Laser projection light source and laser projection device

Abstract

The application provides a laser projection light source and a laser projection device, and relates to the technical field of projection. The laser projection light source comprises a light source main body and a heat dissipation assembly. The light source main body has a device to be cooled, and the device to be cooled comprises a substrate, a device body and a part to be avoided. The substrate has a first surface and a second surface arranged oppositely, and an avoiding groove. The groove opening of the avoiding groove is located on the first surface, at least part of the part to be avoided is located in the avoiding groove, and the end of the part to be avoided located in the avoiding groove and away from the second surface does not protrude from the groove opening. The heat dissipation assembly has a heat conduction surface attached to the first surface, and the heat conduction surface covers at least part of the orthographic projection of the part to be avoided on the first surface. The heat generated by the device to be cooled can be transmitted to the heat dissipation assembly through the first surface and the heat conduction surface.

Description

Laser projection light source and laser projection equipment

[0001] This application claims priority to Chinese patent application No. 202410033323.4, filed on January 9, 2024, with the invention name “Projection device and projection system”, and claims priority to Chinese patent application No. 202420055533.9, filed on January 9, 2024, with the utility model name “Projection device and projection system”, and also claims priority to Chinese patent application No. 202410033318.3, filed on January 9, 2024, with the invention name “Light-emitting device and projection system”, and claims priority to Chinese patent application No. 202420053564.0, filed on January 9, 2024, with the utility model name “Light-emitting device and projection system”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of projection technology, and in particular to a laser projection light source and a laser projection device. Background Art

[0003] Laser projection equipment is increasingly being used in people's daily lives and work. Laser projection is gaining market share due to its wide color gamut, high brightness, and long lifespan. Laser projection equipment typically includes components such as lasers, lenses, and circuit boards. The laser, the source of the laser beam, generates significant heat during operation. Excessive heat can affect the projection quality, reliability, and lifespan of the laser projection equipment.

[0004] Currently, in order to dissipate heat from the laser in a laser projection device, a heat dissipation component is generally used to absorb the heat of the laser, thereby reducing the temperature of the laser.

[0005] However, the current heat dissipation components have low heat dissipation efficiency when dissipating heat from the laser, making it difficult to ensure the normal operation of the laser projection equipment.

[0006] Summary of the Invention

[0007] In view of the above problems, the present application provides a laser projection light source and a laser projection device, which can improve the heat dissipation efficiency of the heat dissipation component for the laser and better ensure the normal operation of the laser.

[0008] In order to achieve the above objectives, this application provides the following technical solutions:

[0009] A first aspect of the present application provides a laser projection light source, comprising: a light source body and a heat dissipation component;

[0010] The light source body has a heat dissipation device, which includes: a substrate, a device body, and a piece to be avoided; the substrate has a first surface and a second surface arranged opposite to each other, and a avoidance groove; the device body is connected to the second surface, the notch of the avoidance groove is located on the first surface, at least part of the piece to be avoided is located in the avoidance groove, and the end of the portion of the piece to be avoided located in the avoidance groove that is away from the second surface does not protrude from the notch;

[0011] The heat dissipation component has a heat-conducting surface in contact with the first surface, and the heat-conducting surface covers at least a portion of the orthographic projection of the part to be avoided on the first surface.

[0012] A second aspect of the present application provides a laser projection device, comprising the laser projection light source shown above, a light modulation component and a projection lens;

[0013] The light modulation component is located at the light output side of the laser projection light source, and the light modulation component is used to modulate the light emitted by the laser projection light source;

[0014] The projection lens is located on the light-emitting side of the light modulation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] FIG1 is a top view of a laser projection light source provided in an embodiment of the present application;

[0017] FIG2 is a schematic structural diagram of a light source body provided in an embodiment of the present application;

[0018] FIG3 is a diagram showing the relationship between a heat dissipation device and a heat dissipation assembly according to an embodiment of the present application;

[0019] FIG4 is a schematic structural diagram of a heat dissipation device provided in an embodiment of the present application;

[0020] FIG5 is a schematic structural diagram of another heat dissipation device provided in an embodiment of the present application;

[0021] FIG6 is a schematic structural diagram of a support member provided in an embodiment of the present application;

[0022] FIG7 is a schematic diagram of a heat dissipation assembly and a heat sink provided in an embodiment of the present application;

[0023] FIG8 is a schematic structural diagram of a heat conducting block provided in an embodiment of the present application;

[0024] FIG9 is a schematic structural diagram of a light emitting device provided in an embodiment of the present application;

[0025] FIG10 is a schematic structural diagram of another light-emitting device provided in an embodiment of the present application;

[0026] FIG11 is a top view of the light emitting device shown in FIG9;

[0027] FIG12 is a side view of the light emitting device shown in FIG9;

[0028] FIG13 is a schematic diagram of a connection between a light emitting device and a power supply provided in an embodiment of the present application;

[0029] FIG14 is a cross-sectional view of a conductive member provided in an embodiment of the present application;

[0030] FIG15 is a cross-sectional view of the light emitting device shown in FIG11 taken along line AA;

[0031] FIG16 is a partial enlarged view of the light emitting device shown in FIG15 at position B;

[0032] FIG17 is another partial enlarged view of the light emitting device shown in FIG15 at position B;

[0033] FIG18 is another partial enlarged view of the light emitting device shown in FIG15 at position B;

[0034] FIG19 is another partial enlarged view of the light emitting device shown in FIG15 at position B;

[0035] FIG20 is another partial enlarged view of the light emitting device shown in FIG15 at position B;

[0036] FIG21 is a cross-sectional view of the light emitting device shown in FIG10;

[0037] FIG22 is a schematic structural diagram of a light emitting device provided in another embodiment of the present application;

[0038] FIG23 is a cross-sectional view of the light emitting device shown in FIG22;

[0039] FIG24 is a cross-sectional view of the light emitting device shown in FIG22;

[0040] FIG25 is a schematic structural diagram of a laser projection device provided in an embodiment of the present application;

[0041] FIG26 is a schematic diagram of a projection imaging optical path of a laser projection device provided in an embodiment of the present application;

[0042] FIG27 is a schematic structural diagram of a projection system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0043] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0044] It should be noted that the brief descriptions of terms in this application are only for the purpose of facilitating the understanding of the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their ordinary and usual meanings.

[0045] In addition, the terms "comprises" and "comprising" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such product or device.

[0046] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0047] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0049] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] Currently, in order to dissipate heat from the laser in a laser projection light source, a heat dissipation component is generally used to absorb the heat from the laser, thereby reducing the temperature of the device to be dissipated. For example, the heat dissipation component can abut against the outer surface of the laser and continuously cool the laser through air cooling or water cooling. However, due to the presence of a protrusion on the outer surface of the laser, the protrusion protrudes from the outer surface of the laser, resulting in insufficient contact between the heat dissipation component and the laser, limiting the contact area between the heat dissipation component and the laser, thereby reducing the heat dissipation efficiency of the heat dissipation component and making it difficult to ensure the normal operation of the laser.

[0051] Based on the above problems, the present application provides a laser projection light source. Please refer to Figure 1, which is a top view of a laser projection light source provided by an embodiment of the present application. The laser projection light source may include: a light source body 100 and a heat dissipation assembly 300.

[0052] In order to see the shape of the light source body 100 more clearly, please refer to Figure 2, which is a structural schematic diagram of a light source body provided in an embodiment of the present application. The light source body 100 in the laser projection light source may have a device 200 to be cooled. The device 200 to be cooled refers to a device installed in the light source body 100 and has a heat dissipation requirement. For example, the device 200 to be cooled can be a light-emitting device (also referred to as a laser) installed in the light source body 100. In other possible implementations, the device 200 to be cooled can also be other components installed in the light source body 100, such as a control circuit board. The embodiment of the present application does not limit this.

[0053] As shown in Figures 2 and 3, Figure 3 is a diagram showing the relationship between a heat dissipation device and a heat dissipation assembly according to an embodiment of the present application. The heat dissipation device 200 may include: a substrate 201, a device body 202, and a piece to be avoided 203.

[0054] The substrate 201 in the device 200 to be cooled may have a first surface S1 and a second surface S2 disposed opposite to each other, and a relief groove K. The device body 202 in the device 200 to be cooled may be connected to the second surface S2 of the substrate 201. Here, the device body 202 may be fixed on the second surface S2 of the substrate 201.

[0055] The notch K1 of the avoidance groove K in the substrate 201 can be located on the first surface S1 of the substrate 201. At least a portion of the component 203 to be avoided can be located within the avoidance groove K. The end of the component 203 to be avoided that is located within the avoidance groove K and faces away from the second surface S2 of the substrate 201 does not protrude beyond the notch K1 of the avoidance groove K. In this way, the avoidance groove K can conceal the component 203 to be avoided, preventing it from protruding from the first surface S1 of the heat dissipation component 200.

[0056] 3 , the heat dissipation component 300 in the laser projection light source may have a heat conducting surface S3 in contact with the first surface S1 of the substrate 201. The heat conducting surface S3 of the heat dissipation component 300 may cover at least a portion of the orthographic projection of the object to be avoided 203 on the first surface S1.

[0057] In this case, the heat generated by the heat dissipation device 200 during operation can be transferred to the heat dissipation assembly 300 sequentially through the first surface S1 and the heat-conducting surface S3 of the substrate 201. After absorbing the heat, the heat dissipation assembly 300 can cool the heat dissipation device 200. Because the avoidance member 203 does not protrude from the first surface S1 of the substrate 201, the heat-conducting surface S3 of the heat dissipation assembly 300 is not obstructed by the avoidance member 203, allowing the heat-conducting surface S3 of the heat dissipation assembly 300 to contact more of the first surface S1. In other words, the contact area between the heat-conducting surface S3 of the heat dissipation assembly 300 and the first surface S1 of the heat dissipation device 200 is larger.

[0058] Furthermore, when the heat conducting surface S3 covers all the notches K1 of the avoidance slot K, the heat conducting surface S3 also covers the entire orthographic projection of the component to be avoided 203 on the first surface S1. This further increases the contact area between the heat conducting surface S3 of the heat dissipation assembly 300 and the first surface S1 of the component to be cooled 200.

[0059] It should be noted that the part to be avoided 203 in the heat dissipation device 200 can be a block provided on the substrate 201, and these blocks are easy to protrude from the side of the substrate 201 away from the device body 202 (i.e., the first surface S1). In one possible implementation, the part to be avoided 203 can be a connecting structure for assembling the heat dissipation device 200 in the light source body 100, for example, the connecting structure can be a screw. In another possible implementation, the part to be avoided 203 can be a temperature sensor for detecting the temperature of the heat dissipation device 200. After the avoidance groove K is provided on the first surface S1 of the substrate 201, part of the part to be avoided 203 can be located in the avoidance groove K, or the part to be avoided 203 can also be located entirely in the avoidance groove K. In this way, after the heat conduction surface S3 of the heat dissipation assembly 300 is attached to the first surface S1 of the substrate 201, the heat conduction surface S3 can cover part of the orthographic projection of the part to be avoided 203 on the first surface S1, or it can cover the entire orthographic projection of the part to be avoided 203 on the first surface S1.

[0060] In the laser projection light source provided in this application, a clearance groove K is provided on the first surface S1 of the heat dissipation device 200. This clearance groove K serves to conceal the clearance member 203, preventing the clearance member 203 from protruding from the first surface S1 of the heat dissipation device 200. Thus, after the heat conduction surface S3 of the heat dissipation assembly 300 is bonded to the first surface S1 of the heat dissipation device 200, the clearance member 203 in the heat dissipation device 200 does not affect the bond between the heat conduction surface S3 of the heat dissipation assembly 300 and the first surface S1, and the heat conduction surface S3 of the heat dissipation device 200 does not need to specifically bypass the clearance member 203. This allows the heat conduction surface S3 of the heat dissipation device 200 to be larger, ensuring a more complete bond between the heat conduction surface S3 and the first surface S1. This, in turn, increases the contact area between the heat dissipation assembly 300 and the heat dissipation device 200, resulting in better heat dissipation efficiency from the heat dissipation assembly 300 to the heat dissipation device 200, thereby better ensuring the normal operation of the laser projection light source.

[0061] In the embodiment of the present application, since the device body 202 in the device to be dissipated 200 can be fixed on the second surface S2 of the substrate 201, and the heat-conducting surface S3 of the heat dissipation assembly 300 can be aligned with the first surface S1 of the substrate 201 facing away from the device body 202. Therefore, during the operation of the device to be dissipated 200, the heat generated by the device body 202 can be first transferred to the substrate 201, and then transferred to the heat dissipation assembly 300, so that the heat dissipation assembly 300 can continuously cool the substrate 201. In this way, the substrate 201 can play a role in heat conduction, facilitating the transfer of the heat generated by the device to be dissipated 200 to the heat dissipation assembly 300, so as to achieve the cooling of the device to be dissipated 200. In addition, the number of devices to be dissipated 200 in the light source body 100 can be multiple, and the multiple substrates 201 in the multiple devices to be dissipated 200 are arranged in parallel, and the first surface S1 on each substrate 201 can be arranged flush, and the first surface S1 on each substrate 201 can be aligned with the same heat-conducting surface S in the heat dissipation assembly 300.

[0062] Optionally, as shown in Figure 4, Figure 4 is a schematic structural diagram of a device to be heat-dissipated provided in an embodiment of the present application. The avoidance groove K provided on the first surface S1 of the device to be heat-dissipated 200 can be distributed at the edge position of the substrate 201, and the side surface S4 of the substrate 201 can have an opening K2 connected to the avoidance groove K. The side surface S4 of the substrate 201 can be connected to the first surface S1 and the second surface S2, respectively. Here, setting the avoidance groove K at the edge position of the substrate 201 can reduce the influence of the avoidance groove K provided on the first surface S1 and the avoidance part 203 located in the avoidance groove K on the device body 201 in the device to be heat-dissipated 200.

[0063] It should be noted that in laser projection light sources, the device body 201 of the device 200 to be dissipated heat is typically disposed within the central region of the substrate 201. If the avoidance groove K were also disposed within the central region of the substrate 201, this would affect the normal operation of the device body 201. Furthermore, if an opening K2 communicating with the avoidance groove K is provided on the side surface S4 of the substrate 201, machining the avoidance groove K can be facilitated from the side surface S4 of the substrate 201.

[0064] In an embodiment of the present application, as shown in FIG2 , the light source body 100 may further include: a support member 101. The device to be dissipated 200 in the light source body 100 may be mounted on the support member 101 via a piece to be avoided 203. Here, after the device to be dissipated 200 is mounted on the support member 101 via the piece to be avoided 203, the second surface S2 of the device to be dissipated 200 may face the support member 101. In this way, the connection function played by the piece to be avoided 203 facilitates the connection of the device to be dissipated 200 to the support member 101 in the light source body 100, so as to ensure that the support member 101 can provide support for the device to be dissipated 200.

[0065] It should be noted that, when the second surface S2 of the device 200 to be cooled faces the support member 101, the device 200 to be cooled can be located between the support member 101 and the portion of the heat dissipation assembly 300 where the heat conducting surface S3 is provided. Thus, when the device 200 to be cooled is a laser, the support member 101 can be the main housing of the light source. Because the main housing of the light source is easy to form and has higher processing precision, the positional accuracy of the laser during installation is also higher, ensuring the reliability of the laser during operation.

[0066] Further, as shown in Figure 5, Figure 5 is a schematic structural diagram of another device to be heat-dissipated provided in an embodiment of the present application. The substrate 201 in the device to be heat-dissipated 200 may also have a through hole V1. One end opening of the through hole V1 is located on the second surface S2 of the substrate 201, and the other end opening of the through hole V1 may be located on the bottom surface K3 of the avoidance groove K. Here, the bottom surface K3 of the avoidance groove K refers to: a side of the avoidance groove K that is arranged opposite to the slot K1. To this end, the through hole V1 provided on the substrate 201 may be connected to the avoidance groove K to ensure that the part to be avoided 203 in the device to be heat-dissipated 200 can pass through the substrate 201 and be connected to the support member 101.

[0067] Exemplarily, a portion of the part to be avoided 203 can be located within the avoidance groove K and abut against the bottom surface K3 of the avoidance groove K; another portion of the part to be avoided 203 can pass through the through hole V1 to connect with the support member 101. It should be noted that the through hole V1 can serve to accommodate the part to be avoided 203, further making it difficult for the part to be avoided 203 to protrude from the first surface S1, and at the same time, it also facilitates the connection between the part to be avoided 203 and the support member 101. The number of through holes V1 and avoidance grooves K on the heat dissipation device 200 is the same. For example, two through holes V1 and two avoidance grooves K can be provided on each substrate 201.

[0068] In the present application, after a portion of the member 203 to be avoided is located within the avoidance groove K and abuts against the bottom surface K3 of the avoidance groove K, the portion of the member 203 to be avoided located within the avoidance groove K can limit the movement of the member 203 in the direction toward the second surface S2. In this way, the bottom surface K3 of the avoidance groove K can also serve as a position limiter. The mutual abutment between the bottom surface K3 and the portion of the member 203 to be avoided located within the avoidance groove K facilitates the installation of the member 203 to be avoided. Furthermore, after passing through the through hole V1, another portion of the member 203 to be avoided can protrude from the second surface S2 of the substrate 201, and the portion of the member 203 to be avoided that protrudes from the second surface S2 can be connected to the support member 101.

[0069] For example, the avoidance member 203 may be a screw, the screw head of which may be located within the avoidance groove K and abut against the bottom surface K3 of the avoidance groove K. The avoidance groove K can be used to conceal the screw head to prevent it from protruding from the first surface S1. The screw shaft of the screw may pass through the through hole V1 to connect with the support member 101.

[0070] In this case, as shown in Figure 6, Figure 6 is a structural schematic diagram of a support member provided in an embodiment of the present application, and the support member 101 in the light source body 100 may have a connecting hole V2. The connecting hole V2 may be connected to the through hole V1 provided on the substrate 201 in the device to be dissipated 200, and the avoidance member 203 may pass through the through hole V1 and be connected to the connecting hole V2. Here, in the case where the avoidance member 203 is a screw, the connecting hole V2 may be a threaded hole, and the screw in the screw may be threadedly connected to the threaded hole after passing through the through hole V1. Since the screw head in the screw can abut against the bottom surface K3 of the groove in the avoidance groove K provided on the substrate 201, after the screw in the screw is threadedly connected to the threaded hole provided on the support member 101, the screw can lock the substrate 201 to the support member 101, so that the device to be dissipated 200 as a whole can be installed on the support member 101.

[0071] In an embodiment of the present application, as shown in Figure 6, the support member in the light source body 100 also has a support column 102, and the support column 102 can be configured to: after the heat-conducting surface S3 of the heat-dissipating assembly 300 is bonded to the first surface S1 of the heat-dissipating device 200, it is connected to the part of the heat-dissipating assembly 300 where the heat-conducting surface S3 is set.

[0072] In this case, the device to be cooled 200 can be independently assembled on the support member 101 via the avoidance member 203, and the portion of the heat dissipation assembly 300 where the heat conductive surface S3 is provided can also be independently assembled on the support member 101 via the support column 102. There is no need to first assemble the device to be cooled 200 on the portion of the heat dissipation assembly 300 where the heat conductive surface S3 is provided, and then completely assemble the heat dissipation assembly 300 with the device to be cooled 200 assembled on the support member 100. In this way, only the assembly accuracy between the device to be cooled 200 and the support member 101 needs to be considered, and no longer the assembly accuracy between the device to be cooled 200 and the portion of the heat dissipation assembly 300 where the heat conductive surface S3 is provided. This ensures a high degree of installation accuracy of the device to be cooled 200 on the support member 101, further improving the reliability of the device to be cooled 200.

[0073] In an embodiment of the present application, as shown in FIG7 , which is a schematic diagram of a heat dissipation assembly and a heat sink provided in an embodiment of the present application, the heat dissipation assembly 300 may include: a heat sink 301 and a heat pipe 302 .

[0074] The heat pipe 302 has an evaporation section 3021 for absorbing heat and a condensation section 3022 for releasing heat at its two ends along its extension direction. The condensation section 3022 of the heat pipe 302 can be thermally connected to the heat sink 301, and the evaporation section 3021 of the heat pipe 302 can be thermally connected to the device 200 to be cooled.

[0075] During operation of the heat pipe 302, the liquid inside the heat pipe 302 absorbs heat from the device 200 to be dissipated in the evaporation section 3021 and evaporates to form gas. The gas is then transferred to the condensation section 3022 within the heat pipe 302, where it releases heat and condenses to form liquid. The heat released by the gas is then transferred to the radiator 301. The condensed liquid then flows back to the evaporation section 3021, creating a continuous cycle that continuously absorbs heat from the device 200 to be dissipated. In this way, the heat pipe 302 can continuously and efficiently transfer heat from the device 200 to be dissipated to the radiator 301, thereby ensuring a heat dissipation and cooling effect on the device 200 to be dissipated. For example, multiple heat pipes 302 can be arranged in parallel. For example, in Figure 7, four heat pipes 302 are arranged in parallel. The radiator 301 can include multiple fins arranged in parallel, with the walls of the heat pipe 302 in the condensation section 3022 abutting against and passing through each fin.

[0076] In the embodiment of the present application, there are multiple ways to configure the heat conducting surface S3 in the heat dissipation assembly 300. The embodiment of the present application uses the following two optional implementations as examples for schematic illustration.

[0077] In a first optional implementation, the outer surface of the evaporator section 3021 of the heat pipe 302 in the heat dissipation assembly 300 can be bonded to the first surface S1 of the device 200 to be cooled. In other words, the portion of the outer surface of the evaporator section 3021 that is bonded to the first surface S1 serves as the heat transfer surface S3. In this case, by directly bonding the outer surface of the evaporator section 3021 of the heat pipe 302 to the first surface S1, the thermal resistance between the device 200 to be cooled and the heat pipe 302 can be effectively reduced, thereby improving heat transfer efficiency.

[0078] In a second optional implementation, as shown in FIG7 , the heat dissipation assembly 300 may further include a heat conductive block 303 . The heat conductive block 303 may be connected to the evaporation section 3021 in the heat pipe 302 , and the side of the heat conductive block 303 that contacts the first surface S1 of the device 200 to be cooled is the heat conductive surface S3 . In this case, the heat conductive block 303 can function to transfer heat, allowing the heat conductive block 303 to transfer heat from the device 200 to be cooled to the heat pipe 302 . For example, the heat conductive block 303 may be a copper block or an aluminum block.

[0079] Furthermore, as shown in FIG8 , which is a schematic structural diagram of a heat conducting block provided in an embodiment of the present application, the heat conducting block 303 in the heat dissipation assembly 300 has a plurality of sockets P that can penetrate the heat conducting block 303. Here, there are multiple heat pipes 302 in the heat dissipation assembly 300, and the multiple heat pipes 302 can correspond one-to-one with the multiple sockets P provided on the heat conducting block 303. The evaporation end 3021 in each heat pipe 302 can be located in the corresponding socket P, and the evaporation end 3021 in each heat pipe 302 can be connected to the heat conducting block 303 in the corresponding socket P.

[0080] The insertion direction of each plug-in card P on the heat-conducting block 303 can be parallel to the heat-conducting surface S3 of the heat-conducting block 303, and the orthographic projection of at least one plug-in card P on the heat-conducting surface S3 can overlap the orthographic projection of the avoidance component 203 in the heat-dissipating device 200 on the heat-dissipating surface S3. In this case, because the avoidance component 203 can be hidden in the avoidance groove K, the heat pipe 302 in the heat dissipating assembly 300 no longer needs to avoid the avoidance component 203.

[0081] For example, when the avoidance member 203 is a screw, if the screw head protrudes from the first surface S1 of the heat dissipation device 200, in order to improve the reliability of the heat pipe 302, the heat pipe 302 needs to bypass the screw, resulting in a reduction in the number of heat pipes 302 that can be inserted into the heat conductive block 303, thereby affecting the number of heat pipes 302 arranged and reducing the heat dissipation efficiency. However, after the screw head is concealed by the avoidance groove K, even if the orthographic projection of at least one heat pipe 302 in the heat dissipation assembly 300 on the heat conductive surface S3 overlaps with the orthographic projection of the avoidance member 203 on the heat conductive surface S3, it can be ensured that there is no interference between the avoidance member 203 and the heat pipe 302, thereby increasing the number of heat pipes 302 arranged and the contact area between the heat conductive block 303 and the heat dissipation device 200, thereby further improving the efficiency of the heat dissipation assembly 300 in dissipating the heat to the heat dissipation device 200.

[0082] Optionally, as shown in FIG. 8 , the heat-conducting block 303 in the heat dissipation assembly 300 may include: a bump 3031 , and a heat-conducting bracket 3032 fixedly connected to the bump 3031 .

[0083] The side of the bump 3031 facing away from the thermally conductive bracket 3032 is the thermally conductive surface S3. That is, the side of the bump 3031 facing away from the thermally conductive bracket 3032 can be in contact with the first surface S1 of the heat dissipation device 200. The thermally conductive bracket 3032 can be connected to the support column 102 provided on the support frame 101. In other words, the thermally conductive block 303 can be fastened to the support member 101 in the light source body 100 through the connection between the thermally conductive bracket 3032 and the support column 102. The thermally conductive bracket 3032 can also have multiple sockets P.

[0084] It should be noted that after experimental simulation, it was found that: when the heat dissipation device 200 is a laser and the avoidance part 203 is a screw, there is no avoidance groove K on the substrate 201, and the screw head in the screw protrudes from the first surface S1 of the heat dissipation device 200, and when the thermal power of the laser is 45W, the presence of the screw head in the screw will increase the heat flux density of the laser by 5.7%, which will increase the difficulty of heat dissipation of the laser. In the present application, a avoidance groove K is provided on the first surface S1 of the substrate 201, and the screw head in the screw is hidden and installed in the avoidance groove K, and then the heat conductive surface of the heat dissipation component 300 is directly bonded to the first surface S1 of the substrate 201 to ensure that the bonding area between the two is large, thereby effectively improving the heat dissipation effect of the laser. For example, the heat dissipation method proposed in this application can reduce the temperature of the laser by about 14°C.

[0085] In the embodiment of the present application, when the device 200 to be heat-dissipated is a light-emitting device 202', as shown in Figure 9, which is a schematic structural diagram of a light-emitting device provided in the embodiment of the present application, the device body 202 located on the substrate 201 can be the light-emitting portion 202' of the light-emitting device 200'. It should be noted that the light-emitting device 200' can also be called a laser.

[0086] Here, the light emitting unit 202 ′ may include a housing 2021 and a light emitting element 2022 . The light emitting element 2022 may also be referred to as a light emitting chip, and may emit laser light. The housing 2021 and the light emitting element 2022 may both be disposed on the substrate 201 .

[0087] The housing 2021 may have a sealed internal cavity U. The light-emitting element 2022 may be located within the internal cavity U of the housing 2021. If there are multiple light-emitting elements 2022 within the internal cavity U of the housing 2022, the multiple light-emitting elements 2022 are connected via wires 2025. During the process of emitting laser light, the light-emitting element 2022 also generates heat, which can be transferred to the substrate 201, which then transfers the heat to the heat dissipation assembly 300.

[0088] Here, as shown in Figure 10, Figure 10 is a schematic structural diagram of another light-emitting device provided in an embodiment of the present application. The housing 2021 may include: a side panel 21a fixedly connected to the substrate 201, and a light-transmitting member 21b fixedly connected to the side of the side panel 21a facing away from the substrate 201. The side panel 21a may be annular, and the light-emitting member 2021 may be located within the area enclosed by the side panel 21a. After the two sides of the side panel 21a are respectively connected to the substrate 201 and the light-transmitting member 21b, the area enclosed by the side panel 21a can be sealed as an internal cavity U through the cooperation of the substrate 201 and the light-transmitting member 21b. The laser light emitted by the light-emitting member 2022 located in the internal cavity U can be emitted to the outside of the housing 2021 through the light-transmitting member 21b. Optionally, the material of the light-transmitting member 21b may be optical glass, crystal, sapphire, etc. with high light transmittance; the light-transmitting member 21b may be a plate-shaped member, or the light-transmitting member 21b may be a lens with a focusing function.

[0089] In the embodiment of the present application, there are various types of light emitting devices 202 ′, and the embodiment of the present application will use the following two cases as examples for illustration.

[0090] In the first case, the structure of the light-emitting device can be similar to that shown in Figure 3. This light-emitting device is formed using a ceramic packaging process. Specifically, the housing can include a ceramic component made of a ceramic material. For example, the side panels surrounding the light-emitting component can be ceramic components. The substrate 201 can be a printed circuit board, and the housing and substrate 201 are integrally welded to facilitate integration and miniaturization of the light-emitting device. Alternatively, multiple housings can be provided on a single substrate 201, each housing housing housing multiple light-emitting components 2022.

[0091] Furthermore, the material of the shell can be selected from ceramic materials such as Al2O3 or AlN. Based on cost considerations, this application can use Al2O3 ceramic material; and the substrate 201 uses metal material. In order to improve the heat dissipation or thermal conductivity of the substrate 201, the substrate 201 can be selected from metal materials such as oxygen-free copper, red copper, tungsten copper, etc.

[0092] In the second case, as shown in Figures 9 and 10 , the light-emitting device 200' is formed using a metal packaging process. Specifically, the housing 2021 of the light-emitting portion 202' comprises a metal component. For example, the side panels 21a surrounding the light-emitting element 2022 in the housing 2021 are metal components. The substrate 201 can be a metal base plate made of metal.

[0093] In this case, the light-emitting portion 202' of the light-emitting device 200' may further include a conductive member 2023. Referring to Figures 11 and 12, Figure 11 is a top view of the light-emitting device shown in Figure 9, and Figure 12 is a side view of the light-emitting device shown in Figure 9. The conductive member 2023 may pass through the housing 2021. A first end of the conductive member 2023 may be located outside the internal cavity U of the housing 2021, while a second end of the conductive member 2023 may be located within the internal cavity U and electrically connected to the light-emitting member 2022. The second end of the conductive member 2023 may be electrically connected to the light-emitting member 2022 via a wire 2025.

[0094] In the embodiment of the present application, the conductive member 2023 can serve as a lead on the light-emitting device 200', allowing the light-emitting device 200' to be connected to an external power supply via the conductive member 2023. For example, as shown in Figure 13, Figure 13 is a schematic diagram of the connection between a light-emitting device and a power supply provided in an embodiment of the present application. The power supply 400 is located outside the housing 2021, and the first end of the conductive member 2023 can be electrically connected to the power supply 400. The power supply 400 transmits a pulsed current to the light-emitting element 2022 through the conductive member 2023, enabling the light-emitting element 2022 to emit laser light.

[0095] It should be noted that after the power supply 400 inputs a pulse current to the light-emitting device 200' through the conductive member 2023, the light-emitting device 200' generates noise during operation. Currently, noise-reducing foam is placed around the light-emitting device 200' to absorb and isolate the noise. However, the noise reduction effect of the noise-reducing foam is limited, and the noise affects the user experience. The applicants of this application have discovered through experiments that the noise is primarily generated by the conductive member 2023 on the light-emitting device 200'. For example, if the conductive member 2023 is made of a magnetic metal, the conductive member 2023 may be magnetic. Thus, when the power supply 400 inputs a pulse current to the light-emitting device 200' through the conductive member 2023, the pulse current flowing through the magnetic conductive member 2023 causes magnetostriction in the conductive member 2023, which in turn generates noise.

[0096] To this end, in the embodiment of the present application, the conductive member 2023 of the light-emitting portion 202' of the light-emitting device 200' is made of a non-magnetic metal material. That is, the conductive member 2023 can be made of a non-magnetic metal material. Thus, after the power supply 400 transmits a pulse current to the light-emitting member 2022 via the conductive member 2023, because the conductive member 2023 is made of a non-magnetic metal material, the pulse current will not cause magnetostriction in the conductive member. Consequently, the conductive member 2023 will not generate noise due to magnetostriction. This can significantly reduce or even eliminate noise generated during the operation of the light-emitting device 200', thereby improving the user experience.

[0097] Furthermore, testing revealed that using a non-magnetic metal material for the conductive member 2023 reduced noise by 1.2 dB compared to the pre-processing stage. The number and peak values ​​of harmonics above 1 kHz, which impact the user's subjective experience, were significantly reduced. It should be noted that, in addition to the conductive member 2023, other electronic components may also be present on the light-emitting device 200', generating noise. If these electronic components are present, using a non-magnetic metal material for the conductive member 2023 will still generate noise, but the noise generated by the light-emitting device 200' will be significantly reduced. If these electronic components are not present, using a non-magnetic metal material for the conductive member 2023 will completely eliminate the noise generated by the light-emitting device 200'.

[0098] In one possible implementation, the conductive member 2023 can be a solid structure made of a single non-magnetic metal material. That is, the conductive member 200 can be a non-magnetic single metal wire, such as copper, silver, or aluminum. Single metal wires are readily available and can reduce the manufacturing cost of the light-emitting device 200'.

[0099] In another possible implementation, as shown in FIG14 , FIG14 is a cross-sectional view of a conductive member provided in an embodiment of the present application. The conductive member 2023 may include: a conductive rod 23a and a conductive sleeve 23b. The conductive sleeve 23b may be sleeved on the conductive rod 23a and fixedly connected to the conductive rod 23a. The non-magnetic metal material used to prepare the conductive rod 23a is different from the non-magnetic metal material used to prepare the conductive sleeve 23b. In this case, by forming the conductive member 2023 with the conductive rod 23a and the conductive sleeve 23b of different non-magnetic metal materials, the conductive member 2023 can simultaneously have the different properties of two non-magnetic metal materials, thereby expanding the applicable scenarios of the conductive member 2023.

[0100] For example, the bending strength of the conductive rod 23a can be greater than that of the conductive sleeve 23b, and the conductivity of the conductive rod 23a can be less than that of the conductive sleeve 23b. In this way, the bending strength of the conductive member 2023 can be ensured by the conductive rod 23a, while the conductivity of the conductive sleeve 23b can be ensured by the conductive sleeve 23b. To this end, by combining two different non-magnetic metal materials, the conductive member 2023 can simultaneously exhibit excellent bending resistance and conductivity. For example, the conductive rod 23a can be made of copper, and the conductive sleeve 23b can be made of silver; alternatively, the conductive rod 23a can be made of aluminum, and the conductive sleeve 23b can be made of copper. It should be noted that bending strength can be used to measure a material's ability to withstand bending and its durability, while conductivity can be used to measure a material's conductive properties.

[0101] For example, the thermal expansion coefficient of the conductive rod 23a can be greater than the thermal expansion coefficient of the conductive sleeve 23b. Since one end of the conductive member 2023 passes through the housing 2021 and enters the internal cavity U, after the conductive member 2023 expands due to heat, the conductive rod 23a can expand to a greater extent and squeeze the conductive sleeve 23b, so that there is no gap between the conductive rod 23a and the conductive sleeve 23b, thereby ensuring the sealing of the internal cavity U of the housing 2021.

[0102] In the embodiment of the present application, as shown in FIG15 , which is a cross-sectional view of the light-emitting device shown in FIG11 at point AA, the light-emitting portion 202′ may further include a sealant 2024. The housing 2021 also has a through hole Q, which extends through the housing 2021 along its thickness and communicates with the internal cavity U.

[0103] Among them, the conductive member 2023 can pass through the through hole Q, and the sealing member 2024 is located between the conductive member 2023 and the hole wall of the through hole Q. Here, since the sealing member 2024 is provided between the conductive member 2023 and the hole wall of the through hole Q, the internal cavity U of the shell 2021 will not be connected to the outside of the shell 2021. In this way, the sealing of the internal cavity U is improved, and the light-emitting member 2022 can work stably in the closed cavity. For example, as shown in Figure 16, Figure 16 is a partial enlarged view of the light-emitting device shown in Figure 15 at B, and the sealing member 2024 can be filled into the entire gap in the through hole Q to ensure the reliability of the seal; or, as shown in Figure 17, Figure 17 is another partial enlarged view of the light-emitting device shown in Figure 15 at B, and the sealing member 2024 can also be filled into part of the gap in the through hole Q.

[0104] In the embodiment of the present application, as shown in FIG. 16 and FIG. 17 , the sealing member 2024 may include: an insulating layer 24 a and a buffer layer 24 b , and the insulating layer 24 a and the buffer layer 24 b are connected along the radial direction of the through hole Q.

[0105] The absolute value of the difference between the thermal expansion coefficients of the insulating layer 24a and the buffer layer 24b is less than a first set value. The insulating layer 24a provides insulation, preventing electrical connection between the conductive member 2023 and the housing 2021. For example, the buffer layer 24b may be a Kovar metal layer, and the insulating layer 24a may be a glass insulating layer 24a or a ceramic insulating layer 24a. The insulating layer 24a, the buffer layer 24b, and the conductive member 2023 may be connected together by sintering.

[0106] It should be noted that the coefficient of thermal expansion of the insulating material in the insulating layer 24a is generally smaller than that of the non-magnetic metal in the conductive member 2023. Therefore, after the conductive member 2023 thermally expands, it may exert stress on the insulating layer 24a, causing the insulating layer 24a to crack, thereby affecting the sealing of the internal cavity U. In addition, due to the difference in thermal expansion coefficients between the housing 2021 and the insulating layer 24a, the housing 2021 may also exert stress on the insulating layer 24a, causing the insulating layer 24a to crack.

[0107] In the embodiment of the present application, because the thermal expansion coefficient of the insulating layer 24a is close to that of the buffer layer 24b, the two expand to the same degree during thermal expansion. The buffer layer 24b can absorb some of the stress applied to the insulating layer 24a by the conductive member 2023 or the housing 2021, thereby preventing the insulating layer 24a from being subjected to excessive stress and cracking. Therefore, the provision of the buffer layer 24b can alleviate the cracking of the insulating layer caused by the mismatch in the thermal expansion coefficients of the insulating layer 24a, the conductive member 2023, or the housing 2021, and ensure the sealing of the internal cavity U.

[0108] For example, when both the insulating layer 24a and the buffer layer 24b are formed on one side, as shown in FIG16 , the buffer layer 24b may be located between the insulating layer 24a and the conductive member 2023. In this case, the buffer layer 24b can better mitigate the cracking of the insulating layer caused by the mismatch in thermal expansion coefficients between the insulating layer 24a and the conductive member 2023. Alternatively, as shown in FIG18 , which is another partial enlarged view of the light-emitting device shown in FIG15 at position B, the buffer layer 24b may be located between the insulating layer 24a and the wall of the through-hole Q. In this case, the buffer layer 24b can better mitigate the cracking of the insulating layer caused by the mismatch in thermal expansion coefficients between the insulating layer 24a and the housing 2021.

[0109] For example, as shown in Figures 19 and 20, when the total number of insulating layers 24a and buffer layers 24b is greater than two, the insulating layers 24a and buffer layers 24b are alternately arranged in a radial direction of the through-hole Q. With this arrangement, the alternately arranged insulating layers 24a and buffer layers 24b can better absorb stress from the conductive member 2023 or the housing 2021, dispersing the stress in different insulating layers 24a and buffer layers 24b, further preventing the occurrence of insulation layer cracking.

[0110] In an embodiment of the present application, the absolute value of the difference between the thermal expansion coefficient of the shell 2021 near the through hole Q and the thermal expansion coefficient of the insulating layer 24a is less than the second set value; and / or the absolute value of the difference between the thermal expansion coefficient of the conductive member 2023 and the thermal expansion coefficient of the insulating layer 24a is less than the second set value.

[0111] Here, when the absolute value of the difference between the thermal expansion coefficient of the shell 2021 near the through hole Q and the thermal expansion coefficient of the insulating layer 24a is less than the second set value, after the shell 2021 and the insulating layer 24a undergo thermal expansion, the stress exerted by the shell 2021 on the insulating layer 24a can be reduced because the thermal expansion coefficients of the two are close.

[0112] When the absolute value of the difference between the thermal expansion coefficient of the conductive member 2023 and the thermal expansion coefficient of the insulating layer 24a is less than the second set value, after the conductive member 2023 and the insulating layer 24a undergo thermal expansion, the stress exerted by the conductive member 2023 on the insulating layer 24a can be reduced because their thermal expansion coefficients are close.

[0113] It should be noted that the first set value and the second set value may be the same or different. This embodiment of the present application does not limit this. The second set value here can be determined according to actual needs. When the sealing requirements of the housing 2021 are high, the second set value can be selected to be smaller; when the sealing requirements of the housing 2021 are low, the second set value can be selected to be larger.

[0114] In an embodiment of the present application, as shown in Figure 21, which is a cross-sectional view of the light-emitting device shown in Figure 10, the through-hole Q can be provided on the side plate 21a. Here, the side plate 21a can be made of a Kovar metal member, and the buffer layer 24b in the seal 2024 can be made of a Kovar metal layer. In other words, the side plate 21a and the buffer layer 24b are made of the same material. As a result, the thermal expansion coefficients of the side plate 21a and the seal 2024 are similar, thereby reducing the stress exerted on the insulating layer 24a by the housing 2021 during thermal expansion.

[0115] It should be noted that, when the light-emitting device 200' is formed using a metal packaging process, the above embodiment is schematically described using an example in which the first end of the conductive member 2023 is located outside the internal cavity U of the housing 2021, and the second end of the conductive member 2023 is located within the internal cavity U of the housing 2021 and electrically connected to the light-emitting member 2022. In other possible implementations, the conductive members 2023 may all be distributed outside the internal cavity U of the housing 2021.

[0116] For example, please refer to Figures 22, 23, and 24. Figure 22 is a schematic structural diagram of a light-emitting device provided in another embodiment of the present application, Figure 23 is a cross-sectional view of the light-emitting device shown in Figure 22, and Figure 24 is a cross-sectional view of the light-emitting device shown in Figure 22. The light-emitting portion 202' may include: a housing 2021, a light-emitting element 2022, a conductive element 2023, an insulating portion 2026, and a conductive sheet 2027.

[0117] Here, the structure and distribution relationship between the housing 2021 and the light-emitting element 2022 can refer to the contents of the embodiments corresponding to Figures 9 and 10 above, and will not be repeated here.

[0118] The housing 2021 may have a strip-shaped through hole L, and the insulating portion 2026 may be located within the strip-shaped through hole L and fixedly connected to the housing 2021. The insulating portion 2026 may have an opening Z corresponding to the conductive sheet 2027. The conductive sheet 2027 may pass through the opening Z, so that the first end of the conductive sheet 2027 may be located outside the internal cavity U of the housing 2021, and the second end of the conductive sheet 2027 may be located inside the internal cavity U of the housing 2021. Here, the first end of the conductive sheet 2027 located outside the internal cavity U may be electrically connected to the end of the conductive member 2023. For example, the conductive member 2023 may be fixed to the first end of the conductive sheet 2027 by welding. In this way, the conductive members 2023 may be distributed entirely outside the internal cavity U of the housing 2021. The second end of the conductive sheet 2027 located inside the internal cavity U may be electrically connected to the light-emitting member 2022. For example, the second end of the conductive sheet 2027 may be electrically connected to the light-emitting element 2022 via the wire 2025 .

[0119] It should be noted that the strip-shaped through hole L can be provided on the annular side plate 21a in the housing 2021, and the side plate 21a is also made of a metal material. Therefore, by providing the insulating portion 2026 within the strip-shaped through hole L, a short circuit between the conductive sheet 2027 and the side plate 21a can be prevented. The insulating portion 2026 can be made of a ceramic material.

[0120] In the embodiment of the present application, when the conductive members 2023 are all distributed outside the internal cavity U of the shell 2021, the conductive members 2023 can also be made of non-magnetic metal materials. In this way, after the pulse current is applied to the conductive members 2023, the pulse current will not cause the conductive members 2023 to exhibit magnetostriction, so that the conductive members 2023 will not generate noise due to the magnetostriction phenomenon, thereby significantly alleviating or even eliminating the noise generated by the light-emitting device 200' during operation. It should be noted that since the probability of the conductive sheet 2027 exhibiting magnetostriction is low, the conductive sheet 2027 can be made of non-magnetic metal materials or other common metal materials. The embodiment of the present application does not limit this.

[0121] Based on the above embodiments, the present application also provides a laser projection device. Please refer to Figure 25, which is a schematic diagram of the structure of a laser projection device provided in an embodiment of the present application. Laser projection device 00 may include: a laser projection light source 01, a light modulation component 02, and a projection lens 03. Laser projection light source 01 may be the laser projection light source in the above embodiments. The specific structure, operating principle, and function of the laser projection light source have been described in detail in the aforementioned embodiment 1 and will not be repeated here.

[0122] The light modulation component 02 may be located on the light-emitting side of the laser projection light source 01 and may be used to modulate the light emitted by the laser projection light source 01. The projection lens 03 may be located on the light-emitting side of the light modulation component 02.

[0123] It should be noted that the laser projection device 00 may further include a housing 04. FIG24 only shows a portion of the housing 04.

[0124] Exemplarily, laser projection light source 01 is configured to provide an illumination beam (also referred to as a laser beam). Light modulation component 02 is configured to modulate the illumination beam provided by laser projection light source 01 using an image signal to obtain a projection beam. Projection lens 03 is configured to project the projection beam onto a screen or wall to form a projection image. Laser projection light source 01, light modulation component 02, and projection lens 03 can be assembled in housing 04. Laser projection light source 01, light modulation component 02, and projection lens 03 can be connected sequentially along the direction of beam propagation.

[0125] The laser projection light source 01, light modulation assembly 02, and projection lens 03 can each be enclosed by a corresponding housing. The housings corresponding to the laser projection light source 01, light modulation assembly 02, and projection lens 03 can support the corresponding optical components and ensure that each optical component meets certain sealing or airtight requirements.

[0126] One end of the light modulation component 02 is connected to the projection lens 03, and the light modulation component 02 and the projection lens 03 are arranged along the emission direction (for example, parallel to the N direction) of the projection beam of the laser projection device 00. The other end of the light modulation component 02 can be connected to the laser projection light source 01.

[0127] In some embodiments, the arrangement direction of the laser projection light source 01 and the light modulation assembly 02 is approximately perpendicular to the arrangement direction of the light modulation assembly 02 and the projection lens 03. That is, in the laser projection device 00, the emission direction of the projection light beam (e.g., parallel to the N direction) is approximately perpendicular to the emission direction of the illumination light beam (e.g., parallel to the M direction). This connection structure not only adapts to the optical path characteristics of the reflective light valve (described below) in the light modulation assembly 02, but also helps shorten the length of the optical path in one direction, thereby providing more space for arranging the various components of the laser projection device 00.

[0128] In an embodiment of the present application, please refer to FIG26 , which is a schematic diagram of the projection imaging optical path of a laser projection device provided in an embodiment of the present application. The illumination beam emitted by the laser projection light source 01 enters the light modulation component 02 . The laser projection light source 01 includes a laser. In some examples, the laser can emit a blue laser, and the light source also includes a wavelength conversion device for receiving the blue laser excitation to generate other primary colors besides blue, which are together used to form the illumination beam. In some examples, the laser projection light source 01 includes a three-color laser for emitting a three-color laser beam, eliminating the need for a wavelength conversion device. The three-color laser has a wide color gamut and high brightness, and can provide a high-quality illumination beam.

[0129] Light modulation assembly 02 includes a first light homogenizing component 021, a reflector 022, a lens 023, a light valve 024, and a prism assembly 025. Light valve 024 is configured to modulate the incident illumination beam into a projection beam based on the image signal and direct the projection beam toward projection lens 03. First light homogenizing component 021 and light valve 024 are positioned sequentially along the propagation direction of the light beam. First light homogenizing component 021 is configured to homogenize the incident illumination beam and direct it toward light valve 024.

[0130] In some embodiments, the first light homogenizing component 021 is a light pipe. This light pipe receives the illumination beam provided by the laser projection light source 01 and homogenizes the illumination beam. In some embodiments, the light outlet of the light pipe is rectangular. This light pipe can shape the light spot of the light beam so that the shape of the light spot matches the shape of the light valve. In some embodiments, the first light homogenizing component 021 can also be a fly-eye lens.

[0131] Light valve 024 can be a reflective light valve. It includes multiple reflective sheets, each corresponding to a pixel in the projection image. For example, depending on the image to be displayed, the reflective sheets corresponding to the pixels to be illuminated can reflect a light beam toward projection lens 03. The light beam reflected toward projection lens 03 is called the projection beam. In this way, light valve 024 can modulate the illumination beam to generate the projection beam, which is then used to display the image.

[0132] In some embodiments, the light valve 024 is a digital micromirror device (DMD). A DMD includes multiple (e.g., tens of thousands) of individually driven, rotating micromirrors. The micromirrors can be arranged in an array. Each micromirror (e.g., each micromirror) corresponds to a pixel in the projected image to be displayed.

[0133] 26 , in some embodiments, the laser projection device 00 may further include an illumination lens assembly located between the light valve 024 and the first light homogenizing component 021. The illumination lens assembly includes a reflector 022, a lens 023, and a prism assembly 025. The light beam homogenized by the first light homogenizing component 021 may be directed toward the light valve 024 through the illumination lens assembly.

[0134] The illumination beam emitted from the first light homogenizing member 021 is directed to the reflector 022, which reflects the illumination beam to the convex lens 023. The convex lens 023 converges the illumination beam to the prism assembly 025, which reflects the illumination beam to the light valve 024.

[0135] Based on the above embodiment, the present application also provides a projection system. Please refer to Figure 27, which is a schematic diagram of the structure of a projection system provided in an embodiment of the present application. The projection system may include: a laser projection device 00 and a projection screen 10. Here, the laser projection device 00 can be the laser projection device shown in the above embodiment. The laser projection device 00 is used to project a projection image onto the projection screen 10. The specific structure, working principle, and function of the laser projection device have been described in detail in the above embodiment 1 and will not be repeated here.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

[0137] For ease of explanation, the above description has been presented in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations are possible. The above embodiments have been selected and described to better explain the principles and practical applications, thereby enabling those skilled in the art to better utilize the embodiments and various variations of the embodiments suitable for specific use considerations.

Claims

1. A laser projection light source, characterized in that, Comprising: A light source main body (100) and a heat dissipation component (300); The light source main body (100) has a device to be heat dissipated (200), and the device to be heat dissipated (200) includes: a substrate (201), a device body (202), and a component to be avoided (203); The substrate (201) has a first surface (S1) and a second surface (S2) which are oppositely arranged, and an avoidance groove (K); the device body (202) is connected to the second surface (S2), the notch (K1) of the avoidance groove (K) is located on the first surface (S1), at least part of the component to be avoided (203) is located in the avoidance groove (K1), and the end of the part of the component to be avoided (203) located in the avoidance groove (K) that faces away from the second surface (S2) does not protrude from the notch (K1); The heat dissipation component (300) has a heat conduction surface (S3) that fits with the first surface (S1), and the heat conduction surface (S3) covers at least part of the orthographic projection of the component to be avoided (203) on the first surface (S1).

2. The laser projection light source according to claim 1, wherein The avoidance grooves (K) are distributed at the edge positions of the substrate, and the side surface (S4) of the substrate (201) has an opening (K2) that communicates with the avoidance groove (K), and the side surface (S4) is respectively connected to the first surface (S1) and the second surface (S2).

3. The laser projection light source according to claim 1 or 2, characterized in that, The light source main body (100) further includes: a support member (101), the device to be heat dissipated (200) is mounted on the support member (101) through the component to be avoided (203), and the second surface (S2) faces the support member (101).

4. The laser projection light source according to claim 3, characterized in that, The substrate (201) further has a through hole (V1), one end orifice of the through hole (V1) is located on the second surface (S2), and the other end orifice of the through hole (V1) is located on the bottom surface (K3) of the avoidance groove (K); A part of the component to be avoided (203) is located in the avoidance groove (K) and abuts against the bottom surface (K3); another part of the component to be avoided (203) passes through the through hole (V1) to be connected to the support member (101).

5. The laser projection light source according to claim 4, characterized in that, The support member (101) has a connection hole (V2); The connection hole (V2) communicates with the through hole (V1), and the component to be avoided (203) is connected to the connection hole (V1) after passing through the through hole (V1).

6. The laser projection light source according to claim 5, characterized in that, The support member (101) further has a support post (102), and the support post (102) is configured to: after the heat conduction surface (S3) fits with the first surface (S1), be connected to the part of the heat dissipation component (300) where the heat conduction surface (S3) is provided.

7. The laser projection light source according to any one of claims 1-6, characterized in that The heat dissipation component (300) includes: a heat sink (301) and a heat pipe (302); Wherein, along the extending direction of the heat pipe (302), the two ends of the heat pipe (302) respectively have an evaporation section (3021) for absorbing heat and a condensation section (3022) for releasing heat; the condensation section (3022) is in thermal conduction with the heat sink (301), and the evaporation section (3021) is in thermal conduction with the device to be heat dissipated (200).

8. The laser projection light source according to claim 7, characterized in that, The outer tube surface of the evaporation section (3021) is in contact with the first surface (S1); Alternatively, the heat dissipation component (300) further includes: a heat conduction block (303), the heat conduction block (303) is connected to the evaporation section (3021), and the surface of the heat conduction block (303) in contact with the first surface (S1) is the heat conduction surface (S3).

9. The laser projection light source according to claim 8, wherein, The number of the heat pipes (302) is multiple; and the heat conduction block (303) has a plurality of insertion holes (P) that can penetrate through the heat conduction block (303), the plurality of insertion holes (P) correspond to the multiple heat pipes (302) one by one, and the evaporation section (3021) in each heat pipe (302) is located in the corresponding insertion hole (P); Wherein, the penetrating direction of each of the insertion holes (P) is parallel to the heat conduction surface (S3); and the positive projection of at least one of the insertion holes (P) on the heat conduction surface (S3) overlaps with the positive projection of the component to be avoided (203) on the heat conduction surface (S3).

10. The laser projection light source according to any one of claims 1-9, characterized in that, The device to be cooled (200) is a light-emitting device (200’), and the device body (202) is the light-emitting part (202’) in the light-emitting device (200’).

11. The laser projection light source according to claim 10, characterized in that, The light-emitting part (202’) includes: a housing (2021), a light-emitting component (2022), and a conductive component (2023); The housing (2021) has a sealed internal cavity (U); The light-emitting component (2022) is located in the internal cavity (U); The conductive component (2023) passes through the housing (2021), the first end of the conductive component (2023) is located outside the internal cavity (U), and the second end of the conductive component (2023) is located in the internal cavity (U) and is used for electrically connecting with the light-emitting component (2022); Wherein, the material of the conductive component (2023) includes: a non-magnetic metal material.

12. The laser projection light source according to claim 11, wherein The conductive component (2023) is a solid structure made of the same non-magnetic metal material.

13. The laser projection light source according to claim 11, wherein, The conductive component (2023) includes: a conductive rod body (23a) and a conductive sleeve (23b), the conductive sleeve (23b) is sleeved on the conductive rod body (23a) and is fixedly connected to the conductive rod body (23a); Wherein, the non-magnetic metal material used to prepare the conductive rod body (23a) is different from the non-magnetic metal material used to prepare the conductive sleeve (23b).

14. The laser projection light source according to claim 13, wherein The anti-bending strength of the conductive rod body (23a) is greater than that of the conductive sleeve (23b), and the conductivity of the conductive rod body (23a) is less than that of the conductive sleeve (23b).

15. The laser projection light source according to claim 13, characterized in that, The thermal expansion coefficient of the conductive rod body (23a) is greater than that of the conductive sleeve (23b).

16. The laser projection light source according to any one of claims 11-15, characterized in that, The light-emitting part (202’) further includes: a sealing member (2024); The housing (2021) further has a through hole (Q) that penetrates the housing (2021) in the thickness direction of the housing (2021) and communicates with the internal cavity (U); the conductive member (2023) passes through the through hole (Q), and the seal (2024) is located in the gap between the conductive member (2024) and the hole wall of the through hole (Q).

17. The laser projection light source according to claim 16, wherein The seal (2024) includes: an insulating layer (24a) and a buffer layer (24b), and the insulating layer (24a) and the buffer layer (24b) are connected in the radial direction of the through hole (Q); the absolute value of the difference between the thermal expansion coefficient of the insulating layer (24a) and the thermal expansion coefficient of the buffer layer (24b) is less than a first set value.

18. The laser projection light source according to claim 17, characterized in that, When the number of layers of both the insulating layer (24a) and the buffer layer (24b) is one layer, the buffer layer (24a) is located between the insulating layer (24b) and the conductive member (2023), or the buffer layer (24a) is located between the insulating layer (24a) and the hole wall of the through hole (Q); When the total number of layers of the insulating layer (24a) and the buffer layer (24b) is greater than two layers, the insulating layer (24a) and the buffer layer (24b) are alternately arranged in the radial direction of the through hole (Q) in sequence.

19. The laser projection light source according to claim 17, characterized in that, The absolute value of the difference between the thermal expansion coefficient of the housing (2021) near the through hole (Q) and the thermal expansion coefficient of the insulating layer (24a) is less than a second set value; and / or the absolute value of the difference between the thermal expansion coefficient of the conductive member (2023) and the thermal expansion coefficient of the insulating layer (24a) is less than a second set value.

20. A laser projection device, characterized in that, Comprising a laser projection light source according to any one of claims 1-19, and a light modulation component and a projection lens; The light modulation component is located on the light-emitting side of the laser projection light source, and the light modulation component is configured to modulate the light emitted by the laser projection light source; The projection lens is located on the light-emitting side of the light modulation component.

Images