一种聚酰亚胺薄膜的烘烤方法以及防护结构
By heating and curing polyimide films in a dynamic vacuum environment and using a protective structure to expel volatiles, the problems of bubbles, cracking, and contamination in polyimide films have been solved, achieving efficient and low-cost film preparation.
CN122401722APending Publication Date: 2026-07-17TSINGHUA UNIVERSITY
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TSINGHUA UNIVERSITY
- Filing Date
- 2026-06-18
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In the existing technology, hot baking of polyimide films is prone to producing bubbles, nitrogen-protected baking is costly and inconvenient to operate, and it is easy to contaminate the film, making it difficult to effectively prevent oxidation, bubbles and dust contamination.
Method used
The substrate is placed in an oven with a protective structure and dynamically vacuum-cured. Volatile substances are continuously removed by vacuuming, avoiding nitrogen protection and preventing oxidation, bubbles and dust contamination.
Benefits of technology
It achieves flatness and cleanliness of polyimide films under nitrogen-free conditions, avoiding bubbles, cracks and dust contamination, simplifying the process and reducing costs.
✦ Generated by Eureka AI based on patent content.
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Figure CN122401722A_ABST
Abstract
本公开涉及一种聚酰亚胺薄膜的烘烤方法以及防护结构，将涂覆有聚酰亚胺前驱体溶液的基片置于防护结构中之后，放置到烘箱中；对烘箱抽真空，并在加热固化过程中持续进行抽真空，以维持动态真空环境；在动态真空环境下，对烘箱进行加热升温，按照预设的温度曲线对聚酰亚胺前驱体溶液进行固化，并通过持续抽真空将固化过程中产生的挥发物排出腔体；固化结束后降温并恢复常压，得到位于基片上方的聚酰亚胺薄膜。其中，防护结构包括防护罩，防护罩罩设于基片外部，且防护罩与基片之间形成有供挥发物排出的气体交换通道。固化形成聚酰亚胺薄膜的过程中，无需氮气、且能够有效防止聚酰亚胺薄膜的氧化、气泡、开裂及浮尘污染。
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