一种绝缘高导热的尼龙复合材料及其制备方法
By introducing benzoxazine-grafted hexagonal boron nitride and magnesium aluminum spinel-supported nano-magnesium oxide filler into nylon materials, combined with modified polyamide compatibilizers, the problems of insufficient thermal conductivity and insulation of nylon materials are solved, and a composite material with high thermal conductivity, high insulation and moisture heat resistance and stability is realized, which is suitable for the electronic and electrical fields.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NANJING LIHUA ENG PLASTIC
- Filing Date
- 2026-06-12
- Publication Date
- 2026-07-17
AI Technical Summary
Existing polyhexamethylene adipamide (PA66) nylon materials have low thermal conductivity, which cannot meet the heat dissipation requirements of high-power electronic devices. At the same time, the large difference in surface energy between inorganic fillers and nylon matrix makes them prone to agglomeration and uneven dispersion, which limits the improvement of thermal conductivity, increases interface defects, and reduces insulation and resistance to damp heat.
Benzoxazine-grafted hexagonal boron nitride and magnesium aluminum spinel-supported nano-magnesium oxide were used as fillers, and modified polyamide was used as a compatibilizer to form a continuous thermally conductive path and enhance interfacial bonding. The aromatic heterocycles of benzoxazine were used to passivate surface defects, and the magnesium aluminum spinel-supported nano-magnesium oxide blocked water vapor permeation. The modified polyamide formed multiple coordination effects to improve interfacial compatibility.
A nylon composite material with high thermal conductivity, high insulation and long-term resistance to damp heat has been developed. By constructing a continuous thermally conductive network, interfacial hydrogen bonding and multiple coordination effects, the interfacial bonding is strengthened, the interfacial thermal resistance and dielectric loss are reduced, and it is suitable for high-end applications in the field of electronics and electrical engineering.
Smart Images
Figure CN122404971A_ABST