一种用于H级干式变压器的芳纶纸预浸料制备方法

CN122406582APending Publication Date: 2026-07-17SICHUAN JIAXIN INSULATED MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SICHUAN JIAXIN INSULATED MATERIALS CO LTD
Filing Date
2026-06-16
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

The existing aramid paper pretreatment process has the problem of insufficient interlayer bonding strength, which leads to interlayer delamination or blistering, resulting in insufficient interlayer bonding strength of the insulation components.

Method used

A wet processing method is used to treat aramid paper. The method for preparing aramid paper prepreg includes the following steps: wet processing of aramid paper prepreg, using new equipment and materials for aramid paper prepreg, including wet processing, directional fiber layer construction, pre-pressing and discharge, interface reinforcement coating, thermal light source pre-curing, gradient curing and post-treatment.

Benefits of technology

It significantly improves interlayer bonding strength, toughness, and heat resistance, and enhances insulation properties, including higher dielectric strength and better creepage resistance, thus solving the problem of insufficient interlayer bonding strength in existing technologies.

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Abstract

本发明适用于绝缘材料技术领域,提供了一种用于H级干式变压器的芳纶纸预浸料制备方法,包括:将芳纶纸完全浸渍于含H级酚醛环氧树脂、双氰胺、增韧剂、稀释剂及纳米填料的树脂浸料中;经自动滑扫辊湿式滑扫以构建单面纤毛层;预压排料后涂覆含有机硅改性环氧树脂、纳米二氧化硅及自修复微胶囊的界面增强材料;通过旋转刷辊二次刷开,再经热光源预固化及梯度热压固化,最终密封包装。本发明方法在不损伤基材纤维的前提下形成定向纤毛互锁结构,显著提升层间结合强度与介电性能;构建的纤毛层树脂浓度梯度有效优化应力分布;引入自修复微胶囊赋予材料裂纹自主修复功能,延长使用寿命。本发明适用于H级干式变压器的匝间、层间绝缘结构件制造。
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