An injection molding production line and injection molding method for a packaging structure

Abstract

This application discloses a packaging structure injection molding production line and injection molding method. The packaging structure injection molding production line includes: a feeding mechanism, a turntable mechanism, a mold closing injection molding mechanism, and a unloading mechanism. The unloading mechanism includes: a support body, on which a carrier tray that can move along a preset path is provided, the carrier tray being used to receive and transport the injection-molded packaging shell; multiple workstations are sequentially arranged on the support body along the preset path, and multiple workstations are sequentially provided with an unloading detection component, a leveling component, and a transfer component, the carrier tray moving sequentially between the multiple workstations; the support body is also provided with multiple sets of heat dissipation components, and at least one set of heat dissipation components is selectively arranged at the workstations where the unloading detection component, the leveling component, and the transfer component are located.

Description

Technical Field

[0001] This application relates to the field of injection molding technology, and more specifically to an injection molding production line for a packaging structure. Background Technology

[0002] Currently, in the field of injection molding production lines for packaging structures, automated assembly line operations have become the mainstream method for improving production efficiency. A typical injection molding production line for packaging structures usually includes basic components such as a feeding unit, a turntable conveyor unit, an injection molding unit, and a finished product unloading unit. Through the mechanical connections between these units, a serial operation process from substrate input, packaging molding to finished product output is achieved. Such production lines are widely used in packaging fields such as consumer electronics, automotive electronics, and power semiconductor modules to achieve mass production of external plastic protective shells for chips, circuit boards, or other sensitive components.

[0003] However, in existing automated injection molding production lines, the unloading mechanism, as the final execution device in the finished product output stage, is typically designed with a relatively simple function. Its main task is to remove the injection-molded casing from the mold or turntable and place it on the downstream conveyor belt or tray. The unloading mechanism itself generally lacks the ability to actively identify, judge, and process the quality status of the casing. The production line lacks effective solutions for the common problem of localized warping deformation of the casing surface caused by uneven cooling and shrinkage, differences in mold temperature fields, or the release of internal material stress during injection molding, resulting in a low product yield. Summary of the Invention

[0004] The purpose of this application is to provide an injection molding production line and injection molding method for packaging structures to improve the product yield.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: A packaging structure injection molding production line is provided, comprising: a feeding mechanism, a turntable mechanism, a mold-closing injection molding mechanism, and a unloading mechanism. The feeding mechanism, the mold-closing injection molding mechanism, and the unloading mechanism are arranged around the turntable mechanism. The feeding mechanism is used to transport the substrate to be injection molded onto the turntable mechanism. The mold-closing injection molding mechanism is used to remove the substrate located on the turntable mechanism for injection molding to form a packaging shell. The unloading mechanism unloads the corresponding injection-molded packaging shell. The unloading mechanism includes: a support body, on which a carrier tray movable along a preset path is provided. The carrier tray is used to receive and transport the injection-molded packaging shell. The enclosure is assembled; multiple workstations are arranged sequentially along a preset path on the support body, and a material unloading detection component, a leveling component, and a transfer component are arranged sequentially on the multiple workstations. The carrying tray moves sequentially between the multiple workstations; the support body is also provided with multiple sets of heat dissipation components, and at least one set of heat dissipation components is selectively arranged at the workstations where the material unloading detection component, the leveling component, and the transfer component are located; wherein, the encapsulation enclosure is cooled in multiple stages by the multiple sets of heat dissipation components at different transfer stages, the material unloading detection component is used to detect the degree of warpage of the encapsulation enclosure, the leveling component is used to level and correct the warped encapsulation enclosure, and the transfer component is used to transfer the leveled and corrected encapsulation enclosure.

[0006] As a preferred embodiment, the unloading detection component includes: at least one pair of detection brackets and a sensor body, wherein the sensor body is connected to the detection brackets, and the detection brackets are movably mounted on the bracket body; when the carrying tray is moved to the workstation where the unloading detection component is located, the sensor bodies are respectively located on both sides of the carrying tray.

[0007] As a preferred embodiment, the bracket body is further provided with a positioning component, which is located close to the unloading detection component; wherein, the positioning component is used to lock and fix the carrier tray to limit the displacement of the carrier tray relative to the unloading detection component during the detection of the packaging shell.

[0008] As another preferred embodiment, the positioning component includes: a substrate fixedly connected to the support body, the substrate extending along the conveying direction of the carrier tray; positioning members, a plurality of positioning members spaced apart on the substrate along the conveying direction of the carrier tray; and a protrusion fixedly disposed on the side of the carrier tray and protruding toward one side of the substrate; wherein, when the carrier tray moves along the conveying direction, the protrusion selectively engages with any of the positioning members to lock and fix the carrier tray at the corresponding detection point, so that the unloading detection component can detect different positions on the upper surface of the packaging shell respectively.

[0009] Preferably, the support body is further provided with a blowing assembly, which is located at the work station of the leveling assembly and to the side of the leveling assembly; wherein, the blowing assembly is used to blow airflow onto the surface of the packaging shell to be leveled in order to remove debris from the surface of the packaging shell to be leveled.

[0010] Preferably, the leveling assembly includes: a lifting mechanism, one end of which is fixedly connected to the support body; a leveling pressure plate, connected to the other end of the lifting mechanism and driven by the lifting mechanism to move up and down in the vertical direction; and a plurality of leveling pins, which are spaced apart on the lower surface of the leveling pressure plate, and each leveling pin has a flat pressure head on its end face that contacts the packaging shell; wherein, by driving the leveling pressure plate down through the lifting mechanism, the flat pressure head of each leveling pin contacts each area of ​​the upper surface of the packaging shell and applies downward pressure to perform multi-point pressure leveling on the surface of the packaging shell.

[0011] Further preferably, the heat dissipation component includes a first heat dissipation component and a second heat dissipation component; the first heat dissipation component is disposed at the workstation where the unloading and detection component is located, and is used to dissipate heat from the packaged shell when it is being detected; the support body is also provided with a conveying platform, which is located in the downstream area of ​​the transfer component, and the second heat dissipation component is disposed on the conveying platform. The transfer component moves the leveled and corrected packaged shell to the conveying platform to complete the unloading, and then the second heat dissipation component dissipates heat from the packaged shell. The second heat dissipation component and the first heat dissipation component together constitute a multi-stage heat dissipation system for the packaged shell.

[0012] Preferably, the turntable mechanism includes a turntable and a base, the turntable being connected to and rotatable relative to the base, and a feeding and detection component is provided on the turntable mechanism; the feeding mechanism includes a first feeding mechanism and a second feeding mechanism, the first feeding mechanism being used to transport the substrate to be injected to the turntable, and rotating with the turntable to the feeding and detection component for detection of the substrate; wherein, when the feeding and detection component detects that the substrate is unqualified, the unqualified substrate is removed from the turntable by the second feeding mechanism, and the reworked substrate is reloaded onto the turntable by the second feeding mechanism; when the feeding and detection component detects that the substrate is qualified, the substrate is injection molded and packaged by the mold closing and injection molding mechanism, and the packaged shell after injection molding is transferred to the unloading mechanism for unloading.

[0013] Furthermore, this application also provides a method for injection molding a packaging structure, which is applicable to the packaging structure injection molding production line described in any one of the above. The method includes: step S10: transporting the substrate to be injection molded to a turntable mechanism via a feeding mechanism; step S20: removing the substrate from the turntable mechanism via a mold-closing injection molding mechanism and performing injection molding to form a packaging shell; step S30: transferring the injection-molded packaging shell to a carrying tray of a unloading mechanism, the carrying tray sequentially passing through an unloading inspection mechanism along a preset transfer path. The testing, leveling, and transfer components are located at the workstations, and multiple sets of heat dissipation components are used to dissipate heat from the packaged housing; Step S40: At the workstation where the unloading testing component is located, the degree of warpage of the packaged housing on the carrier tray is detected, and it is determined whether the packaged housing is warped; if it is determined to be warped, the packaged housing is leveled and corrected by the leveling component, and the leveled packaged housing is transported to the workstation where the transfer component is located; if it is determined not to be warped, the packaged housing is directly transported to the workstation where the transfer component is located; Step S50: The packaged housing is transferred and unloaded by the transfer component.

[0014] Further preferably, the feeding mechanism includes a first feeding mechanism and a second feeding mechanism, and the turntable mechanism is equipped with a feeding detection component; step S10 also includes step S11: the substrate to be injected is transported to the turntable mechanism via the first feeding mechanism; step S12: the substrate is rotated to the feeding detection component via the turntable for detection; step S13: if the feeding detection component detects that the substrate is unqualified, the second feeding mechanism removes the unqualified substrate from the turntable for repair, and the repaired substrate is reloaded onto the turntable by the second feeding mechanism; if the feeding detection component detects that the substrate is qualified, the turntable transfers the qualified substrate to the mold closing injection mechanism.

[0015] Compared with the prior art, the beneficial effects of this application are as follows: The unloading inspection component detects the warpage of the packaged housing to obtain height deviation data of various points on the housing surface relative to a standard plane. The leveling component corrects the detected warpage by applying controllable pressure at multiple points to restore the warped portion to within the allowable tolerance range. The transfer component picks up and removes the leveled and corrected packaged housing from the unloading mechanism, thus completing the entire unloading process. The arrangement of these components in the unloading mechanism transforms it from a single-function handling device into a multi-functional integrated processing unit that combines detection, correction, multi-stage temperature control, sorting, and transfer. This improves the product yield during production, significantly reduces the investment in subsequent independent detection and correction equipment, and simplifies the production line structure. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an injection molding production line for packaging structures.

[0017] Figure 2 This is a top-down view of the injection molding production line for the packaging structure.

[0018] Figure 3 This is a schematic diagram of the turntable mechanism.

[0019] Figure 4 This is a schematic diagram of the feeding mechanism.

[0020] Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0021] Figure 6 This is a schematic diagram of the feeding mechanism from another isometric perspective.

[0022] Figure 7 This is a magnified view of the location of the material unloading detection component.

[0023] Figure 8 This is a structural diagram showing the positions of the leveling and transfer components in the feeding mechanism.

[0024] Figure 9 for Figure 8 A magnified view of a section at point B in the middle.

[0025] Figure 10 A magnified view showing the position of the leveling components.

[0026] In the diagram: 1. Injection molding production line for packaging structure; 2. Substrate; 3. Packaging shell; 10. Feeding mechanism; 11. First feeding mechanism; 12. Second feeding mechanism; 20. Turntable mechanism; 21. Turntable; 22. Base; 23. Feeding detection component; 30. Mold closing injection mechanism; 40. Unloading mechanism; 41. Support body; 42. Bearing tray; 43. Unloading detection component; 431. Detection bracket; 432. Sensor body; 44. Leveling component; 441. Lifting mechanism; 442. Leveling pressure plate; 443. Leveling ejector pin; 444. Flat pressure head; 45. Transfer component; 46. Heat dissipation component; 461. First heat dissipation component; 462. Second heat dissipation component; 47. Positioning component; 471. Substrate; 472. Positioning component; 473. Protrusion; 48. Blowing component; 49. Conveying platform. Detailed Implementation

[0027] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0028] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0029] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0030] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0031] In a preferred embodiment, see Figures 1 to 10 This application provides a packaging structure injection molding production line 1, specifically an HPD packaging structure injection molding production line 1, where HPD stands for High Power Device. The packaging structure injection molding production line 1 includes a loading mechanism 10, a turntable mechanism 20, a mold-closing injection molding mechanism 30, and a unloading mechanism 40. The loading mechanism 10, mold-closing injection molding mechanism 30, and unloading mechanism 40 are arranged around the turntable mechanism 20. This surrounding layout makes the spatial arrangement between the functional mechanisms compact and reasonable, shortening the transfer distance of the substrate 2 between different process stages, thereby effectively reducing the production cycle time. The loading mechanism 10 is used to transport the substrate 2 to be injection molded onto the turntable mechanism 20. The mold-closing injection molding mechanism 30 is used to remove the substrate 2 located on the turntable mechanism 20 for injection molding to form a packaging shell 3. The unloading mechanism 40 performs unloading operations on the injection-molded packaging shell 3. The entire line forms a continuous operation system of substrate 2 input, packaging molding, and finished product output, avoiding material backlog and waiting between processes, and significantly improving production efficiency.

[0032] Specifically, see Figures 4 to 6The unloading mechanism 40, as a core component of the entire production line, specifically includes a support body 41. This support body 41 serves as the load-bearing base for the entire unloading mechanism 40, providing a unified and stable support platform for the installation of subsequent workstation components. The support body 41 is equipped with a carrier tray 42 that can move along a preset transfer path. The carrier tray 42 is used to receive and transport the injection-molded packaging shell 3. The transfer path of the carrier tray 42 is a straight line. Multiple workstations are sequentially arranged along this preset transfer path on the support body 41. At each of these workstations, an unloading detection component 43, a leveling component 44, and a transfer component are sequentially installed. 45. The carrying tray 42 moves precisely between the aforementioned workstations via a servo drive mechanism or pneumatic slide, allowing the packaging housing 3 on it to be processed sequentially according to the order of material unloading detection, warpage correction, and transfer. Simultaneously, multiple sets of heat dissipation components 46 are provided on the support body 41, and at least one set of heat dissipation components 46 is selectively located at the workstations of the material unloading detection component 43, leveling component 44, and transfer component 45. That is, the installation positions of the heat dissipation components 46 spatially overlap or are adjacent to the workstations of the aforementioned functional components. In some embodiments... In this process, two sets of heat dissipation components 46 can be provided. One set of heat dissipation components 46 is located at the station where the unloading detection component 43, the leveling component 44, or the transfer component 45 is located, while the other set of heat dissipation components 46 is located on the path that other packaged housings 3 need to pass through during the unloading process, which is independent of the station where the aforementioned components are located. If three sets of heat dissipation components 46 are provided, any two sets of heat dissipation components 46 can be located at any two of the stations where the unloading detection component 43, the leveling component 44, or the transfer component 45 are located, and the remaining heat dissipation components 46 are also located on other packaged housings 3, which are independent of the station where the aforementioned components are located. The same principle applies to the path that the material needs to pass through during the material handling process; this allows the heat dissipation function to run through all stages of the material handling process. The encapsulation shell 3 is subjected to multi-stage heat dissipation through multiple sets of heat dissipation components 46 at different transfer stages. This multi-stage heat dissipation method avoids the limitation of setting a single concentrated heat dissipation only at the end of the material handling process in related technologies. It allows the heat dissipation process to be deeply integrated with the detection, calibration, and transfer processes. It can implement staged temperature control according to the thermal state differences of the shell at each stage, thereby effectively avoiding internal stress concentration and secondary deformation caused by a single rapid cooling, and ensuring the stability and yield of the final product dimensions.

[0033] The unloading detection component 43 is used to detect the warpage of the packaging shell 3 to obtain height deviation data of various points on the shell surface relative to the standard plane; the leveling component 44 is used to level and correct the detected warpage of the packaging shell 3, restoring the warped portion to within the allowable tolerance range through multi-point controllable pressure; and the transfer component 45 is used to pick up and remove the leveled and corrected packaging shell 3 from the unloading mechanism 40, thus completing the entire unloading process. The arrangement of the components in the unloading mechanism 40 transforms it from a single-function handling device into a multi-functional integrated processing unit that integrates detection, correction, multi-stage temperature control, sorting, and transfer, significantly reducing the investment in subsequent independent detection and correction equipment and simplifying the production line structure.

[0034] As a preferred embodiment, see [link to previous document]. Figure 5 The unloading detection component 43 includes at least one pair of detection brackets 431 and a sensor body 432. The sensor body 432 is connected to the detection brackets 431, and the detection brackets 431 are vertically mounted on the bracket body 41. When the carrying tray 42 is moved to the work station of the unloading detection component 43 and completed positioning, the detection bracket 431 is adjusted vertically to the preset detection height under the drive of a cylinder, motor screw or other linear drive device to enter the detection state.

[0035] For details, see Figure 7 The sensor bodies 432 are respectively disposed on both sides of the support tray 42. The dual-sided layout provides a structural basis for specific detection modes in some embodiments. When the unloading detection component 43 is in the detection state, that is, preferably, one side of the sensor body 432 emits a detection beam, and the other side of the sensor body 432 receives the beam, forming a through-beam optical detection channel. Since the height of the sensor body 432 is adjusted by the detection bracket 431 to be the standard flat surface height of the packaging shell 3, if the packaging shell 3 to be detected does not have a warping phenomenon, the detection beam emitted by the sensor body 432 on one side will be accurately received by the sensor body 432 on the other side. If the surface of the packaging shell 3 has warping deformation, the beam passing through the detection channel will be affected by the locally protruding surface. When the surface is blocked, the intensity or position of the light beam captured by the receiving sensor body 432 changes. At this time, by adjusting the height of the detection bracket 431, the light beam from one side of the sensor body 432 can be accurately received by the other side of the sensor body 432. The height deviation value at the detection point on the surface of the package housing 3 can be resolved, thereby obtaining the magnitude of the warpage at the detection point. The surface of the package housing 3 can be detected by the emission and reception of the detection beam, which has high detection efficiency. Since the sensor body 432 does not directly contact the surface of the housing, secondary damage or positional displacement of the housing caused by contact pressure is completely avoided. It is especially suitable for online rapid detection of HPD package housing 3 with high surface precision requirements and not yet fully cooled and shaped.

[0036] As a further preferred option, see Figure 5 The support body 41 is also equipped with a positioning component 47, which is located close to the unloading detection component 43. The close spatial arrangement of the positioning component 47 and the unloading detection component 43 allows the carrier tray 42 to be immediately locked after entering the detection station, maintaining a stable relative position during the detection process. The main function of the positioning component 47 is to lock and fix the carrier tray 42 to limit any slight lateral or longitudinal displacement of the carrier tray 42 relative to the unloading detection component 43 during the detection of the packaging shell 3. Since the unloading detection component 43 measures the height values ​​of each detection point on the shell surface, if the carrier tray 42 moves during the detection, it will cause the sensor body 432 to shift relative to the preset detection point of the shell, thereby introducing measurement errors or even misjudgments. The addition of the positioning component 47 effectively avoids this risk, ensuring the consistency of the detection benchmark and the reliability of the detection data from a mechanical locking perspective. It provides an accurate basis for warping deformation for the subsequent leveling component 44, which is one of the fundamental links to ensure the calibration accuracy of the entire unloading mechanism 40.

[0037] In this preferred embodiment, the positioning component 47 specifically includes a base plate 471, positioning members 472, and protrusions 473. The base plate 471 is fixedly connected to the support body 41 and extends along the conveying direction of the carrier tray 42, with its extension length covering the intervals corresponding to at least all preset detection points. Multiple positioning members 472 are spaced apart on the base plate 471 along the conveying direction of the carrier tray 42, with each positioning member 472 precisely corresponding to a preset detection point. The protrusions 473 are fixedly disposed on the side of the carrier tray 42 and protrude towards the base plate 471. These protrusions 473 serve as direct actuators for the engagement of the carrier tray 42 with the positioning members 472 on the base plate 471, and their cross-sectional shape matches the cutouts or engagement grooves on the positioning members 472. In specific implementation, the positioning element 472 is a screw. The screw and the base plate 471 are connected by a threaded hole. The end of the screw has a hollow part or a groove. The operator can adjust the screw's screwing depth relative to the base plate 471 by rotating it, so that the hollow part at the end of the screw is closer to or further away from the protrusion 473 on the side of the support tray 42. When it is necessary to lock the support tray 42, the screw is rotated so that its end is pushed towards the protrusion 473 until the protrusion 473 is embedded in the hollow part at the end of the screw, forming a mechanical fit. At this time, the movement direction and lateral movement of the support tray 42 at the detection point are reliably restricted.

[0038] Furthermore, a locking nut can be fitted onto the outside of the screw. After the screw is rotated and adjusted to the appropriate position and engages with the protrusion 473, the locking nut is tightened to make it fit tightly against the side of the substrate 471. Utilizing the dual anti-loosening mechanism of thread self-locking and nut pre-tightening, the stability of the screw's position is further enhanced, preventing the screw from rotating and loosening due to equipment vibration during continuous production. When the carrier tray 42 moves along the conveying direction, the protrusion 473 can selectively engage with any pre-adjusted positioning member 472, thereby locking the carrier tray 42 to the corresponding detection point, enabling the unloading detection assembly 43 to detect different positions on the upper surface of the packaging shell 3. For example, when a warping test is required on the housing near the first detection point, the carrier tray 42 moves to a position where the protrusion 473 aligns with the positioning member 472 corresponding to the first detection point. The positioning member 472 engages and locks with the protrusion 473, and the unloading detection component 43 performs the test at this position. After the test is completed, the positioning member 472 and the protrusion 473 are unlocked, and the carrier tray 42 continues to move until the protrusion 473 aligns with the positioning member 472 corresponding to the second detection point. The two parts engage and lock again to perform the test at the second point. This process continues until all preset points are tested. This method of locking and positioning at each point sequentially ensures the uniqueness and certainty of the relative position between the carrier tray 42 and the sensor body 432 during each test through a mechanical engagement structure. It has high repeatability and is not affected by the cumulative error of the drive mechanism. At the same time, each positioning member 472 can be adjusted independently to adapt to the slight changes in the preset detection points on different batches of housings. It is flexible in on-site debugging and has strong versatility.

[0039] Regarding the specific structure of the leveling component 44, in the preferred embodiment, see [link to documentation]. Figure 9 and Figure 10 The leveling assembly 44 includes a lifting mechanism 441, a leveling pressure plate 442, and multiple leveling pins 443. One end of the lifting mechanism 441 is fixedly connected to the support body 41. The lifting mechanism 441 can be a linear drive device that can provide stable and adjustable downward pressure, such as a cylinder, hydraulic cylinder, or servo electric cylinder. The leveling pressure plate 442 is connected to the other end of the lifting mechanism 441 and is driven by the lifting mechanism 441 to reciprocate vertically. Multiple leveling pins 443 are spaced apart on the lower surface of the leveling pressure plate 442, forming an array-type multi-point correction matrix. The end face of each leveling pin 443 that contacts the packaging shell 3 is provided with a flat pressure head 444. This flat pressure head 444 increases the contact area between the pin and the shell surface, transmitting the correction force to the shell in a surface contact manner, avoiding stress concentration and local indentation that may be caused by traditional point-shaped pins.

[0040] Specifically, during the leveling and correction operation, the control system controls the lifting mechanism 441 to drive the leveling plate 442 to descend rapidly to a preset position close to the surface of the housing. Then, the leveling plate 442 descends slowly so that the flat pressure head 444 of each leveling pin 443 contacts each area of ​​the upper surface of the housing 3. The lifting mechanism 441 continues to apply downward leveling pressure, which is evenly distributed to each leveling pin 443 through the leveling plate 442. Each flat pressure head 444 applies continuous pressure to the warped protrusions on the housing surface, causing the protruding areas to undergo slight plastic deformation or stress release, gradually restoring them to a flat state. Through multi-point pressure leveling, the leveling component 44 can correct the irregularly distributed warped parts on the housing.

[0041] Furthermore, the leveling pin 443 adopts an independently adjustable height mounting structure, so that the lower flat pressure head 444 of each leveling pin 443 can be pre-adjusted to different height positions according to the preset warping data when not in operation, thereby achieving differentiated correction for the local warping area of ​​the shell when the leveling pressure plate 442 is pressed down as a whole.

[0042] Further, see Figure 6 and Figure 7 The heat dissipation component 46 preferably includes a first heat dissipation component 461 and a second heat dissipation component 462. The first heat dissipation component 461 and the second heat dissipation component 462 work together to achieve multi-stage heat dissipation for the package housing 3. The first heat dissipation component 461 is located at the work station of the unloading and inspection component 43. It is used to dissipate heat while the package housing 3 is undergoing warpage inspection at the inspection station. The first heat dissipation component 461 also assists in cleaning residual debris on the surface of the package housing 3, thereby improving the inspection accuracy of the unloading and inspection component 43 on the package housing 3. Furthermore, the inspection stage becomes the first stage of the entire multi-stage heat dissipation process.

[0043] Similarly, downstream of the unloading and inspection component 43, the support body 41 is also equipped with a blowing component 48. The blowing component 48 is located at the station of the leveling component 44 and is located to the side of the leveling component 44. It works with the first heat dissipation component 461 to further provide the blowing function. Specifically, the blowing component 48 is located to the side of the station of the leveling component 44, and its air outlet faces the surface of the packaging shell 3 to be leveled. Before, during, or after the leveling component 44 performs the leveling and correction action, the blowing component 48 can be activated in real time to blow high-speed airflow onto the surface of the packaging shell 3 to be leveled, so as to completely peel off and blow away the debris in the gaps of the packaging shell 3, and further clean the packaging shell 3.

[0044] Preferably, the support body 41 is further provided with a conveying platform 49, which is located downstream of the transfer component 45, and the second heat dissipation component 462 is disposed on the conveying platform 49. The transfer component 45 transfers the leveled and corrected packaged housing 3 from the workstation of the carrying tray 42 or the leveling component 44 to the conveying platform 49 to complete the final unloading. The conveying platform 49 may be provided with a track structure to facilitate the transport of the packaged housing 3 to the final storage position. During the transport of the packaged housing 3 on the conveying platform 49, the second heat dissipation component 462 disposed thereon further dissipates the heat, forming a second stage of heat dissipation. The second heat dissipation component 462 and the first heat dissipation component 461 are connected in series in the entire unloading and transfer sequence of the packaged housing 3, and together they constitute a multi-stage heat dissipation for the packaged housing 3.

[0045] In a specific embodiment, the first heat dissipation component 461 is only installed on one side of the station where the unloading detection component 43 is located, that is, it is installed only on one side of the conveying path of the carrying tray 42, and the first heat dissipation component 461 is inclined, with a set tilt angle between its air outlet surface and the horizontal plane, and the blowing cooling airflow sweeps across its upper surface from the side of the housing in an oblique manner. This lateral tilting heat dissipation method enables effective pre-temperature equalization of the housing while minimizing interference with the detection beam path, regulating the overall temperature of the housing to a suitable plastic temperature range for leveling and correction. The second heat dissipation component 462 adopts a covering heat dissipation structure, with its air outlet located above the conveying platform 49. It covers the entire upper surface area of ​​the housing conveyed on the conveying platform 49 with downward vertical airflow, forming a large-area, uniform vertical airflow coverage. The cooling air volume and cooling rate of the second heat dissipation component 462 are significantly greater than those of the first heat dissipation component 461. Its purpose is to rapidly and forcibly cool and shape the already leveled housing, quickly reducing the housing temperature from the warm state during correction to a cold state close to the ambient temperature, thereby locking in the leveled geometry obtained after correction and preventing stress rebound during subsequent natural cooling, which could lead to further deformation. The clear division of labor between the first heat dissipation component 461 and the second heat dissipation component 462 in terms of heat dissipation location, air outlet method, heat dissipation intensity and functional purpose has constructed a phased and functional thermal management closed loop. The front end focuses on temperature uniformity to facilitate calibration, while the rear end focuses on rapid cooling to lock in the shape. The two work together to create the optimal thermodynamic conditions for leveling and calibration, and ensure the effective solidification of the calibration effect. This makes the final flatness qualification rate of the product significantly better than the traditional solution with only single heat dissipation at the end.

[0046] Furthermore, regarding the upstream portion of the entire production line, see [link to relevant documentation]. Figure 3The turntable mechanism 20 specifically includes a turntable 21 and a base 22. The turntable 21 is connected to the base 22 and can rotate relative to it, thereby realizing the transfer and conveying of the substrate 2 between different workstations. The turntable mechanism 20 is equipped with a loading and inspection component 23, which preferably adopts a vision inspection component, such as a machine vision system composed of a high-resolution industrial camera, a coaxial or ring light source, and an image processing module. The loading mechanism 10 is further subdivided into a first loading mechanism 11 and a second loading mechanism 12, which cooperate with each other in function. The first loading mechanism 11 is used to transport the substrate 2 to be injected from the hopper or the loading vibratory feeder to the preset bearing position on the turntable 21. The turntable 21 rotates the substrate 2 to the loading and inspection component 23 by indexing rotation. The loading and inspection component 23 inspects the substrate 2 for items such as appearance, size, or positional deviation.

[0047] In a specific embodiment, the turntable 21 is made of a transparent material, such as optical-grade transparent engineering plastic or tempered glass. When the substrate 2 rotates with the transparent turntable 21 to the visual inspection station of the loading and inspection component 23, the visual inspection component can take a high-definition image of the substrate 2 before injection molding from below or to the side of the turntable 21 without being obstructed by the turntable 21 itself. Based on the image, it can determine whether the substrate 2 has defects such as defects, scratches, or poor incoming materials, thereby generating a corresponding qualified or unqualified sorting signal. When the loading and inspection component 23 detects that the current substrate 2 is unqualified, the control system issues a sorting command. The unqualified substrate 2 rotates with the turntable 21 to the corresponding position of the second loading mechanism 12 and is picked up from the turntable 21 by the second loading mechanism 12 and sent back to the repair area for rework. After rework, the substrate 2 is reloaded by the second loading mechanism 12 onto the empty support position on the turntable 21 and re-enters the subsequent inspection and injection molding process. When the material loading and inspection component 23 detects that the substrate 2 is qualified, the turntable 21 directly transfers the qualified substrate 2 to the location of the mold closing and injection molding mechanism 30. The mold closing and injection molding mechanism 30 removes the substrate 2 from the turntable 21 and transfers it into the injection mold for injection molding and encapsulation. After injection molding is completed and the mold is opened under pressure and cooling, the resulting encapsulated shell 3 is transferred via the turntable 21 or directly by a robot or other device to the carrying tray 42 of the unloading mechanism 40, and enters the unloading inspection, leveling and correction, and multi-stage heat dissipation process as described above. By introducing an automatic inspection and sorting rework closed loop based on machine vision before the injection molding process, it is ensured that only qualified substrates 2 can enter the injection mold cavity, eliminating encapsulation waste caused by defective substrates 2 from the source, greatly reducing the ineffective consumption of injection molding materials and the unnecessary machine time of the mold closing and injection molding mechanism 30. At the same time, the configuration of the transparent turntable 21 makes the arrangement of the visual inspection light path more flexible, enabling multi-angle imaging of the substrate 2 without blind spots, improving the comprehensiveness and accuracy of the inspection.

[0048] Specifically, the first feeding mechanism 11 is dedicated to feeding the original substrate 2 to be injected into the mold. That is, the first feeding mechanism 11 only supplies material to the storage area of ​​the original substrate 2, and its gripping actuator only contacts the brand-new substrate 2 throughout the entire production cycle. The second feeding mechanism 12 is independent of the first feeding mechanism 11. It has an independent moving arm, traveling track, or rotary drive device, and is physically located adjacent to the station of the feeding detection component 23 and a temporary storage area for rework substrate 2. The second feeding mechanism 12 only supplies material to the storage area of ​​the reworked and qualified substrate 2. Its actuator is only used to reload the reworked substrate 2, which has been manually or automatically re-inspected and confirmed as qualified, onto the turntable. This completely avoids the problems of difficult material traceability and complex status management caused by the traditional single feeding mechanism 10 needing to handle both new and rework materials, from both hardware and process perspectives. Since the first feeding mechanism 11 and the second feeding mechanism 12 each correspond to the substrate 2 in a specific state, the operator or production management system can intuitively distinguish the nature of the batch of substrate 2 by the identity of the currently performing feeding mechanism, and there will be no situation where the repaired substrate 2 and the brand new substrate 2 are mixed in the same feeding channel and are difficult to identify.

[0049] Based on the hardware of the aforementioned packaging structure injection molding production line 1, this application also provides a packaging structure injection molding method, which is applicable to the packaging structure injection molding production line 1 in any of the above embodiments, such as... Figure 1 and Figure 2As shown. The injection molding method for this encapsulation structure specifically includes the following steps. Step S10: The substrate 2 to be injected is transported to the turntable mechanism 20 via the feeding mechanism 10. Specifically, the feeding mechanism 10 picks up the substrate 2 to be injected from the feeding end, and precisely positions it on the support position of the turntable 21 of the turntable mechanism 20 via a robotic arm or conveyor rail, completing the initial input of the substrate 2. Step S20: The substrate 2 is removed from the turntable mechanism 20 by the mold closing injection molding mechanism 30 and injection molded to form the encapsulation shell 3. The turntable 21 rotates the support position carrying the substrate 2 to the corresponding position of the mold closing injection molding mechanism 30. The picking robot or suction device in the mold closing injection molding mechanism 30 removes the substrate 2 from the turntable 21 and transfers it into the mold cavity. After mold closing, high-temperature molten plastic is injected for injection molding. After a specified holding pressure and cooling time, the mold is opened and the formed encapsulation shell 3 is removed. Step S30: The injection-molded packaged shell 3 is transferred to the carrier tray 42 of the unloading mechanism 40. The carrier tray 42 travels along a preset transfer path, passing sequentially through the stations of the unloading detection component 43, the leveling component 44, and the transfer component 45. During the transfer, the packaged shell 3 is cooled in multiple stages by multiple sets of heat dissipation components 46. This step achieves seamless connection between the injection-molded finished product and the unloading process, and the straight-line transfer method of the carrier tray 42 ensures that each processing station is closely connected. Step S40: At the station of the unloading detection component 43, the degree of warpage of the packaged shell 3 on the carrier tray 42 is detected, and it is determined whether the packaged shell 3 is warped. Specifically, after the carrier tray 42 moves the housing to below the unloading detection component 43, the positioning component 47 locks and fixes the carrier tray 42. The detection bracket 431 descends, allowing the housing to enter the detection optical path between the sensor bodies 432 on both sides. One side emits a detection beam, and the other side receives it. The unloading detection mechanism obtains the height deviation values ​​of each preset detection point, and calculates the actual warpage and warpage distribution of the housing. The control system compares and judges according to the preset flatness qualification threshold: if the warpage exceeds the allowable range, it is judged that warpage exists and needs to be corrected; if the data of each detection point is within the qualified range, it is judged that there is no warpage. If it is judged that there is warpage, the carrier tray 42 moves the housing to the station where the leveling component 44 is located, and the leveling component 44 performs leveling and correction on the packaged housing 3. During leveling, the side blowing component 48 first blows airflow to the surface of the housing to remove debris, and then the lifting mechanism 441 drives the leveling pressure plate 442 to descend. The flat pressure head 444 of each leveling pin 443 contacts the raised area of ​​the housing and applies multi-point pressure for leveling. After leveling, the packaged housing 3 is then transferred to the station of the transfer component 45. If it is determined that there is no warping, that is, the flatness of the housing has met the standard, the packaged housing 3 can be directly transported to the station of the transfer component 45 without leveling correction, simplifying the process and avoiding unnecessary process occupation. Step S50: The packaged housing 3 is transferred and unloaded by the transfer component 45.The transfer component 45 picks up the packaged housing 3 from the carrier tray 42 at the transfer station and transfers it to the conveyor platform 49 or an external conveyor belt. Simultaneously, the second heat dissipation component 462 performs final cooling and shaping on the housing on the conveyor platform 49. The cooled finished housing is then output to the next process or packaging area. This process integrates material loading, injection molding, unloading inspection, selective leveling, multi-stage heat dissipation, and final transfer into a highly automated production line. The logic between steps is clear. By setting up warp detection branches, qualified products can quickly flow to the unloading stage without needing to undergo a correction process, avoiding unnecessary equipment occupation and wasted cycle time, further improving the average production speed and resource utilization of the entire line.

[0050] In a further preferred embodiment, the feeding mechanism 10 specifically includes a first feeding mechanism 11 and a second feeding mechanism 12, and the turntable mechanism 20 is equipped with a feeding detection component 23. Step S10 more specifically includes the following sub-steps: Step S11: The substrate 2 to be injection molded is conveyed to the turntable 21 of the turntable mechanism 20 through the first feeding mechanism 11. Step S12: The substrate 2 is rotated to the feeding detection component 23 by the turntable 21 for detection. The visual detection component captures an image of the substrate 2 and analyzes and judges whether the surface of the substrate 2 is intact, whether the size is within the tolerance range, etc. Step S13: If the feeding and inspection component 23 detects that the substrate 2 is unqualified, the control system generates an unqualified signal. The second feeding mechanism 12 then removes the unqualified substrate 2 from the turntable 21 and sends it to the rework area for rework. After rework, the substrate 2 is picked up again by the second feeding mechanism 12 and reloaded back onto the corresponding support position on the turntable 21, allowing it to re-enter the inspection and injection molding process. If the feeding and inspection component 23 detects that the substrate 2 is qualified, the turntable 21 directly transfers the qualified substrate 2 to the mold closing injection molding mechanism 30 for subsequent injection molding and encapsulation operations. This branch processing method ensures that the unqualified substrate 2 is effectively intercepted and recycled, improving the material utilization rate and product first-pass yield of the entire line.

[0051] In the warpage determination logic involved in step S40, more refined determination criteria can be introduced in actual operation to ensure correction efficiency while avoiding ineffective leveling of irreparable products. Specifically, when determining warpage, the decision is made not only based on the magnitude of the warpage but also by combining the data measured by the unloading detection component 43 at multiple detection points with the assistance of the positioning component 47. In summary, the control system has a pre-set leveling feasibility determination rule, which defines the maximum number of deviation points that the packaging shell 3 can accept for leveling correction. In specific implementation, the positioning component 47 locks the carrying tray 42 to multiple preset detection points in sequence, and the unloading detection component 43 obtains the height deviation value at each detection point. If the warpage of two or more detection points exceeds the preset leveling allowable upper limit, the control system determines that the deformation of the packaging shell 3 is too complex or severe, and the deviation value is too large. At this time, the shell is directly determined as a defective product and will not enter the leveling process. Subsequently, the transfer component 45 will transfer it to the designated defective product discharge area. Only when the data measured at only one detection point exceeds the upper limit of the leveling allowable limit, that is, when the warping of the shell is manifested as a local and single bulging deformation, does the control system determine that the encapsulated shell 3 can enter the leveling process, and the leveling component 44 performs pressure leveling on the encapsulated shell 3.

[0052] Taking three preset detection points as an example: Under the action of the positioning component 47, the carrying pallet 42 moves sequentially to the first detection point, the second detection point, and the third detection point. The unloading detection component 43 completes the height data acquisition at the three points respectively. If, after data processing, it is found that the warping at both the first and second detection points exceeds the standard, that is, there are two or more out-of-tolerance points, the control system immediately determines that the shell is an uncorrectable product and directly treats it as unqualified; if only the warping at the second detection point exceeds the standard, while the detection values ​​at the first and third detection points are within the qualified range, that is, there is only one out-of-tolerance point, then the shell is determined to be qualified for leveling, and the carrying pallet 42 will be transferred to the station where the leveling component 44 is located, and the shell surface will be corrected by pressing by the leveling component 44.

[0053] As a further supplement to the above-mentioned warpage determination logic, a warpage limit threshold can also be defined directly. In this embodiment, the control system has a preset maximum allowable warpage value. After the material feeding detection component 43 measures the warpage data at each detection point, regardless of whether there is one or more points exceeding the standard, as long as the absolute value of the height deviation measured at any detection point exceeds the preset warpage limit threshold, it indicates that the warpage deformation at that point is too large. Even if there is only one such point, it has exceeded the correction stroke of the leveling pin 443 or the limit of plastic deformation that the shell material can withstand. At this time, the control system also directly determines that the encapsulated shell 3 is a defective product and no longer performs the leveling correction process. Thus, a safety correction boundary is set from the absolute level of warpage, effectively avoiding the risk of secondary damage such as shell cracking, puncture, or local stress whitening caused by excessive extrusion at a single point. This further ensures that the products output after the leveling process are all qualified products with intact appearance and no hidden internal damage, improving the quality and safety level of the final product. This warpage threshold can be combined with the aforementioned judgment rule based on the number of out-of-tolerance points, meaning that any condition triggered will result in a non-compliance, forming a more rigorous and comprehensive graded judgment system.

[0054] In summary, the packaging structure injection molding production line 1 and injection molding method provided in this application achieve a compact connection between substrate 2 feeding, injection molding and packaging, and finished product unloading through a four-station layout surrounding the turntable mechanism 20. Through the unloading mechanism 40, which sequentially arranges unloading detection components 43, leveling components 44, and transfer components 45 along the transport path of the carrying tray 42, as well as multiple sets of heat dissipation components 46 that selectively overlap with these components, a deep integration of multiple functions such as detection, correction, and multi-stage heat dissipation is achieved within a single mechanism. Simultaneously, the collaborative cooperation between multiple stations, using precise transport positioning as a bridge and detection data as a unified decision-making basis, enables each package shell 3 to adaptively complete quality judgment and necessary repair work during the unloading process, and undergoes a complete thermal process from pre-uniform temperature to shaping and cooling. This solution avoids the traditional unloading mechanism 40's single role of merely handling materials, ensuring the long-term stability of product dimensions.

[0055] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A packaging structure injection molding production line, characterized in that, include: The system includes a feeding mechanism, a turntable mechanism, a mold-closing injection molding mechanism, and a unloading mechanism. The feeding mechanism, the mold-closing injection molding mechanism, and the unloading mechanism are arranged around the turntable mechanism. The feeding mechanism is used to transport the substrate to be injected onto the turntable mechanism. The mold-closing injection molding mechanism is used to remove the substrate located on the turntable mechanism and perform injection molding to encapsulate it into a package shell. The unloading mechanism unloads the package shell after it has been injected. The feeding mechanism includes: a support body, on which a carrier tray that can move along a preset path is provided, the carrier tray being used to receive and transport the injection-molded packaging shell; Multiple workstations are arranged sequentially along a preset path on the support body. Each workstation is equipped with a material feeding and detection component, a leveling component, and a transfer component. The carrying pallet moves sequentially between the multiple workstations. The support body is also provided with multiple sets of heat dissipation components, and at least one set of heat dissipation components is selectively arranged at the workstations where the unloading detection component, the leveling component, and the transfer component are located; The encapsulation housing undergoes multi-stage heat dissipation through multiple sets of heat dissipation components at different transfer stages. The unloading detection component is used to detect the degree of warpage of the encapsulation housing. The leveling component is used to level and correct the warped encapsulation housing. The transfer component is used to transfer the leveled and corrected encapsulation housing.

2. The injection molding production line for the packaging structure as described in claim 1, characterized in that, The material feeding detection component includes: at least one pair of detection brackets and a sensor body, wherein the sensor body is connected to the detection brackets, and the detection brackets are detachably mounted on the bracket body; When the carrying tray is moved to the workstation where the unloading detection component is located, the sensor body is located on both sides of the carrying tray.

3. The injection molding production line for the packaging structure as described in claim 2, characterized in that, The support body is also provided with a positioning component, which is located close to the material unloading detection component; The positioning component is used to lock and fix the carrier tray to limit the displacement of the carrier tray relative to the unloading detection component during the detection of the packaging shell.

4. The injection molding production line for the packaging structure as described in claim 3, characterized in that, The positioning component includes: A substrate, which is fixedly connected to the support body and extends along the conveying direction of the carrying tray; Positioning elements, a plurality of said positioning elements are arranged at intervals on the substrate along the conveying direction of said carrying tray; The protrusion is fixedly disposed on the side of the support tray and protrudes toward the substrate; When the carrier tray moves along the conveying direction, the protrusion selectively engages with any of the positioning members to lock and fix the carrier tray at the corresponding detection point, so that the unloading detection component can detect different positions on the upper surface of the packaging shell.

5. The injection molding production line for the packaging structure as described in claim 1, characterized in that, The support body is also provided with a blowing assembly, which is located at the work station of the leveling assembly and is located to the side of the leveling assembly. The purging assembly is used to blow airflow onto the leveling surface of the packaging housing to remove debris from the leveling surface of the packaging housing.

6. The injection molding production line for the packaging structure as described in claim 1, characterized in that, The leveling component includes: A lifting mechanism, one end of which is fixedly connected to the support body; A leveling pressure plate is connected to the other end of the lifting mechanism and is driven by the lifting mechanism to move up and down in the vertical direction. And multiple leveling pins, which are spaced apart on the lower surface of the leveling plate, and each leveling pin has a flat pressure head on its end face that contacts the packaging shell; The lifting mechanism drives the leveling plate to descend, causing the flat pressure head of each leveling pin to contact each area of ​​the upper surface of the packaging shell and apply downward pressure to perform multi-point pressure leveling on the surface of the packaging shell.

7. The injection molding production line for the packaging structure as described in claim 1, characterized in that, The heat dissipation assembly includes a first heat dissipation assembly and a second heat dissipation assembly; The first heat dissipation component is located at the station of the unloading and detection component, and is used to dissipate heat from the packaging shell when it is being detected. The support body is also provided with a conveying platform, which is located in the downstream area of ​​the transfer component. The second heat dissipation component is located on the conveying platform. The transfer component moves the leveled and corrected packaging shell to the conveying platform to complete the unloading. Then, the second heat dissipation component dissipates heat from the packaging shell. The second heat dissipation component and the first heat dissipation component together constitute a multi-stage heat dissipation system for the packaging shell.

8. The injection molding production line for the packaging structure as described in claim 1, characterized in that, The turntable mechanism includes a turntable and a base. The turntable is connected to the base and can rotate relative to it. The turntable mechanism is equipped with a feeding detection component. The feeding mechanism includes a first feeding mechanism and a second feeding mechanism. The first feeding mechanism is used to transport the substrate to be injected to the turntable, and rotate with the turntable to the feeding detection component to detect the substrate. When the feeding detection component detects that the substrate is unqualified, the unqualified substrate is removed from the turntable by the second feeding mechanism, and the repaired substrate is reloaded onto the turntable by the second feeding mechanism. When the feeding and detection component detects that the substrate is qualified, the substrate is injection molded and packaged by the mold closing and injection molding mechanism. The packaged shell after injection molding is then transferred to the unloading mechanism for unloading.

9. A method for injection molding an encapsulation structure, wherein the method is applicable to the injection molding production line for encapsulation structures as described in any one of claims 1-8, characterized in that, The injection molding method for the encapsulation structure includes: Step S10: The substrate to be injection molded is transported to the turntable mechanism via the feeding mechanism; Step S20: The substrate is removed from the turntable mechanism by the mold-closing injection molding mechanism and injection molded to form a package shell; Step S30: Transfer the injection-molded packaged shell to the carrier tray of the unloading mechanism. The carrier tray travels along a preset transfer path, passing through the stations of the unloading detection component, the leveling component, and the transfer component in sequence, and the packaged shell is cooled by multiple sets of heat dissipation components. Step S40: At the station where the unloading and inspection components are located, the degree of warpage of the packaging shell on the carrier tray is detected, and it is determined whether the packaging shell is warped. If the determination is yes, the packaging shell is leveled and corrected by the leveling component, and the leveled packaging shell is transported to the station where the transfer component is located. If the determination is negative, the packaging shell is directly transported to the workstation where the transfer components are located; Step S50: The packaging housing is transferred and unloaded using the transfer component.

10. The injection molding method for the encapsulation structure as described in claim 9, characterized in that, The feeding mechanism includes a first feeding mechanism and a second feeding mechanism, and the turntable mechanism is equipped with a feeding detection component; Step S10 also includes step S11: conveying the substrate to be injection molded to the turntable of the turntable mechanism through the first feeding mechanism; Step S12: Rotate the substrate to the feeding and detection component using a turntable for detection; Step S13: If the material feeding detection component detects that the substrate is unqualified, the second feeding mechanism will remove the unqualified substrate from the turntable for repair, and the repaired substrate will be reloaded onto the turntable by the second feeding mechanism; if the material feeding detection component detects that the substrate is qualified, the turntable will transfer the qualified substrate to the mold closing injection mechanism.

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