Semiconductor package mold structure

By integrating thermal expansion compensation grooves and shape memory alloy actuation layers into semiconductor packaging molds, combined with vacuum accumulators and quick-acting valves, zero-gap sealing and efficient air extraction are achieved in high-temperature environments, solving the problems of package overflow and micropores, and improving packaging quality and mold life.

CN122401752APending Publication Date: 2026-07-17KUNSHAN YINAITE PRECISION MOLD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KUNSHAN YINAITE PRECISION MOLD
Filing Date
2026-03-25
Publication Date
2026-07-17

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Abstract

本发明公开了一种半导体封装模具结构，属于半导体封装技术领域，包括：机台主体，连接于所述机台主体的压机驱动机构，设置在所述压机驱动机构上的安装平台，连接于所述安装平台上的下模组件，以及设置在所述下模组件上方的上模组件，所述下模组件包括：连接于所述安装平台的下模座、以及嵌设在所述下模座内的下模芯；所述下模芯包括：设置在其中央区域的成型工作区、以及设置在所述成型工作区外围的非成型配合区；所述非成型配合区上开设有热膨胀补偿槽，所述热膨胀补偿槽配置为吸收所述下模芯受热产生的形变位移；本发明通过在下模组件中集成热膨胀补偿槽与记忆合金致动层，提高了封装成品的良率与可靠性。
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