铜合金的制备方法

By employing a step-by-step and confined copper alloy preparation process, the problem of simultaneously improving strength and conductivity in traditional copper alloy preparation has been solved, enabling the preparation of copper alloys with high strength, good plasticity, and high conductivity.

CN122406134APending Publication Date: 2026-07-17NINGBO XINGYE SHENGTAI GROUP +2
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Patent Information

Application Number
CN202610802747.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-04
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing copper alloy preparation technologies cannot simultaneously achieve high strength, good plasticity, and high conductivity. Traditional aging precipitation processes and "over-aging + deformation" processes have limited improvements in strength and conductivity or reduced plasticity.

Method used

The process route of 'first solution treatment', 'over-aging treatment', 'deformation treatment', 'intermediate aging treatment', 'confined second solution treatment' and 're-aging treatment' is adopted. Through step-by-step and confinement methods, the efficient enrichment of solute atoms and the precise control of precipitated phase are achieved, forming a nano-precipitated phase reinforcement.

Benefits of technology

This method achieves ultra-high strength, good plasticity, and high conductivity in copper alloys, breaking through the limitations of traditional processes and significantly improving the synergistic effect of strength and conductivity.

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Abstract

本发明提供了一种铜合金的制备方法,涉及铜合金技术领域。本发明提供的铜合金的制备方法,核心在于“限域二次固溶时效”,通过“第一次固溶处理、过时效处理、变形处理、中间时效处理、限域二次固溶处理和再时效处理”的工艺路线,在实现强度更高、导电率更好的同时,显著改善合金的塑性,打破了传统工艺的局限性。本发明制备得到铜合金兼具超高强度(抗拉强度≥1000MPa)、良好塑性(延伸率≥5%)和高导电性(较传统方法导电率提升≥20%)。
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