Polyamide composition and use and connector

By introducing syndiotactic polystyrene and maleic anhydride-grafted polyphenylene ether with specific weight-average molecular weights into polyamide resin, a stable phase structure is formed, which solves the problems of high dielectric constant, large dissipation factor and insufficient baking resistance and discoloration performance of connector materials in high signal transmission and miniaturization design. It realizes a polyamide composition with low dielectric constant, low dissipation factor and high flatness, which meets the high performance requirements of the server industry.

CN122404973APending Publication Date: 2026-07-17SHANGHAI KINGFA SCI & TECH +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI KINGFA SCI & TECH
Filing Date
2026-06-17
Publication Date
2026-07-17

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Abstract

本发明公开了一种聚酰胺组合物及应用和连接器，聚酰胺组合物包括以下重量份数的各组分：5‑55份聚酰胺树脂，5‑35份间规聚苯乙烯复配物，5‑25份无卤阻燃剂，0.5‑7份马来酸酐接枝聚苯醚；所述聚酰胺树脂为半芳香族聚酰胺；所述间规聚苯乙烯复配物包括重均分子量为4万‑5万的间规聚苯乙烯A和重均分子量为9万‑10万的间规聚苯乙烯B。本发明的聚酰胺组合物具有低Dk和Df、以及高平面度和强耐烘烤变色性能。
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Patent Citations

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