Cooling edge ring with fixation mechanism
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LAM RES CORP
- Filing Date
- 2024-12-06
- Publication Date
- 2026-07-14
AI Technical Summary
Existing technologies struggle to effectively control the temperature of the edge ring in substrate processing systems, leading to unstable etching rates and uniformity, as well as inconsistent and variable properties of the heat transfer interface materials, which negatively impacts processing performance.
A heat transfer gas (such as helium) is used to control the interface temperature between the edge ring and the base plate through a special channel and sealing components. The edge ring temperature is precisely regulated by adjusting the gas pressure and coolant flow using a temperature controller, and a fixing mechanism is used to ensure sealing and stability.
Precise control of edge ring temperature was achieved, which improved etching rate and uniformity, reduced dependence on heat transfer interface materials, and enhanced the repeatability and stability of the process.
Smart Images

Figure CN122397374A_ABST