Heater block and heating base device having the same

Abstract

The present disclosure relates to a heater block having excellent heat dissipation characteristics and capable of precisely controlling a heating temperature, and an apparatus for heating a substrate having the same. The heater block of the present disclosure includes a cooling plate provided with a cooling channel through which cooling water flows, a light emitting module provided on a first surface of the cooling plate to irradiate light to an object to be heated, and a power supply module provided on a second surface of the cooling plate to supply power to the light emitting module.

Description

Technical Field

[0001] This disclosure relates to a heater block and an apparatus for heating a substrate having the heater block, and more specifically, to a heater block having excellent heat dissipation characteristics and the ability to precisely control the heating temperature, and an apparatus for heating a substrate having the heater block. Background Technology

[0002] Semiconductor devices are formed by repeating several cell processes involving substrate processing, such as ion implantation, thin film deposition, and thermal processing. In each cell process, heat energy needs to be supplied to process the substrate at a specified process temperature. In particular, heating processes that use light energy to heat the substrate to a predetermined process temperature are widely used because they minimize the side effects of impurity generation, as these processes are performed in a short time.

[0003] In a typical substrate heating apparatus, the substrate, while seated within a chamber, undergoes heat treatment via a heater containing multiple halogen lamps. The substrate temperature is measured non-contactly using a temperature measuring device such as a pyrometer. The pyrometer collects the radiant energy emitted by the substrate and measures its temperature non-contactly based on the blackbody radiation temperature relationship. The measured temperature is then fed back to the heater block via a heating controller to control the heater temperature.

[0004] When a silicon wafer, which has light-transmitting properties in the low-temperature range due to its material properties, is used as a substrate, some of the light from the halogen lamp passes through the substrate at a substrate temperature of about 600°C or lower. A pyrometer with a wavelength band of about 0.9 μm to about 1 μm measures the portion of the light from the halogen lamp that passes through the substrate. The halogen lamp has a radiation wavelength of about 0.4 μm to about 6 μm. Therefore, it is impossible to accurately measure the temperature of the substrate alone, and temperature measurement errors occur.

[0005] Furthermore, because halogen lamps are not divided into multiple control zones, it is impossible to achieve precise control over each zone. Therefore, a substrate heating technology is needed that can control the heating of each control zone, with each zone having an area smaller than that of the halogen lamp.

[0006] Furthermore, in the technology of heating the substrate at high temperatures using high-output power supplies, it is crucial to effectively dissipate heat from the heat sources in the heater block, especially the light-emitting module and the power supply module, in order to prevent the degradation of these heat sources.

[0007] (Patent Document 1) Korean Patent No. 10-0974013 Summary of the Invention

[0008] Problems to be solved

[0009] This disclosure provides a heater block with excellent heat dissipation characteristics, which effectively removes heat generated by the light-emitting module and the power supply module, as well as an apparatus for heating a substrate having the heater block.

[0010] This disclosure also provides a heater block that can stably supply power by simplifying the connection and assembly structure between the light-emitting module and the power supply module, and an apparatus for heating a substrate having the heater block.

[0011] Problem Solving Methods

[0012] According to an example embodiment, the heater block includes: a cooling plate having a cooling channel for cooling water flow; a light-emitting module disposed on a first surface of the cooling plate to irradiate light onto an object to be heated; and a power supply module disposed on a second surface of the cooling plate to supply power to the light-emitting module, wherein the light-emitting module includes: an insulating base plate; an electrode pad disposed on the insulating base plate; and a light-emitting semiconductor element disposed on the insulating base plate and electrically connected to the electrode pad, wherein the power supply module passes through the cooling plate to supply power to the electrode pad.

[0013] The power supply module can pass through the insulating base plate to supply power to the electrode pads.

[0014] The power supply module may include: a terminal portion connected to an external power source to receive power; a body portion configured to support the terminal portion; and an electrode rod portion electrically connected to the terminal portion to extend from the bottom surface of the body portion, wherein the cooling plate may include a first through hole into which the electrode rod portion is inserted.

[0015] The cooling plate may include: a first plate having a plurality of upper protrusions that project from its top surface to define the sides of the cooling channel; and a second plate disposed on the first plate to be coupled to each other and configured to define the top surface of the cooling channel.

[0016] The first through hole can pass through the area where multiple upper protrusions are set.

[0017] The light-emitting module may further include: a second through hole through an insulating base plate; and an upper electrode component configured to span the second through hole and be electrically connected to an electrode pad, wherein the end of the electrode rod portion inserted into the second through hole may be connected to the upper electrode component.

[0018] The light-emitting module may further include: a second through hole through an insulating base plate; an upper electrode component configured to cross the second through hole and be electrically connected to an electrode pad; an insertion electrode component extending from the upper electrode component and inserted into the second through hole; and a conductive cap coupled to the lower part of the insertion electrode component, wherein the end of the electrode rod portion may be connected to the bottom surface of the conductive cap.

[0019] The lower part of the inserted electrode component and the conductive cap can be threaded on their respective inserting surfaces and coupled to each other through the threads.

[0020] The light-emitting module component may further include an insulating insert disposed between the second through hole and the insertion electrode component to support the insertion electrode component.

[0021] The light-emitting module may further include: a metal plate configured to support an insulating base plate and made of thermally conductive metal; and a third through hole passing through the metal plate to communicate with the second through hole.

[0022] The ends of the electrode rod portion can be configured as flat surfaces for surface contact.

[0023] The heater block may further include: a light transmission plate disposed on the emitting surface of the light-emitting module to protect the light-emitting module; and a cooling gas supply component configured to supply cooling gas to the space between the light-emitting module and the light transmission plate.

[0024] The heater block may further include: a cover disposed on the power supply module; and a cooling gas exhaust component configured to exhaust cooling gas diffused into the space between the power supply module and the cover.

[0025] The electrode rod portion may include: a rod-shaped conductive element made of metal; and an insulating coating extending along the side of the conductive element to surround the side of the conductive element and expose the end of the conductive element, wherein the transverse cross-section of the electrode rod portion may have different widths depending on the direction, such that the distance between the outer surface of the electrode rod portion and the inner surface of the first through hole varies depending on the direction.

[0026] The insulating insert may have a gas channel for cooling gas flow in the height direction.

[0027] The body portion may include an elastic member configured to provide an elastic force to the electrode rod portion in the extension direction.

[0028] The electrode rod portion can be configured to move linearly along the extension direction, and the body portion can further include: a guide hole for receiving an elastic member, the electrode rod portion guiding the linear movement path; an insulating guide member configured to connect the elastic member to the electrode rod portion and move linearly along the guide hole; and a flexible cable member configured to electrically connect the electrode rod portion to the terminal portion.

[0029] Each of the light-emitting module and the power supply module may have a polygonal shape.

[0030] Each of the light-emitting module and the power supply module may have a honeycomb array structure, in which multiple modules are arranged in two dimensions.

[0031] According to another embodiment, an apparatus for heating a substrate includes: a chamber configured to provide a heat treatment space; a substrate support configured to support the substrate in the heat treatment space; and a heater block according to one embodiment, which is configured to face the substrate support to irradiate light onto the substrate, thereby heating the substrate.

[0032] Invention efficacy

[0033] In the heater block and the apparatus for heating a substrate having the same according to the example embodiment, the simple assembly structure of the plurality of light-emitting modules and the plurality of power supply modules provided around a cooling plate effectively removes the heat generated by the plurality of light-emitting modules and the plurality of power supply modules, thereby solving problems such as reduced output of the light-emitting modules and unstable power supply that may result from insufficient heat dissipation. Furthermore, the light-emitting modules and the power supply modules can exchange heat with the cooling plate, and cooling gas can be supplied to the light-emitting modules and the power supply modules to prevent heat accumulation and achieve more efficient heat dissipation.

[0034] Furthermore, the connection and assembly structures between the light-emitting module and the power supply module can be simplified to ensure a stable supply of high power, and to enable quick disassembly and stable replacement of the light-emitting module and the power supply module, thus ensuring mass production.

[0035] Furthermore, the multiple power supply modules can independently supply power to each of the multiple corresponding light-emitting modules to selectively control the multiple light-emitting modules. Therefore, the heating temperature can be adjusted by distinguishing the position of the multiple light-emitting modules to improve the heating uniformity of the heated object such as the substrate. Attached Figure Description

[0036] Figure 1 These are partial perspective views of a heater block and partial cross-sectional views of a power supply module according to one embodiment.

[0037] Figure 2 This is a view showing the assembled state of a heater block according to one embodiment.

[0038] Figure 3 This is a view showing the flow of cooling gas in a heater block according to one embodiment.

[0039] Figure 4 This is a cross-sectional view of a heater block according to one embodiment.

[0040] Figure 5 This is a view used to explain the assembly state of a heater block according to one embodiment.

[0041] Figure 6 This is a view showing the configuration of an apparatus for heating a substrate according to another embodiment. Detailed Implementation

[0042] Specific embodiments will now be described in more detail with reference to the accompanying drawings. However, this disclosure may take different forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided to make this disclosure thorough and complete, and to fully convey the scope of this disclosure to those skilled in the art. In the description, like elements are denoted by like reference numerals. In the figures, the dimensions of layers and regions are exaggerated for clarity. Like reference numerals refer to like elements throughout the text.

[0043] Figure 1 These are partial perspective views of a heater block and partial cross-sectional views of a power supply module according to one embodiment. Figure 2 This is a view showing the assembled state of a heater block according to one embodiment. Figure 3 This is a view illustrating the cooling gas flow of a heater block according to one embodiment. Figure 4 This is a cross-sectional view of a heater block according to one embodiment. Figure 5 This is a view used to explain the assembly state of a heater block according to one embodiment.

[0044] Reference Figures 1 to 5 According to one embodiment, the heater block (1000) may include a cooling plate (100) having a cooling channel (111) through which cooling water flows, a light-emitting module (200) disposed on a first surface of the cooling plate (100) for emitting light to an object to be heated (hereinafter referred to as the heated object), and a power supply module (300) disposed on a second surface of the cooling plate (100) for supplying power to the light-emitting module (200). Furthermore, the light-emitting module (200) may include an insulating base plate (221), an electrode pad (222) disposed on the insulating base plate (221), and a light-emitting semiconductor element (230) disposed on the insulating base plate (221) and electrically connected to the electrode pad (222), and the power supply module (300) may supply power to the electrode pad (222) through the cooling plate (100).

[0045] According to one embodiment, the heater block (1000) may include a light source or heat source that emits light, serving as a unit for supplying heat energy in various heat processing equipment, such as a device for heating a substrate to provide light energy to a heated object.

[0046] The cooling plate (100) can provide cooling channels (111) through which cooling water flows to absorb and remove heat generated in the light-emitting module (200) and / or power supply module (300) mounted on the two surfaces of the cooling plate (100) or heat transferred from the heated object, so that the light-emitting module (200) and / or power supply module (300) can be maintained at a constant temperature.

[0047] The cooling plate (100) may include a cooling water inlet (130) for supplying cooling water flowing through the cooling channel, and a cooling water outlet (140) for discharging cooling water that exchanges heat with the light-emitting module (200) and / or the power supply module (300). The cooling plate (200) may also include a circulation pipe connecting the cooling water inlet (130) and the cooling water outlet (140) to circulate the cooling water, a temperature controller connecting the circulation pipe to control the cooling water temperature, and a cooling water filter for removing impurities from the cooling water. In addition to process cooling water (PCW) or cooling water, various coolants may also be used as cooling water.

[0048] The light-emitting module (200) can serve as a light source or heat source that emits light to the heated object to heat it, thereby performing heat treatment. The number of light-emitting modules (200) can be one or more, and multiple light-emitting modules (200) can be independently separated from each other and individually installed on or removed from the cooling plate (100). The light-emitting modules (200) can be disposed on the first surface of the cooling plate (100) and then in contact with each other. Thus, the heat generated by the light-emitting modules (200) during the conversion of electrical energy into light energy can be transferred to the cooling plate (100) and then removed through heat exchange with each other, effectively suppressing the deterioration of the light-emitting modules (200).

[0049] The light-emitting semiconductor element (230) may be a semiconductor element that emits light when electrons provided through an n-type semiconductor layer and holes provided through a p-type semiconductor layer are coupled to each other, and may include a light-emitting diode (LED) or a laser diode (LD). In order to be used in the heater block (1000) as a heat source or light source to uniformly supply energy to a heated object having a large area, it must be in the form of a surface light source with a large area. For this purpose, the light-emitting module (200) may need to provide light-emitting semiconductor elements (230) manufactured in a two-dimensional array shape.

[0050] The light-emitting semiconductor element (230) may include an n-type electrode connected to an n-type semiconductor layer and a p-type electrode connected to a p-type semiconductor layer. The n-type electrode may be connected to an electrode pad (222) at a low potential, and the p-type electrode may be connected to an electrode pad (222) at a high potential. Multiple electrode pads (222) may be provided to supply power to multiple light-emitting semiconductor elements (230) provided in a two-dimensional array. Insulating members (222a) may be provided between the multiple electrode pads (222) to electrically isolate adjacent electrode pads (222) from each other.

[0051] An insulating base plate (221) supports the electrode pads (222) and the light-emitting semiconductor elements (230), and the insulating base plate (221) must be electrically insulated to prevent the multiple electrode pads (222) and the multiple light-emitting semiconductor elements (230) from short-circuiting with each other. The insulating base plate (221) may be thermally conductive to effectively dissipate the heat generated by the light-emitting semiconductor elements (230). That is, the insulating base plate (221) may be made of a material exhibiting high electrical insulation properties and excellent thermal conductivity (e.g., alumina, etc.). The interior of the insulating base plate (221) may also include wiring for electrical connections between the electrode pads (222). Each of the insulating base plate (221) and the electrode pads (222) may be a ceramic printed circuit board (220) constituting the circuitry for supplying power to the light-emitting semiconductor elements (230).

[0052] The light-emitting semiconductor element (230) can be electrically connected to the electrode pad (222) via over-chip bonding or wire bonding. The light-emitting semiconductor element (230) and the electrode pad (222) can be electrically connected in various forms. For example, the n-type electrode of the first light-emitting semiconductor element (230) can be attached to the first electrode pad (222) using conductive adhesive or the like, and the p-type electrode of the first light-emitting semiconductor element (230) can be electrically connected to the adjacent second electrode pad (222) via wire bonding. Furthermore, when the n-type electrode of the second light-emitting semiconductor element is attached to the second electrode pad (222) using conductive adhesive or the like, and the p-type electrode of the second light-emitting semiconductor element (230) is electrically connected to the adjacent second electrode pad (222) via wire bonding, multiple light-emitting semiconductor elements (230) can be connected in series.

[0053] The light-emitting semiconductor element (230) may include a vertical-cavity surface-emitting laser (VCSEL) element, which may have a structure in which the laser beam is emitted perpendicular to the heated object (e.g., a substrate), unlike side-emitting lasers such as typical distributed feedback laser diodes (DFB LDs) or Fabry-Perot laser diodes (FP LDs). Because the laser beam is emitted perpendicular to the heated object, it can have a circularly symmetrical distribution, thus offering superior light uniformity compared to side-emitting lasers, and enabling wafer-level processing and fabrication using a single silicon wafer (or circular substrate). Furthermore, since the resonant distance becomes very short, the critical current can be reduced, and the overall output can be decreased.

[0054] In particular, for use as a heating light source in a device for heating a substrate, a surface light source with a large area must be formed. For this purpose, the light-emitting semiconductor element (120) may need to be fabricated as a two-dimensional array type light source. Regarding side-emitting lasers, since the laser emits light through the side of a structure laminated on the substrate, it may be difficult to fabricate a two-dimensional array type light source. On the other hand, vertical-cavity surface-emitting lasers (VCSELs) can be fabricated very easily into the desired structure for a two-dimensional array type light source because the structure stacked on the substrate is formed as required.

[0055] Furthermore, vertical-cavity surface-emitting lasers (VCSELs) can have a light source illumination angle of approximately 20° to 25° relative to the vertical direction of the emitting surface. This is much narrower than the illumination angle of light-emitting diodes (LEDs), which is approximately 30° to 40°. Consequently, the light can exhibit excellent linearity. This makes it possible to emit high-power, high-precision, and uniform light towards a heated object, even with a two-dimensional array of light sources.

[0056] A power supply module (300) may be a unit electrically connected to a corresponding light-emitting module (200) to supply power, and may be provided in one or a plurality of units. The plurality of power supply modules (300) may individually supply power to the plurality of light-emitting modules (200), or may supply power to a group of light-emitting modules consisting of some groups of the plurality of light-emitting modules (200). The plurality of power supply modules (300) may be independently separable from each other and may be individually mounted to or detached from the cooling plate (100). The plurality of power supply modules (300) may be provided on a second surface of the cooling plate (100) to contact each other, whereby heat generated from the plurality of power supply modules (300) may be transferred to the cooling plate (100) and then removed through heat exchange with each other.

[0057] The plurality of light-emitting modules (200) and / or the plurality of power supply modules (300) can be independently separated from each other and can be individually installed on or removed from the cooling plate (100). Thus, when some light-emitting modules (200) or power supply modules (300) malfunction or degrade, the corresponding light-emitting modules (200) or power supply modules (300) can be replaced or individually repaired. Therefore, the heater block (1000) can be easily repaired and maintained to effectively manage heat.

[0058] In this disclosure, the plurality of light-emitting modules (200) and the plurality of power supply modules (300) are provided to be mounted on a first surface and a second surface of a cooling plate (100), with the first surface and the second surface facing each other relative to the cooling plate (100), thereby allowing the cooling plate (100) to stably support the plurality of light-emitting modules (200) and the plurality of power supply modules (300). Furthermore, the cooling plate (100) can separate the plurality of light-emitting modules (200) and the plurality of power supply modules (300) from each other on the two surfaces to support the plurality of light-emitting modules (200) and the plurality of power supply modules (300), thereby effectively removing heat generated from the plurality of light-emitting modules (100) and the plurality of power supply modules (300) without heat accumulation. For example, if the plurality of light-emitting modules (100) and the plurality of power supply modules (300) are mounted on one surface of the cooling plate (200), the heat generated by the modules of the plurality of light-emitting modules (100) and the plurality of power supply modules (300) that are far from the cooling plate (200) may not be dissipated and may accumulate on their own. In addition, heat may also accumulate on the contact surfaces of other modules, resulting in an overall inability to dissipate heat effectively and the accumulation of heat.

[0059] If the heat generated from the emitting module (200) and the power supply module (300) cannot be effectively dissipated, the accumulated heat may affect the operation of the power supply module (300) and / or the light-emitting module (200), resulting in unstable power supply or deterioration of light output. In addition, the electrical connection between the power supply module and the light-emitting module may be partially short-circuited due to the accumulated heat, which limits the durability of the heater block.

[0060] However, in this disclosure, a cooling plate (100) may be configured between the light-emitting module (200) and the power supply module (300), thereby allowing the cooling plate (100) to contact each of the light-emitting module (200) and the power supply module (300) to effectively dissipate heat generated from the light-emitting module (200) and the power supply module (300).

[0061] The power supply module (300) can supply power to the electrode pad (222) through the insulating base plate (221).

[0062] To allow the power supply module (300) on the second surface of the cooling plate to supply power to the light-emitting module (200) on the first surface of the cooling plate (100), the power supply module (300) can be connected to the bottom surface of the insulating base plate (221), and the electrode pad (222) on the bottom surface and the insulating base plate (221) can be electrically connected to the electrode pad (222) through through holes filled with conductive material through the through holes of the insulating base plate (221). However, in the case where the device for heating the substrate uses a heater block, due to the use of high power to achieve rapid heat treatment at high temperatures, the power supply may be unstable due to the resistive component of the through holes when power is supplied from the through holes. In order to stably reduce the resistive component of the through holes by increasing the diameter of the through holes or increasing the number of through holes, most of the insulating base plate may be provided as through holes, resulting in structural instability.

[0063] Therefore, in this disclosure, the power supply module (300) can stably supply high power by directly supplying power to the electrode pad (222) through the insulating base plate (221) without using through holes, while suppressing the generation of additional heat in the light-emitting module (200).

[0064] The power supply module (300) may include a terminal portion (310) connected to an external power source to receive power, a body portion (320) supporting the terminal portion (310), and an electrode rod portion (330) electrically connected to the terminal portion (310) to extend from the bottom surface of the body portion (320).

[0065] Furthermore, the cooling plate (100) may include a first through hole into which an electrode rod portion (330) is inserted, allowing the electrode rod portion (330) to pass through the cooling plate (100) and connect to the corresponding light-emitting module (200). Based on this structure, multiple power supply modules (300) can be stably and easily detachably provided on the second surface of the cooling plate (200) in a state of independent separation from each other.

[0066] The terminal portion (310) can be connected to a power cord extending from an external power source to receive the power required for the corresponding light-emitting module (200) to generate light. The terminal portion (310) can be provided with a connection part into which the socket terminal of the power cord is inserted and connected.

[0067] The main body (320) can be supported on the terminal part (310) on the top surface, and may be provided with wiring components that transmit the power supplied to the terminal part (310) to the electrode rod part (330), and a switch part that selectively short-circuits the supplied power. The main body (320) may further have mounting holes into which a fixing member for fixing the power supply module (300) to the cooling plate (100) is inserted.

[0068] An electrode rod portion (330) electrically connected to the terminal portion (310) and extending downward from the bottom surface of the body portion (320) may pass through the cooling plate (100) in the thickness direction and be connected to the electrode terminal portion of a corresponding light-emitting module (200) powered by the power supply module (300). The electrode rod portions (330) may be provided in pairs and respectively connected to the n-type electrode terminal portion and p-type electrode terminal portion of the light-emitting module (200). Since the cooling plate (100) is made of a conductive material (e.g., a metal such as copper or stainless steel) to facilitate heat conduction, the electrode rod portion (330) may include a metal rod (331) for transmitting power supplied from the terminal portion (320) and an insulating coating (332) covering the sides of the metal rod (331) except for the ends (333) to prevent the electrode rod portion (330) from being electrically short-circuited with the cooling plate (100).

[0069] In this specification, multiple light-emitting modules (200) and multiple power supply modules (300) can be used to independently or selectively control the emission state of each region of the multiple light-emitting modules (200), thereby improving the heating uniformity or temperature uniformity of the heated object.

[0070] To further subdivide the control area, each of the plurality of light-emitting modules (200) may include a first light-emitting portion and a second light-emitting portion that emit light independently of each other. The first light-emitting portion and the second light-emitting portion may divide the emitting surface of the light-emitting module into two equal surfaces, or may divide the emitting surface into two surfaces at different proportions. Each of the first light-emitting portion and the second light-emitting portion may include a plurality of light-emitting semiconductor elements that provide light energy. The plurality of light-emitting semiconductor elements may be provided by mounting a plurality of wafers, or may be provided as a single element with multiple wafers.

[0071] To enable the first and second light-emitting portions to emit light independently of each other, the terminal portion (310) may include a first terminal portion (310a) and a second terminal portion (310b) that respectively receive power supplied to the first and second light-emitting portions, and the electrode rod portion (330) may include a first electrode rod portion and a second electrode rod portion that are respectively electrically connected to the first terminal portion (310a) and the second terminal portion (310b). Each of the first electrode rod portion and the second electrode rod portion may be provided as a pair of positive and negative electrodes, and the power supplied to the first terminal portion (310a) and the second terminal portion (310b) may be transmitted to the corresponding first and second light-emitting portions through the cooling plate (100).

[0072] To improve the temperature uniformity of heated objects such as substrates, multiple light-emitting modules (200) and multiple power supply modules (300) can be arranged in a two-dimensional configuration and selectively controlled for each region. In this case, heat may accumulate in the central region of the two-dimensionally arranged multiple light-emitting modules (200) and multiple power supply modules (300), but the cooling plate (100) can suppress heat accumulation and effectively dissipate heat by directly exchanging heat with the multiple light-emitting modules (200) and multiple power supply modules (300), thereby enabling precise control of the heating temperature and power supply of each region, thus improving the temperature uniformity of the heated object.

[0073] The cooling plate (100) may further include a first plate (110) having a plurality of upper protrusions (112) protruding from the top surface to define the side of the cooling channel (111), and a second plate (120) disposed on the first plate (110) to be coupled to each other and configured to define the top surface of the cooling channel (111). That is, the cooling channel (111) may be sufficient as long as cooling water flows and is surrounded by the top surface of the first plate (110), the upper protrusions (112) and the bottom surface of the second plate (120), while the structure or formation location of the upper protrusions (112) etc. used to define the cooling channel (111) (e.g., the bottom surface of the second plate (120) etc.) can vary.

[0074] When the cooling channel (111) is a linear channel with a straight or curved shape, defined by a pipe or borehole inserted between the cooling water inlet (130) and the cooling water outlet (140), the cooling water can flow rapidly from the cooling water inlet (130) to the cooling water outlet (140) along the linear channel. Therefore, the cooling water may not only lack sufficient time to exchange heat with the first plate and / or the second plate, but there must also be a temperature gradient (or temperature difference) from the cooling water inlet (130) to the cooling water outlet (140). On the other hand, if the cooling water flows through a wide space defined by the central portion between the first plate and the second plate, which are coupled to each other at the edges or boundaries of the cooling plate (100), the contact area between the flowing cooling water and the first plate and / or the second plate may be small, and therefore, heat exchange may not be well performed.

[0075] If the cooling water does not flow between the cooling water inlet (130) on one side of the cooling plate (100) and the cooling water outlet (140) on the other side of the cooling plate (100) and along the shortest path (or a path close to the shortest path) across the cooling plate (100), but flows in a continuous bypass, the cooling area of ​​the cooling water heat exchange can be maximized to improve the heat dissipation effect of the cooling plate (100).

[0076] like Figure 5As shown in Figure (a), which is a plan view illustrating the top surface of the first plate (110), the top surface of the first plate (110) may be provided with multiple upper protrusions (112), which define the sides of the cooling channel (111). The multiple upper protrusions (112) may be spaced apart from each other and disposed on the top surface of the first plate (110), such that the space between the multiple upper protrusions (112) defines the cooling channel (111). When cooling water is introduced into the top surface of the first plate (110) through the cooling water inlet (130) disposed on one side of the cooling plate (200), the cooling water flowing to the cooling water outlet (140) disposed on the other side of the cooling plate (200) has no choice but to diffuse around the multiple upper protrusions (112) while continuously colliding with them, thereby effectively increasing the contact area or cooling area between the cooling water and the first plate (110).

[0077] The first plate (110) and the second plate (120) of the cooling plate (100) can be coupled to each other to integrate with each other. Since the first plate (110) and the second plate (120) are not only coupled at the edges, but also supported by the upper protrusion (112) therein, the cooling plate (100) can be structurally more stable.

[0078] The second plate (120) forms a cooling plate (200) by coupling with the first plate (110). The bottom surface of the second plate (120) can define the top surface of the cooling channel, and the bottom surface of the second plate (120) can directly contact multiple upper protrusions (112), so that the heat of the second plate (120) can be quickly transferred to the upper protrusions (112). That is, the cooling water can directly exchange heat when it comes into contact with the top surface of the first plate (110), the upper protrusions (112), and the bottom surface of the second plate (110). The first plate (110) and the second plate (120) can be thermally connected through the upper protrusions (112) to provide a cooling plate (100) with an integrated structure that can maintain a uniform temperature. Each of the first plate (110) and the second plate (120) may be made of a metal with high thermal conductivity, and the first plate (110) and the second plate (120) may be coupled to each other by brazing or welding. Therefore, the first plate (110) and the second plate (120) may be completely connected to each other, so that heat transfer between the first plate (210) and the second plate (220) occurs more quickly.

[0079] Since the light-emitting module (200), which serves as the heat source in the heater block (1000), generates more heat than the power supply module (300), it is necessary to dissipate the heat emitted from the light-emitting module (200) more quickly. Therefore, multiple light-emitting modules (200) can be arranged on a first plate (110) and an upper protrusion (112) that allow for faster heat dissipation through contact with cooling water on the top surface, and multiple power supply modules (300) can be arranged on a second plate (120).

[0080] The first plate (110) and the second plate (120) can be made of the same material or different materials. The first plate (110), which requires relatively excellent heat dissipation characteristics, can be made of copper, a metal with good thermal conductivity, and the second plate (120), which can enhance the mechanical stability of the cooling plate (100), can be made of stainless steel, a metal with excellent mechanical strength and chemical stability.

[0081] The first through hole (150) into which the electrode rod portion (330) is inserted can be configured to pass through the area where multiple upper protrusions (112) are located.

[0082] In order for multiple power supply modules (300) to pass through the cooling plate (100) and thus supply power to multiple corresponding light-emitting modules (200), a portion of the multiple power supply modules (300) (e.g., electrode rod portion (330)) must pass through the first plate (110) and the second plate (120). If the electrode rod portion (330) passes through the area of ​​the cooling channel (111), an electrical short circuit may occur between the electrode rod portion (330) and the cooling water, or water leakage may occur at the insertion location of the electrode rod portion (330). To overcome this limitation, in this disclosure, multiple first through holes (150) can be defined as passing through the first plate (110) and the second plate (120) in the area where the upper protrusion (112) is provided, and the electrode rod portions (330) of the multiple power supply modules (300) can be inserted into the multiple first through holes (150) to electrically connect to the multiple corresponding light-emitting modules (200). To define the first through hole (150), the lower first through hole (150a) can be defined by the upper protrusion (112) of the first plate (110) to correspond to the position and number of the electrode rod portion (330), and the upper first through hole (150b) can be defined in the area of ​​the second plate (120) that is connected to the upper protrusion (112). After the first plate (110) is connected to the second plate (120), the first through hole (150) can be defined by drilling holes in the area where multiple upper protrusions (112) are provided.

[0083] Since the electrode rod portion (330) is inserted into the first through hole (150) through a plurality of upper protrusions (112) that form the part where the first plate (110) and the second plate (120) are joined together, the electrode rod portion (330) will not be in direct contact with the cooling water, and the first through hole (150) will not be exposed to the cooling water, thus eliminating the possibility of cooling water leakage.

[0084] The cooling plate (100) may also include a plurality of coupling through holes (160) through a region provided with a plurality of upper protrusions (112), and a plurality of fixing members that are at least partially inserted into the plurality of coupling through holes (160) to fix a plurality of light-emitting modules (200) or light-emitting modules (200).

[0085] Multiple light-emitting modules (200) and multiple power supply modules (300) can be configured to be arranged in a two-dimensional manner facing each other on the first and second surfaces of the cooling plate (100). In order to maintain the electrical connection between the multiple light-emitting modules (200) and the multiple power supply modules (300) corresponding to each other, the multiple light-emitting modules (200) and the multiple power supply modules (300) may need to be stably fixed to the first and second surfaces of the cooling plate (100), respectively.

[0086] To prevent cooling water leakage, multiple coupling through holes (160) may pass through the area provided with multiple upper protrusions (112). Depending on the method of securing multiple light-emitting modules (200) and / or multiple power supply modules (300) by at least partially inserting fixing members, the multiple coupling through holes (160) may pass completely or partially through the cooling plate (100).

[0087] To define multiple coupling through holes (160), a lower coupling through hole (160a) can be defined through the upper protrusion (112) of the first plate (110), and an upper coupling through hole (160b) can be defined in the region of the second plate (120) where the upper protrusion (112) is attached. After the first plate (110) is attached to the second plate (120), the coupling through holes (160) can be defined by drilling holes in the region where the multiple upper protrusions (112) are provided or by a similar method.

[0088] Multiple fixing members can be at least partially inserted into the coupling through hole (160), and one end of each fixing member can be inserted into and fixed into a fixing slot defined in each of the multiple light-emitting modules (200) or multiple power supply modules (300) to fix the multiple light-emitting modules (200) or multiple power supply modules (300) to the cooling plate (100). The fixing members can be screws with threads on their outer surfaces, and threads corresponding to the threads on the outer surfaces of the fixing members can be provided on the inner surfaces of the coupling through hole (160) or fixing slots.

[0089] like Figure 5 As shown in (b), the first plate (110) may further include a lower protrusion (113) that protrudes from the bottom surface of the first plate (110) to define a groove (214) in which a plurality of light-emitting modules (200) are mounted.

[0090] Multiple light-emitting modules (200) may be disposed on a first surface of a cooling plate (100) facing the object to be heated, to emit light toward the object. In order to uniformly heat the object to be heated, such as a substrate, the multiple light-emitting modules (200) must be uniformly arranged in two dimensions on the first surface of the cooling plate (100) (or the bottom surface of the first plate (110)). Therefore, in this disclosure, in order to determine the correct position for mounting the multiple light-emitting modules (200), the multiple light-emitting modules (200) may be inserted into and mounted in multiple recesses (114) defined between lower protrusions (113) protruding from the bottom surface of the first plate (110), so that the multiple light-emitting modules (200) can be uniformly arranged at predetermined positions on the bottom surface of the first plate (110). When the light-emitting module (200) is inserted into the groove (114), the heat generated from the light-emitting module (200) can be quickly dissipated to the cooling plate (100) through the bottom surface of the first plate (110) that contacts the bottom surface of the light-emitting module (200), and can also be dissipated through the lower protrusion (113) that contacts or is close to the side of the light-emitting module (200).

[0091] Similar to the recess (114) for accommodating multiple light-emitting modules (200), the second plate (120) may include a top recess (121) defined in the top surface of the second plate (120) to accommodate multiple power supply modules (300). The top recess (121) may be multiple top recesses (121) to individually accommodate multiple power supply modules (300), or it may be a single top recess (121) to collectively accommodate multiple power supply modules (300). The second plate (120) may further include a cover (600) that covers the top recess (121) to protect the multiple power supply modules (300) accommodated in the top recess (121).

[0092] Each of the multiple light-emitting modules (200) and power supply modules (300) may have a polygonal shape.

[0093] To uniformly heat a target object such as a substrate, not only are multiple light-emitting modules (200) uniformly arranged in a two-dimensional form, but multiple power supply modules (300) supplying power to the corresponding light-emitting modules (200) via a cooling plate (100) can also be uniformly arranged in a two-dimensional form. The multiple light-emitting modules (200) and the multiple power supply modules (300) can be uniformly distributed in a two-dimensional form, and the spacing between the multiple light-emitting modules (200) and the spacing between the multiple power supply modules (300) must also be constant in a two-dimensional form. If the spacing between the light-emitting modules (200) varies depending on the direction and position, light emission may not occur in the spacing area between the light-emitting modules (200), and therefore, uniform light emission may not be possible across the entire light-emitting surface of the heater block (1000).

[0094] When the planar shape (outermost shape when viewed from above) of each of the light-emitting modules (200) and power supply modules (300) is circular rather than polygonal, the spacing between adjacent light-emitting modules (200) and their corresponding power supply modules (300) may vary depending on the orientation, thus potentially preventing uniform light emission. For example, the spacing between adjacent light-emitting modules (200) may be minimized in the horizontal and vertical directions, while the spacing between adjacent light-emitting modules (200) may be maximized in a direction tilted at approximately a 45-degree angle.

[0095] When the planar shapes of the light-emitting modules (200) and the corresponding power supply modules (300) are the same polygonal shape, not only can multiple light-emitting modules (200) and multiple power supply modules (300) be evenly distributed on both surfaces of the cooling plate (100), but the gaps between adjacent light-emitting modules (200) and power supply modules (300) can also remain constant. Due to this arrangement, the heater block (1000) can provide uniform thermal or light energy to the heated object.

[0096] Reference Figure 1 and Figure 5 (b) Each of the multiple light-emitting modules (200) and multiple power supply modules (300) may have a hexagonal shape. When each of the multiple light-emitting modules (200) and multiple power supply modules (300) has a hexagonal outermost shape, it can be easily expanded in two dimensions, and the overall arrangement of the multiple light-emitting modules (200) or multiple power supply modules (300) can define a concentric structure from the center. Therefore, uniform light emission can be achieved regardless of the position on the emitting surface of the heater block (1000).

[0097] Multiple light-emitting modules (200) and multiple power supply modules (300) can be arranged in two dimensions to form an array shape with a honeycomb structure.

[0098] In a honeycomb array of multiple light-emitting modules (200) and multiple power supply modules (300) arranged in a two-dimensional pattern with hexagonal planar shapes, the entire periphery of a light-emitting module (200) can be surrounded by a minimum number (six) of adjacent light-emitting modules (200) equal to the number of angles of the hexagonal shape. Therefore, the average density and luminous efficiency (or heating efficiency) of light-emitting modules (200) per unit area can be increased.

[0099] If each of the multiple light-emitting modules (200) has a polygonal (e.g., hexagonal) shape, the groove (114) defined by the lower protrusion (113) can also be arranged in two dimensions into a polygonal (e.g., hexagonal) shape.

[0100] According to an exemplary embodiment, the light-emitting module (200) may further include a second through hole (223) penetrating the insulating base plate (221) and an upper electrode component (224) spanning the second through hole (223) and electrically connected to the electrode pad (222). The end (333) of the electrode rod portion (330) inserted into the second through hole (223) may be connected to the upper electrode component (224) (see [link]). Figure 2 (b)).

[0101] The second through hole (223) into which the electrode rod portion (330) is inserted can be defined in the thickness direction of the insulating base plate (221), allowing the power supply module (300) to supply power directly to the electrode pad (222) through the insulating base plate (221) without using a through hole that may cause unstable power supply due to high resistance components. In order to supply power to the electrode pad (222) disposed on the insulating base plate (221), a unit may be required to be electrically connected to the electrode rod portion (330) inserted through the second through hole (223) to pass through the insulating base plate (221) and reach the top surface of the insulating base plate (221). For this purpose, the upper electrode component (224) may be configured to span the upper part of the second through hole (223) or the second through hole (223), and at least one end of the upper electrode component (224) may be electrically connected to the electrode pad (222). Here, the upper electrode component (224) may be made of a metal with excellent conductivity (such as copper), and the end of the upper electrode component (224) and the electrode pad (222) may be fixed and electrically connected by welding or similar means.

[0102] The end (333) of the electrode rod portion (330) inserted into the second through hole (223) to reach the top surface of the insulating base plate (221) may be electrically connected to the bottom surface of the upper electrode component (224) spanning the upper part of the second through hole (223) or the central part of the second through hole (223). The top surface of the end (333) of the electrode rod portion (330) and the bottom surface of the central part of the upper electrode component (224) may be defined as corresponding surfaces (e.g., planes).

[0103] If the heat generated from the light-emitting module (200) cannot be dissipated smoothly to the cooling plate (100) and heat accumulation occurs, the solder joints of the fixed upper electrode component (224) and the electrode pad (222) may partially melt. As a result, the power supply may become unstable, and an electric arc may occur due to the high power. In addition, in order to reduce the resistivity at the contact point between the electrode rod portion (330) and the upper electrode component (224), the electrode rod portion (330) may be pushed to the upper electrode component (224) to make close contact with each other, but this force may cause the partially melted solder joints to be lifted or completely separated.

[0104] To supplement this, the light-emitting module (200) according to another exemplary embodiment may include a second through hole (223) through an insulating base plate (221), an upper electrode component (224) spanning the second through hole (223) and electrically connected to an electrode pad (222), an insertion electrode component (225) extending from the upper electrode component (224) and inserted into the second through hole (223), and a conductive cap (226) coupled to the lower part of the insertion electrode component (225), the end of the electrode rod portion (330) being connectable to the bottom surface of the conductive cap (226) (see See Figure 2 (c)).

[0105] The upper electrode component (224) may span over the upper portion of the second through hole (223) defined in the thickness direction of the insulating base plate (221), and at least one end of the upper electrode component (224) may be electrically connected to the electrode pad (222). Here, the upper electrode component (224) may be made of a metal with excellent conductivity (such as copper), and the ends of the upper electrode component (224) and the electrode pad (222) may be fixed and electrically connected by welding or similar means.

[0106] In another exemplary embodiment, the electrode rod portion (330) may be inserted into the second through hole (223) to reach the top surface of the insulating base plate (221), but not connected to the bottom surface of the central portion of the upper electrode component (224). Instead, the upper electrode component (224) may extend to the bottom surface (or vicinity) of the insulating base plate (221) via an insertion electrode component (225) extending from the bottom surface of the central portion of the upper electrode component (224) and inserted into the second through hole (223) and a conductive cap (226) coupled to the lower part of the insertion electrode component (225). Both the multiple insertion electrode components (225) and the conductive cap (226) may be made of a metal with excellent conductivity, such as copper.

[0107] Since the end of the electrode rod portion (330) is not directly connected to the upper electrode component (224), but is connected to the bottom surface of the conductive cap (226), even if the electrode rod portion (330) is pushed to the upper electrode component (224), the end of the upper electrode component (224) and the electrode pad (222) will not separate from each other or partially separate at the welding point. Therefore, power can be stably supplied to the upper electrode component (224) and the electrode pad (222).

[0108] If the conductive cap (226) is fixed in position on the insulating base plate (221) and does not move in the extension direction of the second through hole (223) (or the thickness direction of the insulating base plate (221)), the insertion electrode component (225) and the upper electrode component (224) connected to the conductive cap (226) can also be fixed, and the end of the electrode rod portion (330) may be stably connected by pressing against the bottom surface of the conductive cap (226) due to the force pushing the electrode rod portion (330). The conductive cap (226) may be fixed without moving in the extension direction of the second through hole (223) (or the thickness direction of the insulating base plate (221)) because the top surface of the conductive cap (226) is supported on the bottom surface of the insulating base plate (221) or a stepped portion provided on the bottom surface. In this case, the bottom surface of the insulating base plate (221) or the stepped portion provided on the bottom surface can provide a reference position for the coupling of the insertion electrode component (225) and the conductive cap (226).

[0109] The lower part of the insertion electrode component (225) and the conductive cap (226) can be inserted into each other and threadedly coupled by providing threads (227) on their opposing surfaces.

[0110] Coupling structures, such as recesses or protrusions, can be provided on the insertion electrode component (225) and the conductive cap component (226) for mutual insertion. For example, such as Figure 2As shown in (c), a recess can be defined on the upper part of the conductive cap (226) into which the lower part of the insertion electrode component (225) is inserted, or a recess can be defined on the lower part of the insertion electrode component (225) and a protrusion can be provided on the upper part of the conductive cap (226) into which the insertion electrode component is inserted. With the insertion electrode component (225) and the conductive cap (226) inserted into each other and with threads (227) provided on their surfaces facing each other, when the conductive cap (226) is fixed and rotated in the extension direction of the second through hole (223) (or the thickness direction of the insulating base plate (221)), the insertion electrode component (225) and the conductive cap (226) can be securely threadedly coupled by the threads (227). Furthermore, since the upper electrode component (224) connected to the insertion electrode component (225) is supported on the top surface of the insulating base plate (221), when the insertion electrode component (225) threadedly coupled to the conductive cap (226) is pulled, the solder joints between the upper electrode component (224) and the electrode pad (222) or between the upper electrode component (224) and the electrode pad (222) are in close contact with each other without detachment. In addition, since the conductive cap (226) is firmly fixed to the insulating base plate (221), even if the electrode rod portion (330) connected to the bottom surface of the conductive cap (226) is pushed to make close contact with each other at the connection, the thrust of the electrode rod portion (330) will not be directly transmitted to the upper electrode component (224), but may be blocked by the conductive cap (226). Therefore, even if the solder joint partially melts, a stable connection state can be maintained.

[0111] According to another embodiment, the light-emitting module (200) may further include an insulating insert (228) between the second through hole (223) and the insertion electrode component (225) to support the insertion electrode component (225).

[0112] If the insertion electrode component (225) moves to one side within its insertion second through hole (223), the upper electrode component (224) connected to the insertion electrode component (225) may also move, and thus the electrical connection between the end of the upper electrode component (224) and the electrode pad (222) may be damaged. Therefore, in order to maintain a stable electrical connection path while keeping the insertion part stationary within the second through hole (223), an insulating insert (228) may be provided between the second through hole (223) and the insertion electrode component (225) to support the insertion electrode component (225).

[0113] Since the lower cross-sectional area of ​​the insulating insert (228) is larger than the upper cross-sectional area, the upper part of the insulating insert (228) can be stably supported by inserting into the second through hole (223) and contacting the inner surface of the second through hole. The lower part of the insulating insert (228) does not need to be inserted into the second through hole, but is supported by the bottom surface of the insulating base plate (221) or the stepped portion on the bottom surface, so as not to move towards the upper electrode component (224) along the extension direction of the second through hole (223) and maintain a constant height. In addition, the upper end of the insulating insert (228) can stably support the upper electrode component (224) and the insertion electrode component (225) by contacting the bottom surface of the center portion of the upper electrode component (224).

[0114] The insulating insert (228) may have a through-hole penetrating the body of the insulating insert (228) and may include an upper through-hole for inserting the electrode component (225) and a lower through-hole for inserting the conductive cap (226). On the connecting surface where the upper and lower through-holes connect, the cross-sectional area of ​​the upper through-hole may be smaller than that of the lower through-hole, thus a connecting step may be present between the upper and lower through-holes. Therefore, the upper part of the conductive cap (226) may be supported by the connecting step to maintain a constant height and prevent movement towards the upper electrode component (224) along the extension direction of the coupling through-hole. In other words, the insulating insert (228) may provide a reference surface for the (threaded) coupling between the inserting electrode component (225) and the conductive cap (226) to achieve mutual compression. The conductive cap (226) which maintains a constant height from the reference surface of the (threaded) connection may be pulled toward the conductive cap (226) by the insert electrode part (225) which is (threaded) to the conductive cap (226), so that the solder between the electrode part (224) and the electrode pad (222) or between the upper electrode part (224) and the electrode pad (222) can adhere firmly without lifting.

[0115] Furthermore, since the conductive cap (226) is supported by the connecting step portion, even if the electrode rod portion (330) connected to the bottom surface of the conductive cap (226) transmits force to reduce resistance, the conductive cap (226) can maintain a constant height. Therefore, the conductive cap and the electrode rod portion (330) can be in close contact with each other.

[0116] The light-emitting module (200) may further include a metal plate (210) made of thermally conductive metal, which supports an insulating base plate (221), and a third through hole (211) that penetrates the metal plate (210) and communicates with the second through hole (223).

[0117] The light-emitting module (200) can be disposed on the bottom surface of the first plate (110). However, since the light-emitting semiconductor element (230) and the ceramic printed circuit board (220) do not have thermally conductive material distributed across the entire surface, the light-emitting semiconductor element (120) and the circuit wiring components (111a, 111b) may not be able to quickly transfer heat to the bottom surface of the first plate (110). However, in this disclosure, the metal plate (210) can be configured to integrally support the ceramic printed circuit board (220) and the light-emitting semiconductor element (230) connected thereto, and the metal plate (210) is made of thermally conductive metal. Therefore, the heat generated from the light-emitting semiconductor element (230) can be quickly transferred to the first plate (110) for dissipation to the outside. Furthermore, in order to at least partially accommodate the inserted electrode component (225), the conductive cap component (226), and the insulating insert component (228) (these components are the electrical connection structure of the ceramic printed circuit board (220)), the light-emitting module (200) may further include a third through hole (211) that penetrates the metal plate (210) and communicates with the second through hole (223). The third through hole (211) may include an upper third through hole (211a) (in which the upper part of the narrow cross-sectional area of ​​the insulating insert component (228) is inserted) and a lower third through hole (211b) (in which the lower part of the wide cross-sectional area of ​​the insulating insert component (228) is inserted), and thus a stepped portion may be present between the upper third through hole (211a) and the lower third through hole (211b). The top surface of the lower part of the insulating insert (228) can contact and stably support the stepped portion between the upper third through hole (211a) and the lower third through hole (211b), so that the insulating insert (228) can maintain a constant height and not move towards the upper electrode component (224) along the extension direction of the second through hole (223).

[0118] For rapid heat exchange, multiple mating surfaces of the contacting light-emitting modules (200) and the first plate (110) are made of metal. Due to the roughness of the metal surface structure, gaps may form at the interface between the metal surfaces when they come into contact. The air filling these gaps at the interface between the light-emitting modules (200) and the first plate (110) may have low thermal conductivity, thus reducing the thermal conductivity characteristics between them. In particular, when the heater block (1000) is configured in a processing space maintained in a vacuum state (such as in a device for heating a substrate), the gaps at the interface between the light-emitting modules (200) and the first plate (110) may be in a vacuum state, significantly reducing heat exchange between them, which could be fatal. To address this limitation, a flexible heat dissipation pad can be provided between the cooling plate (100) and the multiple light-emitting modules (200).

[0119] When a resilient heat dissipation pad (such as a silicone heat dissipation pad) is provided between the light-emitting module (200) and the first plate (110), the heat dissipation pad can fill the gap created by the surface roughness of the light-emitting module (200) and the first plate (110) while elastically deforming, thereby increasing the thermal contact area between the light-emitting module (200) and the first plate (110) and effectively improving the heat exchange efficiency. In addition, slippage may occur between the metal plate (210) and the first plate (110), causing the proper position of the electrical connection to deviate. If a resilient heat dissipation pad is provided between the light-emitting module (200) and the first plate (110), slippage can be prevented and the proper position can be maintained.

[0120] The end (333) of the electrode rod portion (330) may be a flat surface and be in close contact with the bottom surface of the upward-facing electrode portion (224) or the bottom surface of the conductive cap (226), thereby enabling the power supply method for supplying power to the light-emitting module (200) to be performed in a manner with end-plane contact.

[0121] According to one embodiment, the heater block (1000) may further include a light transmission plate (400) disposed on the light-emitting surface of the light-emitting module (200) to protect the light-emitting module, and a cooling gas supply component (500) for supplying cooling gas to the space between the light-emitting module (200) and the light transmission plate (400).

[0122] The light transmission plate (400) can be mounted on the first plate (110) to be placed on the light-emitting surface of the light-emitting module (200) and can transmit light emitted from the light-emitting semiconductor element (230) and protect the light-emitting semiconductor element (120).

[0123] Heat generated from the light-emitting module (200) can be dissipated through the bottom surface of the light-emitting module (200) and the cooling plate (100). However, in a structure where multiple light-emitting semiconductor elements (230) and multiple light-emitting modules (200) serving as point light sources are arranged in a two-dimensional configuration, the arrangement area of ​​the light-emitting semiconductor elements (230) may not be completely uniform. Heat dissipation through heat conduction alone may not achieve sufficient heat dissipation or temperature uniformity. Therefore, in one embodiment, a cooling gas supply component (500) can supply cooling gas to the space between the light-emitting module (200) and the light transmission plate (400), so that the cooling gas can flow when it collides with the exposed surface of the light-emitting module to utilize convection and conduction, thereby further improving the heat dissipation effect and temperature uniformity.

[0124] The cooling gas can be nitrogen (N2) or process air.

[0125] Multiple cooling gas components (500) may be disposed at the edge of the cooling plate portion (100) and face each other, so that cooling gas can be uniformly supplied into the space between the light-emitting module (200) and the light transmission plate (400). Alternatively, the multiple cooling gas components (500) disposed at the edge of the cooling plate (100) and face each other may first diffuse through a cooling gas channel extending along the edge of the first plate (110) and surrounding the center of the light-emitting module (200), and then the cooling gas may be injected into all directions of the light-emitting module (200) through supply holes communicating with the cooling gas channel to flow in the space between the light-emitting module (200) and the light transmission plate (400), thereby achieving more uniform temperature control.

[0126] According to one embodiment, the heater block (1000) may further include a cover (600) disposed on the power supply module (300) and a cooling gas discharge component (700) for discharging cooling gas diffused into the space between the power supply module (300) and the cover (600).

[0127] The cover (600) can be mounted on the second plate (120) to be placed on the power supply module (300) and to protect the power supply module (300).

[0128] Cooling gas supplied by the cooling gas supply component (500) can flow through the space between the light-emitting module (200) and the light transmission plate (400) and exchange heat with the light-emitting module (200). Then, it sequentially passes through the second through hole (223), the third through hole (211), and the first through hole (150) to diffuse into the space between the power supply module (300) and the cover (600). The temperature of the cooling gas exchanging heat with the light-emitting module (200) may rise, but the temperature may drop again when the cooling gas passes through the first through hole (150) of the cooling plate (100). Therefore, the cooling gas can flow through the space between the power supply module (300) and the cover (600) and then be discharged to the outside through the cooling gas exhaust component (700), thereby dissipating the heat generated by the power supply module (300).

[0129] As described above, the cooling gas supply component (500) is positioned on one side of the light-emitting module (200), while the cooling gas exhaust component (700) is positioned on one side of the power supply module (300), because stabilizing the light-emitting characteristics of the temperature-sensitive light-emitting module (200) is important. However, the cooling gas supply component (500) may be positioned on one side of the power supply module (300), while the cooling gas exhaust component (700) may be positioned on one side of the light-emitting module (200).

[0130] In order to stabilize the temperature by dissipating heat from the light-emitting module (200) and the power supply module (300) as the cooling gas supplied to the cooling gas supply component (500) is discharged from the cooling gas discharge component (700), the cooling gas must be able to flow smoothly through the space between the light-emitting module (200) and the light transmission plate (400) and the space between the power supply module (300) and the cover (600). The cooling gas can diffuse through the second through hole (223), the third through hole (211), and the first through hole (150). The second through hole (223), the third through hole (211), and the first through hole (150) may need to provide a channel for the cooling gas to move smoothly without encountering flow resistance, as the electrode rod portion (330), the inserted electrode component (225), the conductive cap (226), or the insulating insert (228) are inserted therein.

[0131] For this purpose, the electrode rod portion (330) inserted into the first through hole (150) may include a rod-shaped conductive element (331) made of metal and an insulating coating (332) extending along the side of the conductive element (331) to surround the side of the conductive element (331) and expose the end (333) of the conductive element. The cross-section of the electrode rod portion (330) may have different widths depending on the direction, so the distance between the outer surface of the electrode rod portion (330) and the inner surface of the first through hole (150) may be different from each other depending on the direction.

[0132] When the cross-sectional size and shape of the electrode rod portion (330) inserted into the first through hole (150) are almost the same, the first through hole (150) and the electrode rod portion (330) have a gap distance that allows them to contact each other. Alternatively, when the electrode rod portion (330) is inserted into the first through hole (150), the outer surface of the electrode rod portion (330) may be stably supported by the inner surface of the first through hole (150), but this may not ensure sufficient space for the flow of cooling gas. Therefore, the cooling gas may not be able to move through the gap space between the first through hole (150) and the electrode rod portion (330).

[0133] However, if the cross-section of the electrode rod portion (330) has different widths depending on the direction, and the distance between the outer surface of the electrode rod portion (330) and the inner surface of the first through hole (150) varies depending on the direction, then the distance space for smooth flow of cooling gas can be ensured. That is, in the region where the electrode rod portion (330) has the maximum width, the distance to the inner surface of the first through hole (150) can be minimized to ensure stable support of the electrode rod portion (330), while in the region (332a) where the electrode rod portion (330) has the minimum width, the distance to the inner surface of the first through hole (150) can be maximized to facilitate the flow of cooling gas through that space. For example, the cross-section of the first through hole (150) may be circular, while the cross-section of the electrode rod portion (330) may be elliptical with a major axis and a minor axis.

[0134] The cross-section of the conductive element (331) may have different widths depending on the direction, or the transverse thickness of the insulating coating (332) may vary depending on the direction, so the cross-section of the electrode rod portion (330) may have different widths depending on the direction.

[0135] Similarly, when the electrode rod portion (330) is inserted into the second through hole (223) and / or the third through hole (211), the cross-section of the electrode rod portion (330) may have different widths depending on the direction. Therefore, the distance between the outer surface of the electrode rod portion (330) and the inner surface of the second through hole (223) and / or the distance between the outer surface of the electrode rod portion (330) and the inner surface of the third through hole (211) may vary depending on the direction.

[0136] In another embodiment of the light-emitting module (200), the insulating insert (228) provides a gas channel (228a) through which cooling gas flows in the height direction.

[0137] The insulating insert (228) can be inserted into the second through hole (223) and the third through hole (211), and the gas passage (228a) can be provided in the form of a recess (or channel) extending in the height direction of the outer surface of the insulating insert (228), or the cross section of the edge of the insulating insert (228) can vary depending on the direction.

[0138] Furthermore, the second through hole (223) or the upper electrode component (224) extending above the second through hole (223) can be provided to ensure that the second through hole (223) is not blocked, allowing cooling gas to flow freely into the second through hole (223). For this purpose, the central portion of the upper electrode component (224) may be larger than the electrode pad (222), and the width of the upper electrode component (224) (width perpendicular to the extending direction) may be smaller than the diameter of the second through hole (223) (see [reference]). Figure 3 ).

[0139] According to one embodiment, the body portion (320) may include an elastic member (324) that provides elasticity to the electrode rod portion (330) in the extension direction.

[0140] Since the electrode rod portion (330) is electrically connected by surface contact with the bottom surface of the upper electrode component (224) or the conductive cap (226), the electrode rod portion (330) may be pushed by the elastic force provided by the elastic member (324) to make close contact with the upper electrode component (224) or the conductive cap (226), thereby reducing the resistance on the surface contact area. The elastic member (324) may be a spring or the like that contracts or extends in the extension direction of the electrode rod portion (330).

[0141] In order for the electrode rod portion (330) to make close contact with the upper electrode component (224) or the conductive cap (226) through the elastic force provided by the elastic member (324), the electrode rod portion (330) must be able to move linearly along the extension direction of the electrode rod portion (330) to push and fix the upper electrode component (224) or the conductive cap (226).

[0142] If the elastic member (324) does not provide elastic force along the extension direction of the electrode rod portion (330), or if the electrode rod portion (324) does not move linearly along the extension direction of the electrode rod portion (330), the electrode rod portion (330) may bend due to elastic force or thrust, or the upper electrode component (224) or conductive cap (226) may be damaged. Therefore, lifting and arcing may occur at the welded portion of the upper electrode component (224) and the electrode pad (222).

[0143] The body portion (320) may further include a guide hole (325) for accommodating the elastic member (324) and guiding the electrode rod portion (330) in a linear movement path, an insulating guide member (326) for connecting the elastic member (324) to the electrode rod portion (330) and moving linearly along the guide hole (325), and a flexible cable member (323) for electrically connecting the electrode rod portion (330) to the terminal portion (310).

[0144] The guide hole (325) may have a hole shape extending along the extension direction parallel to the electrode rod portion (330), and the elastic member (324) may be accommodated in the space within the hole, so that the elastic member (324) provides elastic force to the electrode rod portion (330) when it contracts or extends in the extension direction of the electrode rod portion (330). Furthermore, in the internal space of the guide hole (325), with a portion of the electrode rod portion (330) being accommodated, the electrode rod portion (330) may be guided along a linear movement path in the extension direction of the electrode rod portion (330).

[0145] An insulating guide member (326) may be disposed within the internal space of a guide hole (325) to connect an elastic member (324) to an electrode rod portion (330), thereby enabling the elastic member (324) and the electrode rod portion (330) to move linearly along the guide hole (325) without deviating from the extension direction of the electrode rod portion (330). One end of the elastic member (324) may be supported on the inner end of the guide hole (325), and the other end of the elastic member (324) may be connected to the insulating guide member (326) which moves linearly along the guide hole (325). Therefore, the elastic member (324) may extend in the extension direction of the electrode rod portion (330) to provide elasticity. An insulating guide member (326) with electrical insulation properties can be inserted between the electrode rod portion (330) and the elastic member (324) to prevent the power used in the light-emitting module (200) from leaking from the electrode rod portion (330) to the elastic member (324), thereby suppressing the risk of arcing or power leakage to the outside that may occur in the elastic member within the guide hole (325).

[0146] The body portion (320) may further include a printed circuit board component (321) for distributing power supplied to the terminal portion (310), and a power connection block component (322) electrically connected to the printed circuit board component (321) to transmit the distributed power to the electrode rod portion (330). The power connection block component (322) may be fixedly connected to the printed circuit board component (321), and the electrode rod portion (330) may be linearly movable along a guide hole (325). Thus, the power connection block component (322) and the electrode rod portion (330) may be electrically connected by a flexible cable member (323) capable of deforming and moving according to the linear movement of the electrode rod portion (330), thereby allowing power supplied to the terminal portion (310) to be transmitted to the electrode rod portion (330).

[0147] Figure 6 This is a view illustrating a device configuration for heating a substrate according to another example embodiment.

[0148] In describing the apparatus for heating a substrate according to another example embodiment, details that overlap with those of the apparatus for heating a substrate according to one example embodiment previously described will be omitted.

[0149] Reference Figure 6 According to another example embodiment, the apparatus for heating a substrate may include a chamber (2000) providing a heat treatment space, a substrate support (3000) supporting a substrate (S) disposed in the heat treatment space, and a heater block (1000) according to an example embodiment, the heater block (1000) being configured to face the substrate support (3000) to emit light onto a first surface of the substrate (S), thereby heating the substrate (S).

[0150] Equipment for heating a substrate can heat the substrate (S) by heat-treating the substrate (S) or by forming a thin film on the substrate (S) to perform various processes. For example, equipment for heating a substrate can be a rapid thermal process (RTP) device that generates high-temperature heat to rapidly heat-treat the substrate (S).

[0151] The chamber (2000) provides a heat treatment space that is separate from the outside and can be controlled by various gases. To prevent contamination of the substrate (S), the heat treatment space can be maintained in a vacuum state, or an inert gas or similar substance can be introduced to maintain an inert gas environment.

[0152] The substrate support (3000) can support the substrate (S) during heat treatment. The substrate support (3000) can be configured to support the lower edge of the substrate (S), so that the portion (or area) of the bottom surface of the substrate (S) that is not in contact with the substrate support (3000) can be exposed. For example, the substrate support (3000) can be a hollow shape with a central opening, so that when the substrate (S) is placed on the substrate support (3000), the edge portion of the bottom surface of the substrate (S) can contact the substrate support (3000), while the remaining portion can be exposed downwards.

[0153] The heater block (1000) may be a heater block according to an example embodiment, and thus may be configured to face the substrate support (3000), and may heat the substrate (S) by emitting light onto a first surface (e.g., the top surface) of the substrate (S). Here, the heater block (1000) may be used to supply heat energy to the substrate (S), and a plurality of light-emitting modules (100) may emit light onto the first surface of the substrate (S) and be spaced apart from each other on the upper side of the substrate support (3000), so that the light energy generated by the plurality of light-emitting modules (100) may be provided to the first surface of the substrate (S) mounted on the substrate support (3000) to heat the substrate (S).

[0154] The apparatus for heating the substrate may further include a pyrometer (4100) disposed on a second surface of the substrate (S) opposite to the first surface to measure the temperature of the substrate (S).

[0155] The pyrometer (4100) may be disposed on a second surface (e.g., the bottom surface) opposite a first surface of the substrate (S) and configured to measure the temperature of the substrate (S), and to detect incident light from the substrate (S) to measure the temperature. For example, the pyrometer (4100) may receive incident radiated light from the substrate (S) to measure the radiant energy (or light intensity) of the radiated light. A plurality of pyrometers (4110, 4120 and 4130) may be arranged on the underside of the substrate (S) mounted on a substrate support (3000), thereby obtaining the radiant energy and reflectivity of the facing portion, and measuring the temperature at each location (or region) of the substrate (S) corresponding to the pyrometer (3000).

[0156] The device for heating the substrate may further include a heating controller (4000) that selectively controls the power supplied to each of the plurality of power supply modules (300) based on the temperature measured by a pyrometer (4100).

[0157] The heating controller (4000) can control the power supplied to multiple light-emitting modules (100) at corresponding temperature measurement locations based on the temperatures measured by multiple pyrometers (4100). Here, the multiple pyrometers (4100) can measure the amount of incident light from the substrate (S) to calculate the temperature, and the heating controller (4000) can use the calculated temperature to control the power input to the corresponding multiple light-emitting modules (100).

[0158] The heating controller (4000) may include a temperature setting unit (4200) for setting a target temperature of the substrate (S), and a power determination unit (4300) for comparing the target temperature set in the temperature setting unit (4200) with the temperature measured by a pyrometer (4100) to determine a power supply value. The temperature setting unit (4200) may set the target temperature of the substrate (S), and may also set the temperature of the substrate (S) achieved by heating by the heater block (1000).

[0159] The power determination unit (4300) determines the power supply value by comparing the target temperature set in the temperature setting unit (4200) with the temperature measured by the pyrometer (4100), and can supply the determined power from the power supply unit (4400). The power supply unit (4400) may include a first power supply unit (4410) and a second power supply unit (4420), which independently or selectively supply power to a first light-emitting portion and a second light-emitting portion provided in the light-emitting module (100), which emit light independently of each other. Therefore, the determined power can be supplied to the light-emitting module (100) disposed on the heater block (1000) corresponding to (or relative to) the area of ​​the substrate (S) portion measured by the pyrometer (4110 to 4130), thereby controlling the heating temperature of that area and compensating for the temperature of the substrate (S) portion measured by the pyrometer (4110 to 4130).

[0160] The heating controller (4000) can simultaneously control all of the multiple light-emitting modules (200) based on the measured temperature, or it can divide the multiple light-emitting modules (200) into multiple groups (e.g., a central region group and an edge region group, etc.) based on the temperature of each part of the substrate (S) corresponding to the position of each of the multiple pyrometers (4110 to 4130), so as to independently control the operation and power supply of each group. Similarly, the first and second light-emitting parts of the light-emitting module (200) can be controlled simultaneously as a whole, or they can be controlled separately for each group after being grouped.

[0161] As described above, in the apparatus for heating a substrate according to the example embodiment, the heating temperature of a plurality of light-emitting modules arranged in a two-dimensional pattern can be controlled using the temperature measured by a pyrometer to improve the temperature uniformity of the substrate during heat treatment. Here, multiple pyrometers can be provided, thus providing one for each region, and the multiple light-emitting modules in each subdivided region can be more precisely controlled based on the temperatures measured by the various pyrometers to improve process characteristics, such as superior temperature uniformity of the substrate.

[0162] In the heater block (1000) and the device for heating the substrate having the same according to the example embodiment, the heat generated by the multiple light-emitting modules (200) and the multiple power supply modules (300) can be effectively removed due to the simple assembly structure in which multiple light-emitting modules (200) and multiple power supply modules (300) are located at the center of the cooling plate (100). This solves the limitations such as reduced output of the light-emitting modules (200) and unstable power supply that may be caused by insufficient heat dissipation. In addition, not only can the light-emitting modules (200) and the power supply modules (300) exchange heat with the cooling plate (300), but cooling gas can also be supplied to the light-emitting modules (200) and the power supply modules (300) to prevent heat accumulation and achieve more efficient heat dissipation and temperature uniformity.

[0163] Furthermore, the connection and assembly structure between the light-emitting module (200) and the power supply module (300) can be simplified to stably supply high power, and the light-emitting module (200) and the power supply module (300) can be quickly disassembled and stably replaced to ensure mass production.

[0164] In addition, multiple power supply modules (300) can independently supply power to each of the multiple corresponding light-emitting modules (200) to selectively control the multiple light-emitting modules (200). Therefore, the heating temperature can be adjusted by distinguishing the positions of the multiple light-emitting modules (200) to improve the heating uniformity of the heated object such as the substrate.

[0165] The term "on" used in the above description includes both direct and indirect contact between upper and lower parts in relative positions. It can refer not only to the entire top or bottom surface, but also to a portion of the top or bottom surface, indicating a position relative to or in direct contact with the upper or lower surface. Furthermore, the terms "top," "bottom," "front end," "rear end," "upper part," "lower part," "upper end," and "lower end," etc., used in the above description are defined based on the drawings for convenience, and the shape and position of the components are not limited by these terms.

[0166] Although embodiments have been described with reference to several illustrative examples, the embodiments are not limited to those described above. Therefore, it should be understood that those skilled in the art can conceive of numerous other modifications and embodiments consistent with the spirit and scope of this disclosure. Accordingly, the actual scope of protection of this invention should be determined by the scope of the appended claims.

Claims

1. A heater block, comprising: The cooling plate is equipped with cooling channels for the flow of cooling water; A light-emitting module is disposed on the first surface of the cooling plate for irradiating light onto the object to be heated; as well as A power supply module, disposed on the second surface of the cooling plate, is used to supply power to the light-emitting module. The light-emitting module includes: Insulating base plate; Electrode pads disposed on the insulating base plate; and A light-emitting semiconductor element disposed on the insulating substrate and electrically connected to the electrode pad. The power supply module passes through the cooling plate to supply power to the electrode pads.

2. The heater block of claim 1, wherein the power supply module passes through the insulating base plate to supply power to the electrode pad.

3. The heater block according to claim 2, wherein the power supply module comprises: Terminal section connected to an external power source to receive power; The body portion is configured to support the terminal portion; as well as An electrode rod portion electrically connected to the terminal portion to extend from the bottom surface of the body portion. The cooling plate includes a first through hole, into which the electrode rod is partially inserted.

4. The heater block according to claim 3, wherein the cooling plate comprises: The first plate has multiple upper protrusions that protrude from its top surface to define the sides of the cooling channel; as well as A second plate is disposed on the first plate to be coupled to each other and configured to define the top surface of the cooling channel.

5. The heater block according to claim 4, wherein the first through hole passes through the area where the plurality of upper protrusions are disposed.

6. The heater block according to claim 3, wherein the light-emitting module further comprises: The second through hole passes through the insulating base plate; as well as The upper electrode component is configured to span the second through hole and be electrically connected to the electrode pad. The end of the electrode rod portion inserted into the second through hole is connected to the upper electrode component.

7. The heater block according to claim 3, wherein the light-emitting module further comprises: The second through hole passes through the insulating base plate; as well as The upper electrode component is configured to span the second through hole and be electrically connected to the electrode pad. An electrode component is inserted, extending from the upper electrode component and inserted into the second through hole; as well as A conductive cap is coupled to the lower part of the inserted electrode component. The end of the electrode rod portion is connected to the bottom surface of the conductive cap.

8. The heater block according to claim 7, wherein the lower part of the inserted electrode component and the conductive cap are threaded on their opposing surfaces and coupled to each other by the threads.

9. The heater block of claim 7, wherein the light-emitting module component further includes an insulating insert disposed between the second through hole and the insertion electrode component to support the insertion electrode component.

10. The heater block according to claim 6 or 7, wherein the light-emitting module further comprises: A metal plate, configured to support the insulating base plate and made of thermally conductive metal; as well as A third through hole passes through the metal plate to communicate with the second through hole.

11. The heater block according to claim 6 or 7, wherein the end of the electrode rod portion is configured as a plane for surface contact.

12. The heater block according to claim 1, further comprising: A light transmission plate is disposed on the emitting surface of the light-emitting module to protect the light-emitting module; as well as A cooling gas supply component is configured to supply cooling gas to the space between the light-emitting module and the light transmission plate.

13. The heater block according to claim 12, further comprising: A cover is provided on the power supply module; as well as A cooling gas exhaust component is configured to exhaust the cooling gas that diffuses into the space between the power supply module and the cover.

14. The heater block according to claim 3, wherein the electrode rod portion comprises: A rod-shaped conductive element made of metal; as well as An insulating coating extends along the side of the conductive element to surround the side of the conductive element and expose the ends of the conductive element. The transverse cross-section of the electrode rod portion has a different width depending on the direction, such that the distance between the outer surface of the electrode rod portion and the inner surface of the first through hole varies depending on the direction.

15. The heater block according to claim 9, wherein the insulating insert is provided with a gas channel for cooling gas flow in the height direction.

16. The heater block of claim 3, wherein the body portion includes an elastic member configured to provide an elastic force to the electrode rod portion in the extending direction.

17. The heater block of claim 16, wherein the electrode rod portion moves linearly along the extending direction, and The body portion further includes: A guide hole, wherein the elastic member is received in the guide hole, and the electrode rod portion guides a linear movement path; An insulating guide member is configured to connect the elastic member to the electrode rod portion and move linearly along the guide hole; and A flexible cable component configured to electrically connect the electrode rod portion to the terminal portion.

18. The heater block of claim 1, wherein each of the light-emitting module and the power supply module has a polygonal shape.

19. The heater block according to claim 1, wherein each of the light-emitting module and the power supply module has a honeycomb array structure, wherein multiple modules are arranged in a two-dimensional manner.

20. An apparatus for heating a substrate, comprising: The chamber is configured to provide space for heat treatment; A substrate support is configured to support the substrate in the heat treatment space; and The heater block as described in any one of claims 1 to 9 and 12 to 19 is supported facing the substrate to irradiate the substrate with light, thereby heating the substrate.

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