A heat-stable platen structure

Abstract

The application discloses a kind of heat-stable type pressing plate structure, belong to printing and embossing processing equipment technical field.The pressing plate structure includes heat transfer plate, honeycomb plate and die plate, heat transfer plate is contacted with heating plate, the upper surface of honeycomb plate is oppositely arranged with heat transfer plate, and the lower surface is oppositely arranged with die plate.Honeycomb plate is equipped with multiple honeycomb holes along the thickness direction, at least in part honeycomb hole is provided with heat-conducting metal column, and the upper and lower end faces of heat-conducting metal column are formed with heat transfer plate and die plate respectively.Closely contact between heat transfer plate and honeycomb plate is detachably connected, and it is convenient to adjust the arrangement area of heat-conducting metal column.The application utilizes the high thermal conductivity and high volume heat capacity of heat-conducting metal column, realizes heat rapid and uniform transmission and heat accumulation buffer, significantly improves the temperature uniformity and thermal stability of die plate surface;Meanwhile, through detachable connection and selective arrangement of metal column, material cost is reduced, and different pattern requirements can be flexibly adapted.The structure is not only suitable for frosted gold stamping process, but also can be widely applied to ordinary gold stamping, hot embossing and other surface decoration processes requiring high temperature shaping.

Description

Technical Field

[0001] This invention relates to the field of printing and embossing equipment technology, and more specifically, to a heat-stable pressure plate structure for hot stamping, hot embossing and frosted hot stamping processes. Background Technology

[0002] Hot stamping and embossing are common surface decoration techniques for materials such as paper, leather, and plastic. Hot stamping involves transferring metallic foil onto the substrate surface using a heated die, while embossing creates three-dimensional textures. The recently developed "matte hot stamping" (also known as "embossed hot stamping") combines these two techniques in a single process, creating a three-dimensional decorative effect. In essence, matte hot stamping is a hot-pressing process that combines the functions of hot stamping and embossing.

[0003] In all the aforementioned processes, temperature control of the mold plate is crucial. Uneven temperature can lead to problems such as poor hot stamping adhesion, poor gloss, and inconsistent embossing depth, seriously affecting product quality.

[0004] Existing hot stamping or hot embossing equipment typically includes a heating plate, a heat transfer plate, a mold plate, and an intermediate connecting plate connecting the heat transfer plate and the mold plate. To ensure the temperature uniformity and thermal stability of the mold plate surface, some technical solutions use a honeycomb plate as the intermediate connecting plate, utilizing the high strength-to-weight ratio of the honeycomb structure.

[0005] However, existing technologies still have the following shortcomings: First, the honeycomb cells of ordinary honeycomb panels are filled with air, and air has an extremely low thermal conductivity (about 0.026 W / m·K). This causes the heat to be transferred from the heat transfer plate to the mold plate to be discontinuous and uneven. The surface of the mold plate is prone to local overheating or undercooling "temperature patches", which seriously affects the quality consistency of hot stamping or embossing.

[0006] Secondly, even if some solutions fill the honeycomb cells with thermally conductive materials (such as thermally conductive silicone), the thermal conductivity of these materials is usually still much lower than that of metals (thermally conductive silicone is about 1-5 W / m·K, and aluminum is about 200 W / m·K), and their volumetric heat capacity is limited. In intermittent operation mode, when the mold plate contacts the substrate and heat is rapidly lost, the filler cannot replenish the heat in time, resulting in a sudden drop in temperature and unstable subsequent hot stamping effect.

[0007] Third, simply replacing the entire honeycomb panel with a solid metal plate in pursuit of thermal uniformity will result in a significant increase in weight and heating energy consumption. Furthermore, it will still fail to solve the problem of lateral heat diffusion between patterned and non-patterned areas. Heat will flow from the patterned areas that require high temperatures to the peripheral areas that do not, causing energy waste and process loss.

[0008] The traditional pressing structure described above can only process a maximum of 2,500 sheets per hour for small-area designs (78 square centimeters or less) when using matte foil stamping. For medium-area designs (78-156 square centimeters), the maximum speed is only 1,800 sheets per hour. For large-area designs (greater than 156 square centimeters), the efficiency is extremely low.

[0009] Therefore, there is an urgent need for a heat-stable plate structure for hot stamping or embossing that can quickly and evenly transfer heat, has heat storage and buffering capabilities, is cost-controllable, and can be flexibly adapted to different patterns. Summary of the Invention

[0010] The present invention aims to provide a thermally stable pressure plate structure to solve the technical problems of poor thermal uniformity, insufficient thermal stability, high cost and difficulty in flexibly adapting to different patterns in the prior art.

[0011] To achieve the above objectives, the present invention provides the following technical solution: A heat-stabilized pressure plate structure includes a heat transfer plate, a honeycomb plate, and a mold plate. The heat transfer plate is in contact with a heating plate. The upper surface of the honeycomb plate is opposite to the lower surface of the heat transfer plate, and the lower surface of the honeycomb plate is opposite to the upper surface of the mold plate. The honeycomb panel has multiple honeycomb holes that penetrate along the thickness direction. At least some of the honeycomb holes are provided with heat-conducting metal pillars, the upper end face of which is in contact with the lower surface of the heat transfer plate, and the lower end face of which is in contact with the upper surface of the mold plate.

[0012] Furthermore, the heat-conducting metal pillars are selectively placed within the honeycomb holes in local areas corresponding to the hot stamping or embossing pattern to be processed, based on the regional distribution of the pattern to be processed.

[0013] Furthermore, no heat-conducting metal pillars or heat-insulating fillers are placed in the honeycomb holes in the non-patterned areas.

[0014] Alternatively, the heat-conducting metal pillars can be placed inside all the honeycomb holes of the honeycomb plate.

[0015] The heat transfer plate and the honeycomb plate are detachably connected to facilitate adjustment of the placement area of ​​the heat-conducting metal pillars.

[0016] The mold plate is detachably connected to the lower surface of the honeycomb panel.

[0017] Furthermore, it also includes multiple plate locks, each plate lock including a locking rod passing through the honeycomb holes, an expandable latching mechanism disposed at the end of the locking rod, and an adjusting member for driving the latching mechanism to open or close; the other end of the plate lock is provided with a plate-shaped locking part, the plate-shaped locking part having an inclined surface, and the side edge of the mold plate also having an inclined surface, the two inclined surfaces cooperating with each other, so that the end of the plate-shaped locking part with the inclined surface can fasten the inclined surface of the side edge of the mold plate.

[0018] Furthermore, the material of the heat-conducting metal pillar is copper, copper alloy, silver, or silver alloy.

[0019] Furthermore, the heat transfer plate is made of the same material as the heat-conducting metal column, or the thermal conductivity of the heat transfer plate is not lower than that of the heat-conducting metal column.

[0020] Furthermore, the detachable connection is a bolted connection, with bolt holes corresponding to the heat transfer plate and the honeycomb plate, and the two are fastened together by bolts.

[0021] Furthermore, the cross-sectional shape of the thermally conductive metal pillar matches the cross-sectional shape of the honeycomb hole, and the thermally conductive metal pillar and the honeycomb hole are interference fit or clearance fit and filled with thermally conductive medium.

[0022] Furthermore, the height of the heat-conducting metal pillar is equal to the depth of the honeycomb holes, so that the upper and lower end faces of the heat-conducting metal pillar form a tight physical contact with the heat transfer plate and the mold plate, respectively.

[0023] Furthermore, the mold plate is a hot stamping mold plate, a hot embossing mold plate, or a composite mold plate that combines hot stamping and embossing functions.

[0024] Compared with the prior art, the present invention has the following beneficial effects: Significantly improved thermal stability: By setting heat-conducting metal pillars (such as copper pillars) inside the honeycomb holes, the high thermal conductivity and high volumetric heat capacity of the metal are utilized to achieve rapid and uniform heat transfer from the heat transfer plate to the mold plate. At the same time, it plays a role in heat storage and buffering, suppressing the sudden temperature drop during hot stamping or embossing, and ensuring the temperature uniformity and thermal stability of the mold plate surface over time.

[0025] Cost-controllable: With the detachable heat transfer plate design, users can selectively place heat-conducting metal pillars only in areas where heat transfer is needed, according to the actual hot stamping or embossing pattern, leaving non-patterned areas empty or filled with heat insulation material, which greatly reduces the amount of precious metals (such as copper and silver) used and saves costs.

[0026] Highly flexible and adaptable: The heat transfer plate and the honeycomb plate are connected by bolts or other detachable means. When it is necessary to change the hot stamping pattern or embossing mold, the heat transfer plate can be easily removed and the layout of the heat-conducting metal columns can be readjusted without replacing the entire honeycomb plate. This adapts to the needs of multi-variety and small-batch production.

[0027] Maximize heat transfer efficiency: Select heat transfer plates and heat-conducting metal pillars made of the same material or with similar thermal conductivity to reduce contact thermal resistance and allow heat to be transferred preferentially through the metal pillars, avoiding heat loss in the air cavity.

[0028] This pressure plate structure, during testing, could process 4000-4500 sheets per hour for frosted hot stamping of patterns measuring 21*42=882 square centimeters, greatly improving production efficiency. The efficiency is even higher for medium and small-area paper. It also boasts high production efficiency for ordinary hot stamping and embossing.

[0029] The honeycomb panel mainly serves as a structural support and positioning element. Its honeycomb holes provide space and precise positioning for the heat-conducting metal pillars, enabling the entire pressure plate structure to achieve excellent thermal performance while maintaining a low weight.

[0030] High adaptability: This pressure plate structure is not limited to specific process types. It can be used for ordinary flat hot stamping, as well as fine hot embossing and complex relief-style frosted hot stamping. One set of hardware can be adapted to the production of multiple products by changing the mold plate and adjusting the layout of the heat conduction pillars. It is especially suitable for printing companies that produce small to medium batches and multiple varieties. Attached Figure Description

[0031] Figure 1 A structural diagram of a heat-stabilized pressure plate installed on a static platform, as provided by the present invention; Figure 2 This is the overall structure of the pressure plate of the present invention; Figure 3 For the present invention Figure 2 A structural diagram showing the hidden heat insulation plate and heating plate; Figure 4 For the present invention Figure 3 Exploded view of the intermediate pressure plate structure; Figure 5 For the present invention Figure 3 Structural diagram of the hidden heat transfer plate; Figure 6 For the present invention Figure 4 A magnified view of a portion of the image; Figure 7 For the present invention Figure 3 The reverse side; Figure 8 For the present invention Figure 7 A magnified view of a portion of the image; Figure 9 This is a structural diagram of the plate lock of the present invention; Figure 10 This is a cross-sectional view of the structure of the plate lock of the present invention, in which the mold plate is fixedly mounted on the honeycomb plate.

[0032] In the diagram: 1-Heat transfer plate; 2-Honeycomb plate; 21-Honeycomb hole; 22-Step; 3-Mold plate; 4-Heat-conducting metal column; 5-Bolt; 6-Plate lock; 61-Plate lock locking part; 62-Locking rod; 63-Screw; 64-Shaft; 65-Right swing arm; 66-Left swing arm; 51-Bolt hole; 7-Heating plate; 8-Heat insulation plate; 9-Static platform. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0034] like Figures 1-10 As shown, this embodiment provides a heat-stabilized pressure plate structure for hot stamping, which is installed below the stationary platform 9 of a die-cutting hot stamping machine. It includes, from top to bottom, a heat insulation plate 8, a heating plate 7, a heat transfer plate 1, a honeycomb plate 2, and a mold plate 3. The heat insulation plate 8 is provided to prevent heat from the heating plate 7 from being transferred to the stationary platform, thus preventing deformation of the stationary platform 9. The heating plate 7 contains a heating tube, which is existing technology. The upper surface of the heat transfer plate 1 is connected to the heating plate to receive heat. The structure of the stationary platform can be a pure cast iron platform, or it can refer to the content disclosed in CN117774501A, which will not be elaborated further. The upper surface of the honeycomb plate 2 is opposite to the lower surface of the heat transfer plate 1, and the lower surface is opposite to the upper surface of the mold plate 3. The lower surface of the mold plate 3 has a hot stamping, embossing, or a composite pattern that combines hot stamping and embossing functions.

[0035] The honeycomb panel 2 is made of cast iron, but can also be made of steel or stainless steel. It has multiple circular honeycomb holes 21 evenly distributed throughout its interior, extending along its thickness. The panel thickness (i.e., the depth of the honeycomb holes) is 21-28 mm. Alternatively, the cross-section of the honeycomb holes 21 can be hexagonal or square. Circular shapes are the simplest to manufacture; therefore, this embodiment uses a circular shape.

[0036] A thermally conductive metal pillar 4 is provided within each of the honeycomb holes 21. The material of the metal pillar can be copper or a copper alloy, or silver or a silver alloy. In this embodiment, copper is chosen as the material, i.e., copper pillars, considering cost, heat capacity, and thermal conductivity. The cross-sectional shape of the copper pillar is a circle that matches the honeycomb hole 21, with a clearance fit. The gaps are filled with thermally conductive gel, thermally conductive silicone grease, or nano-carbon paste to reduce contact thermal resistance. The height of the copper pillar is exactly equal to the thickness of the honeycomb plate 2, so that the upper end face of the copper pillar is in close contact with the lower surface of the heat transfer plate 1, and the lower end face of the copper pillar is in close contact with the upper surface of the mold plate 3, forming a tight physical contact.

[0037] The heat transfer plate 1 and the honeycomb plate 2 are detachably connected by multiple bolts 5. Specifically, bolt holes 51 are provided at the four corners of the heat transfer plate 1 and the honeycomb plate 2, and the bolts 5 pass through the heat transfer plate 1 and are screwed into the bolt holes 51 of the honeycomb plate 2. When it is necessary to change the layout of the heat-conducting metal pillars 4, simply unscrew the bolts 5, remove the heat transfer plate 1, and the copper pillars can be taken out or inserted from the honeycomb holes 21. This allows users to change the metal pillar layout according to different products without replacing the entire plate, reducing usage costs.

[0038] The heat transfer plate 1 is made of the same material as the copper column, pure copper, to ensure the highest thermal conductivity matching. Considering that the heat transfer plate 1 is subjected to greater pressure, brass or bronze is preferred; while the copper column is not subjected to pressure within the honeycomb holes, but to ensure thermal conductivity and heat transfer effects, red copper is selected to ensure the highest thermal conductivity matching. Alternatively, the thermal conductivity of the heat transfer plate 1 is not lower than that of the copper column to ensure good thermal conductivity.

[0039] The mold plate 3 is fixed to the lower surface of the honeycomb plate 2 by a detachable plate lock 6.

[0040] It also includes multiple plate locks 6, which are evenly distributed around the mold plate 3, with at least one on each side. For example... Figure 9 As shown, the plate lock 6 includes a locking rod 62 passing through the honeycomb hole 21, an expandable latching mechanism located at the end of the locking rod 62, and an adjusting component for driving the latching mechanism to open or close; the adjusting component is a screw 63. The latching mechanism consists of a left swing rod 65 and a right swing rod 66. The right swing rod 66 is fixed on a shaft 64, and the left swing rod 65 is hinged to the shaft 64. The other end of the locking rod 62 extends to provide a plate-shaped locking part 61. The plate-shaped locking part 61 has an inclined surface, and the side edge of the mold plate 3 also has an inclined surface. The two inclined surfaces cooperate with each other, so that the inclined end of the plate-shaped locking part 61 can fasten the inclined surface of the side edge of the mold plate 3. Through the coordinated action of multiple plate locks 6 distributed around the perimeter, the mold plate 3 is firmly clamped under the honeycomb plate 2; and the mold plate 3 can be detachably connected.

[0041] like Figure 10As shown, during installation, the heat transfer plate 1 is already installed on the honeycomb plate 2. First, the locking rod 62 is inserted into the selected honeycomb hole 21 from the side of the honeycomb plate 2 facing the mold plate 3. The lower left swing rod 65 is initially in a retracted state. As the locking rod moves downward, the free end of the left swing rod 65 gradually approaches and finally abuts against the heat transfer plate 1 that is fixed to the honeycomb plate. Due to the physical obstruction created by the presence of the heat transfer plate 1, the left swing rod 65 cannot continue to move downward in a straight line. Under the continuous downward thrust, the left swing rod 65 flips outward, so that the end contacts the side wall of the honeycomb hole 21, completing the initial positioning. Subsequently, by tightening the screw 63, the right swing rod 66 is driven to unfold, so that the entire latching mechanism is locked into the inner wall of the honeycomb hole 21, thereby fixing the locking rod 62 axially. An annular step 22 is also provided inside the honeycomb hole 21. This is to prevent the latching mechanism from being locked into the honeycomb hole 21 if the screw 63 loosens during long-term operation, thus preventing the plate lock 6 from sliding out directly.

[0042] During disassembly, simply loosen each screw 63 to retract the right swing arm 66, then pull out the locking rod 62 to achieve quick replacement of the mold plate 3.

[0043] In use, the heating plate transfers heat to the heat transfer plate 1, and the heat is rapidly conducted to every area of ​​the mold plate 3 through the closely contacting copper pillars. Due to the high thermal conductivity of copper (approximately 400 W / (m·K)) and its large volumetric heat capacity, the surface of the mold plate 3 can reach a uniform temperature within seconds. Furthermore, at the moment of contact with the hot stamping, the copper pillars release the stored heat, suppressing temperature drop and thus achieving a clear, firm, and flawless hot stamping or embossing effect.

[0044] In this embodiment, the copper pillars can cover the honeycomb holes 21 of the honeycomb panel. like Figure 5 As shown, the difference between this embodiment and Embodiment 1 is that the heat-conducting metal pillars 4 are not set in all the honeycomb holes 21, but are selectively set in the honeycomb holes 21 in local areas corresponding to the pattern, according to the distribution of the hot stamping, embossing, or combined hot stamping and embossing patterns to be processed. The honeycomb holes 21 in non-pattern areas are left empty (i.e., air is retained) or filled with heat-insulating material (such as aerogel or vacuum microsphere composite material).

[0045] Because only the patterned areas require high-temperature heat transfer for hot stamping, embossing, or matte hot stamping, while non-patterned areas do not require heat conduction, this selective design ensures temperature uniformity and stability across the processing area while significantly reducing copper usage and lowering manufacturing costs. This structure, such as... Figure 3As shown, the heat transfer plates 1 are arranged in sections, each plate being square. Each heat transfer plate 1 can be detached and connected to the honeycomb plate 2 via multiple bolts 5. Specifically, holes are provided at the four corners of the heat transfer plates 1, and corresponding bolt holes 51 are provided on the honeycomb plate 2. The bolts 5 pass through the heat transfer plates 1 and are screwed into the bolt holes 51 on the honeycomb plate 2. When it is necessary to change the layout of the heat-conducting metal pillars 4, simply unscrew the bolts 5, remove the corresponding heat transfer plate 1, and the copper pillar can be removed or inserted from the honeycomb holes 21. Furthermore, when it is necessary to produce products with different patterns, simply remove the heat transfer plates 1 and rearrange the positions of the copper pillars; the operation is convenient and cost-effective.

[0046] For cases where uniform heating of the entire plate surface or pattern coverage of the entire mold plate 3 is required, heat-conducting metal pillars 4 can be set in all honeycomb holes 21 to obtain maximum heat uniformity and heat capacity. In this case, the mold plate can be a metal cast iron plate that matches the honeycomb plate, and a frosted hot stamping mold can be fixed on the metal cast iron plate. The fixing method between the mold plate and the honeycomb plate is the same as described above.

[0047] In this embodiment, the mold plate 3 can be replaced with different types according to actual production needs. When performing ordinary hot stamping, a copper hot stamping plate with a metal foil transfer pattern is used; when performing hot embossing, a steel embossing plate with engraved texture is used; when performing frosted hot stamping, a composite mold plate integrating the hot stamping area and the embossing area (also known as "frosted hot stamping mold plate" or "embossed hot stamping mold plate") is used.

[0048] Regardless of the type of mold plate, the heat-conducting metal pillar arrangement strategy described in this invention can achieve efficient heat transfer and ensure consistent quality under various process conditions.

Claims

1. A heat-stabilized pressure plate structure, comprising a heat transfer plate (1), a honeycomb plate (2), and a mold plate (3), wherein the heat transfer plate (1) is in contact with a heating plate, the upper surface of the honeycomb plate (2) is disposed opposite to the lower surface of the heat transfer plate (1), and the lower surface of the honeycomb plate (2) is disposed opposite to the upper surface of the mold plate (3), characterized in that: The honeycomb plate (2) is provided with a plurality of honeycomb holes (21) that penetrate along the thickness direction; at least some of the honeycomb holes (21) are provided with heat-conducting metal pillars (4), the upper end face of the heat-conducting metal pillars (4) is in contact with the lower surface of the heat transfer plate (1), and the lower end face of the heat-conducting metal pillars (4) is in contact with the upper surface of the mold plate (3).

2. The heat-stabilized pressure plate structure according to claim 1, characterized in that: The heat-conducting metal pillars (4) are selectively placed in the honeycomb holes (21) of the local area corresponding to the pattern to be processed, according to the regional distribution of the hot stamping or hot embossing pattern to be processed.

3. The heat-stabilized pressure plate structure according to claim 2, characterized in that: No heat-conducting metal pillars (4) or heat-insulating fillers are provided in the honeycomb holes (21) in the non-patterned areas.

4. The heat-stabilized pressure plate structure according to claim 1, characterized in that: The heat-conducting metal pillars (4) are disposed within all the honeycomb holes (21) of the honeycomb plate (2).

5. The heat-stabilized pressure plate structure according to claim 1, characterized in that: The heat transfer plate (1) and the honeycomb plate (2) are detachably connected to facilitate the adjustment of the placement area of ​​the heat-conducting metal column (4).

6. The heat-stabilized pressure plate structure according to claim 1, characterized in that: The mold plate (3) is detachably connected to the lower surface of the honeycomb plate (2).

7. The heat-stabilized pressure plate structure according to claim 6, characterized in that: It also includes multiple plate locks (6), each plate lock (6) including a locking rod (62) passing through the honeycomb hole (21), an expandable buckle mechanism provided at the end of the locking rod (62), and an adjusting member for driving the buckle mechanism to open or close; the other end of the plate lock (6) is provided with a plate-shaped locking part (61), the plate-shaped locking part (61) has a slope, and the side edge of the mold plate (3) also has a slope. The two slopes cooperate with each other so that the end of the plate-shaped locking part (61) with the slope can fasten the slope of the side edge of the mold plate (3).

8. The heat-stabilized pressure plate structure according to claim 1, characterized in that: The heat-conducting metal column (4) is made of copper, copper alloy, silver or silver alloy.

9. The heat-stabilized pressure plate structure according to claim 1, characterized in that: The material of the heat transfer plate (1) is the same as that of the heat-conducting metal column (4), or the thermal conductivity of the heat transfer plate (1) is not lower than that of the heat-conducting metal column (4).

10. The heat-stabilized pressure plate structure according to claim 5, characterized in that: The detachable connection is a bolted connection. Bolt holes are provided on the heat transfer plate (1) and the honeycomb plate (2) respectively, and the two are fastened by bolts (5).

11. The heat-stabilized pressure plate structure according to claim 1, characterized in that: The cross-sectional shape of the thermally conductive metal pillar (4) matches the cross-sectional shape of the honeycomb hole (21), and the thermally conductive metal pillar (4) and the honeycomb hole (21) are interference fit or clearance fit and filled with thermally conductive medium.

12. The heat-stabilized pressure plate structure according to claim 1, characterized in that: The height of the heat-conducting metal pillar (4) is equal to the depth of the honeycomb hole (21), so that the upper and lower end faces of the heat-conducting metal pillar (4) form a close physical contact with the heat transfer plate (1) and the mold plate (3), respectively.

13. The heat-stabilized pressure plate structure according to any one of claims 1 to 12, characterized in that: The mold plate (3) is a hot stamping mold plate, a hot embossing mold plate, or a composite mold plate that combines hot stamping and embossing functions.

Images