Resin composition and article thereof
By combining maleimide resin, vinyl polyphenylene ether resin or polyolefin resin with the compound of formula (1), the shortcomings of the resin composition in terms of filling and interfacial adhesion are solved through crosslinking reaction, and higher heat resistance and mechanical properties are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ELITE ELECTRONIC MATERIAL(ZHONGSHAN)CO LTD
- Filing Date
- 2025-01-17
- Publication Date
- 2026-07-17
AI Technical Summary
Existing resin compositions cannot simultaneously meet the performance requirements of high filler properties, good interfacial adhesion between the resin matrix and the glass fiber cloth, and excellent heat resistance after moisture absorption.
By using a specific ratio of maleimide resin, vinyl polyphenylene ether resin or polyolefin resin combined with the compound of formula (1), the filling properties, interfacial tightness and heat resistance of the resin composition are improved through crosslinking reaction.
It improves the filling properties of the resin composition, the interfacial tightness between the resin matrix and the glass fiber cloth, the heat resistance after moisture absorption, the glass transition temperature, and the tensile strength of the copper foil.
Smart Images
Figure CN122404976A_ABST