Inspection system, display device, inspection method, program, method for manufacturing laminate, and control device

Abstract

The present application suitably detects local deformation of a layer. An inspection system (100) includes an irradiation device (2) capable of irradiating a radioactive ray, a photographing device (4) that irradiates a radioactive ray to a layer stack by the irradiation device (2) and outputs data showing an internal structure of the layer stack, and a control device (5) that outputs information on deformation of a portion of a first layer of the layer stack based on the data output by the control device (108).

Description

Technical Field

[0001] This invention relates to an inspection system, a display device, an inspection method, a procedure, a method for manufacturing laminates, and a control device. Background Technology

[0002] As a means of acquiring information about the interior of an object in a non-destructive manner, there are known X-ray devices, such as those disclosed in the following patent documents, which have an X-ray source for irradiating an object with X-rays and include a detector for detecting transmitted X-rays that have passed through the object.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-174495 Summary of the Invention

[0006] According to a first aspect of this disclosure, the inspection system includes: an irradiation device capable of irradiating radiation; an imaging device that irradiates the laminate with the radiation through the irradiation device and outputs data showing the internal structure of the laminate; and a control device that outputs information about the deformation of a portion of a first layer of the laminate based on the data.

[0007] According to a second aspect of this disclosure, the inspection system includes an irradiation device capable of irradiating radiation and a control device, wherein the control device irradiates the laminate with radiation through the irradiation device, acquires data showing the internal structure of the laminate, and outputs the acquired information about the deformation of a portion of the first layer inside the laminate.

[0008] According to a third aspect of this disclosure, the display device displays information about the deformation of a portion of the first layer of the laminate, calculated based on data obtained by irradiation of radiation that shows the internal structure of the laminate.

[0009] According to the fourth aspect of this disclosure, the inspection method includes: acquiring data obtained by irradiation of radiation, showing the internal structure of the laminate; and calculating, based on the data, information about the deformation of a portion of the first layer of the laminate.

[0010] According to the fifth aspect of this disclosure, the program causes a computer to perform the following processing: acquiring data, taken by means of irradiation, showing the internal structure of a laminate; and, based on the data, calculating information about the deformation of a portion of the first layer of the laminate.

[0011] According to the sixth aspect of this disclosure, a method for manufacturing a laminate includes: creating design information about the shape of the laminate; manufacturing the laminate based on the design information; and using the inspection system to determine whether a portion of a component of a constituent layer of the manufactured laminate is deformed.

[0012] According to the seventh aspect of this disclosure, the control device acquires data showing the internal structure of the laminate, which is captured by irradiation, and calculates a determination result based on the data as to whether a portion of the constituent layer of the laminate is deformed. Attached Figure Description

[0013] Figure 1 This is a schematic structural diagram showing an example of an inspection device in its first embodiment.

[0014] Figure 2 This is a schematic block diagram of the inspection device of this embodiment.

[0015] Figure 3 This is a schematic diagram of a stacked structure.

[0016] Figure 4 This is a schematic diagram of a stacked structure.

[0017] Figure 5 This is a schematic diagram of a stacked structure.

[0018] Figure 6 This is a chart showing an example of the grayscale values ​​at various locations on the line.

[0019] Figure 7 This is a diagram showing an example of the location of a layer.

[0020] Figure 8 This is a schematic diagram illustrating an example of a detection line and a baseline.

[0021] Figure 9 This is a chart showing an example of the difference between the detection line and the baseline.

[0022] Figure 10 This is a chart showing an example of local variations in a layer.

[0023] Figure 11 This is a flowchart illustrating the processing flow of the control device.

[0024] Figure 12 This is a flowchart illustrating the processing flow of the control device.

[0025] Figure 13 This is a flowchart illustrating the processing flow of the control device.

[0026] Figure 14This is a flowchart illustrating the processing flow of another example of this embodiment.

[0027] Figure 15 This is a diagram illustrating another example of the output information.

[0028] Figure 16 This is a diagram illustrating another example of the output information.

[0029] Figure 17 This is a diagram illustrating another example of the output information.

[0030] Figure 18 This is a diagram illustrating another example of the output information.

[0031] Figure 19 This is a diagram illustrating another example of the output information.

[0032] Figure 20 It is a block diagram of the manufacturing system.

[0033] Figure 21 It is a flowchart illustrating the processing flow carried out through the manufacturing system. Detailed Implementation

[0034] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Furthermore, the components in the following embodiments include components readily conceived by those skilled in the art, substantially identical components, i.e., components within the so-called equivalent range. Moreover, the components disclosed in the following embodiments can be suitably combined.

[0035] In the following description, an STU orthogonal coordinate system is established, and the positional relationships of each part are explained with reference to this STU orthogonal coordinate system. A defined direction in the horizontal plane is designated as the U-axis direction, a direction orthogonal to the U-axis direction in the horizontal plane is designated as the S-axis direction, and directions orthogonal to both the U-axis and S-axis directions (i.e., vertical directions) are designated as the T-axis direction. Furthermore, the rotation (tilt) directions around the S-axis, T-axis, and U-axis are designated as the θS-axis, θT-axis, and θU-axis directions, respectively.

[0036] (Inspect the overall structure of the system)

[0037] Figure 1This is a schematic structural diagram illustrating an example of the inspection apparatus of this embodiment. The inspection system 100 of this embodiment irradiates a test object Q (in this embodiment, a laminate A described later) with radiation via an irradiation device 2, and detects the radiation transmitted through the test object Q via an imaging device 4. In this embodiment, the radiation irradiated by the irradiation device 2 includes X-rays. X-rays are electromagnetic waves generated from the extranuclear portion of atomic nuclei, with wavelengths of approximately 1 pm to 30 nm. X-rays include at least one of ultrasoft X-rays of approximately 50 eV, soft X-rays of approximately 0.1 keV to 2 keV, X-rays of approximately 2 keV to 20 keV, and hard X-rays of approximately 20 eV to 1000 eV. Inspection systems using X-rays are disclosed in, for example, Japanese Patent Application Publication No. Sho 60-210087, Japanese Patent Application Publication No. Hei 7-308313, Japanese Patent Application Publication No. 2013-113798, Japanese Patent Application Publication No. 2013-174495, Japanese Patent Application Publication No. 2017-22054, and Japanese Patent Application Publication No. 2018-536978.

[0038] In this embodiment, the inspection system 100 includes an X-ray computed tomography (CT) examination device. The X-ray CT examination device irradiates the object Q with radiation (X-rays), detects the transmitted X-rays that pass through the object Q, and acquires internal information of the object Q in a non-destructive manner. The internal information of the object Q may be, for example, its internal structure.

[0039] exist Figure 1 The inspection system 100 includes an inspection system 1 that detects X-rays transmitted by irradiating the object Q with radiation (X-rays), and a control system 5 that controls the overall operation of the inspection system 100, including the inspection system 1. The inspection system 1 includes an irradiation device 2 that emits X-rays XL as radiation, a stage device 3 that holds and moves the object Q, and an imaging device 4 that detects the radiation (transmitted X-rays) emitted from the irradiation device 2 and transmitted through the object Q held by the stage device 3.

[0040] In this embodiment, the irradiation device 2 and the imaging device 4 are arranged such that the optical axis of the X-ray XL emitted from the irradiation device 2 toward the imaging device 4 is along the U-axis. The detection surface of the imaging device 4 is set to be parallel to a surface (ST plane) orthogonal to the optical axis of the X-ray XL.

[0041] Furthermore, in this embodiment, the inspection system 100 includes a chamber component 6 that forms an internal space SP for the X-rays XL emitted from the irradiation device 2 to travel. In this embodiment, the irradiation device 2, the stage device 3, and the imaging device 4 are disposed within the internal space SP.

[0042] In this embodiment, the chamber member 6 is disposed on a supporting surface FR. The supporting surface FR includes the floor of a factory or similar facility. The chamber member 6 is supported by a plurality of supporting members 6S. The chamber member 6 is disposed on the supporting surface FR via the supporting members 6S. In this embodiment, the lower surface of the chamber member 6 is separated from the supporting surface FR by the supporting members 6S. That is, a space is formed between the lower surface of the chamber member 6 and the supporting surface FR. In addition, at least a portion of the lower surface of the chamber member 6 can contact the supporting surface FR.

[0043] In this embodiment, the chamber member 6 contains lead. The chamber member 6 suppresses the leakage of X-rays XL from the internal space SP to the external space RP of the chamber member 6.

[0044] In this embodiment, the inspection system 100 has a component 6D mounted on the chamber member 6 and having a lower thermal conductivity than the chamber member 6. In this embodiment, component 6D is disposed on the outer surface of the chamber member 6. Component 6D suppresses the temperature of the internal space SP from being affected by the temperature (temperature change) of the external space RP. That is, component 6D functions as an insulating component to suppress heat transfer from the external space RP to the internal space SP. Component 6D may contain, for example, plastic. In this embodiment, component 6D may contain, for example, expanded polystyrene.

[0045] (Irradiation device)

[0046] The irradiation device 2 is a device capable of irradiating radiation (X-rays XL in this embodiment). The irradiation device 2 irradiates the object Q with X-rays XL. The irradiation device 2 has an exit section 8 that emits X-rays XL. The irradiation device 2 forms a point X-ray source. In this embodiment, the irradiation device 2 includes a point X-ray source (the point where X-rays are generated). The irradiation device 2 irradiates the object Q with conical X-rays (so-called cone beam). Furthermore, the intensity of the emitted X-rays XL can be adjusted by the irradiation device 2. Adjusting the intensity of the X-rays XL emitted from the irradiation device 2 can be based on the X-ray absorption characteristics of the object Q, etc. Furthermore, the diffusion shape of the X-rays emitted from the irradiation device 2 is not limited to a conical shape; for example, it can also be fan-shaped X-rays (so-called fan beam). Additionally, it can also be linear X-rays (so-called pencil beam).

[0047] The emission section 8 of the irradiation device 2 faces the +U direction. In this embodiment, at least a portion of the X-rays XL emitted from the emission section 8 travels in the +U direction within the internal space SP.

[0048] (Platform device)

[0049] The stage device 3 includes a stage 9 capable of holding and moving the measuring object Q, and a drive system 10 for moving the stage 9.

[0050] In this embodiment, the stage 9 includes: a worktable 12 having a holding part 11 for holding the measuring object Q; a first movable member 13 for movably supporting the worktable 12; a second movable member 14 for movably supporting the first movable member 13; and a third movable member 15 for movably supporting the second movable member 14.

[0051] The worktable 12 is capable of rotating while the measuring object Q is held in place by the holding part 11. The worktable 12 is capable of moving (rotating) in the θT direction. The first movable member 13 is capable of moving in the S-axis direction. When the first movable member 13 moves in the S-axis direction, the worktable 12 moves together with the first movable member 13 in the S-axis direction. The second movable member 14 is capable of moving in the T-axis direction. When the second movable member 14 moves in the T-axis direction, the first movable member 13 and the worktable 12 move together with the second movable member 14 in the T-axis direction. The third movable member 15 is capable of moving in the U-axis direction. When the third movable member 15 moves in the U-axis direction, the second movable member 14, the first movable member 13, and the worktable 12 move together with the third movable member 15 in the U-axis direction.

[0052] In this embodiment, the drive system 10 includes: a rotary drive device 16 that rotates the worktable 12 about the T-axis on the first movable member 13; a first drive device 17 that moves the first movable member 13 in the S-axis direction on the second movable member 14; a second drive device 18 that moves the second movable member 14 in the T-axis direction; and a third drive device 19 that moves the third movable member 15 in the U-axis direction.

[0053] The second drive device 18 includes a screw shaft 20B disposed on a nut of the second movable member 14, and an actuator 20 for rotating the screw shaft 20B. The screw shaft 20B is supported by bearings 21A and 21B to be rotatable about a T-axis. In this embodiment, the screw shaft 20B is supported by bearings 21A and 21B such that the axis of the screw shaft 20B is substantially parallel to the T-axis. In this embodiment, balls are disposed between the nut of the second movable member 14 and the screw shaft 20B. That is, the second drive device 18 includes a so-called ball screw drive mechanism.

[0054] The third drive device 19 includes a screw shaft 23B disposed on a nut of the third movable member 15, and an actuator 23 for rotating the screw shaft 23B. The screw shaft 23B is supported by bearings 24A and 24B to enable rotation. In this embodiment, the screw shaft 23B is supported by bearings 24A and 24B such that the axis of the screw shaft 23B is substantially parallel to the U-axis. In this embodiment, balls are disposed between the nut of the third movable member 15 and the screw shaft 23B. That is, the third drive device 19 includes a so-called ball screw drive mechanism.

[0055] The third movable member 15 has a guide mechanism 25 that guides the second movable member 14 in the Y-axis direction. The guide mechanism 25 includes track-shaped guide members 25A and 25B extending in the T-axis direction. At least a portion of the second drive device 18, including the actuator 20 and bearings 21A and 21B supporting the screw shaft 20B, is supported by the third movable member 15. The screw shaft 20B is rotated by the actuator 20, and the second movable member 14 moves in the T-axis direction while being guided by the guide mechanism 25.

[0056] In this embodiment, the inspection system 100 has a base member 26. The base member 26 is supported by a chamber member 6. In this embodiment, the base member 26 is supported on the inner wall (inner surface) of the chamber member 6 via a support mechanism. The position of the base member 26 is fixed at a predetermined position.

[0057] The base member 26 has a guide mechanism 27 that guides the third movable member 15 in the U-axis direction. The guide mechanism 27 includes track-shaped guide members 27A and 27B extending in the U-axis direction. At least a portion of the third drive device 19, including the actuator 23 and bearings 24A and 24B supporting the screw shaft 23B, is supported by the base member 26. The screw shaft 23B is rotated by the actuator 23, and the third movable member 15 moves in the U-axis direction while being guided by the guide mechanism 27.

[0058] Additionally, although the illustration is omitted, in this embodiment, the second movable member 14 has a guide mechanism that guides the first movable member 13 in the S-axis direction. The first drive device 17 includes a ball screw mechanism capable of moving the first movable member 13 in the S-axis direction. The rotary drive device 16 includes a motor capable of moving (rotating) the worktable 12 in the θT direction.

[0059] In this embodiment, a reference object 48 is provided on the worktable 12, and the measuring object Q is provided on the reference object 48. The reference object 48 and the measuring object Q, which are held on the worktable 12, can be moved in four directions—the S-axis, T-axis, U-axis, and θT-axis—by the drive system 10.

[0060] Furthermore, the drive system 10 can also move the measuring object Q held on the worktable 12 in six directions: the S-axis, T-axis, U-axis, θS-axis, θT-axis, and θU-axis. In this embodiment, the drive system 10 is configured to include a ball screw drive mechanism, but it may also include, for example, a voice coil motor. For example, the drive system 10 may also include a linear motor or a planar motor.

[0061] In this embodiment, the stage 9 is movable within the internal space SP. The stage 9 is positioned on the +U side of the exit section 88. The stage 9 is movable within the internal space SP, further on the +U side than the exit section 8. At least a portion of the stage 9 can face the exit section 8. The stage 9 can position the held measurement object Q facing the exit section 8. The stage 9 can position the measurement object Q along the path of the X-rays XL emitted from the exit section 8. The stage 9 can be positioned within the irradiation range of the X-rays XL emitted from the exit section 8.

[0062] In this embodiment, the inspection system 100 includes a measurement system 28 for measuring the position of the stage 9. In this embodiment, the measurement system 28 includes an encoder system.

[0063] The measurement system 28 includes: a rotary encoder 29 for measuring the rotation of the worktable 12 (position with respect to the θU direction), a linear encoder 30 for measuring the position of the first movable member 13 with respect to the S-axis direction, a linear encoder 31 for measuring the position of the second movable member 14 with respect to the T-axis direction, and a linear encoder 32 for measuring the position of the third movable member 15 with respect to the U-axis direction.

[0064] In this embodiment, rotary encoder 29 measures the rotation of the worktable 12 relative to the first movable member 13. Linear encoder 30 measures the position of the first movable member 13 relative to the second movable member 14 (position about the S-axis). Linear encoder 31 measures the position of the second movable member 14 relative to the third movable member 15 (position about the T-axis). Linear encoder 32 measures the position of the third movable member 15 relative to the base member 26 (position about the U-axis).

[0065] The rotary encoder 29 includes, for example, a scale member 29A disposed on the first movable member 13, and an encoder head 29B disposed on the worktable 12 and detecting the scale of the scale member 29A. The scale member 29A is fixed to the first movable member 13. The encoder head 29B is fixed to the worktable 12. The encoder head 29B is capable of measuring the amount of rotation of the worktable 12 relative to the scale member 29A (first movable member 13).

[0066] The linear encoder 30 includes, for example, a scale member 30A disposed on the second movable member 14, and an encoder head 30B disposed on the first movable member 13 and detecting the scale of the scale member 30A. The scale member 30A is fixed to the second movable member 14. The encoder head 30B is fixed to the first movable member 13. The encoder head 30B is capable of measuring the position of the first movable member 13 relative to the scale member 30A (the second movable member 14).

[0067] The linear encoder 31 includes a scale member 31A disposed on a third movable member 15, and an encoder head 31B disposed on a second movable member 14 and detecting the scale of the scale member 31A. The scale member 31A is fixed to the third movable member 15. The encoder head 31B is fixed to the second movable member 14. The encoder head 31B is capable of measuring the position of the second movable member 14 relative to the scale member 31A (the third movable member 15).

[0068] The linear encoder 32 includes a scale member 32A disposed on a base member 26 and an encoder head 32B disposed on a third movable member 15 and detecting the scale of the scale member 32A. The scale member 32A is fixed to the base member 26. The encoder head 32B is fixed to the third movable member 15. The encoder head 32B is capable of measuring the position of the third movable member 15 relative to the scale member 32A (base member 26).

[0069] (Filming device)

[0070] The imaging device 4 acquires a portion of the radiation irradiated onto the object Q (laminated structure A) by the irradiation device 2 and outputs its data. In this embodiment, the imaging device 4 acquires transmitted X-rays that pass through the object Q. As described later, the imaging device 4 is capable of acquiring multiple transmitted X-rays that irradiate the object Q at different angles by the irradiation device 2. By using multiple transmitted X-rays and performing reconstruction processing, data showing the internal structure of the object Q (laminated structure A) can be acquired.

[0071] The imaging device 4 is positioned within the internal space SP further along the +U direction than the illumination device 2 and the stage 9. The imaging device 4 is fixed in a predetermined position. Alternatively, the imaging device 4 can be movable. The stage 9 can move within the space between the illumination device 2 and the imaging device 4 within the internal space SP.

[0072] The imaging device 4 includes: a scintillator 34 having an incident surface 33 for X-rays XL from the irradiation device 2, including transmitted X-rays that pass through the object to be measured S, to be incident upon; and a light-receiving part 35 for receiving light generated in the scintillator 34. The incident surface 33 of the imaging device 4 can face the object to be measured S held by the stage 9.

[0073] The scintillator section 34 contains a scintillating material that generates light with a wavelength different from the X-rays when irradiated. The light-receiving section 35 contains a photomultiplier tube. The photomultiplier tube includes a phototube that converts light energy into electrical energy through the photoelectric effect. The light-receiving section 35 amplifies the light generated in the scintillator section 34, converts it into an electrical signal, and outputs it. The output electrical signal corresponds to data showing the internal structure of the laminate Q (laminate A) being measured.

[0074] A moving mechanism (not shown) supports the imaging device 4 for mobility. The moving mechanism 46 includes a drive mechanism that moves the imaging device 4 at least in the U-axis direction (the direction of movement relative to the illumination device 2 and the stage 9). The moving mechanism 46 may also be configured, similar to the stage 9, to move the imaging device 4 in the S-axis, T-axis, U-axis, and θT directions. It may also be configured, similar to the stage 9, to move the imaging device 4 in multiple axial directions. For example, a mechanism that moves the device in both the S-axis and T-axis directions may also be used.

[0075] The structure of the inspection system 100 of this embodiment has been described above, but the structure of the inspection system 100 is not limited to the above description and can be any structure. The inspection system 100 can be any structure having an irradiation device 2, an imaging device 4 and a control system 5.

[0076] (Control system)

[0077] Based on the data showing the internal structure of the laminate A output by the imaging device 4, the control system 5 outputs information about the local deformation of a layer (the first layer) of the laminate A. Here, local deformation does not refer to large-scale deformation of the entire layer, but rather to large-scale deformation of only a portion of the layer. In other words, the information about local deformation can also be expressed as information about the deformation of a portion of a layer in the laminate A.

[0078] Figure 2 This is a schematic block diagram of the inspection device according to this embodiment. Figure 2 As shown, the inspection system 100 includes an irradiation device 2, an imaging device 4, and a control system 5. The control system 5 is a computer, such as... Figure 2 As shown, the system includes an input device 101, a display device 102, a communication device 104, a storage device 106, and a control device 108. Furthermore, the control system 5 can be a single unit, integrated with other units, or configured as a system combining various devices such as a computing unit and a data server; there are no particular limitations.

[0079] Input device 101 is a mechanism for receiving user input. Examples of input devices 101 include a mouse, keyboard, and touchscreen. Display device 102 is a display for showing images. Communication device 104 is a module for communicating with control device 108 and external devices, and may include, for example, an antenna. In this embodiment, the communication method based on communication device 104 is wireless communication, but the communication method can be any method. Storage device 106 is a memory that stores various information such as data output from imaging device 4 showing the internal structure of the laminate A, or the calculation content and program of control device 108. For example, it includes at least one of main storage devices such as random access memory (RAM) and read-only memory (ROM), and external storage devices such as hard disk drive (HDD). The program used by control device 108 stored in storage device 106 can be stored in a recording medium readable by control system 5.

[0080] The control device 108 is a computing device, including, for example, a computing circuit such as a central processing unit (CPU). The control device 108 includes an X-ray control unit 110, a reconstruction calculation unit 111, an acquisition unit 112, a calculation unit 114, a baseline calculation unit 116, a judgment unit 118, and an output control unit 120. The control device 108 implements the X-ray control unit 110, the reconstruction calculation unit 111, the acquisition unit 112, the calculation unit 114, the baseline calculation unit 116, the judgment unit 118, and the output control unit 120 by reading and executing a program (software) from the storage device 106, and performs their processing. Alternatively, the control device 108 may execute processing using a single CPU, or it may include multiple CPUs and execute processing through these multiple CPUs. Furthermore, at least a portion of the X-ray control unit 110, the reconstruction calculation unit 111, the acquisition unit 112, the calculation unit 114, the baseline calculation unit 116, the judgment unit 118, and the output control unit 120 may be implemented using hardware circuitry.

[0081] The specific processing details of the control device 108 will be described later.

[0082] (Layered structure)

[0083] Figures 3 to 5This is a schematic diagram of a laminated structure. The laminate A, the object of inspection, is a laminated structure consisting of multiple layers B. Laminated structure A is formed by stacking multiple layers B. In this embodiment, laminate A is a lithium-ion battery. This embodiment uses a lithium-ion battery as an example, but is not limited to this. Other batteries, such as sodium batteries, can also be used. Furthermore, the laminated structure is not limited to batteries; laminate A can also be any object consisting of multiple layers B. Such an object can be, for example, a structure consisting of stacked flat "cells" like a fuel cell stack, or a stacked packaging material. Figure 3 As shown, the laminate A, which is a lithium-ion battery, has a frame C and multiple layers B disposed within the frame C. When the laminate A is a lithium-ion battery, the components constituting layer B include at least one of electrodes or inter-electrode components. In this embodiment, layer B1, which serves as the positive electrode, and layer B2, which serves as the negative electrode, are alternately laminated. Furthermore, layer B3, which serves as an electrolyte layer, is disposed between layer B1 and layer B2. That is, in this embodiment, layers B1 and B2 are electrodes, and layer B3 is an inter-electrode component (in this example, an electrolyte layer). Moreover, in this embodiment, the layers are laminated in the order of layer B1, layer B3, layer B2, layer B3, layer B1, ... In this embodiment, layer B1, which serves as the positive electrode, and layer B2, which serves as the negative electrode, are stacked alternately. However, this is not the only possibility. For example, the stacked structure could be one in which layer B1 serves as the positive electrode, the electrode components, and layer B1 serves as the positive electrode, without using layer B2, which serves as the negative electrode, but only using layer B1, which serves as the positive electrode.

[0084] exist Figure 3 and Figure 4 In the example, the stack A, serving as a lithium-ion battery, is cylindrical, with cylindrical layers B stacked on top. In this embodiment, the stack A includes a diaphragm, which is stacked. Each layer B is stacked such that the inner peripheral surface of the next layer B faces the outer peripheral surface of the cylindrical layer B. However, the stack A is not limited to having cylindrical layers B; the shape of each layer B can be arbitrary. For example, as... Figure 5 As shown, a flat layer B can also be stacked.

[0085] From now on, the direction of each layer B stacked in the laminate A is defined as the stacking direction Y. In the specified layer B constituting the laminate A, the direction perpendicular to the vertical direction relative to one of the surfaces (e.g., the surface) of layer B is defined as the stacking direction Y. In the specified XY cross-section formed by the stacking direction Y and the vertical direction X, the direction along the layer surface is defined as the layer direction X. The layer direction X can be the direction along the layer surface or the direction along the midpoint between the layer surface and the back surface. The layer direction X can also be described as the direction along the layer in the specified cross-section of the in-plane direction of layer B. The specified cross-section refers to a two-dimensional cross-section of the laminate A, defined to generate information about the local deformation of layer B, for the purpose of creating a three-dimensional image. The specified cross-section will be described later. For example, in the case where the laminate A is cylindrical, such as... Figure 4 As shown, each layer B is stacked in the radial direction, i.e., from the center of the circle towards the circumference. Therefore, the direction from the central axis of the stacked body A towards the outer edge of the radial direction is called the stacking direction Y. Furthermore, as... Figure 4 As shown, when the plane along the stacking direction Y is defined as a predetermined cross-section, the in-plane direction along the predetermined cross-section (the direction along the cross-section and orthogonal to the stacking direction Y) becomes the layer direction X. Furthermore, for example, in the case of a flat layer B being stacked, such as... Figure 5 As shown, the direction of the stacked flat layer B is called the stacking direction Y. Furthermore, as... Figure 5 As shown, when the plane along the stacking direction Y is set as a specified cross section, the in-plane direction along the specified cross section (the direction along the cross section and orthogonal to the stacking direction Y) is called the layer direction X.

[0086] (Processing based on the control system)

[0087] The following section describes the processing of information on the local deformation of layer B of laminate A, based on control system 5.

[0088] (Detection of image data)

[0089] The X-ray control unit 110 of the control system 5 controls the irradiation device 2 to irradiate radiation (X-ray XL) from the irradiation device 2 toward the laminate A (the object to be measured Q).

[0090] Furthermore, the X-ray control unit 110 controls the imaging device 4 to receive a portion of the radiation irradiated from the irradiation device 2 onto the laminate A (in this example, transmitted X-rays passing through the laminate A), and acquires a transmitted X-ray image passing through the laminate A. Then, the stage 9 is rotated to acquire multiple transmitted X-ray images with different angles of the radiation irradiated from the irradiation device 2 onto the laminate A. The reconstruction calculation unit 111 performs calculations based on the multiple X-ray transmitted images obtained by irradiating the laminate A with radiation while rotating it, to acquire three-dimensional data (three-dimensional image) of the internal structure of the laminate A. Thus, the internal structure of the laminate A is calculated. Examples of reconstruction methods for the laminate A include back projection, filtered back projection, and successive approximation. Back projection and filtered back projection are described, for example, in U.S. Patent Application Publication No. 2002 / 0154728. Furthermore, the successive approximation method is described, for example, in the specification of U.S. Patent Application Publication No. 2010 / 0220908.

[0091] The reconstruction calculation unit 111 outputs three-dimensional data of the internal structure of the laminate A. In this embodiment, the data showing the internal structure of the laminate A is data showing the grayscale values ​​(brightness values) at each position in the three-dimensional coordinates of the laminate A, or image data showing the internal structure of the laminate A. Hereafter, the data showing the internal structure of the laminate A is appropriately recorded as image data of the laminate A. Furthermore, the data showing the internal structure of the laminate A is not limited to a reconstructed image created based on calculations of multiple X-ray transmission images. If the internal structure of the laminate A can be clearly defined through a single X-ray transmission image, then a single X-ray transmission image may also be used. The method for obtaining the internal structure of the laminate A is not limited to radiation; for example, ultrasound, such as terahertz, may also be used.

[0092] (Image data acquisition)

[0093] The acquisition unit 112 acquires the image data of the stack A (data showing the internal structure of the stack A) output by the reconstruction calculation unit 111. The method by which the acquisition unit 112 acquires the image data of the stack A can be any method. For example, the image data of the stack A output by the reconstruction calculation unit 111 can be stored in the storage device 106, and the acquisition unit 112 reads the image data of the stack A from the storage device 106.

[0094] The output control unit 120 outputs information about the local deformation of layer B based on the image data of the laminate A acquired by the acquisition unit 112. The output control unit 120 can output information about the local deformation of layer B by any method based on the image data acquired by the acquisition unit 112, but an example in this embodiment will be described later.

[0095] (Calculation of the layer's location)

[0096] The calculation unit 114 calculates the position information of layer B of the laminate A based on the image data of the laminate A, and the output control unit 120 outputs information about the local deformation of layer B based on the position information of layer B of the laminate A. The calculation unit 114 uses the image data of the laminate A to calculate the position information of layer B in a predetermined cross-section of the laminate A. The position information of layer B refers to information showing the position of layer B in the coordinate system of the laminate A. Furthermore, the predetermined cross-section, as described above, refers to a two-dimensional cross-section of the three-dimensional image of the laminate A set for generating information about the local deformation of layer B. The calculation unit 114 can arbitrarily set the predetermined cross-section, but it is preferable to set the surface that intersects the in-plane direction of layer B as the predetermined cross-section.

[0097] The calculation unit 114 calculates the position of layer B in the specified cross-section along the stacking direction Y as the position information of layer B. The position of layer B in the stacking direction Y can be the position of any part of layer B in the stacking direction Y, such as the position of the surface of layer B in the stacking direction Y, or the position of the internal part of layer B in the stacking direction Y.

[0098] In this embodiment, it is preferable that the calculation unit 114 calculates the position of each part of layer B along the layer direction X in the stacking direction Y as the position information of layer B. Alternatively, the calculation unit 114 may calculate the position information of layer B (the position of each part along the layer direction X in the stacking direction Y) for one layer B of the laminate A, but in this embodiment, the position information of layer B is calculated for multiple layers B of the laminate A.

[0099] The method for calculating the position information of layer B based on image data can be any method, but in this embodiment, the calculation unit 114 calculates the position information of layer B based on the grayscale value of each position shown in the image data of the stack A. This will be explained in detail below.

[0100] Here, if a line along the stacking direction Y on a specified cross-section is designated as line SC, the calculation unit 114 extracts the grayscale values ​​at each position on line SC from the image data of the stack A. The calculation unit 114 shifts the position of line SC in the stacking direction X and repeatedly extracts the grayscale values ​​at each position on line SC. Thus, the grayscale values ​​at each position on each line SC at different positions in the stacking direction X are extracted. Figure 4 , Figure 5 In the example, lines SCa, SCb, SCc, and SCd are shown as lines SC at different positions in the layer direction X. The calculation unit 114 extracts the grayscale values ​​at each position on lines SCa to SCd from the image data of the stack A. However, Figure 4 , Figure 5For example, the distance between lines SC in the layer direction X can be any distance. In addition, the number of lines SC that are the objects of grayscale value extraction can also be any number.

[0101] Figure 6 This is a chart showing an example of the grayscale values ​​at various locations on the line. Figure 6 The grayscale values ​​at various locations on lines SCa to SCd are shown. Figure 6 The horizontal axis of each chart indicates the position in the stacking direction Y (the position of each point on line SC), and the vertical axis indicates the grayscale value at that position extracted from the image data. For example, Figure 6 grayscale value group L0a ( Figure 6 The line at the top of the chart shows the grayscale values ​​at various locations on line SCa. Figure 6 The grayscale value group L0b shows the grayscale values ​​at various locations on line SCb. Figure 6 The grayscale value group L0c shows the grayscale values ​​at various locations on line SCc. Figure 6 The grayscale value group L0d shows the grayscale values ​​at various locations on line SCd. Hereinafter, the grayscale values ​​at various locations on line SC will be appropriately recorded as the grayscale value group L0.

[0102] The calculation unit 114 calculates the position information of layer B (the position of layer B in the stacking direction Y) based on the grayscale values ​​(each grayscale value group L0) at each position on each line SC. That is, since the grayscale values ​​of the image data will change depending on the position of layer B or the presence or absence of layer B, the calculation unit 114 uses this to calculate the position of layer B in the stacking direction Y based on the grayscale values ​​(each grayscale value group L0 at a different position in the layering direction X) at each position on each line SC.

[0103] Here, the grayscale value group L0 exhibits a waveform where the grayscale values ​​increase and decrease periodically as the layering direction Y advances. In other words, it is a waveform formed by multiple unit waveforms W with the same tendency to increase and decrease grayscale values, arranged in the layering direction Y. The grayscale values ​​of each unit waveform W are sometimes not completely consistent, but their increasing and decreasing tendencies are the same. Figure 6 In the example, the unit waveforms W contained in the grayscale value group L0 exhibit the following waveforms: as the grayscale value moves towards the stacking direction Y, it increases to become the first maximum, then decreases to become the minimum, then increases again to become the second maximum (lower than the first maximum), then decreases again to become the minimum. In this example, for instance, the position where the grayscale value reaches the first maximum corresponds to the center position of layer B1 (or layer B2) in the stacking direction Y, the position where the grayscale value reaches the second maximum corresponds to the center position of layer B2 (or layer B1) in the stacking direction Y, and the position where the grayscale value reaches the minimum corresponds to the center position of layer B3 in the stacking direction Y.

[0104] Figure 7 This is a diagram illustrating an example of layer position. In this embodiment, the calculation unit 114 calculates the unit waveforms W (in the same interval) of each grayscale value group L0. Figure 6 In the example, the position of the stacking direction Y within the unit waveform W1 that satisfies the specified conditions (in) Figure 6 In the example, the position Pa of the stacking direction Y that becomes the first maximum is the same as layer B (in Figure 7 In the example, the position of layer B1a) in the stacking direction Y is calculated, and the position information of layer B (the position of each part along the stacking direction X in the stacking direction Y) is calculated. The calculation unit 114 repeats this process for each unit waveform W to calculate the position information of each layer B. Here, unit waveforms W within the same interval refer to unit waveforms W located in the same interval in the stacking direction Y. For example, when counting the number of unit waveforms W in the stacking direction Y, it can refer to unit waveforms W counted in the same order. In addition, the grayscale value that meets the specified conditions can be arbitrarily set, for example, it can refer to the maximum value, minimum value, or center value of the grayscale value in the unit waveform W. Figure 7 In the example shown, the grayscale value at the center of layer B1, which becomes the first maximum value, is set to a grayscale value that meets the specified conditions.

[0105] That is, for example in Figure 6 and Figure 7 In the example, the positions Pa1 to Pa4 in the stacking direction Y where the grayscale values ​​of the unit waveform W1 (the first unit waveform W) of grayscale value groups L0a to L0d reach their first maximum are set as the position information of layer B1a. That is, for example, position Pa1 is set as the position of layer B1a in the stacking direction Y at the location where grayscale value group L0a (line SCa) is extracted in the layer direction X. Similarly, the positions Pb1 to Pb4 in the stacking direction Y where the grayscale values ​​of the unit waveform W2 (the second unit waveform W) of grayscale value groups L0a to L0d reach their first maximum are set as the position information of layer B1b, which is located further in the stacking direction Y than layer B1a. Similarly, the positions Pc1 to Pc4 in the stacking direction Y where the grayscale value of the unit waveform W3 (the third unit waveform W) of grayscale value groups L0a to L0d becomes the first maximum are set to the position information of layer B1c, which is located further along the stacking direction Y than layer B1b. Likewise, the positions Pd1 to Pd4 in the stacking direction Y where the grayscale value of the unit waveform W4 (the fourth unit waveform W) of grayscale value groups L0a to L0d becomes the first maximum are set to the position information of layer B1d, which is located further along the stacking direction Y than layer B1c.

[0106] In addition, Figure 6 and Figure 7In the example, the grayscale value that will become the first maximum is set as a grayscale value that satisfies the specified conditions, but as mentioned above, the grayscale value that satisfies the specified conditions is not limited to this. For example, the grayscale value that will become the second maximum may also be set as a grayscale value that satisfies the specified conditions. In this case, for example, the position information of each layer B2 is calculated. In addition, for example, the minimum value corresponding to the position of layer B3 may also be set as a grayscale value that satisfies the specified conditions. In this case, for example, the position information of each layer B3 is calculated. However, the position of layer B3 in the stacking direction Y can be converted into the position of layer B1 or layer B2 in the stacking direction Y. Therefore, when the minimum value corresponding to the position of B3 is set as a grayscale value that satisfies the specified conditions, the position information of layer B1 or layer B2 can be calculated based on the calculated position information of layer B3. That is, in this case, it can also be said that the image data of layer B3 (third layer) adjacent to layer B1 or layer B2 (first layer) is regarded as the image data of layer B1 or layer B2 (first layer).

[0107] (Calculation of the detection line)

[0108] Figure 8 This is a schematic diagram illustrating an example of a detection line and a reference line. In this embodiment, the calculation unit 114 calculates a detection line L indicating the position of layer B, and the output control unit 120 outputs information about the local deformation of layer B based on the detection line L. The detection line L is a line indicating the position information of layer B (the position of layer B at each position in the layer direction X in the stacking direction Y). That is, the detection line L is a line extending in the layer direction X, and the position of each point in the layer direction X in the direction intersecting the layer direction X indicates the position of layer B at each position in the layer direction X in the stacking direction Y.

[0109] The calculation unit 114 calculates the detection line L based on the position information of layer B. The calculation unit 114 can calculate the detection line L by any method. For example, the calculation unit 114 can use the line connecting the various parts along the layer direction X of layer B as the detection line L in the stacking direction Y, or it can calculate the detection line L by approximating these positions with curves. The curve approximation method can be any method, for example, the least squares method can be used to calculate the detection line L. Figure 8 Examples of detection lines La to Ld are shown, indicating the positions of various parts of layers B1a to B1d along the layer direction X in the stacking direction Y. Detection line La is calculated based on grayscale value group L0a, detection line Lb is calculated based on grayscale value group L0b, detection line Lc is calculated based on grayscale value group L0c, and detection line Ld is calculated based on grayscale value group L0d.

[0110] (Obtaining the baseline)

[0111] In this embodiment, the baseline calculation unit 116 acquires a baseline M indicating the reference position of layer B, and the output control unit 120 outputs information about the local deformation of layer B based on a comparison between the detection line L and the baseline M. The baseline M is a line indicating the reference position of layer B in the stacking direction Y at each position in the layer direction X. That is, the baseline M is a line extending in the layer direction X, and the position of each point in the layer direction X in the direction intersecting the layer direction X indicates the reference position of layer B in the stacking direction Y at each position in the layer direction X. The reference position of layer B in the stacking direction Y refers to the estimated position of layer B in the stacking direction Y when no local deformation has occurred.

[0112] The baseline calculation unit 116 can obtain a common baseline M for multiple layers B, but in this embodiment, the baseline M is obtained for each layer B.

[0113] The baseline calculation unit 116 can obtain the baseline M by any method. For example, the baseline calculation unit 116 can obtain the baseline M based on design information. That is, for example, if the baseline M is preset as design information, the baseline calculation unit 116 can obtain the baseline M that is preset as design information. Furthermore, for example, if the reference position of layer B is preset as design information, the baseline calculation unit 116 can calculate the baseline M based on the reference position of layer B. In this case, the baseline calculation unit 116 can use the line connecting the reference positions at each position in the layer direction X as the baseline M, or it can calculate the baseline M by approximating the reference positions at each position in the layer direction X with a curve. The curve approximation method can be any method; for example, the least squares method can be used to calculate the baseline M.

[0114] Without setting design information, the baseline calculation unit 116 can calculate the baseline M based on the detection line L. However, even when design information is set, the baseline calculation unit 116 can still calculate the baseline M based on the detection line L. The method for calculating the baseline M based on the detection line L can be arbitrary, but the baseline calculation unit 116 can also calculate the baseline M by approximating the detection line L with a curve. The method of curve approximation can be arbitrary, for example, the least squares method can be used to calculate the baseline M. The approximate curve is fitted by a smooth function. The smooth function is, for example, a power series (e.g., 9th power). In addition, for example, the baseline calculation unit 116 can use a specified function (e.g., a power series) to fit the detection line L to calculate the baseline M. In this case, for example, the baseline calculation unit 116 can use a 9th power series as the specified function, use the least squares method as the fitting method, and calculate the baseline M using equation (1).

[0115] [Number 1]

[0116] Here, y on the left side of equation (1) i (x) refers to the position (reference position) in the stacking direction Y at position x in the layer direction X of the i-th reference line M. Furthermore, in equation (1), a on the right-hand side... in x is obtained for the i-th baseline M n coefficient, x n It is x raised to the power of n.

[0117] The baseline calculation unit 116 can calculate the baseline M using the entire range of the detection line L. In this case, for example, the baseline calculation unit 116 calculates the baseline M by performing a curve approximation on the entire range of the detection line L in the layer direction X.

[0118] The baseline calculation unit 116 may also calculate the baseline M using only a portion of the detection line L. In this case, for example, the baseline calculation unit 116 may calculate the baseline M by approximating the detection line L with a curve over a portion of the detection line L in the layer direction X. The method of selecting a portion of the detection line L from the entire range can be arbitrary; the baseline calculation unit 116 may select a portion of the detection line L located at any position as the interval for calculating the baseline M. For example, in this embodiment, it is preferable that the baseline calculation unit 116 selects an interval from the entire range of the detection line L where the position change in the stacking direction Y is within a predetermined range as the interval for calculating the baseline M. The position change in the stacking direction Y refers to the position change in the stacking direction Y when advancing a unit length along the baseline M in the layer direction X. An interval with a large position change in the stacking direction Y can be considered an interval where the position changes abruptly in the stacking direction Y. That is, in this embodiment, an interval where the position does not change abruptly in the stacking direction Y is selected as the interval for calculating the baseline M. For example, Figure 8 The positional variation of the detection line La in the layer direction X, from position X1 to position X2, is relatively large in the layer direction Y. Therefore, within the detection line La, the interval outside the position X1 to position X2 interval is selected as the interval for calculating the baseline M. Alternatively, if there is no interval where the positional variation in the layer direction Y is within the specified range, the baseline M can be calculated using the detection line L of another layer B.

[0119] Furthermore, it is possible to arbitrarily choose whether to use the entire interval of the detection line L or a portion thereof. For example, if the baseline calculation unit 116 cannot calculate the baseline M using the entire interval of the detection line L (e.g., if the curve approximation calculation does not converge), it may choose to use a portion of the interval. Alternatively, for example, the baseline calculation unit 116 may calculate a baseline M as a candidate baseline using the entire interval of the detection line L, and if the candidate baseline M deviates from the detection line L by a predetermined distance, it is deemed an unsuitable baseline M and a portion of the interval is selected for use.

[0120] Figure 8 Examples of baselines Ma and Md for layers B1a to B1d are shown.

[0121] (Judgment of local deformation)

[0122] The determination unit 118 generates information about the local deformation of layer B based on the position information of layer B calculated by the calculation unit 114, and the output control unit 120 outputs the information about the local deformation of layer B generated by the determination unit 118. That is, the determination unit 118 determines whether local deformation has occurred in layer B based on the position information of layer B. If local deformation is determined to have occurred, the determination unit 118 generates information about the local deformation of layer B in a manner that includes information indicating that local deformation has occurred. On the other hand, if the determination unit 118 determines that no local deformation has occurred, the determination unit 118 generates information about the local deformation of layer B in a manner that includes information indicating that no local deformation has occurred.

[0123] The method for determining whether local deformation has occurred based on the location information of layer B (the method for generating information about local deformation) can be any method. The following describes an example in this embodiment.

[0124] Figure 9 This is a diagram illustrating an example of the difference between the detection line and the reference line. In this embodiment, the determination unit 118 determines whether local deformation has occurred in layer B based on the detection line L of layer B and the reference line M of layer B. The determination method based on the detection line L and the reference line M can be any method, but in this embodiment, the determination unit 118 determines whether local deformation has occurred in layer B based on the difference between the detection line L and the reference line M (the difference between the detection line L and the reference line M in the stacking direction Y). In this case, the determination unit 118 determines that local deformation has occurred if the difference between the detection line L and the reference line M meets a predetermined condition, and determines that no local deformation has occurred if the difference does not meet the predetermined condition.

[0125] More specifically, the determination unit 118 calculates the difference between the detection line L and the reference line M in the stacking direction Y for each position in the layer direction X. That is, the determination unit 118 calculates the difference between the Y-direction position of the detection line L at the same position in the layer direction X and the Y-direction position of the reference line M, and repeats this process for each position in the layer direction X, thereby calculating the difference between the detection line L and the reference line M in the stacking direction Y at each position in the layer direction X. Thereafter, the difference between the detection line L and the reference line M in the stacking direction Y is appropriately recorded as a difference value, and the difference value at each position in the layer direction X is appropriately recorded as a difference group N. Figure 9 The difference group Na shows an example of the difference group N between the detection line La and the baseline Ma of layer B1a.

[0126] The determination unit 118 can determine local deformation using any method based on the difference group N (the difference value at each position in the layer direction X). For example, the determination unit 118 can compare the difference value with a predetermined threshold at each position in the layer direction X and determine whether the difference value is less than the threshold at each position in the layer direction X. In this case, if the difference value at all positions in the layer direction X is less than the threshold, the determination unit 118 considers that the difference between the detection line L and the reference line M does not meet the predetermined condition, and thus determines that the layer B has not undergone local deformation. On the other hand, if the difference value at some positions in the layer direction X is above the threshold, the determination unit 118 considers that the difference between the detection line L and the reference line M meets the predetermined condition, and thus determines that the layer B has undergone local deformation. Preferably, if the difference value at all positions in the layer direction X is above the threshold, the determination unit 118 considers that the setting of the reference line M is inappropriate and recalculates the reference line M, and re-determines the local deformation. However, if the difference value at all positions in the layer direction X is above the threshold, the determination unit 118 can also determine that the layer B has undergone local deformation.

[0127] Furthermore, even if the difference value at some locations is above a threshold, the determination of whether local deformation has occurred can be retained if the ratio of the difference value to the threshold is less than a predetermined value. For example, if the ratio of the difference value to the threshold is less than a predetermined value, the output control unit 120 can output information for the user to determine whether local deformation has occurred. More specifically, in this case, the output control unit 120 can cause the display device 102 to display information showing locations where the difference value is above the threshold, and information showing the difference value at said location. For example, the output control unit 120 can display an image obtained by cutting a three-dimensional image of the stack A with a predetermined cross-section, and an image showing locations where the difference value is above the threshold in said image (e.g., an image highlighting said location) as information showing locations where the difference value is above the threshold. In addition, the output control unit 120 can display the difference value, or it can display the ratio of the difference value to the threshold as information showing the difference value at said location. Furthermore, for example, a score can be assigned to the ratio of the difference value to the threshold, with a higher ratio resulting in a lower score, and said score can be displayed. The user visually confirms the image to determine whether layer B has undergone local deformation, and inputs the determination result to the input device 101. The determination unit 118 determines whether layer B has undergone local deformation based on the user's determination result input to the input device 101. That is, the determination unit 118 determines that layer B has undergone local deformation if the user's determination result indicates that local deformation has occurred, and determines that layer B has not undergone local deformation if the user's determination result indicates that no local deformation has occurred. In addition, if the ratio of the difference value to the threshold is above a predetermined value, the determination unit 118 may determine that layer B has undergone local deformation.

[0128] In the above example, the determination unit 118 compares the difference value with a threshold for each position in the layer direction X. Therefore, since it is possible to determine whether deformation has occurred at each position in the layer direction X of layer B, it is also possible to appropriately detect locations in layer B where local deformation has occurred.

[0129] However, the determination unit 118 is not limited to comparing the difference value with a threshold for each position in the layer direction X. For example, the determination unit 118 may also calculate the difference between the maximum value (the maximum difference value) and the minimum value (the minimum difference value) at each position in the layer direction X (hereinafter referred to as the displacement value). In this case, the determination unit 118 determines that layer B has not undergone local deformation if the displacement value is above a predetermined threshold, and determines that layer B has undergone local deformation if the displacement value is above the threshold. In this case, even if the displacement value is above the threshold, the determination unit 118 may retain the determination of whether local deformation has occurred if the ratio of the displacement value to the threshold is less than a predetermined value. If the ratio of the displacement value to the threshold is less than a predetermined value, the output control unit 120 may output information for the user to determine whether local deformation has occurred. The information output method in this case, and the determination method performed by the determination unit 118 based on the user's determination result, are the same as those in the case where the ratio of the difference value to the threshold is less than a predetermined value, so the description is omitted. In addition, in this case, if the ratio of the displacement value to the threshold is above a predetermined value, the determination unit 118 may also determine that the layer B has undergone local deformation.

[0130] Furthermore, for example, the determination unit 118 can calculate the average value of the difference value at each position in the layer direction X. In this case, the determination unit 118 determines that layer B has not undergone local deformation if the average value is above a predetermined threshold, and determines that layer B has undergone local deformation if the average value is above the threshold. In this case, even if the average value is above the threshold, the determination unit 118 may retain the determination of whether local deformation has occurred if the ratio of the average value to the threshold is less than a predetermined value. If the ratio of the average value to the threshold is less than the predetermined value, the output control unit 120 may output information for the user to determine whether local deformation has occurred. The information output method in this case, and the determination method performed by the determination unit 118 based on the user's determination result, are the same as in the case where the ratio of the difference value to the threshold is less than the predetermined value, so the description is omitted. In addition, in this case, if the ratio of the average value to the threshold is above the predetermined value, the determination unit 118 may also determine that layer B has undergone local deformation.

[0131] In this case, where displacement values ​​or average values ​​are used to determine local deformation, it is not necessary to determine whether each location is above a threshold. Therefore, it is possible to determine whether local deformation has occurred in layer B while reducing the computational load.

[0132] The judgment unit 118 performs the above processing on each layer B to determine whether local deformation has occurred in each layer B. Figure 10 This is a chart showing an example of local variations in a layer. Figure 10 The horizontal axis indicates the number of each layer B contained in the laminate A (layers B arranged in stacking order), and the vertical axis indicates the amount of local deformation of said layer B. For example, when determining local deformation at each location in the layer direction X, Figure 10 The local deformation along the vertical axis can be represented by the difference value at the location where local deformation is determined. Furthermore, for example, in cases where local deformation is determined based on displacement values, Figure 10 The local deformation along the vertical axis can be expressed as a displacement value. When judging local deformation based on the average value, Figure 10 The local deformation of the vertical axis can be the average value. Figure 10 The local deformation of each layer B in laminates A1 and A2 is shown. Laminates A1 and A2 are different laminates. For example, they may be of the same type but have different production dates. Figure 10 In the example shown, a portion of layer B of the laminate A1 exhibits a high degree of local deformation, indicating that local deformation has occurred in this portion of layer B.

[0133] (Poor judgment of laminated structures)

[0134] Furthermore, the determination unit 118 can generate defect information about the laminate A having the layers B based on the difference values ​​of each layer B, and the output control unit 120 can output the defect information about the laminate A. The defect information about the laminate A refers to information indicating whether the laminate A is defective. That is, in this case, the determination unit 118 determines whether the laminate A having these layers B is defective based on the difference values ​​of each layer B. The determination method in this case can be any method. For example, the determination unit 118 can determine that the laminate A is defective if the number of layers B that are determined to have undergone local deformation is a predetermined number or more, and determine that it is not defective if the number is less than a predetermined number. Furthermore, for example, the determination unit 118 can calculate the average value of the displacement values ​​of each layer B (the difference between the maximum and minimum difference values ​​at each position), and determine that the laminate A is defective if the average value is a predetermined value or more, and determine that it is not defective if the average value is less than a predetermined value. Furthermore, for example, the judgment unit 118 can calculate the average value of each layer B (the average value of the difference value at each position), and if the average value is above a predetermined value, it can determine that the laminate A is defective, and if it is below the predetermined value, it can determine that it is not defective.

[0135] By judging defects in laminate A in this way, defects caused by local deformation can be detected in a non-destructive manner.

[0136] (Information output)

[0137] The output control unit 120 outputs information about the local deformation of layer B generated by the judgment unit 118. That is, the output control unit 120 outputs the judgment result obtained by the judgment unit 118. The method by which the output control unit 120 outputs information about the local deformation of layer B can be any method; the display device 102 can display the information, or the information can be sent to other devices.

[0138] In addition to outputting the judgment result obtained by the judgment unit 118 (information on whether layer B has undergone local deformation), the output control unit 120 can also output information showing which layer B has undergone local deformation as information about the local deformation of layer B. That is, the output control unit 120 can output information showing which layer B contained in the laminate A has undergone local deformation. Furthermore, if the judgment unit 118 detects the location of the local deformation of layer B, the output control unit 120 can also output information showing the location of the local deformation of layer B. For example, the output control unit 120 can cause the display device 102 to display an image obtained by cutting a three-dimensional image of the laminate A with a predetermined cross-section, and an image showing the location of the local deformation of layer B in the image (e.g., an image highlighting the location).

[0139] (Effect)

[0140] As described above, the control system 5 of this embodiment analyzes whether layer B of the laminate A has undergone local deformation based on image data of the laminate A obtained by irradiation (data showing the internal structure of the laminate A), and outputs data regarding the local deformation. Therefore, according to this embodiment, data regarding the local deformation of layer B can be obtained non-destructively, thereby enabling the appropriate detection of local deformation of layer B. In particular, even if a lithium-ion battery is judged to be defect-free during electrical inspection, it sometimes deteriorates after reuse and cannot be used properly. Through in-depth research, the inventors have discovered that this phenomenon is caused by the precipitation of Li from the lithium-ion battery, resulting in local deformation of the lithium-ion battery. In response, according to this embodiment, by detecting local deformation based on the image data of the laminate A obtained by irradiation using the method described above, the situation of being unable to be used properly can be appropriately suppressed.

[0141] (Processing flow)

[0142] The processing flow of the control system 5 described above will be explained. Figures 11 to 13 This is a flowchart illustrating the processing flow of the control device.

[0143] like Figure 11As shown, the control system 5 (control device 108) controls the acquisition unit 112 to acquire image data of the laminate A (data showing the internal structure of the laminate A) (step S10). The control system 5 (control device 108) controls the calculation unit 114 to calculate the detection line L of layer B of the laminate A based on the image data of the laminate A (step S12). Furthermore, the control system 5 (control device 108) causes the reference line calculation unit 116 to acquire (generate) the reference line M of layer B (step S14). Then, the control system 5 (control device 108) controls the determination unit 118 to determine whether the difference between the detection line L and the reference line M meets a predetermined condition (step S16). If the determination unit 118 determines that the difference between the detection line L and the reference line M meets the predetermined condition (step S16; Yes), the determination unit 118 determines that the layer B has undergone local deformation (step S18), and the output control unit 120 outputs information indicating that the layer B has undergone local deformation as information about local deformation. On the other hand, if the determination unit 118 determines that the difference between the detection line L and the reference line M does not meet the specified conditions (step S16; No), the determination unit 118 determines that the layer B has not undergone local deformation (step S20), and the output control unit 120 outputs information indicating that the layer B has not undergone local deformation as information about local deformation. After executing step S18 or step S20, the control system 5 (control device 108) proceeds to step S22 to determine whether to end the process. If the control system 5 (control device 108) determines that the process should be ended (step S22; Yes), the process ends; otherwise, if the process should not be ended (step S22; No), it returns to step S12 and repeats the same process for other layers B.

[0144] use Figure 12 illustrate Figure 11 The detailed processing flow of the method for obtaining the baseline M in step S14 is as follows. Figure 12As shown, when design information for baseline M exists (step S14A; Yes), the baseline calculation unit 116 of the control system 5 (control device 108) calculates baseline M based on the design information (step S14B). On the other hand, when the baseline calculation unit 116 determines that design information for baseline M does not exist (step S14A; No), the baseline calculation unit 116 determines whether to use the detection line L of the entire range of layer B to calculate baseline M (step S14C). When the baseline calculation unit 116 calculates baseline M using the detection line L of the entire range of layer B (step S14C; Yes), the baseline calculation unit 116 calculates baseline M based on the detection line L of the entire range of layer B (step S14D). If the baseline calculation unit 116 calculates the baseline M without using the detection lines L of the entire interval of layer B (step S14C; No), the baseline calculation unit 116 determines whether there is an interval in the detection lines L where the positional change in the stacking direction Y is within a specified range (step S14E). If the baseline calculation unit 116 determines that there is an interval where the positional change is within the specified range (step S14E; Yes), the baseline calculation unit 116 calculates the baseline M based on the detection lines L of the interval (step S14F). On the other hand, if the baseline calculation unit 116 determines that there is no interval where the positional change is within the specified range (step S14E; No), the baseline calculation unit 116 changes the selected layer B (step S14G), returns to step S14A, and repeats the same process. That is, in this case, the baseline calculation unit 116 calculates the baseline M based on the design information of the baseline M for another layer B or the detection line L of the other layer B, and processes the baseline M of the other layer B as the baseline M of the layer B that is being targeted this time.

[0145] use Figure 13 illustrate Figure 11 The detailed processing flow of the method for determining whether the difference between the detection line L and the baseline M in step S16 meets the specified conditions. For example... Figure 13 As shown, the determination unit 118 determines whether there is a difference between the detection line L and the reference line M (step S16A). That is, here the determination unit 118 calculates the difference value (the difference between the detection line L and the reference line M in the stacking direction Y) for each position in the layer direction X, and determines whether the difference value is zero for each position in the layer direction X. If the determination unit 118 determines that there is no difference between the detection line L and the reference line M (step S16A; no), that is, if the difference value is zero at each position in the layer direction X, the determination unit 118 does not perform the judgment of local deformation and proceeds to step S16A. Figure 11Step S22. If the determination unit 118 determines that there is a difference between the detection line L and the reference line M (step S16A; Yes), and determines that the difference value (the difference between the detection line L and the reference line M in the stacking direction Y) is less than a threshold (step S16B; Yes), the determination unit 118 determines that the layer B has not undergone local deformation (step S20). On the other hand, if the determination unit 118 determines that the difference value is above the threshold (step S16B; No), and determines that the ratio of the difference value to the threshold is above a predetermined value (step S16C; Yes), the determination unit 118 determines that the layer B has undergone local deformation (step S18). If the determination unit 118 determines that the ratio of the difference value to the threshold is less than a predetermined value (step S16C; No), the output control unit 120 outputs information for the user to determine whether local deformation has occurred (step S18A). The user confirms this information and determines whether the layer B has undergone local deformation, and inputs the determination result to the input device 101. The judgment unit 118 determines whether the layer B has undergone local deformation based on the judgment result of the user input to the input device 101.

[0146] (Another example of a method for judging local deformation 1)

[0147] In the above description, the determination unit 118 determines whether local deformation has occurred in layer B based on the detection line L and the reference line M of layer B. However, the detection line L and the reference line M may not be used to determine whether local deformation has occurred. For example, the determination unit 118 may determine whether local deformation has occurred in layer B (the first layer), which is the object of determination of local deformation, is based on a comparison with another layer B (the second layer). That is, in this case, the output control unit 120 may output information about the local deformation of layer B (the first layer) based on a comparison with another layer B (the second layer). Here, the other layer B (the second layer), which is the object of comparison, can be any layer different from the layer B (the first layer), which is the object of determination. However, in this embodiment, it is preferable to be a layer that is adjacent to the layer B (the first layer), which is the object of determination, in the stacking direction Y. However, if the layer B, which is the object of determination, is an electrode, the layer that is adjacent to layer B, separated by a component between electrodes (in this example, an electrolyte layer), can be designated as the other layer B, which is the object of comparison. That is, in this embodiment, since layer B3, which serves as an electrolyte layer, is disposed between layer B1 and layer B2, which serve as electrodes, when layer B1 is the layer to be judged, the other layer B that serves as the comparison object can be layer B2, which is adjacent to layer B1 across layer B3. Furthermore, for example, the other layer B that serves as the comparison object can be a layer of the same type as the layer B that serves as the judgment object, and is adjacent to the layer B that serves as the judgment object across layers of a different type. In other words, in this embodiment, layers are stacked in the order of B1, B3, B2, B3, and B1. Therefore, when layer B1 is the layer to be judged, the other layer B that serves as the comparison object can be layer B1, which is adjacent to layer B1 across layers B3, B2, and B3.

[0148] The method for determining local deformation of layer B as the object of judgment and layer B as the comparison object can be any method. For example, in this embodiment, the judgment unit 118 can calculate the detection line L (first detection line) of layer B as the object of judgment and the detection line L (second detection line) of layer B as the comparison object, and determine whether local deformation has occurred in layer B as the object of judgment based on the difference between the first detection line and the second detection line (the difference in the stacking direction Y of the first detection line and the second detection line). In this case, the judgment unit 118 determines that local deformation has occurred if the difference between the first detection line and the second detection line meets a predetermined condition, and determines that no local deformation has occurred if the difference does not meet the predetermined condition.

[0149] More specifically, the determination unit 118 can calculate the difference in the stacking direction Y between the first detection line and the second detection line at each position in the layer direction X, and determine whether local deformation has occurred based on the difference at each position in the layer direction X. That is, the determination unit 118 calculates the difference between the Y-direction positions of the first detection line and the second detection line at the same position in the layer direction X, and repeats this process for each position in the layer direction X, thereby calculating the difference in the stacking direction Y between the first detection line and the second detection line at each position in the layer direction X. In other words, the determination unit 118 calculates the distances in the stacking direction Y between the layer B to be determined and the layer B to be compared in multiple intervals of the layer B to be determined, and outputs information about the local deformation of the layer B to be determined. Thereafter, the difference in the stacking direction Y between the first detection line and the second detection line is appropriately recorded as an interlayer difference value.

[0150] The determination unit 118 can determine local deformation using any method based on the interlayer difference value at each position in the layer direction X. For example, the determination unit 118 can compare the interlayer difference value with a predetermined threshold at each position in the layer direction X, and determine whether the interlayer difference value is less than the threshold at each position in the layer direction X. In this case, if the interlayer difference value at all positions in the layer direction X is less than the threshold, the determination unit 118 considers the difference to not meet the predetermined condition, and thus determines that the layer B, which is the object of determination, has not undergone local deformation. On the other hand, if the interlayer difference value at a part of the positions in the layer direction X is greater than or equal to the threshold, the determination unit 118 considers the difference to meet the predetermined condition, and thus determines that the layer B, which is the object of determination, has undergone local deformation. In other words, if in a part of the multiple intervals of the layer B, which is the object of determination, the distance in the stacking direction Y to the layer B being compared is greater than or equal to a predetermined value (first interval), and in a second interval different from the first interval, the distance in the stacking direction Y to the layer B being compared is less than a predetermined value, the determination unit 118 determines that the layer B, which is the object of determination, has undergone local deformation.

[0151] Furthermore, even if the interlayer difference value at a certain location (the first interval) is above a threshold, the determination of whether local deformation has occurred can be retained if the ratio of the difference value to the threshold is less than a predetermined value. For example, if the ratio of the interlayer difference value to the threshold is less than a predetermined value, the output control unit 120 can output information for the user to determine whether local deformation has occurred. More specifically, in this case, the output control unit 120 can cause the display device 102 to display information showing locations where the interlayer difference value is above the threshold, and information showing the interlayer difference value at said location. For example, the output control unit 120 can display an image obtained by cutting a three-dimensional image of the laminate A with a predetermined cross-section, and an image showing locations where the interlayer difference value is above the threshold in said image (e.g., an image highlighting said location) as information showing locations where the interlayer difference value is above the threshold. In addition, the output control unit 120 can display the interlayer difference value, or it can display the ratio of the interlayer difference value to the threshold as information showing the interlayer difference value at said location. Furthermore, for example, a score can be assigned to the ratio of the interlayer difference value to a threshold, with a higher ratio resulting in a lower score, and the score can be displayed. The user visually confirms this image to determine whether local deformation has occurred in layer B, and inputs the determination result to the input device 101. The determination unit 118 determines whether local deformation has occurred in layer B based on the user's determination result input to the input device 101. That is, the determination unit 118 determines that local deformation has occurred in layer B if the user's determination result indicates that local deformation has occurred, and determines that no local deformation has occurred in layer B if the user's determination result indicates that no local deformation has occurred. In addition, if the ratio of the difference value to the threshold is above a predetermined value, the determination unit 118 can determine that local deformation has occurred in layer B.

[0152] Furthermore, for example, the determination unit 118 can calculate the difference between the maximum value (the largest difference value) and the minimum value (the smallest difference value) at each position in the layer direction X (hereinafter referred to as the interlayer displacement value). In this case, the determination unit 118 determines that layer B has not undergone local deformation if the interlayer displacement value is above a predetermined threshold, and determines that layer B has undergone local deformation if the interlayer displacement value is above the threshold. In this case, even if the interlayer displacement value is above the threshold, the determination unit 118 may retain the determination of whether local deformation has occurred if the ratio of the interlayer displacement value to the threshold is less than a predetermined value. If the ratio of the interlayer displacement value to the threshold is less than the predetermined value, the output control unit 120 may output information for the user to determine whether local deformation has occurred. The information output method in this case, and the determination method performed by the determination unit 118 based on the user's determination result, are the same as those in the case where the ratio of the interlayer displacement value to the threshold is less than the predetermined value, so the description is omitted.

[0153] Furthermore, for example, the determination unit 118 can calculate the average value of the interlayer difference value (interlayer average value) at each position in the layer direction X. In this case, the determination unit 118 determines that layer B has not undergone local deformation if the interlayer average value is above a predetermined threshold, and determines that layer B has undergone local deformation if the interlayer average value is above the threshold. In this case, even if the interlayer average value is above the threshold, the determination unit 118 may retain the determination of whether local deformation has occurred if the ratio of the interlayer average value to the threshold is less than a predetermined value. If the ratio of the interlayer average value to the threshold is less than the predetermined value, the output control unit 120 can output information for the user to determine whether local deformation has occurred. The information output method in this case, and the determination method performed by the determination unit 118 based on the user's determination result, are the same as those in the case where the ratio of the interlayer difference value to the threshold is less than the predetermined value, so the description is omitted.

[0154] The process for determining local deformation based on the comparison between layer B and another layer B (the second layer) described above will be explained. Figure 14This is a flowchart illustrating the processing flow of another example of this embodiment. In this example, the control system 5 (control device 108) causes the acquisition unit 112 to acquire image data of the laminate A (data showing the internal structure of the laminate A) (step S30). Then, the control system 5 (control device 108) causes the calculation unit 114 to calculate the detection line L, i.e., the first detection line, of layer B as the judgment object, and the detection line L, i.e., the second detection line, of layer B as the comparison object, based on the image data of the laminate A (step S32). The control system 5 (control device 108) causes the judgment unit 118 to determine whether the difference between the first detection line and the second detection line meets a predetermined condition (step S34). If the judgment unit 118 determines that the difference between the first detection line and the second detection line meets the predetermined condition (step S34; Yes), the judgment unit 118 determines that the layer B has undergone local deformation (step S36), and the output control unit 120 outputs information indicating that the layer B has undergone local deformation as information about local deformation. On the other hand, if the determination unit 118 determines that the difference between the first detection line and the second detection line does not meet the specified conditions (step S34; No), the determination unit 118 determines that layer B has not undergone local deformation (step S38), and the output control unit 120 outputs information indicating that layer B has not undergone local deformation as information about local deformation. After executing step S36 or step S38, the control system 5 (control device 108) proceeds to step S40 to determine whether to end the process. If the control system 5 (control device 108) determines that the process should be ended (step S40; Yes), the process ends; if the control system 5 (control device 108) determines that the process should not be ended (step S40; No), it returns to step S32 and repeats the same process for other layers B.

[0155] (Another example of the method for judging local deformation 2)

[0156] In the above description, the control system 5 calculates the position of layer B in a specified cross-section based on image data, and determines whether there is local deformation based on the position of layer B in the specified cross-section. That is, in the above description, image data in a two-dimensional cross-section of the specified cross-section is extracted from the image data of the stack A, which is three-dimensional voxel data, and grayscale values ​​in a one-dimensional line SC are extracted from the image data of the specified cross-section to calculate a one-dimensional detection line L, thereby calculating the position of layer B. However, the determination of whether there is local deformation is not limited to using the position of layer B in the specified cross-section. For example, the calculation unit 114 of the control system 5 can calculate the position of layer B in the stacking direction Y at each location of the two-dimensional surface intersecting the layer direction X based on the image data of the stack A. In this case, the calculation unit 114 extracts the grayscale values ​​at each location of the two-dimensional surface. Then, the calculation unit 114 shifts the position of the two-dimensional surface and repeats the same process to obtain the grayscale values ​​of each two-dimensional surface. The calculation unit 114 extracts grayscale values ​​corresponding to the same part of layer B from the grayscale values ​​of each two-dimensional surface, and calculates a detection surface showing the Y-direction position of each position in the in-plane direction of layer B based on the extracted grayscale values. Then, the calculation unit 114 determines whether there is local deformation based on the detection surface. That is, in this example, the one-dimensional detection line L in the above embodiment is replaced with a two-dimensional detection surface. Other than that, the processing method is the same as in the above embodiment.

[0157] (Another example of the output information 1)

[0158] Next, other examples of information about the local deformation of layer B output by the output control unit 120 will be described. Figures 15-17 This is a schematic diagram illustrating other examples of output information. In this example, the output control unit 120 causes the display device 102 to display an image Q1 of the laminate A and an image Q2 showing a threshold for determining local deformation. Image Q1 includes an image obtained by cutting a three-dimensional image of the laminate A with a specified cross-section, and an image showing the location in which layer B undergoes local deformation (e.g., an image highlighting the location). Image Q2 includes an image showing the threshold and an image showing the user's change to the threshold. Figures 15-17 In the example, as image Q2, a scale image representing the upper and lower limits of the threshold that can be set is shown, and a bar image superimposed on the scale representing the current threshold.

[0159] When the user inputs a threshold into the input device 101, the control system 5 sets the threshold to the value input by the user. Then, the control system 5 uses the newly set threshold to re-determine whether layer B has undergone local deformation and updates images Q1 and Q2. That is, the control system 5 overlays an image showing the location of local deformation in layer B detected using the newly set threshold onto an image obtained by cutting a three-dimensional image of the laminate A with a specified cross-section as image Q1. Furthermore, the control system 5 displays the newly set threshold as image Q2. For example, Figure 15 Images Q1 and Q2 are shown when the threshold is a specified value. Figure 16 Images Q1 and Q2 are shown when the threshold is set higher than a specified value. Figure 17 Images Q1 and Q2 are shown when the threshold is set lower than a specified value. Figure 16 In the middle, due to the higher threshold, the region in layer B considered to be experiencing local deformation becomes narrower. Figure 17 In layer B, the area considered to be undergoing local deformation becomes wider due to the increased threshold.

[0160] By displaying images showing the location of local deformation in layer B, as in this example, and images showing the received threshold changes, users can properly identify whether local deformation has occurred.

[0161] (Another example of the output information 2)

[0162] Figure 18 This is a schematic diagram illustrating another example of output information. In this example, the output control unit 120 can output image data of the laminate A (e.g., Figure 18 The image Q3 shown illustrates the deformation degree at each location of layer A, and information indicating whether local deformation has occurred in layer B, serving as information about the local deformation of layer B. The deformation degree data at each location of layer A can refer, for example, the difference (difference value) between the detection line L and the baseline M in the stacking direction Y at each location of layer A, or the difference (interlayer difference value) between the first detection line and the second detection line in the stacking direction Y at each location of layer A. By outputting this data as information about the local deformation of layer B, this information about local deformation can be appropriately used as teacher data for machine learning. That is, for example, by using the deformation degree at each location and the information indicating whether local deformation has occurred in layer B (labels) as teacher data to enable a machine learning model to perform machine learning, it can appropriately learn the correspondence between the deformation degree at each location and the local deformation.

[0163] (A system example)

[0164] The inspection system 100 described above is processed by a single device, but multiple devices can also be combined. Figure 19 This is a schematic diagram showing the system structure with an inspection device. Next, using... Figure 19 The manufacturing system 300, which includes an inspection system 100, will be described. The manufacturing system 300 has multiple ( Figure 12 The system comprises three units: an inspection system 100 and a program creation device 302. The inspection system 100 and the program creation device 302 are connected via a wired or wireless communication line. The program creation device 302 creates various settings or programs created in the control device of the inspection system 100. The program creation device 302 outputs the created program or data to the inspection system 100. The inspection system 100 obtains area and scope information or inspection programs from the program creation device 302 and processes the obtained data and programs. The manufacturing system 300 performs inspections in the inspection system 100 using the data and programs created in the program creation device 302, thus effectively utilizing the created data and programs.

[0165] Next, refer to Figure 20 A manufacturing system including the aforementioned inspection device will be described. Figure 20 This is a block diagram of the manufacturing system. The manufacturing system 200 of this embodiment includes the inspection system 100, design device 202, manufacturing device 204 and repair device 206 as described in the above embodiment.

[0166] Design device 202 creates design information about the shape or composition of the laminate A and sends the created design information to manufacturing device 204.

[0167] Manufacturing apparatus 204 manufactures laminate A based on design information input from design apparatus 202. Inspection system 100 inspects the internal structure of the manufactured laminate A and determines whether layer B of laminate A has undergone local deformation. In other words, inspection system 100 determines whether the manufactured laminate A is a good product. If laminate A is not a good product, inspection system 100 determines whether laminate A can be repaired. If laminate A can be repaired, based on information about local deformation, the defective part (the part where local deformation occurs) and the repair content are calculated, and information showing the defective part and the repair content are sent to repair apparatus 206.

[0168] The repair device 206 repairs the defective parts of the laminate A based on the information received from the inspection system 100 showing the defective parts and the information showing the repair content.

[0169] Figure 21This is a flowchart illustrating the processing flow performed by the manufacturing system. In the manufacturing system 200, the design device 202 first creates design information for the laminate A (step S101). Next, the manufacturing device 204 manufactures the laminate A based on the design information (step S102). Next, the inspection system 100 inspects (measures) the manufactured laminate A (step S103). Next, the inspection system 100 determines whether local deformation has occurred in the laminate A (step S104).

[0170] Next, the inspection system 100 determines whether the manufactured laminate A is a good product (step S105). If the manufacturing system 200 determines that the manufactured laminate A is a good product ("Yes" in step S105), the process ends. Furthermore, if the inspection system 100 determines that the manufactured laminate A is not a good product ("No" in step S105), it determines whether the manufactured laminate A can be repaired (step S106).

[0171] If the manufacturing system 200 determines that the manufactured laminate A can be repaired (yes in step S106), the repair device 206 performs repair on laminate A (step S107), and returns to the process in step S103. If the manufacturing system 200 determines that the manufactured laminate A cannot be repaired (no in step S106), the process ends, and the defective product is recycled. At this point, the manufacturing system 200 terminates. Figure 21 The flowchart shown illustrates the processing.

[0172] In the manufacturing system 200 of this embodiment, the inspection system 100 of the above embodiment can inspect the internal structure of the laminate A with high precision, and therefore can determine whether the manufactured laminate A is a good product. In addition, the manufacturing system 200 can repair the laminate A if it is not a good product.

[0173] Alternatively, the repair process performed by the repair device 206 in this embodiment can be replaced by the manufacturing device 204 performing a manufacturing process again. In this case, if the inspection system 100 determines that the repair is possible, the manufacturing device 204 performs the manufacturing process again.

[0174] (Effect)

[0175] As described above, the inspection system 100 of this disclosure includes: an irradiation device 2 capable of irradiating with radiation; an imaging device 4 capable of irradiating the laminate A with radiation via the irradiation device 2 and outputting data showing the internal structure of the laminate A; and a control device 108 that, based on the data showing the internal structure of the laminate A, outputs information about the deformation of a portion of layer B (the first layer) of the laminate A (information about the local deformation of layer B). According to this disclosure, data about the local deformation of layer B can be obtained non-destructively, thereby enabling the appropriate detection of local deformation of layer B.

[0176] Furthermore, the control device 108 uses data showing the internal structure of the laminate A to calculate the position of layer B of the laminate A in a specified cross-section of the laminate A, and outputs information about the local deformation of layer B based on the position of layer B. According to this disclosure, data about the local deformation of layer B can be obtained non-destructively, thereby enabling appropriate detection of the local deformation of layer B.

[0177] Furthermore, the control device 108 outputs information about the local deformation of layer B based on the detection line L indicating the location of layer B. According to this disclosure, since the information about the local deformation is output using the detection line L, the local deformation of layer B can be detected with high precision.

[0178] Furthermore, the detection line L is calculated by approximating the position of layer B using a curve. According to this disclosure, since information about local deformation is output using this detection line L, local deformation of layer B can be detected with high precision.

[0179] Furthermore, the approximate curve used to calculate the detection line L is smooth. According to this disclosure, by performing such a smooth curve approximation, local deformation of layer B can be detected with high precision.

[0180] Furthermore, the control device 108 acquires a reference line M indicating the reference position of layer B, and outputs information about the local deformation of layer B based on a comparison between the reference line M and the detection line L. According to this disclosure, since the information about the local deformation is output using the detection line L and the reference line M, the local deformation of layer B can be detected with high precision.

[0181] Furthermore, the control device 108 obtains a reference line M from the design information. According to this disclosure, by using such a reference line M, local deformation of layer B can be detected with high precision.

[0182] Furthermore, the control device 108 uses the position of layer B throughout the entire range of layer B to calculate the baseline M. According to this disclosure, by calculating the baseline M in this way, local deformation of layer B can be detected with high precision.

[0183] Furthermore, the control device 108 uses the position of layer B within a portion of layer B to calculate the baseline M. According to this disclosure, by calculating the baseline M in this way, local deformation of layer B can be detected with high precision.

[0184] Furthermore, the control device 108 uses a range within a specified range of positional variation of layer B in the stacking direction Y of the laminate A as a partial interval. By using this interval to calculate the baseline M, local deformation of layer B can be detected with high precision.

[0185] Furthermore, the control device 108 outputs information about the local deformation of layer B based on a comparison between data of layer B (first layer) of the laminate A and data of the layer adjacent to layer B (second layer). According to this disclosure, since information about local deformation is output based on comparisons between layers B, local deformation of layer B can be detected with high precision.

[0186] Furthermore, the control device 108 calculates the distances in the stacking direction Y between layers B (the first layer) and another layer B (the second layer) in multiple intervals of layer B (the first layer), and outputs information about the local deformation of layer B (the first layer). According to this disclosure, since the information about local deformation is output based on the comparison of each interval of layers B, the local deformation of layer B can be detected with high precision.

[0187] Furthermore, if, in a first interval of multiple intervals of layer B (first layer), the distance in the stacking direction Y to another layer B (second layer) is greater than or equal to a predetermined value, and in a second interval different from the first interval, the distance in the stacking direction Y to another layer B (second layer) is less than a predetermined value, the control device 108 outputs information indicating that layer B (first layer) has deformed. According to this disclosure, by determining whether deformation has occurred in this way, local deformation can be detected with high precision.

[0188] Furthermore, the control device 108 treats the data of layer B (third layer), which is adjacent to layer B (first layer) of the laminate A, as data of layer B (first layer). By processing the data in this way, local deformation of layer B (first layer) can be appropriately detected.

[0189] Furthermore, the components constituting layer B (the first layer) include at least one of electrodes or inter-electrode components. According to this disclosure, localized deformation of the electrodes or inter-electrode components can be appropriately detected.

[0190] Furthermore, the laminate A is a lithium-ion battery. According to this disclosure, localized deformation of the lithium-ion battery can be appropriately detected.

[0191] Furthermore, the data showing the internal structure of laminate A is an image showing the internal structure of laminate A. According to this disclosure, by using such image data, local deformation of layer B can be appropriately detected.

[0192] Furthermore, the radiation includes X-rays. According to this disclosure, by using data obtained from X-ray irradiation showing the internal structure of the laminate A, local deformation of layer B can be appropriately detected.

[0193] Furthermore, the control device 108 acquires image data, which is generated by reconstructing an image of the stack based on multiple images, showing the internal structure of the stack A. These multiple images are obtained by irradiating the stack A with radiation incident from different directions. According to this disclosure, by using the image data showing the internal structure of the stack A, local deformation of layer B can be appropriately detected.

[0194] Furthermore, the inspection system 100 of this disclosure includes an irradiation device 2 capable of irradiating radiation and a control device 108. The control device 108 irradiates the laminate A with radiation via the irradiation device 2, acquires data showing the internal structure of the laminate A, and outputs information about the deformation of a portion of layer B inside the laminate A (information about the local deformation of layer B). According to this disclosure, local deformation of layer B can be appropriately detected.

[0195] Furthermore, the display device of this disclosure (display device 102, etc.) displays information about the deformation of a portion of layer B (first layer) of the laminate A, calculated based on data obtained by irradiation showing the internal structure of the laminate A. According to this disclosure, by displaying the calculated information about the local deformation of layer B, the user can appropriately identify the local deformation.

[0196] Furthermore, the inspection method of this disclosure includes: acquiring data obtained by irradiation with radiation, showing the internal structure of the laminate A; and calculating information about the deformation of a portion of the first layer of the laminate A based on the data. According to this disclosure, local deformation of layer B can be appropriately detected.

[0197] Furthermore, the procedure of this disclosure enables a computer to perform the following processes: acquire data, captured by irradiation, showing the internal structure of the laminate A; and calculate information about the deformation of a portion of the first layer of the laminate A based on the data. According to this disclosure, local deformation of layer B can be appropriately detected.

[0198] Furthermore, the method for manufacturing the laminate A disclosed herein includes: generating design information regarding the shape of the laminate A; manufacturing the laminate A based on the design information; and using an inspection system 100 to determine whether a portion of a component of the constituent layer B of the manufactured laminate A has deformed. According to this disclosure, a laminate A without localized deformation can be provided.

[0199] Furthermore, the control device 108 of this disclosure acquires data showing the internal structure of the laminate A as captured by irradiation, and calculates a determination result based on the data as to whether a portion of the constituent layers of the laminate A has deformed. According to this disclosure, local deformation of layer B can be appropriately detected.

[0200] The accompanying drawings have described suitable embodiments of the present invention, but it is not intended to imply that the invention is not limited to the examples described. The shapes or combinations of the constituent components shown in the above examples are merely illustrative, and various modifications can be made based on design requirements without departing from the spirit of the invention. The constituent components of the aforementioned embodiments can be suitably combined. Furthermore, sometimes some constituent components are not used. In addition, to the extent permitted by law, all publicly available publications concerning inspection devices, etc., cited in the foregoing embodiments are incorporated herein by reference. All other embodiments and applications made by those skilled in the art based on the foregoing embodiments are included within the scope of these embodiments.

[0201] Explanation of icon numbers

[0202] 1: Measurement System

[0203] 2: Irradiation device

[0204] 4: Filming equipment

[0205] 5: Control System

[0206] 100: Inspection System

[0207] 108: Control device

[0208] 110: X-ray Control Department

[0209] 112: Acquisition Department

[0210] 114: Calculation Department

[0211] 116: Baseline Calculation Section

[0212] 118: Judgment Department

[0213] 120: Output Control Unit

[0214] A: Laminated body

[0215] B: Layer

[0216] L: Detection line

[0217] M: Baseline

Claims

1. An inspection system, comprising: Irradiation device capable of irradiating radiation; The imaging device irradiates the laminate with radiation through the irradiation device and outputs data showing the internal structure of the laminate. as well as Control device; Based on the data, the control device outputs information about the deformation of a portion of the first layer of the laminate.

2. The inspection system according to claim 1, wherein, The control device uses the data to calculate the position of the first layer of the laminate in a specified cross-section of the laminate. Based on the location of the first layer, output information about the deformation of a portion of the first layer.

3. The inspection system according to claim 2, wherein, The control device outputs information about the deformation of a portion of the first layer based on a detection line indicating the position of the first layer.

4. The inspection system according to claim 3, wherein, The detection line is calculated by approximating the position of the first layer using a curve.

5. The inspection system according to claim 4, wherein, The approximate curve is smooth.

6. The inspection system according to any one of claims 3 to 5, wherein, The control device Obtain the baseline that shows the reference position of the first layer. Based on the comparison between the baseline and the detection line, information about the deformation of a portion of the first layer is output.

7. The inspection system according to claim 6, wherein, The control device obtains the baseline from the design information.

8. The inspection system according to claim 6, wherein, The control device uses the position of the first layer in the entire range of the first layer to calculate the baseline.

9. The inspection system according to claim 6, wherein, The control device uses the position of the first layer in a portion of the first layer's interval to calculate the baseline.

10. The inspection system according to claim 9, wherein, The control device uses a range within a specified range of the positional variation of the first layer in the stacking direction of the laminate as the range of the part.

11. The inspection system according to any one of claims 1 to 10, wherein, The control device outputs information about the deformation of a portion of the first layer based on a comparison of data from the first layer of the stack with data from the second layer adjacent to the first layer.

12. The inspection system according to claim 11, wherein, The control device calculates the distance from the second layer in the stacking direction of the stacked body in multiple intervals of the first layer, and outputs information about the deformation of a portion of the first layer.

13. The inspection system according to claim 12, wherein, The control device If, in a first interval of multiple intervals of the first layer, the distance from the second layer in the stacking direction is greater than or equal to a predetermined value, and in a second interval different from the first interval, the distance from the second layer in the stacking direction is less than a predetermined value, information about the deformation of the first layer is output.

14. The inspection system according to any one of claims 1 to 13, wherein, The control device treats the data of the third layer adjacent to the first layer of the stack as the data of the first layer.

15. The inspection system according to any one of claims 1 to 14, wherein, The components constituting the first layer include at least one of electrodes or components between electrodes.

16. The inspection system according to any one of claims 1 to 15, wherein, The laminate is a lithium-ion battery.

17. The inspection system according to any one of claims 1 to 16, wherein, The data showing the internal structure of the laminate is an image showing the internal structure of the laminate.

18. The inspection system according to any one of claims 1 to 17, wherein, The radiation includes X-rays.

19. The inspection system according to any one of claims 1 to 18, wherein, The control device acquires image data, which is generated by reconstructing the image of the stack based on multiple images to show the internal structure of the stack, the multiple images being obtained by radiation incident on the stack from different directions.

20. An inspection system, comprising: Irradiation device capable of irradiating radiation; as well as Control device, The control device By irradiating the laminate with radiation through the irradiation device, data showing the internal structure of the laminate is obtained. Output information about the deformation of a portion of the first layer inside the stack.

21. A display device that displays information about the deformation of a portion of a first layer of a laminate, calculated based on data taken by means of irradiation that shows the internal structure of the laminate.

22. An inspection method, comprising: To acquire data showing the internal structure of a laminate, obtained by irradiation with radiation; as well as Based on the data, information about the deformation of a portion of the first layer of the laminate is calculated.

23. A program that causes a computer to perform the following processes: Acquire data showing the internal structure of a laminate, obtained by imaging after exposure to radiation; and Based on the data, information about the deformation of a portion of the first layer of the laminate is calculated.

24. A method for manufacturing a laminate, comprising: Create design information about the shape of the stacked body; The laminate is manufactured based on the design information; as well as The inspection system according to any one of claims 1 to 20 is used to determine whether a portion of the constituent layer of the manufactured laminate is deformed.

25. A control device for acquiring data, captured by irradiation, showing the internal structure of a laminated body. Based on the data, a determination is made as to whether a portion of the constituent layer of the laminate is deformed.

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