A flexible wearable ultrasound patch system
By employing technologies such as high-channel array imaging, multi-front-end synchronous acquisition, flexible-rigid hybrid circuitry, and asymmetric double-layer packaging, the problems of insufficient channel count, curved surface adhesion, and thermal management in wearable ultrasound devices have been solved. This has enabled high performance, low profile, and long-term stable operation of flexible wearable ultrasound patches, making them suitable for continuous monitoring and dynamic imaging of deep human tissues.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- UNIV OF SCI & TECH BEIJING
- Filing Date
- 2026-05-21
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wearable ultrasound devices suffer from insufficient channel count, limited surface adhesion, large overall thickness, inadequate thermal management capabilities, and poor stability during long-term continuous operation, making it difficult to meet the needs of continuous monitoring and dynamic imaging of deep human tissues.
It adopts a high-channel array imaging structure, a multi-front-end synchronous acquisition architecture, a flexible-rigid circuit design, a transducer embedded integrated structure, an asymmetric double-layer packaging structure, and a low-power operating mode. Combined with a flexible wearable ultrasonic patch system, it improves imaging performance, adhesion capability, thermal management, and stability.
It achieves high-channel array imaging, flexible attachment, low-profile integration, thermal safety, and low-power continuous operation, making it suitable for continuous monitoring and dynamic structural assessment of deep human tissues.
Smart Images
Figure CN122398359A_ABST