A semiconductor material cutting apparatus
The semiconductor material cutting device, which uses sliding, deflection, and rotation cutting mechanisms, solves the problems of insufficient cutting quality and precision, equipment stability and heat dissipation and chip removal, as well as inadequacy in flexibility and adaptability, achieving efficient and stable cutting results and extending equipment life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN DELTA INNOVATION SEMICON CO LTD
- Filing Date
- 2026-06-03
- Publication Date
- 2026-07-17
AI Technical Summary
Existing semiconductor material cutting equipment has shortcomings in cutting quality and precision, equipment stability and heat dissipation and chip removal, flexibility and adaptability, resulting in low cutting efficiency, high cost and short equipment life.
A semiconductor material cutting device employing sliding, deflection, and rotation cutting mechanisms is used. The sliding mechanism enables coarse adjustment of the cutting position, the deflection adjustment mechanism changes the spatial angle of the cutting head, and the rotation cutting mechanism enables short-distance rotation of the cutting line. Combined with precise cooling and chip removal, the cutting stability and adaptability are improved.
It significantly improves cutting quality and precision, enhances equipment stability and flexibility, extends the service life of the cutting line, and reduces production costs.
Smart Images
Figure CN122401671A_ABST