一种真空贴合工艺

By using the cooperation of bonding actuators and carrier stations in the vacuum bonding process, combined with pretreatment steps, the problem of low automation in existing vacuum bonding processes has been solved, achieving high-precision and stable bonding results, and improving production efficiency and product quality.

CN122401928APending Publication Date: 2026-07-17GUANGZHOU NINGWEI HUANYU INTELLIGENT MANUFACTURING TECHNOLOGY CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGZHOU NINGWEI HUANYU INTELLIGENT MANUFACTURING TECHNOLOGY CO LTD
Filing Date
2026-06-16
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing vacuum bonding processes have low automation, high reliance on manual labor, and difficulty in guaranteeing bonding accuracy and product quality. In particular, in the process of bonding patterned film materials to the inside of mobile phone cases, production efficiency is low and product quality is unstable.

Method used

Design a vacuum bonding process that uses bonding actuators to hold the bonding material and utilizes a bearing station to position the bonding product, creating an adjustable pressure bonding environment. Combined with pretreatment steps to remove protective and filler materials, this achieves an automated bonding process.

Benefits of technology

It improves the relative positioning accuracy between the bonding material and the bonded product, reduces defects such as bubbles, wrinkles and misalignment, forms a continuous and automated bonding process, and improves production efficiency and the stability of finished product quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

本申请公开了一种真空贴合工艺,涉及贴合加工技术领域,包括如下步骤:提供贴合材料和贴合产品;使贴合材料被贴合执行件保持;对贴合产品的待贴合面进行预处理,并使贴合产品被定位于承载工位;对贴合材料的待贴合面进行预处理;使保持有贴合材料的贴合执行件与承载工位相对配合,并在贴合材料与贴合产品所在区域形成可调压的贴合环境;调节贴合环境的压力,并驱动贴合执行件带动贴合材料朝向贴合产品运动,使贴合材料贴合于贴合产品;解除贴合环境的压力状态,并输出贴合后的成品。上述设计能够形成连续化、自动化的贴合工艺流程,从而提高生产效率、贴合精度和成品质量稳定性。
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