连接组件和半导体工艺设备
By employing a dual-sealing structure and purge channel cooling technology in semiconductor process equipment, the problem of sealing ring failure caused by high-temperature processes has been solved, improving sealing reliability and sealing ring lifespan, and ensuring process stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
- Filing Date
- 2025-01-15
- Publication Date
- 2026-07-17
AI Technical Summary
In semiconductor process equipment, the sealing reliability of the sealing rings decreases due to high-temperature processes, leading to the problem of sealing failure in the process chamber.
The system employs a dual-sealing structure, including a connecting plate, a first sealing ring, and a second sealing ring. By setting a first sealing groove and a second sealing groove on the connecting plate, and by setting a purging channel between the process chamber and the transfer chamber for cooling, the high-temperature resistance and service life of the sealing ring are improved.
It improves the sealing reliability between the process chamber and the connecting plate, prevents seal failure, extends the service life of the sealing ring, and ensures the stability and effectiveness of the process.
Smart Images
Figure CN122406196A_ABST