Passive device and method of making the same

Abstract

A passive device, the passive device (100) comprises at least two functional parts, the edge of the insulating part is inwardly recessed relative to the edge of the base (1), the surface of the base (1) is exposed, the exposed part of the base (1) can form protection for the side surface of the functional part, the influence of the side surface of the functional part can be reduced or prevented during the process or packaging process, so that the structure of the passive device (100) is more stable, the reliability is good, and the electrical consistency is better. When the adjacent two passive devices (100) are separated by means of scribing and cutting process, the exposed part of the base (1) between the adjacent passive devices (100) can be cut, the insulating part will not be subjected to cutting stress, and will not be naturally separated from the base (1), avoiding the problem that the conductive part in the passive device (100) falls off, and the purpose of nondestructive cutting can be achieved. A manufacturing method of the passive device is also provided.

Description

Passive device and manufacturing method thereof Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a passive device and a manufacturing method thereof. Background Art

[0002] The wafer includes a device region and scribe lines. The device region is used to form passive devices, and the scribe lines are used to separate the passive devices.

[0003] Since the size of passive components is at the millimeter level, a scribing and cutting process is required. This process will cause the insulating layer to peel off from the substrate. The peeling of the insulating layer will cause the conductive layer in the passive component to fall off, resulting in abnormal performance of the passive component.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field.

[0005] Summary of the Invention

[0006] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art and to provide a passive device and a method for manufacturing the same.

[0007] According to one aspect of the present invention, a passive device is provided, comprising a substrate and at least two functional parts; the at least two functional parts are arranged on one side of the substrate, the functional parts comprising a conductive part and an insulating part arranged in sequence in a direction away from the substrate, the insulating part covering the conductive part, two adjacent layers of insulating parts contacting each other, and an edge of the insulating part being retracted relative to an edge of the substrate, exposing the surface of the substrate.

[0008] In one embodiment of the present invention, the at least two functional parts include a first functional part and a second functional part arranged in sequence along a direction away from the substrate, the first functional part includes a first conductive part and a first insulating part, the second functional part includes a second conductive part and a second insulating part, the first insulating part is arranged on a side of the first conductive part away from the substrate, the second conductive part is arranged on a side of the first insulating part away from the substrate, the second insulating part covers the second conductive part and is in contact with the first insulating part, the edge of the second insulating part is farther from the edge of the substrate than the edge of the first insulating part, and the side of the first insulating part away from the substrate is exposed.

[0009] In one embodiment of the present invention, at least two functional parts further include a third functional part, which is arranged on a side of the second functional part away from the substrate, and the third functional part includes a third conductive part and a third insulating part. The third conductive part is arranged on a side of the second insulating part away from the substrate, and the third insulating part covers the third conductive part and is in contact with the second insulating part. The edge of the third insulating part is farther from the edge of the substrate than the edge of the second insulating part, exposing the side of the second insulating part away from the substrate.

[0010] In one embodiment of the present invention, the passive device further includes a first passivation portion, which is disposed between the first conductive portion and the first insulating portion. The first passivation portion covers the first conductive portion and contacts the substrate. An edge of the first passivation portion is flush with or retracted relative to an edge of the substrate.

[0011] In one embodiment of the present invention, an edge of the second insulating portion is farther from an edge of the substrate than an edge of the first insulating portion, exposing a side of the first insulating portion away from the substrate, and an edge of the third insulating portion is farther from an edge of the substrate than an edge of the second insulating portion, exposing a side of the second insulating portion away from the substrate.

[0012] In one embodiment of the present invention, an edge of the first passivation portion is flush with an edge of the substrate.

[0013] In one embodiment of the present invention, an edge of the first passivation portion and an edge of the first insulating portion are flush with each other.

[0014] In one embodiment of the present invention, edges of the first insulating portion, the second insulating portion, the third insulating portion, and the first passivation portion are flush with each other.

[0015] In one embodiment of the present invention, the edges of the first insulating portion, the second insulating portion and the first passivation portion are flush with each other, and the edge of the third insulating portion is farther from the substrate than the edge of the second insulating portion, exposing a side of the second insulating portion away from the substrate.

[0016] In one embodiment of the present invention, the edge of the first insulating portion and the edge of the first passivation portion are flush with each other, the edge of the second insulating portion is farther from the edge of the substrate than the edge of the first insulating portion, exposing a side of the first insulating portion away from the substrate, and the edge of the third insulating portion is flush with the edge of the second insulating portion.

[0017] In one embodiment of the present invention, one side of the first insulating portion, one side of the second insulating portion, one side of the third insulating portion, and one side of the first passivation portion are flush with each other, the other side of the first insulating portion and the other side of the first passivation portion are flush with each other, the other side of the second insulating portion is farther from the edge of the substrate than the other side of the first insulating portion, exposing the side of the first insulating portion away from the substrate, and the other side of the third insulating portion is farther from the edge of the substrate than the other side of the second insulating portion, exposing the side of the second insulating portion away from the substrate.

[0018] In one embodiment of the present invention, one side of the first insulating portion, one side of the second insulating portion, and one side of the first passivation portion are flush with each other, the other side of the first insulating portion and the other side of the first passivation portion are flush with each other, the other side of the second insulating portion is farther from the edge of the substrate than the other side of the first insulating portion, exposing the side of the first insulating portion away from the substrate, and both sides of the third insulating portion are farther from the edge of the substrate than both sides of the second insulating portion, exposing the side of the second insulating portion away from the substrate.

[0019] In one embodiment of the present invention, the first insulating portion extends to the side of the first passivation portion and extends from the side of the first passivation portion to the surface of the substrate, the second insulating portion extends to the side of the first insulating portion and extends from the side of the first insulating portion to the surface of the substrate, and the third insulating portion extends to the side of the second insulating portion and extends from the side of the second insulating portion to the surface of the substrate.

[0020] In one embodiment of the present invention, the substrate is made of glass.

[0021] In one embodiment of the present invention, the second conductive part is connected to the first conductive part through a first via provided on the first insulating part and the first passivation part, the third conductive part is connected to the second conductive part through a second via provided on the second insulating part, and the passive device also includes a conductive column, which is connected to the third conductive part through a third via provided on the third insulating part.

[0022] In one embodiment of the present invention, the passive device further includes a protective layer, which covers the side surfaces of the three insulating parts, the side surfaces of the second insulating part, the side surfaces of the first insulating part, the side surfaces of the first passivation part, the exposed area of ​​the first insulating part on the side away from the substrate, the exposed area of ​​the second insulating part on the side away from the substrate, and at least a portion of the area of ​​the third insulating part on the side away from the substrate.

[0023] According to another aspect of the present invention, a method for manufacturing the passive device provided in one aspect of the present invention is provided, the method comprising:

[0024] forming a functional layer group on the substrate body, wherein the functional layer group comprises a plurality of conductive parts and an insulating layer sequentially arranged in a direction away from the substrate body, wherein the insulating layer covers the plurality of conductive parts;

[0025] forming a cutting groove section on the insulating layer of the functional layer group, wherein the cutting groove section penetrates the insulating layer and is located between the conductive parts;

[0026] forming another functional layer group on a side of the functional layer group away from the substrate body, the other functional layer group including a plurality of other conductive portions and an other insulating layer, the other insulating layer covering the plurality of other conductive portions, and the insulating layers of two adjacent functional layer groups contacting each other;

[0027] forming other cutting groove segments on the insulating layers of other functional layer groups, wherein the cutting groove segments are interconnected and their orthographic projections on the substrate body overlap with each other to form cutting grooves, and the cutting grooves expose the substrate body;

[0028] A scribing process is used to cut along the cutting grooves to form multiple passive components.

[0029] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are incorporated into and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0031] FIG1 is a schematic diagram showing the distribution of all passive components and cutting grooves between adjacent passive components on a wafer according to an embodiment of the present invention.

[0032] FIG2 is a schematic plan view of some passive components and some cutting grooves involved in an embodiment of the present invention.

[0033] FIG3 is a schematic cross-sectional view taken along line AA of FIG2 according to an embodiment of the present invention, when the passive component includes a first functional portion and a second functional portion.

[0034] FIG4 is a schematic cross-sectional view taken along line AA in FIG2 of the embodiment of the present invention when the first functional portion includes a first passivation portion.

[0035] FIG5 is a schematic cross-sectional view taken along line AA of FIG2 according to an embodiment of the present invention when the passive device includes a protection layer.

[0036] FIG6 is a schematic cross-sectional view taken along line AA of FIG2 according to an embodiment of the present invention when the passive component includes a first functional portion, a second functional portion, and a third functional portion.

[0037] 7 is a schematic cross-sectional view taken along line AA of FIG. 2 according to an embodiment of the present invention, when the passive component includes a first functional portion, a second functional portion, and a third functional portion, and the first functional portion includes a first passivation portion.

[0038] 8 is a schematic diagram of a partial structure of a passive device according to an embodiment of the present invention, wherein the passive device includes a first functional portion, a second functional portion, and a third functional portion, and the first functional portion includes a first passivation portion.

[0039] 9 is a schematic cross-sectional view taken along line BB of FIG. 8 according to an embodiment of the present invention, when the passive component includes a first functional portion, a second functional portion, and a third functional portion, and the first functional portion includes a first passivation portion.

[0040] Figure 10 is a schematic diagram of the AA cross-section of Figure 2 of the embodiment of the present invention when the protective layer covers the side surfaces of the three insulating parts, the side surfaces of the second insulating part, the side surfaces of the first insulating part, at least a portion of the area on the side of the first passivation part away from the substrate, and at least a portion of the area on the side of the third insulating part away from the substrate.

[0041] Figure 11 is a schematic AA cross-sectional view of Figure 2 of the embodiment of the present invention when the protective layer covers the side surfaces of the three insulating parts, the side surfaces of the second insulating part, the side surfaces of the first insulating part, the entire surface of the first passivation part away from the substrate, and the entire surface of the third insulating part away from the substrate.

[0042] 12 is a schematic cross-sectional view taken along line AA of FIG. 2 according to the embodiment of the present invention when two sides of the first cutting groove segment, two sides of the second cutting groove segment, two sides of the third cutting groove segment, and two sides of the fourth cutting groove segment are flush with each other.

[0043] Figure 13 is a schematic diagram of the AA cross-section of Figure 2 of the embodiment of the present invention when the two sides of the first cutting groove segment, the two sides of the second cutting groove segment and the two sides of the fourth cutting groove segment are flush with each other, and the two sides of the third cutting groove segment are closer to the edge of the substrate than the two sides of the second cutting groove segment.

[0044] Figure 14 is a schematic diagram of the AA cross-section of Figure 2 of an embodiment of the present invention when the two sides of the first cutting groove segment and the two sides of the fourth cutting groove segment are flush with each other, the two sides of the second cutting groove segment are closer to the edge of the base than the two sides of the first cutting groove segment, and the two sides of the third cutting groove segment and the two sides of the second cutting groove segment are flush with each other.

[0045] Figure 15 is a schematic diagram of the AA cross-section of Figure 2 of an embodiment of the present invention, in which one side of the cutting groove is a flat surface, the other side of the first cutting groove segment and the other side of the fourth cutting groove segment are flush with each other, the other side of the second cutting groove segment is closer to the edge of the substrate relative to the other side of the first cutting groove segment, and the other side of the third cutting groove segment is closer to the edge of the substrate relative to the other side of the second cutting groove segment.

[0046] Figure 16 is a schematic diagram of the AA cross-section of Figure 2 of an embodiment of the present invention, where one side of the cutting groove is a flat surface, the other side of the first cutting groove segment and the other side of the fourth cutting groove segment are flush with each other, the other side of the third cutting groove segment and the other side of the second cutting groove segment are flush with each other, and the other side of the second cutting groove segment is closer to the edge of the substrate than the other side of the first cutting groove segment.

[0047] Figure 17 is a schematic diagram of the AA cross-section of Figure 2 of the embodiment of the present invention when the other side of the first cutting groove segment, the other side of the second cutting groove segment and the other side of the fourth cutting groove segment are flush with each other, and the other side of the third cutting groove segment is closer to the edge of the substrate than the other side of the second cutting groove segment.

[0048] Figure 18 is a schematic diagram of the AA cross-section of Figure 2 of the embodiment of the present invention when the other side of the first cutting groove segment, the other side of the second cutting groove segment and the other side of the fourth cutting groove segment are flush with each other, and the other side of the third cutting groove segment is closer to the edge of the substrate than the other side of the second cutting groove segment.

[0049] Figure 19 is a schematic diagram of the AA cross-section involved in Figure 2 of the embodiment of the present invention when the first insulating part extends to the side of the first passivation part, the second insulating part extends to the side of the first insulating part, and extends from the side of the first insulating part to the surface of the substrate, and the third insulating part extends to the side of the second insulating part.

[0050] FIG20 is a flow chart of a method for manufacturing a passive device according to an embodiment of the present invention.

[0051] Description of reference numerals:

[0052] 1-substrate, 2-first functional portion, 21-first conductive portion, 211-first via, 22-first passivation portion, 221-fourth cutting groove segment, 23-first insulating portion, 231-first cutting groove segment, 3-second functional portion, 31-second conductive portion, 311-second via, 32-second insulating portion, 321-second cutting groove segment, 4-third functional portion, 41-third conductive portion, 411-third via, 42-third insulating portion, 421-third cutting groove segment, 5-conductive pillar, 6-protective layer, 7-cutting groove, 71-first cutting strip, 72-second cutting strip, 10-substrate body, 100-passive device, 200-wafer. DETAILED DESCRIPTION

[0053] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent identical or similar structures, and thus their detailed description will be omitted. Furthermore, the figures are merely schematic illustrations of the present invention and are not necessarily drawn to scale.

[0054] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0055] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0056] As shown in FIG1 , the processing of integrated passive devices 100 usually adopts advanced wafer manufacturing processes, which require high conductivity of the conductive layer and high resistivity of the substrate 1 to achieve high-performance passive devices 100, with the following advantages: small size, easy integration, high consistency, low cost, etc. At this time, the glass-based substrate 1 has obvious advantages over the silicon-based substrate 1, so the cutting of glass-based integrated passive devices 100 is developed. At present, the cutting grooves 7 between glass-based integrated passive devices 100 are composed of structures such as an insulating layer, a conductive layer, a blue film, and a glass substrate 1. The scribing and cutting process can correspond to the design of the above-mentioned cutting grooves 7. The wafer 200 has multiple device areas and cutting lanes (scribe lines). The device area is provided with passive devices 100. The cutting lanes are used to form cutting grooves 7. The cutting grooves 7 are located between two adjacent passive devices 100. The passive devices 100 can be chips, and the cutting lanes are used to separate the chips.

[0057] As shown in FIG2 , a portion of a wafer after passive devices 100 are formed is illustrated. For example, FIG2 shows four passive devices 100 and first and second cutting strips 71 and 72 of the four passive devices 100. The first and second cutting strips 71 and 72 intersect, and the angle between the first and second cutting strips 71 and 72 is 90 degrees, as shown in FIG2 . After the passive devices 100 are formed, the passive devices 100 and cutting grooves 7 on the entire wafer are also distributed in the manner shown in FIG2 , i.e., including all passive devices 100 on substrate 1 and all cutting grooves 7 between different passive devices 100, as shown in FIG1 .

[0058] Since the chip size is at the millimeter level, the cutting groove 7 design of TFT-LCD is adopted. After cutting, the chip size is too small to be separated, and the cutting process needs to be changed to a scribing cutting process. Due to the different cutting process principles, since the chip size is at the millimeter level, a scribing cutting process needs to be adopted. This process will cause the insulating layer to peel off from the substrate 1. The peeling of the insulating layer will cause the metal pattern in the chip to fall off, resulting in abnormal chip performance.

[0059] Based on this, an embodiment of the present invention provides a passive device 100. As shown in Figures 2 to 19, the passive device 100 includes a substrate 1 and at least two functional portions, with the at least two functional portions being disposed on one side of the substrate 1. The functional portions include a conductive portion and an insulating portion disposed sequentially away from the substrate 1. The insulating portion covers the conductive portion, and adjacent layers of insulating portions are in contact with each other. The edges of the insulating portions are retracted relative to the edges of the substrate 1, exposing the surface of the substrate 1.

[0060] The edges of the insulating portion are recessed relative to the edges of the substrate 1, exposing the surface of the substrate 1. The exposed portion of the substrate 1 protects the sides of the functional portion, reducing or preventing the impact of the functional portion's side effects during the manufacturing or packaging process. This makes the passive device 100 more structurally stable, reliable, and electrically consistent. When separating two adjacent passive devices 100 using a scribing process, the insulating portion can be cut from the exposed portion of the substrate 1 between the adjacent passive devices 100. This prevents the insulating portion from being subjected to cutting stress and naturally prevents it from peeling off from the substrate 1. This avoids the problem of the conductive portion within the passive device 100 falling off, achieving the goal of non-destructive cutting.

[0061] The passive device 100 involved in the present invention is described in detail below with reference to specific embodiments.

[0062] As shown in Figures 2 to 19, the surface of the substrate body 10 has a device region, which forms a passive device 100. The passive device 100 includes multiple functional portions sequentially arranged in a direction away from the substrate 1. Each functional portion includes multiple conductive portions and insulating portions sequentially arranged in a direction away from the substrate 1. The insulating portion of each functional portion covers the conductive portion. The insulating portions of two longitudinally adjacent functional portions of the same passive device 100 are arranged adjacent to each other, and the edges of the insulating portions are retracted relative to the edges of the substrate 1, exposing the surface of the substrate 1.

[0063] It is understood that a cutting groove 7 is provided between two adjacent passive components 100, exposing the substrate body 10. The cutting groove 7 comprises multiple cutting groove segments 7, each formed between two adjacent insulating portions of the same layer. Multiple functional portions comprise a functional layer group, and the insulating portions of the functional layer group comprise an insulating layer. The multiple cutting groove segments 7 are interconnected, and their orthographic projections on the substrate body 10 overlap, meaning that each cutting groove segment 7 extends through the insulating layer of each functional layer group. The insulating layers of the functional layer groups within the cutting groove 7 are removed, leaving only the substrate 1, simplifying the structure of the cutting groove 7.

[0064] As shown in FIG3 and FIG4 , the passive component 100 may include a first functional portion 2 and a second functional portion 3 . The first functional portion 2 is disposed on one side of a substrate 1 , and the second functional portion 3 is disposed on a side of the first functional portion 2 away from the substrate 1 .

[0065] As shown in FIG3 , the first functional portion 2 may include a first conductive portion 21 and a first insulating portion 23. The first insulating portion 23 is located on the side of the first conductive portion 21 away from the substrate 1. The second functional portion 3 may include a second conductive portion 31 and a second insulating portion 32. The second conductive portion 31 is located on the side of the first insulating portion 23 away from the substrate 1. The second conductive portion 31 is connected to the first conductive portion 21 via a first via 211 provided on the first insulating portion 23. The second insulating portion 32 covers the second conductive portion 31 and contacts the first insulating portion 23. The passive component 100 may further include a conductive pillar 5. The conductive pillar 5 may be connected to the second conductive portion 31 via a second via 311 provided on the second insulating portion 32. The edge of the first insulating portion 23 is recessed relative to the edge of the substrate 1, exposing the surface of the substrate 1. The edge of the second insulating portion 32 is recessed relative to the first insulating portion 23, exposing the side of the first insulating portion 23 away from the substrate 1. In other words, the edge of the second insulating portion 32 is farther from the edge of the substrate 1 than the edge of the first insulating portion 23.

[0066] In Figure 3, the cutting groove 7 between two adjacent passive devices 100 includes a first cutting groove segment 231 and a second cutting groove segment 321. The first cutting groove segment 231 is formed between the two first insulating parts 23, and the second cutting groove segment 321 is formed between the two second insulating parts 32. The second cutting groove segment 321 is connected to the first cutting groove segment 231. The orthographic projection of the first cutting groove segment 231 on the substrate 1 is located within the orthographic projection of the second cutting groove segment 321 on the substrate 1. The width of the second cutting groove segment 321 is greater than the width of the first cutting groove segment 231.

[0067] As shown in FIG4 , the first functional portion 2 may include a first conductive portion 21, a first passivation portion 22, and a first insulating portion 23. The first conductive portion 21 is provided on one side of the substrate 1, the first passivation portion 22 is provided on the side of the first conductive portion 21 away from the substrate 1, and the first insulating portion 23 is provided on the side of the first passivation portion 22 away from the substrate 1. The second functional portion 3 may include a second conductive portion 31 and a second insulating portion 32. The second conductive portion 31 is provided on the side of the first insulating portion 23 away from the substrate 1. The second conductive portion 31 is connected to the first conductive portion 21 via a first via 211 provided on the first insulating portion 23 and the first passivation portion 22. The second insulating portion 32 covers the second conductive portion 31 and contacts the first insulating portion 23. The passive device 100 may further include a conductive pillar 5. The conductive pillar 5 may be connected to the second conductive portion 31 via a second via 311 provided on the second insulating portion 32. The edge of the first passivation portion 22 is retracted relative to the edge of the substrate 1 , the edge of the first insulating portion 23 is flush with the edge of the first insulating portion 23 , and the edge of the second insulating portion 32 is retracted relative to the edge of the first insulating portion 23 , exposing the side of the first insulating portion 23 away from the substrate 1 .

[0068] As shown in Figure 4, based on Figure 3, the cutting groove 7 between two adjacent passive devices 100 also includes a fourth cutting groove segment 221, and the fourth cutting groove segment 221 is formed between two adjacent first passivation portions 22. The orthographic projection of the fourth cutting groove segment 221 on the substrate 1 overlaps with the orthographic projection of the first cutting groove segment 231 on the substrate 1.

[0069] As shown in FIG5 , the passive device 100 may further include a protective layer 6. The protective layer 6 covers the side surfaces of the second insulating portion 32, the side surfaces of the first insulating portion 23, at least a portion of the side of the first passivation portion 22 facing away from the substrate 1, and at least a portion of the side of the second insulating portion 32 facing away from the substrate 1. This layer 6 can prevent the first insulating portion 23, the second insulating portion 32, and the third insulating portion 42 from peeling off from each other due to the influence of water and oxygen, thereby affecting the performance of the passive device 100. The material of the protective layer 6 can be the same as that of the first passivation portion 22, or other materials that can resist water and oxygen corrosion, such as metallic silver, which will not be further described here.

[0070] As shown in FIG6 , the difference from the embodiment shown in FIG3 is that the passive device 100 may further include a third functional portion 4, which is disposed on the side of the second functional portion 3 away from the substrate 1. The third functional portion 4 includes a third conductive portion 41 and a third insulating portion 42. The third conductive portion 41 is disposed on the side of the second insulating portion 32 away from the substrate 1. The third insulating portion 42 covers the third conductive portion 41 and contacts the second insulating portion 32. The third conductive portion 41 is connected to the second conductive portion 31 via a second via 311 provided on the second insulating portion 32. The conductive pillar 5 is disposed on the side of the third insulating portion 42 away from the substrate 1 and connected to the third conductive portion 41 via a third via 411 provided on the third insulating portion 42. The edge of the first insulating portion 23 is recessed relative to the edge of the substrate 1, the edge of the second insulating portion 32 is flush with the edge of the first insulating portion 23, and the edge of the third insulating portion 42 is recessed relative to the edge of the second insulating portion 32, exposing the side of the second insulating portion 32 away from the substrate 1.

[0071] The cutting groove 7 between two adjacent passive components 100 may include a first cutting groove segment 231, a second cutting groove segment 321, and a third cutting groove segment 421. The first cutting groove segment 231 is formed between two adjacent first insulating portions 23, the second cutting groove segment 321 is formed between two adjacent second insulating portions 32, and the third cutting groove segment 421 is formed between two adjacent third insulating portions 42. The orthographic projection of the second cutting groove segment 321 on the substrate 1 overlaps with the orthographic projection of the first cutting groove segment 231 on the substrate 1, and the orthographic projection of the third cutting groove segment 421 on the substrate 1 is located within the orthographic projection of the second cutting groove segment 321 on the substrate 1. The width of the third cutting groove segment 421 is greater than the width of the second cutting groove segment 321.

[0072] In other embodiments, the edge of the first insulating portion 23 may be retracted relative to the edge of the substrate 1, the edge of the second insulating portion 32 may be retracted relative to the edge of the first insulating portion 23, and the edge of the third insulating portion 42 may be retracted relative to the edge of the second insulating portion 32, exposing the side of the second insulating portion 32 away from the substrate 1. That is, the edge of the second insulating portion 32 is farther from the edge of the substrate 1 than the edge 23 of the first insulating portion 23, and the edge of the third insulating portion 42 is farther from the edge of the substrate 1 than the edge 23 of the second insulating portion 32.

[0073] As shown in Figures 7 to 19 , the passive device 100 differs from the embodiment shown in Figure 6 in that it further includes a first passivation portion 22 disposed between the first insulating portion 23 and the first conductive portion 21, with its edge flush with the edge of the first insulating portion 23. A fourth slot segment 221 is formed between two adjacent first passivation portions 22, and the orthographic projection of the fourth slot segment 221 on the substrate 1 overlaps the orthographic projection of the first slot segment 231 on the substrate 1. The width of the fourth slot segment 221 is greater than or equal to 110 μm.

[0074] As shown in Figures 7 to 9 , the edge of the first passivation portion 22 is flush with the edge of the first insulating portion 23. The edge of the second insulating portion 32 is recessed relative to the edge of the first insulating portion 23, exposing the side of the first insulating portion 23 away from the substrate 1. The edge of the third insulating portion 42 is recessed relative to the edge of the second insulating portion 32, exposing the side of the second insulating portion 32 away from the substrate 1. The edge of the first passivation portion 22 is flush with the edge of the first insulating portion 23. In other words, the distance between the edge of the first insulating portion 23 and the edge of the substrate 1 is the same as the distance between the edge of the first passivation portion 22 and the edge of the substrate 1. The edge of the second insulating portion 32 is farther from the edge of the substrate 1 than the edge of the first insulating portion 23. The edge of the third insulating portion 42 is farther from the edge of the substrate 1 than the edge of the second insulating portion 32.

[0075] In Figures 7 to 9 , the thickness of the first insulating portion 23, the thickness of the second insulating portion 32, and the thickness of the third insulating portion 42 can be 3-10 μm, and the distance between the edge of the second insulating portion 32 and the edge of the first insulating portion 23, and the distance between the edge of the third insulating portion 42 and the edge of the second insulating portion 32 can be 2-10 μm. The retracted distance of the first insulating portion 23 can be 15-35 μm, that is, the distance between the edge of the first insulating portion 23 and the edge of the substrate 1 can be 15-35 μm, that is, the width of the exposed portion of the substrate 1 can be 15-35 μm.

[0076] In this embodiment, the thickness of the first insulating portion 23 may be 5 μm, the thickness of the second insulating portion 32 may be 6 μm, and the thickness of the third insulating portion 42 may be 3 μm. The retracted distance of the second insulating portion 32 may be 10 μm, that is, the width of the exposed portion of the first insulating portion 23 may be 10 μm, that is, the distance between the edge of the second insulating portion 32 and the edge of the first insulating portion 23 may be 10 μm. The retracted distance of the third insulating portion 42 may be 8 μm, that is, the width of the exposed portion of the second insulating portion 32 may be 8 μm, that is, the distance between the edge of the third insulating portion 42 and the edge of the second insulating portion 32 may be 8 μm.

[0077] The thickness of the first passivation part 22, the thickness of the first insulating part 23, the thickness of the second insulating part 32, the thickness of the third insulating part 42, the distance between the edge of the first insulating part 23 and the edge of the substrate 1, the distance between the edge of the second insulating part 32 and the edge of the first insulating part 23, and the distance between the edge of the third insulating part 42 and the edge of the second insulating part 32 in Figures 10 to 19 can be referred to Figures 7 to 9, and therefore will not be repeated here.

[0078] It can be understood that the cutting groove 7 between two adjacent passive devices 100 may include a first cutting groove segment 231, a second cutting groove segment 321, a third cutting groove segment 421 and a fourth cutting groove segment 221, and the centers of the first cutting groove segment 231, the second cutting groove segment 321, the third cutting groove segment 421 and the fourth cutting groove segment 221 are located on the same straight line, the area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1 is smaller than the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1, the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1 is smaller than the area of ​​the orthographic projection of the third cutting groove segment 421 on the substrate 1, the orthographic projection of the first cutting groove segment 231 on the substrate 1 coincides with the orthographic projection of the fourth cutting groove segment 221 on the substrate 1, that is, the two sides of the fourth cutting groove segment 221 are flush with the two sides of the first cutting groove segment 231.

[0079] As shown in FIG10 , based on FIG7 , the passive device 100 further includes a protective layer 6. The protective layer 6 covers the side surfaces of the third insulating portion 42, the side surfaces of the second insulating portion 32, the side surfaces of the first insulating portion 23, the side surfaces of the first passivation portion 22, the exposed area of ​​the first insulating portion 23 away from the substrate 1, the exposed area of ​​the second insulating portion 32 away from the substrate 1, and at least a portion of the side of the third insulating portion 42 away from the substrate 1. As shown in FIG11 , the protective layer 6 may cover the side surfaces of the three insulating portions, the side surfaces of the second insulating portion 32, the side surfaces of the first insulating portion 23, the entire surface of the first passivation portion 22 away from the substrate 1, and the entire surface of the third insulating portion 42 away from the substrate 1.

[0080] As shown in Figure 12, the edges of the first insulating portion 23, the second insulating portion 32, the third insulating portion 42, and the first passivation portion 22 are flush with each other. The two sides of the first cutting groove segment 231, the two sides of the second cutting groove segment 321, the two sides of the third cutting groove segment 421, and the two sides of the fourth cutting groove segment 221 are flush with each other. It can be understood that the centers of the first cutting groove segment 231, the second cutting groove segment 321, the third cutting groove segment 421, and the fourth cutting groove segment 221 are located on the same straight line, and the areas of the orthographic projection of the first cutting groove segment 231 on the substrate 1, the orthographic projection of the second cutting groove segment 321 on the substrate 1, the orthographic projection of the third cutting groove segment 421 on the substrate 1, and the orthographic projection of the fourth cutting groove segment 221 on the substrate 1 are equal.

[0081] As shown in Figure 13, the edges of the first insulating portion 23, the second insulating portion 32, and the first passivation portion 22 are flush with each other. The edge of the third insulating portion 42 is farther from the substrate 1 than the edge of the second insulating portion 32, exposing the side of the second insulating portion 32 away from the substrate 1. The two sides of the first cutting groove segment 231, the two sides of the second cutting groove segment 321, and the two sides of the fourth cutting groove segment 221 are flush with each other. The two sides of the third cutting groove segment 421 are closer to the edge of the substrate 1 than the two sides of the second cutting groove segment 321, exposing the side of the second insulating portion 32 away from the substrate 1. It can be understood that the centers of the first cutting groove segment 231, the second cutting groove segment 321, the third cutting groove segment 421 and the fourth cutting groove segment 221 are located on the same straight line, the area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1, the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1 and the area of ​​the orthographic projection of the fourth cutting groove segment 221 on the substrate 1 are equal, and the area of ​​the orthographic projection of the third cutting groove segment 421 on the substrate 1 is greater than the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1.

[0082] As shown in Figure 14, the edges of the first insulating portion 23 and the first passivation portion 22 are flush with each other. The edge of the second insulating portion 32 is farther from the edge of the substrate 1 than the edge of the first insulating portion 23, exposing the side of the first insulating portion 23 away from the substrate 1. The edge of the third insulating portion 42 is flush with the edge of the second insulating portion 32. The sides of the first cutting groove segment 231 and the sides of the fourth cutting groove segment 221 are flush with each other. The sides of the second cutting groove segment 321 are retracted relative to the sides of the first cutting groove segment 231, exposing the side of the first insulating portion 23 away from the substrate 1. The sides of the third cutting groove segment 421 and the sides of the second cutting groove segment 321 are flush with each other. It can be understood that the centers of the first cutting groove segment 231, the second cutting groove segment 321, the third cutting groove segment 421 and the fourth cutting groove segment 221 are located on the same straight line, the area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1 is equal to the area of ​​the orthographic projection of the fourth cutting groove segment 221 on the substrate 1, the area of ​​the orthographic projection of the third cutting groove segment 421 on the substrate 1 is equal to the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1, and the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1 is greater than the area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1.

[0083] As shown in Figure 15, one side of the first insulating part 23, one side of the second insulating part 32, one side of the third insulating part 42 and one side of the first passivation part 22 are flush with each other, the other side of the first insulating part 23 and the other side of the first passivation part 22 are flush with each other, the other side of the second insulating part 32 is farther from the edge of the substrate 1 than the other side of the first insulating part 23, exposing the side of the first insulating part 23 away from the substrate 1, and the other side of the third insulating part 42 is farther from the edge of the substrate 1 than the other side of the second insulating part 32, exposing the side of the second insulating part 32 away from the substrate 1.

[0084] It can be understood that the center of the first cutting groove segment 231 and the center of the fourth cutting groove segment 221 are located on the same straight line, the center of the second cutting groove segment 321 is offset to the right relative to the center of the first cutting groove segment 231, and the center of the third cutting groove segment 421 is offset to the right relative to the center of the second cutting groove segment 321. The area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1 is equal to the area of ​​the orthographic projection of the fourth cutting groove segment 221 on the substrate 1, the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1 is greater than the area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1, and the area of ​​the orthographic projection of the third cutting groove segment 421 on the substrate 1 is greater than the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1.

[0085] As shown in Figure 16, one side of the first insulating part 23, one side of the second insulating part 32, one side of the third insulating part 42 and one side of the first passivation part 22 are flush with each other, the other side of the first insulating part 23 and the other side of the first passivation part 22 are flush with each other, the other side of the second insulating part 32 is retracted relative to the other side of the first insulating part 23, exposing the side of the first insulating part 23 away from the substrate 1, and the other side of the third insulating part 42 and the other side of the second insulating part 32 are flush with each other.

[0086] It can be understood that the center of the first cutting groove segment 231 and the center of the fourth cutting groove segment 221 are located on the same straight line, the center of the third cutting groove segment 421 and the center of the second cutting groove segment 321 are offset to the right relative to the center of the first cutting groove segment 231, the area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1 is equal to the area of ​​the orthographic projection of the fourth cutting groove segment 221 on the substrate 1, the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1 is greater than the area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1, and the area of ​​the orthographic projection of the third cutting groove segment 421 on the substrate 1 is equal to the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1.

[0087] As shown in Figure 17, one side of the first insulating part 23, one side of the second insulating part 32, one side of the third insulating part 42 and one side of the first passivation part 22 are flush with each other, the other side of the first insulating part 23 is flush with the other side of the first passivation part 22, the other side of the second insulating part 32 is flush with the other side of the first insulating part 23, and the other side of the third insulating part 42 is retracted relative to the other side of the second insulating part 32, exposing the side of the second insulating part 32 away from the substrate 1.

[0088] It can be understood that the center of the first cutting groove segment 231, the center of the second cutting groove segment 321 and the center of the fourth cutting groove segment 221 are located on the same straight line, the center of the third cutting groove segment 421 is offset to the right relative to the center of the first cutting groove segment 231, the area of ​​the orthographic projection of the first cutting groove segment 231 on the substrate 1, the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1, and the area of ​​the orthographic projection of the fourth cutting groove segment 221 on the substrate 1 are equal, and the area of ​​the orthographic projection of the third cutting groove segment 421 on the substrate 1 is greater than the area of ​​the orthographic projection of the second cutting groove segment 321 on the substrate 1.

[0089] As shown in FIG18 , one side of the first insulating portion 23, one side of the second insulating portion 32, and one side of the first passivation portion 22 are flush with each other. The other side of the first insulating portion 23 and the other side of the first passivation portion 22 are flush with each other. The other side of the second insulating portion 32 is further from the edge of the substrate 1 than the other side of the first insulating portion 23, exposing the side of the first insulating portion 23 away from the substrate 1. The two sides of the third insulating portion 42 are further from the edge of the substrate 1 than the two sides of the second insulating portion 32, exposing the side of the second insulating portion 32 away from the substrate 1. It can be understood that the centers of the first cutting groove segment 231, the third cutting groove segment 421, and the fourth cutting groove segment 221 are located on the same straight line, and the center of the second cutting groove segment 321 is offset to the right relative to the center of the first cutting groove segment 231.

[0090] In the above embodiment, the first insulating portion 23, the second insulating portion 32, and the third insulating portion 42 are staggered with each other. When one or both sides of the second insulating portion 32 are farther from the edge of the substrate 1 than one side of the first insulating portion 23, exposing the side of the first insulating portion 23 away from the substrate 1, the width of the exposed portion of the side of the first insulating portion 23 away from the substrate 1 is 10 microns. When one or both sides of the third insulating portion 42 are farther from the edge of the substrate 1 than one side of the second insulating portion 32, exposing the side of the second insulating portion 32 away from the substrate 1, the width of the exposed portion of the side of the second insulating portion 32 away from the substrate 1 is 8 microns.

[0091] The micron-level indentation between the first insulating portion 23, the second insulating portion 32, and the third insulating portion 42 enhances their stability within the cut groove 7 and prevents the first insulating portion 23, the second insulating portion 32, and the third insulating portion 42 from forming an inverted pyramid structure within the cut groove 7 due to abnormal alignment accuracy. Specifically, the widths of the first insulating portion 23, the second insulating portion 32, and the third insulating portion 42 gradually increase away from the substrate 1. The inverted pyramid structure makes it more susceptible to process defects such as delamination between the first insulating portion 23, the second insulating portion 32, and the third insulating portion 42 when exposed to water, oxygen, and cutting stress.

[0092] As shown in FIG19 , the first insulating portion 23 extends to the side of the first passivation portion 22 and extends from the side of the first passivation portion 22 to the surface of the substrate 1. The second insulating portion 32 extends to the side of the first insulating portion 23 and extends from the side of the first insulating portion 23 to the surface of the substrate 1. The third insulating portion 42 extends to the side of the second insulating portion 32 and extends from the side of the second insulating portion 32 to the surface of the substrate 1. It can be understood that the first insulating portion 23, the second insulating portion 32, and the third insulating portion 42 are in contact with the surface of the substrate 1, which greatly reduces the chances of contact between the first insulating portion 23 and the first passivation portion 22, the gap between the second insulating portion 32 and the first insulating portion 23, and the gap between the third insulating portion 42 and the first insulating portion 23 with water and oxygen in the external air, thereby improving the reliability of the passive device 100.

[0093] It should be noted that the material of the first passivation portion 22 in the above embodiment is SiNx or SiO2. The insulating portion is a photosensitive material, which includes at least one of polyimide, epoxy resin, polybenzoxazole, and benzocyclobutene.

[0094] Of course, the passive device 100 can include more functional parts, for example, four layers of functional parts, five layers of functional parts, or even more functional parts. The insulating parts of adjacent functional parts are in contact with each other. Referring to FIG. 7 , the insulating part farther from the substrate 1 can be set to be retracted relative to the insulating part closer to the substrate 1, exposing the surface of the insulating part below. The relative positional relationship of the edges of different insulating parts can also be set by referring to the arrangement of the passive device 100 in other figures above. A detailed list is not provided here.

[0095] An embodiment of the present invention provides a method for manufacturing a passive device 100. As shown in Figures 1 to 20, the method includes:

[0096] In step S10 , a functional layer group is formed on the base body 10 . The functional layer group includes a plurality of conductive parts and an insulating layer sequentially arranged in a direction away from the base body 10 . The insulating layer covers the plurality of conductive parts.

[0097] In step S20 , 7 sections of cutting grooves are formed on the insulating layer of the functional layer group. The 7 sections of cutting grooves penetrate the insulating layer and are located between the conductive parts.

[0098] Step S30, forming another functional layer group on a side of the functional layer group away from the substrate body 10, wherein the other functional layer group includes a plurality of other conductive portions and an insulating layer, and the other insulating layer covers the plurality of other conductive portions, and the insulating layers of two adjacent functional layer groups are in contact with each other;

[0099] In step S40 , other cutting grooves 7 are formed on the insulating layers of other functional layer groups. The cutting grooves 7 are interconnected and their orthographic projections on the base body 10 overlap with each other to form cutting grooves 7 , which expose the base body 10 .

[0100] In step S50 , a scribing process is used to cut along the cutting grooves 7 to form a plurality of passive components 100 .

[0101] The specific structure and technical effects involved in this method can refer to the passive device 100 mentioned above. Since the specific structure and beneficial effects of the passive device 100 have been described in detail above, they will not be repeated here.

[0102] When the passive device 100 includes the first passivation portion 22, before step S10, the method may further include: forming a first passivation layer on the substrate body 10. When the first passivation layer is provided with a fourth cutting groove section 221, the method may further include: forming a fourth cutting groove section 221 on the first passivation layer.

[0103] The following describes in detail a method for manufacturing the passive device 100 according to an embodiment of the present invention, taking the passive device 100 in FIG. 7 to FIG. 9 as an example.

[0104] The method may include:

[0105] A first conductive layer is formed on the substrate 1 . The first conductive layer can be formed by atomic layer deposition (ALD) or magnetron sputtering.

[0106] A first passivation layer is formed on the substrate body 10, and a fourth cutting groove segment 221 is formed on the first passivation layer. The width of the fourth cutting groove segment 221 is greater than or equal to 110 μm. One section of the first via hole 211 can also be formed simultaneously with the formation of the fourth cutting groove segment 221.

[0107] A first passivation layer with a thickness of 0.12 μm is formed on the substrate body 10 via a plasma chemical vapor deposition process. Materials for the first passivation layer include, but are not limited to, SiNx, SiO2, and the like. A dry etching process is used to remove the first passivation layer from the cutting path, forming a fourth cutting groove segment 221 in the first passivation layer. This ensures that the soft blade can cut properly and avoids damage to the internal circuits of the passive device 100.

[0108] A first insulating layer is formed on the base body 10 , and a first cutting groove segment 231 is formed on the first insulating layer. Another segment of the first via hole 211 may also be formed while forming the first cutting groove segment 231 .

[0109] A first insulating layer with a thickness of 5 μm is formed on the side of the first passivation layer away from the substrate body 10 through a resist coating process. A first mask opening is provided on the first mask plate, and the first insulating layer is exposed and developed through the first mask opening, forming a first cutting groove segment 231 in the first insulating layer. The two sides of the first cutting groove segment 231 are flush with the two sides of the fourth cutting groove segment 221.

[0110] A second conductive layer is formed on the first insulating layer. The second conductive layer is formed in the same manner as the first conductive layer, and can be formed by atomic layer deposition (ALD) or magnetron sputtering. The second conductive layer is connected to the first conductive layer through the first via 211 .

[0111] A second insulating layer is formed on the second conductive layer, and a second cutting groove segment 321 is formed on the second insulating layer. The second via hole 311 may also be formed while forming the first cutting groove segment 231 .

[0112] A second insulating layer with a thickness of 6 μm is formed on the side of the first insulating layer away from the substrate 1 through a resist coating process. A second mask opening is provided on the second mask plate, through which the second insulating layer is exposed and developed, forming a second cut groove segment 321 in the second insulating layer. The two sides of the second cut groove segment 321 are respectively expanded by 10 μm relative to the two sides of the first cut groove segment 231 to prevent the second insulating layer from peeling off from the first insulating layer due to poor processing.

[0113] A third conductive layer is formed on the second insulating layer. The third conductive layer is formed in the same manner as the second conductive layer, and can be formed by atomic layer deposition (ALD) or magnetron sputtering. The third conductive layer is connected to the second conductive layer through a second via 311 .

[0114] A third insulating layer is formed on the third conductive layer, and a third cutting groove segment 421 is formed on the second insulating layer. The third via hole 411 can also be formed while the third cutting groove segment 421 is being formed.

[0115] A third insulating layer with a thickness of 3 μm is formed on the side of the second insulating layer away from the substrate 1 through a resist coating process. A third mask opening is provided on the third mask plate, through which the third insulating layer is exposed and developed, forming a third cutting groove segment 421 in the third insulating layer. The two sides of the third cutting groove segment 421 are respectively expanded by 8 μm relative to the two sides of the second cutting groove segment 321 to prevent the third insulating layer from peeling off from the second insulating layer due to poor processing.

[0116] A conductive column 5 is formed on the third insulating layer. The conductive column 5 is formed in the same manner as the third conductive layer, and can be formed by atomic layer deposition (ALD) or magnetron sputtering. The conductive column 5 is connected to the first conductive layer through the third via 411 .

[0117] The cutting groove 7 shown in the figure can be formed through the above process. The cutting groove 7 includes the first cutting groove segment 231 , the second cutting groove segment 321 and the third cutting groove segment 421 . The passive device 100 is located in the area surrounded by the cutting groove 7 .

[0118] For a passive device 100 with more functional layer groups, reference may be made to the first insulating layer and the method for forming the first cutting groove segment 231 on the first insulating layer. It should be noted that the material of the first insulating layer, the material of the second insulating layer, and the material of the third insulating layer are photosensitive materials, including but not limited to polyimide, epoxy resin, polybenzoxazole, and benzocyclobutene.

[0119] Those skilled in the art will readily appreciate other embodiments of the present invention upon consideration of the specification and practice of the invention herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not invented herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the appended claims.

Claims

1. A passive device, wherein: include: substrate; At least two functional parts are arranged on one side of the substrate, and the functional parts include a conductive part and an insulating part arranged in sequence in a direction away from the substrate, the insulating part covers the conductive part, and two adjacent layers of the insulating parts are in contact with each other. The edges of the insulating parts are retracted relative to the edges of the substrate, exposing the surface of the substrate.

2. The passive device according to claim 1, wherein: The at least two functional parts include a first functional part and a second functional part arranged in sequence along a direction away from the substrate, the first functional part includes a first conductive part and a first insulating part, the second functional part includes a second conductive part and a second insulating part, the first insulating part is arranged on a side of the first conductive part away from the substrate, and the second conductive part is arranged on a side of the first insulating part away from the substrate, the second insulating part covers the second conductive part and is in contact with the first insulating part, and an edge of the second insulating part is farther from the edge of the substrate than an edge of the first insulating part, exposing a side of the first insulating part away from the substrate.

3. The passive device according to claim 2, wherein: The at least two functional parts also include a third functional part, which is arranged on a side of the second functional part away from the substrate. The third functional part includes a third conductive part and a third insulating part. The third conductive part is arranged on a side of the second insulating part away from the substrate. The third insulating part covers the third conductive part and is in contact with the second insulating part. The edge of the third insulating part is farther from the edge of the substrate than the edge of the second insulating part, exposing a side of the second insulating part away from the substrate.

4. The passive device according to claim 3, wherein: The passive component also includes a first passivation portion, which is arranged between the first conductive portion and the first insulating portion. The first passivation portion covers the first conductive portion and contacts the substrate. The edge of the first passivation portion is flush with or retracted relative to the edge of the substrate.

5. The passive device according to claim 4, wherein: The edge of the second insulating portion is farther from the edge of the substrate than the edge of the first insulating portion, exposing the side of the first insulating portion away from the substrate. The edge of the third insulating portion is farther from the edge of the substrate than the edge of the second insulating portion, exposing the side of the second insulating portion away from the substrate. The passive device according to claim 5 , wherein: An edge of the first passivation portion is flush with an edge of the substrate.

7. The passive device according to claim 5, wherein: An edge of the first passivation portion is flush with an edge of the first insulating portion.

8. The passive device according to claim 7, wherein: The edges of the first insulating portion, the second insulating portion, the third insulating portion, and the first passivation portion are flush with each other.

9. The passive device according to claim 7, wherein: The edges of the first insulating portion, the second insulating portion and the first passivation portion are flush with each other, and the edge of the third insulating portion is farther from the edge of the substrate than the edge of the second insulating portion, exposing a side of the second insulating portion away from the substrate.

10. The passive device according to claim 7, wherein: The edge of the first insulating portion and the edge of the first passivation portion are flush with each other, the edge of the second insulating portion is farther from the edge of the substrate than the edge of the first insulating portion, exposing a side of the first insulating portion away from the substrate, and the edge of the third insulating portion is flush with the edge of the second insulating portion.

11. The passive device according to claim 7, wherein: One side of the first insulating portion, one side of the second insulating portion, one side of the third insulating portion, and one side of the first passivation portion are flush with each other, the other side of the first insulating portion and the other side of the first passivation portion are flush with each other, the other side of the second insulating portion is farther from the edge of the substrate than the other side of the first insulating portion, exposing the side of the first insulating portion away from the substrate, and the other side of the third insulating portion is farther from the edge of the substrate than the other side of the second insulating portion, exposing the side of the second insulating portion away from the substrate.

12. The passive device according to claim 7, wherein: One side of the first insulating portion, one side of the second insulating portion, and one side of the first passivation portion are flush with each other, the other side of the first insulating portion and the other side of the first passivation portion are flush with each other, the other side of the second insulating portion is farther from the edge of the substrate than the other side of the first insulating portion, exposing the side of the first insulating portion away from the substrate, and both sides of the third insulating portion are farther from the edge of the substrate than both sides of the second insulating portion, exposing the side of the second insulating portion away from the substrate.

13. The passive device according to claim 6, wherein: The first insulating portion extends to the side of the first passivation portion and extends from the side of the first passivation portion to the surface of the substrate. The second insulating portion extends to the side of the first insulating portion and extends from the side of the first insulating portion to the surface of the substrate. The third insulating portion extends to the side of the second insulating portion and extends from the side of the second insulating portion to the surface of the substrate.

14. The passive device according to claim 1, wherein The substrate is made of glass.

15. The passive device according to claim 4, wherein: The second conductive part is connected to the first conductive part through a first via provided on the first insulating part and the first passivation part, the third conductive part is connected to the second conductive part through a second via provided on the second insulating part, and the passive component further includes a conductive column, which is connected to the third conductive part through a third via provided on the third insulating part.

16. The passive device according to claim 4, wherein The passive device also includes a protective layer, which covers the side surfaces of the three insulating parts, the side surfaces of the second insulating part, the side surfaces of the first insulating part, the side surfaces of the first passivation part, the exposed area of ​​the first insulating part on a side away from the substrate, the exposed area of ​​the second insulating part on a side away from the substrate, and at least a portion of the area of ​​the third insulating part on a side away from the substrate.

17. A method for manufacturing a passive device according to any one of claims 1 to 16, wherein: The method comprises: forming a functional layer group on the substrate body, the functional layer group comprising a plurality of conductive portions and an insulating layer sequentially arranged in a direction away from the substrate body, the insulating layer covering the plurality of conductive portions; forming a cutting groove segment on the insulating layer of the functional layer group, wherein the cutting groove segment penetrates the insulating layer and is located between the conductive parts; forming another functional layer group on a side of the functional layer group away from the substrate body, the other functional layer group including a plurality of other conductive portions and an other insulating layer, the other insulating layer covering the plurality of other conductive portions, and the insulating layers of two adjacent functional layer groups contacting each other; forming other cutting groove segments on the insulating layer of the other functional layer group, wherein the cutting groove segments are interconnected and their orthographic projections on the base body overlap with each other to form cutting grooves, wherein the cutting grooves expose the base body; A scribing process is adopted to cut along the cutting groove to form a plurality of passive components.

Images