Circuit board and semiconductor package comprising the same
By introducing a high-rigidity glass core layer with a low coefficient of thermal expansion and highly adhesive metal components into the circuit board, the problems of circuit board warping and reliability are solved, and the requirements for high density and miniaturization of circuit boards are met.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LG INNOTEK CO LTD
- Filing Date
- 2024-11-04
- Publication Date
- 2026-07-14
AI Technical Summary
In the pursuit of high density and miniaturization, existing circuit boards are prone to warping and reliability issues. Furthermore, the increased density of circuit patterns leads to an increase in the area and thickness of the circuit board, affecting product cost and reliability.
A glass layer with high rigidity and low coefficient of thermal expansion is used as the core layer, and a first metal part with high adhesion to the core layer and the second metal part is formed in the via. The via electrode is formed by multiple metal parts, and the central axis of the via is offset from the central axis of the electrode to balance the stress.
It effectively suppresses warping, improves the reliability and electrical characteristics of circuit boards, enhances the reliability of via electrodes, ensures chemical balance and stress equilibrium, and improves structural stability.
Smart Images
Figure CN122397323A_ABST