A semiconductor material cutting apparatus

Abstract

The application relates to the technical field of semiconductors, in particular to a semiconductor material cutting device which comprises two support installation plates arranged opposite to each other, the upper ends of the support installation plates are provided with V-shaped installation racks, the end portions of the V-shaped installation racks are provided with fixed installation rings, and the device further comprises a sliding mechanism, a deflection adjusting mechanism and a turnover cutting mechanism. The semiconductor material cutting device adopts an innovative turnover cutting mode, the cutting line always keeps a relatively short working length, vibration, wear and stress are obviously inhibited, and therefore the cutting surface quality and size precision are greatly improved; the device integrates a multi-degree-of-freedom adjusting and stable guiding system, and has flexible adaptability; accurate cooling and auxiliary chip removal design effectively control heat production and chip removal; automatic tensioning of the cutting line can further guarantee the stability of cutting; the overall structure prolongs the service life of the cutting line and the device while improving the cutting efficiency and quality.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a semiconductor material cutting apparatus. Background Technology

[0002] Semiconductor materials are the cornerstone of the modern electronics industry, and the quality and efficiency of their dicing directly affect chip performance, yield, and manufacturing costs. Wire dicing technology, due to its advantages such as low cutting stress and low kerf loss, is widely used in key processes such as ingot squaring and slicing. However, existing semiconductor wire dicing equipment, especially traditional long-distance sweeping wire dicing methods, is gradually revealing many technical bottlenecks that urgently need to be addressed in today's pursuit of higher precision, higher efficiency, and lower costs.

[0003] First, existing technologies have significant shortcomings in terms of cutting quality and precision. Mainstream equipment uses a unidirectional or reciprocating long-distance sweeping motion of the cutting wire for cutting. In the initial stage of cutting, the contact length between the cutting wire and the processed material is relatively short, which can maintain good rigidity and high cutting stability. However, as the cutting process progresses, especially when cutting into the central region of the semiconductor material, the effective wire length involved in the cutting increases sharply. The excessively long cutting wire is prone to generating multi-order vibrations and uncontrollable vibrations under high-speed motion. This vibration will directly cause microscopic wavy patterns on the cut surface, resulting in uneven kerf width and deterioration of the cut surface roughness, which seriously affects the dimensional accuracy and surface quality of the semiconductor wafer. At the same time, the presence of vibration makes the material removal process of the cutting wire unstable, which not only increases the abnormal wear of the cutting wire, but also introduces uneven mechanical stress inside the material, posing a potential risk of microcracks or even breakage inside the wafer.

[0004] Secondly, existing devices have shortcomings in terms of operational stability and heat dissipation / chip removal. To suppress vibration, some solutions attempt to simply increase the tension of the cutting wire, but this not only increases the risk of wire breakage but may also exacerbate stress concentration. Existing tensioning mechanisms are mostly rigid or passively adjustable, making it difficult to achieve constant, adaptive tension control under complex conditions of dynamically changing cutting wire lengths. This makes it difficult to fundamentally guarantee cutting stability. Furthermore, traditional cooling methods often use fixed-angle spray pipes for large-area coverage cooling, which cannot accurately guide the coolant to the instantaneously high-temperature cutting point, resulting in low heat dissipation efficiency. Insufficient cooling further exacerbates thermal wear on the cutting wire and may damage semiconductor materials due to thermal stress. Simultaneously, the long-distance, unidirectional cutting motion is not conducive to effectively removing fine debris generated during the cutting process from the narrow kerf depths. Residual debris can clog the kerf, increasing the running resistance of the cutting wire and causing secondary wear. This not only reduces cutting efficiency but also scratches the processed surface, creating defects.

[0005] Furthermore, the flexibility and adaptability of existing cutting equipment need to be improved. Many traditional devices have limited degrees of freedom of movement and relatively simple cutting path planning, making them unsuitable for precision cutting of complex shapes or semiconductor structures with specific tilt angles. When performing cutting tasks with different process requirements, adjustments are cumbersome, and adaptability is poor, affecting overall processing efficiency.

[0006] Finally, the aforementioned problems collectively lead to a shortened overall service life of the equipment. The severe vibration of the cutting wire, the sustained high temperatures caused by inadequate cooling, and the secondary wear from debris all significantly accelerate the fatigue and wear of the cutting wire, making it a consumable that requires frequent replacement and increasing production costs. Simultaneously, the long-term operation of the entire equipment under unstable conditions also exacerbates the wear of moving parts, affecting the long-term accuracy and durability of the equipment.

[0007] The present invention aims to solve the technical problems existing in the prior art, and to this end, proposes a semiconductor material cutting device. Summary of the Invention

[0008] The purpose of this invention is to provide a semiconductor material cutting apparatus to solve the technical problems existing in the prior art.

[0009] By adopting the above technical solution, the present invention has the following beneficial effects:

[0010] The present invention provides a semiconductor material cutting device, including two support mounting plates arranged opposite each other, each support mounting plate having a V-shaped mounting bracket at its upper end, and each V-shaped mounting bracket having a fixing mounting ring at its end, and further including: a sliding mechanism, a deflection adjustment mechanism, and a turnover cutting mechanism.

[0011] As a further aspect of the present invention: the sliding mechanism is disposed between two support mounting plates, including two support guide mounting cylinders horizontally disposed between the two support mounting plates, and a movable mounting frame is disposed between the support guide mounting cylinders.

[0012] As a further embodiment of the present invention: the two ends of the support guide mounting cylinder are respectively fixed to two support mounting plates, and the two ends of the movable mounting frame are provided with support guide mounting columns in conjunction with the support guide mounting cylinder.

[0013] As a further aspect of the present invention: the inner side of the supporting guide mounting cylinder is provided with a sliding conductive strip, and the outer side of the supporting guide mounting column is provided with a sliding conductive groove in coordination with the sliding conductive strip.

[0014] As a further embodiment of the present invention: a wire cylinder is provided in the middle of each of the supporting mounting plates, and a winder is provided on each of the supporting mounting plates on one side of the wire cylinder. A traction rope extends from one end of the winder and passes through the wire cylinder to connect with the movable mounting frame.

[0015] As a further aspect of the present invention: a buffer guide tube is provided at the upper end of the mobile mounting frame, and a connecting conduit is provided at the upper end of the buffer guide tube.

[0016] As a further embodiment of the present invention: the deflection adjustment mechanism is located at the lower end of the movable mounting frame, including a support rotating mounting sleeve at the lower end of the movable mounting frame, a support rotating mounting column in cooperation with the support rotating mounting sleeve, a rotating mounting disk at the lower end of the support rotating mounting column, two sets of rotating arc-shaped columns symmetrically arranged on the rotating mounting disk, a rotating mounting ring below the rotating arc-shaped columns, and two sets of steering drive components symmetrically arranged on the outer side of the rotating mounting ring, the steering drive components being respectively located at the ends of the two rotating arc-shaped columns.

[0017] As a further aspect of the present invention: the inner wall of the supporting rotating mounting sleeve is provided with two sets of rotating conductive rings, and the outer side of the supporting rotating mounting column is provided with rotating conductive grooves in conjunction with the rotating conductive rings.

[0018] As a further embodiment of the present invention: a steering bevel gear ring is provided on the outer side of the support rotating mounting column between the support rotating mounting sleeve and the rotating mounting disk, and a plurality of driving bevel gears are provided in angular engagement with the steering bevel gear ring, all of which are fixed at the lower end of the support rotating mounting sleeve.

[0019] As a further aspect of the present invention: the interior of the rotating mounting disk is provided with a liquid distribution and guiding cavity, and a guiding insertion hole is provided in the middle position of the supporting rotating mounting column above the liquid distribution and guiding cavity. A guiding insert is provided on the inner side of the supporting rotating mounting sleeve in conjunction with the guiding insertion hole, and the upper end of the guiding insert is connected to the buffer guiding tube.

[0020] As a further aspect of the present invention: an arc-shaped flow guiding cavity is provided inside the rotating arc-shaped column, and the arc-shaped flow guiding cavity is connected to the liquid distribution flow guiding cavity. Several universal flow guiding tubes are symmetrically arranged on both sides of the rotating mounting plate and both sides of the rotating arc-shaped column. One end of the universal flow guiding tube on the rotating mounting plate and one end of the universal flow guiding tube on the rotating arc-shaped column are connected to the liquid distribution flow guiding cavity and the arc-shaped flow guiding cavity, respectively. A nozzle is provided at the other end of each universal flow guiding tube.

[0021] As a further aspect of the present invention: the turnover cutting mechanism is set on the rotating mounting ring, including a limiting rotating ring set inside the rotating mounting ring, a limiting rotating cylinder movably set in conjunction with the limiting rotating ring, a swing drive component set outside the limiting rotating cylinder via a fixed mounting frame, two sets of synchronous swing mounting frames symmetrically set at both ends of the swing drive component via a rotating shaft, a deflection drive column set between the outer ends of the two sets of synchronous swing mounting frames, the two ends of the deflection drive column being rotatably connected to the synchronous swing mounting frame, two arc-shaped mounting frames symmetrically set outside the deflection drive column, each arc-shaped mounting frame having a drive rotating column set via a rotating shaft, an arc-shaped drive telescopic rod set outside the drive rotating column, a working mounting frame set at the outer end of each arc-shaped drive telescopic rod, and a limiting guide wheel set on the working mounting frame via a rotating shaft.

[0022] As a further embodiment of the present invention: the outer end of the deflection drive column is also provided with an adjustment drive telescopic column, the outer end of the adjustment drive telescopic column is provided with an adjustment mounting bracket through a limiting telescopic column, and a spring is sleeved on the outer side of the limiting telescopic column between the adjustment mounting bracket and the adjustment drive telescopic column.

[0023] As a further aspect of the present invention: the adjusting mounting bracket is provided with a drive guide wheel via a rotating shaft, and a cutting line is provided between the drive guide wheel and the two limiting guide wheels.

[0024] As a further aspect of the present invention: the inner side of the limiting rotating cylinder is symmetrically provided with arc-shaped conductive columns, and the outer side of the limiting rotating ring is provided with an annular conductive groove in conjunction with the arc-shaped conductive columns.

[0025] As a further embodiment of the present invention: several driving guide wheels are symmetrically arranged at both ends of the limiting rotating cylinder, and all driving guide wheels are in contact with the limiting rotating ring.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] 1. High cutting quality and precision

[0028] The innovative rotary cutting method differs from traditional long-distance sweep wire cutting. This device uses a rotary cutting mechanism to allow the cutting wire to rotate on the cutting surface of the semiconductor material. Even when cutting into the center of the material in the later stages of the cutting process, it can maintain a shorter cutting length. This significantly reduces the vibration, wear, and stress caused by long-wire cutting, thereby greatly improving the quality and dimensional accuracy of the cut surface.

[0029] 2. Stable and reliable operation

[0030] The rotating cutting mechanism uses a combination of a limiting telescopic column and a spring to keep the drive guide wheel in an elastic floating state, which can automatically maintain the tension of the cutting line, effectively suppress vibration during the cutting process, and further ensure the stability and quality of the cutting.

[0031] 3. Excellent heat dissipation and chip removal performance

[0032] The operator can bend the universal guide tube in advance according to the cutting path, so that the coolant can be accurately sprayed onto the cutting point through the nozzle, resulting in high heat dissipation efficiency.

[0033] The auxiliary chip removal mechanism and the rotating cutting motion help to remove chips generated during the cutting process from deep within the kerf, preventing chip accumulation from affecting the working efficiency and service life of the cutting line.

[0034] 4. Flexible adjustment and strong adaptability

[0035] The device has multiple motion functions such as sliding, deflection and rotation. The sliding mechanism can be used to coarsely adjust the cutting position, the deflection adjustment mechanism can be used to change the spatial angle of the entire cutting head, and the rotation cutting mechanism can be used to finely adjust the length and angle of the cutting line. This multi-degree-of-freedom design enables the device to adapt to semiconductor materials with different shapes and cutting requirements.

[0036] 5. Long equipment lifespan

[0037] Because of the short-distance turnaround cutting, the wear and heat generation per unit length of the cutting wire are significantly reduced, and the effective cooling also reduces thermal damage, thereby extending the service life of the cutting wire.

[0038] The overall rigid structure and stable motion guidance reduce abnormal wear on various components, which helps to improve the durability of the entire device. Attached Figure Description

[0039] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0040] Figure 1 This is a front and side view of a semiconductor material cutting device.

[0041] Figure 2 This is a rear-view three-dimensional structural diagram of a semiconductor material cutting device.

[0042] Figure 3 This is a three-dimensional structural diagram of a sliding mechanism in a semiconductor material cutting device.

[0043] Figure 4 This is a partial cross-sectional schematic diagram of a sliding mechanism in a semiconductor material cutting device.

[0044] Figure 5 for Figure 4 An enlarged schematic diagram of point a in the middle.

[0045] Figure 6 This is a three-dimensional structural diagram of a deflection adjustment mechanism in a semiconductor material cutting device.

[0046] Figure 7 This is a partial three-dimensional structural diagram of a deflection adjustment mechanism in a semiconductor material cutting device.

[0047] Figure 8 This is a partial cross-sectional schematic diagram of a deflection adjustment mechanism in a semiconductor material cutting device.

[0048] Figure 9 This is a partial cross-sectional schematic diagram of a rotating mounting ring in a semiconductor material cutting device.

[0049] Figure 10 for Figure 9 Enlarged schematic diagram of point b in the middle.

[0050] Figure 11 This is a three-dimensional structural diagram of a turnover cutting mechanism in a semiconductor material cutting device.

[0051] Figure 12 for Figure 11 An enlarged view of point c in the middle.

[0052] 1-Support mounting plate, 2-Support guide mounting cylinder, 3-V-shaped mounting bracket, 4-Fixed mounting ring, 5-Rotating arc-shaped column, 6-Rotating mounting ring, 7-Supporting rotating mounting sleeve, 8-Limiting rotating cylinder, 9-Synchronous swing mounting bracket, 10-Cutting line, 11-Buffer guide cylinder, 12-Connecting conduit, 13-Universal guide pipe, 14-Nozzle, 15-Winder, 16-Steering drive component, 17-Traction rope, 18-Moving mounting bracket, 19-Wire cylinder, 20-Support guide mounting column, 21-Sliding conductive groove, 22-Sliding conductive strip, 23-Guide insert, 24-Drive bevel gear, 25-Rotating mounting plate 26-Limiting rotating ring, 27-Supporting rotating mounting column, 28-Rotating conductive groove, 29-Rotating conductive ring, 30-Flow guide hole, 31-Steering bevel gear ring, 32-Liquid distribution guide cavity, 33-Arc-shaped conductive column, 34-Arc-shaped guide cavity, 35-Annular conductive groove, 36-Oscillating drive component, 37-Deflection drive column, 38-Arc-shaped mounting bracket, 39-Drive rotating column, 40-Arc-shaped drive telescopic rod, 41-Spring, 42-Adjusting drive telescopic column, 43-Adjusting mounting bracket, 44-Drive guide wheel, 45-Working mounting bracket, 46-Limiting guide wheel, 47-Limiting telescopic column, 48-Drive guide wheel. Detailed Implementation

[0053] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0054] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0055] Example 1, please refer to Figures 1-4 In this embodiment of the invention, a semiconductor material cutting device includes two support mounting plates 1 facing each other. Each support mounting plate 1 has a V-shaped mounting bracket 3 at its upper end and a fixed mounting ring 4 at its end. The device also includes a sliding mechanism, a deflection adjustment mechanism, and a turnover cutting mechanism.

[0056] The two support mounting plates 1 are fixed to the top of the working area by the V-shaped mounting bracket 3 and the fixed mounting ring 4 on it. Then, the horizontal displacement of the deflection adjustment mechanism and the turnover cutting mechanism is adjusted by the sliding mechanism. The spatial angle of the turnover cutting mechanism is adjusted by the deflection adjustment mechanism so that the turnover cutting mechanism can rotate at a certain spatial angle to cut the semiconductor material fixed by the external equipment.

[0057] Example 2, based on Example 1, please refer to... Figures 3-5 In this embodiment of the invention, the sliding mechanism is disposed between two supporting mounting plates 1, including two supporting guide mounting cylinders 2 horizontally disposed between the two supporting mounting plates 1, and a movable mounting frame 18 disposed between the supporting guide mounting cylinders 2. The two ends of the supporting guide mounting cylinders 2 are respectively fixed on the two supporting mounting plates 1. The two ends of the movable mounting frame 18 are provided with supporting guide mounting columns 20 in cooperation with the supporting guide mounting cylinders 2. The inner side of the supporting guide mounting cylinders 2 is provided with sliding conductive strips 22, and the outer side of the supporting guide mounting columns 20 is provided with sliding conductive grooves 21 in cooperation with the sliding conductive strips 22.

[0058] Each of the support mounting plates 1 has a wire tube 19 in the middle. Each of the support mounting plates 1 on one side of the wire tube 19 has a winder 15. One end of the winder 15 extends out and is provided with a traction rope 17. The traction rope 17 passes through the wire tube 19 and is connected to the movable mounting frame 18. The upper end of the movable mounting frame 18 is provided with a buffer guide tube 11, and the upper end of the buffer guide tube 11 is provided with a connecting conduit 12.

[0059] By winding and unwinding the traction rope 17 at both ends of the winding device 15, the movable mounting frame 18 can be moved and repositioned. With the cooperation of the support guide column and the support guide mounting cylinder 2, the movement of the movable mounting frame 18 is more stable. At the same time, the sliding conductive strip 22, with the cooperation of the sliding conductive groove 21, realizes sliding coupling power supply, ensuring continuous and stable power supply to the movable mounting frame 18.

[0060] The external equipment is connected through the connecting conduit 12, so that the external coolant can be continuously introduced into the buffer guide tube 11. The coolant is a non-conductive coolant.

[0061] Example 3, based on Example 2, please refer to... Figures 6-8 In this embodiment of the invention, the deflection adjustment mechanism is located at the lower end of the movable mounting frame 18, including a support rotating mounting sleeve 7 located at the lower end of the movable mounting frame 18, a support rotating mounting column 27 provided in cooperation with the support rotating mounting sleeve 7, a rotating mounting disk 25 located at the lower end of the support rotating mounting column 27, two sets of rotating arc surface columns 5 symmetrically arranged on the rotating mounting disk 25, a rotating mounting ring 6 located below the rotating arc surface columns 5, and two sets of steering drive components 16 symmetrically arranged on the outer side of the rotating mounting ring 6, with the steering drive components 16 respectively located at the ends of the two rotating arc surface columns 5;

[0062] The inner wall of the support rotating mounting sleeve 7 is provided with two sets of rotating conductive rings 29, and the outer side of the support rotating mounting column 27 is provided with rotating conductive grooves 28 in conjunction with the rotating conductive rings 29.

[0063] A steering bevel gear ring 31 is provided on the outside of the support rotating mounting column 27 between the support rotating mounting sleeve 7 and the rotating mounting disk 25. A plurality of drive bevel gears 24 are provided in equiangular meshing with the steering bevel gear ring 31. All drive bevel gears 24 are fixed to the lower end of the support rotating mounting sleeve 7.

[0064] The rotating mounting plate 25 is provided with a liquid distribution and guiding cavity 32. A guiding hole 30 is provided in the middle of the supporting rotating mounting column 27 above the liquid distribution and guiding cavity 32. A guiding tube 23 is provided on the inner side of the supporting rotating mounting sleeve 7 in conjunction with the guiding hole 30. The upper end of the guiding tube 23 is connected to the buffer guiding tube 11.

[0065] The rotating arc-shaped column 5 is provided with an arc-shaped flow guide cavity 34 inside. The arc-shaped flow guide cavity 34 is connected to the liquid distribution flow guide cavity 32. Several universal flow guide tubes 13 are symmetrically arranged on both sides of the rotating mounting plate 25 and both sides of the rotating arc-shaped column 5. One end of the universal flow guide tube 13 on the rotating mounting plate 25 and one end of the universal flow guide tube 13 on the rotating arc-shaped column 5 are connected to the liquid distribution flow guide cavity 32 and the arc-shaped flow guide cavity 34, respectively. The other end of the universal flow guide tube 13 is provided with a nozzle 14.

[0066] By driving the bevel gear 24 to mesh and drive the steering bevel gear ring 31 to rotate, the supporting rotating mounting column 27 and the supporting rotating mounting sleeve 7 are rotated and displaced. At this time, the rotating disk and its rotating arc surface column 5 are also rotated and displaced. Rotational coupling power supply is achieved with the cooperation of the rotating conductive ring 29 and the rotating conductive groove 28.

[0067] External coolant enters the guide tube 23 through the buffer guide tube 11, and then enters the liquid distribution guide cavity 32 through the guide tube 23 and the guide hole 30. It then enters the arc-shaped guide cavity 34 inside the rotating arc-shaped column 5 through the liquid distribution guide cavity 32. Finally, the coolant is discharged from the nozzle 14 through the universal guide tube 13. According to the cutting path of this cutting operation, the shape of the universal guide tube 13 is pre-adjusted so that the coolant in the nozzle 14 is accurately sprayed onto the cutting path.

[0068] Example 4, based on Example 3, please refer to... Figures 9-12 In this embodiment of the invention, the turnover cutting mechanism is mounted on the rotating mounting ring 6, including a limiting rotating ring 26 disposed inside the rotating mounting ring 6, a limiting rotating cylinder 8 movably disposed in conjunction with the limiting rotating ring 26, and a swing drive component 36 disposed outside the limiting rotating cylinder 8 via a fixed mounting bracket. Two sets of synchronous swing mounting brackets 9 are symmetrically disposed at both ends of the swing drive component 36 via a rotating shaft. A deflection drive column 37 is disposed between the outer ends of the two sets of synchronous swing mounting brackets 9, and both ends of the deflection drive column 37 are rotatably connected to the synchronous swing mounting brackets 9. Two arc-shaped mounting brackets 38 are symmetrically disposed outside the deflection drive column 37, and each arc-shaped mounting bracket 38 is provided with a drive rotating column via a rotating shaft. 39. Arc-shaped drive telescopic rods 40 are provided on the outer side of the drive rotating column 39. A working mounting frame 45 is provided at the outer end of each arc-shaped drive telescopic rod 40. A limit guide wheel 46 is provided on the working mounting frame 45 via a rotating shaft. An adjustment drive telescopic column 42 is also provided at the outer end of the deflection drive column 37. An adjustment mounting frame 43 is provided at the outer end of the adjustment drive telescopic column 42 via a limit telescopic column 47. A spring 41 is sleeved on the outer side of the limit telescopic column 47 between the adjustment mounting frame 43 and the adjustment drive telescopic column 42. A drive guide wheel 44 is provided on the adjustment mounting frame 43 via a rotating shaft. A cutting line 10 is provided between the drive guide wheel 44 and the two limit guide wheels 46.

[0069] The inner side of the limiting rotating cylinder 8 is symmetrically provided with arc-shaped conductive posts 33, and the outer side of the limiting rotating ring 26 is provided with annular conductive grooves 35 in conjunction with the arc-shaped conductive posts 33. Several driving guide wheels 48 are symmetrically provided at both ends of the limiting rotating cylinder 8, and all driving guide wheels 48 are in contact with the limiting rotating ring 26.

[0070] By driving the guide wheel 48 to roll on the limiting rotating ring 26, the limiting rotating cylinder 8 rotates on the limiting rotating ring 26. During the rotation, the arc-shaped conductive column 33 and the annular conductive groove 35 cooperate to ensure the continuous power supply to the limiting rotating cylinder 8.

[0071] As the limiting rotating cylinder 8 rotates, the two sets of synchronously swinging mounting frames 9 are driven by the swing drive component 36 to deflect at an angle. At the same time, the lengths of the arc-shaped drive telescopic rod 40 and the adjusting drive telescopic column 42 are adjusted to change the length of the cutting line 10 between the two limiting guide wheels 46 during the rotational cutting. Then, through the deflection of the deflection drive column 37, the arc-shaped drive telescopic rod 40 and the adjusting drive telescopic column 42 are deflected synchronously. In conjunction with the drive rotating column 39, the angle of the arc-shaped drive telescopic rod 40 is adjusted to change the angle of the cutting line 10 between the two limiting guide wheels 46 during the rotational cutting. This allows the cutting line 10 to rotate and perform cutting operations on the semiconductor cutting surface. The rotational motion enables the cutting line to cut over a shorter working distance and maintain stability for a long time. Current semiconductor cutting often uses direct sweep wire cutting, which results in a large variation in the wire cutting working length. The longer the cutting line 10, the more likely it is to generate unnecessary vibrations during cutting, causing a decrease in semiconductor cutting accuracy and quality. It also causes accelerated wear of the cutting line 10, increases the heat generated during cutting, and puts a lot of pressure on heat dissipation, affecting its service life.

[0072] Even in the later stages of cutting, when cutting into the center of the semiconductor material, the cyclic cutting operation can be carried out at a relatively short cutting interval. At this time, although the length of the cutting line 10 between the two limiting guide wheels 46 is also relatively long, the actual cutting operation length is relatively short, resulting in less heat generation, less cutting vibration, less stress generated during cutting, and significantly improved cutting quality and efficiency.

[0073] Furthermore, it can remove deep cutting debris as it rotates, thereby improving the work efficiency of the cutting line 10 between the two limiting guide wheels 46. Through the cooperation of the limiting telescopic column 47 and the spring 41, the drive guide wheel 44 is always in an elastic floating state, which can ensure that the cutting line 10 remains taut, thereby suppressing the generation of vibration of the cutting line 10 and further improving the cutting quality and efficiency of semiconductor materials.

[0074] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0075] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A semiconductor material cutting apparatus, comprising two opposing support mounting plates, each support mounting plate having a V-shaped mounting bracket at its upper end, and each V-shaped mounting bracket having a fixing mounting ring at its end, characterized in that, Also includes: A sliding mechanism is provided between two support mounting plates, including two support guide mounting cylinders horizontally arranged between the two support mounting plates, and a movable mounting frame is provided between the support guide mounting cylinders; A deflection adjustment mechanism is located at the lower end of the movable mounting frame. It includes a support rotating mounting sleeve at the lower end of the movable mounting frame, a support rotating mounting column in cooperation with the support rotating mounting sleeve, a rotating mounting plate at the lower end of the support rotating mounting column, two sets of rotating arc-shaped columns symmetrically arranged on the rotating mounting plate, a rotating mounting ring below the rotating arc-shaped columns, and two sets of steering drive components symmetrically arranged on the outer side of the rotating mounting ring. The steering drive components are respectively located at the ends of the two rotating arc-shaped columns. A rotary cutting mechanism is mounted on a rotating mounting ring. It includes a limiting rotating ring inside the rotating mounting ring, a limiting rotating cylinder that moves in conjunction with the limiting rotating ring, and a swing drive component mounted on the outside of the limiting rotating cylinder via a fixed mounting frame. Two sets of synchronous swing mounting frames are symmetrically mounted at both ends of the swing drive component via a rotating shaft. A deflection drive column is positioned between the outer ends of the two sets of synchronous swing mounting frames, with both ends of the deflection drive column rotatably connected to the synchronous swing mounting frames. Two arc-shaped mounting frames are symmetrically mounted on the outside of the deflection drive column, each with a drive rotating column mounted on a rotating shaft. An arc-shaped drive telescopic rod is mounted on the outside of each drive rotating column, and a working mounting frame is mounted at the outer end of each arc-shaped drive telescopic rod. A limiting guide wheel is mounted on the working mounting frame via a rotating shaft. An adjusting drive telescopic column is also mounted at the outer end of the deflection drive column, and an adjusting mounting frame is mounted on the outer end of the adjusting drive telescopic column via the limiting telescopic column. A drive guide wheel is mounted on the adjusting mounting frame via a rotating shaft, and a cutting line is enveloped between the drive guide wheel and the two limiting guide wheels.

2. The semiconductor material cutting apparatus according to claim 1, characterized in that, The two ends of the support guide mounting cylinder are respectively fixed to two support mounting plates. Both ends of the movable mounting frame are equipped with support guide mounting columns in conjunction with the support guide mounting cylinder. The upper end of the movable mounting frame is equipped with a buffer guide cylinder, and the upper end of the buffer guide cylinder is equipped with a connecting conduit.

3. The semiconductor material cutting apparatus according to claim 2, characterized in that, The inner side of each support guide mounting cylinder is provided with a sliding conductive strip, and the outer side of each support guide mounting column is provided with a sliding conductive groove to cooperate with the sliding conductive strip.

4. The semiconductor material cutting apparatus according to claim 2, characterized in that, Each of the support mounting plates has a wire cylinder in the middle, and each of the support mounting plates on one side of the wire cylinder has a winder. One end of the winder extends out and is equipped with a traction rope, which passes through the wire cylinder and is connected to the movable mounting frame.

5. A semiconductor material cutting apparatus according to claim 1, characterized in that, The inner wall of the support rotating mounting sleeve is provided with two sets of rotating conductive rings, and the outer side of the support rotating mounting column is provided with rotating conductive grooves in conjunction with the rotating conductive rings.

6. The semiconductor material cutting apparatus according to claim 5, characterized in that, A steering bevel gear ring is provided on the outer side of the support rotating mounting column between the support rotating mounting sleeve and the rotating mounting plate. Several drive bevel gears are provided in angular engagement with the steering bevel gear ring, and all drive bevel gears are fixed to the lower end of the support rotating mounting sleeve.

7. A semiconductor material cutting apparatus according to claim 6, characterized in that, The rotating mounting plate has a liquid distribution and guiding cavity inside. A guiding hole is provided in the middle of the supporting rotating mounting column above the liquid distribution and guiding cavity. A guiding tube is provided on the inner side of the supporting rotating mounting sleeve to cooperate with the guiding hole. The upper end of the guiding tube is connected to the buffer guiding tube.

8. A semiconductor material cutting apparatus according to claim 7, characterized in that, The rotating arc-shaped column has an arc-shaped flow guide cavity inside, which is connected to the liquid distribution flow guide cavity. Several universal flow guide tubes are symmetrically arranged on both sides of the rotating mounting plate and both sides of the rotating arc-shaped column. One end of the universal flow guide tube on the rotating mounting plate and one end of the universal flow guide tube on the rotating arc-shaped column are connected to the liquid distribution flow guide cavity and the arc-shaped flow guide cavity, respectively. The other end of each universal flow guide tube is equipped with a nozzle.

9. A semiconductor material cutting apparatus according to claim 1, characterized in that, A spring is fitted on the outer side of the limiting telescopic column between the adjusting mounting bracket and the adjusting drive telescopic column.

10. A semiconductor material cutting apparatus according to claim 1, characterized in that, The inner side of the limiting rotating cylinder is symmetrically provided with arc-shaped conductive posts, and the outer side of the limiting rotating ring is provided with annular conductive grooves in conjunction with the arc-shaped conductive posts. Several driving guide wheels are symmetrically provided at both ends of the limiting rotating cylinder, and all driving guide wheels are in contact with the limiting rotating ring.

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