A deposition apparatus for microchannel CVD coating and its surface strengthening process

By designing a deposition device for microchannel CVD coatings and utilizing a pumping mechanism and adsorption components to process reaction byproducts, the carrier gas was recycled, solving the problem of incomplete carrier gas recovery in traditional technologies and improving production efficiency.

CN122406191APending Publication Date: 2026-07-17JIANGYIN GIANSUN MOLD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGYIN GIANSUN MOLD
Filing Date
2026-06-03
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In traditional technologies, unreacted precursor gases and carrier gases contain moisture or are not completely separated after recovery, making them unsuitable for direct reuse in production. Furthermore, no complete drying and recycling pathways have been designed for the recovery and separation of precursor gases and carrier gases.

Method used

A deposition apparatus for microchannel CVD coating is designed, comprising a reaction chamber, a pumping mechanism, a recovery tank, an adsorption component, and a drying tank. The reaction byproducts are transported to the recovery tank by the pumping mechanism, and the carrier gas is recycled after being processed by the adsorption component and the drying tank.

Benefits of technology

It enables the effective recovery and recycling of carrier gas, reduces the direct emission of harmful gases, lowers carrier gas consumption, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to the fields of high-end equipment manufacturing and surface engineering technology, specifically a deposition apparatus for microchannel CVD coating and its surface strengthening process. The apparatus includes an operating table and a reaction chamber mounted on the operating table, with a sealed chamber formed within the reaction chamber. An inlet pipe and an exhaust pipe are respectively installed on the reaction chamber, with the exhaust pipe connected to a pumping mechanism mounted on the operating table. A separation mechanism, also mounted on the operating table, includes a recovery tank and multiple adsorption components within the recovery tank. A recovery unit is connected at one end to the recovery tank and at the other end to the inlet pipe. This invention uses the pumping mechanism to transport reaction byproducts along with carrier gas to the recovery tank. While the reaction byproducts are fully absorbed, selective filtration of the carrier gas is achieved. Unreacted precursor gas and carrier gas are mixed and discharged from the recovery tank, dried, and can then be stored or directly returned to the inlet pipe to participate in the next deposition cycle, thus achieving carrier gas circulation.
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Description

Technical Field

[0001] This invention relates to the fields of high-end equipment manufacturing and surface engineering technology, specifically a microchannel CVD coating deposition device and its surface strengthening process. Background Technology

[0002] Thin film deposition refers to the process of forming a thin layer of material on the surface of a substrate using various physical or chemical methods. There are many methods of thin film deposition, mainly classified as physical vapor deposition (PVD), chemical vapor deposition (CVD), sputtering deposition, and atomic layer deposition (ALD). Among these, the core of CVD is the chemical reaction of the gaseous precursor. The precursor gas, carried by a carrier gas, is introduced into the reaction chamber and undergoes a decomposition reaction under high temperature or plasma-excited conditions, depositing the desired material atoms onto the substrate surface and growing into a continuous thin film.

[0003] After the precursor enters the reaction chamber, the carrier gas, as an inert gas, does not participate in the reaction. Therefore, the gas discharged after the reaction includes unreacted precursor gas, carrier gas, and gaseous byproducts. The recovered gas needs to be treated before it can be discharged. Traditional technologies only target the adsorption of harmful byproducts and do not design a complete drying and circulation path for the recovery and separation of precursor gas and carrier gas. The recovered carrier gas contains excessive moisture or unreacted precursors that have not been completely separated, and cannot be directly reused in production. Summary of the Invention

[0004] The purpose of this invention is to provide a deposition apparatus for microchannel CVD coatings to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A microchannel CVD coating deposition apparatus includes an operating table and a reaction chamber disposed on the operating table. A sealed chamber is formed inside the reaction chamber, and the product is clamped in the chamber and reacts with a gaseous precursor entering the chamber.

[0007] The reaction chamber is equipped with an air inlet pipe and an exhaust pipe, and the exhaust pipe is connected to a pumping mechanism installed on the operating table.

[0008] A separation mechanism is provided on the operating table, including a recovery tank and a plurality of adsorption components disposed in the recovery tank. The adsorption components are arranged along the circumference of the recovery tank, and the plurality of adsorption components are driven to perform actions by a drive component disposed on the recovery tank.

[0009] The recycling component is connected to the recycling tank at one end and to the air inlet pipe at the other end.

[0010] The microchannel CVD coating deposition apparatus as described above: the pumping mechanism includes an impeller assembly disposed on the operating table, a first motor disposed on the operating table, the output shaft of the first motor being connected to the impeller shaft of the impeller assembly, and an inhalation end and an exhalation end formed on the impeller assembly, the inhalation end being connected to the exhaust pipe, and the exhalation end being connected to the air inlet formed on the recovery tank.

[0011] The microchannel CVD coating deposition apparatus as described above: the recovery unit includes a connecting pipe, one end of which is connected to the air inlet pipe and the other end of which is connected to the air outlet formed on the recovery tank, and a drying tank is provided on the connecting pipe.

[0012] The microchannel CVD coating deposition apparatus described above: a one-way valve is provided at the connection between the connecting pipe and the air inlet pipe.

[0013] The microchannel CVD coating deposition apparatus as described above: the adsorption component includes a reaction vessel, a stirring shaft is rotatably mounted inside the reaction vessel, a plurality of stirring blades are arranged along the circumference of the stirring shaft, and a second gear is provided on one end of the stirring shaft extending outside the reaction vessel.

[0014] The microchannel CVD coating deposition apparatus as described above: the drive assembly includes a drive shaft, one end of which is rotatably connected to the recovery tank, and the drive shaft is driven to rotate by a second motor disposed on the recovery tank. A first gear that meshes with a plurality of second gears is sleeved on one end of the drive shaft located inside the recovery tank.

[0015] The microchannel CVD coating deposition apparatus described above: multiple reaction tanks pass sequentially through the recovery tank along the gas delivery direction, and each reaction tank is connected to an input pipe and an output pipe. The input pipe extends into the bottom of the inner side of the reaction tank, and the output pipe is located at the top of the inner side of the reaction tank.

[0016] A surface strengthening process for a microchannel CVD coating, using a microchannel CVD coating deposition apparatus as described in any of the above claims, includes the following specific steps:

[0017] Step 1: After the carrier gas carries the gaseous precursor through the inlet pipe into the sealed chamber inside the reaction chamber, a chemical reaction occurs on the inner wall surface of the microchannel, generating solid substances and depositing them layer by layer to form a dense film. Meanwhile, the gaseous byproducts produced by the reaction are desorbed from the surface and sucked out of the chamber by the pumping mechanism along with the carrier gas.

[0018] Step 2: The pumping mechanism delivers the discharged gas to the recovery tank. After passing through multiple adsorption components, the gaseous byproducts contained in the carrier gas are removed, and the carrier gas continues to be delivered away from the recovery tank.

[0019] Step 3: Before entering the intake pipe, the carrier gas needs to be dried. The dried carrier gas is then put back into the intake pipe for recycling.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] The reaction byproducts are transported to the recovery tank along with the carrier gas via a pumping mechanism. As the gas passes through multiple circumferentially arranged adsorption components, the driving mechanism controls the adsorption components to perform actions, increasing the contact area between the gas and the adsorption material. This allows the reaction byproducts and other harmful gases to be fully absorbed. These reagents have no effect on the carrier gas, achieving selective removal. The unreacted precursor gas is mixed with the carrier gas and discharged from the recovery tank. After drying in the recovery unit, it can be stored or directly returned to the inlet pipe to participate in the next round of deposition, realizing carrier gas circulation. This reduces the direct discharge of harmful gases into the atmosphere and effectively reduces the consumption of carrier gas. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a microchannel CVD coating deposition apparatus.

[0023] Figure 2 This is a schematic diagram of the structure of a microchannel CVD coating deposition apparatus from another angle.

[0024] Figure 3 This is a schematic diagram of the pumping mechanism and recovery tank in a microchannel CVD coating deposition apparatus.

[0025] Figure 4 This is a schematic diagram of the recovery tank in a microchannel CVD coating deposition apparatus.

[0026] Figure 5 This is a schematic diagram of the drive component in a microchannel CVD coating deposition apparatus.

[0027] Figure 6 This is a schematic diagram of the reaction vessel in a microchannel CVD coating deposition apparatus.

[0028] Figure 7 This is a schematic diagram of the stirring assembly in a microchannel CVD coating deposition apparatus.

[0029] Figure 8 This is a schematic diagram of the input and output pipes in a microchannel CVD coating deposition apparatus.

[0030] In the diagram: 1. Control panel; 2. Reaction chamber; 201. Inlet pipe; 202. Exhaust pipe; 3. Recovery tank; 301. Inlet; 302. Outlet; 4. Pumping mechanism; 5. First motor; 6. Second motor; 7. Drying tank; 8. Reaction chamber; 9. Drive shaft; 10. First gear; 11. Stirring shaft; 12. Second gear; 13. Stirring blades; 14. Input pipe; 15. Output pipe; 16. Connecting pipe. Detailed Implementation

[0031] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0032] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0033] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods, means, and elements well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0034] Please see Figures 1-8 In this embodiment of the invention, a deposition apparatus for a microchannel CVD coating includes an operating table 1 and a reaction chamber 2 disposed on the operating table 1. A sealed chamber is formed inside the reaction chamber 2, and the product is clamped in the chamber and reacts with a gaseous precursor entering the chamber.

[0035] The reaction chamber 2 is respectively equipped with an air inlet pipe 201 and an exhaust pipe 202, and the exhaust pipe 202 is connected to the pumping mechanism 4 provided on the operating table 1.

[0036] The separation mechanism is set on the operating table 1, including a recovery tank 3 and a plurality of adsorption components set in the recovery tank 3. The adsorption components are arranged along the circumference of the recovery tank 3, and the plurality of adsorption components are driven to perform actions by a drive component set on the recovery tank 3.

[0037] The recycling component is connected at one end to the recycling tank 3 and at the other end to the air inlet pipe 201.

[0038] In this embodiment, a gaseous precursor containing the desired elements is fed into a high-temperature reaction chamber 2 under the influence of a carrier gas. It contacts the surface of the microchannel substrate in the reaction chamber 2 and diffuses to the inner wall surface. Under heating conditions, the gaseous precursor reacts with the substrate surface to generate a solid substance, which is deposited to form a dense film adhering to the inner wall of the channel. By activating the pumping mechanism 4, the reaction byproducts generated after the reaction are transported to the recovery tank 3 along with the carrier gas. The gas sequentially passes through multiple adsorption components. Simultaneously, the drive component is activated, controlling the gas to enter the adsorption components and perform its work, increasing the contact area between the gas and the adsorption material, allowing the harmful gases to be fully absorbed. Unreacted precursor gas and carrier gas are mixed and discharged from the recovery tank 3. After drying in the recovery unit, the gas can be stored or directly returned to the inlet pipe 201 to participate in the next round of deposition, achieving carrier gas circulation. This reduces the direct discharge of harmful gases into the atmosphere and effectively lowers carrier gas consumption.

[0039] As a further embodiment of the present invention, please refer to... Figure 3 The pumping mechanism 4 includes an impeller assembly mounted on the operating table 1. A first motor 5 is mounted on the operating table 1. The output shaft of the first motor 5 is connected to the impeller shaft of the impeller assembly. The impeller assembly has an inhalation end and an exhalation end. The inhalation end is connected to the exhaust pipe 202, and the exhalation end is connected to the air inlet 301 formed on the recovery tank 3.

[0040] In this embodiment, the impeller assembly includes blades, an impeller shaft, and a cover. When the first motor 5 is working, the rotation of its output shaft drives the impeller shaft to rotate synchronously. When the impeller shaft rotates, the reaction chamber 2 is subjected to suction under the cooperation of multiple blades on it, so that the reaction byproducts generated after the reaction are absorbed along with the carrier gas and unreacted gaseous precursors and transported to the recovery tank 3. The pumping principle of the specific pumping mechanism 4 is prior art, and this invention will not provide further explanation.

[0041] As a further embodiment of the present invention, please refer to... Figure 3 The recycling component includes a connecting pipe 16, one end of which is connected to the air inlet pipe 201, and the other end is connected to the air outlet 302 formed on the recycling tank 3. A drying tank 7 is provided on the connecting pipe 16.

[0042] Preferably, a one-way valve is provided at the connection between the connecting pipe 16 and the air inlet pipe 201 to prevent gas in the air inlet pipe 201 from flowing back into the connecting pipe 16, thereby maintaining the stability of the channel pressure through one-way gas flow.

[0043] In this embodiment, after the unreacted precursor gas and carrier gas are mixed and discharged from the recovery tank 3, they are transported to the drying tank 7 through the connecting pipe 16. When the unreacted precursor gas and carrier gas are discharged, they may carry trace amounts of water vapor or moisture components from the reaction byproducts. After being adsorbed by the drying tank 7, the moisture content of the gas can be effectively reduced. The dried carrier gas can be stored or directly returned to the inlet pipe 201 to participate in the next round of deposition, thus avoiding the impact of moisture entering the reaction tank 2 on the deposition process.

[0044] As a further embodiment of the present invention, please refer to... Figure 6 and Figure 7 The adsorption assembly includes a reaction vessel 8, in which a stirring shaft 11 is rotatably mounted. Multiple stirring blades 13 are arranged along the circumference of the stirring shaft 11, and a second gear 12 is provided on one end of the stirring shaft 11 that extends out of the reaction vessel 8.

[0045] The drive assembly includes a drive shaft 9, one end of which is rotatably connected to the recycling tank 3. The drive shaft 9 is driven to rotate by a second motor 6 mounted on the recycling tank 3. A first gear 10 that meshes with a plurality of second gears 12 is fitted on one end of the drive shaft 9 located inside the recycling tank 3.

[0046] It should be noted that: alkaline absorbents, such as sodium hydroxide, can be used to remove hydrochloric acid, while ammonium chloride particles / vapor can be removed by washing with water or decomposing by heating. If hydrogen fluoride is present, calcium salt precipitation can be used. These chemical agents have no effect on the carrier gas and can achieve selective removal, enabling the carrier gas to be recovered while preventing harmful gases from being released into the external environment.

[0047] The aforementioned pumping mechanism 4 transports the discharged gas to the recovery tank 3. Acidic reactive byproducts such as hydrochloric acid and ammonium chloride can be selectively removed using specific chemical absorbents. The gas sequentially passes through multiple reaction tanks 8, each containing a different specific chemical absorbent. These absorbents react with the byproducts but not with the carrier gas or unused gas precursors, ensuring that the gas discharged from the recovery tank 3 does not contain byproducts. This effectively removes byproducts during the carrier gas recovery process, preventing their direct release into the external environment.

[0048] As a further embodiment of the present invention, please refer to... Figure 8 The recovery tank 3 passes through multiple reaction tanks 8 in sequence along the gas conveying direction, and each reaction tank 8 is connected to an input pipe 14 and an output pipe 15. The input pipe 14 extends into the bottom of the inner side of the reaction tank 8, and the output pipe 15 is located at the top of the inner side of the reaction tank 8.

[0049] In this embodiment, in order to ensure the reaction time between the gaseous byproducts in the gas and the specific chemical reagents, the structure of the inlet pipe 14 extending to the bottom and the outlet pipe 15 located at the top increases the travel distance of the gas in the reaction vessel 8, allowing the gaseous byproducts and chemical reagents to have more sufficient contact time, which is conducive to the full progress of the reaction. During the process of the gas being transported from bottom to top in a countercurrent manner, the stirring action of the stirring blades 13 can accelerate the reaction rate between the gaseous byproducts and chemical reagents, avoiding the situation where the concentration of chemical reagents in local areas is too low, resulting in incomplete removal of gaseous byproducts.

[0050] A surface strengthening process for a microchannel CVD coating, using a microchannel CVD coating deposition apparatus as described in any of the above claims, includes the following specific steps:

[0051] Step 1: After the carrier gas carries the gaseous precursor through the air inlet pipe 201 into the sealed chamber inside the reaction chamber 2, a chemical reaction occurs on the surface of the microchannel inner wall, generating solid substances and depositing them layer by layer to form a dense film. Meanwhile, the gaseous byproducts generated by the reaction are desorbed from the surface and sucked out of the chamber by the pumping mechanism 4 along with the carrier gas.

[0052] Step 2: The pumping mechanism 4 delivers the discharged gas to the recovery tank 3. After passing through multiple adsorption components, the gaseous byproducts contained in the carrier gas are removed, and the carrier gas continues to be delivered away from the recovery tank 3.

[0053] Step 3: Before the carrier gas enters the intake pipe 201, it needs to be dried. The dried carrier gas is then put back into the intake pipe 201 for recycling.

[0054] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0055] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A microchannel CVD coating deposition apparatus, comprising an operating table (1) and a reaction chamber (2) disposed on the operating table (1), wherein a sealed chamber is formed inside the reaction chamber (2), and a product is held in the chamber and reacts with a gaseous precursor entering the chamber. Its characteristics are: The reaction chamber (2) is provided with an air inlet pipe (201) and an exhaust pipe (202), and the exhaust pipe (202) is connected to the pumping mechanism (4) provided on the operating table (1); The separation mechanism is set on the operating table (1), including a recovery tank (3) and a plurality of adsorption components set in the recovery tank (3). The adsorption components are arranged around the circumference of the recovery tank (3), and the plurality of adsorption components are driven to perform actions by a drive component set on the recovery tank (3). The recycling component is connected at one end to the recycling tank (3) and at the other end to the air inlet pipe (201).

2. The deposition apparatus for a microchannel CVD coating according to claim 1, characterized in that, The pumping mechanism (4) includes an impeller assembly mounted on the operating table (1). A first motor (5) is mounted on the operating table (1). The output shaft of the first motor (5) is connected to the impeller shaft of the impeller assembly. An inhalation end and an exhalation end are formed on the impeller assembly. The inhalation end is connected to the exhaust pipe (202), and the exhalation end is connected to the air inlet (301) formed on the recovery tank (3).

3. The deposition apparatus for a microchannel CVD coating according to claim 1, characterized in that, The recycling component includes a connecting pipe (16), one end of which is connected to the air inlet pipe (201), and the other end is connected to the air outlet (302) formed on the recycling tank (3). A drying tank (7) is provided on the connecting pipe (16).

4. The deposition apparatus for microchannel CVD coating according to claim 3, characterized in that, A one-way valve is provided at the connection between the connecting pipe (16) and the air intake pipe (201).

5. The deposition apparatus for a microchannel CVD coating according to claim 1, characterized in that, The adsorption assembly includes a reaction vessel (8), a stirring shaft (11) is rotatably installed inside the reaction vessel (8), a plurality of stirring blades (13) are arranged along the circumference of the stirring shaft (11), and a second gear (12) is arranged on one end of the stirring shaft (11) that extends out of the reaction vessel (8).

6. The deposition apparatus for a microchannel CVD coating according to claim 5, characterized in that, The drive assembly includes a drive shaft (9), one end of which is rotatably connected to the recycling tank (3), and the drive shaft (9) is driven to rotate by a second motor (6) mounted on the recycling tank (3). A first gear (10) that meshes with a plurality of second gears (12) is sleeved on one end of the drive shaft (9) located inside the recycling tank (3).

7. The deposition apparatus for microchannel CVD coating according to claim 5, characterized in that, The recovery tank (3) passes through multiple reaction tanks (8) in sequence along the gas conveying direction, and the reaction tanks (8) are respectively connected to an input pipe (14) and an output pipe (15). The input pipe (14) extends into the bottom of the inner side of the reaction tank (8), and the output pipe (15) is located at the top of the inner side of the reaction tank (8).

8. A surface strengthening process for a microchannel CVD coating, employing the deposition apparatus for a microchannel CVD coating as described in any one of claims 1-7, characterized in that, The specific steps include the following: Step 1: After the carrier gas carries the gaseous precursor through the inlet pipe (201) into the sealed chamber inside the reaction chamber (2), a chemical reaction occurs on the inner wall surface of the microchannel with the gaseous precursor to generate solid substances and deposit them layer by layer to form a dense film. The gaseous byproducts generated by the reaction are desorbed from the surface and sucked out of the chamber by the pumping mechanism (4) along with the carrier gas. Step 2: The pumping mechanism (4) delivers the discharged gas to the recovery tank (3). After passing through multiple adsorption components, the gaseous byproducts contained in the carrier gas are removed, and the carrier gas continues to be delivered away from the recovery tank (3). Step 3: Before the carrier gas enters the intake pipe (201), it needs to be dried. The dried carrier gas is then put back into the intake pipe (201) for recycling.