Light emitting device, method of manufacturing the same, and laser projection apparatus

Abstract

A light emitting device (2000), a preparation method thereof and a laser projection equipment (10). The light emitting device (2000) comprises a light emitting assembly (200) and a substrate (100). The substrate (100) comprises a substrate body, at least one connecting pattern (13), a plurality of interconnection regions (12) and a plurality of first pads (11). The light emitting assembly (200) is fixed on the at least one connecting pattern (13) and comprises at least one tube shell (202), a conductive structure (24), a first wire (23) and a plurality of laser chips (203, 221, 222, 223). At least one of the side wall or the bottom wall of the at least one tube shell (202) is provided with the first wire (23). The plurality of laser chips (203, 221, 222, 223) are arranged in the at least one tube shell (202) and are electrically connected with the wire (23), and the plurality of laser chips (203, 221, 222, 223) emit at least two different color lasers.

Description

Light-emitting device and preparation method thereof, laser projection equipment

[0001] This application claims priority to Chinese patent application No. 202311683844.6 filed on December 8, 2023; and priority to Chinese patent application No. 202410089831.4 filed on January 22, 2024, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of laser technology, and in particular to a light-emitting device and a preparation method thereof, and a laser projection device. Background Art

[0003] With the improvement of living standards, people's demand for high-color and high-brightness TV products has increased year by year, and the advantages of laser projection equipment have been clearly revealed. In recent years, the convenient laser projection equipment has been very popular in the market, and miniaturized laser projection equipment has emerged. Summary of the Invention

[0004] Some embodiments of the present disclosure provide a light-emitting device and a method for preparing the same, as well as a laser device, for resolving the problem that the number of laser chips used is limited by the driving circuit. While increasing the power of the laser chip, the number of driving circuits can remain unchanged, thereby effectively improving the working efficiency of the driving circuit and reducing costs.

[0005] In one aspect, a light-emitting device is provided. The light-emitting device includes a substrate and a light-emitting component. The substrate includes a substrate body, at least one connection pattern, multiple interconnection regions, and multiple groups of first solder pads. The at least one connection pattern is provided on the substrate body and includes a conductive portion. The multiple interconnection regions are provided on the substrate body. The multiple groups of first solder pads are provided on the substrate body and electrically connected to the conductive portion via the multiple interconnection regions. Each group of first solder pads includes two first solder pads with different polarities. The light-emitting component is secured to the at least one connection pattern and includes at least one housing, a conductive structure, traces, and multiple laser chips. A first trace is provided on at least one of the sidewalls or bottom wall of the at least one housing. The conductive structure is provided on the side of the at least one housing facing the substrate and is electrically connected to the first trace and the conductive portion. The multiple laser chips are provided within the at least one housing and electrically connected to the first trace. The multiple laser chips emit laser light of at least two different colors. Among the multiple laser chips, a single laser chip is electrically connected to any of the groups of first solder pads.

[0006] The light-emitting device of some embodiments of the present disclosure includes a substrate and a light-emitting component. The light-emitting component is fixed on the connection pattern of the substrate, and any laser chip is electrically connected to the corresponding two first pads through a first trace, a conductive structure, a conductive portion, and an interconnection area. In this way, separate power supply can be provided to laser chips with different light-emitting colors, solving the problem that the number of laser chips used is limited by the number and cost of driving circuits. When the number of laser chips is increased, the number of driving circuits remains unchanged, thereby effectively improving the working efficiency of the driving circuit and reducing costs.

[0007] In another aspect, a laser projection device is provided. The laser projection device includes a light source assembly, an optical modulation assembly, and a lens. The light source assembly is configured to emit an illumination beam; the light source assembly includes the light-emitting device; the optical modulation assembly is configured to modulate the illumination beam provided by the light source assembly to obtain a projection beam; and the lens is configured to image the projection beam.

[0008] The laser projection equipment of some embodiments of the present disclosure includes the above-mentioned light-emitting device, which can realize separate power supply for laser chips with different light emission colors, solving the problem that the number of laser chips used is limited by the number and cost of driving circuits, so that while the number of laser chips is increased, the number of driving circuits remains unchanged, effectively improving the working efficiency of the driving circuit and reducing costs.

[0009] On the other hand, a method for preparing a light-emitting device is provided. The light-emitting device includes a substrate, a light-emitting component, and the light-emitting component includes a laser chip, a first accommodating structure, a cover plate, and a plurality of first sealing parts. The method includes: providing the laser chip, the first accommodating structure, the cover plate, and the plurality of first sealing parts; arranging the laser chip in the first accommodating structure; arranging the plurality of first sealing parts on the side of the cover plate facing the first accommodating structure; arranging adjacent two first sealing parts of the plurality of first sealing parts at intervals; connecting the first accommodating structure and the cover plate through the plurality of first sealing parts, so that any two adjacent first sealing parts contact each other to connect the first accommodating structure and the cover plate, so as to close the gap at the connection between the first accommodating structure and the cover plate to form the light-emitting component; and electrically connecting the light-emitting component to the substrate.

[0010] Some embodiments of the present disclosure provide methods for preparing light-emitting devices. Multiple, mutually separated first sealing portions are used to seal a first housing structure and a cover plate, thereby sealing a laser chip within the tube housing and isolating the laser chip from the outside world. This reduces overflow from the first sealing portions, thereby avoiding or reducing holes and minimizing the impact on the laser chip. In another aspect, a light-emitting device is provided. The light-emitting device is prepared by the method. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the implementation methods of some embodiments of the present disclosure or related technologies, the following will briefly introduce the drawings required for use in the description of some embodiments of the present disclosure or related technologies. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0012] FIG1 is a structural diagram of a laser projection device according to some embodiments;

[0013] FIG2 is a light path diagram of a light source assembly, an optical modulation assembly, and a lens in a laser projection device according to some embodiments;

[0014] FIG3 is a schematic diagram showing a laser projection device projecting an image according to some embodiments;

[0015] FIG4 is a schematic diagram illustrating the operation of a micro reflective lens according to some embodiments;

[0016] FIG5 is a structural diagram of a light emitting device in the related art;

[0017] FIG6 is another structural diagram of a light emitting device in the related art;

[0018] FIG7 is a structural diagram of a light emitting device according to some embodiments;

[0019] FIG8 is another structural diagram of a light emitting device according to some embodiments;

[0020] FIG9 is another structural diagram of a light emitting device according to some embodiments;

[0021] FIG10 is a structural diagram of a cover plate and a plurality of first sealing portions according to some embodiments;

[0022] FIG11 is another structural diagram of a cover plate and a plurality of first sealing portions according to some embodiments;

[0023] FIG12 is another structural diagram of a cover plate and a plurality of first sealing portions according to some embodiments;

[0024] FIG13 is a structural diagram of a housing structure according to some embodiments;

[0025] FIG14 is a structural diagram of multiple accommodation structures according to some embodiments;

[0026] FIG15 is an exploded view of a light emitting assembly according to some embodiments;

[0027] FIG16 is another structural diagram of a light emitting device according to some embodiments;

[0028] FIG17 is a diagram showing the working principle of a light emitting device in the related art;

[0029] FIG18 is a circuit diagram of a plurality of laser chips using a common anode wiring method in the related art;

[0030] FIG19 is a circuit diagram of a plurality of laser chips using a common cathode wiring method in the related art;

[0031] FIG20 is another structural diagram of a light emitting device according to some embodiments;

[0032] FIG21 is a structural diagram of a substrate according to some embodiments;

[0033] FIG22 is another structural diagram of a substrate according to some embodiments;

[0034] FIG23 is a block diagram of a lighting device according to some embodiments;

[0035] FIG24 is a structural diagram of a side of a housing facing a substrate according to some embodiments;

[0036] FIG25 is a circuit diagram of a light emitting device according to some embodiments;

[0037] FIG26 is another structural diagram of a light emitting device according to some embodiments;

[0038] FIG27 is a circuit diagram of a temperature measurement component according to some embodiments;

[0039] FIG28 is another structural diagram of a substrate according to some embodiments;

[0040] FIG29 is another structural diagram of a substrate according to some embodiments;

[0041] FIG30 is another structural diagram of a substrate according to some embodiments;

[0042] FIG31 is a circuit diagram of a housing according to some embodiments;

[0043] FIG32 is another structural diagram of a light emitting device according to some embodiments;

[0044] FIG33 is a structural diagram of wiring within a first tube shell according to some embodiments;

[0045] FIG34 is a top view of traces within a first housing according to some embodiments;

[0046] FIG35 is another structural diagram of a light emitting device according to some embodiments;

[0047] FIG36 is a structural diagram of wiring within a second tube shell according to some embodiments;

[0048] FIG37 is a top view of traces within a second housing according to some embodiments;

[0049] FIG38 is another structural diagram of a light emitting device according to some embodiments;

[0050] FIG39 is a structural diagram of a plurality of tube shells according to some embodiments;

[0051] FIG40 is another structural diagram of a substrate according to some embodiments;

[0052] FIG41 is another structural diagram of a light emitting device according to some embodiments;

[0053] FIG42 is another structural diagram of a side of a housing facing a substrate according to some embodiments;

[0054] FIG43 is a structural diagram of a light emitting assembly according to some embodiments;

[0055] FIG44 is another structural diagram of a substrate according to some embodiments;

[0056] FIG45 is a top view of wiring within a housing according to some embodiments;

[0057] FIG46 is another structural diagram of a light emitting device according to some embodiments;

[0058] FIG47 is another structural diagram of a side of a housing facing a substrate according to some embodiments;

[0059] FIG48A is a flow chart of a method for preparing a light emitting device according to some embodiments;

[0060] FIG48B is another flow chart of a method for preparing a laser projection device according to some embodiments;

[0061] FIG49 is another flow chart of a method for manufacturing a laser projection device according to some embodiments;

[0062] FIG50 is another flow chart of a method for manufacturing a laser projection device according to some embodiments;

[0063] FIG51 is a structural diagram of a cover plate and a second sealing portion according to some embodiments;

[0064] FIG52 is a structural diagram of a cover plate, a plurality of first sealing portions, and a second sealing portion according to some embodiments;

[0065] FIG53 is a structural diagram of a light emitting assembly according to some embodiments;

[0066] FIG54 is another structural diagram of a light emitting device according to some embodiments;

[0067] FIG. 55 is a partial structural diagram of a cover plate according to some embodiments. DETAILED DESCRIPTION

[0068] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0069] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0070] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of some embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0071] When describing some embodiments, the word "connected" and its derivatives may be used. The term "connected" should be understood broadly. For example, "connected" can mean fixed, removable, or integrated; it can be directly connected or indirectly connected through an intermediary. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0072] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0073] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0074] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0075] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0076] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0077] As used herein, "parallel," "perpendicular," and "equal" include the stated conditions and conditions approximating the stated conditions within an acceptable range of deviation as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0078] FIG1 is a structural diagram of a laser projection device according to some embodiments.

[0079] Some embodiments of the present disclosure provide a laser projection device 10. As shown in FIG1 , the laser projection device 10 includes a light source assembly 500, an optical modulation assembly 600, and a lens 700. The light source assembly 500 is configured to provide an illumination beam. The optical modulation assembly 600 is configured to modulate the illumination beam provided by the light source assembly 500 using an image signal to obtain a projection beam. The lens 700 is configured to project the projection beam onto a screen or wall to form an image.

[0080] The light source assembly 500, optical modulation assembly 600, and lens 700 are sequentially connected along the direction of light beam propagation and each is enclosed by a corresponding housing. The housings of the light source assembly 500, optical modulation assembly 600, and lens 700 support each optical component and ensure that each optical component meets the predetermined sealing or airtight requirements.

[0081] As shown in Figure 1, the first end of the optical modulation component 600 is connected to the light source component 500, and the light source component 500 and the optical modulation component 600 are arranged along the exit direction of the illumination light beam of the laser projection device 10 (refer to the M direction shown in Figure 1). The second end of the optical modulation component 600 is connected to the lens 700, and the optical modulation component 600 and the lens 700 are arranged along the exit direction of the projection light beam of the laser projection device 10 (refer to the N direction shown in Figure 1). The M direction is roughly perpendicular to the N direction. On the one hand, this connection structure can adapt to the optical path characteristics of the reflective light valve in the optical modulation component 600. On the other hand, it is also beneficial to shorten the length of the optical path in one dimension, which is beneficial to the structural arrangement of the laser projection device 10.

[0082] For example, when the light source assembly 500 , the optical modulation assembly 600 and the lens 700 are arranged in one dimensional direction (eg, the M direction), the length of the light path in this dimensional direction will be very long, which is not conducive to the structural arrangement of the laser projection device 10 .

[0083] In some embodiments, the light source assembly 500 can provide three primary colors of light in a time-sequential manner (other colors of light can also be added on the basis of the three primary colors of light). Due to the persistence of vision of the human eye, the human eye sees white light formed by the mixture of the three primary colors of light. Alternatively, the light source assembly 500 can also output the three primary colors of light simultaneously to continuously emit white light. The light source assembly 500 may include a light-emitting device that can emit a laser beam of at least one color, such as a red laser beam, a blue laser beam, or a green laser beam.

[0084] Figure 2 is a light path diagram of a light source assembly, an optical modulation assembly, and a lens in a laser projection device according to some embodiments. Figure 3 is a principle diagram of projection imaging by a laser projection device according to some embodiments.

[0085] The illumination beam emitted by the light source assembly 500 enters the optical modulation assembly 600. As shown in Figures 2 and 3, the optical modulation assembly 600 includes an illumination lens assembly 501 and a light modulation device (or light valve) 502. The illumination lens assembly 501 is configured to receive the illumination beam provided by the light source assembly 500 and transmit the illumination beam to the light modulation device 502 at a set angle and direction. The light modulation device 502 is configured to modulate the illumination beam to obtain a projection beam and reflect the projection beam into the lens 700.

[0086] In some embodiments, as shown in Figures 2 and 3, the lighting lens assembly 501 includes a light homogenizing component 510, a lens assembly 520, and a prism assembly 550. The light homogenizing component 510 is configured to receive the illumination beam provided by the light source assembly 500 and homogenize the illumination beam. The lens assembly 520 is configured to converge the illumination beam emitted from the light homogenizing component 510 to the prism assembly 550. The prism assembly 550 is configured to reflect the illumination beam to the light modulation device 502.

[0087] In some embodiments, as shown in Figures 2 and 3, the light homogenizing component 510 includes a light pipe 5101. The light outlet of the light pipe 5101 can be rectangular, thereby shaping the light spot. This allows the light spot shape of the illumination beam emitted from the light pipe 5101 to match the rectangular light-receiving surface of the optical modulator 502. Alternatively, the light homogenizing component 510 can include a fly-eye lens. This fly-eye lens can homogenize the incident illumination beam and shape it to output a rectangular light spot.

[0088] 2 and 3 , the illumination lens assembly 501 further includes a reflector 530 . The reflector 530 is located on the light-emitting side of the lens assembly 520 and is configured to reflect the illumination light beam emitted from the lens assembly 520 to the prism assembly 550 .

[0089] In some embodiments, as shown in FIG. 3 , the light modulation device 502 includes a digital micromirror device (DMD) 540 .

[0090] In the optical modulation assembly 600, the DMD 540 is a core component, which is configured to use the image signal to modulate the illumination beam provided by the light source assembly 500. In other words, the DMD 540 controls the illumination beam to display different brightness and grayscale for different pixels of the image to be projected, thereby ultimately forming an optical image.

[0091] Figure 4 is a schematic diagram of the operation of a micro-reflective lens according to some embodiments. As shown in Figure 4, the light reflected by the micro-reflective lens 2401 at a negative deflection angle is called OFF light, which is invalid light.

[0092] As the miniaturization trend of light-emitting devices continues to accelerate, product size continues to decrease. This has led to increased sealing challenges. Current welding methods struggle to achieve high airtightness and are subject to issues such as solder overflow and glass stress. Glass stress refers to the rapid heating of the weld area by the high-energy laser beam during the welding process, leading to localized thermal expansion. This, combined with the poor thermal conductivity of glass, can cause significant temperature differences inside and outside the weld area, potentially leading to localized thermal stress.

[0093] Figure 5 is a structural diagram of a light emitting device in the related art. Figure 6 is another structural diagram of a light emitting device in the related art.

[0094] Generally, as shown in Figures 5 and 6, a light-emitting device 1000 includes a substrate 1001 and at least one light-emitting component 2001. The light-emitting component 2001 includes a collimating portion 201 (e.g., a collimating lens), a housing 2020, a laser chip 2030, and a deflection component 204 (e.g., a reflective prism). The laser chip 2030 and the deflection component 204 are respectively disposed within the housing 2020. The housing 2020 includes a housing structure 2021 and a cover plate 2022. The cover plate 2022 and the housing structure 2021 are interconnected to form a sealed space. This sealed space is configured to accommodate the laser chip 2030 and the deflection component 204.

[0095] As shown in Figures 5 and 6, at least one light-emitting assembly 2001 includes multiple light-emitting assemblies 2001. The multiple light-emitting assemblies 2001 are evenly spaced along the length of the substrate 1001. The laser chip 2030 and the deflection component 204 are fixed to the tube shell 2020 using a nano-metal slurry through a low-temperature sintering process. After sintering, the thermal conductivity and mechanical reliability of the laser chip 2030 at high temperatures are significantly improved. The deflection component 204 is configured to deflect the light beam emitted by the laser chip 2030 by 90°, so that the light beam is emitted in a direction perpendicular to the substrate 1001. The reflected light beam passes through the cover plate 2022 and is ultimately collimated by the collimator 201 before being emitted.

[0096] The laser chip 2030 is an active device and needs to be packaged in a dust-free, dry, and highly airtight space to prevent water vapor and oxygen from entering the space, thereby ensuring the long-term operation reliability of the light-emitting device 1000. Gold-tin alloy solder is a commonly used solder for airtight packaging of the tube shell 2020. The gold-tin alloy has good strength and wettability. The wettability can refer to the ability of the gold-tin alloy to form a uniform and dense wetting layer on the surface of a material when the gold-tin alloy contacts the surface of the material. This wetting layer can quickly expand and evenly cover the surface of the material, filling tiny pores and depressions to form a stable contact interface.

[0097] As shown in Figure 6, the light emitting component 2001 further includes a soldering piece 205. The soldering piece 205 can be prepared in advance from a gold-tin alloy solder. The thickness of the soldering piece 205 can be adjusted according to demand, and the thickness of the soldering piece 205 is substantially uniform.

[0098] Typically, in the process of preparing the soldering sheet 205 in advance with a gold-tin alloy solder to produce a eutectic alloy to achieve sealing, it is required to plate the soldering surface (for example, at least a portion of the contact surface between the cover plate 2022 and the accommodating structure 2021) with gold. When the temperature rises above the melting point of the solder, the solder melts and fills the gap between the cover plate 2022 and the accommodating structure 2021, ultimately achieving airtightness. The soldering sheet 205 is usually prefabricated at the cover plate 2022. During the soldering process, after the soldering sheet 205 contacts the accommodating structure 2021, the soldering sheet 205 is heated to complete the welding. Because when the soldering sheet 205 melts and a certain amount of pressure is applied, the solder in a molten state is very likely to overflow the sealing area (such as the contact area between the cover plate 2022 and the accommodating structure 2021). Therefore, there is insufficient solder and solder voids are easily formed. Solder voids refer to holes or gaps formed when the weld is not completely filled during the welding process. Furthermore, the overflow of the solder may also cause the solder to overflow into the sealed space, thereby affecting the laser chip 2030 .

[0099] To address the aforementioned issues, some embodiments of the present disclosure provide a light-emitting device 2000. This light-emitting device 2000 includes multiple first sealing portions. Adjacent first sealing portions contact each other by changing their physical form, thereby sealing the housing structure and the cover plate, thereby enhancing the airtightness of the soldering process and preventing solder overflow that could affect the laser chip.

[0100] FIG7 is a structural diagram of a light-emitting device according to some embodiments. As shown in FIG7 , the light-emitting device 2000 includes a substrate 100 and a light-emitting component 200. The substrate 100 includes an electrical connection structure. The light-emitting component 200 is fixed to one side of the substrate 100. The substrate 100 is configured to carry and fix the light-emitting component 200, and to be electrically connected to the light-emitting component 200 to provide a specific electrical signal to the light-emitting component 200, thereby achieving light emission of the light-emitting component 200. The light-emitting component 200 includes a tube shell 202, a laser chip, and a conductive structure. The laser chip is disposed in the tube shell 202, and the conductive structure is disposed on the side of the tube shell 202 facing the substrate 100 and is connected to the electrical connection structure. In this way, the light-emitting component 200 and the substrate 100 can be electrically connected via the conductive structure and the electrical connection structure.

[0101] As shown in FIG7 , the tube shell 202 includes a housing structure 2021, a cover plate 2022, and a plurality of first sealing portions 2023. The housing structure 2021 is disposed on the substrate 100, and the side of the housing structure 2021 away from the substrate 100 is recessed to form a cavity. The cover plate 2022 is disposed over the housing structure 2021 to enclose the cavity and form a sealed space. The plurality of first sealing portions 2023 are disposed between the housing structure 2021 and the cover plate 2022. The plurality of first sealing portions 2023 are configured to connect the housing structure 2021 and the cover plate 2022 to seal the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0102] It should be noted that before the cover plate 2022 is welded to the housing structure 2021, the multiple first sealing portions 2023 are separated from each other and are spaced apart on the side of the cover plate 2022 facing the housing structure 2021. When the cover plate 2022 is welded to the housing structure 2021, adjacent first sealing portions 2023 come into contact with each other based on changes in their physical form, thereby sealing the gap at the connection between the housing structure 2021 and the cover plate 2022. The physical form may include solid, liquid, etc.

[0103] For example, when the cover plate 2022 is welded to the accommodating structure 2021 , the two adjacent first sealing portions 2023 melt due to heating, changing from solid to liquid, so that the two adjacent first sealing portions 2023 contact each other to close the gap at the connection between the accommodating structure 2021 and the cover plate 2022 .

[0104] In some embodiments of the present disclosure, multiple first sealing portions 2023 seal the housing structure 2021 and the cover plate 2022, isolating the laser chip within the housing 202 from the outside world and ensuring long-term, reliable operation of the light-emitting device 2000. The multiple first sealing portions 2023 are separated from each other, each of which is an independent structure. After the multiple first sealing portions 2023 change from a solid state to a liquid state, adjacent first sealing portions 2023 contact each other due to their own shape change, thereby sealing the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0105] Compared to the related art method of sealing the housing structure 2021 and the cover plate 2022 with prefabricated solder tabs 205, some embodiments of the present disclosure seal the housing structure 2021 and the cover plate 2022 with multiple first sealing portions 2023. This prevents the formation of weld voids caused by overflow of the first sealing portions 2023, thereby improving airtightness. Furthermore, this prevents overflow of the first sealing portions 2023 from affecting the laser chip.

[0106] FIG8 is another structural diagram of a light-emitting device according to some embodiments. In some embodiments, as shown in FIG8 , the light-emitting device 2000 further includes a second sealing portion 2024. The orthographic projections of the plurality of first sealing portions 2023 on the plane where the cover plate 2022 is located at least partially overlap with the orthographic projections of the second sealing portion 2024 on the plane where the cover plate 2022 is located. FIG8 takes the example of the second sealing portion 2024 being disposed on the side of the cover plate 2022 facing the accommodating structure 2021. The second sealing portion 2024 satisfies at least one of the following conditions: the second sealing portion 2024 is disposed on the side of the cover plate 2022 facing the accommodating structure 2021 and is located between the cover plate 2022 and the plurality of first sealing portions 2023; or the second sealing portion 2024 is disposed on the side of the accommodating structure 2021 facing the cover plate 2022 and is located between the accommodating structure 2021 and the plurality of first sealing portions 2023.

[0107] In some embodiments, the second sealing portion 2024 can be a coating structure, such as a metallized layer. For example, the metallized layer includes at least one of titanium (Ti), platinum (Pt), or gold (Au), or at least one of nickel (Ni) or Au, or at least one of chromium (Cr) or gold (Au). Multiple first sealing portions 2023 can be provided on the second sealing portion 2024. The multiple first sealing portions 2023 cooperate with the second sealing portion 2024 to stably secure the cover plate 2022 to the housing structure 2021 and to seal the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0108] Figure 9 is another structural diagram of a light-emitting device according to some embodiments. In some embodiments, as shown in Figure 9, the light-emitting device 2000 further includes two sealed areas 300. The two sealed areas 300 are a first sealed area and a second sealed area, respectively. The first sealed area is located on the side of the housing structure 2021 near the cover plate 2022; multiple first sealing portions 2023 are located in the first sealed area. The second sealed area is provided corresponding to the first sealed area, located on the side of the cover plate 2022 near the housing structure 2021, and multiple first sealing portions 2023 are located in the second sealed area. The orthographic projection of the second sealed area on the plane of the substrate 100 at least partially overlaps with the orthographic projection of the first sealed area on the plane of the substrate 100. The first and second sealed areas are each a metallization layer. The first sealing portion 2023 is located in the first and second sealed areas to close the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0109] In some embodiments, the first sealing region may include a second sealing portion 2024. The second sealing region may include a second sealing portion 2024. For example, if the second sealing portion 2024 is disposed on a side of the cover plate 2022 close to the accommodating structure 2021, the second sealing region includes the second sealing portion 2024; if the second sealing portion 2024 is disposed on a side of the accommodating structure 2021 close to the cover plate 2022, the first sealing region includes the second sealing portion 2024.

[0110] In the case where the light-emitting device 2000 also includes a first sealing area and a second sealing area, the second sealing portion 2024 satisfies at least one of the following: the orthographic projection of the second sealing portion 2024 on the surface of the cover plate 2022 close to the accommodating structure 2021 is within the second sealing area, or the orthographic projection of the second sealing portion 2024 on the surface of the accommodating structure 2021 close to the cover plate 2022 is located within the first sealing area.

[0111] In some embodiments, the sealed region 300 can be insulated from the circuit structures (e.g., the conductive structure and the electrical connection structure) in the light-emitting device 2000. The sealed region 300 can enhance the reliability of the connection between the first sealed portion 2023, the cover plate 2022, and the housing structure 2021. In some embodiments, a scheme similar to that shown in FIG. 8 can be employed, with specific configurations made based on the material, surface flatness, and insulation properties of the sealed region 300. This can enhance the stability of the sealed housing structure 2021 and the cover plate 2022.

[0112] Figure 10 illustrates one structural diagram of a cover plate and multiple first sealing portions according to some embodiments, and Figure 11 illustrates another structural diagram of a cover plate and multiple first sealing portions according to some embodiments. In some embodiments, as shown in Figures 10 and 11 , multiple first sealing portions 2023 are disposed in the second sealing region. Each first sealing portion 2023 is hemispherical, with a gap between adjacent first sealing portions 2023.

[0113] As shown in Figures 10 and 11, the first sealing portion 2023 is a hemispherical metal solder ball. The material of the first sealing portion 2023 can be a gold-tin alloy. A gap exists between two adjacent metal solder balls disposed on the cover plate 2022. Under pressure, the metal solder balls change their shape, extending toward each other and contacting each other, thereby sealing the cover plate 2022 and the housing structure 2021. Under the pressure, the metal solder balls assume a rounded shape.

[0114] Compared with the method of welding through the welding sheet 205 in the related art, the metal solder balls contact each other by extension and thus seal the accommodating structure 2021 and the cover plate 2022. In this way, the solder can be prevented from overflowing, thereby preventing the formation of welding voids and the overflowed solder from affecting the laser chip 203.

[0115] FIG12 is another structural diagram of a cover plate and a plurality of first sealing portions according to some embodiments. In some embodiments, as shown in FIG12 , the sealing region 300 is an annular structure. The surface area of ​​the sealing region 300 is defined as S, the spacing between the accommodating structure 2021 and the cover plate 2022 is defined as H, the number of the plurality of hemispherical first sealing portions 2023 is defined as M, and the radius of the hemispherical first sealing portion 2023 is defined as R. Then, the surface area S of the sealing region 300, the spacing H between the accommodating structure 2021 and the cover plate 2022, the number M of the plurality of first sealing portions 2023, and the radius R of the first sealing portion 2023 satisfy formula (1).

[0116] It is understood that the meaning of formula (1) is that the total volume of the plurality of first sealing portions 2023 is greater than or equal to the volume of the welding area, which is the area defined by the sealing area 300 , the accommodating structure 2021 , and the cover plate 2022 .

[0117] As shown in FIG12 , the hemispherical first sealing portion 2023 is used to eutectic weld the accommodating structure 2021 and the cover plate 2022, which can reduce the unfilled area of ​​the first sealing portion 2023. The first sealing portion 2023 in a high-temperature molten state can fill the sealing area 300, thereby ensuring an airtight effect.

[0118] In some embodiments, the radius R of the first sealing portion 2023 and the distance between two adjacent first sealing portions 2023 are related to the thickness of the first sealing portion 2023 when subjected to pressure and after welding. As shown in FIG12 , the outer lengths of any sealing area 300 are defined as the first length L1 and the first width L3, and the inner lengths are defined as the second length L2 and the second width L4. The total volume of the plurality of first sealing portions 2023 is V. If the first sealing portion 2023 just fills the space corresponding to the sealing area 300 between the accommodating structure 2021 and the cover plate 2022, then the total volume V of the plurality of first sealing portions 2023 satisfies formulas (2) and (3). V = V1 Formula (2) V1 = S × H = (L1 × L3 - L2 × L4) × H Formula (3)

[0119] Ideally, the total volume V of the plurality of first sealing portions 2023 in some embodiments of the present disclosure is equal to the target volume V1. However, given the potential for errors in the accuracy of the total volume of the first sealing portions 2023, the total volume V of the plurality of first sealing portions 2023 may be slightly larger than the target volume V1. In some embodiments, the total volume V of the first sealing portions 2023 may exceed the target volume V1 by up to 10%. The volume V2 of any spherical first sealing portion 2023 satisfies formula (4).

[0120] The volume V3 of any hemispherical first sealing portion 2023 is half the volume of the spherical first sealing portion 2023 , as satisfying formula (5).

[0121] Therefore, when the plurality of first sealing portions 2023 are respectively hemispherical, the total volume V of the plurality of first sealing portions 2023 satisfies formula (6) and formula (7). (1+10%)×S×H≥V≥S×H Formula (7)

[0122] In some embodiments, the perimeter of any sealing area 300 is defined as L, and the distance between two adjacent hemispherical first sealing portions 2023 is defined as A. Then, the perimeter L of the sealing area 300, the distance A between two adjacent hemispherical first sealing portions 2023, and the number M of the first sealing portions 2023 satisfy Formula (8). A×M=L Formula (8)

[0123] As shown in Figure 12, the perimeter L of the sealing area 300 is approximately the sum of the first length L1, the second length L2, the first width L3, and the second width L4 (L = L1 + L2 + L3 + L4). The spacing A between two adjacent hemispherical first sealing portions 2023 is defined as the spacing between the centers of the two adjacent first sealing portions 2023 on the side close to the cover plate 2022. To ensure that the plurality of first sealing portions 2023 fully fill the sealing area 300, the perimeter L of the sealing area 300, the spacing A between the centers of the two adjacent first sealing portions 2023 on the side close to the cover plate 2022, and the number M of first sealing portions 2023 satisfy equation (8).

[0124] According to formulas (6), (7), and (8), it can be found that when the distance H between the accommodating structure 2021 and the cover plate 2022 and the size of the sealing area 300 are determined, the relationship between the number M of the first sealing portions 2023 and the radius R of the first sealing portions 2023 can be obtained. The distance H between the accommodating structure 2021 and the cover plate 2022 can refer to the thickness of the first sealing portion 2023 after closing the accommodating structure 2021 and the cover plate 2022, hereinafter referred to as the sealing thickness for short. The sealing thickness can also be the distance between the cover plate 2022 and the accommodating structure 2021 in the direction perpendicular to the plane where the substrate 100 is located.

[0125] In some embodiments, during the preparation of the first sealing portions 2023, the radius R of the first sealing portions 2023 is greater than or equal to 5 μm and less than or equal to 300 μm (5 μm < r < 300 μm). For example, the radius R of the first sealing portions 2023 is 5 μm, 100 μm, 200 μm, 250 μm, or 300 μm. The size of the radius R of the first sealing portions 2023 corresponds to different sealing thicknesses.

[0126] For the package 202 with a volume smaller than the first preset threshold, during the sealing process, the sealing thickness satisfies at least one of the following: greater than or equal to 20 μm, or less than or equal to 50 μm. For example, the sealing thickness is 20 μm, 25 μm, 30 μm, 40 μm, or 50 μm. Correspondingly, the radius of the hemispherical first sealing portions 2023 satisfies at least one of the following: greater than or equal to 40 μm, or less than or equal to 100 μm. For example, the radius of the hemispherical first sealing portions 2023 is 40 μm, 50 μm, 70 μm, 90 μm, or 100 μm.

[0127] For a tube shell 202 whose volume is greater than the first preset threshold, the sealing thickness satisfies at least one of the following: greater than or equal to 50 μm, or less than or equal to 100 μm. For example, the sealing thickness is 50 μm, 60 μm, 70 μm, 90 μm, or 100 μm. In this way, the sealing strength and the contact area between the first sealing portion 2023 and the cover plate 2022 and the accommodating structure 2021 can be increased. In this case, the radius of the first sealing portion 2023 satisfies at least one of the following: greater than or equal to 120 μm and less than or equal to 180 μm. For example, the radius of the hemispherical first sealing portion 2023 is 120 μm, 140 μm, 150 μm, 170 μm, or 180 μm. The desired sealing thickness can be obtained by adjusting the pressure on the cover plate 2022 and the spacing between adjacent first sealing portions 2023. By controlling the pressure during the sealing process within the radius range of the hemispherical first sealing portion 2023 (e.g., greater than or equal to 40 μm and less than or equal to 100 μm; greater than or equal to 120 μm and less than or equal to 180 μm), ideal welding can be achieved. Thus, when the first sealing portion 2023 is made of a gold-tin alloy, the diffusion of the first sealing portion 2023 can be uniform and dense as the temperature increases.

[0128] When the radius of the hemispherical first sealing portion 2023 is greater than or equal to 5 μm and less than or equal to 40 μm, for example, the radius of the hemispherical first sealing portion 2023 is 5 μm, 15 μm, 20 μm, 35 μm, or 40 μm, the required sealing contact area is generally small and the sealing thickness is thin. In this case, it is easy to cause solder joints in the sealing area 300 to be cold or false, thereby reducing the reliability and environmental adaptability of the light-emitting device 2000. Therefore, for the single-chip package tube shell 202, the size of the tube shell 202 and the area of ​​the sealing area 300 are generally small, and the above-mentioned radius of the first sealing portion 2023 is suitable for the tube shell 202.

[0129] When the radius of the hemispherical first sealing portion 2023 is greater than or equal to 200 μm and less than or equal to 300 μm, for example, the radius of the hemispherical first sealing portion 2023 is 200 μm, 220 μm, 250 μm, 280 μm or 300 μm, the first sealing portion 2023 is prone to overflow during the sealing process, and parameters such as pressure and temperature need to be strictly controlled, which increases the difficulty of the sealing process. In this case, due to the large radius of the first sealing portion 2023, it is difficult to control the sealing thickness after sealing during the sealing process, resulting in uneven thickness of the first sealing portion 2023. In addition, due to the increase in the volume of the first sealing portion 2023, the sealing cost will also increase. Therefore, when sealing a large-sized tube shell 202 and the sealing area 300 is large, the first sealing portion 2023 can completely fill the sealing area by using the above-mentioned radius.

[0130] When the radius of the first sealing portion 2023 and the size of the housing 202 are determined, the desired sealing thickness can be achieved by adjusting the number of first sealing portions 2023. Generally speaking, when the size of the housing 202 is determined, the smaller the radius of the first sealing portion 2023, the more first sealing portions 2023 are required. In some embodiments, when the number of first sealing portions 2023 is between 100 and 300, the number of first sealing portions 2023 can be small, and a first sealing portion 2023 with a radius greater than a second predetermined threshold can be used for sealing. For some small housings 202, when the radius of the first sealing portion 2023 is small, the number of first sealing portions 2023 can be between 4,000 and 8,000.

[0131] In some embodiments, the number of the first sealing parts 2023 is in a range of 500 to 2000. Under this number, a uniform sealing thickness can be obtained by adjusting the radius of the first sealing parts 2023, and ultimately a suitable sealing effect can be obtained.

[0132] The foregoing mainly takes the hemispherical shape of the first sealing portion 2023 as an example. Of course, in some embodiments, the first sealing portion 2023 can also be in other shapes, such as a cube, a cuboid, a sphere, an ellipsoid, a tetrahedron, etc.

[0133] Taking the first sealing portion 2023 as an example, the radius of the first sealing portion 2023 is R, and the volume of any first sealing portion 2023 satisfies formula (9).

[0134] Therefore, when the plurality of first sealing portions 2023 are spherical, the total volume V of the plurality of first sealing portions 2023 can be set to satisfy formula (10) and formula (11).

[0135] The process of determining the total volume of the prefabricated plurality of first sealing portions 2023 of other shapes is similar to the process and will not be repeated here.

[0136] FIG13 is a structural diagram of a housing structure according to some embodiments. FIG14 is a structural diagram of multiple housing structures according to some embodiments. As shown in FIG13 and FIG14 , the housing structure 2021 includes a side wall 208 and a bottom plate. The side wall 208 is arranged on the bottom plate. The side wall 208 can be formed of a ceramic material or a metal alloy material. The bottom plate is the patch area for the laser chip 203 and the steering component 204. Considering the patch accuracy and heat dissipation effect, the flatness of the bottom plate is required to be high. Therefore, the bottom plate can be made of materials with good heat dissipation, such as oxygen-free copper and diamond. The bottom plate and the side wall 208 can be sintered to form the overall structure of the housing structure 2021.

[0137] As shown in Figures 13 and 14, the housing structure 2021 also includes at least two stepped portions 206. These at least two stepped portions 206 are located on either side of the sidewall 208 along the length of the housing structure 2021. A metal film is provided on each of the steps 206, electrically connecting the step portion 206 to the base plate, thereby achieving electrical connection between the light-emitting assembly 200 and the substrate 100. The housing structure 2021 also includes a positioning portion 207. The positioning portion 207 is located in the middle portion of the step portion 206 along the width of the housing structure 2021 and can serve as an identification area. For example, a global coordinate system can be constructed using the positioning portions 207 on both sides. The rectangular portion between the at least two stepped portions 206 serves as a circuit isolation area, ensuring that the electrical connections between the at least two stepped portions 206 and the base plate are independent of each other. An identification area can be added to one side of the sidewall 208 to identify the orientation or direction of the sidewall 208 when it is mounted on the substrate 100.

[0138] The laser chip 203 can be welded to the heat sink through the eutectic process. The main material of the heat sink can be aluminum nitride (ALN), silicon carbide (SiC), etc. The waveguide size of the laser chip 203 in the direction of the fast axis is small, so that the beam quality of the output light beam is close to the diffraction limit and a large divergence angle will be generated. Depending on the size of the waveguide layer in the direction of the fast axis of the laser, the divergence angle of the light beam can be between 40° and 60°. The divergence angle of the laser chip 203 in the direction of the slow axis can be between 6° and 15°, and the beam quality is poor. The size of the active area is generally between 100μm and 500μm, and the direction of the fast axis is perpendicular to the direction of the slow axis.

[0139] The deflection component 204 deflects the light beam emitted by the laser chip 203 by 90°. The deflection component 204 can be made of materials such as borosilicate glass, quartz, and silicon. An antireflection coating can be applied to the surface of the deflection component 204 to improve reflectivity. Because the laser chip 203 has a large divergence angle along its fast axis, the deflection component 204 can only deflect the majority of the light beam emitted by the laser chip 203. A small portion of the light beam does not form effective light, but instead exits from the side of the deflection component 204 as a stray beam.

[0140] FIG15 is an exploded view of a light-emitting assembly according to some embodiments. In some embodiments, as shown in FIG15 , the light-emitting assembly 200 further includes at least one collimating portion 201. At least one collimating portion 201 is disposed on the cover plate 2022. The collimating portion 201 is primarily configured to process the divergence angle of the light beam emitted by the laser chip 203. Therefore, the collimating portion 201 needs to be designed and adjusted based on the divergence angle of the laser chip 203 and the optical path of the light-emitting device 2000. The curvature of the collimating portion 201 can be adjusted based on the different characteristics of any light-emitting device 2000, or the curvature of the collimating portion 201 can be maintained constant to facilitate processing and reduce costs.

[0141] In some embodiments, the surface shape of the collimating portion 201 can be an aspherical surface, a free-form surface, or a Fresnel structure can be used to achieve the function of compressing the divergence angle. The Fresnel structure is similar to a Fresnel lens. It should be noted that the surface parameters of the collimating portion 201 are related to the optical path of the light beam. Therefore, in the light-emitting device 2000, the position of the laser chip 203, the position of the steering component 204, and the spacing between the cover plate 2022 and the accommodating structure 2021 need to be set within a preset tolerance range. The number of collimating portions 201 is the same as the number of light-emitting components 200.

[0142] In some embodiments, as shown in FIG15 , at least one collimating portion 201 includes a plurality of collimating portions 201 . The collimating portion 201 can be fixed by applying glue to the four corners of any collimating portion 201 , and the glue application position needs to avoid the optically effective area. The optically effective area may refer to an area where the collimating portion 201 can effectively process and transmit light. After the light beam emitted by the laser chip 203 is reflected by the steering component 204 , the fast axis direction of the laser is parallel to the short side direction of the collimating portion 201 , and the slow axis direction of the laser is parallel to the long side direction of the collimating portion 201 . At this time, the plurality of collimating portions 201 are arranged along the length direction of the substrate 100 .

[0143] Figure 16 is another structural diagram of a light-emitting device according to some embodiments. After completing the gap between the closed accommodating structure 2021 and the cover plate 2022, the packaged light-emitting component 200 can be separated again. After the cover plate 2022 is separated from the accommodating structure 2021 again, as shown in Figure 16, by observing the sealing area 300, it can be seen that the distribution shape of the intermetallic compounds (Intermetallic Compounds) formed at the position of the first sealing portion 2023 is circular. Since the thickness of the intermetallic compounds at the position of the first sealing portion 2023 is thicker than that of other areas, it can be clearly observed that the corresponding area of ​​the first sealing portion 2023 and the area where the solder is not filled have different colors.

[0144] The following describes light-emitting devices in some embodiments of the present disclosure.

[0145] The widespread use of miniaturized laser projection equipment has increased the difficulty of designing miniaturized light-emitting devices. Typically, to reduce the wiring required to interconnect the various components in a light-emitting device and save space, multiple laser chips in a light-emitting device typically use a common anode or common cathode wiring method. Here, a common anode wiring method can refer to connecting the anodes of multiple laser chips to the positive pole of the same power supply, while the cathodes of the multiple laser chips are connected to multiple drive circuits of the light-emitting device; a common cathode wiring method can refer to connecting the cathodes of multiple laser chips to the negative pole of the same power supply, while the anodes of the multiple laser chips are connected to multiple drive circuits of the light-emitting device.

[0146] However, the use of a common anode routing method makes it difficult to accurately control the input voltage of the laser chip, which not only causes power loss but also easily damages the laser chip. Although the use of a common cathode routing method can effectively control the input voltage of the laser chip and reduce power consumption, when multiple laser chips need to work simultaneously to increase brightness, it is difficult to solve the problem of increased costs caused by the increase in the number of driving circuits.

[0147] In the related art, as shown in Figure 17, the driver circuit board is used to transmit a drive signal to the light-emitting device, and the power supply board is used to supply power to the light-emitting device. When the light-emitting device is powered on, it emits three colors of laser light (such as red laser, blue laser, and green laser) according to the received drive signal. Figure 18 is a circuit diagram of a light-emitting device in which multiple laser chips adopt a common anode wiring method, and Figure 19 is a circuit diagram of a light-emitting device in which multiple laser chips adopt a common cathode wiring method. As shown in Figures 18 and 19, every three laser chips (such as red laser chip R, green laser chip B, and blue laser chip B) form a light-emitting device, which can emit red laser, green laser, and blue laser. R_T, G_T, and B_T (such as R_T0, G_T0, B_T0; R_T1, G_T1, B_T1; R_T2, G_T2, B_T2) in the figure represent the driving circuit of the light-emitting device. When multiple light-emitting devices are required to work simultaneously to increase brightness, as the number of light-emitting devices increases, the number of driving circuits increases accordingly, resulting in increased costs.

[0148] To address the aforementioned issues, some embodiments of the present disclosure provide a light-emitting device and a laser apparatus. The light-emitting device includes a substrate and a light-emitting assembly, which is fixed to a connection pattern on the substrate. Laser chips emitting the same color are connected in series and electrically connected to two corresponding first pads of different polarities via a first trace, a conductive structure, a conductive portion, and an interconnection region. This allows power to be supplied separately to the laser chips emitting lasers of different colors, resolving the issue of the number of laser chips being limited by the number and cost of driver circuits. This allows the number of driver circuits to remain constant while the number of laser chips is increased, effectively improving the efficiency of the driver circuits and reducing costs.

[0149] The following describes light-emitting devices according to some embodiments of the present disclosure in conjunction with the accompanying drawings.

[0150] In some embodiments, as shown in FIG20 , a light-emitting device 2000 includes a substrate 100 and a light-emitting component 200, with the light-emitting component 200 being located on one side of the substrate 100. As shown in FIG21 and FIG22 , the substrate 100 includes at least one connection pattern 13, a plurality of first solder pads 11, a plurality of interconnection regions 12, and a substrate body, with the at least one connection pattern 13, the plurality of first solder pads 11, and the plurality of interconnection regions 12 being respectively located on a side of the substrate body facing the light-emitting component 200.

[0151] In some embodiments, a plurality of second traces are disposed in the substrate body, and the plurality of second traces form a plurality of interconnection regions 12 .

[0152] In some embodiments, at least one connection pattern 13 is disposed on a side of the substrate body facing the light emitting component 200 .

[0153] In some embodiments, the plurality of interconnect regions 12 are metal film layers, and the plurality of first pads 11 are electrically connected to at least one connection pattern 13 via the plurality of interconnect regions 12. The plurality of first pads 11 are connected to a drive circuit and a power source. For example, the plurality of first pads 11 can be connected to the power source via a connector, a flexible substrate, a glass epoxy substrate, a spring-loaded terminal block, or the like.

[0154] In some embodiments, the plurality of first pads 11 include a plurality of groups of first pads 11. For example, any group of first pads 11 includes two first pads 11. Any group of first pads 11 includes a positive polarity pad and a negative polarity pad.

[0155] In some embodiments, multiple groups of first solder pads 11 satisfy one of the following: within the plane where the substrate 100 is located, multiple groups of first solder pads 11 are all located on the same side of the substrate body and close to the edge of the substrate body; first solder pads 11 of the same polarity in the multiple groups of first solder pads 11 are arranged adjacent to each other; and first solder pads 11 of different polarities in any group of first solder pads 11 are arranged adjacent to each other.

[0156] In some embodiments, any first pad 11 is a metal layer and has a rectangular shape.

[0157] As shown in Figures 21 and 22, any of the at least one connection pattern 13 includes a fixing portion 132, which is provided on the substrate body and corresponds to the bottom wall of at least one tube shell 202. For example, the fixing portion 132 is electrically connected to the bottom wall of at least one tube shell 202. The light-emitting component 200 is fixed to the fixing portion 132. The fixing portion 132 can be made of metal and can be rectangular in shape. The connection pattern 13 also includes a conductive portion 131, which is electrically connected to the light-emitting component 200. The area marked by the thick black frame in Figure 21 is the location where the light-emitting component 200 is fixed on the substrate 100.

[0158] In some embodiments, as shown in FIG20 , the light-emitting assembly 200 includes at least one housing 202. Each of the at least one housing 202 includes a housing bottom wall, housing side walls, and sealing glass. The housing bottom wall is parallel to the plane of the substrate 100, while the housing side walls are perpendicular to the plane of the substrate 100. The sealing glass is located on the side of the housing side wall away from the housing bottom wall. The housing bottom wall, housing side walls, and sealing glass form a sealed space. The lower surface of the housing bottom wall is connected to the fixing portion 132. Wiring can be provided on at least one of the housing bottom wall or the housing side wall, and at least one of the housing bottom wall or the housing side wall can be made of ceramic material.

[0159] In some embodiments, the sidewall of at least one tube shell 202 is made of ceramic, and the bottom wall of at least one tube shell 101 is made of metal.

[0160] In some embodiments, as shown in FIG23 , the light emitting device 2000 further includes an electrical coupling component 400, which is disposed in an area of ​​the substrate body near the plurality of first solder pads 11, the electrical coupling component 400 and the plurality of first solder pads 111 are electrically connected, and the electrical coupling component 400 is configured to connect an external electrical signal.

[0161] For example, as shown in FIG. 20 , the light emitting assembly 200 further includes a first wiring 23 , and the first wiring 23 is disposed on at least one of the side of the tube shell or the bottom wall of the tube shell.

[0162] As shown in Figure 24, the light-emitting component 200 further includes a conductive structure 24 and a first metal film 25 (metal film). The conductive structure 24 and the first metal film 25 are disposed on the side of the housing 202 facing the substrate body (i.e., the lower surface of the housing bottom wall). The conductive structure 24 is positioned correspondingly to the conductive portion 131 and is electrically connected to the conductive portion 131. The first metal film 25 is positioned correspondingly to the fixing portion 132 and is connected to the fixing portion 132.

[0163] In some embodiments, as shown in Figures 20 and 26, the light-emitting assembly 200 further includes a plurality of stepped portions 206. The plurality of stepped portions 206 are disposed within any one of the tube shells 202 and are located on both sides of the length direction of the tube shell 202. For example, as shown in Figure 26, the plurality of stepped portions 206 include four stepped portions 206, two of which are located within the first tube shell 211, and the remaining two stepped portions 206 are located within the second tube shell 212. A second metal film is provided on the upper surface of the stepped portion 206 (i.e., the surface away from the substrate 100), and the second metal film is electrically connected to the conductive structure 24 via the first trace 23.

[0164] In some embodiments, as shown in FIG20 , the light-emitting assembly 200 further includes multiple laser chips 203 located within the tube housing 202. For example, the multiple laser chips 203 are located within a sealed space formed by the bottom wall, sidewalls, and sealing glass of the tube housing. The multiple laser chips 203 include laser chips 203 of at least two different light emission colors, and each type of laser chip 203 corresponds to a group of first solder pads 11.

[0165] The multiple laser chips 203 can be electrically connected to the conductive structure 24 through the first traces 23 , and the conductive portion 131 can be electrically connected to the multiple first pads 11 through the multiple interconnection regions 12 . In this way, the multiple laser chips 203 can be electrically connected to the multiple first pads 11 .

[0166] Taking the light-emitting component 200 including the first trace 23 as an example, the same type of laser chip 203 can be electrically connected to a corresponding group of first pads 11 through the first trace 23, the conductive structure 24, the conductive portion 131 and the interconnection area 12, thereby achieving separate power supply for multiple laser chips 203.

[0167] For example, as shown in FIG20 , the plurality of laser chips 203 include a first laser chip 221 and a second laser chip 222. The first laser chip 221 emits blue laser light, and the second laser chip 222 emits red laser light or green laser light. Because the first laser chip 221 is electrically connected to a corresponding set of first solder pads 11, and the second laser chip 222 is electrically connected to another corresponding set of first solder pads 11, the substrate 100 includes at least four first solder pads 11.

[0168] It should be noted that FIG20 illustrates a light-emitting device 2000 including two laser chips 203 with different light emission colors, but this does not limit the light-emitting device 2000 of some embodiments of the present disclosure. In other implementations, the multiple laser chips 203 may also include three types of laser chips 203, each of which emits laser light of a different color. The three laser chips 203 are electrically connected to a corresponding set of first solder pads 11 via first traces 23 to provide independent power to any of the three types of laser chips 203. The present disclosure does not limit the type of laser chip 203.

[0169] For example, as shown in FIG25 , the light-emitting device 2000 includes three laser chips 203: a red laser chip (e.g., R, R1, and R2), a green laser chip (e.g., G, G1, and G2), and a blue laser chip (e.g., B, B1, and B2). It should be noted that the red laser chip can emit red laser light, the green laser chip can emit green laser light, and the blue laser chip can emit blue laser light. Since any type of laser chip 203 is connected in series with a corresponding power supply and drive circuit (e.g., R_T0, G_T0, and B_T0), the number of drive circuits can remain unchanged regardless of how the number of laser chips 203 increases. This solves the problem that the number of laser chips 203 used is limited by the drive circuit, effectively improves the working efficiency of the drive circuit, and reduces costs.

[0170] In some embodiments, the substrate 100 can be made of copper and be a single-sided printed circuit board (PCB). This allows the back side of the substrate 100 (i.e., the side away from the light-emitting component 200) to have sufficient space for heat dissipation, which is beneficial for heat dissipation of the light-emitting device 2000. Furthermore, it is possible to achieve a design that can power each laser chip 203 independently and meet the miniaturization requirements of the light-emitting device 2000. The present disclosure does not limit the size of the substrate 100, and the size of the substrate 100 can be flexibly set according to needs. For example, the substrate 100 is a copper substrate with a width of 15.8 mm, a length of 26 mm, and a thickness of 1.6 mm.

[0171] In some embodiments, when the substrate 100 is made of copper, the thickness of the substrate 100 may be 2 ounces (oz), or approximately 70 micrometers.

[0172] In some embodiments, as shown in Figures 21 to 24, in a direction perpendicular to the plane of the substrate 100, any first solder pad 11 among the multiple first solder pads 11 at least partially overlaps with any interconnection region 12 among the multiple interconnection regions 12, the connection pattern 13 at least partially overlaps with the multiple interconnection regions 12, and the conductive structure 24 at least partially overlaps with the connection pattern 13.

[0173] In a direction perpendicular to the plane of the substrate 100, there is an overlapping area between the first pad 11 and the interconnection region 12, and the overlapping area is the connection area between the first pad 11 and the interconnection region 12. By increasing the connection area between the first pad 11 and the interconnection region 12, it is beneficial to improve the stability of the electrical connection between the first pad 11 and the interconnection region 12 and the amount of current passing through. The first pad 11 and the interconnection region 12 at least partially overlap, which can be understood as: in a direction perpendicular to the plane of the substrate 100, the first pad 11 is located in the interconnection region 12 (as shown in Figure 21 or Figure 22), or the first pad 11 and the interconnection region 12 partially overlap, and the first pad 11 and the interconnection region 12 also have non-overlapping (e.g., staggered) areas.

[0174] In a direction perpendicular to the plane of the substrate 100, the connection pattern 13 or the conductive portion 131 overlaps with the interconnection region 12. The overlapping area is the connection area between the connection pattern 13 or the conductive portion 131 and the interconnection region 12. Increasing the connection area between the connection pattern 13 or the conductive portion 131 and the interconnection region 12 helps to improve the stability and current flow of the electrical connection between the connection pattern 13 or the conductive portion 131 and the interconnection region 12. Taking the overlapping area between the conductive portion 131 and the interconnection region 12 as an example, the at least partial overlap between the conductive portion 131 and the interconnection region 12 can be understood as: in a direction perpendicular to the plane of the substrate 100, the conductive portion 131 is located within the interconnection region 12 (as shown in Figures 21 or 23), or the conductive portion 131 partially overlaps with the interconnection region 12, and there is also a non-overlapping area between the conductive portion 131 and the interconnection region 12.

[0175] With such configuration, the first pad 11 can be electrically connected to the connection pattern 13 through the interconnection region 12 .

[0176] In a direction perpendicular to the plane of the substrate 100, the conductive structure 24 at least partially overlaps with the connection pattern 13, that is, there is an overlapping area between the conductive structure 24 and the connection pattern 13, thereby achieving electrical connection between the conductive structure 24 and the connection pattern 13. The conductive structure 24 at least partially overlaps with the connection pattern 13, which can be understood as follows: in a direction perpendicular to the plane of the substrate 100, the conductive structure 24 is located within the connection pattern 13, or the connection pattern 13 is located within the conductive structure 24, or the conductive structure 24 and the connection pattern 13 partially overlap, and there is also a non-overlapping area between the conductive structure 24 and the connection pattern 13.

[0177] In some embodiments, as shown in FIG21 and FIG22 , within the plane of the substrate 100, the plurality of first solder pads 11 are located on the same side of the substrate 100. Thus, after the housing 202 is disposed on the substrate 100, the plurality of first solder pads 11 are also located on the same side of the housing 202. This not only ensures the miniaturization of the light-emitting device 2000, but also enhances the aesthetics of the light-emitting device 2000 and facilitates manual soldering.

[0178] Of course, in some other embodiments, the plurality of first pads 11 may also be located on two opposite sides of the tube shell 202 in the length direction or the width direction, so that independent power supply for any type of laser chip 203 can be achieved.

[0179] FIG20 takes an example in which the multiple laser chips 203 include a first laser chip 221 and a second laser chip 222 , and the first laser chip 221 emits a blue laser and the second laser chip 222 emits a red laser or a green laser. Of course, in some embodiments, the multiple laser chips 203 may also include three types of laser chips 203 .

[0180] For example, as shown in Figure 26, the multiple laser chips 203 include two first-type laser chips 221, each emitting light of different colors, three second-type laser chips 222, and four third-type laser chips 223. The laser chips 203 of a given type, located within the same tube housing 202, are connected in series and to a corresponding set of first solder pads 11. The number of first solder pads 11 electrically connected to the light-emitting assembly 200 is twice the number of different types of laser chips 203.

[0181] Each laser chip 203 emits laser light of a single color, while the first, second, and third laser chips 221, 222, and 223 emit different colors. For example, the first laser chip 221 emits blue laser light, the second laser chip 222 emits green laser light, and the third laser chip 223 emits red laser light. Alternatively, the first laser chip 221 emits green laser light, the second laser chip 222 emits blue laser light, and the third laser chip 223 emits red laser light.

[0182] In some embodiments, as shown in FIG26 , the third laser chip 223 emits light at a wavelength greater than that of the first laser chip 221 and the second laser chip 222. For example, the third laser chip 223 emits red laser light, corresponding to a wavelength within the range of 622 nm to 760 nm, the first laser chip 221 emits blue laser light, corresponding to a wavelength within the range of 435 nm to 450 nm, and the second laser chip 222 emits green laser light, corresponding to a wavelength within the range of 492 nm to 577 nm. In other embodiments, the first laser chip 221, the second laser chip 222, and the third laser chip 223 may also emit laser light of other colors, which are not limited herein.

[0183] 26 , at least one laser chip 203 among the plurality of laser chips 203 is disposed in a tube housing 202 . In the same tube housing 202 , all laser chips 203 with the same light emission color are connected in series and connected to a corresponding set of first pads 11 .

[0184] 26 , at least one housing 202 includes a first housing 211 and a second housing 212. The first housing 211 and the second housing 212 are arranged side by side along the length direction of the light emitting assembly 200 (eg, the left-right direction in FIG. 26 ).

[0185] In this case, four third-type laser chips 223 are disposed within the first tube shell 211. The four third-type laser chips 223 are connected in series via conductive wires (e.g., gold wires or bonding wires), and both ends of the series circuit are electrically connected to the second metal film of the stepped portion 206 on both sides. The second metal film is electrically connected to the conductive structure 24 via the first trace 23, the conductive structure 24 is electrically connected to the conductive portion 131, and the conductive portion 131 is electrically connected to the corresponding two first pads 11 via the interconnection region 12, thereby achieving electrical connection between the four third-type laser chips 223 and the corresponding group of first pads 11.

[0186] Two first-type laser chips 221 and three second-type laser chips 222 are disposed within the second tube housing 212. The two first-type laser chips 221 are connected in series via a wire, and both ends of the series circuit are electrically connected to the second metal film on a stepped portion 206. The second metal film is electrically connected to a conductive structure 24 via a first trace 23. The conductive structure 24 is electrically connected to the conductive portion 131 of the connection pattern 13. The connection pattern 13 is electrically connected to the corresponding two first pads 11 via the interconnect region 12, thereby achieving electrical connection between the two first-type laser chips 221 and the corresponding group of first pads 11.

[0187] The three second-type laser chips 222 are connected in series via wires, and both ends of the series circuit are electrically connected to the second metal film of another step portion 206. The second metal film is electrically connected to the conductive structure 24 via the first trace 23. The conductive structure 24 is electrically connected to the conductive portion 131 of the connection pattern 13. The connection pattern 13 is electrically connected to the corresponding two first pads 11 via the interconnection region 12, thereby achieving electrical connection between the three first-type laser chips 221 and the corresponding group of first pads 11.

[0188] It should be noted that FIG26 illustrates an example in which the multiple tube shells 202 include two tube shells 202, but the present disclosure is not limited thereto. In other embodiments, the at least one tube shell 202 may include a single tube shell 202, with the first laser chip 221, the second laser chip 222, and the third laser chip 223 located within the same tube shell 202; or, the at least one tube shell 202 may include three tube shells 202, with the first laser chip 221, the second laser chip 222, and the third laser chip 223 corresponding to the three tube shells 202, respectively, and laser chips 203 with the same light output color located within the same tube shell 202. The present disclosure does not limit the number of tube shells 202.

[0189] In some embodiments, as shown in Figure 21, the multiple first pads 11 include four groups of first pads 11, and the four groups of first pads 11 are: a first positive polarity pad (R+) and a first negative polarity pad (R-), a second positive polarity pad (B+) and a second negative polarity pad (B-), a third positive polarity pad (G+) and a third negative polarity pad (G-), and a fourth positive polarity pad (NTC+) and a fourth negative polarity pad (NTC-).

[0190] It should be noted that, as shown in Figure 21, the first positive polarity pad (R+) corresponds to the first positive polarity pad 1012, and the first negative polarity pad (R-) corresponds to the first negative polarity pad 1013; the second positive polarity pad (B+) corresponds to the second positive polarity pad 1015, and the second negative polarity pad (B-) corresponds to the second negative polarity pad 1014; the third positive polarity pad (G+) corresponds to the third positive polarity pad 1016, and the third negative polarity pad (G-) corresponds to 1017; the fourth positive polarity pad (NTC+) corresponds to 1011, and the fourth negative polarity pad (NTC-) corresponds to the fourth negative polarity pad 1018.

[0191] In some embodiments, as shown in FIG21 , along the length of the substrate 100, from left to right, the eight first solder pads 11 are arranged in the following order: fourth positive solder pad (NTC+), first positive solder pad (R+), first negative solder pad (R-), second negative solder pad (B-), second positive solder pad (B+), third positive solder pad (G+), third negative solder pad (G-), and fourth resistor negative solder pad (NTC-). In this case, the fourth positive solder pad (NTC+) is adjacent to the first positive solder pad (R+), the first negative solder pad (R-) is adjacent to the second negative solder pad (B-), the second positive solder pad (B+) is adjacent to the third positive solder pad (G+), and the third negative solder pad (G-) is adjacent to the fourth negative solder pad (NTC-). By arranging the positions of the multiple first solder pads 11 according to the principle of adjacent solder pads of the same polarity, short circuits between the positive and negative electrodes caused by welding errors can be prevented.

[0192] The present disclosure does not limit the type of the first pad 11. For example, as shown in Figure 21, the first pad 11 can be a cross pad. Of course, the first pad 11 can also be any type of pad known to those skilled in the art.

[0193] In some embodiments, as shown in FIG21 , substrate 100 further includes a temperature measuring component (e.g., a thermistor) 4, which is connected to a corresponding set of first pads 11 via a second trace. Temperature measuring component 4 is configured to detect heating of laser chip 203. For example, temperature measuring component 4 may include a negative temperature coefficient (NTC) temperature measuring component, or other types of temperature measuring components known to those skilled in the art, which are not limited herein.

[0194] In some embodiments, the temperature measuring component 4 satisfies at least one of the following conditions: the temperature measuring component 4 is located in the middle of the arrangement direction of the multiple groups of first solder pads 11, and the multiple groups of first solder pads 11 are symmetrically arranged on both sides of the temperature measuring component 4. As shown in Figures 21 and 27, the temperature measuring component 4 is located on one side of the connection pattern 13 near the eight first solder pads 11. The eight first solder pads 11 are symmetrically distributed on both sides of the temperature measuring component 4. The corresponding group of first solder pads 11 of the temperature measuring component 4 (i.e., the fourth positive polarity solder pad NTC+ and the fourth negative polarity solder pad NTC-) is located at the outermost side of the multiple first solder pads 11, and the temperature measuring component 4 is electrically connected to the fourth positive polarity solder pad (NTC+) and the fourth negative polarity solder pad (NTC-) via the corresponding interconnection region 12. The circuit connection circuit of the temperature measuring component 4 is shown in Figure 27. In Figure 27, TP1 represents the fourth positive polarity solder pad (NTC+) and TP8 represents the fourth negative polarity solder pad (NTC-).

[0195] In some embodiments, as shown in FIG24 , the conductive structure 24 includes a plurality of second pads 241, which are connected to the first trace 23. The plurality of second pads 241 correspond to the sidewalls of at least one housing 202. For example, the plurality of second pads 241 are connected to the sidewalls of at least one housing 202. Correspondingly, as shown in FIG21 and FIG22 , in a direction perpendicular to the plane of the substrate 100, the conductive portion 131 includes a plurality of third pads 1311, and any one of the plurality of third pads 1311 at least partially overlaps with the interconnection region 12.

[0196] In this case, the plurality of third solder pads 1311 are electrically connected to the plurality of second solder pads 241, respectively. The plurality of third solder pads 1311 are also electrically connected to the plurality of first solder pads 11 via the interconnection region 12. The second solder pads 241 are soldered to the corresponding laser chips 203 via the first traces 23. Furthermore, the plurality of laser chips 203 emitting light of the same color within the same tube housing 202 are connected in series. This allows each laser chip 203 of a particular color to be powered independently, avoiding an increase in the number of driver circuits resulting from an increase in the number of laser chips 203, thereby reducing costs.

[0197] In some embodiments, when at least one tube shell 202 includes a first tube shell 211 and a second tube shell 212, and the multiple laser chips 203 include a first laser chip 221, a second laser chip 222, and a third laser chip 223, and the third laser chip 223 is arranged in the first tube shell 211, and the first laser chip 221 and the second laser chip 222 are arranged in the second tube shell 212, the conductive structure 24 may include eight second solder pads 241, and four second solder pads are provided on a side of any tube shell 202 close to the first solder pad 11, and the four second solder pads 241 are arranged side by side.

[0198] Two second solder pads 241 on the second tube shell 212 are connected to the first group of first solder pads 11, and another two second solder pads 241 on the second tube shell 212 are connected to the second group of first solder pads 11. Two second solder pads 241 on the first tube shell 211 away from the second tube shell 212 are connected to the third group of first solder pads 11, and one of the other two adjacent second solder pads 241 on the first tube shell 211 that is closer to the second tube shell 212 is electrically connected to the second solder pad 241 on the second tube shell 212 that is closer to the first tube shell 211.

[0199] In this case, a metal film 25 and a plurality of second solder pads 241 are respectively provided on the side of the first tube shell 211 and the second tube shell 212 facing the substrate 100. The metal film 25 corresponds to and is connected to the fixing portion 132, and the plurality of second solder pads 241 correspond to and are electrically connected to the plurality of third solder pads 1311. In this way, the light-emitting component 200 can be fixed to the substrate 100 and electrically connected.

[0200] As shown in Figures 21, 22 and 26, the first tube shell 211 and the second tube shell 212 are fixed and electrically connected to the substrate 100 in the following manner: the fixing portion 132 of the connection pattern 13 located on the right side is fixedly connected to the metal film 25 of the second tube shell 212 on the side facing the substrate 100, and the four third solder pads 1311 corresponding to the four second solder pads 241 of the second tube shell 212 are arranged close to the first solder pads 11. Two of the four third solder pads 1311 are connected to one group of first solder pads 11 through the interconnection region 12, and the other two third solder pads 1311 are connected to another group of first solder pads 11 through the interconnection region 12.

[0201] The fixed portion 132 of the connection pattern 13 on the left is fixedly connected to the metal film 25 on the side of the first tube shell 211 facing the substrate 100. The four third pads 1311 corresponding to the four second pads 241 of the first tube shell 211 are arranged near the first pad 11. Two third pads 1311 of the four third pads 1311 that are away from the connection pattern 13 on the right are connected to a group of third pads 1311 through the interconnection region 12. At least one of the other two third pads 1311 (the two third pads 1311 numbered 3 and 4 in FIG. 22 ) that is closer to the right side is connected to the third pad 1311 (e.g., the third pad 1311 numbered 5 in FIG. 22 ) in the conductive portion 131 of the connection pattern 13 on the right that is closest to the first tube shell 211 on the left side through the same interconnection region 12.

[0202] For example, as shown in FIG28 , third pads 1311 numbered 3 and 4 are electrically connected to third pad 1311 numbered 5 via interconnection region 12. For another example, as shown in FIG29 , third pad 1311 numbered 4 is electrically connected to third pad 1311 numbered 5 via interconnection region 12. It should be noted that the connection pattern 13 on the right side corresponds to the second housing 212, and the connection pattern 13 on the left side corresponds to the first housing 211.

[0203] Since positioning holes need to be provided on the substrate 100, if the distance between the tube shell 202 and the positioning holes is compressed to less than or equal to 0.5 mm, the area between the tube shell 202 and the positioning holes is inconvenient for routing. Therefore, some embodiments of the present disclosure may provide a second solder pad 241 on a side of the tube shell 202 close to the first solder pad 11. The second solder pad 241 is electrically connected to the corresponding first solder pad 11 through the third solder pad 1311 close to the first solder pad 11 and the interconnection area 12.

[0204] In other embodiments, if the spacing between the positioning hole and the housing 202 and the spacing between the two housings 202 meet the minimum trace width, the second pad 241 may be disposed on a side of the housing 202 away from the first pad 11. In this case, an interconnection region 12 may be disposed in at least one of the following locations: the area between the positioning hole and the housing 202 on the substrate 100, or the area between the two housings 202 on the substrate 100. In this way, after the adjacent third pads 1311 are connected via the interconnection region 12, the third pads 1311 can be electrically connected to the first pad 11, thereby increasing the trace width and, in turn, the amount of current passing therethrough.

[0205] The following describes various electrical connection relationships between the light emitting assembly 200 and the substrate 100 by taking an example in which the substrate 100 includes eight first pads 11 , the at least one tube shell includes two tube shells, and the multiple laser chips include laser chips of three different colors.

[0206] As shown in FIG26 , eight first solder pads 11 are located on the same side of the two tube shells 202 , and four second solder pads 241 are provided on the side of each tube shell 202 close to the first solder pad 11. The substrate corresponding to the first tube shell 211 and the second tube shell 212 is shown in FIG21 or 23 . Correspondingly, the conductive portion 131 includes eight third solder pads. To clearly illustrate the correspondence between the laser chip 203 , the second solder pads 241 , the third solder pads 1311 , and the first solder pad 11 , the eight third solder pads 1311 close to the first solder pad 11 are numbered as shown in FIG21 and FIG26 . The four third solder pads 1311 corresponding to the four second solder pads 241 on the first tube shell 211 are numbered 1 to 4, and the four third solder pads 1311 corresponding to the four second solder pads 241 on the second tube shell 212 are numbered 5 to 8.

[0207] Furthermore, the first laser chip 221 emits blue laser light, the second laser chip 222 emits green laser light, and the third laser chip 223 emits red laser light. Multiple third laser chips 223 are packaged within the first tube shell 211. The third laser chips 223 are electrically connected to two corresponding second solder pads 241 via the first trace 23 of the first tube shell 211. The two second solder pads 241 are connected to two corresponding third solder pads 1311 (numbered 1 and 2). The third solder pad 1311 numbered 1 is connected to the first positive polarity solder pad (R+) via the interconnection region 12, and the third solder pad 1311 numbered 2 is connected to the first negative polarity solder pad (R-) via the interconnection region 12.

[0208] Multiple first-type laser chips 221 and multiple second-type laser chips 222 are packaged within the second tube shell 212. The first-type laser chips 221 are electrically connected to two corresponding second solder pads 241 via the first trace 23 of the second tube shell 212. The two second solder pads 241 are connected to two corresponding third solder pads 1311 (numbered 5 and 6). The third solder pad 1311 numbered 5 is connected to the second negative-polarity solder pad (B-) via the interconnection region 12, and the third solder pad 1311 numbered 6 is connected to the second positive-polarity solder pad (B+) via the interconnection region 12. The second laser chip 222 is electrically connected to the corresponding two second pads 241 through the first trace 23 in the second tube shell 212. The two second pads 241 are connected to the corresponding two third pads 1311 (numbered 7 and 8). The third pad 1311 numbered 7 is connected to the third positive polarity pad (G+) through the interconnection area 12, and the third pad 1311 numbered 8 is connected to the third negative polarity pad (G-) through the interconnection area 12.

[0209] Based on the above structure, the third pad 1311 numbered 3, the third pad 1311 numbered 4, and the third pad 1311 numbered 5 may have multiple connection modes.

[0210] In some embodiments, as shown in Figures 21 and 28, due to wiring space limitations and the addition of the temperature measuring component 4, if wiring is routed between the third pad 1311 (numbered 5) and the second negative polarity pad (B-), the area of ​​other wiring will be reduced, or the wiring will overlap with the temperature measuring component 4, resulting in a short circuit. Therefore, the third pad 1311 numbered 3, the third pad 1311 numbered 4, and the third pad 1311 numbered 5 can be electrically connected to the second negative polarity pad (B-) through the same interconnection region 12. For example, the second negative polarity pad (B-) is connected to the three third pads 1311 numbered 3, 4, and 5 through the corresponding interconnection region 12. This configuration can, on the one hand, increase the wiring width, thereby increasing the amount of current passing through and improving the luminous intensity of the laser chip 203. On the other hand, it can also avoid affecting the position of the temperature measuring component 4 and the first pad 11, simplifying the structure of the light-emitting device 2000.

[0211] In some embodiments, as shown in FIG29 , third solder pad 1311 numbered 4 and third solder pad 1311 numbered 5 are electrically connected to the second negative polarity solder pad (B-) via the same interconnection region 12. Third solder pad 1311 numbered 5 is correspondingly connected to second solder pad 241 at the bottom of second housing 212, which is connected to the cathode of the blue laser chip, thereby electrically connecting the blue laser chip to the second negative polarity solder pad (B-). In this case, third solder pad 1311 numbered 3 and third solder pad 1311 numbered 2 are electrically connected to the first negative polarity solder pad (R-) via the same interconnection region 12. Third solder pad 1311 numbered 2 is correspondingly connected to second solder pad 241 at the bottom of first housing 211, which is connected to the cathode of the red laser chip, thereby electrically connecting the red laser chip to the first negative polarity solder pad (R-). With this arrangement, the routing widths of the first negative polarity pad (R-) and the second negative polarity pad (B-) can be doubled, thereby increasing the amount of current passing therethrough and improving the luminous intensity of the laser chip 203. It can also avoid affecting the position of the temperature measuring component 4 and the first pad 11, thereby simplifying the structure of the light-emitting device 2000.

[0212] In some embodiments, taking the orientation shown in FIG. 28 or FIG. 29 as an example, with the location of the temperature measuring component 4 as the dividing line, only the first positive polarity pad (R+) and the first negative polarity pad (R-) may be respectively arranged on the left side of the temperature measuring component 4, and the second negative polarity pad (B-), the second positive polarity pad (B+), the third positive polarity pad (G+), and the third negative polarity pad (G-) may be respectively arranged on the right side of the temperature measuring component 4. Correspondingly, the positions of the plurality of third pads 1311 correspond to the positions of the plurality of second pads 241 to ensure uniform trace width.

[0213] For example, as shown in FIG30 , the fourth positive polarity pad (NTC+) and the fourth negative polarity pad (NTC-) can be respectively arranged on the left side of the substrate 100. In this arrangement, the second pad 241 of any tube shell 202 can be directly electrically connected to the first pad 11 adjacent to the second pad 241, but the wiring between the first pad 11 and the temperature measuring component 4 needs to be readjusted. For example, the space on the lower side of the substrate 100 (e.g., the portion of the substrate 100 corresponding to the side where the multiple first pads 11 are away from the tube shell 202) needs to be increased to accommodate this portion of the wiring; alternatively, the fourth positive polarity pad (NTC+) and the fourth negative polarity pad (NTC-) can still be respectively arranged on the left and right sides, with different numbers of first pads 11 on each side.

[0214] In some embodiments, if the space requirement of the temperature measuring component 4 is not considered, the third pads 1311 corresponding to any laser chip 203 can correspond to the position of the second pads 241 of the tube shell 202 and be evenly distributed, which is not limited in the present disclosure.

[0215] For example, as shown in Figure 31, Figure 31 is a circuit diagram corresponding to the light-emitting device 2000 shown in Figure 21 or Figure 28, U1 represents the first tube shell 211, U2 represents the second tube shell 212, the first tube shell 211 and the second tube shell 212 have the same structure, and U2 is obtained by rotating U1 180° clockwise; pin 1 of U1 is connected to TP2, pin 2 is connected to TP3, pin 3 and pin 4 of U1 and pin 5 of U2 are respectively connected to TP4, pin 6 of U2 is connected to TP5, pin 7 is connected to TP6, and pin 8 is connected to TP7. Pins 1-4 of U1 correspond to the four third solder pads 1311 numbered 1-4 respectively, pins 5-8 of U2 correspond to the four third solder pads 1311 numbered 5-8 respectively, TP2 corresponds to the first positive polarity solder pad (R+), TP3 corresponds to the first negative polarity solder pad (R-), TP4 corresponds to the second negative polarity solder pad (B-), TP5 corresponds to the second positive polarity solder pad (B+), TP6 corresponds to the third positive polarity solder pad (G+), and TP7 corresponds to the third negative polarity solder pad (G-).

[0216] In some embodiments, as shown in FIG32 , at least one tube shell 202 includes a first tube shell 211 and a second tube shell 212 , which are arranged along a first direction Y. The light-emitting assembly 200 further includes a lens 8 , which is located on a side of the tube shell 202 away from the substrate 100 . A laser chip 203 and a reflective prism 5 are respectively disposed within the first tube shell 211 and the second tube shell 212 . The laser chip 203 emits laser light along the first direction Y or in a direction opposite to the first direction Y. The laser light is projected onto the reflective surface of the reflective prism and is reflected. The reflected laser light is then emitted through at least one of the light window (sealed glass) or the lens 8 . Here, the first direction Y is the direction from right to left in FIG26 .

[0217] In some embodiments, the light-emitting component 200 further includes at least one light-transmitting glass seal, which is located on a side of the at least one tube shell 202 away from the substrate 100. The at least one tube shell 202 and the at least one light-transmitting glass seal form a housing space, and the housing space accommodates at least one laser chip among the multiple laser chips.

[0218] In some other embodiments, the light emitting device 1000 further includes other components known to those skilled in the art, such as a reflective prism 5 and a heat sink 6 , which are not limited here.

[0219] As shown in Figures 33 to 35, multiple third laser chips 223 are provided in the first tube shell 211. The multiple third laser chips 223 are connected in series. The cathode and anode of the multiple third laser chips 223 are respectively connected to the second solder pad 241 provided at the bottom of the first tube shell 211 through the wiring (such as the first wiring 23) in the first tube shell 211. The second solder pad 241 is electrically connected to the third solder pad 1311 of the substrate 100. The third solder pad 1311 is electrically connected to the first solder pad 11 through the interconnection region 12, thereby realizing the electrical connection between the third laser chip and the substrate 100. The wiring in the first tube shell 211 can be located in the side wall and the bottom wall of the tube shell.

[0220] As shown in Figures 36 to 38, a plurality of first laser chips 221 and a plurality of second laser chips 222 are provided in the first tube shell 211. All the first laser chips 221 are connected in series, and all the second laser chips 222 are connected in series. The plurality of first laser chips 221 and the plurality of second laser chips 222 are separated from each other. The positive and negative electrodes of the first laser chips 221 are electrically connected to the second soldering pad 241 at the bottom of the second tube shell 212 through the wiring in the second tube shell 212, respectively. The second soldering pad 241 is electrically connected to the third soldering pad 1311 of the substrate 100. The third soldering pad 1311 is electrically connected to the third soldering pad 1311 of the substrate 100. The positive and negative electrodes of the second laser chip 222 are electrically connected to the corresponding first pads 11 through the interconnection region 12. The positive and negative electrodes of the second laser chip 222 are respectively electrically connected to the second pads 241 at the bottom of the second tube shell 212 through the wiring inside the second tube shell 212. The second pads 241 are electrically connected to the third pads 1311 of the substrate 100. The third pads 1311 are connected to the corresponding first pads 11 through the interconnection region 12, thereby realizing the electrical connection between the first laser chip 221 and the substrate 100, and the electrical connection between the second laser chip 222 and the substrate 100. The wiring inside the second tube shell 212 is located in the side wall and bottom wall of the tube shell.

[0221] In some embodiments, as shown in Figures 39 to 41 , a laser chip 203 is disposed within any one of the tube shells 202, and the arrangement direction of the multiple tube shells 202 is the same as the arrangement direction of the multiple first solder pads 11. On the side of the tube shells 202 facing the substrate 100, each tube shell 202 includes two second solder pads 241 arranged side by side, at least on the side proximal to the first solder pads 11, and the two second solder pads 241 are respectively connected to a group of first solder pads 11.

[0222] In some examples, a light-emitting device 2000 includes three housings 202, with each type of laser chip 203 individually packaged within a housing 202. That is, the multiple laser chips 203 within a housing 202 emit light of the same color and are connected in series. For example, all first-type laser chips 221 are disposed within the same housing 202, and all first-type laser chips 221 are connected in series; all second-type laser chips 222 are disposed within the same housing 202, and all second-type laser chips are connected in series; and all third-type laser chips 223 are disposed within the same housing 202, and all third-type laser chips 223 are connected in series. Multiple first solder pads 11 are located on the same side of the three housings 202, and the multiple first solder pads 11 and the multiple housings 202 are arranged in the same direction. Two second solder pads 241 are disposed on a side of each housing 202 proximal to the first solder pad 11, and the two second solder pads 241 are arranged in the same direction as the multiple first solder pads 11. The two second pads 241 of any tube shell 202 are electrically connected to a corresponding group of first pads 11 .

[0223] In this case, as shown in Figures 40 to 42, at least one connection pattern 13 includes three connection patterns 13. The substrate 100 includes three connection patterns 13 corresponding to the three tube shells 202. Each connection pattern 13 includes two third solder pads 1311. These two third solder pads 1311 are adjacent to one side of the multiple groups of first solder pads 11 and are arranged side by side. Each third solder pad 1311 is electrically connected to the corresponding first solder pad 11 through the interconnection region 12. The multiple third solder pads 1311 are respectively connected to the multiple second solder pads 241 of the tube shell 202. The second solder pads 241 are electrically connected to the laser chip 203 located in the tube shell 202 via the first traces 23, thereby achieving electrical connection between the laser chip 203 and the corresponding first solder pads 11.

[0224] For example, as shown in Figures 40 and 41, the tube shell 202 on the left is used to package the red laser chip, and the corresponding two second solder pads 241 are respectively connected to the first positive polarity solder pad (R+) and the first negative polarity solder pad (R-) through the third solder pad 1311 and the interconnection area 12. The tube shell 202 in the middle is used to package the blue laser chip, and the corresponding two second solder pads 241 are respectively connected to the second negative polarity solder pad (B-) and the second positive polarity solder pad (B+) through the third solder pad 1311 and the interconnection area 12. The tube shell 202 on the right is used to package the green laser chip, and the corresponding two second solder pads 241 are respectively connected to the third positive polarity solder pad (G+) and the third negative polarity solder pad (G-) through the third solder pad 1311 and the interconnection area 12.

[0225] In other embodiments, as shown in FIG42 , multiple second solder pads 241 may also be disposed on a side of the tube shell 202 close to the first solder pad 11 and a side away from the first solder pad 11. Correspondingly, as shown in FIG41 , multiple third solder pads 1311 are disposed on a side of the substrate body close to the first solder pad 11 and a side away from the first solder pad. If the spacing between the positioning hole and the tube shell 202 and the spacing between the multiple tube shells 202 meet the minimum trace width, an interconnection region 12 may be disposed between the positioning hole and the tube shell 202 or between the multiple tube shells 202 to electrically connect the multiple third solder pads 1311 away from the first solder pad 11 with the multiple third solder pads 1311 close to the first solder pad 11, thereby increasing the trace width and thereby increasing the amount of current passing therethrough.

[0226] In some embodiments, as shown in Figures 43 to 45, at least one tube shell 202 includes a tube shell 202, in which three types of laser chips 203 (i.e., a first type laser chip 221, a second type laser chip 222, and a third type laser chip 223) are disposed. Four second soldering pads 241 are arranged side by side on a first side of the tube shell 202, adjacent to the first soldering pads 11. A second soldering pad 241 is also provided on each of the second and third sides adjacent to the first side, with the second and third sides being arranged opposite each other. The six second soldering pads 241 of the tube shell 202 are connected to the three groups of first soldering pads 11, respectively.

[0227] For example, as shown in FIG45 , the first laser chip 221, the second laser chip 222, and the third laser chip 223 are located within the same tube shell 202. The three laser chips 203 are arranged from left to right and are each connected to the interior of the tube shell 202 via leads and electrically connected to the wiring within the tube shell 202. For example, the third laser chip 223 is a red laser chip, the first laser chip 221 is a blue laser chip, and the second laser chip 222 is a green laser chip. As shown in FIG45 , the light-emitting assembly 200 also includes multiple anti-static devices 7. Blue and green laser chips require anti-static devices 7, while red laser chips require them because the material used for them has strong anti-static capabilities. Therefore, red laser chips can be omitted from the anti-static devices 7.

[0228] It should be noted that, as shown in FIG45 , the light-emitting assembly 200 further includes multiple reflective prisms 5 and multiple heat sinks 6. Multiple laser chips 203 and multiple anti-static devices 7 are disposed on the side of the heat sink 6 away from the substrate 100. The multiple reflective prisms 5 are located on the light-emitting side of the multiple laser chips 203, and the reflective surfaces of the multiple reflective prisms 5 are aligned and matched with the multiple laser chips 203. The multiple laser chips 203 can be disposed correspondingly to the multiple heat sinks 6, or multiple laser chips 203 emitting the same color can be disposed on the same heat sink 6, without limitation.

[0229] As shown in Figures 46 and 47, the side of the tube shell 202 closest to the first solder pad 11 is the first side, and the second and third sides are located on the left and right sides of the first side, respectively, and are adjacent to the first side. Four second solder pads 241 are arranged side by side on the first side of the tube shell 202, one second solder pad 241 is arranged on the second side, and one second solder pad 241 is arranged on the third side.

[0230] Correspondingly, as shown in FIG44 , four third pads 1311 are provided on one side of the connection pattern 13 near the first pad 11 (corresponding to the first side of the housing 202). A third pad 1311 is provided on the left and right sides of the four third pads 1311 (corresponding to the second and third sides of the housing 202). The six third pads 1311 are connected to the six second pads 241, respectively. The six third pads 1311 are electrically connected to the corresponding first pads 11 via the interconnection regions 12, thereby achieving corresponding connections between the six second pads 241 and the six first pads 11.

[0231] The connection relationship between the six second pads 241 and the six first pads 11 is as follows:

[0232] As shown in Figures 44 and 47, the second pad 241 on the second side (taking the left side as an example) is electrically connected to the third pad 1311 numbered 1, and the third pad 1311 numbered 1 is electrically connected to the first positive polarity pad (R+) through the interconnection region 12. In this case, at least one of the third pads 1311 numbered 9 or 10 and the third pad 1311 numbered 1 can be electrically connected to the first positive polarity pad (R+) through the same interconnection region 12.

[0233] The first second solder pad 241 at the left end of the first side is electrically connected to the third solder pad 1311 numbered 2, and the third solder pad 1311 numbered 2 is electrically connected to the first negative polarity solder pad (R-) through the interconnection area 12. The second second solder pad 241 at the left end of the first side is electrically connected to the third solder pad 1311 numbered 3, and the third solder pad 1311 numbered 3 is electrically connected to the second negative polarity solder pad (B-) through the interconnection area 12. The second second solder pad 241 at the right end of the first side is electrically connected to the third solder pad 1311 numbered 4, and the third solder pad 1311 numbered 4 is electrically connected to the second positive polarity solder pad (B+) through the interconnection area 12. The first second solder pad 241 at the right end of the first side is electrically connected to the third solder pad 1311 numbered 5, and the third solder pad 1311 numbered 5 is electrically connected to the third positive polarity solder pad (G+) through the interconnection area 12.

[0234] The second pad 241 on the third side (taking the right side as an example) is electrically connected to the third pad 1311 numbered 6, and the third pad 1311 numbered 6 is electrically connected to the third negative polarity pad (G-) through the interconnection region 12. In this case, at least one of the third pads 1311 numbered 7 or 8 and the third pad 1311 numbered 6 can be electrically connected to the third negative polarity pad (G-) through the same interconnection region 12.

[0235] Of course, in other embodiments, the first positive polarity pad (R+) can also be connected to at least one of the third pads 1311 numbered 1, 10, or 9 through the interconnection region 12; similarly, the third negative polarity pad (G-) can be connected to at least one of the third pads 1311 numbered 6, 7, and 7 through the interconnection region 12. The above structure can be configured according to the relative positions and sizes of the substrate 100, the tube housing 202, and the positioning holes, and is not limited in this disclosure.

[0236] In some embodiments, as shown in Figures 46 and 47, four second solder pads 241 are arranged side by side on a fourth side of the tube housing 202, which is opposite to the first side. Two of the four second solder pads 241 are connected to one third solder pad 1311 through two corresponding third solder pads 1311 via the same interconnection region 12. The third solder pad 1311 is connected to the second solder pads 241 on the second side. The other two second solder pads 241 are connected to one third solder pad 1311 through two corresponding third solder pads 1311 via the same interconnection region 12. The third solder pad 1311 is connected to the second solder pads 241 on the third side.

[0237] The fourth side of the housing 202, which is the side away from the first pads 11, is provided with four second pads 241. Correspondingly, as shown in FIG44 , four third pads 1311 (numbered 7, 8, 9, and 10) are also provided on the side of the connection pattern 13 away from the first pads 11. These four third pads 1311 are electrically connected to the four second pads 241 on the fourth side, respectively.

[0238] The two third solder pads 1311 numbered 9 and 10 are electrically connected to a third solder pad 1311 (numbered 1) located on the left side of the connection pattern 13, so that the three third solder pads 1311 numbered 1, 9, and 10 are electrically connected to the first positive polarity solder pad (R+) through the same interconnection region 12. This connects the two second solder pads 241 on the fourth side of the package 202 to the second solder pad 241 on the second side through the same interconnection region 12. The two third solder pads 1311 numbered 7 and 8 are electrically connected to a third solder pad 1311 (numbered 6) located on the right side of the connection pattern 13, so that the three third solder pads 1311 numbered 6, 7, and 8 are electrically connected to the third negative polarity solder pad (G-) through the same interconnection region 12.

[0239] With this arrangement, the first positive-polarity pad (R+) and the third negative-polarity pad (G-) are respectively connected to the three third pads 1311, so that the two second pads 241 on the fourth side of the tube shell 202 can be connected to the second pads 241 on the third side through the same interconnection region 12. In this way, the width of the interconnection region 12 can be increased, which is conducive to increasing the current flow.

[0240] It should be noted that Figures 44 and 46 only take the multiple third pads 1311 on the side of the substrate 100 away from the first pad 11 as an example, with two as a group, that is, numbers 9 and 10 are a group, and 7 and 8 are a group, and the third pads 1311 numbered 9 and 10 are electrically connected to the third pad 1311 numbered 1, and the third pads 1311 numbered 7 and 8 are electrically connected to the third pad 1311 numbered 6, but this does not constitute a limitation on the light-emitting device 2000 provided in some embodiments of the present disclosure.

[0241] In some other embodiments, at least one of the four third solder pads 1311 (numbered 7, 8, 9 and 10) on the fourth side of the tube shell 202 can be electrically connected to the third solder pad 1311 numbered 1, and at least one of the remaining third solder pads 1311 can be electrically connected to the third solder pad 1311 numbered 6. For example, the third solder pads 1311 numbered 8, 9, and 10 are electrically connected to the third solder pad 1311 numbered 1, and the third solder pad 1311 numbered 7 is electrically connected to the third solder pad 1311 numbered 6, or the third solder pad 1311 numbered 10 is electrically connected to the third solder pad 1311 numbered 1, and the third solder pads 1311 numbered 7, 8, and 9 are electrically connected to the third solder pad 1311 numbered 6, or the third solder pads 1311 numbered 7, 8, 9, and 10 are electrically connected to the third solder pad 1311 numbered 1, or the third solder pads 1311 7, 8, 9, and 10 are electrically connected to the third solder pad 1311 numbered 6, which is not limited here.

[0242] In some embodiments, within the plane of the substrate 100, the width of a single side of the first pad 11 is any value in the range of 1.3 mm to 1.7 mm. For example, the width of a single side of the first pad 11 is 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, or 1.7 mm. Along the arrangement direction of the plurality of first pads 11, the spacing between two adjacent first pads 11 is any value in the range of 0.8 mm to 1.2 mm. For example, the spacing between adjacent first pads 11 is 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, or 1.2 mm.

[0243] In some embodiments, within the plane of the substrate 100, the width of the long side of the third solder pad 1311 is any value between 1.1 mm and 1.5 mm, for example, the width of the long side of the third solder pad 1311 is 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, or 1.5 mm. The width of the short side is any value between 0.4 mm and 0.8 mm, for example, the width of the short side is 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, or 0.8 mm. Along the arrangement direction of the plurality of third solder pads 1311, the spacing between adjacent third solder pads 1311 is any value between 0.1 mm and 0.5 mm, for example, the spacing between adjacent third solder pads 1311 is 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm.

[0244] The present disclosure does not limit the size (including length and width) of the tube shell 202, and the size of the tube shell 202 can be set according to the requirements of the light-emitting device 2000. For example, the size of the tube shell 202 is 10.6 mm in length and 6.4 mm in width.

[0245] The present disclosure also provides a method for preparing a light-emitting device, which can be applied to prepare the light-emitting device 2000 of any of the above embodiments. FIG48A is a flow chart of a method for preparing a light-emitting device according to some embodiments. As shown in FIG48A , the method includes steps 901 to 905.

[0246] In step 901 , a laser chip 203 , a receiving structure 2021 , a cover plate 2022 and a plurality of first sealing portions 2023 are provided.

[0247] In step 902 , the laser chip 203 is placed in the accommodation structure 2021 .

[0248] In step 903 , a plurality of first sealing portions 2023 are disposed on a side of the cover plate 2022 facing the accommodating structure 2021 ; two adjacent first sealing portions 2023 among the plurality of first sealing portions 2023 are disposed at intervals.

[0249] In step 904, the accommodating structure 2021 and the cover plate 2022 are connected by multiple first sealing parts 2023, so that any two adjacent first sealing parts 2023 contact each other to connect the accommodating structure 2021 and the cover plate 2022, so as to close the gap at the connection between the accommodating structure 2021 and the cover plate 2022 to form the light-emitting component 200.

[0250] In step 905 , the light emitting component 200 is electrically connected to the substrate 100 .

[0251] In some embodiments, the method further includes: providing a second sealing portion 2024 on a side of the cover plate 2022 facing the accommodating structure 2021 .

[0252] FIG48B is another flow chart of a method for preparing a laser projection device according to some embodiments. In some embodiments, as shown in FIG48B , the method further includes step 913 .

[0253] In step 913 , the plurality of first sealing portions 2023 are connected to the second sealing portion 2024 .

[0254] FIG49 is another flow chart of a method for manufacturing a laser projection device according to some embodiments. In some embodiments, as shown in FIG49 , step 904 includes step 1001 and step 1002 .

[0255] In step 1001 , the plurality of first sealing portions 2023 are heated so that the plurality of first sealing portions 2023 are in a molten state.

[0256] In step 1002 , multiple first sealing parts 2023 are simultaneously connected to the accommodating structure 2021 , and pressure is applied to the multiple first sealing parts 2023 so that adjacent first sealing parts 2023 contact each other to close the gap at the connection between the accommodating structure 2021 and the cover plate 2022 .

[0257] FIG50 is another flow chart of a method for manufacturing a laser projection device according to some embodiments. In some embodiments, as shown in FIG50 , step 913 includes step 1101 and step 1102 .

[0258] In step 1101 , the number of first sealing portions 2023 , the distance between any two adjacent first sealing portions 2023 among the plurality of first sealing portions 2023 , and the radius of the first sealing portion 2023 are determined.

[0259] In step 1102 , the plurality of first sealing portions 2023 are connected to the second sealing portion 2024 according to the number of the first sealing portions 2023 , the distance between any two adjacent first sealing portions 2023 , and the radius of the first sealing portion 2023 .

[0260] The following, in conjunction with the accompanying drawings, illustrates the preparation process and operating principles of the light-emitting device 2000 provided in some embodiments of the present disclosure. It should be noted that the preparation methods in some embodiments of the present disclosure are merely illustrative, and the steps of some methods may be interchangeable. In the preparation methods of some embodiments of the present disclosure, the preparation process of all possible components of the light-emitting device 2000 may not be fully described. Where examples are not provided, it should be considered that these are omitted for the sake of brevity.

[0261] First, a laser chip 203 , a receiving structure 2021 , a cover plate 2022 , a plurality of first sealing portions 2023 and a second sealing portion 2024 are provided.

[0262] Figure 51 is a structural diagram of the cover plate and the second sealing portion according to some embodiments. As shown in Figure 51, a second sealing portion 2024 is then provided at the second sealing area corresponding to the side of the cover plate 2022 facing the accommodating structure 2021. The second sealing portion 2024 can be used to connect the first sealing portion 2023. For example, a metallization layer is prepared at the second sealing area. The cover plate 2022 is used to form the tube shell 202 with the accommodating structure 2021 to achieve sealing for the laser chip inside the tube shell 2022. The material of the cover plate 2022 can be high-strength sapphire, or it can also be quartz, glass, etc. The second sealing portion 2024 is provided around the cover plate 2022, and the remaining area of ​​the cover plate 2022 is a light-transmitting area. The second sealing portion 2024 achieves high airtightness by combining with the first sealing portion 2023.

[0263] Figure 52 illustrates the structure of a cover plate, multiple first sealing portions, and a second sealing portion according to some embodiments. Subsequently, as shown in Figure 52 , the number of first sealing portions 2023, the spacing between the multiple first sealing portions 2023, and the radius of the first sealing portions 2023 are determined based on the size of the tube shell 202. Furthermore, the multiple first sealing portions 2023 are connected to the second sealing portion 2024 based on the number of first sealing portions 2023, the spacing between the multiple first sealing portions 2023, and the radius of the first sealing portions 2023.

[0264] As shown in Figure 13 , components or structures such as a laser chip 203, a steering component 204, and a heat sink are then placed within the housing structure 2021. The laser chip 203 is configured to emit a light beam, and the steering component 204 is configured to redirect the light beam. For example, the steering component 204 is a reflector. The heat sink is configured to conduct heat generated by the laser chip 203.

[0265] Figure 53 illustrates the structure of a light-emitting assembly according to some embodiments. As shown in Figure 53 , the prepared cover plate 2022 and the housing structure 2021 are aligned, and the first sealing portions 2023 are heated. Pressure is then applied to the cover plate 2022, causing the multiple first sealing portions 2023 to change shape under the pressure, filling the sealing area 300 and completing the seal between the cover plate 2022 and the housing structure 2021.

[0266] Figure 54 is another structural diagram of a light-emitting device according to some embodiments. As shown in Figure 54, the light-emitting component 200 is electrically connected to the substrate 100 to complete the preparation of the light-emitting device 2000. The substrate 100 can not only be used to fix the light-emitting component 200, but also a printed circuit board (PCB) can be set inside the substrate 100 to realize the circuit interconnection function between the substrate 100 and the tube shell 202, and then the substrate 100 is electrically connected to the laser chip 203. The tube shell 202 and the substrate 100 can be fixed by reflow soldering using tin-silver-copper alloy, or the tube shell 202 and the substrate 100 can also be fixed by high-temperature pressure sintering silver paste or copper paste. The material of the substrate 100 can be metal materials such as oxygen-free copper and red copper.

[0267] In some embodiments, the first sealing portion 2023 can be prefabricated on a large scale on the substrate corresponding to the cover plate 2022. Figure 55 is a partial structural diagram of the cover plate according to some embodiments. As shown in Figure 55, the transmittance of the cover plate 2022 is increased by providing a transmissive film layer, and the cover plate 2022 is metallized and sputtered to form the second sealing portion 2024. The first sealing portion 2023 is then prefabricated on the second sealing portion 2024. After completing all the processes (i.e., after the cover plate 2022 and the accommodating structure 2021 are connected), the cover plate 2022 is cut into shape. Metallization sputtering is a common surface coating technology that can form a metal film on the surface of the material. And it is achieved through a physical sputtering process.

[0268] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0269] It should be noted that any one of the disclosed technical solutions in the present disclosure can solve one or more of the above-mentioned technical problems to a certain extent and achieve corresponding technical effects. Alternatively, multiple disclosed technical solutions can also be combined into an overall solution to solve one or more of the above-mentioned technical problems and achieve corresponding technical effects. Alternatively, some of the disclosed technical solutions are combined into an overall solution, and combined with related technologies and deterioration solutions, but the solution can compensate for the deterioration trend through the technical means of the present disclosure, thereby solving one or more of the above-mentioned technical problems to a certain extent as a whole and achieving corresponding technical effects. Alternatively, each disclosed technical solution is combined into a complete technical solution, constituting an organic and inseparable overall solution, thereby solving the technical problems as a whole and achieving corresponding technical effects.

[0270] Any technical solution disclosed in this disclosure, as well as the recombination of multiple technical solutions disclosed, can form a complete technical solution, and can solve one or more of the above-mentioned technical problems and achieve corresponding technical effects. They all belong to the content of this disclosure and are the content that is directly and unambiguously determined based on the content of this disclosure.

[0271] Those skilled in the art will appreciate that the scope of this disclosure is not limited to the specific embodiments described above, and that certain elements of the embodiments may be modified or replaced without departing from the spirit of this disclosure. The scope of this disclosure is limited by the appended claims. In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Claims

1. A light emitting device, comprising: Base plate, comprising: substrate body; at least one connection pattern, provided on the substrate body and comprising a conductive portion; a plurality of interconnection regions disposed on the substrate body; and a plurality of groups of first pads, disposed on the substrate body, the plurality of groups of first pads being electrically connected to the conductive portion through the plurality of interconnection regions, any group of first pads among the plurality of groups of first pads comprising two first pads with different polarities; and A light-emitting component is fixed on the at least one connection pattern and comprises: At least one tube shell, at least one of the side wall or the bottom wall of the at least one tube shell being provided with a first wiring; a conductive structure, disposed on a side of the at least one tube shell facing the substrate and electrically connected to the first trace and the conductive portion; and A plurality of laser chips are disposed in the at least one tube shell and electrically connected to the first trace, the plurality of laser chips emit at least two lasers of different colors, and the same laser chip among the plurality of laser chips is electrically connected to any one group of first pads.

2. The light emitting device according to claim 1, wherein: The at least one connection pattern is arranged on a side of the substrate body facing the light-emitting component; a plurality of second routing lines are arranged in the substrate body, and the plurality of second routing lines form the plurality of interconnection areas; in a direction perpendicular to the plane where the substrate is located, any first soldering pad in the plurality of groups of first soldering pads at least partially overlaps with any interconnection area in the plurality of interconnection areas, the conductive portion at least partially overlaps with the plurality of interconnection areas, and the conductive structure at least partially overlaps with the conductive portion.

3. The light emitting device according to claim 1 or 2, wherein: Any one of the multiple laser chips includes multiple laser chips, and the multiple laser chips in the same laser chip are connected in series to form a series circuit, and the two ends of the series circuit are electrically connected to the corresponding two first solder pads respectively; the number of the multiple first solder pads in the multiple groups of first solder pads that are electrically connected to the light-emitting component is twice the number of types of the multiple laser chips.

4. The light emitting device according to any one of claims 1 to 3, wherein: The conductive structure includes a plurality of second pads, and the plurality of second pads correspond to the side wall of the at least one tube shell; the conductive part includes a plurality of third pads, the plurality of third pads correspond to the plurality of second pads respectively and are welded and connected, and the plurality of second pads are electrically connected to the first trace.

5. The light emitting device according to any one of claims 1 to 4, wherein: Any one of the multiple laser chips includes one or more laser chips, and the one or more laser chips emit lasers of the same color; the multiple laser chips include a first laser chip, a second laser chip, and a third laser chip, and the first laser chip, the second laser chip, and the third laser chip respectively emit lasers of different colors.

6. The light emitting device according to claim 5, wherein: The wavelength of the laser light emitted by the third laser chip is greater than the wavelength of the laser light emitted by the first laser chip and the second laser chip.

7. The light emitting device according to claim 5 or 6, satisfying one of the following conditions: The at least one tube shell comprises a first tube shell and a second tube shell arranged side by side, the third laser chip is arranged in the first tube shell, and the first laser chip and the second laser chip are both arranged in the second tube shell; The at least one tube shell comprises three tube shells, the three tube shells are arranged along the length direction of the substrate, and the first laser chip, the second laser chip and the third laser chip are respectively arranged in the three tube shells; and The at least one tube shell comprises a tube shell, and the first laser chip, the second laser chip and the third laser chip are all arranged in the tube shell.

8. The light emitting device according to any one of claims 1 to 7, wherein: The at least one tube shell includes a plurality of tube shells, and at least one laser chip of the plurality of laser chips is disposed in any one of the plurality of tube shells.

9. The light emitting device according to claim 8, wherein: The arrangement direction of the plurality of tube shells is the same as the arrangement direction of the plurality of groups of first pads.

10. The light emitting device according to any one of claims 1 to 9, wherein: The material of the side wall of the at least one tube shell is ceramic, and the material of the bottom wall of the at least one tube shell is metal. 11 . The light emitting device according to claim 1 , further comprising a temperature measuring component, wherein the temperature measuring component is connected to a corresponding group of first solder pads in the plurality of groups of first solder pads through a second wiring.

12. The light emitting device according to claim 11, wherein: The temperature measuring component satisfies one of the following conditions: The temperature measuring component is located in the middle of the arrangement direction of the multiple groups of first solder pads, and the multiple groups of first solder pads are symmetrically arranged on both sides of the temperature measuring component.

13. The light emitting device according to any one of claims 1 to 12, wherein: The plurality of groups of first pads satisfy one of the following: In the plane where the substrate is located, the multiple groups of first pads are all located on the same side of the substrate body and close to the edge of the substrate body; The first soldering pads of the same polarity in the plurality of groups of first soldering pads are arranged adjacent to each other; and The pads with different polarities in any group of first pads are arranged adjacent to each other.

14. The light emitting device according to any one of claims 1 to 13, wherein: In the plane where the substrate is located, the single-side width of any first solder pad in the multiple groups of first solder pads is any value in the range of 1.3mm to 1.7mm; along the arrangement direction of the multiple groups of first solder pads, the spacing between two adjacent first solder pads is any value in the range of 0.8mm to 1.2mm.

15. The light emitting device according to any one of claims 1 to 14, wherein: Any first pad in the plurality of groups of first pads is a metal layer and is rectangular.

16. The light emitting device according to any one of claims 1 to 15, wherein: Any one of the at least one connection pattern further includes a fixing portion, the fixing portion is provided on the substrate body, the fixing portion corresponds to the bottom wall of the at least one tube shell, and the light emitting component is provided on the fixing portion; The light emitting component further comprises at least one metal film, which is disposed on a side of the at least one tube shell facing the substrate body, and any one of the at least one metal film corresponds to and is connected to the fixing portion.

17. The light-emitting device according to any one of claims 1 to 16, further comprising an electrical coupling component, wherein the electrical coupling component is arranged in an area of ​​the substrate body close to the multiple groups of first solder pads, the electrical coupling component and the multiple groups of first solder pads are electrically connected, and the electrical coupling component is configured to connect an external electrical signal.

18. The light emitting device according to any one of claims 1 to 17, wherein: The light-emitting component further includes at least one light-transmitting glass seal, which is located on a side of the at least one tube shell away from the substrate. The at least one tube shell and the at least one light-transmitting glass seal form a housing space, and the housing space accommodates at least one laser chip among the multiple laser chips.

19. A method for preparing a light-emitting device, the light-emitting device comprising a substrate and a light-emitting component, the light-emitting component comprising a laser chip, a containing structure, a cover plate and a plurality of first sealing parts, wherein: The method comprises: Providing the laser chip, the accommodating structure, the cover plate and the plurality of first sealing parts; Disposing the laser chip in the accommodating structure; The plurality of first sealing portions are arranged on a side of the cover plate facing the accommodating structure; two adjacent first sealing portions among the plurality of first sealing portions are arranged at intervals; The accommodating structure and the cover plate are connected by the plurality of first sealing portions, so that any two adjacent first sealing portions are in contact with each other to connect the accommodating structure and the cover plate, so as to close a gap at a connection between the accommodating structure and the cover plate, thereby forming the light-emitting assembly; The light emitting component is electrically connected to the substrate.

20. A laser device comprising: A light source assembly configured to emit an illumination light beam; the light source assembly comprises a light emitting device as claimed in any one of claims 1 to 18; An optical modulation component, configured to modulate the illumination light beam provided by the light source component to obtain a projection light beam; as well as The lens is configured to image the projection light beam.

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