A method of repairing a pipe heat shrink band
By using self-healing materials and epoxy resin composites at the peeling strip location of the heat shrinkable tape on the pipeline, the problem of complex repair process, low bonding strength and environmental dependence in the existing technology is solved, achieving efficient, economical and aesthetically pleasing repair results and extending the service life of the pipeline.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- PIPECHINA SOUTH CHINA CO
- Filing Date
- 2026-04-23
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, the repair of the peeling strip position of pipeline heat shrinkable tape has problems such as low bonding strength, easy secondary peeling, complex repair process, long maintenance cycle, high cost, repair quality is greatly affected by the environment, inconsistent appearance, and poor long-term anti-corrosion performance.
The pits formed during the peel strength test were repaired using self-healing materials and epoxy resin composites. The process involved cleaning, filling with a first solid repair material, and wrapping with a second repair material to ensure bonding strength. Heat shrinkable tape of the same specifications was then installed on the outside.
It achieves high bonding strength repair, prevents secondary peeling, shortens repair time, reduces costs, improves aesthetics and environmental adaptability, and extends pipeline service life.
Smart Images
Figure CN122407924A_ABST