Cooling edge ring with fixation mechanism

CN122397374APending Publication Date: 2026-07-14LAM RES CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
LAM RES CORP
Filing Date
2024-12-06
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

Existing technologies struggle to effectively control the temperature of the edge ring in substrate processing systems, leading to unstable etching rates and uniformity, as well as inconsistent and variable properties of the heat transfer interface materials, which negatively impacts processing performance.

Method used

A heat transfer gas (such as helium) is used to control the interface temperature between the edge ring and the base plate through a special channel and sealing components. The edge ring temperature is precisely regulated by adjusting the gas pressure and coolant flow using a temperature controller, and a fixing mechanism is used to ensure sealing and stability.

Benefits of technology

Precise control of edge ring temperature was achieved, which improved etching rate and uniformity, reduced dependence on heat transfer interface materials, and enhanced the repeatability and stability of the process.

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Abstract

A substrate support for a substrate processing chamber includes a base plate and an edge ring disposed on the base plate. A radially outer bottom surface of the edge ring is coplanar with a radially inner bottom surface of the edge ring. The substrate support includes a sealing member between the edge ring and the base plate. The sealing member is configured to define an interface between the edge ring and the base plate. The substrate support includes at least one channel in fluid communication with the interface and configured to supply a heat transfer gas to the interface.
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