diameter larger than that of the dome reflector 331 is mounted at the lower end of the dome reflector 331. The lower illumination unit 36 ​​is mounted on the holding disk 332 at a predetermined tilt angle. The reflected light RL along the imaging optical axis of the middle illumination light L13 and the lower illumination light L14 is also received by the imaging sensor 24.

[0038] The camera body 22 of the first camera 21 functions as a camera for capturing a two-dimensional image of the mounting substrate P2 within the first measurement unit 3, which acquires two-dimensional data D2. When the first measurement unit 3 acquires the two-dimensional data D2, it selects one or more of the coaxial illumination unit 31, the upper illumination unit 34, the middle illumination unit 35, and the lower illumination unit 36. As in this embodiment, it is configured to illuminate the coaxial illumination light L11, the upper illumination light L12, the middle illumination light L13, and the lower illumination light L14, thereby enabling multi-angle illumination of the mounting substrate P2. Thus, the first measurement unit 3 can acquire two-dimensional data D2, which is a clear two-dimensional image of the mounting substrate P2 as the object.

[0039] Figure 4 This is a diagram showing the structure of the second measuring unit 4, which acquires three-dimensional data D3 in measuring unit 2. Figure 4 From Figure 3The measurement unit 2 shown omits the structure associated with the first measurement unit 3. The second measurement unit 4 includes a plurality of projectors 41 as an illumination system and a camera body 22 as an imaging system. The projectors 41 are arranged around the imaging optical axis of the first camera 21 at a predetermined tilt angle. That is, the projection axis of the projectors 41 is tilted at a predetermined angle relative to the imaging optical axis. For example, four projectors 41 or eight projectors 41 are arranged at equal distances and uniform intervals in the circumferential direction surrounding the imaging optical axis.

[0040] The second measuring unit 4, employing a phase-shifting method, captures images while altering the phase of the light irradiated onto the mounting substrate P2 (the object), thereby obtaining three-dimensional data D3 of the surface of the mounting substrate P2. The projector 41 irradiates patterned light L2, such as a sinusoidal pattern or a striped pattern, onto the mounting substrate P2. The reflected light RL1 of the patterned light L2, along the imaging optical axis, is incident on the first camera 21. The imaging sensor 24 of the camera body 22 receives the reflected light RL1.

[0041] Projector 41 illuminates patterned light L2 with different phases four times for each field of view. First camera 21 takes pictures each time patterned light L2 is illuminated. Second measurement unit 4 analyzes the phase changes caused by the surface shape of mounting substrate P2 based on the brightness changes in the four acquired images. Then, based on the analysis results, second measurement unit 4 obtains three-dimensional data D3 such as the height of component B on mounting substrate P2.

[0042] <About the processing unit>

[0043] return Figure 2 The processing unit 5 is implemented by a processor that operates by reading data according to a predetermined program. The processing unit 5 performs processing to analyze shape data D1, which includes two-dimensional data D2 and three-dimensional data D3 obtained by the measurement unit 2, and performs processing to control the operation of the measurement unit 2. Functionally, the processing unit 5 includes an axis processing unit 51, an image processing unit 52, a measurement processing unit 53, a storage unit 54, a display unit 55, an operation unit 56, and an overall processing unit 57.

[0044] The overall processing unit 57 processes the actions of the unified control axis processing unit 51, the imaging processing unit 52, the measurement processing unit 53, the storage unit 54, the display unit 55, and the operation unit 56.

[0045] Display unit 55 is a monitor that displays various information and data. Operation unit 56 consists of a keyboard, mouse, or a touch panel provided on display unit 55. Operation unit 56 is operated by inputting various commands from the operator.

[0046] The storage unit 54 stores various data and settings required for the operation of the inspection device 2M. For example, the storage unit 54 stores substrate data BD. The substrate data BD contains information related to the position and shape of the inspection part representing the inspection object on the mounting substrate P2, and information related to the position and shape of a specific area A on the mounting substrate P2. Furthermore, if design data for the mounting substrate P2, which determines the mounting position of component B and the position of the specific area A, exists, this design data can also be saved in the storage unit 54.

[0047] The axis processing unit 51 controls the moving mechanism 201 to move the measuring unit 2 in the XYZ directions. The moving mechanism 201 has an X-axis drive motor, a Y-axis drive motor, and a Z-axis drive motor for moving the measuring unit 2. The axis processing unit 51 controls these drive motors to move the measuring unit 2 to the imaging position of the first measuring unit 3 and the second measuring unit 4.

[0048] The imaging processing unit 52 controls the first measuring unit 3 and the second measuring unit 4 mounted on the measuring unit 2 to obtain shape data D1, which includes two-dimensional data D2 and three-dimensional data D3 of the mounting substrate P2.

[0049] The measurement processing unit 53 performs setting processing of various information for the substrate data BD and performs inspection processing of the mounting substrate P2. The substrate data BD, with various information set by the measurement processing unit 53, is stored in the storage unit 54. The measurement processing unit 53 performs inspection processing while referring to the substrate data BD to check the mounting substrate P2. Hereinafter, refer to... Figure 5 The setting and inspection processes performed on the measurement and processing unit 53 are explained.

[0050] The measurement processing unit 53 sets inspection area information BD1 related to the inspection area in the mounting substrate P2 for the substrate data BD, and sets specific area information BD2 related to a specific area A in the mounting substrate P2.

[0051] The inspection location information BD1 contains information such as the shape and position of the inspection location on the mounting substrate P2. This inspection location information BD1 is associated with inspection item information BD11, which indicates the inspection item for the inspection location, and inspection method information BD12, which indicates the inspection method for the inspection item. Figure 5In the example shown, the inspection location represented by inspection location information BD1 is component B, the inspection item represented by inspection item information BD11 is component height, and the inspection method represented by inspection method information BD12 is three-dimensional data analysis. In this case, when the measurement processing unit 53 performs inspection processing while referring to the substrate data BD to inspect the mounting substrate P2, it generates the height of component B on the mounting substrate P2 as three-dimensional information DA based on the three-dimensional data D3 of the mounting substrate P2 obtained by the measurement unit 2. Then, based on the generated three-dimensional information DA, the measurement processing unit 53 checks whether the state of the inspection location in the mounting substrate P2 is normal.

[0052] Specific region information BD2 refers to information about a specific region A in the shape data D1 obtained by the measurement unit 2 in the mounting substrate P2 that is assumed to have noise overlap. The measurement processing unit 53 sets information about the through-hole portion A1 formed in the mounting substrate P2 as specific region information BD2 in the substrate data BD, and also sets information about the noise overlap portion A2, including the silkscreen portion A21 and the clamping portion A22, as specific region information BD2 in the substrate data BD. As described above, in the mounting substrate P2, the through-hole portion A1 is a portion that can be considered as a specific region A in the shape data D1 obtained by the measurement unit 2 that is assumed to have noise overlap, and the silkscreen portion A21 and the clamping portion A22 are included in the noise overlap portion A2, which is assumed to have noise overlap, excluding the through-hole portion A1.

[0053] The specific area information BD2 is associated with inspection item information BD21, which indicates the shape and position of the specific area A in the mounting substrate P2; inspection method information BD22, which indicates the inspection method for the inspection item; and response method information BD23, which indicates the response method for the data value of the shape data D1 corresponding to the specific area A. In Figure 5 In the example shown, the detection items associated with the through-hole portion A1 represented by the specific area information BD2 are shape and position, as indicated by the detection item information BD21; the detection methods represented by the detection method information BD22 are two-dimensional data analysis and three-dimensional data analysis; and the response method represented by the response method information BD23 is masking processing. Similarly, the detection items associated with the noise overlap portion A2 represented by the specific area information BD2 are shape and position, as indicated by the detection item information BD21; the detection method represented by the detection method information BD22 is three-dimensional data analysis; and the response method represented by the response method information BD23 is correction processing.

[0054] In this case, the measurement processing unit 53 extracts the through-hole portion A1 based on the two-dimensional data D2 and three-dimensional data D3 obtained by the measurement unit 2, and extracts the noise overlap portion A2 based on the three-dimensional data D3. The shape and position information of the extracted through-hole portion A1 and noise overlap portion A2 are set as specific region information BD2 in the substrate data BD. Furthermore, when generating the three-dimensional information DA of the inspection area of ​​the mounting substrate P2 during the inspection process, the measurement processing unit 53 divides the three-dimensional data D3 of the mounting substrate P2 obtained by the measurement unit 2 into general data D31 corresponding to areas other than specific region A and specific data D32 corresponding to specific region A. The measurement processing unit 53 further divides the specific data D32 into first data D321 corresponding to the through-hole portion A1 and second data D322 corresponding to the noise overlap portion A2. Then, the measurement processing unit 53 refers to the response method information BD23 associated with the specific area information BD2 set for the substrate data BD, and performs a masking process to exclude the first data D321 corresponding to the through-hole portion A1, and performs a correction process on the second data D322 corresponding to the noise overlap portion A2, for example, correcting the data value to the ideal height value measured with the substrate surface as a reference, i.e., "0 (zero)". Thus, the measurement processing unit 53 excludes the data corresponding to the through-hole portion A1, which is assumed to overlap with noise, during the inspection process, and generates three-dimensional information DA of the inspection area in the mounting substrate P2 based on the corrected three-dimensional data D3 corresponding to the noise overlap portion A2. In this case, accurate three-dimensional information DA about the inspection area can be generated, thus enabling high-precision inspection of the inspection area.

[0055] (Substrate data generation and processing)

[0056] In this embodiment, the processing unit 5 is capable of performing substrate data generation processing, specifically substrate data BD, in the measurement processing unit 53. The measurement processing unit 53 performs substrate data generation processing before the inspection processing, which involves inspecting the inspection areas of the mounting substrate P2 in a manner linked to the production of the mounting substrate P2 in the production line 1. (Refer to...) Figure 6 The flowchart describes the substrate data generation process performed by the measurement and processing unit 53.

[0057] The measurement processing unit 53, for example, converts the substrate data used in the mounting machine 13 into data for the inspection device, and the measurement unit 2 acquires an overall image of the prototype substrate via the image processing unit 52 (step s1). The prototype substrate is a substrate prototyped by the mounting machine 13 before the production of the mounting substrate P2, and is a substrate on which the component B is mounted in the same manner as the mounting substrate P2. Based on the overall image of the prototype substrate, the measurement processing unit 53 sets the information of the reference mark M of the substrate in the substrate data BD (step s2).

[0058] Next, the measurement processing unit 53, via the imaging processing unit 52, causes the measurement unit 2 to acquire shape data D1 of the prototype substrate, including two-dimensional data D2 and three-dimensional data D3, which are field-of-view units (step s3). Then, based on the shape data D1 of the prototype substrate, the measurement processing unit 53 sets the inspection area information BD1 in the substrate data BD (step s4), and sets the inspection item information BD11 and the inspection method information BD12 in the substrate data BD in association with the inspection area information BD1 (step s5).

[0059] Next, the measurement processing unit 53 determines whether a through-hole portion A1 exists based on the shape data D1 of the prototype substrate (step s6). If it exists, the shape and position of the through-hole portion A1 are identified (step s7). Additionally, the measurement processing unit 53 determines whether a noise overlap portion A2, including the silkscreen portion A21 and the clamping portion A22, exists based on the shape data D1 of the prototype substrate (step s8). If it exists, the shape and position of the noise overlap portion A2 are identified (step s9). Then, the measurement processing unit 53 performs a specific area setting process, setting specific area information BD2, which is information about a specific area A including the through-hole portion A1 and the noise overlap portion A2, in the substrate data BD (step s10).

[0060] (Specific region settings processing)

[0061] The measurement processing unit 53 performs a specific region setting process when generating the substrate data BD. In this specific region setting process, the measurement processing unit 53 extracts a specific region A based on the shape data D1 obtained by the measurement unit 2 using the printed circuit board P1 as the object, and sets the information of this extracted specific region A as specific region information BD2 in the substrate data BD. That is, the measurement processing unit 53 sets the information of the specific region A in the substrate data BD before generating and inspecting the three-dimensional information DA of the inspection area of ​​the mounting substrate P2. In this case, when the measurement processing unit 53 performs the inspection process of the inspection area of ​​the mounting substrate P2, the process of setting the information of the specific region A in the substrate data BD can be omitted. Therefore, the inspection process of the mounting substrate P2 performed by the measurement processing unit 53 can be simplified, and the production cycle time can be improved.

[0062] Alternatively, the measurement processing unit 53 may perform specific area setting processing during the preparation of the mounting substrate P2 in the production line 1 before production. In this case, the measurement processing unit 53 can extract specific area A based on the shape data D1 obtained by the measurement unit 2 with the printed circuit board P1 as the object during the preparation of production in the production line 1, and set the information of the extracted specific area A as specific area information BD2 in the substrate data BD.

[0063] The measurement processing unit 53 may also extract a specific region A based solely on the three-dimensional data D3 obtained by the measurement unit 2, and set the information of the extracted specific region A as specific region information BD2 in the substrate data BD. (Refer to...) Figure 7 The flowchart describes the specific area setting process performed by the measurement and processing unit 53 in this case.

[0064] The measurement processing unit 53 acquires three-dimensional data D3 of the printed circuit board P1 via the imaging processing unit 52 through the measurement unit 2 (step a1). Then, the measurement processing unit 53 determines whether the data value H of the three-dimensional data D3 is less than the lower limit value Thlo of a predetermined judgment range (step a2). The predetermined judgment range represents the range of three-dimensional data D3 where the three-dimensional information DA generated based on the three-dimensional data D3 becomes an ideal "0 (zero)", and is represented by the range from the lower limit value Thlo to the upper limit value Thhi. The measurement processing unit 53 extracts the area in the printed circuit board P1 where the data value H of the three-dimensional data D3 is less than the lower limit value Thlo of the judgment range as a specific area A corresponding to the via portion A1, and sets the information of the extracted via portion A1 in the substrate data BD (step a3).

[0065] Next, the measurement processing unit 53 determines whether the data value H of the three-dimensional data D3 exceeds the upper limit of the predetermined determination range, Thi (step a4). The measurement processing unit 53 extracts the area in the printed circuit board P1 where the data value H of the three-dimensional data D3 exceeds the upper limit of the determination range, as a specific area A corresponding to the noise overlap area A2, and sets the information of the extracted noise overlap area A2 in the substrate data BD (step a5).

[0066] As described above, the measurement processing unit 53 can appropriately extract the data value H of the three-dimensional data D3 in the printed circuit board P1 that is outside the predetermined determination range as a specific region A, and set the information of the extracted specific region A in the substrate data BD.

[0067] Alternatively, the measurement processing unit 53 can also extract a specific region A based on the two-dimensional data D2 and the three-dimensional data D3 obtained by the measurement unit 2, and set the information of the extracted specific region A as specific region information BD2 in the substrate data BD. (Refer to...) Figure 8 The flowchart describes the specific area setting process performed by the measurement and processing unit 53 in this case.

[0068] The measurement processing unit 53, via the imaging processing unit 52, enables the measurement unit 2 to acquire two-dimensional data D2 and three-dimensional data D3 of the printed circuit board P1 (step b1).

[0069] The measurement processing unit 53 performs binarization processing on the brightness values ​​of the pixels constituting the two-dimensional image represented by the two-dimensional data D2, dividing the region of the two-dimensional image into a high-brightness portion and the remaining portion (step b2). The measurement processing unit 53 acquires the contour data of the high-brightness portion in the two-dimensional image (step b3), and extracts the high-brightness portion whose contour shape meets the prescribed shape conditions (step b4). For example, the measurement processing unit 53 extracts the high-brightness portion whose contour shape meets the condition of a prescribed roundness.

[0070] Next, the measurement processing unit 53 identifies and extracts the three-dimensional data D3 corresponding to the high-brightness portion (step b5), and determines whether the data value H of the three-dimensional data D3 is less than the lower limit of the predetermined judgment range, Thlo (step b6). The measurement processing unit 53 extracts the area in the printed circuit board P1 where the data value H of the three-dimensional data D3 is less than the lower limit of the judgment range, Thlo, as a specific area A corresponding to the via portion A1, and sets the information of the extracted via portion A1 in the substrate data BD (step b7). In addition, the measurement processing unit 53 determines whether the data value H of the three-dimensional data D3 exceeds the upper limit of the predetermined judgment range, Thi (step b8). The measurement processing unit 53 extracts the area in the printed circuit board P1 where the data value H of the three-dimensional data D3 exceeds the upper limit of the judgment range, Thhi, as a specific area A corresponding to the noise overlap portion A2, and sets the information of the extracted noise overlap portion A2 in the substrate data BD (step b9).

[0071] As described above, the measurement processing unit 53 can appropriately extract a region in the printed circuit board P1 whose outline shape based on the two-dimensional data D2 meets the prescribed shape conditions and whose data value H of the three-dimensional data D3 is outside the prescribed judgment range as a specific region A, and set the information of the extracted specific region A in the substrate data BD.

[0072] Furthermore, when the measurement processing unit 53 sets the information of a specific region A as specific region information BD2 in the substrate data BD, it can use a learned model that has learned instances of the three-dimensional data D3 at the specific region A to extract the specific region A when extracting the specific region A based on the three-dimensional data D3 obtained by the measurement unit 2. The measurement processing unit 53 can appropriately extract the specific region A using the learned model.

[0073] The measurement processing unit 53 is capable of generating a learned model. The measurement processing unit 53 learns an example of 3D data D3 in a specific region A using machine learning with a neural network. Then, the measurement processing unit 53 uses the 3D data D3 as input data to generate a learned model that outputs information about the specific region A. (See reference...) Figure 9The flowchart illustrates the generation process of the learned model.

[0074] The measurement processing unit 53, via the imaging processing unit 52, enables the measurement unit 2 to acquire two-dimensional data D2 and three-dimensional data D3 of the general substrate (step c1). The general substrate is a sample substrate used to generate a learned model, and it is a substrate having multiple through holes similar to those on the printed circuit board P1 and the mounting board P2.

[0075] The measurement processing unit 53 performs binarization processing on the brightness values ​​of the pixels constituting the two-dimensional image represented by the two-dimensional data D2 of the general substrate, dividing the region of the two-dimensional image into a high-brightness portion and the remaining portion (step c2). The measurement processing unit 53 obtains the contour data of the high-brightness portion in the two-dimensional image of the general substrate (step c3), and extracts the high-brightness portion whose contour shape meets the prescribed shape conditions (step c4). Then, the measurement processing unit 53 identifies the three-dimensional data D3 corresponding to the extracted high-brightness portion (step c5). As a result, the measurement processing unit 53 can generate a learned model that has learned an example of the three-dimensional data D3 at the through-hole portion A1 of a specific region A (step c6). The learned model generated in this way becomes a learned model that takes the three-dimensional data D3 as input data and outputs information about the specific region A.

[0076] Alternatively, the measurement processing unit 53 can extract a specific region A based on the design data CAD of the mounting substrate P2, and set the information of the extracted specific region A in the substrate data BD. The design data CAD is stored, for example, in the storage unit 54. When multiple specific regions A are extracted based on the design data CAD, the measurement processing unit 53 sets all or part of the information of the multiple specific regions A in the substrate data BD. (See reference...) Figure 10 The flowchart describes the specific area setting process performed by the measurement and processing unit 53 in this case.

[0077] The measurement processing unit 53 obtains the design data CAD of the mounting substrate P2 from the storage unit 54 (step d1). Based on the design data CAD, the measurement processing unit 53 identifies the position and shape of the through-hole portion A1 (step d2), and sets the information of the identified through-hole portion A1 as information of a specific region A in the substrate data BD (step d3). In addition, the measurement processing unit 53 identifies the position and shape of the noise overlap portion A2 based on the design data CAD (step d4), and sets the information of the identified noise overlap portion A2 as information of a specific region A in the substrate data BD (step d5).

[0078] As described above, the measurement processing unit 53 sets the information of a specific region A in the substrate data BD based on the design data CAD of the mounting substrate P2. In this case, when the measurement processing unit 53 performs the process of setting the information of the specific region A in the substrate data BD, the operation of acquiring the shape data D1 by the measurement unit 2 can be omitted. As a result, the process of setting the information of the specific region A performed by the measurement processing unit 53 can be simplified, and the production cycle time can be improved.

[0079] Furthermore, the measurement processing unit 53 can also extract a specific region A based on the shape data D1 obtained by the measurement unit 2 using the mounting substrate P2 as the object during the production process of the mounting substrate P2 in production line 1, and set the information of the extracted specific region A in the substrate data BD. According to this method, the measurement processing unit 53 can perform the process of setting the information of the specific region A in the substrate data BD based on the shape data D1 of the mounting substrate P2 obtained by the measurement unit 2, in a manner linked to the production of the mounting substrate P2 in production line 1, and perform inspection processing to generate and inspect the three-dimensional information DA of the inspection area of ​​the mounting substrate P2. (See reference...) Figure 11 and Figure 12 The flowchart describes the inspection process performed by the measurement and processing unit 53 in this case.

[0080] During the inspection process, the measurement processing unit 53 uses the imaging processing unit 52 to enable the measurement unit 2 to acquire shape data D1 of the mounting substrate P2, which includes two-dimensional data D2 and three-dimensional data D3 (step e1). The measurement processing unit 53 then analyzes the overlap of noise in the shape data D1 of the mounting substrate P2 (step e2).

[0081] The measurement processing unit 53 determines whether there is data corresponding to the noise overlap portion A2 in the shape data D1 of the mounting substrate P2 (step e3). If there is data corresponding to the noise overlap portion A2, the measurement processing unit 53 sets the information of the noise overlap portion A2 as information of a specific region A in the substrate data BD (step e4), and performs a correction process to correct the data corresponding to the noise overlap portion A2 to, for example, an ideal "0 (zero)" (step e5). In addition, the measurement processing unit 53 determines whether there is data corresponding to the through-hole portion A1 in the shape data D1 of the mounting substrate P2 (step e6). If there is data corresponding to the through-hole portion A1, the measurement processing unit 53 sets the information of the through-hole portion A1 as information of a specific region A in the substrate data BD (step e7), and performs a masking process to exclude the data corresponding to the through-hole portion A1 (step e8).

[0082] Next, the measurement processing unit 53 determines, based on the shape data D1 of the mounting substrate P2, whether there is a new, undefined noise overlap in the substrate data BD (step e9). If a new noise overlap exists, the measurement processing unit 53 performs a new specific area setting process to set the information of the new noise overlap in the substrate data BD (step e10). After the new specific area setting process, the measurement processing unit 53 generates three-dimensional information DA of the inspection area in the mounting substrate P2 based on three-dimensional data D3 obtained by excluding the data corresponding to the through-hole portion A1 which is assumed to overlap with noise and correcting the data corresponding to the noise overlap portion A2. Then, the measurement processing unit 53 checks whether the state of the inspection area in the mounting substrate P2 is normal based on the generated three-dimensional information DA (step e11). In this case, the measurement processing unit 53 can generate accurate three-dimensional information DA about the inspection area, thus enabling high-precision inspection of the inspection area.

[0083] Furthermore, the measurement processing unit 53 performs the following processing for setting the new specific area described above. That is, when a new noise overlap exists on the mounting substrate P2, the measurement processing unit 53 temporarily stops the inspection process (step f1) and displays an image of the new noise overlap on the display unit 55 (step f2). Then, the measurement processing unit 53 outputs a request message indicating a request for the operator to determine whether setting the new noise overlap for the substrate data BD is necessary (step f3).

[0084] The measurement processing unit 53 determines whether a new noise overlap setting instruction has been input to the operation unit 56, and responds to the request information (step f4). If a setting instruction is input to the operation unit 56, the measurement processing unit 53 causes the display unit 55 to display a setting screen for setting the new noise overlap information in the substrate data BD (step f5). Based on the input operation to the setting screen, the measurement processing unit 53 sets the new noise overlap information as information for a new specific area in the substrate data BD (step f6). Then, the measurement processing unit 53 performs correction processing or masking processing on the data corresponding to the new noise overlap in the shape data D1 of the mounting substrate P2 (step f7), and starts the inspection process again (step f8).

[0085] [Other Implementation Methods]

[0086] The embodiments of the present invention have been described above, but the present invention is not limited to the embodiments described above. For example, the following modified embodiments may also be used.

[0087] Mounting substrate P2 is a double-sided mounting substrate on both a first and a second surface in the thickness direction, on which components are mounted. In this case, the inspection device 2M can also be used to inspect the double-sided mounting substrate. When inspecting the mounting state of components on the second surface of a double-sided mounting substrate with components mounted on the first surface, there may be overlap noise in the shape data D1 related to the area on the second surface corresponding to the mounting position of the components on the first surface. Therefore, when inspecting a double-sided mounting substrate, the measurement processing unit 53 of the processing unit 5 sets the information of the area on the second surface corresponding to the mounting position of the components on the first surface as information of a specific area A in the substrate data BD.

[0088] In this case, the measurement processing unit 53 refers to the information of a specific region A on the second surface of the substrate data BD, and performs masking or correction processing on the data corresponding to the specific region A on the second surface in the shape data D1 of the double-sided mounting substrate obtained by the measurement unit 2. Therefore, during the inspection process, the measurement processing unit 53 can generate three-dimensional information DA of the inspection area on the second surface of the double-sided mounting substrate based on the three-dimensional data D3 obtained by excluding or correcting the data corresponding to the specific region A on the second surface that overlaps with assumed noise. In this case, accurate three-dimensional information DA about the inspection area can be generated, thus enabling high-precision inspection of the inspection area.

[0089] [The inventions included in the above embodiments]

[0090] The embodiments described above include the inventions shown below.

[0091] One aspect of the present invention relates to an inspection apparatus for inspecting a mounting substrate, which is included in a production line for producing mounting substrates on which components are mounted. This inspection apparatus includes: a measuring unit for acquiring shape data of an object; and a processing unit for generating three-dimensional information of the inspection area based on the shape data acquired by the measuring unit with the mounting substrate as the object, with reference to substrate data containing information indicating an inspection area of ​​the object to be inspected on the mounting substrate. The processing unit sets information about specific regions in the shape data that are assumed to have noise overlap in the mounting substrate within the substrate data. When generating the three-dimensional information of the inspection area, the processing unit performs either a masking process to exclude specific data corresponding to the specific regions in the shape data, or a correction process to correct the specific data.

[0092] According to this inspection apparatus, when generating three-dimensional information of the inspection area on the mounting substrate, the processing unit refers to information set in a specific region of the substrate data and performs masking or correction processing on specific data corresponding to the specific region in the shape data of the mounting substrate obtained by the measurement unit. Therefore, the processing unit can generate three-dimensional information of the inspection area on the mounting substrate based on the shape data after excluding or correcting the data corresponding to the specific region with assumed overlap noise. In this case, accurate three-dimensional information about the inspection area can be generated, thus enabling high-precision inspection of the inspection area.

[0093] In the inspection apparatus described above, the processing unit may set information of at least one region formed in the through-hole portion of the mounting substrate and the noise overlap portion other than the through-hole portion, which is assumed to have noise overlap, as information of the specific region in the substrate data.

[0094] In this method, when generating three-dimensional information of the inspection area on the mounting substrate, the processing unit performs masking or correction processing on specific data corresponding to vias and noise overlap areas set as specific regions in the substrate data from the shape data of the mounting substrate obtained by the measurement unit. Therefore, the processing unit can generate three-dimensional information of the inspection area on the mounting substrate based on the shape data after excluding or correcting the data corresponding to vias and noise overlap areas that are assumed to overlap with noise.

[0095] In the inspection apparatus described above, the processing unit may be able to generate the substrate data. When generating the substrate data, the specific region is extracted based on the shape data obtained by the measuring unit with the printed substrate as the object, and the information of the extracted specific region is set in the substrate data.

[0096] In this method, when generating substrate data, the processing unit sets information about specific regions in the substrate data based on the shape data of the printed circuit board obtained by the measurement unit. That is, the processing unit sets the information about specific regions in the substrate data before generating the substrate data, prior to the processing of generating and inspecting the three-dimensional information of the inspection area of ​​the mounting substrate. In this case, when the processing unit performs the inspection of the inspection area of ​​the mounting substrate, the process of setting the information about specific regions in the substrate data can be omitted. This simplifies the inspection process of the mounting substrate performed by the processing unit and improves production cycle time.

[0097] In the inspection device described above, the processing unit may also be able to generate the substrate data. When generating the substrate data, the specific area is extracted based on the design data of the mounting substrate, and the information of the extracted specific area is set in the substrate data.

[0098] Alternatively, in the inspection apparatus described above, the processing unit may, when extracting multiple specific regions, set all or part of the information of the multiple specific regions into the substrate data.

[0099] In this method, when generating substrate data, the processing unit sets information for a specific area into the substrate data based on the design data for mounting the substrate. In this case, when the processing unit performs the process of setting the information for the specific area into the substrate data, the operation of acquiring shape data by the measurement unit can be omitted. Therefore, the process of setting the information for the specific area by the processing unit can be simplified, and the production cycle time can be improved.

[0100] In the aforementioned inspection apparatus, the processing unit may extract the specific region based on the shape data obtained by the measuring unit using the mounting substrate as the object during the production process of the mounting substrate on the production line, and set the information of the extracted specific region into the substrate data.

[0101] In this method, the processing unit can, in a manner linked to the production of the mounting substrate on the production line, perform processing based on the shape data of the mounting substrate obtained by the measuring unit, set information of a specific area in the substrate data, and perform processing to generate and inspect three-dimensional information of the inspection area of ​​the mounting substrate.

[0102] In the inspection device described above, the processing unit may extract the specific region based on the shape data obtained by the measuring unit with the printed circuit board as the object during the preparation of production on the production line, and set the information of the extracted specific region in the substrate data.

[0103] In this method, the processing unit can, during the preparation for production on the production line, perform processing to set information of a specific area into the substrate data based on the shape data of the printed circuit board obtained by the measuring unit.

[0104] In the above-described inspection device, the measuring unit may acquire two-dimensional and three-dimensional data of the object as shape data, and the processing unit may extract the specific area of ​​the mounting substrate based on the three-dimensional data or the data of both the two-dimensional and three-dimensional data acquired by the measuring unit, and set the information of the extracted specific area in the substrate data.

[0105] In this method, the processing unit can process the information of a specific area into the substrate data based on the three-dimensional data, or the data of both two-dimensional data and three-dimensional data obtained by the measurement unit.

[0106] In the aforementioned inspection device, the processing unit may also extract the area outside the predetermined judgment range of the three-dimensional data value in the mounting substrate as the specific area.

[0107] Alternatively, in the inspection device described above, the processing unit may extract the specific region from the mounting substrate by defining the region whose contour shape based on the two-dimensional data meets the specified shape conditions and whose three-dimensional data value is outside the specified judgment range.

[0108] In this method, the processing unit can appropriately extract a specific region based on the three-dimensional data, or the data from both two-dimensional and three-dimensional data obtained by the measurement unit.

[0109] In the inspection apparatus described above, the processing unit may also use a learned model that has learned instances of the three-dimensional data at the specific region to extract the specific region of the mounting substrate.

[0110] In this approach, the processing unit can appropriately extract specific regions using the learned model.

[0111] In the above-described inspection apparatus, the mounting substrate includes a double-sided mounting substrate on which components are mounted on both a first side and a second side in the thickness direction.

[0112] In this method, an inspection device can be used to inspect a double-sided mounting substrate. For example, when inspecting the mounting status of components on the second side of a double-sided mounting substrate after components have been mounted on the first side, noise may overlap in the shape data related to the area on the second side corresponding to the mounting position of the components on the first side. Therefore, when inspecting a double-sided mounting substrate, the processing unit can set the information of the area on the second side corresponding to the mounting position of the components on the first side as information of a specific area in the substrate data.

[0113] As explained above, according to the present invention, an inspection apparatus capable of inspecting inspection portions in a mounting substrate with high precision can be provided.

Claims

1. An inspection apparatus, disposed on a production line for producing mounting substrates on which components are mounted, for inspecting the mounting substrates, wherein, The inspection device includes: The measuring unit acquires shape data of the object; and The processing unit, referring to substrate data containing information representing the inspection area of ​​the object to be inspected on the mounting substrate, generates three-dimensional information of the inspection area based on the shape data obtained by the measuring unit when the mounting substrate is considered as the object. The processing unit sets information about specific regions in the shape data of the mounting substrate that are assumed to have noise overlap into the substrate data. When generating the three-dimensional information of the inspection area, the processing unit performs either masking processing to exclude specific data in the shape data that corresponds to the specific region, or correction processing to modify the specific data.

2. The inspection device according to claim 1, wherein, The processing unit sets information of at least one region among the through-hole portion formed on the mounting substrate and the noise overlap portion assuming noise overlap other than the through-hole portion as information of the specific region in the substrate data.

3. The inspection device according to claim 1, wherein, The processing unit is capable of generating the substrate data. When generating the substrate data, the processing unit extracts the specific region based on the shape data obtained by the measuring unit using the printed substrate as the object, and sets the information of the extracted specific region in the substrate data.

4. The inspection device according to claim 1, wherein, The processing unit is capable of generating the substrate data. When generating the substrate data, the processing unit extracts the specific region based on the design data of the mounting substrate and sets the information of the extracted specific region into the substrate data.

5. The inspection device according to claim 4, wherein, When the processing unit extracts multiple specific regions, it sets all or part of the information of the multiple specific regions into the substrate data.

6. The inspection device according to claim 1, wherein, During the production process of the mounting substrate on the production line, the processing unit extracts the specific region based on the shape data obtained by the measuring unit using the mounting substrate as the object, and sets the information of the extracted specific region into the substrate data.

7. The inspection device according to claim 1, wherein, When preparing for production on the production line, the processing unit extracts the specific region based on the shape data obtained by the measuring unit using the printed substrate as the object, and sets the information of the extracted specific region in the substrate data.

8. The inspection device according to claim 1, wherein, The measuring unit can acquire two-dimensional and three-dimensional data of the object as shape data. The processing unit extracts the specific region of the mounting substrate based on the three-dimensional data or the data of both the two-dimensional data and the three-dimensional data obtained by the measuring unit, and sets the information of the extracted specific region in the substrate data.

9. The inspection device according to claim 8, wherein, The processing unit extracts the specific region from the mounting substrate by identifying areas where the data value of the three-dimensional data is outside a predetermined range.

10. The inspection apparatus according to claim 8, wherein, The processing unit extracts the specific region from the mounting substrate by defining the region whose contour shape based on the two-dimensional data meets the specified shape conditions and whose three-dimensional data value is outside the specified judgment range.

11. The inspection apparatus according to claim 8, wherein, The processing unit uses a learned model that has learned instances of the three-dimensional data at the specific region to extract the specific region of the mounting substrate.

12. The inspection device according to claim 1, wherein, The mounting substrate includes a double-sided mounting substrate on which components are mounted on a first and a second surface in the thickness direction.

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