Magnetron sputtering target assembly and magnetron sputtering device capable of distributed gas supply

Abstract

This application discloses a magnetron sputtering target assembly and a magnetron sputtering device capable of distributed gas supply, which solves the problem of uneven axial gas distribution during coating of the inner surface of large aspect ratio tubes. This application arranges a target body with a fan-shaped cross-section and a gas supply pipe with uniformly perforated walls side-by-side. The gas supply pipe is located in the complementary angle direction of the fan shape to avoid obstructing the sputtered particle flow. The gas supply pipe can be a cylindrical tube, a spiral coil, or a sheet structure, providing continuous and uniform gas supply along the entire length of the workpiece. The magnetron sputtering device integrating this target assembly also includes a rotary drive unit, a vacuum module, and a rotary connection unit. The workpiece is rotated by the drive unit, while the target assembly and the gas supply pipe remain stationary and extend into the inner cavity of the workpiece. The gas inlet of the gas supply pipe is connected to the vacuum chamber, utilizing the chamber for buffering and stabilizing gas supply. This application can maintain the axial consistency of the gas inside the tube during continuous deposition for several hours, significantly improving the uniformity of coating thickness and performance on the inner surface of large aspect ratio tubes.

Description

Technical Field

[0001] This application relates to the field of nano-coating preparation technology, and in particular to a magnetron sputtering target assembly and a magnetron sputtering device capable of distributed gas supply. Background Technology

[0002] As industrial applications demand increasingly higher adaptability to complex working conditions, the need for coating the inner surfaces of tubular workpieces or slender cylindrical bodies (such as cylinder inner walls, hydraulic cylinder barrels, nuclear fuel cladding tubes, and petrochemical pipeline inner walls) is becoming increasingly urgent. These workpieces typically have a large length-to-diameter ratio, and their inner surfaces are in direct contact with the working medium, enduring multiple damage mechanisms such as wear, corrosion, and erosion. Therefore, it is essential to prepare high-performance protective coatings on their inner surfaces using vapor deposition technology. Preparing surface nano-coatings using vapor deposition is a commonly used method.

[0003] Achieving coating on the inner surface of tubular workpieces using vapor deposition technology requires comprehensive process selection, equipment design, and parameter optimization. Physical vapor deposition (PVD), such as magnetron sputtering and ion plating, is suitable for high hardness requirements, achieving uniform deposition through multi-target design and plasma enhancement. Chemical vapor deposition (CVD), including thermal CVD and plasma-enhanced CVD (PECVD), is suitable for corrosion resistance or semiconductor performance requirements, necessitating precise control of temperature and gas ratios. Equipment employs rotating reaction chambers, specialized gas systems, and temperature control devices to ensure coating uniformity. Process optimization involves adjusting deposition rates, pulsed sputtering, and real-time monitoring to optimize film quality. In practical applications, efficiency and cost must be balanced based on material properties and production needs.

[0004] In current vapor deposition methods for deep hole inner surfaces, both CVD and PVD inevitably involve "gas supply." Specifically, this means supplying gas into the workpiece through its natural openings (one end or both ends). The supplied gas is a key participant in vapor deposition film formation.

[0005] For example, Chinese invention patent CN119932503A discloses a magnetron sputtering device for preparing coatings on the inner surface of a cylinder. It uses a cylindrical hollow target material, which is inserted into the cylinder to be treated for sputtering. The two ends of the cylinder to be treated are directly connected to the rotary drive unit and the chamber, forming a closed space, which directly serves as a vacuum chamber for the inside of the cylinder. Because a hollow target material with a smaller diameter is used, it is suitable for coating the inner wall of tubes with a large length-to-diameter ratio.

[0006] The aforementioned patent document describes a method where gas is supplied to the cylinder via a gas supply device through a chamber. However, this introduces a new problem: gas is often scarce in areas of a workpiece with a large aspect ratio, particularly where the gas source is far from the inlet. For example, the middle of the workpiece is farther from the gas source than the ends. Therefore, in some applications, a gas pipe is typically inserted into the workpiece first to ensure uniform gas supply before vapor deposition begins. However, once deposition starts, the gas pipe must be removed to avoid obstruction. With current processes, PVD targets often have complex compositions. To prepare coatings with excellent adhesion, high precision in gas flow control and long deposition times are required. Simply ensuring uniform gas flow at the beginning is insufficient to guarantee consistent deposition within the workpiece for more than 6 hours.

[0007] Therefore, it is necessary to propose a new technical solution to address the problems existing in the current technology. Summary of the Invention

[0008] This application provides a magnetron sputtering target assembly and a magnetron sputtering device capable of distributed gas supply, in order to solve the problem that existing magnetron sputtering devices are unable to meet the gas supply requirements of workpieces with large aspect ratios.

[0009] To achieve the above objectives, this application provides the following technical solution:

[0010] On one hand, this application provides a magnetron sputtering target assembly, including a target body and a gas supply pipe arranged parallel to the target body; the target body includes a hollow cylindrical target shell, a magnet encapsulated in the inner cavity of the target shell, and a coolant filling between the magnet and the inner cavity wall of the target shell; the target shell is made of a solid material required for sputtering thin films, and the cross-section of the target shell is fan-shaped; a plurality of gas outlet holes are uniformly opened on the pipe wall of the gas supply pipe, the gas supply pipe is located in the complementary angle direction of the fan-shaped cross-section of the target shell, and the length extension direction of the gas supply pipe is the same as the length extension direction of the target shell.

[0011] Furthermore, in the above technical solution, the air supply pipe is a columnar, spiral, or sheet-like structure; or, the air supply pipe is an integrated multi-segment composite structure pipe, which includes at least two of the following: columnar pipe segments, spiral pipe segments, and sheet-like structure pipe segments.

[0012] Furthermore, the air supply pipe is a cylindrical pipe, one end of which is closed, and the other end is provided with an air inlet adapted to the air supply device. A plurality of air outlet holes are evenly opened on the pipe wall of the cylindrical pipe.

[0013] Furthermore, the air supply pipe is a spiral coil, one end of which is closed and the other end is provided with an air inlet adapted to the air supply device. Several air outlet holes are evenly opened on the wall of the spiral coil.

[0014] Furthermore, the air supply pipe includes a straight or curved main pipe and branch pipes evenly arranged on the main pipe, with a plurality of air outlet holes evenly opened on the branch pipes.

[0015] Furthermore, the air supply pipe is a hollow sheet structure, and a plurality of air outlet holes are evenly opened on the outer wall of the sheet structure.

[0016] On the other hand, this application provides a magnetron sputtering device capable of distributed gas supply, including a mounting bracket and a rotary drive unit, a vacuum module, a gas supply module, and the aforementioned magnetron sputtering target assembly, all mounted on the mounting bracket. The target body and the gas supply pipe extend side by side into the inner cavity of the workpiece to be processed. Both the target body and the gas supply pipe are fixedly mounted on the mounting bracket. The first end of the workpiece to be processed is fastened and sealed to the rotary drive unit, and the second end of the workpiece to be processed is rotatably and sealed to the mounting bracket. The vacuum module is used to evacuate the inner cavity of the workpiece to be processed, and the gas supply module is used to supply gas to the gas supply pipe.

[0017] Furthermore, in the above technical solution, the power output end of the rotary drive unit is fastened and sealed to the first end of the workpiece to be processed, and the rotary drive unit is used to drive the workpiece to be processed to rotate around its axis.

[0018] Furthermore, the vacuum module includes a vacuum chamber, on which a rotating connection is provided. The rotating connection is fastened and sealed to the second end of the workpiece to be processed. The vacuum chamber is connected to a vacuum device and a gas supply device. The rotating connection is provided with a vacuum channel for connecting the vacuum device and the inner cavity of the workpiece to be processed.

[0019] Furthermore, the rotating connection includes:

[0020] A fixed central seat is integrally connected to the outer wall of the vacuum chamber. The fixed central seat is provided with a mounting position for fixing the target body and the gas supply pipe. The central axis of the fixed central seat coincides with the rotation axis of the workpiece to be processed.

[0021] A rotating outer ring is fitted around the periphery of the fixed central seat, and the rotating outer ring is fastened and sealed to the second end of the workpiece to be processed;

[0022] A bearing is disposed between the fixed central seat and the rotating outer ring, so that the rotating outer ring can rotate relative to the fixed central seat;

[0023] A dynamic seal is disposed between the fixed central seat and the rotating outer ring, and is used to maintain a vacuum seal between the vacuum chamber and the inner cavity of the workpiece to be processed when the rotating outer ring rotates;

[0024] The fixed central seat is provided with a vacuum channel for connecting the vacuum device and the inner cavity of the workpiece to be processed.

[0025] Furthermore, the air inlet of the air supply pipe is connected to the vacuum chamber.

[0026] Compared with the prior art, this application has at least the following beneficial effects:

[0027] 1. This application arranges a target shell with a fan-shaped cross-section and a gas supply pipe with uniformly opened vent holes on the pipe wall side by side, with both extending in the same direction. At the same time, the gas supply pipe is arranged in the complementary angle direction of the fan-shaped cross-section. In this way, the gas supply pipe will not occupy the effective sputtering area of ​​the target material, fundamentally avoiding the obstruction of the sputtered particle transport path by the gas supply pipe. The uniform gas outlet along the entire length of the gas supply pipe can realize distributed gas supply, so that the process gas is replenished in equal amounts at all positions along the workpiece axis. This solves the problem of gas thinning at workpieces with large aspect ratios far from the gas inlet, meets the uniform gas supply requirements of workpieces with large aspect ratios, and since the gas supply pipe remains inside the workpiece to continuously supply gas during the coating process, it does not need to be pulled out before the deposition begins. Therefore, it can maintain the axial consistency of the gas concentration inside the workpiece during the magnetron sputtering process that lasts for several hours, ensuring the uniformity and stability of the film thickness and performance.

[0028] 2. This application also provides a magnetron sputtering device including the above-mentioned magnetron sputtering target assembly. The mounting bracket of the magnetron sputtering device integrates a rotary drive unit, a vacuum module, a gas supply module, and the magnetron sputtering target assembly. Specifically, the target body and the gas supply pipe are fixedly installed side by side and extended into the inner cavity of the workpiece to be processed. The first end of the workpiece is tightly sealed to the rotary drive unit, and the second end is rotatably sealed to the mounting bracket. The rotary drive unit drives the workpiece to rotate around its axis, while the target assembly remains stationary. During the rotation of the workpiece, each axial surface of the inner wall of the workpiece can pass through the sputtering area of ​​the target material and the convection area of ​​the gas flow in sequence. Thus, no matter how large the length-to-diameter ratio of the tube is, the gas distribution in the central section and the two ends can maintain a high degree of consistency, thereby controlling the texture of the coating to be more uniform. Therefore, the magnetron sputtering device provided in this application can uniformly coat the inner surface of a workpiece with a large aspect ratio in the circumferential direction. The vacuum module evacuates the inner cavity of the workpiece, and the gas supply module supplies gas to the gas supply pipe, so that the required vacuum degree and reaction gas partial pressure can be maintained inside the workpiece. The distributed gas supply pipe is always located inside the workpiece and continuously supplies gas during the deposition process, thereby fundamentally solving the problem of gas uniformity in long-term magnetron sputtering coating of the inner surface of a large aspect ratio pipe. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing this application. For example, based on the technical concepts disclosed in this application and the exemplary drawings, those skilled in the art are able to easily make conventional adjustments or further optimizations to the addition / reduction / classification, specific shapes, positional relationships, connection methods, and size ratios of certain units (components).

[0030] Figure 1 This is a schematic diagram of the structure of a magnetron sputtering target assembly provided in this application in one embodiment;

[0031] Figure 2 This is a partial structural schematic diagram of the magnetron sputtering device provided in this application in one embodiment.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Target body; 2. Air supply pipe; 21. Air outlet;

[0034] 3. Rotary drive unit; 4. Workpiece to be processed; 5. Vacuum chamber; 6. Rotary connection unit; 61. Fixed central seat; 611. Vacuum passage; 62. Rotating outer ring; 63. Bearing; 64. Dynamic seal; 7. Vacuum device; 8. Gas supply device. Detailed Implementation

[0035] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] In the description of this application: unless otherwise stated, "a plurality of" means two or more. The terms "first," "second," etc., in this application are intended to distinguish the objects referred to and do not have any special meaning in terms of technical connotation (e.g., they should not be construed as an emphasis on importance or order). Expressions such as "including," "comprising," and "having" also mean "not limited to" (certain units, components, materials, steps, etc.).

[0037] The terms used in this application, such as "upper," "lower," "left," "right," and "middle," are generally used to facilitate intuitive understanding by referring to the accompanying drawings, and are not absolute limitations on the positional relationships in the actual product. Changes in these relative positional relationships, without departing from the technical concept disclosed in this application, should also be considered within the scope of this application.

[0038] The workpieces in this application are workpieces with a large length-to-diameter ratio, rather than "short and stubby". Specifically, their types include: 1. Workpieces with through holes, such as cylinders, oil pipelines, and cannon barrels; 2. Workpieces with blind holes, such as gas cylinders and accumulators.

[0039] Example 1

[0040] To address the problems existing in the prior art, this application proposes a magnetron sputtering target assembly that combines a gas supply column with a target material based on the concept of distributed gas supply. When applied in a magnetron sputtering device, it can achieve uniform gas distribution during the magnetron sputtering coating process on the inner surface of tubular workpieces with a large aspect ratio.

[0041] The magnetron sputtering target assembly provided in this application includes a target body 1 and a gas supply pipe 2 arranged parallel to the target body 1, such as Figure 1 Specifically, the target body 1 includes a hollow cylindrical target shell, a magnet encapsulated within the inner cavity of the target shell, and a coolant filling the space between the magnet and the inner cavity wall of the target shell. The target shell is made of a solid material required for sputtering thin films; for example, titanium is used to make the target shell for preparing titanium nitride films, and nitrogen is supplied through a gas supply pipe. The target shell has a fan-shaped cross-section. This fan-shaped cross-section design concentrates the effective sputtering surface of the target material on one side of the fan-shaped arc, which is beneficial for guiding sputtered particles to the inner surface of the workpiece. Several air outlets 21 are uniformly formed on the wall of the gas supply pipe 2. The gas supply pipe 2 is located in the complementary angle direction of the fan-shaped cross-section of the target shell, and the length extension direction of the gas supply pipe 2 is the same as the length extension direction of the target shell. The gas supply pipe 2 can uniformly supply gas along its entire length, enabling distributed gas supply. This allows the process gas to be replenished in equal amounts at all positions along the workpiece axis, meeting the uniform gas supply requirements of workpieces with large length-to-diameter ratios. Furthermore, since the gas supply pipe 2 remains inside the workpiece throughout the coating process and continuously supplies gas, it does not need to be pulled out before deposition begins. Therefore, it can maintain the axial consistency of the gas concentration inside the workpiece during the magnetron sputtering process, which can last for several hours, ensuring the uniformity and stability of the film thickness and performance.

[0042] The gas supply pipe 2 in this application has a cylindrical, spiral, or sheet-like structure. Alternatively, the gas supply pipe 2 in this application can be an integral multi-segment composite structure pipe, which includes at least two of the following segment types: cylindrical segments, spiral segments, and sheet-like segments. That is, the gas supply pipe 2 in this application may be a cylinder, prism, spiral tube, or sheet. It may be a perforated solid column, a winding thin tube, a sheet in the form of a metal mesh, or a combination of the above, as long as it can uniformly supply gas to the vicinity of each segment of the target material to achieve uniform gas distribution. The gas supplied through the gas supply pipe 2 is a key participant in vapor phase deposition film formation, and may constitute the film material (such as nitrogen) or may be an auxiliary film formation agent (such as argon).

[0043] If the gas supply pipe 2 is a cylindrical tube, one end is closed, and the other end is equipped with an air inlet adapted to the gas supply device 8. Several air outlets 21 are evenly distributed along the axial and circumferential directions on the tube wall. In use, the process gas enters the cylindrical tube through the air inlet and escapes evenly along the entire length of the workpiece through each air outlet 21, forming a distributed gas supply. This type of gas supply pipe 2 has a simple and reliable structure, is easy to process and install; after entering through the air inlet, the gas flows axially along the cylindrical tube. Because the diameter and spacing of each air outlet 21 are uniformly designed, the gas can escape at a constant flow rate along the entire length, forming an axially linear and uniform gas supply distribution inside the workpiece. This effectively suppresses the phenomenon of exponential decay of gas concentration with increasing distance in traditional single-end or two-end gas supply methods, making it particularly suitable for coating the inner surface of pipes with large length-to-diameter ratios.

[0044] If the gas supply pipe 2 is a spiral coil, one end is closed, and the other end is equipped with an air inlet adapted to the gas supply device 8. Several air outlets 21 are also evenly distributed on the wall of the spiral coil. The spiral structure increases the number of air outlets 21 within a limited space and improves the axial pressure distribution of the gas. This spiral structure of the gas supply pipe 2 significantly increases the actual length of the pipe and the distribution density of the air outlets 21 within a limited space, making the axial flow resistance of the gas more uniform. Simultaneously, the spiral shape provides a more dispersed gas outlet direction in the circumferential direction, thereby achieving superior axial and circumferential gas uniformity within the workpiece. For workpieces with a particularly large length-to-diameter ratio, the spiral gas supply pipe 2 can effectively reduce gas pressure loss along the path, avoid insufficient gas supply at the far end, and ensure that the concentration of reactant gas at each cross-section remains consistent throughout the deposition process.

[0045] If the gas supply pipe 2 includes a straight or curved main pipe and multiple branch pipes evenly arranged on the main pipe, then each branch pipe is evenly provided with several air outlets 21. This structure forms a multi-point distributed gas supply network, which can flexibly design the direction of the main pipe and the number, position and length of the branch pipes according to the specific length, diameter and inner surface morphology of the workpiece, thereby enabling independent gas flow distribution to different sections. For pipe fittings with variable cross-sections or local complex structures, this scheme can achieve precise axial and circumferential gas supply control, further improving the adjustability and adaptability of gas supply uniformity. Therefore, this branch pipeline structure allows for independent gas flow distribution to different sections within the workpiece and is suitable for workpieces with variable cross-sections or local complex morphologies.

[0046] If the gas supply pipe 2 is a hollow sheet structure, then several air outlet holes 21 are evenly opened on its outer wall. The flat shape of this sheet structure makes its cross-sectional area in the inner cavity of the workpiece much smaller than that of a cylindrical tube, thereby greatly reducing the mechanical obstruction to the transport of sputtered particles from the target material to the inner surface of the workpiece. At the same time, the larger surface area of ​​the sheet allows for the arrangement of more air outlet holes 21, resulting in more uniform gas dispersion. This design minimizes the negative impact of the gas supply pipe 2 on the coating rate while ensuring distributed gas supply capability, and is especially suitable for pipes with small inner diameters and large lengths.

[0047] The air supply pipe 2 in this application can take various forms such as columnar pipe, spiral coil, branch pipe or sheet structure, which can flexibly adapt to workpieces with different length-to-diameter ratios and different inner diameters, and has a wide range of applications.

[0048] Therefore, this application employs a distributed gas supply structure along the axial direction inside the workpiece. By arranging the gas supply pipe 2 alongside the fan-shaped target and opening uniform gas outlet holes 21 on the gas supply pipe 2, a continuous and uniform gas supply along the entire length of the workpiece is achieved during the coating process. This allows the process gas to be uniformly input at multiple points along the entire length of the workpiece. Furthermore, the design of this gas supply structure (the cross-section of the target shell is fan-shaped, and the gas supply pipe 2 is located in the complementary angle direction of the fan-shaped cross-section of the target shell) fully considers compatibility with the sputtering process. While avoiding any obstruction effect on the transport of sputtered particles, it achieves a continuous and uniform gas supply during the deposition process. This overcomes the limitations of the existing "pre-gas distribution followed by pipe removal" mode, achieving long-term stability of gas distribution during the vapor phase deposition process on the inner surface of workpieces with large aspect ratios, and realizing high-quality and high-efficiency preparation of high-performance coatings on the inner surface of tubular workpieces.

[0049] Example 2

[0050] The above embodiment provides a distributed (mesh, dot, stripe) gas supply structure combined with a target material mechanism. The gas supply pipe 2 and the target body 1 are inserted into the workpiece to be vapor-deposited. During the rotation of the workpiece, each axial surface of the inner wall can sequentially pass through the sputtering area of ​​the target material and the convection area of ​​the gas flow. Therefore, regardless of the length-to-diameter ratio of the pipe, the gas distribution in the central section and both ends can maintain a high degree of consistency, thereby controlling the uniformity of the coating.

[0051] Based on the magnetron sputtering target assembly provided in Embodiment 1 above, this embodiment provides a magnetron sputtering device capable of distributed gas supply. This magnetron sputtering device is adaptable to processing workpieces ranging from 5 to 10 meters in length. The structure of this magnetron sputtering device is described in detail below.

[0052] The magnetron sputtering apparatus provided in this embodiment includes: a mounting bracket and a rotary drive unit 3, a vacuum module, a gas supply module, a power supply, and the aforementioned magnetron sputtering target assembly, all mounted on the mounting bracket. The two poles of the power supply are connected to the target body 1 and the workpiece, respectively.

[0053] The target body 1 and the gas supply pipe 2 of the magnetron sputtering target assembly extend side-by-side into the inner cavity of the workpiece 4 to be treated. Both the target body 1 and the gas supply pipe 2 are fixedly mounted on the mounting bracket and remain stationary during the coating process. The first end of the workpiece 4 to be treated is fastened and sealed to the rotary drive unit 3, and the second end of the workpiece 4 to be treated is rotatably and sealed to the mounting bracket, as shown below. Figure 2 The vacuum module is used to evacuate the inner cavity of the workpiece 4 to be processed, and the gas supply module is used to supply gas to the gas supply pipe 2.

[0054] In this application, the power output end of the rotary drive unit 3 is fastened and sealed to the first end of the workpiece 4 to be processed. The rotary drive unit 3 is used to drive the workpiece 4 to be processed to rotate around its axis, thereby achieving uniform circumferential coating on the inner surface. The power output end of the rotary drive unit 3 and the first end of the workpiece 4 to be processed can be fastened and sealed through conventional mechanical connection methods such as flange clamp connection or direct insertion magnetic fluid sealing shaft. In a preferred embodiment, a structural connection method of "hollow shaft motor + workpiece end cover flange + central magnetic fluid seal" can be adopted.

[0055] In this application, the vacuum module includes a vacuum chamber 5, on which a rotating connection part 6 is provided. The rotating connection part 6 is fastened and sealed to the second end of the workpiece 4 to be processed. The vacuum chamber 5 is connected to a vacuum device 7 and a gas supply device 8 (the gas supply device 8 may also be part of or connected to a gas supply module). The rotating connection part 6 is provided with a vacuum channel 611 for communicating between the vacuum device 7 and the inner cavity of the workpiece 4 to be processed.

[0056] The rotating connection 6 further includes: a fixed central seat 61, a rotating outer ring 62, a bearing 63, and a dynamic seal 64. The fixed central seat 61 is integrally connected to the outer wall of the vacuum chamber 5, and the fixed central seat 61 is provided with mounting positions for fixing and installing the target body 1 and the gas supply pipe 2. The central axis of the fixed central seat 61 coincides with the rotation axis of the workpiece 4 to be processed. The rotating outer ring 62 is sleeved on the periphery of the fixed central seat 61 and is fastened and sealed to the second end of the workpiece 4 to be processed. The bearing 63 is disposed between the fixed central seat 61 and the rotating outer ring 62, so that the rotating outer ring 62 can rotate freely relative to the fixed central seat 61. The dynamic seal 64 (e.g., a magnetohydrodynamic seal or a lip seal) is disposed between the fixed central seat 61 and the rotating outer ring 62 to maintain a vacuum seal between the vacuum chamber 5 and the inner cavity of the workpiece 4 to be processed when the rotating outer ring 62 rotates. The fixed central seat 61 is also provided with a vacuum channel 611, one end of which is connected to the vacuum device 7, and the other end is connected to the inner cavity of the workpiece 4 to be processed. In this application, the rotating connection part 6 adopts a combination of the fixed central seat 61 and the rotating outer ring 62, and integrates the vacuum channel 611 and the dynamic seal, so that the target assembly is stationary and the workpiece rotates, which simplifies the dynamic seal structure and avoids the torsion and wear of the air supply pipe 2.

[0057] The inlet port of the gas supply pipe 2 is connected to the vacuum chamber 5. In this way, the gas supply module (or gas supply device 8) first sends the process gas into the vacuum chamber 5, which serves as a gas buffer and pressure stabilizing chamber. Then, the gas is evenly distributed to the inner cavity of the workpiece through the outlet port 21 on the gas supply pipe 2, which can effectively suppress the influence of gas supply pressure fluctuation on the uniformity of gas output.

[0058] During the coating process, the magnetron sputtering target assembly is first fixedly mounted on the mounting bracket, with the target body 1 and the gas supply pipe 2 extending parallel into the inner cavity of the workpiece 4 to be treated. The gas supply pipe 2 is positioned at the complementary angle of the fan-shaped cross-section of the target body 1 to avoid obstruction. Then, the workpiece is driven to rotate at a low speed around its axis by the rotary drive unit 3, while the vacuum module is activated to evacuate the inner cavity of the workpiece to a predetermined vacuum level. Next, the gas supply module is activated, and the process gas (such as argon, nitrogen, or other reactive gases) passes sequentially through the vacuum chamber 5, the inlet of the gas supply pipe 2, and the cavity of the gas supply pipe 2, finally escaping along the entire length of the workpiece from the uniformly arranged outlet holes 21, forming an axially uniformly distributed reactive atmosphere in the inner cavity of the workpiece. Afterward, a negative voltage (or a medium-frequency or radio-frequency power supply) is applied to the target body 1, generating a magnetron sputtering phenomenon on the surface of the fan-shaped target material. The sputtered particles are deposited on the inner surface of the rotating workpiece to form a thin film. Throughout the deposition process (which typically lasts for several hours), the gas supply pipe 2 remains inside the workpiece to continuously supply gas. The workpiece continues to rotate while the target assembly remains stationary, thus achieving long-term, stable distributed gas supply and ensuring high uniformity of the film layer along the axial and circumferential directions.

[0059] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

[0060] The present application has been described in a relatively specific and detailed manner above through general descriptions and specific embodiments. It should be understood that, based on the technical concept of the present application, several conventional adjustments or further innovations can be made to these specific embodiments; however, as long as they do not depart from the technical concept of the present application, the technical solutions obtained by these conventional adjustments or further innovations also fall within the protection scope of the claims of the present application.

Claims

1. A magnetron sputter target assembly, characterized by The device includes a target body and an air supply pipe arranged parallel to the target body. The target body includes a hollow cylindrical target shell, a magnet encapsulated in the inner cavity of the target shell, and a coolant filling the space between the magnet and the inner cavity wall of the target shell. The target shell is made of a solid material required for sputtering thin films, and the cross-section of the target shell is fan-shaped. The air supply pipe has a plurality of air outlet holes uniformly opened on its wall. The air supply pipe is located in the complementary angle direction of the fan-shaped cross-section of the target shell, and the length extension direction of the air supply pipe is the same as the length extension direction of the target shell.

2. The magnetron sputter target assembly of claim 1, wherein, The gas supply pipe is cylindrical, spiral, or sheet-like; or, the gas supply pipe is an integral multi-segment composite structure pipe, which includes at least two of the following: cylindrical pipe segments, spiral pipe segments, and sheet-like structure pipe segments.

3. The magnetron sputtering target assembly according to claim 1, characterized in that, The air supply pipe is a cylindrical pipe with one end closed and the other end provided with an air inlet adapted to the air supply device. Several air outlet holes are evenly opened on the pipe wall of the cylindrical pipe.

4. The magnetron sputtering target assembly according to claim 1, characterized in that, The air supply pipe is a spiral coil, one end of which is closed and the other end is provided with an air inlet adapted to the air supply device. Several air outlet holes are evenly opened on the wall of the spiral coil.

5. The magnetron sputtering target assembly according to claim 1, characterized in that, The air supply pipe includes a straight or curved main pipe and branch pipes evenly arranged on the main pipe, with a plurality of air outlet holes evenly opened on the branch pipes.

6. The magnetron sputtering target assembly according to claim 1, characterized in that, The air supply pipe is a hollow sheet structure, and a plurality of air outlet holes are evenly distributed on the outer wall of the sheet structure.

7. A magnetron sputtering device capable of distributed gas supply, characterized in that, The assembly includes a mounting bracket and a rotary drive unit, a vacuum module, and a gas supply module respectively mounted on the mounting bracket, as well as a magnetron sputtering target assembly according to any one of claims 1 to 6; the target body and the gas supply pipe extend side by side into the inner cavity of the workpiece to be processed, the target body and the gas supply pipe are both fixedly mounted on the mounting bracket, the first end of the workpiece to be processed is fastened and sealed to the rotary drive unit, the second end of the workpiece to be processed is rotatably and sealed to the mounting bracket, the vacuum module is used to evacuate the inner cavity of the workpiece to be processed, and the gas supply module is used to supply gas to the gas supply pipe.

8. The magnetron sputtering apparatus capable of distributed gas supply according to claim 7, characterized in that, The power output end of the rotary drive unit is fastened and sealed to the first end of the workpiece to be processed, and the rotary drive unit is used to drive the workpiece to be processed to rotate around its axis. The vacuum module includes a vacuum chamber, a rotating connection part is provided on the vacuum chamber, the rotating connection part is fastened and sealed to the second end of the workpiece to be processed, the vacuum chamber is connected to a vacuum device and a gas supply device, and the rotating connection part is provided with a vacuum channel for connecting the vacuum device and the inner cavity of the workpiece to be processed.

9. The magnetron sputtering apparatus capable of distributed gas supply according to claim 8, characterized in that, The rotating connection part includes: A fixed central seat is integrally connected to the outer wall of the vacuum chamber. The fixed central seat is provided with a mounting position for fixing the target body and the gas supply pipe. The central axis of the fixed central seat coincides with the rotation axis of the workpiece to be processed. A rotating outer ring is fitted around the periphery of the fixed central seat, and the rotating outer ring is fastened and sealed to the second end of the workpiece to be processed; A bearing is disposed between the fixed central seat and the rotating outer ring, so that the rotating outer ring can rotate relative to the fixed central seat; A dynamic seal is disposed between the fixed central seat and the rotating outer ring, and is used to maintain a vacuum seal between the vacuum chamber and the inner cavity of the workpiece to be processed when the rotating outer ring rotates; The fixed central seat is provided with a vacuum channel for connecting the vacuum device and the inner cavity of the workpiece to be processed.

10. The magnetron sputtering apparatus capable of distributed gas supply according to claim 9, characterized in that, The air inlet of the air supply pipe is connected to the vacuum chamber.

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