一种弹簧探针自动化精密对接组装装置及方法
By designing preparation, docking, and pressing units before the inspection process, and combining image sensor detection and a replacement station, the problem of defective products in spring probe assembly was solved, achieving efficient and accurate spring probe assembly.
CN122401074APending Publication Date: 2026-07-17SUZHOU DICK MICROELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU DICK MICROELECTRONICS CO LTD
- Filing Date
- 2026-06-12
- Publication Date
- 2026-07-17
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Figure CN122401074A_ABST
Abstract
本发明弹簧探针自动化精密对接组装装置及方法属于半导体制造设备技术领域;该装置包括准备单元、对接单元、压合单元和铆固单元;在准备单元中,装件工位、检测工位和补件工位的设计,确保针筒、针尾、弹簧和针头能够装入所有治具;在对接单元中,多个不同尺寸对准凸起与对准凹陷的设计,能够实现先完成粗对准,再完成精对准,确保对接精度,为针尾、弹簧和针头能够依次进入针筒;在压合单元中,与针筒治具、针尾治具、弹簧治具或针头治具的孔相对应的多针结构设计,能够将没有成功掉落到针筒的针尾、弹簧和针头压入针筒中;本发明还设计了基于精密对接组装装置的精密对接组装方法,为确保后续弹簧探针组装不出现不良品提供了工艺流程。
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